JP6395308B2 - Cooling block and air conditioner - Google Patents

Description

  The present invention relates to a cooling block and an air conditioner.

In an air conditioner in which an inverter-driven device is incorporated, a controller having a circuit board on which heat-generating electronic components such as an active converter, a diode module, and a power transistor constituting the inverter are mounted is mounted. In recent years, with an increase in capacity of an inverter and its power elements, an improvement in cooling performance for the controller is required. For this reason, as a cooling method for the controller, instead of an air cooling method in which cooling fins are provided to cool, a refrigerant cooling method in which cooling is performed using a refrigerant is being adopted.
In Patent Document 1, a DIP (Dual Inline Package) type electronic component mounted on a wiring board or a SIP (Single Inline Package) type electronic component is formed of an aluminum block having high thermal conductivity. A refrigerant jacket is provided, and a plurality of the electronic components are screwed and fixed to the opposite surface, and a refrigerant pipe is arranged in contact with the opposite surface side, and the plurality of heat-generating electronic components are arranged as a refrigerant. Is disclosed that is cooled via a refrigerant jacket.
Patent Document 2 discloses a cooling device including a cooling unit that cools air in a control box that controls the operation of an air conditioner by heat exchange with a refrigerant.

Japanese Patent No. 5472364 JP2013-15295A

However, the above prior art has the following problems.
In the technique described in Patent Document 1, the cooling pipe and the cooling jacket are arranged so as to cover a plurality of heat-generating electronic components and are screwed to these electronic components.
These electronic components are arranged adjacent to each other in the vertical direction, and the cooling jacket is also extended in the vertical direction. Since the cooling jacket is always cooled to a low temperature, condensation tends to occur. Condensed condensed water descends along the cooling jacket and may flow out onto the substrate, which may cause a short circuit or short circuit.
In the technique described in Patent Document 2, the air in the control box is cooled and the condensed water can be discharged out of the control box, so that the condensed water can be prevented from flowing out into a substrate shape. However, since the cooling of the heating element itself is an air cooling method, there is a problem that the cooling efficiency is deteriorated.

  The present invention has been made to solve the above-described problems, and provides a cooling block and an air conditioner that can suppress the flow of condensed water due to condensation on a circuit board even in a refrigerant cooling system. For the purpose.

  In order to solve the above-described problem, the cooling block according to the first aspect of the present invention includes a planar first heat transfer section that is in contact with the first heat generating member and disposed along a vertical plane, and A planar second heat transfer portion extending from the upper end of the first heat transfer portion in contact with one heat generation member to the side opposite to the first heat transfer member and intersecting the first heat transfer portion And a heat exhaust unit disposed in contact with the cooling pipe through which the refrigerant flows and exhausting heat conducted from the first heat transfer unit and the second heat transfer unit to the cooling pipe, and the second heat transfer unit. It is the lower part of a heat | fever part, Comprising: It is set as the structure provided with the inclination part which inclines below as it distances from the said 1st heat transfer part to the opposite side to a said 1st heat generating member.

  According to this configuration, even if condensation occurs on the cooling block having a low temperature, the condensed water due to condensation flows on the opposite side of the first heat generating member along the inclined portion. For this reason, it is prevented that condensed water flows into the 1st heat-transfer part which a 1st heat generating member contacts.

  In the cooling block, the first heat transfer section and the second heat transfer section may extend in directions orthogonal to each other.

  According to this configuration, the heat generating member whose mounting direction is shifted by 90 ° from the first heat generating member is disposed on the second heat transfer section, and the heat generating member can be cooled. Therefore, it is possible to cool the heat generating member having a large area while standing in a direction orthogonal to the circuit board, so that the component arrangement area on the circuit board can be effectively used.

  In the cooling block, the inclined portion may be formed at a bottom portion of a groove crossing the second heat transfer portion.

  According to this configuration, since the inclined portion is formed at the bottom of the groove, the flow of condensed water becomes smooth. Moreover, the condensed water by the dew condensation in the groove | channel inner surface on an inclination part can also be reliably flowed to an inclination part. Further, when another heat generating member is disposed on the second heat transfer section, the condensed water due to condensation near the second heat transfer section is collected on the inclined section through the inner surface of the groove. It is possible to prevent the condensed water from adhering to other heat generating members on the part.

  In the cooling block, the upper end portion of the inclined portion may be formed below the upper end portion of the first heat generating member.

  According to this configuration, the condensed water flowing through the inclined portion flows in a range lower than the upper end portion of the first heat generating member, and therefore more reliably flows into the first heat generating member side from the upper end portion of the inclined portion. Can be prevented.

  In the cooling block, the second heat transfer section may include an attachment section that contacts and fixes the second heat generating member.

  According to this configuration, the second heat generating member can be cooled by the second heat transfer unit by fixing the second heat generating member to the attachment portion.

  The air conditioner according to the second aspect of the present invention is in contact with the circuit board, the first heat generating member disposed on the circuit board so as to be along the substantially vertical plane, and the first heat generating member. The cooling block is configured to include a cooling pipe through which a refrigerant flows and comes into contact with the exhaust heat unit of the cooling block, and a cooling pipe holding unit that holds the cooling pipe.

  According to this configuration, since the cooling block is provided, the same operation as the cooling block is provided.

  In the air conditioner, the circuit board may further include a second heat generating member, and the second heat generating member may be in contact with the second heat transfer portion of the cooling block. .

  According to this configuration, the second heat generating member can be cooled by the second heat transfer unit.

  According to the cooling block and the air conditioner of the present invention, the condensed water due to condensation is prevented from flowing to the first heat transfer portion that is in contact with the first heat generating member. There exists an effect that it can control that condensed water flows out on a circuit board.

It is a refrigerant circuit diagram of the air conditioner of the 1st Embodiment of this invention. It is a typical perspective view of the state where the peripheral panel of the outdoor unit of the air harmony machine of a 1st embodiment of the present invention was removed. It is a typical front view of the outdoor side controller of the air conditioner of the 1st Embodiment of this invention. It is a typical longitudinal section of the outdoor controller of the air harmony machine of a 1st embodiment of the present invention. It is a typical perspective view of the cooling block of the 1st Embodiment of this invention. It is a typical front view of the cooling block of the 1st Embodiment of this invention. It is AA sectional drawing in FIG. It is typical sectional drawing of the cooling block of the modification (1st modification) of the 1st Embodiment of this invention. It is a typical longitudinal section showing the composition of the principal part of the air harmony machine of a 2nd embodiment of the present invention. FIG. 10 is a view from D in FIG. 9. It is a typical perspective view which shows the structure of the cooling block of the 2nd Embodiment of this invention. It is typical sectional drawing of the cooling block of the modification (2nd modification) of the 2nd Embodiment of this invention.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. In all the drawings, even if the embodiments are different, the same or corresponding members are denoted by the same reference numerals, and common description is omitted.

[First Embodiment]
An air conditioner according to a first embodiment of the present invention will be described.
FIG. 1 is a refrigerant circuit diagram of an air conditioner according to a first embodiment of the present invention. FIG. 2 is a schematic perspective view of the air conditioner outdoor unit according to the first embodiment of the present invention with the outer peripheral panel removed. FIG. 3 is a schematic front view of the outdoor controller of the air conditioner according to the first embodiment of the present invention. FIG. 4 is a schematic longitudinal sectional view of the outdoor controller of the air conditioner according to the first embodiment of the present invention. FIG. 5 is a schematic perspective view of the cooling block according to the first embodiment of the present invention. FIG. 6 is a schematic front view of the cooling block according to the first embodiment of the present invention. 7 is a cross-sectional view taken along line AA in FIG.

  As shown in FIG. 1, the air conditioner 1 of this embodiment includes a compressor 2, a four-way switching valve 3, an outdoor heat exchanger 5, an electronic expansion valve (EEV) 6, an indoor heat exchanger 8, and an accumulator 9. In addition, a closed cycle refrigeration cycle 11 is configured by connecting these devices by a refrigerant pipe 10 (cooling pipe).

The compressor 2 is a device that compresses the refrigerant.
The four-way switching valve 3 is a device that switches the circulation direction of the refrigerant.
The outdoor heat exchanger 5 is a device that exchanges heat between the refrigerant and the outdoor air from the outdoor fan 4.
The electronic expansion valve (EEV) 6 is a device that adiabatically expands the refrigerant.
The indoor heat exchanger 8 is a device that exchanges heat between the refrigerant and the indoor air from the outdoor fan 7.
The accumulator 9 is a device that separates the refrigerant that has not been completely evaporated by the evaporator and prevents the refrigerant from flowing into the compressor 2.

Furthermore, the air conditioner 1 includes a controller 12 that controls the operation of the air conditioner 1 based on an operation command from an operation unit such as a remote controller.
For example, the controller 12 is equipped with an inverter that controls the rotational speed of the compressor 2, and switches the four-way switching valve 3 in accordance with the operation mode. Further, the rotational speed of the outdoor fans 4 and 7, the opening degree of the electronic expansion valve 6 The function which controls etc. is provided.

The controller 12 includes electronic components such as an active converter, a diode module, and a power transistor that constitute an inverter. Since these electronic components are heat-generating electronic components, the controller 12 needs to be cooled.
In the present embodiment, of the refrigerant pipe 10 of the refrigeration cycle 11, the controller 12 is brought into contact with a refrigerant pipe 10 </ b> A (cooling pipe) provided between the electronic expansion valve 6 and the indoor heat exchanger 8. Is cooled.
During the cooling operation, the air conditioner 1 cools the controller 12 with a low-pressure gas phase two-phase refrigerant that is throttled by the electronic expansion valve 6 and flows through the refrigerant pipe 10A. Moreover, the air conditioner 1 cools the controller 12 with the high-pressure liquid refrigerant condensed and liquefied by the indoor heat exchanger 8 that flows through the refrigerant pipe 10A during the heating operation.

  In addition, the refrigerant | coolant piping 10 arrange | positioned in contact with the controller 12 does not need to be refrigerant | coolant piping 10A between the electronic expansion valve 6 and the indoor heat exchanger 8 as mentioned above, and is provided on the controller 12. Other refrigerant pipes 10 maintained at a temperature at which exothermic electronic components and the like can be cooled may be used. For example, the refrigerant pipe 10 between the electronic expansion valve 6 and the outdoor heat exchanger 5 may be used. Moreover, other piping parts, such as low-pressure gas refrigerant piping, may be sufficient.

As shown in FIG. 2, the controller 12 includes an outdoor unit 13 in which the compressor 2, the four-way switching valve 3, the outdoor fan 4, the outdoor heat exchanger 5, the electronic expansion valve 6, the accumulator 9, and the like in the air conditioner 1 are accommodated. Is placed inside.
In this embodiment, the outdoor unit 13 includes a heat exchanger chamber 14 in which the outdoor fan 4 and the outdoor heat exchanger 5 are installed, a compressor 2, a four-way switching valve 3, an electronic expansion valve 6, an accumulator 9, and the like. Machine room 15. The heat exchanger chamber 14 and the machine chamber 15 are partitioned by a partition plate 16 inside the outdoor unit 13.
The controller 12 in this embodiment is installed in the upper area | region of the machine room 15 through the bracket 17 as an example.

As schematically shown in FIG. 3, the controller 12 includes a controller main body 18 and a substrate 21 (circuit board) fixed on the controller main body 18.
As shown in FIG. 4, the upper side and the lower side of the substrate 21 are detachably fixed to the controller main body 18 via support members 19 and 20, respectively.
The support 20 includes a hinge portion 20A that rotatably supports the lower side portion of the substrate 21.
The support 19 includes a fixing portion 19A that removably fixes the rotation position of the upper side portion of the substrate 21 that rotates toward the controller main body 18 around the hinge portion 20A. In the present embodiment, the substrate 21 fixed by the fixing portion 19A is substantially parallel to the controller main body 18 arranged along the vertical plane (including a parallel case). For this reason, when the board | substrate 21 is fixed with respect to the controller main body 18, it will be placed vertically with the attitude | position substantially along a vertical surface (including the case where it aligns with a vertical surface).
In the present embodiment, the substrate 21 is placed vertically due to heat dissipation by natural convection or the convenience of the arrangement space. For this reason, the attitude | position of the board | substrate 21 may incline from a exact | strict vertical surface in the range which does not have trouble in heat dissipation or arrangement | positioning space.
In addition, it is an example that the board | substrate 21 is arrange | positioned along a vertical surface substantially. As long as the drainage performance of the cooling block 25 described later is not impaired, the substrate 21 may be disposed so as to be inclined at an appropriate angle with respect to the vertical plane.
For the fixing portion 19A, for example, an appropriate substrate fixing structure using an elastic claw or a screw can be adopted.

  Hereinafter, in the description of the arrangement of each member related to the substrate 21, for the sake of simplicity, the description will be based on the positional relationship (referred to as “position at the time of attachment”) in the attachment state in which the substrate 21 is fixed by the support tools 19 and 20. There is. Moreover, in the position at the time of attachment, when describing the relative position on the board | substrate 21, the direction of the support tool 19 is called the upper side, and the direction of the support tool 20 is called the lower side.

Various control circuits and various electronic components used for the control circuit are mounted on the substrate 21. Such electronic components include, for example, a plurality of heat-generating electronic components such as an active converter, a diode module, and a power transistor that are components of an inverter that drives the electric motor of the compressor 2. These exothermic electronic components can be provided with various packages such as DIP type and SIP type, or with a heat radiating plate connected to the package.
3 and 4 show, as an example, a DIP type heat generating electronic component 22 (first heat generating member) and a SIP type heat generating electronic component 23 (second heat generating member).
The exothermic electronic components 22 and 23 may be any electronic components such as an active converter, a diode module, and a power transistor, and may be electronic components other than those illustrated as long as they generate heat.

As shown in FIG. 4, the heat-generating electronic component 22 includes a rectangular parallelepiped package main body 22A that houses a chip and radiates heat, and lead pins 22B that extend from the side of the package main body 22A toward the substrate 21.
The heat-generating electronic component 22 is disposed on the substrate 21 with the top surface 22a of the package body 22A facing the controller body 18. In the heat generating electronic component 22, the lead pin 22 </ b> B is electrically connected to the circuit of the substrate 21.
In the present embodiment, the heat-generating electronic component 22 is arranged in such a manner that lead pins 22B extending from both sides of the package body 22A extend upward and downward on the substrate 21 at the mounting position. For this reason, the side surface 22b of the heat-generating electronic component 22 in which the lead pin 22B extends upward is the upper end surface of the package body 22A at the mounting position.
Further, when the heat-generating electronic component 22 is connected to the substrate 21, the top surface 22 a is parallel to the surface of the substrate 21. For this reason, in the mounting position, the top surface 22a of the heat-generating electronic component 22 is also along a substantially vertical surface.

The heat-generating electronic component 23 includes a package main body 23A that houses a chip and dissipates heat, and lead pins 22B that extend from one side of the package main body 23A. The package body 23A can be configured to include a heat sink.
The heat-generating electronic component 23 is disposed on the substrate 21 such that the mounting surface 23a of the package body 23A is parallel to the lower side of the substrate 21 and orthogonal to the substrate 21. At the mounting position, the mounting surface 23a faces downward.
In the heat generating electronic component 23, the lead pin 23 </ b> B is electrically connected to the circuit of the substrate 21.

A cooling block 25 is disposed in contact with the top surface 22 a of the heat generating electronic component 22 and the mounting surface 23 a of the heat generating electronic component 23 in order to cool the heat generating electronic components 22 and 23.
The cooling block 25 has a quadrangular prism shape in which a substantially trapezoidal shape is extended to one side. The length of the cooling block 25 can be an appropriate length that allows a plurality of heat-generating electronic components on the substrate 21 to contact each other. In the present embodiment, the length of the cooling block 25 is slightly longer than the lateral width of the substrate 21 as an example (see FIG. 3).

As shown in FIG. 4, the outer peripheral surface of the cooling block 25 has a first surface 25 a (first heat transfer portion) that contacts the heat-generating electronic component 22 and a second surface 25 b (first-contact) that contacts the heat-generating electronic component 23. 2 heat transfer section), the third surface 25c parallel to the first surface 25a and narrower than the first surface 25a, and an acute angle θ with respect to the first surface 25a, and an obtuse angle (180 with respect to the third surface 25c). And a fourth surface 25d composed of inclined surfaces intersecting at (° -θ). Hereinafter, the angle θ formed by the first surface 25a and the fourth surface 25d may be referred to as the inclination angle θ of the fourth surface 25d. The inclination angle θ substantially coincides (including the case of coincidence) with the angle intersecting with the vertical plane at the mounting position.
The inclination angle θ of the fourth surface 25d is not particularly limited, but is 45 ° as an example in the present embodiment.
The first surface 25a, the second surface 25b, the third surface 25c, and the fourth surface 25d are arranged adjacent to each other in this order in the circumferential direction. Two of these surfaces adjacent to each other may be provided with a corner R or C chamfer at the boundary.

When the cooling block 25 is attached so as to be in contact with the heat generating electronic components 22 and 23, the cooling block 25 becomes convex toward the bracket 17. Therefore, the controller body 18 has an opening through which the heat generating electronic component 23 and the cooling block 25 penetrate. A portion 18a is formed.
On the back side of the controller main body 18, the bracket 17 is disposed at a certain distance from the controller main body 18.

  The 1st surface 25a consists of a substantially rectangular plane, and the screw hole 25h (refer FIG. 6, 7) for screwing the heat-generating electronic component 22 is formed.

The second surface 25b has a substantially rectangular outer periphery and is formed of a plane orthogonal to the first surface 25a. The second surface 25b faces upward at the mounting position.
A plurality of grooves 25j (grooves) extending from the first surface 25a toward the third surface 25c are formed on the second surface 25b. For this reason, the 2nd surface 25b is parted by each groove part 25j, and is an elongate parallel grid | lattice form (refer FIG. 5).
In FIGS. 5 and 6, as an example, eight grooves 25 j are drawn, but the number of grooves 25 j is not limited to this.

As shown in FIG. 7, an inclined surface 25e (inclined portion) is formed on the groove bottom of the groove portion 25j so as to be inclined away from the second surface 25b as it goes from the first surface 25a to the third surface 25c. For this reason, the inclined surface 25e is an inclined surface which inclines downward as it goes from the first surface 25a to the third surface 25c at the mounting position.
The groove portion 25j can be formed from an appropriate position on the first surface 25a, but is preferably formed at a height not higher than the side surface 22b, which is the upper end surface of the package body 22A of the heat-generating electronic component 22. In the present embodiment, the side surface 22b of the package body 22A and the upper end portion of the inclined surface 25e are at the same height at the mounting position.
Furthermore, the upper end portion of the groove portion 25j is lower than the second surface 25b. For this reason, the first surface 25a is formed with a notch 25f in which the upper end of the groove 25j is opened.
The inclination angle of the inclined surface 25e can be set to an appropriate angle at which the water condensed due to condensation or the like in the groove portion 25j easily flows downward at the mounting position. In the present embodiment, the inclined surface 25e is inclined by an acute angle α with respect to the horizontal surface at the time of attachment.

5 and 6 show examples in which the groove width and the arrangement pitch of the groove portions 25j are both constant, this is an example.
The groove width and arrangement pitch of the groove portions 25j may vary depending on the location. For example, the arrangement pitch may be widened at the site where the heat generating electronic component 23 is attached in order to widen the groove width particularly at a portion where condensation is likely to occur or to increase the contact area of the heat generating electronic component 23.
Moreover, you may provide the some groove part 25j non-parallel.

  As shown in FIGS. 5 and 6, a screw hole 25 i for screwing the heat generating electronic component 23 is formed in the second surface 25 b at a position where the heat generating electronic component 23 is fixed.

  As shown in FIG. 4, the third surface 25 c is formed so that the cooling block 25 does not interfere with the bracket 17 at the mounting position. For this reason, when the distance from the top surface 22a on the substrate 21 to the bracket 17 is sufficiently large at the mounting position, the third surface 25c may be deleted and the cooling block 25 may be formed in a triangular prism shape. .

In the fourth surface 25d, the cooling pipe abutting groove 25k (exhaust heat) extending in the longitudinal direction of the cooling block 25 in order to bring the refrigerant pipe 10A into thermal contact with the intermediate portion between the first surface 25a and the third surface 25c. Part) is formed. Here, the term “thermally contacted” means that they are contacted so as to be able to conduct heat, and includes a case where the refrigerant pipe 10A is in direct contact and a case where the refrigerant pipe 10A is indirectly contacted via a heat conductor.
An appropriate shape can be selected as the shape of the cooling pipe contact groove 25k according to the outer shape and arrangement path of the refrigerant pipe 10A.
In the present embodiment, the refrigerant pipe 10A that is brought into contact with the cooling block 25 is disposed so as to extend in a horizontal direction parallel to the substrate 21 at the mounting position. For this reason, the cooling pipe contact groove 25 k is also extended straight in the longitudinal direction of the cooling block 25.
In the present embodiment, the refrigerant pipe 10A is fitted into a semicircular concave groove 31a formed on the inclined surface 31b of the triangular prism-shaped support member 31 (cooling pipe holding portion) fixed to the bracket 17. . The inclined surface 31b of the support member 31 is inclined from the upper side as it protrudes from the bracket 17, and the inclination angle with respect to the bracket 17 is φ. The inclination angle φ may be an angle at which the support member 31 does not interfere with the cooling block 25 at the mounting position, but is the same as the inclination angle θ of the fourth surface 25d in the present embodiment.

Further, a silicon sheet 33 for heat dissipation is arranged on the surface of the refrigerant pipe 10A protruding from the support member 31 and the periphery thereof. For this reason, in the present embodiment, the refrigerant pipe 10 </ b> A is indirectly in contact with the cooling block 25 via the silicon sheet 33.
Therefore, the cooling pipe contact groove 25k adopts a semicircular groove shape in which a convex shape obtained by adding the thickness of the silicon sheet 33 is fitted to the refrigerant pipe 10A protruding from the concave groove 31a.
Further, at the mounting position, a gap of the same degree as that of the silicon sheet 33 is formed between the fourth surface 25d and the inclined surface 31b of the support member 31.

Note that the silicon sheet 33 may be omitted if the cooling block 25 and the refrigerant pipe 10A can be brought into direct contact with high accuracy.
In addition, the cooling pipe abutting groove 25k is preferably in direct or indirect contact with the refrigerant pipe 10A in the widest possible area. However, if the contact area is sufficient, the protrusion of the refrigerant pipe 10A from the concave groove 31a. It is not necessary to contact over the entire circumference. For this reason, the cooling pipe contact groove 25k can be opened larger than the refrigerant pipe 10A covered with the silicon sheet 33 or the outer diameter of the refrigerant pipe 10A. In this case, when the substrate 21 is rotated and the refrigerant pipe 10A or the refrigerant pipe 10A covered with the silicon sheet 33 is brought into contact, the substrate 21 is not easily affected by an error in the rotation position, and can be brought into contact smoothly. It becomes.

  As a material of the cooling block 25, an appropriate metal material having high thermal conductivity can be employed. Examples of suitable materials for the cooling block 25 include aluminum alloy, copper, and silver.

In order to fix the cooling block 25 having such a configuration, as shown in FIG. 4, the top surface 22a of the heat generating electronic component 22 and the first surface 25a are in close contact with each other, and the mounting surface 23a of the heat generating electronic component 23 is attached. And the second surface 25b are in close contact with each other. Then, screws 24 are inserted through through holes (not shown) formed in the heat-generating electronic components 22 and 23. The heat generating electronic components 22 and 23 and the cooling block 25 are fixed by screwing the screws 24 into the screw holes 25h and 25i.
At this time, in order to improve the heat transfer performance between the heat-generating electronic components 22 and 23 and the cooling block 25, it is preferable to apply heat radiation grease and then screw them.
The cooling block 25 may be assembled before connecting the heat generating electronic components 22 and 23 to the substrate 21, or if the substrate 21 is provided with a screw hole or the like, the heat generating electronic component 22 is provided on the substrate 21. , 23 may be assembled after connecting.

In order to attach the substrate 21 to which the cooling block 25 is attached in this way to the bracket 17, the lower side portion of the substrate 21 is locked to the hinge portion 20A as shown by a two-dot chain line in FIG. Next, the substrate 21 is rotated around the hinge portion 20A, and the upper side portion of the substrate 21 is fixed to the fixing portion 19A.
Thereby, the heat-generating electronic component 23 and the cooling block 25 protruding from the substrate 21 are inserted into the opening 18 a of the controller body 18.
The cooling block 25 is moved to a position facing the support member 31 and the refrigerant pipe 10A that are fixed to the bracket 17 in advance. As a result, the refrigerant pipe 10 </ b> A covered with the silicon sheet 33 fits into the cooling pipe contact groove 25 k of the cooling block 25. Further, the silicon sheet 33 is sandwiched between the fourth surface 25 d of the cooling block 25 and the inclined surface 31 b of the support member 31.
In this way, the refrigerant pipe 10A indirectly contacts the cooling block 25 via the silicon sheet 33, and heat conduction between the cooling block 25 and the refrigerant pipe 10A becomes possible.

Next, the effect | action of the air conditioner 1 of such a structure is demonstrated centering on the effect | action of the cooling block 25. FIG.
As shown in FIG. 1, when the air conditioner 1 is operated for heating, the refrigerant is transferred from the compressor 2 through the four-way switching valve 3 to the indoor heat exchanger 8, the electronic expansion valve 6, the outdoor heat exchanger 5, A circuit returning to the compressor 2 through the four-way switching valve 3 and the accumulator 9 is circulated. When the compressor 2 is cooled, the refrigerant flows from the compressor 2 through the four-way switching valve 3 to the outdoor heat exchanger 5, the electronic expansion valve 6, the indoor heat exchanger 8, the four-way switching valve 3, the accumulator. The circuit which returns to the compressor 2 through 9 is circulated.

  While the air conditioner 1 is in the cooling / heating operation, the controller 12 controls various devices of the air conditioner 1 such as controlling the number of rotations of the driving motor of the compressor 2 via an inverter. At that time, the heat generating electronic components 22 and 23 which are electronic components such as an active converter, a diode module, and a power transistor of an inverter mounted on the controller 12 are driven to generate heat. For example, in order to stably operate the inverter for a long period of time and maintain good performance, it is necessary to appropriately cool these exothermic electronic components 22 and 23 so as not to overheat.

Heat generated in the heat-generating electronic components 22 and 23 is radiated to the first surface 25a and the second surface 25b of the cooling block 25 through the top surface 22a and the mounting surface 23a.
On the other hand, the temperature of the refrigerant flowing in the refrigerant pipe 10 </ b> A of the refrigeration cycle 11 is sufficiently lower than the heat generation temperature of the heat generating electronic components 22 and 23 while the air conditioner 1 is operated for cooling and heating. For this reason, in the cooling block 25, the heat flowing in from the first surface 25a and the second surface 25b is radiated (exhaust heat) to the refrigerant pipe 10A through the cooling pipe contact groove 25k.
Thus, since the cooling block 25 functions as a heat sink having a temperature lower than that of the heat generating electronic components 22 and 23 while the air conditioner 1 is being cooled / heated, the heat generating electronic components 22 and 23 are allowed to move to an allowable temperature. It can be cooled to: For this reason, an inverter can be functioned stably over a long period of time.

If the operation of the air conditioner 1 is continued in this way, condensation tends to occur in the cooling block 25 kept at a low temperature. The condensed water condensed on the cooling block 25 flows downward and accumulates due to gravity. Since the cooling block 25 is provided with the groove 25j, most of the condensed water accumulates in the groove 25j. For this reason, the condensed water flows downward along the inclined surface 25e at the bottom of the groove 25j, and is discharged from the lower end of the inclined surface 25e to the outside of the fourth surface 25d. In the present embodiment, the lower end portion of the inclined surface 25e faces the inclined surface 31b of the support member 31, and is thus discharged to the lower side of the support member 31 along the inclined surface 31b.
Accordingly, the condensed water condensed on the cooling block 25 flows in a direction away from the heat-generating electronic component 22 and falls below the cooling block 25 between the controller body 18 and the bracket 17. For this reason, it is possible to prevent the condensed water from flowing onto the heat-generating electronic component 22.
As a result, even if it is a refrigerant cooling system, it can suppress that the condensed water by condensation flows out on the board | substrate 21. FIG. Thereby, a short circuit or electric leakage of the substrate 21 can be prevented.

  Further, according to the air conditioner 1, the condensed water condensed on the cooling block 25 flows under its own weight and continues to be discharged to the support member 31 side, and the condensed water can be prevented from accumulating on the cooling block 25. For this reason, for example, when the substrate 21 is maintained or exchanged, when the substrate 21 is rotated and removed, it is possible to prevent the condensed water from being scattered in the machine room 15 and various electric parts.

Further, according to the air conditioner 1, the heat generating electronic component 23 can be cooled by fixing the heat generating electronic component 23 to the second surface 25 b of the upper part of the cooling block 25. As described above, according to the cooling block 25, it is possible to provide a wide heat radiation space for the SIP-type heat-generating electronic component 23 without occupying the area of the substrate 21.
In this case, since the heat generating electronic component 23 is located at the uppermost part of the cooling block 25, it is possible to reliably prevent the condensed water due to condensation from touching the heat generating electronic component 23.

[First Modification]
Next, the cooling block of the modification (1st modification) of this embodiment is demonstrated.
FIG. 8 is a schematic cross-sectional view of a cooling block according to a modification (first modification) of the first embodiment of the present invention.

As shown in FIG. 8, the cooling block 25A of the present modification includes an inclined surface 25E (inclined portion) instead of the inclined surface 25e of the cooling block 25 of the first embodiment.
As shown in FIG. 3, the cooling block 25 </ b> A can be used in the air conditioner 1 instead of the cooling block 25.
Hereinafter, a description will be given centering on differences from the first embodiment.

Like the inclined surface 25e, the inclined surface 25E is an inclined surface that is inclined so as to move away from the second surface 25b as it goes from the first surface 25a to the third surface 25c, but the positions of the upper end portion and the lower end portion are inclined surfaces 25e. Is different.
At the mounting position, the upper end portion of the inclined surface 25E is formed below the side surface 22b, which is the upper end surface of the heat-generating electronic component 22. For this reason, the notch 25f is a notch 25F extending further downward. A part of the package body 22A is exposed at the cutout portion 25F, and the lower portion of the cutout portion 25F is closed by the top surface 22a.
The lower end portion of the inclined surface 25E is formed at a position that penetrates and connects to the cooling pipe contact groove 25k.
For this reason, in this modification, the inclined surface 25E is inclined by an acute angle β with respect to the horizontal plane at the time of attachment. Similarly to the angle α of the first embodiment, the angle β can be set to an appropriate angle at which water condensed by condensation or the like in the groove 25j can easily flow downward.
In the present modified example, the lower end portion of the inclined surface 25E is formed at a position where it penetrates and connects to the cooling pipe contact groove 25k, so the angle β is larger than the angle α of the first embodiment. It is possible to set.

  According to the cooling block 25A of the present modified example, the upper end portion of the inclined surface 25E is lower than the side surface 22b of the heat-generating electronic component 22, so that the condensed water is more reliably condensed through the inclined surface 25E below the side surface 22b. Can be shed.

[Second Embodiment]
Next, an air conditioner according to a second embodiment of the present invention will be described.
FIG. 9 is a schematic longitudinal sectional view showing the configuration of the main part of the air conditioner according to the second embodiment of the present invention. FIG. 10 is a view as viewed from D in FIG. FIG. 11 is a schematic perspective view showing the configuration of the cooling block according to the second embodiment of the present invention.

As shown in FIG. 9, the air conditioner 61 of the present embodiment includes a controller 62 instead of the controller 12 of the air conditioner 1 of the first embodiment.
As shown in FIG. 9, the air conditioner 61 includes an upper support plate 63 and a pressing member 64 (cooling pipe holding portion) instead of the support member 31 of the air conditioner 1 of the first embodiment. . Since the support member 31 is deleted, the bracket 17 as a member for fixing the support member 31 is not necessary.
With such a configuration, the air conditioner 61 changes the holding form of the refrigerant pipe 10A.
Hereinafter, a description will be given centering on differences from the first embodiment.

  As shown in FIG. 9, the controller 62 includes a cooling block 65 in place of the cooling block 25 of the controller 12 in the first embodiment.

The cooling block 65 has a columnar shape in which one corner of the quadrangular column lacks about a quarter of a square section in the longitudinal direction. For this reason, the cross section orthogonal to the longitudinal direction of the cooling block 65 is substantially L-shaped.
The length of the cooling block 65 is the same as that of the cooling block 25 of the first embodiment.

The outer peripheral surface of the cooling block 65 has a first surface 65a (first heat transfer portion) that contacts the heat-generating electronic component 22, and a second surface 65b (second heat transfer portion) that contacts the heat-generating electronic component 23; A third surface 65c parallel to the first surface 65a and narrower than the first surface 65a, a fourth surface 65d parallel to the second surface 65b and narrower than the second surface 65b, and a first surface parallel to the first surface 65a. A fifth surface 65e narrower than 65a and a sixth surface 65f parallel to the second surface 65b and narrower than the second surface 65b are provided.
The first surface 65a, the second surface 65b, the third surface 65c, the fourth surface 65d, the fifth surface 65e, and the sixth surface 65f are arranged adjacent to each other in this order in the circumferential direction. Of these, the angle between two adjacent surfaces is 90 °. In addition, two of these surfaces adjacent to each other may be provided with corner R or C chamfering at the boundary except for the fourth surface 65d and the fifth surface 65e.
In the cooling block 65, the fourth surface 65d and the fifth surface 65e constitute the surface of the missing part of the quadrangular prism.
The second surface 65b of the cooling block 65 is directed vertically upward at the same mounting position of the substrate 21 as in the first embodiment.

Between the fourth surface 65d and the fifth surface 65e, a cooling pipe abutting groove 65g (heat exhaust part) extending in the longitudinal direction of the cooling block 65 is formed in order to make the refrigerant pipe 10A abut.
An appropriate shape can be selected as the shape of the cooling pipe contact groove 65g in accordance with the outer shape and arrangement path of the refrigerant pipe 10A.
In the present embodiment, as will be described later, the refrigerant pipe 10A extends in a horizontal direction parallel to the substrate 21 at the mounting position. For this reason, the cooling pipe contact groove 65 g is also extended straight in the longitudinal direction of the cooling block 65.
In the present embodiment, the silicon sheet 33 in the first embodiment is deleted, and the refrigerant pipe 10A and the cooling block 65 are brought into direct contact.
Therefore, the cross section orthogonal to the longitudinal direction of the cooling pipe contact groove 65g has a substantially semicircular bottom surface portion equal to the outer diameter of the refrigerant pipe 10A and an opening slightly wider than the outer diameter of the refrigerant pipe 10A. It is U-shaped.
The opening of the cooling pipe abutting groove 65g is directed in an obliquely downward direction (in the obliquely downward direction in the drawing in FIG. 9) that is away from the substrate 21 at the mounting position.

  Similar to the first surface 25a in the first embodiment, the first surface 65a is a substantially rectangular flat surface, and a screw hole 25h for screwing the heat-generating electronic component 22 is formed.

As shown in FIGS. 10 and 11, the second surface 65b is formed with a plurality of grooves 65j (grooves) extending from the first surface 65a toward the third surface 65c. For this reason, the 2nd surface 65b is parted by each groove part 65j, and is a parallel grid | lattice form.
In the present embodiment, the groove 65j is not formed on the lower surface of the heat-generating electronic component 23. Thereby, in the 2nd surface 65b, the area | region which arrange | positions the exothermic electronic component 23 is made wider than the exothermic electronic component 23, and is wider than the width | variety of the 2nd surface 65b of another area | region. Hereinafter, the wide second surface 65b is referred to as an electronic component attachment portion 65n (attachment portion).
A screw hole 25i (see FIG. 11) similar to that in the first embodiment is formed in the electronic component mounting portion 65n.

As shown in FIG. 9, an inclined surface 65k (inclined portion) is formed on the groove bottom of the groove portion 65j so as to be inclined away from the second surface 65b as it goes from the first surface 65a to the third surface 65c. For this reason, the inclined surface 65k is an inclined surface that inclines downward as it goes from the first surface 65a to the third surface 65c at the mounting position.
The groove portion 65j can be formed from an appropriate position on the first surface 65a, but is preferably formed at a height not higher than the side surface 22b of the heat-generating electronic component 22. In the present embodiment, the side surface 22b and the upper end portion of the inclined surface 65k are at the same height at the mounting position.
Furthermore, the upper end portion of the groove portion 65j is lower than the second surface 65b. For this reason, the first surface 65a is formed with a notch 65m in which the upper end of the groove 65j opens.
The inclination angle of the inclined surface 65k can be set to an appropriate angle at which the water condensed due to condensation in the groove portion 65j easily flows downward at the mounting position.
In the present embodiment, as an example, the lower end portion of the inclined surface 65k is formed at a position penetrating the cooling pipe contact groove 65g. The inclined surface 65k is inclined by an acute angle γ with respect to the horizontal plane at the time of attachment.

  In the present embodiment, the groove portion 65j passes through the third surface 65c and the fourth surface 65d. For this reason, the 3rd surface 65c and the 4th surface 65d are the parallel lattice shape parted by the groove part 65j similarly to the 2nd surface 65b.

  In the present embodiment, the shape of the first surface 65a is the same as the first surface 25a in the cooling block 25 of the first embodiment. That is, the vertical width (the distance between the second surface 65b and the sixth surface 65f) of the mounting position in the cooling block 65 is the same as the width of the cooling block 25 in the same direction.

  As the material of the cooling block 65, a material that can be used for the cooling block 25 of the first embodiment can be similarly adopted.

The upper support plate 63 is a member for fixing to the controller main body 18 in a state in which a presser member 64 described later is suspended so as to be rotatable.
The upper support plate 63 includes a fixing portion 63a, a flat plate portion 63b, and a locking plate portion 63c.

The fixing portion 63a is a shape portion that fixes the upper support plate 63 to the controller body 18 above the opening 18a. In the present embodiment, screw holes (not shown) for screwing screws 66 penetrating the controller main body 18 are formed.
The flat plate portion 63b extends from the fixed portion 63a toward the side opposite to the substrate 21 at the mounting position so as to cover the cooling block 65 at the mounting position from above.
The locking plate 63c is bent downward from a position that slightly protrudes in the horizontal direction from the tip of the cooling block 65 at the time of attachment. A locking hole 63d for suspending a presser member 64 to be described later is passed through the locking plate 63c.
Since FIG. 9 is a cross-sectional view, only one locking hole 63d is shown, but a plurality of locking holes 63d are preferably provided in the illustrated depth direction.

The holding member 64 is a plate-like shape that presses and fixes the refrigerant pipe 10 </ b> A to the cooling pipe abutting groove 65 g of the cooling block 65 by covering the cooling block 65 protruding from the opening 18 a obliquely from below at the mounting position. It is a member.
The pressing member 64 includes a first tip pressing portion 64a, a first lower end pressing portion 64b, a cooling tube pressing portion 64c, a second tip pressing portion 64d, a second lower end pressing portion 64e, a fixing portion 64f, and a locking claw 64g. .
Hereinafter, as shown in FIG. 9, the shape of the pressing member 64 will be described based on the positional relationship in the case where the cooling block 65 disposed at the mounting position is fixed.

The first tip pressing portion 64 a is a flat plate portion that extends along the third surface 65 c of the cooling block 65.
The first lower end pressing portion 64 b is a flat plate portion that extends along the fourth surface 65 d of the cooling block 65.

  The cooling pipe pressing portion 64 c is a flat plate portion facing to cover the opening of the cooling pipe abutting groove 65 g of the cooling block 65. The position of the cooling pipe pressing portion 64c is a position where the refrigerant pipe 10A can be pressed against the cooling pipe contact groove 65g when the pressing member 64 is locked to the upper support plate 63 and fixed to the controller main body 18. That is, when the refrigerant pipe 10A is removed and the holding member 64 is fixed, the distance between the cooling pipe holding portion 64c and the bottom surface of the cooling pipe contact groove 65g is slightly smaller than the outer diameter of the refrigerant pipe 10A. To do.

The second tip pressing portion 64 d is a flat plate portion that extends along the fifth surface 65 e of the cooling block 65.
The second lower end pressing portion 64 e is a flat plate portion that extends along the sixth surface 65 f of the cooling block 65.

  The fixing portion 64f is a shape portion that fixes the pressing member 64 to the controller body 18 above the opening 18a. The fixing portion 64 f is a flat plate portion that extends downward from the second lower end pressing portion 64 e and contacts the surface of the controller main body 18. In the present embodiment, a screw hole (not shown) for screwing a screw 67 penetrating the controller main body 18 is formed.

  The locking claw 64 g is a shape portion that locks the presser member 64 in the locking hole 63 d of the upper support plate 63. In the present embodiment, the locking claw 64g is formed in a hook shape that extends from the upper end portion of the first tip pressing portion 64a in a single piece and is bent downward.

The holding member 64 having such a configuration can be formed by pressing an elastically deformable metal plate.
Note that FIG. 9 is a schematic diagram, and the pressing member 64 is drawn so as to be in close contact with the outer surface of the cooling block 65. However, if the presser member 64 is locked to the upper support plate 63 and is fixed to the controller main body 18, the coolant pipe 10A can be pressed toward the cooling pipe contact groove 65g, and the cooling pipe presser 64c. The portions other than may not be in contact with the cooling block 65.

Next, the attachment method of the board | substrate 21 in the air conditioner 61 is demonstrated.
First, with the pressing member 64 removed, the substrate 21 is fixed using support members 19 and 20 (not shown), and the cooling block 65 is disposed at the mounting position.
Next, the locking claw 64g of the pressing member 64 is inserted into the locking hole 63d of the upper support plate 63, and the pressing member 64 is suspended from the locking plate portion 63c.
Thereby, the pressing member 64 is supported so as to be rotatable around the contact position between the locking hole 63d and the locking claw 64g.

The operator fits the refrigerant pipe 10 </ b> A into the cooling pipe contact groove 65 g of the cooling block 65. Next, in this state, the pressing member 64 is rotated clockwise in the drawing, and the pressing member 64 is pressed against the cooling block 65 from obliquely below the cooling block 65.
As a result, the first tip pressing portion 64a, the first lower end pressing portion 64b, the second tip pressing portion 64d, and the second lower end pressing portion 64e are respectively connected to the third surface 65c, the fourth surface 65d, and the fifth surface of the cooling block 65. It moves to a position close along the surface 65e and the sixth surface 65f.
At this time, the fixing portion 64f is close to the controller main body 18 so that the screw 67 can be screwed together, and the cooling pipe pressing portion 64c contacts the refrigerant pipe 10A.
When the operator screws the screw 67 into the screw hole of the fixing portion 64f, the refrigerant pipe 10A is pushed into the cooling pipe abutting groove 65g, and the cooling pipe abutting groove 65g and the cooling pipe holder 64c It is sandwiched between.
When the screw 67 is tightened, the refrigerant pipe 10A is sandwiched between the cooling pipe abutting groove 65g and the cooling pipe pressing portion 64c while being pressed by the cooling pipe abutting groove 65g.
Thus, the attachment of the substrate 21 is completed. When the substrate 21 is removed, the above operations may be performed in the reverse order.

  As described above, the air conditioner 61 of the present embodiment brings the cooling block 65 into contact with the heat-generating electronic components 22 and 23 of the substrate 21 and brings the refrigerant pipe 10 </ b> A into contact with the cooling block 65. Thereby, the heat generating electronic components 22 and 23 can be cooled similarly to the air conditioner 1 of the said 1st Embodiment. For this reason, even if it is a refrigerant | coolant cooling system, it can suppress that the condensed water by dew condensation flows out on the board | substrate 21. FIG. Thereby, a short circuit or electric leakage of the substrate 21 can be prevented.

In the present embodiment, the cooling block 65 and the refrigerant pipe 10 </ b> A are fixed by the upper support plate 63 and the pressing member 64 provided on the controller main body 18. For this reason, since the member which supports 10 A of refrigerant | coolants piping does not need to be supported in the site | part away from the controller main body 18, a structure becomes simple.
Further, the positional relationship between the cooling block 65 and the refrigerant pipe 10A can be easily maintained as compared with the case where the cooling block is pressed against the refrigerant pipe 10A arranged at a position away from the controller main body 18. For this reason, the cooling block 65 and the refrigerant pipe 10A can be brought into contact with each other more reliably, and the cooling efficiency can be increased.

[Second Modification]
Next, the cooling block of the modification (2nd modification) of this embodiment is demonstrated.
FIG. 12 is a schematic cross-sectional view of a cooling block according to a modification (second modification) of the second embodiment of the present invention.

As shown in FIG. 12, the cooling block 85 of the present modification has a substantially rectangular cross-sectional shape, whereas the cooling block 65 of the second embodiment has a substantially L-shaped cross-sectional shape. Is provided. Specifically, the cooling block 85 has a substantially rectangular cross-sectional shape similar to that obtained by cutting out a portion of the cooling block 65 that protrudes from the tip of the fifth surface 65e.
Hereinafter, a description will be given focusing on differences from the second embodiment.

The outer peripheral surface of the cooling block 85 includes a first surface 65a (first heat transfer portion) similar to the cooling block 65, and a second surface 85b (second heat transfer portion) having the same width as the sixth surface 65f of the cooling block 65. And a third surface 85c parallel to the first surface 65a and a fourth surface 85d similar to the sixth surface 65f of the cooling block 65.
The first surface 65a, the second surface 85b, the third surface 85c, and the fourth surface 85d are arranged adjacent to each other in this order in the circumferential direction. Of these, the angle between two adjacent surfaces is 90 °. Further, two of these surfaces adjacent to each other may be provided with a corner R or C chamfer at the boundary.
The second surface 85b of the cooling block 85 is directed vertically upward at the same mounting position of the substrate 21 as in the second embodiment.

A cooling pipe abutting groove 85e (heat exhaust part) extending in the longitudinal direction of the cooling block 85 is formed in the middle part of the third surface 85c in order to bring the refrigerant pipe 10A into contact therewith.
The shape of the cooling pipe abutting groove 85e is a shape in which a semicircular cross section equal to the outer diameter of the refrigerant pipe 10A extends straight in the longitudinal direction of the cooling block 85.

A groove 85j (groove) having the same configuration as the groove 65j in the second embodiment is formed on the second surface 85b, except that the second surface 85b extends from the first surface 65a toward the third surface 85c. . For this reason, the shape of the second surface 85b in a plan view (not shown) is divided by the groove portions 85j and has a parallel lattice shape, like the second surface 65b in the second embodiment.
The second surface 85b is provided with a screw hole 25i for fixing the heat-generating electronic component 23 at the same site as the electronic component mounting portion 65n of the second surface 65b in the second embodiment.
However, if the heat generating electronic component 23 is not provided on the circuit board of the air conditioner using the cooling block 85, the screw hole 25i may be omitted.

  An inclined surface 65k (inclined portion) similar to that in the second embodiment is formed on the groove bottom of the groove portion 85j. However, the inclined surface 65k of the present modification is an inclined surface that is inclined downward as it goes from the first surface 65a to the third surface 85c at the attachment position. Moreover, the lower end part of the inclined surface 65k is formed in the position connected to the edge part of the cooling pipe contact groove 85e.

Thus, the cooling block 85 of the present modification has a substantially L-shaped cross section perpendicular to the longitudinal direction of the cooling block 65 of the second embodiment, whereas the cross sectional shape orthogonal to the longitudinal direction. Is different in that it is substantially rectangular.
For this reason, it can attach to the controller main body 18 so that attachment or detachment is possible using the member which changed the shape of the upper support plate 63 and the pressing member 64 in the said 2nd Embodiment according to the difference in such an external shape.
Therefore, the cooling block 85 of this modification can be used for the controller 62 of the air conditioner 61 of the second embodiment by appropriately changing the shapes of the upper support plate 63 and the pressing member 64.

  When the cooling block 85 is used for the controller 62 of the air conditioner 61, the cooling block 85 has the same inclined surface 65k as the cooling block 65. Therefore, even if it is a refrigerant cooling system, condensed water due to condensation is formed on the substrate 21. Spilling out can be suppressed. Thereby, a short circuit or electric leakage of the substrate 21 can be prevented.

  The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and includes design changes and the like within a scope not departing from the gist of the present invention. . In addition, the components described in the above embodiments and modifications can be implemented by appropriately combining or deleting.

In the above description of each embodiment and each modification, the first heat generating member is a DIP type heat generating electronic component 22 and the second heat generating member is a SIP type heat generating electronic component 23. . However, the difference between the first heat generating member and the second heat generating member depends on whether the portion in contact with the cooling block is the first heat transfer unit or the second heat transfer unit.
For this reason, the type of package is an example, and the first and second heat generating members may be DIP type or SIP type.

  In the description of each of the embodiments and the modifications described above, the first heat transfer unit and the second heat transfer unit are described as examples extending in directions orthogonal to each other, but the second heat transfer unit is the first heat transfer unit. As long as it extends in a direction intersecting with the heat transfer section, the angle between them is not limited to 90 °.

In the description of each of the above embodiments and modifications, an example in which a plurality of grooves having inclined portions are provided has been described. However, depending on the length of the cooling block and the width of the groove, only one groove may be provided. .
It is not essential to provide the inclined portion at the bottom of the groove. For example, the inclined portion may be provided in a step shape by opening the inclined surface to the outside at the end of the cooling block or the like.

  In the description of each of the above embodiments and each modification, the example in the case where the inclined portion is formed from an inclined plane has been described. However, the inclined portion may be formed from a curved surface or may be a V-shaped groove extending obliquely downward. , Or a U-shaped groove.

1, 61 Air conditioner 10, 10A Refrigerant pipe (cooling pipe)
12 Controller 13 Outdoor unit 17 Bracket 18 Controller body 18a Openings 19 and 20 Support 21 Substrate (circuit board)
22 Heat-generating electronic parts (first heat-generating member)
23 Heat-generating electronic parts (second heat-generating member)
22b Side surface (upper end portion of first heating member)
25, 25A, 65, 85 Cooling block 25a, 65a 1st surface (1st heat-transfer part)
25b, 65b, 85b Second surface (second heat transfer section)
25e, 25E, 65k Inclined surface (inclined part)
25j, 65j, 85j Groove (groove)
25k, 65g, 85e Cooling tube contact groove (heat exhaust part)
31 Support member (cooling pipe holding part)
64 Presser member (cooling pipe holding part)
65n electronic parts mounting part (mounting part)

Claims (7)

A planar first heat transfer section that is in contact with the first heat generating member and disposed along the vertical plane;
A planar second heat transfer member extending from the upper end of the first heat transfer member in contact with the first heat transfer member to the side opposite to the first heat transfer member and intersecting the first heat transfer member. A hot section,
An exhaust heat unit that is disposed in contact with the cooling pipe through which the refrigerant flows, and that exhausts heat conducted from the first heat transfer unit and the second heat transfer unit to the cooling pipe;
An inclined portion that is below the second heat transfer portion and is inclined downward as it moves away from the first heat transfer portion to the side opposite to the first heat generating member,
A cooling block. The cooling block according to claim 1, wherein the first heat transfer unit and the second heat transfer unit extend in directions orthogonal to each other. The inclined portion is
The cooling block according to claim 1, wherein the cooling block is formed at a bottom portion of a groove crossing the second heat transfer unit. The cooling block according to claim 1, wherein an upper end portion of the inclined portion is formed below an upper end portion of the first heat generating member. The second heat transfer section is
The cooling block according to any one of claims 1 to 4, further comprising an attachment portion that contacts and fixes the second heat generating member. A circuit board;
A first heat generating member disposed on the circuit board so as to extend along a substantially vertical plane;
The cooling block according to any one of claims 1 to 5, which is in contact with the first heat generating member;
A refrigerant flow, and a cooling pipe that contacts the exhaust heat part of the cooling block;
A cooling pipe holding section for holding the cooling pipe;
An air conditioner. The circuit board further includes a second heat generating member,
The air conditioner according to claim 6, wherein the second heat generating member is in contact with the second heat transfer section of the cooling block.

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