JP6369722B2 - Controller and air conditioner with heat generating electronic components - Google Patents

Description

  The present invention relates to a controller including a substrate on which a heat-generating electronic component such as a power transistor is mounted, and an air conditioner on which the controller is mounted.

  In an air conditioner in which an inverter-driven device is incorporated, a controller having a substrate on which heat-generating electronic components such as an active converter, a diode module, and a power transistor constituting the inverter are mounted is mounted. In recent years, with the increase in capacity of inverters and their power elements, etc., there has been a demand for improved cooling performance for controllers, and as a cooling method, refrigerant is used instead of the air cooling method in which cooling fins are provided for cooling. Refrigerant cooling system that cools by cooling is being adopted.

  In Patent Document 1, a DIP (Dual Inline Package) type electronic component mounted on a wiring board or a SIP (Single Inline Package) type electronic component is formed of an aluminum block having high thermal conductivity. A refrigerant jacket is provided, and a plurality of the electronic components are screwed and fixed to the opposite surface, and a refrigerant pipe is arranged in contact with the opposite surface side, and the plurality of heat-generating electronic components are arranged as a refrigerant. Is disclosed that is cooled via a refrigerant jacket.

Japanese Patent No. 5472364

As described above, the following problems occur when the refrigerant cooling method is adopted as the cooling method of the controller.
(1) Since the heat dissipating surface is reduced by downsizing the aluminum block, it is necessary to collect the heat-generating electronic components on a part of the substrate. In order to fix the electronic components to the aluminum block, it is necessary to provide mounting holes for electronic components on the board side. However, the area occupied by the substrate decreases due to the integration of the electronic components. Decreases, making it difficult to secure current capacity.

(2) Although a heat dissipation silicon sheet or the like is mounted between the refrigerant pipe and the aluminum block, the mounting surface is a vertical surface, so that the sheet is easily peeled off and the workability is deteriorated.
(3) Further, when fixing the substrate, it is necessary to apply a uniform pressure to the sheet so as not to cause wrinkles. However, as described above, wrinkles are likely to occur due to deterioration of workability, and heat transfer performance May decrease.

  The present invention has been made in view of such circumstances, in which a plurality of electronic components are distributed and arranged on two surfaces of a block made of heat transfer material, and the number of mounting holes provided in the substrate is reduced to form a pattern. It aims at providing the controller provided with the exothermic electronic component which can suppress the reduction | decrease of width | variety, and can improve the workability at the time of board | substrate installation, and an air conditioner carrying the same.

In order to solve the above-described problems, a controller and an air conditioner provided with a heat generating electronic component of the present invention employ the following means.
That is, the controller equipped with a heat generating electronic component according to the present invention is fixedly installed in contact with a block made of a heat transfer material in which a plurality of heat generating electronic components mounted on a substrate are cooled through a refrigerant pipe, In the controller including a heat-generating electronic component that can be cooled by using the heat transfer material block as a heat sink, the heat transfer material block includes a first surface along the substrate and a first surface thereof. A block body having at least two surfaces intersecting with the second surface, a part of the electronic component on the first surface of the block body, and at least one or more of the SIP type on the second surface Electronic parts are arranged.

  According to the present invention, there is provided a controller including a heat generating electronic component capable of cooling a plurality of heat generating electronic components mounted on a substrate using a heat transfer material block cooled by a refrigerant pipe as a heat sink, The heat transfer material block is a block body having at least two surfaces, a first surface along the substrate and a second surface intersecting the first surface, and an electronic component on the first surface of the block body Since at least one or more SIP-type electronic components are arranged on the second surface, the SIP-type electronic components distributed and arranged on the second surface that intersects the substrate surface of the block body are fixed. There is no need to provide mounting holes on the substrate side for installation, and the number of electronic component mounting holes provided on the substrate pattern can be reduced. Therefore, even if heat-generating electronic components are consolidated on a part of the board in order to reduce the size of the heat transfer material block, the mounting pattern does not reduce the pattern width of the board, ensuring sufficient current capacity. can do.

  Furthermore, the controller provided with the heat-generating electronic component according to the present invention is arranged such that when a plurality of SIP type electronic components are provided in the controller provided with the heat-generating electronic component, all of them are arranged on the second surface. Or a part thereof is disposed on the second surface and the remaining part is disposed on the first surface.

  According to the present invention, when a plurality of SIP type electronic components are provided, all of them are arranged on the second surface, or a part thereof is arranged on the second surface and the remaining part is arranged on the first surface. Since it is configured to be arranged on the surface, among the plurality of SIP type electronic components provided, the number of mounting holes corresponding to the number of SIP type electronic components distributed and arranged on the second surface side is provided. It is not necessary to provide the circuit board on the substrate side, and the number of electronic component mounting holes provided on the circuit board pattern can be reduced. Thus, the substrate pattern width is not reduced by the mounting holes, and a sufficient current capacity on the substrate side can be secured.

  Furthermore, the controller including the heat-generating electronic component according to the present invention is the controller including any one of the heat-generating electronic components described above, wherein the heat transfer material block is a recess that contacts at least the refrigerant pipe other than the two surfaces. The block body is provided with one surface having a groove.

  According to the present invention, since the heat transfer material block is a block body having at least one surface having a concave groove in contact with the refrigerant pipe in addition to the two surfaces, the heat transfer material block is made up of a plurality of electronic components. A block body having at least three surfaces, ie, two surfaces intersecting each other in which a part and one or more SIP type electronic parts are distributed and one surface having a concave groove in contact with the refrigerant pipe, is made possible. Thus, the heat resistance by the heat transfer material block can be reduced. Therefore, it is possible to improve the cooling performance of the controller by increasing the cooling effect by the refrigerant while reducing the size of the heat transfer material block.

  Furthermore, the controller provided with the heat generating electronic component according to the present invention is the controller provided with the heat generating electronic component described above, wherein the heat transfer material block includes the two surfaces and the one surface having the concave groove. The one surface having the concave groove is a block body having an inclined surface, a bent surface or a curved surface having a predetermined inclination in the horizontal direction with respect to the vertical surface.

  According to the present invention, the heat transfer material block includes two surfaces and one surface having a groove, and the one surface having the groove has a predetermined inclination in the horizontal direction with respect to the vertical surface. Since the block body is a bent surface or a curved surface, one surface having a concave groove in contact with the refrigerant pipe has an inclined surface, a bent surface or a curved surface having a predetermined inclination in the horizontal direction with respect to the vertical surface. By doing so, the volume of the block body which comprises the block made from a heat-transfer material can be made small corresponding to the part lacked by the inclined surface, the bending surface, or the curved surface. Therefore, the heat resistance in the heat transfer material block can be reduced, the heat dissipation from the electronic components can be improved and the cooling performance can be improved, and the heat transfer material block can be further downsized to reduce the cost. it can.

  Furthermore, the controller including the heat-generating electronic component according to the present invention is a controller including the heat-generating electronic component described above, and is a support member that supports the refrigerant pipe along the heat-transfer material block on the controller side. The surface is the inclined surface, the bent surface or the curved surface corresponding to one surface having the concave groove of the block body constituting the heat transfer material block.

  According to the present invention, the support surface of the support member that supports the refrigerant pipe along the heat transfer material block on the controller side is inclined corresponding to one surface having the concave groove of the block body constituting the heat transfer material block. Since the surface is a curved surface, a curved surface, or a curved surface, the inclined surface of the block body on the heat transfer material block side, the curved surface, with the inclined surface on the support member side, and the support surface that is the curved surface or curved surface as a mating surface Or a curved surface is supported and the refrigerant | coolant piping supported by the support member and the block made from a heat-transfer material can be arranged in contact. Thus, the refrigerant pipe is positioned with the support surface of the support member and the inclined surface, bent surface or curved surface of the heat transfer material block as the mating surfaces of each other, and the refrigerant pipe and the heat transfer material block can be easily and It can be reliably placed in contact, and even when a heat-dissipating sheet or the like is interposed between the refrigerant pipe and the heat transfer material block, it can prevent the sheet from peeling or dropping during construction and improve workability. it can.

  Furthermore, the controller including the heat-generating electronic component of the present invention is the controller including any one of the heat-generating electronic components described above, wherein the heat transfer material block includes a part of the plurality of electronic components. The lower end portion of the first surface along the substrate is extended downward from the lower end portion of the package body of some of the electronic components.

  According to the present invention, the lower end portion of the first surface along the substrate on which a part of the plurality of electronic components of the block made of heat transfer material is arranged is lower than the lower end portion of the package body of the partial electronic components. Therefore, even if dew condensation occurs on the surface of the heat transfer material block that is cooled by the refrigerant pipe, the dew condensation water is partially extended downward from the lower end of the package body of the electronic component. It can be dripped rapidly downward through the lower end of the heat transfer material block. Accordingly, it is possible to prevent the dew condensation water from staying on the controller, to prevent the occurrence of a failure due to the dew condensation water dropping on the electronic component, and to damage the electronic component, thereby protecting the controller.

  Furthermore, the controller including the heat-generating electronic component according to the present invention is the controller including any one of the heat-generating electronic components described above, wherein the substrate is supported by the controller body via a support, and the lower side of the substrate is The supporting tool to be supported is a supporting tool that rotatably supports the substrate with its lower side as a fulcrum.

  According to the present invention, the substrate is supported by the controller body via the support, and the support that supports the lower side of the substrate is a support that rotatably supports the substrate with the lower side as a fulcrum. Therefore, when the substrate is fixedly supported to the controller body via the support, the substrate is first supported by the support that rotatably supports the lower side of the substrate, and the upper portion of the substrate is supported with the lower side as a fulcrum. By rotating and supporting the upper side with a support tool, it can be fixedly supported on the controller body. At this time, the refrigerant pipe supported by the support member is provided on one surface of the heat transfer material block. The recessed grooves that are formed can be fitted while rotating from the circumferential direction. Therefore, the concave groove of the heat transfer material block and the refrigerant pipe can be smoothly fitted to each other while avoiding interference with each other, and the heat dissipation material is uniformly disposed between the refrigerant pipe and the heat transfer material block. Pressure can be applied to prevent wrinkles from occurring and workability can be improved.

  Furthermore, the controller equipped with the heat-generating electronic component according to the present invention is fixedly installed in contact with a block made of a heat transfer material in which a plurality of heat-generating electronic components mounted on the substrate are cooled via the refrigerant pipe, The controller is provided with a heat-generating electronic component that can be cooled by using the heat transfer material block as a heat sink, and the heat transfer material block includes a surface on which the plurality of electronic components are fixed and installed. And a surface having a groove with which the refrigerant pipe is fitted and contacted, and the surface having the groove of the block body is inclined with a predetermined inclination in a horizontal direction with respect to a vertical surface. It is a surface, a bent surface, or a curved surface.

  According to the present invention, there is provided a controller including a heat generating electronic component capable of cooling a plurality of heat generating electronic components mounted on a substrate using a heat transfer material block cooled by a refrigerant pipe as a heat sink, A block made of a heat transfer material is a block body including a surface on which a plurality of electronic components are in contact and fixedly installed, and a surface having a groove to which the refrigerant pipe is fitted and contacted. Because the surface has an inclined surface, a bent surface, or a curved surface with a predetermined inclination in the horizontal direction with respect to the vertical surface, the groove on the heat transfer material block side that is a block body is fitted to the refrigerant pipe When contacting, the refrigerant pipe is positioned using an inclined surface, a bent surface, or a curved surface having a predetermined inclination in the horizontal direction as a mating surface with respect to the support surface of the support member that supports the refrigerant pipe. Connect to refrigerant piping It can be arranged. Therefore, the heat transfer material block and the refrigerant pipe can be positioned and placed in contact with each other easily and reliably, and even when a heat-dissipating sheet or the like is interposed between them, the sheet is placed in a predetermined direction in the horizontal direction. It can hold | maintain on the surface which has inclination, can prevent the peeling and fall of the sheet | seat at the time of construction, and can improve workability.

  Furthermore, the controller including the heat-generating electronic component according to the present invention is the controller including the heat-generating electronic component described above, wherein the heat transfer material block includes two intersecting surfaces on which a plurality of the electronic components can be fixedly installed. The block body is provided with a surface having the concave groove formed with the inclined surface, the bent surface or the curved surface so as to cut out one corner of the block body having the two surfaces.

  According to the present invention, the heat transfer material block has two surfaces that can be fixedly installed with a plurality of electronic components and an inclined surface, a curved surface, or a curved surface by cutting out one corner of the block body having the two surfaces. Since the block body is provided with a surface having a concave groove forming a surface, the inclined surface, the bent surface, or the surface having the concave groove of the block made of heat transfer material is cut out at one corner of the block body. By forming the curved surface, the volume of the block body can be minimized. Therefore, it is possible to reduce the thermal resistance in the heat transfer material block and improve the heat dissipation from the heat-generating electronic component, and to further reduce the cost by reducing the size of the heat transfer material block. Moreover, by making the surface having the concave groove an inclined surface, a bent surface, or a curved surface, the refrigerant pipe can be easily fitted and brought into contact with the concave groove, and the workability when the controller is assembled can be improved.

  Furthermore, the controller including the heat-generating electronic component according to the present invention is the controller including any one of the heat-generating electronic components described above, wherein the refrigerant pipe includes an inclined surface, a bent surface, or a curved surface having the concave groove of the block body. It is supported by the support member which has a support surface corresponding to a curved surface.

  According to the present invention, since the refrigerant pipe is supported by the support member having the support surface corresponding to the inclined surface, the bent surface, or the curved surface having the concave groove of the block body, the inclined surface, the bent surface on the support member side. Alternatively, the support surface that is a curved surface is used as a mating surface, the surface having the groove of the heat transfer material block is supported, and the refrigerant pipe supported by the support member and the heat transfer material block are disposed in contact with each other. Can do. Therefore, the heat transfer material block and the refrigerant pipe can be positioned and placed in contact with each other easily and reliably, and even when a heat-dissipating sheet or the like is interposed between them, the sheet is placed in a predetermined direction in the horizontal direction. It can hold | maintain with the support surface which has an inclination, can prevent the peeling and fall of the sheet | seat at the time of construction, and can improve workability.

  Furthermore, the air conditioner according to the present invention is characterized in that any one of the above-described controllers that cools a plurality of heat-generating electronic components by refrigerant piping is mounted as an outdoor unit-side controller.

  According to the present invention, as the outdoor unit-side controller, any one of the above-described controllers that cools a plurality of heat-generating electronic components by the refrigerant pipe is mounted, so the heat-generating electronic components are integrated on the substrate. Even if the heat transfer material block and controller are downsized, the current capacity of the board can be secured sufficiently, the cooling performance for the heat-generating electronic components on the board is improved, and the workability during assembly is also improved. It can be set as the air conditioner carrying a controller. Therefore, it is possible to provide a high-quality air conditioner that improves the reliability and assemblability of the controller, reduces its size, and reduces the cost.

  According to the controller having the heat-generating electronic component of the present invention, the attachment for fixing and installing the SIP type electronic components distributed and arranged on the second surface intersecting with the substrate surface of the block body as the block made of heat transfer material It is no longer necessary to provide holes for the board, and the number of holes for mounting electronic components on the board pattern can be reduced. Even if they are integrated into a part of the substrate, the mounting hole does not reduce the pattern width of the substrate, and a sufficient current capacity can be secured.

  Further, according to the controller having the heat-generating electronic component of the present invention, when the concave groove on the block side made of the heat transfer material, which is a block body, is fitted and contacted with the refrigerant pipe, the inclined surface has a predetermined inclination in the horizontal direction. Since the bending of the curved surface or the curved surface can be used as a mating surface with respect to the supporting surface of the supporting member that supports the refrigerant pipe, the heat transfer material block and the refrigerant pipe can be placed in contact with each other. A surface having a predetermined inclination in the horizontal direction even when a heat-dissipating sheet or the like is interposed between the material block and the refrigerant pipe by positioning them easily and reliably. It can be held by, prevents peeling and dropping of the sheet during construction, and improves workability.

  According to the air conditioner of the present invention, even if the heat-generating electronic components are concentrated on the substrate and the heat transfer material block and the controller are downsized, the current capacity of the substrate can be sufficiently secured, and Air conditioner equipped with a controller with improved cooling performance for heat-generating electronic components and improved workability during assembly, improving controller reliability, assembly, and downsizing Therefore, it is possible to provide a high-quality air conditioner that achieves cost reduction.

It is a refrigerant circuit figure of the air harmony machine concerning a 1st embodiment of the present invention. It is a perspective view of the state which removed the peripheral panel of the outdoor unit of the above-mentioned air harmony machine. It is a front view of the outdoor controller of the said air conditioner. It is a longitudinal cross-sectional view of the said controller. It is a longitudinal cross-sectional view of the outdoor unit side support part which installs the said controller. It is a longitudinal cross-sectional view of the installation state with respect to the outdoor unit of the said controller. It is the front view (A) which shows arrangement | positioning structure of the board | substrate of the said controller, several electronic components, and the block made from a heat-transfer material, and sectional drawing (B) and (C) in each electronic component position. Front view (A) and sectional views (B), (C), and (D) at each electronic component position according to another embodiment showing an arrangement configuration of a controller board, a plurality of electronic components, and a block made of heat transfer material It is. It is a longitudinal cross-sectional view which concerns on other embodiment which shows the installation state with respect to the outdoor unit of a controller. It is the front view (A) which concerns on other embodiment which shows the arrangement configuration of the board | substrate of a controller, several electronic components, and a block made from a heat-transfer material, and sectional drawing (B) and (C) in several electronic component positions. It is sectional drawing of the modification (A) thru | or (E) of the said heat-transfer material block. It is the front view (A) which shows the arrangement configuration of the board | substrate of a conventional controller, a some electronic component, and the block made from a heat-transfer material, and sectional drawing (B), (C) in each electronic component position.

Embodiments according to the present invention will be described below with reference to the drawings.
[First Embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
FIG. 1 shows a refrigerant circuit diagram of the air conditioner according to the first embodiment, and FIG. 2 shows a perspective view of the outdoor unit with the outer peripheral panel removed.
The air conditioner 1 insulates the refrigerant, the compressor 2 that compresses the refrigerant, the four-way switching valve 3 that switches the circulation direction of the refrigerant, the outdoor heat exchanger 5 that exchanges heat between the refrigerant and the outside air from the outdoor fan 4, and the refrigerant. An electronic expansion valve (expansion valve; EEV) 6 for expansion, an indoor heat exchanger 8 for exchanging heat between the refrigerant and indoor air from the indoor fan 7, an accumulator 9 and the like are provided, and refrigerant piping is provided between these devices. A closed cycle refrigeration cycle 11 connected by 10 is provided.

  The air conditioner 1 includes a controller 12 that controls the operation of the air conditioner 1 based on an operation command from a remote controller or the like. The controller 12 is equipped with an inverter for controlling the rotational speed of the compressor 2 and switches the four-way switching valve 3 according to the operation mode. Further, the rotational speed of the outdoor fan 4, the rotational speed of the indoor fan 7, and the electronic expansion valve 6 has a function of controlling the opening degree and the like, and the basic configuration is not different from a known controller.

  The controller 12 includes electronic components such as an active converter, a diode module, and a power transistor that constitute an inverter. Since these electronic components are heat-generating electronic components, it is necessary to cool the controller 12. In the present embodiment, as shown in FIG. 1, for example, a refrigerant pipe 10 </ b> A between an electronic expansion valve (EEV) 6 and an indoor heat exchanger 8 constituting the refrigeration cycle 11 is in contact with the controller 12. During cooling, the controller 12 is cooled by a low-pressure gas-liquid two-phase refrigerant throttled by the electronic expansion valve 6 flowing in the refrigerant pipe 10A, and during heating, the controller 12 condenses and liquefies by the indoor heat exchanger 8 flowing in the refrigerant pipe 10A. The controller 12 is cooled by the high pressure liquid refrigerant.

  Note that the refrigerant pipe arranged in contact with the controller 12 does not necessarily need to be a pipe between the electronic expansion valve (EEV) 6 and the indoor heat exchanger 8 as described above, and the heat generation provided on the controller 12. As long as it is a refrigerant pipe that can be maintained at a temperature level in a range where a cooling effect can be expected with respect to an electronic component or the like, a refrigerant pipe between the electronic expansion valve (EEV) 6 and the outdoor heat exchanger 5 or a low-pressure gas refrigerant Other piping parts, such as piping, may be sufficient.

  As shown in FIG. 2, the controller 12 includes a compressor 2, a four-way switching valve 3, an outdoor fan 4, an outdoor heat exchanger 5, an electronic expansion valve (EEV) 6, an accumulator 9 and the like that constitute the air conditioner 1. It is arranged at an appropriate place in the outdoor unit 13 to be accommodated. Here, the heat exchanger chamber 14 in which the outdoor fan 4 and the outdoor heat exchanger 5 in the outdoor unit 13 are installed is partitioned by a partition plate 16, and the compressor 2, the four-way switching valve 3, the electronic expansion valve ( EEV) 6, an accumulator 9, etc. are installed via brackets 17 in the upper part on the machine room 15 side.

Specific configurations of the controller 12 are shown in FIGS.
The controller 12 includes a controller body 18, and includes a substrate 21 on which an upper side portion and a lower side portion are fixedly installed via support tools 19 and 20. On the substrate 21, various control circuits and a large number of electronic components constituting the circuit are mounted. Here, a mounting structure and a cooling structure of a plurality of heat generating electronic components 22, 23, 24 such as an active converter, a diode module, and a power transistor, which are components of an inverter that drives an electric motor for the compressor 2, will be described below. explain in detail.

  On the substrate 21, as shown in FIGS. 7A to 7C, a DIP type heat-generating electronic component 22 having a plurality of lead pins 22B extending from both side surfaces of the package main body 22A and extending downward, SIP type heat-generating electronic components 23 and 24 having a plurality of lead pins 23B and 24B extending in a row from one side of the package bodies 23A and 24A are collected at one place on the substrate 21, and a DIP-type heat-generating electronic component 22 are mounted substantially parallel to the substrate surface of the substrate 21, and SIP-type heat-generating electronic components 23 and 24 are mounted substantially vertically to the substrate surface.

  Further, a heat transfer material block 25 made of an aluminum alloy material or the like is installed on the substrate 21 at a predetermined interval substantially parallel to the horizontal direction along the substrate surface. A plurality of heat-generating electronic components 22, 23, 24 are arranged in contact with the manufactured block 25. That is, the heat transfer material block 25 is in contact with the first surface (parallel surface) 26 along the substrate surface on which the DIP type heat generating electronic component 22 is placed in contact with the SIP type heat generating electronic components 23, 24. A substrate surface to be disposed and a second surface (vertical surface) 27 intersecting with the first surface 26 and an inclined surface 28 connecting the first surface 26 and the second surface 27 which are the other surface. The block bodies are provided and distributed in a state where the package bodies 22A, 23A, and 24A of the heat-generating electronic components 22, 23, and 24 are in contact with the first surface 26 and the second surface 27, respectively, and are not illustrated. It is fixed and installed with screws.

  When a plurality of DIP type and SIP type exothermic electronic components 22, 23, 24 are fixedly installed on a first surface 26 along a substrate surface of a heat transfer material block (block body) 25 via a screw or the like, It is necessary to provide mounting holes 29 corresponding to the respective electronic components on the side 21 (see FIG. 12), but the SIP-type heat-generating electronic components 23 and 24 are connected to the substrate surface of the heat transfer material block (block body) 25. By dispersively arranging and fixing on the intersecting second surfaces 27, there is no need to provide mounting holes 29 for mounting electronic components on the substrate 21 side. For this reason, the number of mounting holes 29 for the plurality of electronic components 22, 23, 24 provided on the substrate 21 side can be reduced, and in the case of this embodiment, the number of holes can be halved.

  As described above, the heat transfer material block 25 of the present embodiment includes the first surface 26, the second surface 27, and the inclined surface (the other one surface) 28, and the inclined surface 28 is perpendicular to the vertical surface. The surface has a predetermined inclination in the horizontal direction, and the cross section without a corner of the quadrilateral is a triangular block (right isosceles triangle), and the inclination angle is 45 °. A semicircular concave groove 30 is provided on the surface 28, and the refrigerant pipe 10A is fitted and contacted. As shown in FIG. 4, the heat transfer material block 25 here is a first surface on which an inclined surface 28 having a concave groove 30 is disposed obliquely downward, and a DIP type heat-generating electronic component 22 is disposed. 26 is arranged in the vertical direction, and the second surface 27 on which the SIP type heat-generating electronic parts 23 and 24 are arranged is arranged in the horizontal direction.

  The first surface 26, the second surface 27, and the cross-sectional triangle shape are preferably a parallel surface, a vertical surface, and a cross-sectional right triangle shape (right isosceles triangle shape), but are not limited thereto. However, it is a matter of course that the size of the angle, the inclination of the surface, the deviation, and the like are allowed within the range where the operational effects of the present invention can be expected, and these are also included in the present invention.

  As described above, the upper side and the lower side of the substrate 21 are fixedly installed in the vertical direction via the support members 19 and 20 with respect to the controller main body 18 as described above. The support 19 with the claw portion 19A that removably supports the upper side is provided, and the support 20 that supports the lower side is a support with the hinge 20A that can rotatably support the substrate 21 with the lower side as a fulcrum. First, the lower side portion of the substrate 21 is inserted into and supported by the hinge portion 20A of the support 20, and then the upper side portion is rotated in the direction of the arrow as shown in FIG. And it is set as the structure installed detachably by making the nail | claw part 19A of the support tool 19 latch an upper side part.

  On the other hand, on the bracket 17 side that supports the controller 12, as shown in FIG. 5, the inclined surface 28 of the heat transfer material block 25 is provided at a predetermined height position on the surface facing the back surface of the controller body 18. A support member 31 that supports the refrigerant pipe 10A that fits into the recessed groove 30 is provided. The support member 31 may have a certain length along the horizontal direction, or may be divided and arranged at least at two or more locations along the horizontal direction at a predetermined interval.

  In the support member 31, the support surface 32 that supports the refrigerant pipe 10 </ b> A is an inclined surface (here, an inclined surface of 45 °) opposed to the inclined surface 28 of the block 25 made of heat transfer material. 32 and the inclined surface 28 of the heat transfer material block 25 can be positioned on the refrigerant pipe 10A using the mating surfaces of the blocks. Further, since the support surface 32 of the support member 31 is an inclined surface of 45 °, a heat dissipation silicon sheet (heat dissipation sheet) is provided between the groove 30 of the heat transfer material block 25 and the refrigerant pipe 10A. In the case of interposing 33, the silicon sheet 33 has a function as a holding surface that holds the silicon sheet 33 so as not to fall.

  The inclined support surface 32 of the support member 31 is a surface inclined by 45 ° in the horizontal direction with respect to a vertical surface. The inclined support surface 32 is made of a heat transfer material with the refrigerant pipe 10A as a support surface. The surface of the block 25 is a surface corresponding to the inclined surface 28, and the surface shape and the inclination angle thereof are easy to fit the heat transfer material block 25 to the refrigerant pipe 10A, and radiate heat as in the embodiment described later. In accordance with the cross-sectional shape determined in consideration of the ease of holding the silicon sheet 33 for use, or the reduction in the volume of the heat transfer material block 25 that is a block body, it is changed into various forms. Yes, it is not limited to this.

  With this configuration, when the air conditioner 1 is air-cooled, the low-pressure gas-liquid two-phase refrigerant that has passed through the electronic expansion valve 6 flows, and when heated, the high-pressure liquid condensed and liquefied in the indoor heat exchanger 8 The heat transfer material block 25 is placed in contact with the refrigerant pipe 10A through which the refrigerant flows and is cooled. The heat transfer material block 25 is mounted on the substrate 21 using the heat transfer material block 25 as a heat sink. The refrigerant cooling system controller 12 can be configured to cool the plurality of heat-generating electronic components 22, 23, and 24 arranged in contact with each other via the refrigerant.

With the configuration described above, according to the present embodiment, the following operational effects can be obtained.
When the air conditioner 1 is air-cooled, the refrigerant flows from the compressor 2 through the four-way switching valve 3 to the outdoor heat exchanger 5, the electronic expansion valve 6, the indoor heat exchanger 8, the four-way switching valve 3, and the accumulator 9. When the refrigerant is circulated through the return circuit of the compressor 2 and is heated for heating, the refrigerant passes from the compressor 2 through the four-way switching valve 3 to the indoor heat exchanger 8, the electronic expansion valve 6, and the outdoor heat exchanger 5. Then, it is circulated through the circuit returning to the compressor 2 through the four-way switching valve 3 and the accumulator 9.

  While the air conditioner 1 is in the cooling / heating operation, the controller 12 controls various devices such as controlling the number of rotations of the driving motor of the compressor 2 via the inverter. At this time, electronic components 22, 23, 24 such as an active converter, a diode module, and a power transistor of an inverter mounted on the controller 12 are driven to generate heat. In order for the inverter to operate stably and function over a long period of time, it is necessary to appropriately cool these exothermic electronic components 22, 23, and 24 so as not to overheat.

  Further, during the cooling / heating operation, the temperature of the refrigerant flowing in the refrigerant pipe 10A of the refrigeration cycle 11 is sufficiently lower than the heat generation temperature of the heat generating electronic components 22, 23, 24, and is in contact with the refrigerant pipe 10A. Then, the heat transfer material block 25 to be cooled is used as a heat sink to dissipate and cool the heat generated by the heat-generating electronic components 22, 23, 24, thereby providing electronic components 22, 23, such as active converters, diode modules, and power transistors. 24 can be reliably cooled below the allowable temperature. For this reason, an inverter can be functioned stably over a long period of time.

  On the other hand, in adopting the refrigerant cooling system, it is necessary to integrate the electronic components 22, 23, and 24 into a part of the substrate 21 in order to reduce the heat transfer material block 25 and reduce the heat radiation surface. At this time, in order to fix the electronic components 22, 23, 24 to the heat transfer material block 25, it is usually necessary to provide mounting holes 29 for the electronic components 22, 23, 24 on the substrate 21 side. Since the area occupied by the substrate is reduced, the pattern width of the substrate 21 is reduced by the mounting holes 29, making it difficult to secure the current capacity.

  That is, as shown in Patent Document 1 and FIGS. 12 (A) to (C) described above, the first surface 26 along the substrate 21 of the heat transfer material block 25 has no relation to the DIP type and the SIP type. In the case where all the heat-generating electronic components 22, 23, 24 are arranged in contact with each other, at least four mounting holes 29 for the electronic components 22, 23, 24 must be provided on the substrate 21 side. As a result, the current capacity becomes difficult to secure.

  However, in this embodiment, as shown in FIGS. 7A to 7C, the heat transfer material block 25 is divided into a first surface 26 along the substrate surface of the substrate 21, and the first surface thereof. A block body having at least two surfaces with a second surface 27 intersecting with the DIP type electronic component 22 and the first surface 26 intersecting with the first surface 26 along the substrate 21 of the block body. 2, SIP type electronic components 23 and 24 are dispersedly arranged on the second surface 27.

  For this reason, the mounting holes 29 for fixing and installing the SIP type electronic components 23 and 24 arranged in a distributed manner on the second surface 27 intersecting the substrate 21 of the heat transfer material block 25 which is a block body are formed on the substrate. Therefore, it is not necessary to provide the electronic component mounting holes 29 on the substrate 21 side, and the number of electronic component mounting holes 29 provided on the pattern of the substrate 21 can be reduced. As a result, even if the heat-generating electronic components 22, 23, 24 are integrated into a part of the substrate 21 in order to reduce the size of the heat transfer material block 25, the pattern width of the substrate 21 is reduced by the mounting holes 29. And a sufficient current capacity can be secured.

  The heat transfer material block 25 includes the first and second surfaces 26 and 27, and an inclined surface 28, which is another surface having the recessed groove 30 into which the refrigerant pipe 10A is fitted. The cross section from which one corner of the quadrilateral is omitted is a triangular block body. In this way, one surface having the concave groove 30 in contact with the refrigerant pipe 10A is an inclined surface 28, and the heat transfer material block 25 is formed into a block body having a triangular cross section, thereby minimizing the volume of itself. Can be Therefore, the heat resistance by the heat transfer material block 25 can be reduced, the heat dissipation from the heat-generating electronic components 22, 23, 24 can be improved, and the cooling performance can be improved. The size can be reduced and the cost can be reduced.

  In the present embodiment, the support surface 32 of the support member 31 that supports the refrigerant pipe 10A for cooling the controller 12 along the heat transfer material block 25 on the controller 12 side is a block body having a triangular cross section. It is set as the inclined surface corresponding to the inclined surface 28 which has the concave groove 30 of the block 25 made from a heat-transfer material. Therefore, the support surface 32 inclined on the support member 31 side is used as a mating surface to support the inclined surface 28 of the block body in which the cross section of the heat transfer material block 25 on the controller 12 side is triangular, and the support member The refrigerant pipe 10A supported on the 31 side and the heat transfer material block 25 can be arranged in contact with each other.

  Thus, the refrigerant pipe 10A is positioned using the inclined support surface 32 of the support member 31 and the inclined surface 28 of the heat transfer material block 25 as the mating surfaces of each other, and the refrigerant pipe 10A and the heat transfer material block 25 In the case where the heat radiation sheet 33 is interposed between the refrigerant pipe 10A and the heat transfer material block 25, the heat radiation sheet 33 may be peeled off or dropped during construction. It can prevent and improve workability.

  Further, the substrate 21 is supported on the controller body 18 via support members 19 and 20, and the support member 20 that supports the lower side of the substrate 21 rotatably supports the substrate 21 with the lower side as a fulcrum. It is set as the support tool 20 to do. For this reason, when the substrate 21 is fixedly supported to the controller body 18 via the support members 19 and 20, the substrate 21 is first supported with respect to the support member 20 that rotatably supports the lower side of the substrate 21. By rotating the upper part of the substrate 21 with the support 19 as the fulcrum, the upper side can be fixedly supported on the controller main body 18.

  At this time, with respect to the refrigerant pipe 10A supported by the support member 31 on the bracket 17 side that supports the controller 12, the concave groove 30 provided on the inclined surface 28 which is one surface of the heat transfer material block 25 is provided. It can be fitted while being rotated from the circumferential direction. Accordingly, the concave groove 30 of the heat transfer material block 25 and the refrigerant pipe 10A can be smoothly fitted to each other while avoiding interference with each other, and the heat dissipation interposed between the refrigerant pipe 10A and the heat transfer material block 25 is achieved. The pressure can be uniformly applied to the sheet 33 and the like so that wrinkles are not generated, and the workability can be improved.

  Further, since the controller 12 on the outdoor unit 13 side is the above-described controller 12 that cools the plurality of heat generating electronic components 22, 23, 24 by the refrigerant pipe 10 </ b> A, the heat generating electronic components 22, 23, 24 are mounted on the substrate 21. Even if the heat transfer material block 25 and the controller 12 are reduced in size, the current capacity of the substrate 21 can be sufficiently secured, and the cooling performance for the heat-generating electronic components 22, 23, 24 on the substrate 21 is improved. Further, the air conditioner 1 can be provided with the controller 12 having improved workability at the time of assembly. Therefore, the reliability and assembling of the controller 12 are improved, the size is reduced, and the cost is reduced. A high quality air conditioner 1 can be provided.

[Other Embodiments]
Hereinafter, another embodiment of the present invention will be described with reference to FIGS. 4 and 8 to 11.
(1) In the first embodiment, as shown in FIG. 7, a plurality of SIP-type electronic components 23 and 24 are all arranged on the second surface 27. As shown, among the plurality of SIP type electronic components 23 and 24, some of the electronic components 24 are arranged on the second surface 27, and the remaining some of the electronic components 23 are connected to the DIP type electronic components 22. It is good also as a structure arrange | positioned on the same 1st surface 26. FIG.

  As described above, when a plurality of SIP type electronic components 23 and 24 are provided, a part of the SIP type electronic components 23 and 24 are arranged on the second surface 27 and the rest. The number of mounting holes corresponding to the number of SIP-type electronic components distributed on the second surface 27 side can also be obtained by adopting a configuration in which the SIP-type electronic components 23 are arranged on the first surface 26. 29 need not be provided on the substrate 21 side, and the number of electronic component mounting holes 29 provided on the pattern of the substrate 21 can be reduced. For this reason, the pattern width of the substrate 21 is not reduced by the mounting holes 29, and a sufficient current capacity on the substrate 21 side can be secured.

  (2) In the first embodiment, as shown in FIG. 7B, the first surface 26 of the heat transfer material block 25 has substantially the same width as the package body 22A of the electronic component 22. As shown by a two-dot chain line in FIG. 4, the lower end portion 26A of the first surface 26 along the substrate surface of the heat transfer material block 25 is lower than the lower end portion of the package body 22A of the DIP type electronic component 22. It is good also as a structure extended to the side.

  With such a configuration, even if dew condensation occurs on the surface of the heat transfer material block 25 cooled by the refrigerant pipe 10A, the dew condensation water is used as the lower end of the package body 22A of the DIP type electronic component 22. In addition, it can be quickly dropped downward through the lower end portion 26A of the heat transfer material block 25 extended downward. For this reason, it is possible to prevent the dew condensation water from staying on the controller 12, and the occurrence of a failure or damage to the electronic component due to the dew condensation water dripping onto other electronic components including the electronic component 22 or the control circuit. And the controller 12 can be protected.

  (3) In the first embodiment, the substrate 21 is configured to be fixedly installed on the controller main body 18 with the upper and lower sides by the support tools 19 and 20, respectively. The support 20 with the hinge portion 20A that can rotatably support the substrate 21 with the lower side portion as a fulcrum is used. However, even when the substrate 21 is mounted from the horizontal direction, the groove 30 and the coolant on the heat transfer material block 25 side are provided. As long as the configuration does not interfere with the pipe 10A, as shown in FIG. 9, the upper and lower supports may be the same configuration as the support 19, and the substrate 21 may be installed detachably from the horizontal direction.

  In order to prevent the groove 30 on the heat transfer material block 25 side and the refrigerant pipe 10A from interfering with each other during fitting, the cross-sectional shapes of the heat transfer material block 25 and the support member 31 are as shown in (4) below. In this case, if there is a concern that the heat dissipating sheet 33 may drop or peel off, the heat dissipating sheet 33 is replaced with heat conductive grease such as silicone grease, and the heat dissipating sheet 33 Intervention may be unnecessary, and the present invention includes such an embodiment.

  (4) In the first embodiment, the heat transfer material block 25 has a triangular cross section including the first surface 26, the second surface 27, and the inclined surface 28 (in the first embodiment, a right isosceles triangle). Shape), but if it has two surfaces, a first surface 26 and a second surface 27 on which at least a plurality of electronic components 22, 23, 24 are arranged in a distributed manner, the other 1 The surface does not necessarily need to be the inclined surface 28 when the cross section is triangular, and may be a heat transfer material block 25A having a rectangular cross section as shown in FIG. 10, for example.

Furthermore, about the block made from a heat-transfer material, it is good also as a thing of a cross-sectional shape as shown to FIG. 11 (A) thru | or (E) besides the above.
A block 25B made of heat transfer material shown in FIG. 11 (A) is formed by notching one corner of the quadrilateral obliquely leaving the first and second surfaces 26, 27, and forming an inclined surface (the other surface) 28B. The heat transfer material block 25C shown in FIG. 11 (B) has a shape with a concave bent surface (others) in the same manner. 1 side) It is notched by 28C, and has a shape in which a concave groove 30 is provided at the top position.

  In addition, a block 25D made of heat transfer material shown in FIG. 11C is formed by notching one corner of the quadrilateral with a concave (or convex) curved surface (another surface) 28D, and a concave groove 30 at an intermediate position thereof. The heat transfer material block 25E shown in FIG. 11 (D) has a trapezoidal shape by notching one corner of the quadrilateral with a gently inclined surface. A surface) 28E is provided with a concave groove 30. A heat transfer material block 25F shown in FIG. 11E has a concave bent surface (other one) parallel to the surfaces 26 and 27 at one corner of the quadrilateral. Surface) cut out by 28F, and has a shape in which a concave groove 30 is provided at the top position.

  By configuring the heat transfer material blocks 25A to 25F as described above, in any case, a plurality of electronic components 22, 23, and 24 are dispersedly arranged on two intersecting surfaces, and are provided on the substrate 21. It is possible to enjoy the effect that the number of holes 29 can be reduced to suppress the reduction in pattern width. When the heat transfer material block 25A is used, its volume becomes larger than that of the first embodiment, and the heat resistance of the heat transfer material block 25A increases. The increase in thermal resistance can be improved by improving the cooling effect due to reduction in contact thermal resistance, etc., and the decrease in installation workability when the heat radiating sheet is adopted can be covered by substituting with heat transfer grease.

  Furthermore, in addition to the heat transfer material block 25 of the first embodiment, the heat transfer material blocks 25B to 25F have various cross-sectional shapes as shown in FIGS. Therefore, when the concave groove 30 of the heat transfer material blocks 25B to 25F is fitted to the refrigerant pipe 10A supported by the support member 31 for contact assembly, the heat transfer has a shape that is easier to assemble. A block made of material can be selected, which can contribute to improvement in workability when the controller 12 is assembled. In this case, it goes without saying that the support surface 32 of the support member 31 is a support surface corresponding to the other surfaces 28B to 28F on the heat transfer material blocks 25B to 25F side.

  That is, the blocks 25B to 25F made of heat transfer material are fixedly installed on the plurality of electronic components 22, 23, 24 in contact with each other, that is, the first and second surfaces 26, 27, and the refrigerant pipe 10A. A surface having a recessed groove 30 to which the contact is fitted, that is, a block body provided with the inclined surfaces 28B and 28E, the bent surfaces 28C and 28F, the curved surface 28D, etc., and the surface having the groove 30 of the block body. 28B to 28F are inclined surfaces 28B and 28E, bent surfaces 28C and 28F, and a curved surface 28D having a predetermined inclination in the horizontal direction as a whole with respect to the vertical surface, whereby heat transfer as a block body is performed on the refrigerant pipe 10A. When the concave grooves 30 on the material blocks 25B to 25E are fitted and contacted, the inclined surfaces 28B and 28E, the bent surfaces 28C and 28F, and the curved surface 28D having a predetermined inclination in the horizontal direction. Performs positioning of the refrigerant pipe 10A as mating surface against the corresponding support surface 32 of the support member 31 for supporting the refrigerant pipe 10A, to no heat transfer member made of block 25B can be positioned in contact with and 25F and the refrigerant pipe 10A.

  Therefore, the heat transfer material blocks 25B to 25F and the refrigerant pipe 10A can be positioned easily and reliably in contact with each other, and even when the heat radiation sheet 33 or the like is interposed therebetween, the heat radiation material 33 The sheet 33 can be held by a support surface having a predetermined inclination in the horizontal direction, and peeling and dropping of the sheet during construction can be prevented and workability can be improved.

  Similarly to the heat transfer material block 25, the heat transfer material blocks 25B to 25F have two surfaces 26, 27 that can fix and install a plurality of electronic components 22, 23, 24, and the two surfaces 26, The block body is provided with the surfaces 28B to 28F having the concave grooves 30 formed with the inclined surfaces 28B and 28E, the bent surfaces 28C and 28F or the curved surface 28D so as to cut out one corner of the block body 27. Therefore, by forming the surface having the groove 30 of the heat transfer material blocks 25B to 25F with the inclined surfaces 28B, 28E, the bent surfaces 28C, 28F or the curved surface 28D that cut out one corner of the block body, The volume of the heat transfer material blocks 25B to 25F, which are block bodies, can be reduced to reduce the size and weight.

  As a result, the heat resistance of the heat transfer material blocks 25B to 25F can be reduced, the heat dissipation from the heat generating electronic components 22, 23, and 24 can be improved, and the heat transfer material blocks 25B to 25F can be further improved. The size can be reduced and the cost can be reduced. Further, the surfaces having the concave grooves 30 are inclined surfaces 28B, 28E, bent surfaces 28C, 28F, or curved surfaces 28D, so that the refrigerant pipe 10A can be easily fitted and contacted with the concave grooves 30, and the controller 12 is assembled. The workability at the time can be improved.

  Further, since the support surface 32 of the support member 31 that supports the refrigerant pipe 10A is a support surface corresponding to the inclined surfaces 28B, 28E, the bent surfaces 28C, 28F, or the curved surface 28D having the groove 30 on the block body side, With the corresponding support surfaces as mating surfaces, the inclined surfaces 28B, 28E, the bent surfaces 28C, 28F or the curved surfaces 28D having the concave grooves 30 of the heat transfer material blocks 25B to 25F are supported and supported by the support member 31. The refrigerant pipe 10A and the heat transfer material blocks 25B to 25F can be arranged in contact with each other. Therefore, the heat transfer material blocks 25B to 25F and the refrigerant pipe 10A can be positioned easily and reliably in contact with each other, and even when the heat radiation sheet 33 or the like is interposed therebetween, the sheet 33 is It can hold | maintain with the support surface which has a predetermined inclination in a horizontal direction, can prevent peeling and fall of the sheet | seat 33 at the time of construction, and can improve workability.

  Note that the present invention is not limited to the invention according to the above-described embodiment, and it goes without saying that modifications can be made as appropriate without departing from the scope of the invention. For example, in the above-described embodiment, an example in which three exothermic electronic components 22, 23, and 24 are provided on the substrate 21 has been described. However, the number of exothermic electronic components installed and the number of breakdowns of DIP type and SIP type are described. Etc. are not particularly limited.

DESCRIPTION OF SYMBOLS 1 Air conditioner 10A Refrigerant piping 12 Controller 13 Outdoor unit 17 Bracket 18 Controller main body 19,20 Support tool 19A Claw part 20A Hinge part 21 Substrate 22 DIP type electronic component (heat generating electronic component)
22A, 23A, 24A Package body 23, 24 SIP type electronic component (heat-generating electronic component)
25 Heat transfer material block (block body)
25A, 25B, 25C, 25D, 25E, 25F Heat transfer material block (block body)
26 First surface 26A Lower end portion 27 Second surface 28 Inclined surface (the other surface)
28B, 28C, 28D, 28E, 28F Another surface 30 Groove 31 Support member 32 Support surface (inclined support surface)

Claims (10)

A plurality of heat-generating electronic components mounted on a board are fixedly installed in contact with a heat transfer material block cooled via a refrigerant pipe, and the heat transfer material block can be cooled using the heat transfer material block as a heat sink. In a controller with sexual electronic parts,
The heat transfer material block is a block body having at least two surfaces of a first surface along the substrate and a second surface intersecting the first surface;
A part of the electronic component is disposed on the first surface of the block body, and at least one or more SIP type electronic components are disposed on the second surface ,
The heat transfer material block is a block body including one surface having at least a concave groove in contact with the refrigerant pipe in addition to the two surfaces.
The one surface having the concave groove is formed by notching one corner in a cross section perpendicular to the extending direction of the concave groove of the block body so as to have a predetermined inclination in the horizontal direction with respect to the vertical surface. A controller including an exothermic electronic component, wherein the controller is an inclined surface, a bent surface, or a curved surface .   When a plurality of SIP type electronic components are provided, all of them are arranged on the second surface, or a part thereof is arranged on the second surface and the remaining part is arranged on the first surface. The controller having a heat-generating electronic component according to claim 1, wherein the controller is arranged. The support surface of the support member that supports the refrigerant pipe along the heat transfer material block on the controller side corresponds to the one surface having the concave groove of the block body constituting the heat transfer material block. The controller having a heat-generating electronic component according to claim 1, wherein the controller has an inclined surface, a bent surface, or a curved surface. In the heat transfer material block, the lower end portion of the first surface along the substrate on which a part of the plurality of electronic components is arranged is lower than the lower end portion of the package body of the partial electronic components. controller with a heat-generating electronic component according to any of claims 1 to 3, characterized in that it is extended to. The substrate is supported by a controller body via a support, and the support that supports the lower side of the substrate is a support that rotatably supports the substrate with the lower side as a fulcrum. controller with a heat-generating electronic component according to any one of claims 1 to 4. A plurality of heat-generating electronic components mounted on a board are fixedly installed in contact with a heat transfer material block cooled via a refrigerant pipe, and the heat transfer material block can be cooled using the heat transfer material block as a heat sink. In a controller with sexual electronic parts,
The heat transfer material block is a block body having at least two surfaces of a first surface along the substrate and a second surface intersecting the first surface;
A part of the electronic component is disposed on the first surface of the block body, and at least one or more SIP type electronic components are disposed on the second surface ,
The substrate is supported by a controller body via a support, and the support that supports the lower side of the substrate is a support that rotatably supports the substrate with the lower side as a fulcrum. A controller equipped with heat-generating electronic components. A plurality of heat-generating electronic components mounted on a board are fixedly installed in contact with a heat transfer material block cooled via a refrigerant pipe, and the heat transfer material block can be cooled using the heat transfer material block as a heat sink. In a controller with sexual electronic parts,
The heat transfer material block is a block body having two intersecting surfaces on which a plurality of the electronic components can be fixedly installed and a surface having a concave groove into which the refrigerant pipe is fitted and contacted,
The surface of the block body having the groove is cut out at a corner in a cross section perpendicular to the extending direction of the groove of the block body so as to have a predetermined inclination in the horizontal direction with respect to the vertical surface. A controller provided with a heat-generating electronic component, wherein the controller is an inclined surface, a bent surface, or a curved surface.   The substrate is supported by a controller body via a support, and the support that supports the lower side of the substrate is a support that rotatably supports the substrate with the lower side as a fulcrum. A controller comprising the heat-generating electronic component according to claim 7. The heat generation according to claim 7 or 8 , wherein the refrigerant pipe is supported by a support member having a support surface corresponding to an inclined surface, a bent surface, or a curved surface having the concave groove of the block body. Controller equipped with sexual electronic components. An air conditioner in which the controller according to any one of claims 1 to 9 is mounted as the outdoor unit side controller, wherein a plurality of heat-generating electronic components are cooled by refrigerant piping.

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