JP6381248B2 - Plating apparatus and plating method - Google Patents

Description

The present invention, a plating apparatus such as plating the plating object, such as electronic components, and a plating how.

  Conventionally, a barrel plating method for plating small parts such as electronic parts has been proposed (see Patent Document 1). In this method, a plurality of small articles that are objects to be plated are put together with a large number of dummy media (iron balls) in the plating solution in the barrel, and current is passed through the anode and cathode while rotating and stirring the barrel. Plating small parts with nickel (metal for plating) on the anode side.

  Here, the barrel used in the above method is a consumable item, but it is not easy to handle because it is large and heavy. For this reason, it is desirable to facilitate handling of such barrels.

  However, the method described above has not been such that the handling of the barrel used for stirring can be facilitated.

JP 2007-39719 A

The present invention, in view of the above problems, consumable handling is easy plating apparatus, and provides plating how, aims to improve the user's satisfaction.

This invention is plated chamber and, an anode for supplying a current supplied from the power supply to the plating solution, a plurality of plating object is placed is to function as negative electrode plating object for accommodating a plating liquid A plating object placing section; and a stirring means for moving the plating object placed on the plating object placing section in an agitating space and changing a posture thereof, the plating object placing section, A plating apparatus that is formed of a flexible conductive film and includes, as the agitation means, a liquid flow generation means that agitates the plating object by spraying or sucking the plating solution in the vicinity of the plating object. It is characterized by.

The present invention by a easy to handle consumables plating apparatus, and can provide a plating how.

FIG. 3 is a longitudinal front view of the plating apparatus according to the first embodiment. FIG. 2 is a plan view of the plating apparatus of Example 1. FIG. 3 is a partially longitudinal enlarged front view of the plating apparatus of Example 1. FIG. 6 is a longitudinal front view of the plating apparatus of Example 2. FIG. 6 is a partial cross-sectional plan view of the plating apparatus of Example 2.

  An embodiment of the present invention will be described below with reference to the drawings.

  FIG. 1 shows a partially longitudinal front view of the plating apparatus 1, FIG. 2 shows a plan view of the plating apparatus 1, and FIG. 3 shows a partially longitudinal enlarged front view of the plating apparatus 1.

  As shown in FIG. 1, the plating apparatus 1 is disposed at an upper portion of an outer casing 3 having an open upper surface, a plating chamber 10 accommodated in the outer casing 3, and a plating solution 5 in the plating chamber 10. An anode electrode (anode) 7, a supply roll portion 9 a on one side around the plating chamber 10, and a winding roll portion 9 c on the other side, and a flat film portion (cathode, plating object mounting portion) 9 b therebetween. And a conductive film 9 passing through the inside of the plating chamber 10.

  The external housing 3 is a rectangular container having an upper opening, and the plating chamber 10 is accommodated in the external housing 3.

  The plating chamber 10 is formed in a rectangular container shape having a size that can be accommodated in the outer casing 3 and having an upper surface opened, and is filled with a plating solution 5. In the plating chamber 10, the anode 7 and at least the flat film portion 9 b of the conductive film 9 are accommodated in the plating solution 5.

  The plating chamber 10 has one side surface (left side surface in FIG. 1) in the supply direction of the conductive film 9 (left and right direction in FIG. 1) and the other side surface (right side surface in FIG. 1) opposite to the side surface. A horizontally long slit hole 12 is formed near the bottom. The slit hole 12 is formed wider than the width of the conductive film 9. Through the slit hole 12, the planar film portion 9 b of the conductive film 9 is introduced into the plating chamber 10. Moreover, after this slit hole 12 is sealed by a sealing body (not shown), the plating solution 5 is filled in the plating chamber 10 and the operation is performed so that the plating solution 5 does not leak.

Guides 21 and 21 are arranged in the vicinity of both ends in the supply direction of the conductive film 9 inside the plating chamber 10.
The guide 21 has a length in the width direction (vertical direction in FIG. 2) of the conductive film 9 that is substantially the same as the width of the conductive film 9, and has a flat bottom surface. The guide 21 has an upper surface of the planar film portion 9b of the conductive film 9 may depressed so as not to float. The length of the guide 21 is the entire inside of the plating chamber 10, longer than the width of the conductive film 9, or slightly shorter than the width of the conductive film 9. What is necessary is just to make it long enough to plate a plating target object above.

  Inside the guide 21, a liquid injection hole 23 (see FIG. 3) extending in the supply direction of the conductive film 9 is provided. One end of the liquid injection hole 23 communicates with the liquid injection unit 15, and the other end penetrates the end surface of the guide 21 on the center side of the plating chamber 10 and communicates with the plating space 27 (see FIG. 3). The liquid injection hole 23 is formed across the entire width of the conductive film 9 (at least the entire width of the plating space 27) in the width direction of the conductive film 9.

  The liquid jet unit 15 is arranged over the entire width direction of the conductive film 9 near the side surface of the plating chamber 10 above the guide 21. The liquid injection unit 15 causes the plating solution injected from the injection pump 16 to flow in the flow space 17 and convey it to the liquid injection hole 23 of the guide 21, and this plating solution is transferred to the tip (plating chamber) of the liquid injection hole 23. 10 center side) and sprayed into the plating space 27.

  A cover fixing portion 25 that is long in the width direction of the conductive film 9 (vertical direction in FIG. 2) is provided on the upper surface of each guide 21. The cover fixing part 25 fixes both ends of a mesh-like cover sheet 28 that covers the plating object W placed on the flat film part 9 b of the conductive film 9.

  The cover sheet 28 is disposed substantially parallel to the planar film portion 9b of the conductive film 9 with the plating space 27 therebetween, and the guide guides 35 and 33 are convex in the direction away from the conductive film 9 at the stirring unit 30 portion. , 35 (see FIG. 3).

  The plating space 27 formed by the portion other than the stirring unit 30 of the cover sheet 28 and the flat film portion 9b of the conductive film 9 is placed on the flat film portion 9b of the conductive film 9 and overlaps in the vertical direction. The plating target W is formed in a space that is regulated so as not to move between the upper surface of the flat film portion 9 b and the lower surface of the cover sheet 28.

  The stirring unit 30 is disposed so that both ends of the conductive film 9 are connected to both ends in the width direction (both ends in the vertical direction in FIG. 2), and the both ends are connected to the side plates 36, 36. A current prevention cover 31, induction guides 33, 35, 35, and a liquid flow generation unit (liquid flow generation means, stirring means) 37.

The guides 35, 35 are arranged on the upper surface of the cover film 28 with a sufficient interval in the stirring unit moving direction (left and right direction in FIG. 3, the same as the supply direction of the conductive film 9) to stir the plating object W. It is formed by two columnar members extending in the width direction of the conductive film 9 arranged so as to come into contact.

The guide guide 33 is formed in an arc shape that is convex upward in a front view. With this guide guide 33, the cover sheet 28 guided upward from the horizontal state by one guide guide 35 is guided to bend on the upper surface of the guide guide 33 and guided to the other guide guide 35 below. The cover sheet 28 guided to the other guide guide 35 is guided to a horizontal state by the other guide guide 35. This configuration, below the cover sheet 28 which is derived is the orientation in induction guide 35,33,35, agitation space 29 for stirring the plating object W are formed.

  The current prevention cover 31 is formed of a plate-like non-conductive material that covers the entire width of the conductive film 9 between the induction guides 35 and 35, and is arranged so as to cover the entire upper portion of the stirring space 29. ing. Thereby, it is prevented that an electric current flows into the stirring space 29, and unintentional plating is prevented from being performed on the upper surface of the flat film portion 9 b of the conductive film 9 in the stirring space 29. That is, when the plating object W is stirred in the stirring space 29, the upper surface of the flat film portion 9b of the conductive film 9 is exposed. The exposed upper surface of the planar film portion 9b of the conductive film 9 is easily plated. For this reason, unnecessary plating on this portion is prevented by the current prevention cover 31.

  The liquid flow generators 37 and 37 are disposed at the inner positions of the guides 35 and 35 and are formed long in the width direction of the conductive film 9. The liquid flow generators 37 and 37 are connected to a pump (not shown) and suck up the plating solution in the stirring space 29. Stirring is performed so that the plating object W is wound up by the liquid flow generated thereby. The suction port (not shown) provided on the bottom surface side of the liquid flow generating portions 37, 37 is a hole smaller than the object to be plated W or covered with a mesh fabric finer than the size of the object to be plated W. The suction of the plating object W is prevented.

A guide protrusion 38 (see FIG. 2) is provided on the outer surface of the side plate 36. The guide protrusion 38 engages with a moving guide 39 provided on the inner side of both side surfaces of the plating chamber 10. The moving guide 39 is a guide extending in the moving direction of the stirring unit, and the guide protrusion 38 is engaged with the moving guide 39, so that the stirring unit 30 moves horizontally in the moving direction of the stirring unit in parallel with the flat film portion 9b of the conductive film 9. can do. This horizontal movement is executed by a driving device such as a motor (not shown).

  When the stirring unit 30 moves, the position where the cover sheet 28 is lifted is also moved along with this, so the stirring space 29 is also moved.

  As shown in FIG. 1, the electroconductive film 9 is set as the supply roll part 9a in the state wound by roll shape on the outer side of the electroconductive film 9 supply side of the plating chamber 10. As shown in FIG. The conductive film 9 supplied from here is introduced into the plating chamber 10 through one slit hole 12 of the plating chamber 10, and is guided to the outside of the plating chamber 10 through the other slit hole 12. The conductive film 9 guided to the outside of the plating chamber 10 is taken up by a take-up roll unit 9c. The take-up roll unit 9c is rotationally driven by appropriate driving means such as a motor, and takes up the necessary amount of the conductive film 9. The supply roll unit 9a rotates with the winding of the winding roll unit 9c, and feeds and supplies the same amount of the conductive film 9 as the winding amount.

  Thereby, the conductive film 9 is supplied into the plating chamber 10 from the supply roll unit 9a to perform the plating process, and when the plating process is finished, the used conductive film 9 is wound up by the winding roll unit 9c. A new conductive film 9 (that is, an unused portion) is supplied into the plating chamber 10.

Conductive film 9 is made by forming a flexible plated conductive material flexibility or stretchy film (especially a film of non-conductive material is preferred), for example, 6 to poly Lee phagemid film It can be formed by applying copper plating of about 8 microns.

  The anode electrode 7 (see FIG. 1) is an anode formed of a material to be plated, and is formed of an appropriate plating metal such as nickel or tin.

  The anode 7 is connected to the positive side of the power source, and at least the flat film portion 9b of the conductive film 9 is connected to the negative side of the power source so that a current flows in the plating solution.

  The plating object W can be an appropriate electronic component such as a capacitor or a resistor, for example, an extremely small electronic component such as 0.6 mm × 0.3 mm or 0.4 × 0.2 mm.

The plating apparatus 1 configured as described above performs the plating process by executing the following plating method.
First, a new conductive film 9 is introduced into the plating chamber 10, and a plurality of plating objects W are laminated on the upper surface of the flat film portion 9b. This lamination is performed to such an extent that the stacked object W, which is an extremely small electronic component such as 0.6 mm × 0.3 mm or 0.4 × 0.2 mm, has a stacked height of 6 mm or 10 mm (electrically. A large number of the conductive films 9 are piled up to such an extent that the conductive film 9 becomes invisible by the plating object W. At this time, a dummy medium composed of an iron ball or the like is unnecessary, and only the plating object W is laminated.

  The stacked plating objects W are covered with the cover sheet 28 from above and fixed so as not to move in the plating space 27 (see FIG. 3). The object W existing in the stirring space 29 (see FIG. 3) is in a state where it can move freely without being pressed from above.

  After preparing in this way, an electric current is sent from the power source connected to the anode electrode 7 and the conductive film 9 as a cathode electrode (cathode). Then, the metal ions for plating dissolved from the anode electrode 7 are subjected to a reducing action on the surface of the plating target portion of the plating object W to form a metal film for plating on the surface, and the plating object W in the plating space 27 is used for plating. Plated with metal.

  The plating apparatus 1 moves the stirring unit 30 continuously or intermittently from one guide 21 side end portion to the other guide 21 side end portion to generate a liquid flow at the liquid flow generation portion 37, thereby stirring space 29. The inner plating object W is stirred. At this time, the plating object W moves a short distance in the limited space of the stirring space 29 and changes its posture (orientation). As the stirring unit 30 moves, the agitated plating object W is pressed by the cover sheet 28 while being laminated on the conductive film 9, stops moving, and is plated again.

  At the position where the stirring unit 30 is closest to the guide 21, the plating object W stirred in the stirring space 29 spreads toward the guide 21 due to the liquid flow of the liquid flow generation unit 37 (see FIG. 3). The plating object W spread in this way is pushed back by spraying the plating liquid from the liquid injection hole 23 (see FIG. 3) of the guide 21, and the thickness where the plating object W is laminated is maintained.

  In this way, the stirring unit 30 is moved and appropriately stirred, and the plating is continued in the plating space 27 (see FIG. 3) that is not stirred, so that the plating object W is uniformly and uniformly plated. Apply.

  With the above configuration and operation, when a current is supplied from the power source, the plating object W existing in the plating space 27 (see FIG. 3) can be plated with the material of the anode electrode 7. Since a plurality of plating objects W in the plating space 27 are stacked in the vertical direction (current direction for plating) and the conductive film 9 cannot be seen, unnecessary plating is electrodeposited on the upper surface of the conductive film 9. Can be prevented.

  Further, since the stirring space 29 (see FIG. 3) where the upper surface of the conductive film 9 is exposed is covered with the current prevention cover 31 and no current flows, unnecessary plating on the upper surface of the conductive film 9 in the stirring space 29 is performed. Can be prevented from being electrodeposited.

Further, since the conductive film 9 serving as the cathode electrode is in a roll shape, it can be fed out one after another as much as necessary, and can be handled easily. That is, there is no need to replace the barrel as in the previous barrel type, and the necessary amount of the conductive film 9 can be easily drawn out to perform the plating process.

  Further, since the stirring space 29 is sufficiently narrow such that it is less than half of the plating space 27, preferably less than one-third, more preferably less than one-fifth, the plating object W can be moved and changed in posture (change in orientation) in a narrow space. ), It is possible to efficiently plate a large number of plating objects W in a wide space and perform stable plating.

  FIG. 4 shows a longitudinal front view of the plating apparatus 51 of the second embodiment, and FIG. 5 shows a partial cross-sectional plan view of the plating apparatus 51 of the second embodiment.

  The plating apparatus 51 includes a cylindrical lower casing 53b whose upper surface is opened, an upper casing (plating chamber) 53a having the same radial size and opened on both upper and lower surfaces, and a lid that covers the upper surface of the upper casing 53a. 54 and a vibration generating unit (vibrating unit, stirring unit) 80 configured by a driving unit such as a motor provided in the lid unit 54.

  The lower housing 53b includes a packing P formed in a ring shape along the circumference of the upper surface. The upper housing 53a includes a packing P formed in a ring shape along the circumference of the lower surface. These packings P are formed of an elastic material such as rubber.

  Between the upper casing 53a and the lower casing 53b, the plating object accommodation cartridge 70 is sandwiched through the packing P, and is closely fixed by a position fixing tool (not shown). When the plating solution 55 is put into the upper housing 53a in this state, the plating object accommodating cartridge 70 becomes the bottom, and the plating solution 55 does not leak due to the action of the packing P, and the upper housing 53a functions as a plating chamber. To do.

  The lid 54 is provided with a vibration generator 80 at the top and an anode (anode) 57 at the bottom. The anode electrode 57 is formed in a plate shape having a circular shape in plan view using a plating metal such as nickel or tin. The anode electrode 57 is formed to have a size that covers the entire area where the plating object W is present in the plating object accommodation cartridge 70 and is immersed in the plating solution 55 of the upper casing 53a. The anode electrode 57 is prepared with a plurality of different types of metal for plating, and is selectively used depending on which material is used for plating.

  The lid 54 is provided with a liquid flow generation unit (liquid flow generation means, stirring means) 83 that generates a liquid flow. The liquid flow generation unit 83 is formed in an L shape and has an upper end connected to a rotation drive unit (not shown) of the lid unit 54. The inside of the liquid flow generation part 83 is hollow, and a plurality of liquid passage holes 84 are provided on the bottom surface. The liquid flow generation unit 83 takes in the plating solution 55 accommodated in the upper housing 53 a and discharges it from the liquid passage hole 84 by a pump (not shown). Thereby, the downward liquid flow is generated and the plating object W is wound up and stirred.

  Further, the liquid flow generating portion 83 has a lower horizontal straight portion arranged in parallel in the radial direction from the center of the plating object containing cartridge 70 to the vicinity of the outer periphery, and is rotated in a circular shape in plan view by the rotation driving portion of the lid portion 54. To do. For this reason, the plating object W in the position below the liquid passage hole 84 is agitated to change the position and orientation (direction), and this is performed on all the plating objects W while rotating.

  The plating object storage cartridge 70 is formed in a rectangular film shape, and a rectangular conductive film (cathode, plating object mounting portion) 59 is provided on the lower surface side, and a rectangular cover sheet 78 is provided on the upper surface side. A ring-shaped packing P is sandwiched between them. The packing P is made of an elastic material such as rubber, and the thickness (length in the vertical direction) is almost the same as or slightly thicker than the thickness for stacking the plating object W, such as 6 mm or 10 mm. Degree. This ensures a space in which the object to be plated W is accommodated and can be stirred, and when it is sandwiched between the upper casing 53a and the lower casing 53b, it adheres firmly with its elasticity and the plating solution 55 leaks. I try not to go out. In the drawing, the packing P in the plating object storage cartridge 70 is formed to be wider in the radial direction than the packing P disposed above and below the plating object storage cartridge 70 so that there is no problem even if there is a slight misalignment. However, the present invention is not limited to this, and the width can be set to an appropriate width, for example, by reversing the width-width relationship or by using the same width.

  A plurality of plating objects W are accommodated in a space formed inside the packing P between the cover sheet 78 and the conductive film 59. As the plating object W, the same one as in the first embodiment can be used, and it is preferable that the plating object W is laminated to the same thickness as that in the first embodiment. As a result, the conductive film 59 can be prevented from being exposed, and plating can be prevented from being electrodeposited on the conductive film 59.

Conductive film 59 is one formed by plating a conductive material in the flexible or stretchable film (especially a film of non-conductive material is preferred), such as poly Lee bromide film 6-8 microns It can be formed by applying copper plating of a degree.

The cover sheet 78 is a mesh-like material that is disposed substantially parallel to the conductive film 59 with a plating space therebetween, and covers the plating object W.
The conductive film 59 and the cover sheet 78 are in close contact with each other without any gaps, and are configured so that the inner plating object W does not leak to the outside.

  In the illustrated example, the cover sheet 78 and the conductive film 59 are formed in the same size. However, the present invention is not limited to this, and for example, the cover sheet 78 is formed in a bag size that is slightly larger than the conductive film 59. The packing P and the conductive film 59 may be accommodated therein, and a plurality of plating objects W may be accommodated inside the packing P. Even in this case, the same effect can be obtained.

The plating apparatus 51 configured in this way performs the plating process by executing the following plating method.
First, the plating object accommodation cartridge 70 is sandwiched between the upper casing 53a and the lower casing 53b, and is firmly fixed by a position fixture (not shown). At this time, the plating object storage cartridge 70 (particularly the conductive film 59) is set in a state where the whole is taut. Then, the plating solution 55 is poured into the upper housing 53a, and the lid portion 54 on which the anode electrode 57 is set is closed.

  When a current is supplied from a power source using the anode electrode 57 as an anode and the conductive film 59 of the plating object storage cartridge 70 as a cathode electrode (cathode), the metal ions for plating dissolved from the anode electrode 57 are plated portions of the plating object W. The metal film for plating is formed on the surface by receiving a reducing action on the surface, and the plating object W is plated with the metal for plating.

  In addition, the plating target W is such that the stacked height of the plating target W, which is an extremely small electronic component such as 0.6 mm × 0.3 mm or 0.4 × 0.2 mm, becomes 6 mm or 10 mm thick. A large number of the conductive films 59 are piled up to such an extent that the conductive film 59 becomes invisible by the plating object W when viewed electrically. A dummy medium composed of an iron ball or the like is unnecessary, and only the plating object W exists in the plating object accommodation cartridge 70.

  The plating apparatus 1 supplies current and also performs vibration by the vibration generating unit 80. This vibration is transmitted to the plating object accommodation cartridge 70, and the conductive film 59 of the plating object accommodation cartridge 70 vibrates. Since the conductive film 59 vibrates in a tensioned state, the conductive film 59 moves so that the plating object W placed thereon slightly jumps and changes its posture (orientation). Since the vibration is continuously performed in fine units, a slight movement of the plating object W (a distance between the conductive film 59 and the cover sheet 78) and a change of posture are continuously performed by one vibration. . In addition, by changing the frequency of vibration, the amount of vertical lamination of the plating objects W by all the plating objects W and the spread width in the horizontal direction can be changed.

  In addition, the plating apparatus 1 performs an operation of injecting the plating solution 55 from the liquid passage hole 84 while causing the current to flow and rotating the liquid flow generation unit 83. Thereby, the plating object W in the plating object accommodation cartridge 70 is agitated and is not more than half, preferably not more than one-third, of the diameter of the existence range of the plating object W accommodated in a substantially circular shape in plan view. More preferably, it moves over a short distance of 1/5 or less.

  When the plating solution 55 is ejected from the liquid passage hole 84, the plating object W at that position is stirred so as to spread, and the plating object W immediately below the liquid passage hole 84 is reduced or temporarily absent. Due to the vibration of the vibration generating unit 80, the surrounding plating objects W immediately gather and return to the original stacking amount.

  In this way, the plating process is repeated with appropriate stirring, and the plating object W is uniformly plated with a constant thickness.

  With the above configuration and operation, when a current is supplied from the power source, the plating object W existing in the plating space can be plated with the material of the anode electrode 57. Since a plurality of plating objects W in the plating space are stacked in the vertical direction (current direction for plating) and the conductive film 59 cannot be seen, unnecessary plating is electrodeposited on the upper surface of the conductive film 59. Can be prevented.

  Further, the distance that the plating object W moves by agitation is a sufficiently short distance that is less than half of the plating space where the plating object W is present, preferably one third or less, more preferably one fifth or less. Therefore, stable plating can be performed.

  In addition, since the plating object W and the conductive film 59 that need to be replaced every time plating is completed can be set as the plating object accommodation cartridge 70 with one touch, the replacement work is facilitated and the replacement time is shortened. be able to.

  Further, since the plating object storage cartridge 70 is a thin rectangle, it can be stored in a plurality of layers, and the space required for storage can be reduced. Moreover, since the plating object accommodation cartridges 70 can be stacked near the plating apparatus 1, they can be taken and replaced at any time on the spot without having to go to the storage box each time the replacement work is performed.

The present invention is not limited only to the configuration of the above-described embodiment, and many embodiments can be obtained.
For example, in Example 1, the stirring portion is moved in the same direction as the supply direction of the conductive film 9, but not limited thereto, the stirring portion is moved in a direction orthogonal to the supply direction of the conductive film 9. For example, it can be moved in an appropriate direction.

  Further, when the plating object W is large to a certain extent and immediately sinks due to its own weight in the plating solution 55, the cover sheet 28 of Example 1 (see FIG. 1) or the cover sheet 78 of Example 2 ( (See FIG. 4). In this case, since the plating object W does not float more than necessary, the same effects as those of the first and second embodiments described above can be obtained without preventing the cover sheets 28 and 78 from lifting.

  Further, the plating object accommodation cartridge 70 of the second embodiment can be a cartridge fixed to a frame body made of a material such as plastic. In this case, even if the operator is not tensioned, the tensioned state by the frame can always be maintained, handling can be facilitated, and the tension of the conductive film 59 can be stabilized.

  Further, a tension changing unit that can change the tension of the plating object accommodation cartridge 70 (particularly the conductive film 59) may be provided in the second embodiment. Specifically, for example, a ring-shaped pressing tool that presses the vicinity of the plating object accommodation cartridge 70 (particularly the conductive film 59) from the inside to the upper side of the lower housing 53b, and an elevation that moves the pressing tool up and down. Can be provided. In this case, the tension applied to the plating object storage cartridge 70 inside the pressing tool can be changed by changing the amount of pressing the plating object storage cartridge 70 with the pressing tool. As a result, when the tension applied to the plating object storage cartridge 70 increases, the plating object W vibrates in a wide range, and when the tension applied to the plating object storage cartridge 70 decreases, the plating object W gathers in the center and falls within a narrow range. Vibrate. By repeating this tension change, the plating object W spreads or gathers in the center, and the randomness of the position change and the attitude change can be improved.

  Moreover, the plating object accommodation cartridge 70 of Example 2 is good also as a cartridge containing the packing P of the upper and lower sides of the plating object accommodation cartridge 70 shown in FIG. In this case, the upper and lower packings P may be configured to be fixed by a separate fixture in a state where the cover sheet 78, the conductive film 59, and the packing P therebetween are sandwiched. Thereby, handling of the plating object accommodating cartridge 70 can be further facilitated.

  Further, the packing P in the plating object accommodation cartridge 70 according to the second embodiment is not limited to a circular shape, and can be formed into various shapes such as a polygon such as a quadrangle or a hexagon. Even in this case, the same effect can be obtained.

  Further, the shape of each packing P, the shape of the lower end of the upper casing 53a, and the shape of the upper end of the lower casing 53b are substantially the same in the second embodiment. However, the present invention is not limited to this. It can be formed in the shape of Even in this case, the same effect can be obtained.

  Moreover, you may provide an electric current prevention cover in the upper position of the horizontal part of the liquid flow generation | occurrence | production part 83 of Example 2. FIG. In this case, even when the plating object W is spread by the liquid flow and the upper surface of the conductive film 59 is exposed, this portion is covered with the current prevention cover 31 so that no current flows. For this reason, it is possible to prevent unnecessary plating from being electrodeposited on the upper surface of the conductive film 59 at a portion where the plating object W is spread around by the liquid flow.

  In both Examples 1 and 2, first, nickel plating is performed on the anode electrodes 7 and 57 using nickel, and then tin plating is performed on the anode electrodes 7 and 57 using tin. Multi-layer plating such as two-layer plating may be performed.

  Moreover, in any of Example 1, 2, you may add the other external force provision part which accelerates | stimulates stirring of the plating target object W. FIG. In this case, the same effect can be produced, and the stirring effect can be further enhanced.

  The present invention can be used in a technique for plating a plurality of plating objects collectively by using a relatively small article such as an electronic component as a plating object.

DESCRIPTION OF SYMBOLS 1,51 ... Plating apparatus 5,55 ... Plating solution 7,57 ... Anode electrode 9,59 ... Conductive film 9b ... Plane film part 10 ... Plating chamber 28,78 ... Cover sheet 37,83 ... Liquid flow generation part 53a ... Upper casing 59 ... conductive film 70 ... plating object containing cartridge 80 ... vibration generating part W ... plating object

Claims (6)

A plating chamber containing a plating solution;
An anode for supplying a current to be supplied to the plating liquid from the supply,
A plating object placement unit in which a plurality of plating object is placed a plating object functioning as a negative electrode,
Stirring means for moving the plating object placed on the plating object placing part in the stirring space and changing the posture ;
The plating object mounting portion is formed of a flexible conductive film,
The plating apparatus comprising: a liquid flow generating means that stirs the plating object by spraying or sucking the plating solution in the vicinity of the plating object as the stirring means . A cover sheet covering the plating object on the conductive film;
A stirring unit having the liquid flow generating means and a guide;
A moving guide for moving the stirring unit in parallel with the conductive film;
The guide is configured to guide the cover sheet so as to protrude in the direction away from the conductive film at the stirring unit portion,
A stirring space is formed below the cover sheet guided by the guide,
The plating apparatus according to claim 1 , wherein a plating space is formed in a portion other than the stirring unit below the cover sheet . On one outer side of the plating chamber, a supply roll unit set in a state where the conductive film is wound in a roll shape is provided,
On the other outer side of the plating chamber, a winding roll portion for winding the conductive film is provided,
The conductive film is supplied from the supply roll section into the plating chamber and plated, and when the plating process is completed, the used conductive film is wound up by the winding roll section. The plating apparatus according to claim 2 . The plating apparatus according to claim 3 , wherein the stirring unit includes a current prevention cover that is formed of a non-conductive material and covers the entire upper portion of the stirring space . Guides that hold down the upper surface of the conductive film so as not to float are provided near both ends of the conductive film in the supply direction, respectively.
The plating apparatus according to claim 3 or 4, further comprising : a liquid spraying unit that sprays and pushes back a plating solution onto an object to be plated that spreads at a position closest to the guide . A plating chamber containing a plating solution;
An anode for supplying a current to be supplied to the plating liquid from the supply,
A plating object mounting portion on which a plurality of plating objects to be plated functioning as a cathode are mounted ;
It is a plating method by a plating apparatus provided with stirring means for moving the plating object placed on the plating object placing part in the stirring space and changing the posture ,
The plating object mounting portion is formed of a flexible conductive film,
On one outer side of the plating chamber, a supply roll unit set in a state where the conductive film is wound in a roll shape is provided,
On the other outer side of the plating chamber, a winding roll portion for winding the conductive film is provided,
The plating method, wherein the conductive film is supplied from the supply roll section into the plating chamber and plated, and when the plating process is finished, the used conductive film is wound up by the winding roll section .

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