JP2003205471A - Blade for cutting hard and brittle material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To elongate the service life of a blade for cutting a hard and brittle material typified by a diamond electrodeposited blade. <P>SOLUTION: Super abrasive grain particles such as diamond grinding stones 6 and 7 are electrodeposited on both end faces of an endless belt like base metal 5. The service life of the one endless diamond electrodeposited blade 2 is elongated by inverting the electrodeposited blade when diamond grinding stones 6 of one side is spoiled and using the diamond grinding stones 7 of the other side. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hard and brittle material cutting blade for cutting hard and brittle materials, particularly semiconductor crystals such as gallium arsenide and silicon.

[0002]

2. Description of the Related Art Conventionally, in the semiconductor industry, a diamond electrodeposition blade has been used in a band saw type cutting machine for cutting a crystal (ingot) such as gallium arsenide or silicon.

An outline of this band saw type cutting machine is shown in FIG. The endless belt-shaped diamond electrodeposition blade 2 stretched between the pulleys 1a and 1b makes a circular motion in the direction of arrow A by the rotational drive of the pulley 1a, and also in the direction of the semiconductor crystal (ingot) 4 (direction of arrow B). The semiconductor crystal 4, which is a workpiece, is cut by moving the semiconductor crystal 4 in parallel with.

In the conventional diamond electrodeposition blade, as shown in FIGS. 4 and 5, the diamond grindstones 3 having the same height and width are arranged at regular intervals, and the endless belt-shaped base metal 5 is provided.
It is electrodeposited on one end face of the. As shown in FIG. 5, the diamond grindstone 3 is provided so as to partially cover both side surfaces of the belt-shaped base metal 5 from one end side of the belt-shaped base metal 5.

[0005]

However, as shown in FIG. 5, the diamond grindstone 3 of the conventional diamond electrodeposition blade 2 is cut at the end face and both side faces in the cutting proceeding direction (B direction) at the time of cutting. Since it is in contact with the work piece, the electrodeposited diamond is damaged quickly. That is, there is a problem that the life of the diamond electrodeposition blade is short.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to solve the above problems and prolong the life of a blade for cutting hard and brittle materials represented by a diamond electrodeposition blade.

[0007]

In order to achieve the above object, the present invention is configured as follows.

According to a first aspect of the present invention, there is provided a blade for cutting a hard and brittle material in which superabrasive grains are electrodeposited on one end surface of an endless belt-shaped base metal, wherein the endless belt-shaped base metal is superposed on the other end surface. It is characterized in that abrasive grains are electrodeposited.

According to a second aspect of the present invention, in the blade for cutting a hard and brittle material according to the first aspect, a diamond grindstone is electrodeposited as the superabrasive particles on the other end surface of the endless belt-shaped base metal. Is characterized by.

A third aspect of the present invention is a band saw type cutting machine for cutting semiconductor crystals of gallium arsenide, silicon or the like in the blade for cutting a hard and brittle material according to the first or second aspect.
It is characterized in that the endless belt-shaped base metal can be set by exchanging positions of one end surface and the other end surface.

<Operation> The hard and brittle material cutting blade of the present invention is one in which diamond grindstones having the same height, for example, are arranged as superabrasive particles on both end surfaces of an endless belt-shaped base metal. , Therefore, if there is a diamond grindstone on one end face, turn the electrodeposited blade upside down and use the end face on which the other diamond grindstone is electrodeposited, so that one endless diamond electrodeposited blade It is possible to extend the life of the.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below based on the illustrated embodiments.

An embodiment of the present invention is shown in FIGS.
FIG. 1 is a side view of a diamond electrodeposition blade according to this embodiment, and FIG. 2 is a sectional view of the diamond electrodeposition blade during cutting.

The diamond grindstone 6 is electrodeposited on one end surface (one end surface) 8 of the endless belt-shaped base metal 5 with the same height and width, and also on the other end surface (the other end surface) 9. The diamond grindstones 7 having the same height and width are electrodeposited at the same position.

Each diamond grindstone 6 or 7 is electrodeposited on the end face 8 or 9 of the belt-shaped base metal 5 so as to be distributed at intervals along the longitudinal direction, and a chip pocket is provided between the diamond grindstones 6 or 7. Intermittent portions that function as are provided so as to be formed at regular intervals. That is, as shown in FIG. 5, the diamond grindstones 6 and 7 are provided so as to partially cover both side surfaces of the belt-shaped base metal 5 from one end side of the belt-shaped base metal 5.

In this way, the diamond electrodeposited blades 6 and 7 having the same height and width are electrodeposited on both end surfaces of the diamond electrodeposited blade. And turn the working end side of the blade to
It can be used by replacing it with the diamond grindstone 7 side from the other side, whereby the life of the diamond electrodeposition blade can be improved without deteriorating the cutting speed and the cutting surface shape.

However, the present invention is not limited to the intervals of the chip pockets, and the intervals can be set arbitrarily, and the intervals can be eliminated if necessary.

A specific example will be described with reference to FIG.
Diamond whetstones 6 and 7 were electrodeposited on both end surfaces of the belt-shaped base metal 5 as follows. That is, the diamond grindstone 6 provided on one end face has a height of about 1.5 mm protruding from the belt-shaped base metal 5 and a width of about 0.9 mm. The diamond grindstone 7 provided on the other end face has a height of about 1.5 mm protruding from the belt-shaped base metal 5 and a width of about 0.9 mm.
mm.

A 6-inch gallium arsenide single crystal was cut using the diamond electrodeposited blades of the present invention having the above-mentioned structure and a conventional diamond electrodeposited blade. The cutting speed and the cutting surface at this time were the same for both blades.

As a result, by using the diamond electrodeposited blades of the present invention, the number of cuttings per diamond electrodeposited blade was increased from 350 to 600 without deteriorating the cutting speed and the cut surface. I was able to achieve it.

[0021]

As described above, according to the present invention, in a blade for cutting hard and brittle material in which superabrasive grains are electrodeposited on one end surface of an endless belt-shaped base metal, the endless belt-shaped base metal is used. Super-abrasive particles on the other end surface of, for example, a diamond grindstone is electrodeposited, and since diamond grindstones are provided on both end surfaces, if there is a diamond grindstone on one end surface, turn the electrodeposition blade upside down and It is possible to use the end surface where one diamond grindstone is electrodeposited, which makes it possible to extend the life of one endless diamond electrodeposition blade without deteriorating the cutting speed and the cutting surface shape. .

[Brief description of drawings]

FIG. 1 is a side view showing a part of a hard and brittle material cutting blade of the present invention.

FIG. 2 is a sectional view of the blade for cutting a hard and brittle material of the present invention during cutting.

FIG. 3 is a perspective view illustrating a configuration of a band saw type cutting machine.

FIG. 4 is a side view of a conventional blade for cutting hard and brittle materials.

FIG. 5 is a cross-sectional view of a conventional hard and brittle material cutting blade during cutting.

[Explanation of symbols]

2 Diamond electrodeposition blade 3 diamond whetstone 4 Crystal (work) 5 Belt-shaped base metal 6,7 Diamond whetstone 8 One end face (one end face) 9 The other end face (the other end face)

Claims (3)

[Claims] 1. A blade for cutting a hard and brittle material in which one end surface of an endless belt-shaped base metal is electrodeposited with superabrasive particles, wherein the other end surface of the endless belt-shaped base metal is charged with superabrasive particle particles. A blade for cutting hard and brittle materials characterized by being worn. 2. A blade for cutting a hard and brittle material according to claim 1, wherein, as the superabrasive grain particles, a diamond grindstone is electrodeposited on the other end surface of an endless belt-shaped base metal. A blade for cutting brittle materials. 3. A blade for cutting a hard and brittle material according to claim 1 or 2, wherein a band saw type cutting machine for cutting a semiconductor crystal such as gallium arsenide or silicon is provided with one end surface of the endless belt-shaped base metal and the other end. A blade for cutting a hard and brittle material, characterized in that the positions of the end faces of the blade can be set to be interchanged.