JPH11245169A - Cup type wheel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cup type wheel wherein good cutting performance and good cut powder discharging capability are provided even when used for the backside grinding of a fragile material such as a silicon wafer, no reduction occurs in discharging chip even if a super-abrasive grain layer is worn, and manufacturing is easy. SOLUTION: A cup type wheel includes a plurality of slits provided in the diameter direction of an annular super-abrasive grain layer 2. In this case, the slits are formed in the combination of large slits 3 reaching the inner side of a base metal 1 from the operation surface of the super-abrasive layer 2, and small slits 4 reaching the vicinity of a joined part with the base metal 1 of the super-abrasive grain layer 2 from the operation surface of the super- abrasive grain layer 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a cup-type wheel. More particularly, the present invention relates to a cup-type wheel for grinding, which is used for grinding a back surface of a brittle material such as a silicon wafer and has excellent sharpness and discharge of chips, has a long life, and is easy to manufacture.

[0002]

2. Description of the Related Art Conventionally, cup-type wheels for silicon grinding have various types of reducing the contact area of the superabrasive layer on the working surface with respect to an object to be ground in order to improve sharpness and dischargeability of cuttings. Ingenuity has been devised. For example, Japanese Unexamined Utility Model Publication No. 55-120264 discloses a resin in which a cutting edge portion is arranged in a spiral shape in a cup type wheel and silicon carbide is used as a filler between the cutting edges in order to prevent a siren sound during use. Cup-type wheels filled with substances have been proposed. Japanese Utility Model Application Laid-Open No. 57-63658 proposes a cup-type wheel in which cutting edges made of superabrasive grains are formed at predetermined intervals, and the contact area of the cutting edges with the workpiece is smaller than the space area of the interval. Have been. Japanese Patent Application Laid-Open No. 2-160475 discloses a cup-type wheel having a plurality of pipe-shaped grinding wheel tips protruding from an annular end of a wheel base and having a grinding fluid supply hole communicated with the pipe-shaped grinding wheel tip. Proposed. 7-3970
In the gazette, it is 0.1 to 0.5 mm in the circumferential direction of the disc-shaped base.
A cup-type wheel has been proposed in which grindstone pieces having the following blade thicknesses are arranged at a predetermined angle at an inclination angle of 20 to 80 degrees, and a gap between the grindstone pieces is filled with a reinforcing material to suppress chatter vibration. Further, Japanese Patent Application Laid-Open No. 61-270078 discloses that the cross-sectional shape is substantially V
There has been proposed a grinding wheel which forms a letter-shaped groove so that dressing can be performed during a grinding operation of a workpiece. Each of these cup type wheels has a small contact area of the superabrasive grain layer on the working surface with respect to the object to be ground, and the sharpness and the discharge of cutting chips have been improved in the grinding work, but the structure of each is complicated However, there is a problem that it takes a lot of time and effort to manufacture, and the cost is high, such as a special electroforming method or embedding a pipe-shaped chip. Also, even if a slit for discharging chips is provided in the superabrasive layer, the total cross-sectional area in the radial direction of the slit portion becomes smaller as the superabrasive layer wears as the grinding operation is continued, and There has been a problem that the dischargeability is reduced and clogging is likely to occur.

[0003]

DISCLOSURE OF THE INVENTION The present invention is used for grinding a back surface of a brittle material such as a silicon wafer, and has excellent sharpness and chip discharge property. An object of the present invention is to provide a cup-type wheel for grinding that is easy to manufacture without lowering the grindability.

[0004]

Means for Solving the Problems As a result of intensive studies to solve the above-mentioned problems, the present inventor has found that a slit for discharging cutting chips is provided not only in the superabrasive layer but also in the base metal. It has been found that, by adopting a deeply provided structure, good chip discharge performance can be maintained even when the superabrasive layer is worn, and the present invention has been completed based on this finding. That is, the present invention provides a cup-type wheel in which a plurality of slits are provided in a radial direction of an annular superabrasive layer, wherein the slits extend from the working surface of the superabrasive layer to the inside of the base metal. And a cup-type wheel comprising a combination of a small slit extending from the working surface of the superabrasive layer to the vicinity of the joint of the superabrasive layer with the base metal.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION A cup-type wheel according to the present invention is a cup-type wheel in which a plurality of slits are provided in a radial direction of an annular superabrasive layer, wherein the slits act as a superabrasive layer. It consists of a combination of a large slit extending from the surface to the inside of the base metal and a small slit extending from the working surface of the superabrasive layer to the vicinity of the joint of the superabrasive layer to the base. FIG.
1A is a bottom view of one embodiment of the cup-shaped wheel of the present invention, and FIG. 1B is a cross-sectional view taken along line AA of FIG.
(c) is a perspective view thereof. The cup-type wheel of the present embodiment has an annular superabrasive layer 2 on a base metal 1 and a plurality of slits provided at regular intervals in the radial direction of the superabrasive layer. The slit has a large slit 3 extending from the working surface of the superabrasive layer to the inside of the base metal, and a small slit 4 extending from the working surface of the superabrasive layer to the vicinity of the joint of the superabrasive layer with the base metal. Consist of combinations. In the cup-type wheel of the present invention,
There are no particular restrictions on the outer diameter of the base metal, the thickness of the superabrasive layer, the width, interval, inclination, etc. of the large and small slits, and they can be appropriately selected according to the intended use of the cup-type wheel. Usually, the outer diameter of the base metal is 200 to 350 mm, the thickness of the superabrasive layer is 2 to 7 mm, the number of all slits is 30 to 60, and one large slit is provided for 3 to 4 small slits. Is preferred. In the cup-shaped wheel of the present invention, the arrangement of the slits is not particularly limited, but is preferably provided at regular intervals.

[0006] In the cup-type wheel of the present invention, the slit width is not particularly limited, but is usually preferably 1 to 3 mm. The small slit extends from the working surface of the superabrasive layer to the vicinity of the joint between the superabrasive layer and the base metal. May be formed into independent chips separated by slits. There is no particular limitation on the depth of the large slit. For example, the depth of the portion inside the base metal of the large slit is set to 1
It can be 0 to 30 mm. In the cup-type wheel of the present invention, diamond abrasive grains or CBN abrasive grains can be used as the superabrasive grains constituting the superabrasive layer.
There is no particular limitation on the particle size of the superabrasive particles to be used. Depending on the purpose of use of the cup type wheel, coarse particles of about 400
A fine particle of about 10,000 can be appropriately selected.

When a grinding operation is performed using a cup-shaped wheel having a slit formed in a superabrasive layer, grinding fluid and cutting powder move through the slit. When the thickness of the superabrasive layer is reduced due to wear, the total cross-sectional area in the radial direction of the slit portion also decreases, and as the grinding fluid passes, the discharge of cutting chips becomes worse, clogging is likely to occur, and sharpness is reduced. drop down. Since the cup-shaped wheel of the present invention has a large slit and a small slit, it continues to be used, the superabrasive layer is worn, and even if the total cross-sectional area of the small slit portion in the radial direction becomes small, the grinding fluid and Since the swarf moves freely through the large slit, it does not cause clogging, maintains good sharpness until the superabrasive layer is completely worn, and has a long life. Since the cup-shaped wheel of the present invention has a simple shape, the annular superabrasive layer and the base metal are
Large slits and small slits can be easily machined by electric discharge machining, machining and the like. The cup-shaped wheel of the present invention can be particularly suitably used for grinding a back surface of a brittle material such as a silicon wafer.

[0008]

EXAMPLES The present invention will be described in more detail with reference to the following Examples, which should not be construed as limiting the present invention. Example 1 An outer diameter of 250 mm and an inner diameter of a mounting portion of the shape shown in FIG.
86mm, 21mm in thickness, 170mm hole diameter of the base metal of 5000 series aluminum alloy electrodeposited with diamond abrasive grains of 4000 grain size with nickel on the working surface of rim, 2.0m in rim width
A diamond abrasive layer having a thickness of 3.5 mm and a thickness of 3.5 mm was formed. A large slit and a small slit having the shape shown in FIG. 1 were formed in the diamond abrasive layer and the base metal by electric discharge machining. The slit width of both large and small slits is 2.0mm,
The depth of the large slit inside the base metal was 20.0 mm, and the depth of the small slit was 3.0 mm. The number of large slits was 10, the number of small slits was 30, and one large slit and three small slits were repeatedly arranged. Through-feed grinding of silicon for a semiconductor substrate was performed using this cup-type wheel. Grinding could be performed without any trouble until the cutting powder was discharged well, the sharpness was excellent, and the thickness of the superabrasive layer was reduced to 0.6 mm.

[0009]

The cup-type wheel of the present invention has a large slit extending from the working surface of the superabrasive grain layer to the inside of the base metal. Even if the small slit reaching the vicinity of the joint of the abrasive layer and the base metal becomes small, the grinding fluid moves through the large slit and the cutting powder can be discharged, so it maintains excellent sharpness, It has a long life.

[Brief description of the drawings]

FIG. 1 is a bottom view, a sectional view, and a perspective view of one embodiment of a cup-type wheel of the present invention.

[Explanation of symbols]

 1 base metal 2 super abrasive layer 3 large slit 4 small slit

Claims (1)

[Claims] 1. A cup-type wheel having a plurality of slits provided in a radial direction of an annular superabrasive layer, wherein the slits extend from the working surface of the superabrasive layer to the inside of the base metal, A cup-type wheel comprising a combination of small slits extending from the working surface of the superabrasive layer to the vicinity of the joint between the superabrasive layer and the base metal.