JP6373685B2 - Band saw - Google Patents

Description

  The present invention relates to a band saw used for cutting hard and brittle materials such as ceramic plates.

  As a method for processing a circular ceramic plate into an accurate circular shape of a required size, a processing method as shown in FIG. 6 has been conventionally used. Specifically, as shown in FIG. 6A, using an electrodeposition band saw (not shown), a plurality of portions on the outer periphery of a substantially circular ceramic plate 60 as a raw material are linearly formed along a tangential direction. After cutting, a rounded quadrangular ceramic plate 61 is formed, and the outer periphery of the ceramic plate 61 is similarly cut to form a polygonal ceramic plate 62 as shown in FIG. A circular ceramic plate 63 as shown in FIG. 6C is created by polishing the outer periphery of the ceramic plate 62.

  However, since the processing method shown in FIG. 6 requires a polishing process using a grindstone or the like in addition to a plurality of cutting processes using an electrodeposition band saw, it requires a great amount of processing time until the ceramic plate 63 is completed. .

  Therefore, the present inventor tried to process the ceramic plate 60 into a circular shape by using a conventional electrodeposition band saw and using a processing method as shown in FIG. 4 described later. That is, as shown in FIG. 4, while rotating the ceramic plate 60 around the center line 60c in the direction of the arrow R, the conventional electrodeposition band saw 70 (see FIG. 7) along the tangential direction with respect to the ceramic plate 60. ) To try to make a circular shape.

  On the other hand, as a prior art related to the present invention, for example, there is a band saw type cutting machine described in Patent Document 1. [FIG. 10] of Patent Document 1 describes a band saw type cutting machine in which blade portions are provided along both edges of an endless belt.

JP 2006-221958 A

  As shown in FIG. 7, while using a conventional electrodeposited band saw 70 in which an abrasive layer 72 is formed along one side edge 71a of an endless belt 71, the ceramic plate 60 is rotated in the direction of arrow R. In the case of circular machining, it cannot be avoided that the other side edge 71b of the endless belt 71 contacts the arcuate opening edge 60a formed in the ceramic plate 60 by the cutting action of the abrasive layer 72.

  When such a contact phenomenon occurs, a part of the endless belt 71 is welded to the ceramic plate 60, or the side edge 71b of the endless belt 71 is worn or cracked. Circular machining is extremely difficult and cannot be employed in actual manufacturing processes.

  On the other hand, since the band saw type cutting machine described in Patent Document 1 is a segment type metal bond type abrasive layer (blade part), this band saw type cutting machine is circularly processed into a ceramic plate 60 as shown in FIG. If used, the substrate portion (edge portion of the endless belt) between adjacent abrasive layers (blade portions) is welded, worn, or cracked, and cannot be used practically.

  Therefore, the problem to be solved by the present invention is to provide a band saw that can efficiently perform circular processing of a hard and brittle material such as a ceramic plate and is excellent in durability.

The band saw according to the present invention includes an endless belt formed by joining both ends of a band-shaped metal plate, and a main abrasive that is formed along one side edge of the endless belt and cuts a work material into a circular shape. A material layer, and a secondary abrasive layer that is formed along the other side edge and is in contact with an arc-shaped opening edge formed in the work material by the cutting action of the main abrasive layer, The thickness of the abrasive layer is not less than the thickness of the main abrasive layer. Here, the thicknesses of the main abrasive layer and the secondary abrasive layer refer to the dimensions of the primary abrasive layer and the secondary abrasive layer in the plate thickness direction of the endless belt.

  When the main abrasive layer side of the band saw of the present invention having such a configuration is brought into contact with the ceramic plate and circularly processed while rotating the ceramic plate in a certain direction, the cutting action of the main abrasive layer causes the ceramic plate to become a ceramic plate. Since the sub-abrasive material layer having a thickness equal to or larger than the thickness of the main abrasive material layer contacts the formed arc-shaped opening edge, the endless belt does not directly touch the opening edge, and the endless belt against the ceramic plate Can be avoided.

  Moreover, since the opening edge part of a ceramic plate is ground by the sub-abrasive material layer rotating with the main abrasive layer in the circumferential direction of the endless belt, it is possible to prevent the endless belt from being worn or cracked. For this reason, the band saw of this invention can perform circular processing of hard brittle materials, such as a ceramic plate, efficiently, and is excellent also in durability.

  Here, it is desirable that the grain size of the abrasive grains of the main abrasive layer is not more than the grain size of the abrasive grains of the sub-abrasive layer.

When the endless belt has a thickness of 0.3 mm to 0.8 mm,
The thickness of the main abrasive layer is +0.2 mm to +1.2 mm with respect to the thickness of the endless belt,
It is desirable that the thickness of the auxiliary abrasive layer is +0.24 mm to +1.8 mm with respect to the thickness of the endless belt.

  The thickness of the main abrasive layer is the thickness of the endless belt + less than 0.2 mm (less than 0.50 mm), or the thickness of the auxiliary abrasive layer is the thickness of the endless belt + less than 0.24 mm (less than 0.54 mm). In such a case, the rigidity of the circular processing of the ceramic plate, which will be described later, is insufficient, and the circular state cannot be maintained.

  In addition, the thickness of the main abrasive layer exceeds the thickness of the endless belt +1.2 mm (exceeds 2.00 mm), or the thickness of the auxiliary abrasive layer exceeds the thickness of the endless belt +1.8 mm (2. If it exceeds 50 mm), a high load is applied during circular processing, the circular state cannot be maintained, and kerf loss (removal allowance) also increases.

  Therefore, when the thickness of the endless belt is 0.3 mm to 0.8 mm, the above-described ranges are preferable for the thickness of the main abrasive layer and the thickness of the auxiliary abrasive layer.

  When the thickness of the endless belt is 0.3 mm, 0.5 mm, and 0.8 mm, the thickness of the main abrasive layer and the thickness of the auxiliary abrasive layer are set as shown in Table 1 below. can do.

  Furthermore, the grain size of the abrasive grains of the main abrasive layer can be set to # 40 to # 200, and the grain size of the abrasive grains of the auxiliary abrasive layer can be set to # 30 to # 170.

  Meanwhile, the main abrasive layer and the secondary abrasive layer can be formed by fixing diamond abrasive grains by metal plating.

  According to the present invention, a circular saw of a hard and brittle material such as a ceramic plate can be efficiently performed, and a band saw excellent in durability can be provided.

It is a perspective view which shows the band saw which is embodiment of this invention. It is an enlarged view of the area | region shown by the arrow A in FIG. It is sectional drawing in the BB line in FIG. It is a partially-omission perspective view which shows the cutting operation by the band saw shown in FIG. FIG. 2 is a partially omitted horizontal sectional view showing a cutting operation by the band saw shown in FIG. 1. It is process drawing which shows the conventional cutting operation. It is a horizontal sectional view showing a conventional cutting operation.

  Hereinafter, based on FIGS. 1-5, the band saw 100 which is embodiment of this invention is demonstrated. As shown in FIG. 1 to FIG. 3A, the band saw 100 of the present embodiment includes an endless belt 10 formed by joining both ends of a band-shaped metal plate with a welded portion 13, and one of the endless belts 10. The main abrasive layer 11 formed along the side edge portion 10a and the auxiliary abrasive layer 12 formed along the other side edge portion 10b, and the thickness 12t of the auxiliary abrasive layer 12 is the main abrasive material. The layer 11 is formed to have a thickness of 11t or more. The main abrasive layer 11 and the secondary abrasive layer 12 are each formed by fixing diamond abrasive grains by metal plating.

  In the band saw 100, the main abrasive material layer 11 and the secondary abrasive material layer 12 are continuously formed along the longitudinal direction of the side edge portions 10a and 10b (longitudinal direction of the endless belt 10). Therefore, disposing at least one of the main abrasive layer and the secondary abrasive layer discontinuously along the longitudinal direction of the side edge portion of the endless belt (for example, a plurality of abrasive layers occupying a certain area). Arranging at predetermined intervals along the longitudinal direction of the side edge, or arranging a plurality of abrasive layers having a shape of a part of a sphere at predetermined intervals along the longitudinal direction of the side edge, etc. ) Is also possible.

  The length of the band saw 100 in the circumferential direction is 4300 mm, the width is 10 mm, and the thickness of the endless belt 10 is 0.5 mm. Moreover, as shown to Fig.3 (a), the thickness 11t of the main abrasive material layer 11 is 1.06 mm, and the thickness 12t of the sub-abrasive material layer 12 is 1.18 mm. The grain size of the abrasive grains of the main abrasive layer 11 is # 80, and the grain size of the abrasive grains of the secondary abrasive layer 12 is # 60. However, it is not limited to these.

  In the band saw 100, the welded portion 13 is inclined with respect to the longitudinal direction of the endless belt 10. However, the present invention is not limited to this, and the welded portion 13 is perpendicular to the longitudinal direction (the endless belt 10 is Or a direction that crosses at a right angle).

  Next, circular processing of the ceramic plate 60 using the band saw 100 will be described with reference to FIGS. As shown in FIG. 4, the band saw 100 is stretched by two pulleys 21 and 22 and can be rotated in the arrow S direction by a predetermined power. A ceramic plate 60 as a work material is set on a rotary table (not shown), and can be rotated in the direction of arrow R around a center line 60c.

  Circular processing is performed by bringing the ceramic plate 60 into contact with the main abrasive layer 11 of the band saw 100 rotating in the arrow S direction while rotating in the arrow R direction. The tension value of the band saw 100 by the two pulleys 21 and 22 is 350 kg, the peripheral speed of the band saw 100 is 800 mm / min, and the feeding speed of the ceramic plate 60 is 7 mm / min.

  In the present embodiment, the ceramic plate 60 having a diameter of 320 mm and a thickness of 10 mm was circularly processed using the band saw 100 to create a ceramic plate 64 having a diameter of 300 mm and a thickness of 10 mm. However, the present invention is not limited to this.

  As shown in FIG. 4, when the ceramic plate 60 rotating in the arrow R direction is brought into contact with the main abrasive layer 11 side of the band saw 100 rotating in the arrow S direction, as shown in FIG. Since the sub-abrasive material layer 12 having a thickness of 11 t or more of the main abrasive material layer 11 is in contact with the arc-shaped opening edge 60b formed in the ceramic plate 60 by the cutting action of the main abrasive material layer 11, the endless The belt 10 does not directly touch the opening edge 60b, and the endless belt 10 is not welded to the ceramic plate 60.

  Moreover, since the opening edge part 60b of the ceramic plate 60 is ground by the sub-abrasive material layer 12 that rotates together with the main abrasive material layer 11 of the endless belt 10, it is possible to prevent the endless belt 10 from being worn or cracked. Can do. For this reason, the band saw 100 not only can efficiently perform circular processing of the ceramic plate 60 that is one of hard and brittle materials, but also has excellent durability.

  Next, band saws 101 and 102 according to other embodiments will be described with reference to FIGS.

  The thickness 11bt of the main abrasive layer 11b of the band saw 101 shown in FIG. 3B is 1.06 mm, the thickness 12bt of the secondary abrasive layer 12b is 1.18 mm, and the main abrasive layer 11b and the secondary abrasive layer. The grain size of the abrasive grains 12b is # 80, and the other parts are the same as those of the band saw 100.

  The thickness 11ct of the main abrasive layer 11c and the thickness 12ct of the auxiliary abrasive layer 12c of the band saw 102 shown in FIG. 3C are both 1.06 mm, and the abrasive grains of the main abrasive layer 11c and the auxiliary abrasive layer 12c are shown. The particle size of each is # 80, and the other parts are the same as those of the band saw 100.

  When the cutting performance of the band saw 101 shown in FIG. 3A and the band saw 101 shown in FIG. 3B is compared, the particle size of the secondary abrasive layer 12 of the band saw 100 is coarser than the particle size of the secondary abrasive layer 12b of the band saw 101. Accordingly, since the sharpness is good, the cutting performance of the band saw 100 tends to be higher than that of the band saw 101.

  Further, when the cutting performance of the band saw 102 shown in FIG. 3C is compared with that of the band saw 100 shown in FIG. 3A, the thickness 12t of the secondary abrasive layer 12 of the band saw 100 is the thickness of the secondary abrasive layer 12c of the band saw 102. Since it is larger than 12 ct and the chip discharge performance during processing is better, the band saw 100 tends to have higher cutting performance than the band saw 102.

  The band saws 100, 101, 102 described with reference to FIGS. 1 to 5 are examples of the present invention, and the band saw of the present invention is not limited to the band saws 100, 101, 102 described above.

  The band saw of the present invention can be widely used in an industrial field for cutting hard and brittle materials such as ceramic plates, for example, in the field of electrical / electronic equipment industry.

DESCRIPTION OF SYMBOLS 10 Endless belt 10a, 10b Side edge part 11, 11b, 11c Main abrasive layer 11t, 11bt, 11ct, 12t, 12bt, 12ct Thickness 12, 12b, 12c Sub abrasive layer 13 Welded part 21, 22 Pulley 60, 64 Ceramic Plate 60b Opening edge 100, 101, 102 Band saw

Claims (5)

An endless belt formed by joining both ends of a belt-shaped metal plate, a main abrasive layer formed along one side edge of the endless belt and cut into a circular shape to cut a workpiece , and the other A sub-abrasive material layer that is formed along the side edge portion and contacts the arc-shaped opening edge portion formed in the work material by the cutting action of the main abrasive material layer, and the thickness of the sub-abrasive material layer is A band saw having a thickness equal to or greater than the thickness of the main abrasive layer.   The band saw according to claim 1, wherein the grain size of the abrasive grains of the main abrasive layer is equal to or smaller than the grain size of the abrasive grains of the auxiliary abrasive layer. When the endless belt has a thickness of 0.3 mm to 0.8 mm,
The thickness of the main abrasive layer is +0.2 mm to +1.2 mm with respect to the thickness of the endless belt,
The band saw according to claim 1 or 2, wherein a thickness of the sub-abrasive material layer is +0.24 mm to +1.8 mm with respect to a thickness of the endless belt.   The band saw according to any one of claims 1 to 3, wherein the main abrasive layer has an abrasive grain size of # 40 to # 200, and the secondary abrasive layer has an abrasive grain size of # 30 to # 170.   The band saw according to any one of claims 1 to 4, wherein the main abrasive layer and the secondary abrasive layer are formed by fixing diamond abrasive grains by metal plating.

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