JP6368136B2 - Positioning device and semiconductor inspection device - Google Patents

Description

  The present invention relates to a positioning device and a semiconductor inspection device.

  Japanese Patent Application Laid-Open No. 2004-228561 describes a micro article transport apparatus that can accurately transport a micro article placed on a support surface. The minute article transport apparatus includes a fixed portion, a support surface for placing the minute article, a transport substrate connected to the fixed portion via the vibration element in a plurality of axial directions, and a predetermined amount for each vibration element. It has a transfer processing means for applying a voltage and transferring a micro article, and a monitoring device for monitoring the micro article on the transfer substrate in an enlarged state.

JP 2007-55772 A

An object of the present invention is to provide a positioning apparatus and a semiconductor inspection apparatus that can position an electronic component without damaging it.

A positioning device according to the first invention that meets the above-described object includes a transport unit that transports an electronic component, a positioning table on which the electronic component transported by the transport unit is fitted, and a recessed portion that is open on the upper side is formed. comprises a pre-Symbol position excitation to oscillate the-decided Me stand vertically portion, the vibrating portion, and the ultrasonic vibrator for generating ultrasonic vibration, the ultrasonic vibration transmitted the positioning base And the shape of the recessed portion is a quadrangular pyramid shape in which the area of the upper base is larger than the area of the lower base, and the size of the recessed portion when viewed in plan is The size is set to be larger by a predetermined allowable error than the size of the electronic component .

The positioning device according to the first invention, the transport unit, adsorbs the upper surface of the electronic component, have a suction collet to move in the vertical direction, the depth of the recess is, than the height of the electronic component It may be shallow .

The positioning device according to the first invention, the transport unit has a suction collet for adsorbing upper surface of the electronic component, prior SL-position-decided Me table is moved in the vertical direction, the depth of the recess portion, It may be shallower than the height of the electronic component .

In the positioning device according to the first aspect of the present invention, it is preferable that the excitation unit can excite the positioning table with an amplitude of 10 μm or less .

In the positioning device according to the first aspect of the present invention, it is preferable that a screw part is formed on the positioning table, and the screwing part is screwed into the ultrasonic horn so that the positioning table is attached to the ultrasonic horn .

The positioning device according to the second aspect of the present invention is provided with a conveying unit that conveys an electronic component, and an abutting unit that determines a position of the electronic component that the electronic component conveyed by the conveying unit abuts. A positioning table, a vibration unit that vibrates the positioning table in a vertical direction, and a direction in which the electronic component moves toward the abutting unit when the positioning table is vibrated by the vibration unit. A drive unit that tilts the positioning table, and the vibration unit generates an ultrasonic vibration, an ultrasonic horn that transmits the ultrasonic vibration, and the positioning table is attached thereto, Have

According to a third aspect of the present invention, there is provided a semiconductor inspection apparatus according to a third aspect of the present invention , comprising: an index table having a plurality of suction collets that are arranged along the circumferential direction by sucking the upper surface of each electronic component; Positioning table in which an indented part having an electronic part fitted therein is formed, a vibration part for vibrating the positioning table in the vertical direction, and the electronic part adsorbed by the suction collet and taken out from the indented part A monitoring unit for monitoring that the position of the position is within a predetermined range, wherein the excitation unit transmits the ultrasonic vibration, and the positioning unit transmits the ultrasonic vibration. An ultrasonic horn to which a base is attached, and the shape of the indented part is a quadrangular pyramid shape in which the area of the upper base is larger than the area of the lower base, and the concave part when viewed in plan The size of the parts have been larger by setting predetermined tolerance amount than the size of the electronic component.

According to a fourth aspect of the present invention, there is provided a semiconductor inspection apparatus according to a fourth aspect of the present invention , comprising: an index table having a plurality of suction collets that are attracted to the upper surface of each electronic component and arranged in a circumferential direction; A positioning table provided with an abutting part for determining the position of the electronic component against the electronic component, an excitation unit for exciting the positioning table in the vertical direction, and the positioning unit added by the excitation unit The position of the electronic component that is picked up by the suction collet and taken out from the positioning table in advance is tilted in the direction in which the electronic component moves toward the abutting portion when being shaken. A monitoring unit for monitoring that the vibration is within a predetermined range, the excitation unit including an ultrasonic transducer that generates ultrasonic vibrations, and the ultrasonic vibrations Reached, having an ultrasonic horn wherein the positioning base is mounted.

ADVANTAGE OF THE INVENTION According to this invention, the positioning device and semiconductor inspection apparatus which can be positioned so that an electronic component may not be damaged can be provided.

It is explanatory drawing of the semiconductor inspection apparatus which concerns on the 1st Embodiment of this invention. It is a side view of the positioning stand and vibration part with which the same semiconductor inspection apparatus is provided. It is a side view which shows the modification of the positioning stand with which the semiconductor inspection apparatus is provided, and a vibration part. (A) and (B) are respectively a plan view and a side sectional view of a positioning table provided in the semiconductor inspection apparatus. It is explanatory drawing which shows operation | movement of the same semiconductor inspection apparatus. It is explanatory drawing of the positioning stand of the semiconductor inspection apparatus which concerns on the 2nd Embodiment of this invention, Comprising: (A) is explanatory drawing which shows the state before positioning, (B) is explanatory drawing which shows the state after positioning. is there.

  Next, embodiments of the present invention will be described with reference to the accompanying drawings for understanding of the present invention. It should be noted that in the drawing, illustration of parts not related to the description may be omitted.

[First Embodiment]
As shown in FIG. 1, the semiconductor inspection apparatus 10 according to the first embodiment of the present invention sequentially conveys rectangular parallelepiped electronic components (an example of an article) EP such as a chip resistor and a chip capacitor, and determines them in advance. Inspection can be performed. Note that the sizes of these electronic components EP are, for example, 0403 size and 0603 size.

The semiconductor inspection apparatus 10 includes an index table 12, a positioning table 14, a vibration unit 16, a camera CAM, and a control unit 18.
The index table (an example of a transport unit) 12 includes a table unit 122 and a suction collet 124.

The table portion 122 is a disk that rotates about a central axis AX that extends in the vertical direction (see the arrow shown in FIG. 1).
A plurality of suction collets 124 are arranged at intervals along the outer peripheral portion of the table portion 122. The suction collet 124 can suck and hold the upper surface of the electronic component EP. The suction collet 124 is driven by a motor or an air cylinder (not shown) and can move in the vertical direction.
Accordingly, the electronic component EP is sucked by the suction collet 124 and is sequentially transported along the circumferential direction of the table portion 122 as the index table 12 rotates.

  The positioning table (an example of the first positioning table) 14 is disposed below the suction collet 124. As shown in FIG. 2A, the positioning table 14 is fixed to the vibration unit 16, and is excited by ultrasonic vibration.

As shown in FIGS. 3 (A) and 3 (B), a recess portion HL having an upper opening is formed on the upper surface of the positioning table 14. The shape of the recessed portion HL is, for example, a quadrangular frustum shape in which the area of the upper base is larger than the area of the lower base, and the depth Ld of the recessed portion HL is shallower than the height Lh of the electronic component EP. Yes. The electronic component EP conveyed by the index table 12 is fitted into the recess HL. The size of the indented portion HL (the size in plan view) is set larger than the size of the electronic component EP by a predetermined allowable error, and the electronic component EP fitted in the indented portion HL is determined in advance. Positioned within the allowable error range.
In addition, corresponding to the shape of the target electronic component EP, a positioning table having a different recessed portion shape is prepared. That is, it is possible to deal with a wide variety of electronic parts EP simply by exchanging the positioning table.
As shown in FIG. 3B, a male screw part 142 is formed at the lower part of the positioning table 14.

  The vibration unit 16 (see FIG. 2A) can vibrate the positioning table 14 by ultrasonic vibration having an amplitude of 1 μm or less, for example. The vibration unit 16 includes an ultrasonic transducer 162 and an ultrasonic horn 164. In addition, in FIG. 2A, the part represented by hatching has shown the cross section.

The ultrasonic transducer 162 can vibrate in the vertical direction and generate ultrasonic vibration in the vertical direction.
The ultrasonic horn 164 is provided on the upper side of the ultrasonic transducer 162. The ultrasonic horn 164 is a resonator that transmits the ultrasonic vibration generated by the ultrasonic vibrator 162. The ultrasonic horn 164 extends in the vertical direction. A positioning table 14 is attached to the upper side of the ultrasonic horn 164. The positioning table 14 is fixed by screwing a male screw part (an example of a screw part) 142 (see FIG. 3B) into a female screw part formed on the upper surface of the ultrasonic horn 164. Therefore, the ultrasonic vibration of the ultrasonic horn 164 is reliably transmitted to the positioning table 14.

  The semiconductor inspection apparatus 10 may include a vibration unit 16a illustrated in FIG. 2B instead of the vibration unit 16 illustrated in FIG. 2A. The vibration unit 16a includes an ultrasonic vibrator 162 that vibrates in the horizontal direction (left-right direction) and an ultrasonic horn 164a that extends in the horizontal direction. The positioning table 14 is fixed to the upper side of the distal end portion of the vibration portion 16a by a male screw portion 142 (see FIG. 3B) and is vibrated in the horizontal direction. Here, the horizontal direction is not horizontal in a strict sense. That is, “horizontal” means that a manufacturing error is allowed in design and “substantially horizontal” (the same applies hereinafter). Specifically, for example, the vibration direction and the horizontal plane may intersect within a range of −10 degrees to +10 degrees.

The camera CAM (see FIG. 1) is disposed downstream of the positioning table 14 in the transport direction of the index table 12 and below the suction collet 124. The camera CAM can take an image of the electronic component EP sucked by the suction collet 124. The camera CAM is connected to the control unit 18 shown in FIG. The imaged electronic component EP is monitored by an image processing unit (not shown) provided in the control unit 18 to be in a predetermined position range.
The camera CAM and the image processing unit constitute at least an example of a monitoring unit.

The control unit 18 has a power supply device. When the power supply device outputs a voltage or current to the ultrasonic transducer 162, the control unit 18 determines the amplitude of the vibration generated by the ultrasonic transducer 162, that is, the amplitude of the vibration of the positioning table 14. Can be controlled.
The control unit 18 is provided with a setting unit (not shown). The user can set the magnitude of the amplitude of the positioning table 14 for each unit of several μm or less (for example, every 0.1 μm) via this setting unit. Further, the user can set the time for driving the ultrasonic transducer 162 (time for vibrating the positioning table 14) every several ms (for example, every 1 ms) via the setting unit.

Next, the operation of the semiconductor inspection apparatus 10 will be described.
(Step S1)
The electronic component EP is delivered from outside the semiconductor inspection apparatus 10. The delivered electronic components EP are sucked by the suction collet 124 and then sequentially conveyed along with the rotation of the index table 12. When the suction collet 124 that sucks the electronic component EP reaches above the positioning table 14, the operation of the index table 12 stops (see FIG. 4A).

(Step S2)
The suction collet 124 that reaches above the positioning table 14 is lowered. As shown in FIG. 4B, the electronic component EP approaches the indented portion HL (see FIG. 3) formed in the positioning table 14.

(Step S3)
When the lowered suction collet 124 stops the suction operation (OFF), the held electronic component EP naturally falls. At that time, the electronic component EP naturally falls more reliably by breaking the vacuum. A part of the electronic component EP that naturally falls falls into the indentation HL.

(Step S4)
The electronic component EP partially falling into the indented portion HL is vibrated by, for example, 5 to 50 msec by ultrasonic vibration having an amplitude of 1 μm or less by the vibration unit 16. The entire electronic component EP that has been vibrated fits into the recessed portion HL and is positioned (see FIG. 4C).
Note that the amplitude of vibration applied to the electronic component EP may be, for example, 10 μm or less.

(Step S5)
When the vibration operation is stopped (OFF), the suction collet 124 starts suction (ON). The electronic component EP positioned by being fitted in the recess HL is adsorbed by the adsorbing collet 124 (see FIG. 4D).

(Step S6)
When the suction collet 124 that sucks the electronic component EP rises, the index table 12 rotates (see FIG. 4E), and the electronic component EP is transported to the next process (monitoring process).

(Step S7)
In the monitoring process, the camera CAM shown in FIG. 1 images the electronic component EP sucked by the suction collet 124 from below. The imaging data of the electronic component EP is transmitted to an image processing unit (not shown) provided in the control unit 18. The image processing unit confirms that the position of the electronic component EP is within a predetermined allowable error range based on the imaging data. If the position of the electronic component EP is not within the allowable error range, the electronic component EP is transported to a predetermined location in a later process. When the position of the electronic component EP is not within the allowable error range, the operation of the semiconductor inspection apparatus 10 may be stopped.

As described above, in the semiconductor inspection apparatus 10 according to the first embodiment, since the amplitude of the vibration to be excited is very small, the possibility that the electronic component EP is damaged is reduced. In addition, since the electronic component EP only needs to fit into the recessed portion HL (see FIG. 3), the electronic component EP is positioned in a short time.
In the semiconductor inspection apparatus 10, the suction collet 124 moves up and down and the electronic component EP is transferred to the positioning table 14. However, the positioning table 14 moves up and down and the electronic component EP is transferred. Also good.

  The index table 12, the positioning table 14, and the vibration unit 16 described above can be regarded as an example of a positioning device. Since such a positioning device has a small amplitude of vibration to be vibrated, even a fragile article such as an electronic component can be positioned in a short time.

[Second Embodiment]
Subsequently, a semiconductor inspection apparatus according to a second embodiment of the present invention will be described. The same components as those in the semiconductor inspection apparatus 10 according to the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
A semiconductor inspection apparatus according to the second embodiment of the present invention includes a positioning table 54 (an example of a second positioning table) shown in FIG. 5 instead of the positioning table 14 (see FIG. 2A), and a drive unit (not shown). ).

The positioning table 54 is provided with an abutting portion 542. The butting portion 542 is formed with a first butting surface 542a and a second butting surface 542b.
The abutting portion 542 can position the electronic component EP at a predetermined location by abutting the electronic component EP.

  The abutting part 542 may be recessed like a recessed part HL (see FIG. 3) with respect to the upper surface of the positioning table 54. The abutting portion 542 may be formed so as to protrude from the upper surface of the positioning table 54. That is, it is only necessary to form the first butting surface 542a and the second butting surface 542b against which the electronic component EP is abutted.

  The drive unit (not shown) includes, for example, a motor and a piezoelectric element, and the positioning table 54 can be tilted. When the positioning table 54 is vibrated by the driving unit, the two adjacent side surfaces of the electronic component EP move toward the first butting surface 542a and the second butting surface 542b, respectively. Tilt in the direction you want.

The operation of the semiconductor inspection apparatus according to the present embodiment differs from that of the semiconductor inspection apparatus 10 according to the first embodiment in steps S3 and S4. Hereinafter, steps (step S3a and step S4a) different from these steps S3 and S4 will be described.
(Step S3a)
The drive unit tilts the positioning table 54.
When the lowered suction collet 124 stops the suction operation (OFF), the held electronic component EP naturally falls. The electronic component EP that has dropped naturally is placed on the surface of the positioning table 54 (see FIG. 5A). In addition, after the natural fall, at least a part of the side surface of the electronic component EP may hit the butting portion 542.

(Step S4a)
The electronic component EP placed on the surface of the positioning table 54 is vibrated, for example, by 5 to 50 msec by ultrasonic vibration having an amplitude of 1 μm or less by the vibration unit 16. The excited electronic component EP is positioned with two adjacent side surfaces abutting against the first butting surface 542a and the second butting surface 542b (see FIG. 5B).
Note that the amplitude of vibration applied to the electronic component EP may be, for example, 10 μm or less.
After the electronic component EP is positioned, the drive unit returns the tilted positioning table 54 to the original position.

  Thus, in the semiconductor inspection apparatus according to the second embodiment, the electronic component EP is positioned by abutting against the abutting portion 542. Therefore, even if the size of the electronic component EP changes, the electronic components EP of a plurality of sizes are positioned without exchanging the positioning table 54.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and all changes in conditions and the like that do not depart from the gist are within the scope of the present invention.
The shape of the recessed portion formed in the positioning table is not limited to a quadrangular pyramid shape in which the area of the upper base is larger than the area of the lower base.
Further, the object to be positioned by the positioning device is not limited to the electronic component.
Furthermore, the vibration generated by the excitation unit is not limited to ultrasonic vibration, and may be vibration having a lower frequency.

10: Semiconductor inspection device, 12: Index table, 14: Positioning table, 142: Male screw unit, 16: Excitation unit, 18: Control unit, 54: Positioning table, 122: Table unit, 124: Suction collet, 162: Super Sonic vibrator, 164: ultrasonic horn, 542: abutting portion, 542a: first abutting surface, 542b: second abutting surface, CAM: camera, EP: electronic component, HL: recessed portion

Claims (8)

A transport unit for transporting electronic components;
A positioning table on which the electronic component conveyed by the conveyance unit is fitted, and a hollow part having an open upper side is formed,
Comprising a vibration unit that vibrates the previous SL-position-decided Me stand vertically, and
The excitation unit includes an ultrasonic transducer that generates ultrasonic vibrations, and an ultrasonic horn that transmits the ultrasonic vibrations and to which the positioning table is attached;
The shape of the indented part is a quadrangular pyramid shape in which the area of the upper base is larger than the area of the lower base, and the size of the indented part in plan view is determined in advance than the size of the electronic component Positioning device that is set larger by the allowable error . The positioning device according to claim 1 ,
The transport unit, adsorbs the upper surface of the electronic component, have a suction collet to move in the vertical direction,
A positioning device in which a depth of the indentation is shallower than a height of the electronic component . The positioning device according to claim 1 ,
The transport unit has a suction collet that sucks the upper surface of the electronic component;
Before Symbol position-decided Me table is moved in the vertical direction,
A positioning device in which a depth of the indentation is shallower than a height of the electronic component . The positioning device according to claim 2 or 3 ,
The vibration unit is pre Symbol position-decided Me stand positioning device capable vibrated at the following amplitude 10μm to. The positioning device according to claim 4, wherein
A positioning device in which a screw part is formed on the positioning table, and the screwing part is screwed into the ultrasonic horn so that the positioning table is attached to the ultrasonic horn. A transport unit for transporting electronic components;
A positioning table provided with an abutting portion for abutting the electronic component conveyed by the conveying unit and determining a position of the electronic component ;
And a vibration unit that vibrated the previous Symbol position-decided Me stand in the vertical direction,
A drive unit that tilts the positioning table in a direction in which the electronic component moves toward the abutting unit when the positioning table is vibrated by the vibration unit ;
An ultrasonic vibrator that generates ultrasonic vibration;
An ultrasonic horn that transmits the ultrasonic vibration and to which the positioning table is attached . An index table having a plurality of suction collets, each of which sucks the upper surface of the electronic component and is arranged along the circumferential direction;
A positioning table on which the electronic component conveyed by the suction collet fits, and a recess is formed on the upper side;
An excitation unit that vibrates the positioning table in the vertical direction ;
A monitoring unit for monitoring that the position of the electronic component sucked by the suction collet and taken out from the indented part is within a predetermined range ;
The excitation unit includes an ultrasonic transducer that generates ultrasonic vibrations, and an ultrasonic horn that transmits the ultrasonic vibrations and to which the positioning table is attached;
The shape of the indented part is a quadrangular pyramid shape in which the area of the upper base is larger than the area of the lower base, and the size of the indented part in plan view is determined in advance than the size of the electronic component A semiconductor inspection system that is set larger than the allowable error . An index table having a plurality of suction collets, each of which sucks the upper surface of the electronic component and is arranged along the circumferential direction;
A positioning table provided with an abutting portion for abutting the electronic component conveyed by the suction collet and determining the position of the electronic component;
An excitation unit for exciting the positioning table in the vertical direction;
A drive unit that tilts the positioning table in a direction in which the electronic component moves toward the abutting unit when the positioning table is vibrated by the vibration unit;
A monitoring unit for monitoring that the position of the electronic component sucked by the suction collet and taken out from the positioning table is within a predetermined range;
An ultrasonic vibrator that generates ultrasonic vibration;
A semiconductor inspection apparatus comprising: an ultrasonic horn that transmits the ultrasonic vibration and to which the positioning table is attached.