JP6361352B2 - Polyamide elastomer composition and molded body using the same - Google Patents

Description

  The present invention relates to a polyamide elastomer composition excellent in flexibility, thermal conductivity, and sealing performance, and a molded body using the same.

In recent years, in various electronic members, the amount of heat generation tends to increase due to the improvement in processing speed and mounting density of integrated circuits. For this reason, measures for heat dissipation are required for various electronic members.
Conventionally, in order to improve the heat dissipation of an electronic material, for example, silica, graphite, or the like is added to a resin constituting the electronic material to impart heat dissipation (Patent Documents 1, 2, and 3). However, these additives cannot meet various requirements because the balance between thermal conductivity and flexibility becomes very difficult.
Therefore, as a material excellent in flexibility and thermal conductivity, a styrene-based elastomer and / or a hydrogenated product thereof, a hydrocarbon-based rubber softener, and a resin composition of a thermally conductive material have been studied (Patent Document 4). ). Further, a resin composition comprising a polyester elastomer and a styrene elastomer and comprising an inorganic filler such as boron nitride and a hydrocarbon rubber softener has been studied (Patent Document 5).

JP 2006-193626 A JP 2007-31611 A Japanese Patent Laid-Open No. 4-164953 JP 2001-106865 A JP 2013-53211 A

  However, the resin compositions described in Patent Documents 4 and 5 have problems such as anxiety of dimensional stability due to a change with time, and a required characteristic required in recent years that the sealing performance under low temperature and low pressure conditions cannot be satisfied.

  The present invention has been made in view of the above problems, and has a polyamide elastomer composition excellent not only in flexibility and thermal conductivity but also in sealing performance, and a molded body using the same. The purpose is to provide.

  As a result of intensive studies to achieve the above object, the present inventors are excellent in flexibility and thermal conductivity by including an inorganic filler, a silane coupling agent, and a polyamide elastomer. Moreover, it discovered that the polyamide elastomer composition excellent also in sealing performance and a molded object using the same were obtained, and it came to this invention.

  That is, the present invention relates to a polyamide elastomer composition containing an inorganic filler, a silane coupling agent, and a polyamide elastomer, wherein the inorganic elastomer is contained in an amount of 10 to 80% by weight. .

  The present invention also relates to a laminate characterized in that the polyamide elastomer composition is bonded to a thermosetting resin.

  Furthermore, this invention relates to the sealing material characterized by including the said polyamide elastomer composition, an adhesive agent, an electronic component, and a heat radiating member.

  As described above, according to the present invention, it is possible to provide a polyamide elastomer composition not only excellent in flexibility and thermal conductivity but also excellent in sealing performance, and a molded body using the same. .

(Polyamide elastomer)
As the polyamide elastomer used in the polyamide elastomer composition according to the present invention, a polyamide elastomer having a polyamide unit as a hard segment and a polyether unit as a soft segment is preferably used. Examples include ether ester amide elastomers and polyether amide elastomers in which hard segments and soft segments are connected by amide bonds.

  The hard segment is a segment obtained by reacting a polyamide-forming unit with at least one dicarboxylic acid selected from aliphatic dicarboxylic acid, alicyclic dicarboxylic acid and aromatic dicarboxylic acid.

  The polyamide-forming unit of the hard segment is a unit consisting of a lactam, an aminocarboxylic acid and / or a nylon salt consisting of a diamine and a dicarboxylic acid, a nylon salt consisting of a diamine and a dicarboxylic acid, a lactam, an aminocarboxylic acid and a dicarboxylic acid A unit obtained by reacting 1 type or 2 types or more.

Examples of the lactam include aliphatic lactams having 5 to 20 carbon atoms such as ε-caprolactam, ω-enantolactam, ω-undecalactam, ω-lauryllactam, 2-pyrrolidone and the like.
Examples of the aminocarboxylic acid include aliphatic groups having 5 to 20 carbon atoms such as 6-aminocaproic acid, 7-aminoheptanoic acid, 8-aminooctanoic acid, 10-aminocapric acid, 11-aminoundecanoic acid, 12-aminododecanoic acid. and ω-aminocarboxylic acid.
Diamines used in nylon salts consisting of diamine and dicarboxylic acid include ethylenediamine, trimethylenediamine, tetramethylenediamine, hexamethylenediamine, heptamethylenediamine, octamethylenediamine, nonamethylenediamine, decamethylenediamine, undecamethylenediamine. And diamine compounds such as aliphatic diamines having 2 to 20 carbon atoms such as dodecamethylenediamine, 2,2,4-trimethylhexamethylenediamine, 2,4,4-trimethylhexamethylenediamine, and 3-methylpentamethylenediamine. Examples of dicarboxylic acids include aliphatic dicarboxylic acids having 2 to 20 carbon atoms such as oxalic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, and dodecanedioic acid. It includes dicarboxylic acid compounds such as.
Among these, ω-lauryl lactam, 11-aminoundecanoic acid or 12-aminododecanoic acid is preferable from the viewpoints of dimensional stability due to low water absorption, chemical resistance, and mechanical properties.

The hard segment dicarboxylic acid can be used as a molecular weight modifier. Specific examples of the dicarboxylic acid include linear aliphatic dicarboxylic acids having 2 to 25 carbon atoms such as oxalic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, and dodecanedioic acid. Or aliphatic dicarboxylic acids such as dimerized aliphatic dicarboxylic acids having 14 to 48 carbon atoms (dimer acid) obtained by dimerizing unsaturated fatty acids obtained by fractional distillation of triglycerides and hydrogenated products thereof (hydrogenated dimer acid) Mention may be made of acids, alicyclic dicarboxylic acids such as 1,4-cyclohexanedicarboxylic acid, and aromatic dicarboxylic acids such as terephthalic acid and isophthalic acid. As the dimer acid and hydrogenated dimer acid, trade names “Pripol 1004”, “Plipol 1006”, “Plipol 1009”, “Plipol 1013” and the like manufactured by Unikema Corporation can be used.
A polyamide having carboxyl groups at both ends can be obtained by ring-opening polymerization or polycondensation of the polyamide-forming units in the presence of the dicarboxylic acid by a conventional method.

  The number average molecular weight of the hard segment is preferably 300 to 15000, and more preferably 300 to 6000 from the viewpoints of flexibility and moldability.

  On the other hand, the soft segment is preferably a polyether, and examples thereof include polyethylene glycol, polypropylene glycol, polytetramethylene ether glycol, ABA type triblock polyether represented by the following formula (1), and the like alone or 2 More than seeds can be used. Moreover, polyether diamine etc. which are obtained by making animonia etc. react with the terminal of polyether can be used. The number average molecular weight of the soft segment is preferably 200 to 6000, and more preferably 650 to 2000.

(In the formula, x represents 1 to 20, y represents 4 to 50, and z represents 1 to 20.)

  In the above formula (1), x and z are each an integer of 1 to 20, preferably an integer of 1 to 18, more preferably an integer of 1 to 16, particularly preferably an integer of 1 to 14, An integer of 12 is most preferred. Moreover, although y is an integer of 4-50, the integer of 5-45 is preferable, the integer of 6-40 is more preferable, the integer of 7-35 is especially preferable, and the integer of 8-30 is the most preferable.

  Examples of the combination of the hard segment and the soft segment include the combinations of the hard segment and the soft segment mentioned above. Among these, lauryl lactam ring-opening polycondensate / polyethylene glycol combination, lauryl lactam ring-opening polycondensate / polypropylene glycol combination, lauryl lactam ring-opening polycondensate / polytetramethylene ether glycol combination, lauryl lactam The ring-opening polycondensate / ABA type triblock polyether combination is preferred, and the lauryl lactam ring-opening polycondensate / ABA type triblock polyether combination is particularly preferred.

  The ratio (weight ratio) between the hard segment and the soft segment is preferably hard segment / soft segment = 95/5 to 20/80, and more preferably 60/40 to 30/70. The ratio is particularly preferably 50/50 to 30/70. If the hard segment is less than 20% by weight, bleed out is likely to occur from the molded body and the product may not be formed. If it exceeds 95% by weight, flexibility tends to be insufficient.

  The polyamide elastomers as described above are commercially available from Daicel Evonik: Daiamide, ARKEMA: Pebax, Emschemy Japan: Grillamide, Riken Technos: Hyper Alloy Actima, Mitsubishi Engineering Plastics: Novamit, Ube Industries, Ltd .: UBESTA XPA series and the like.

  Among them, “UBESTA XPA 9040X1, 9040F1, 9048X1, 9048F1, 9055X1, 9055X1, 9055F1, 9063X1, 9063F1, 9068X1, 9068F1, 9040X2, 9048X2, 9040F2, and 9048F2” A polyetheramide elastomer such as Ube Industries, Ltd. can be preferably used.

(Inorganic filler)
The polyamide elastomer composition according to the present invention contains an inorganic filler for improving thermal conductivity. As the inorganic filler, conductive filler {metal (silver, copper, nickel, stainless steel fiber, etc.), oxide (ZnO, ITO, ATO, etc.), nitride (Si ₃ N ₄ , Li ₃ N ₄ etc.) , carbide (SiC, CaC _2, etc.), boride based (FeB, MgB _2, etc.), carbon-based}, magnetic fillers (ferrite, Sm / Co, Nd / Fe / B , etc.), a piezoelectric filler, thermally conductive Filler (Ag, h-BN, AlN, Al ₂ O ₃ ), reinforcing filler (glass fiber, carbon fiber, MOS, talc, mica, etc.), moldability filler, impact resistant filler, wear resistant filler, heat resistance Fillers (clay minerals, talc, calcium carbonate, precipitated barium sulfate, etc.), flame retardant fillers (zinc borate, red phosphorus, ammonium phosphate, magnesium hydroxide, etc.), soundproof and vibration proof fillers (iron) Powder, barium sulfate, mica, ferrite, etc.), solid lubricant filler (graphite, molybdenum disulfide, fluororesin powder, talc, etc.), heat radiation filler (hydrotalcite, aluminum oxide, charcoal, magnesium oxide, etc.) It is done. Of these, magnesium oxide and talc are preferably used in terms of improving thermal conductivity.

  Also, the shape of the inorganic filler is granular, spherical (improved easy processability and fracture toughness), flat (flaky) (rigidity, vibration control, surface lubricity), acicular (mechanical thermal reinforcement, conductive Efficiency, vibration suppression) and the like, but can be appropriately used depending on the purpose. Moreover, 0.01-100 micrometers is preferable and, as for the average particle diameter of an inorganic filler, 0.1-50 micrometers is more preferable.

  The inorganic filler is added at 10 to 80% by weight of the total weight of the polyamide elastomer composition, preferably 30 to 80% by weight, more preferably 40 to 75% by weight, and particularly preferably 50 to 75% by weight. If the inorganic filler is less than 10% by weight, the thermal conductivity is equivalent to that of the polyamide elastomer, and if it is more than 80% by weight, the flexibility is lowered and the molding processability is deteriorated.

(Silane coupling agent)
The polyamide elastomer composition according to the present invention contains a silane coupling agent in order to improve the dispersibility of the inorganic filler. Specific examples of the silane coupling agent include α-aminoethyltriethoxysilane, α-aminopropyltriethoxysilane, α-aminobutyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropylmethyldiethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropylmethyldimethoxysilane N-β- (aminoethyl) -γ-aminopropyltriethoxysilane, γ-ureidopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, N-benzyl- γ-aminopropyltrimethoxy Amino group-containing silanes such as silane and N-vinylbenzyl-γ-aminopropyltriethoxysilane; γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropyltriethoxy Epoxy group-containing silanes such as silane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltriethoxysilane; Vinyl group-containing silanes such as vinyltrimethoxysilane, vinyltriethoxysilane and vinylmethyldimethoxysilane; β-carboxyethyltriethoxysilane, β-carboxyethylphenylbis (2-methoxyethoxy) silane, N-β- (N -Carboxymethyla Noethyl) -γ-aminopropyltrimethoxysilane and other carboxyl group-containing silanes; γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-mercaptopropylmethyldimethoxysilane, γ-mercaptopropylmethyldiethoxysilane Mercapto group-containing silanes such as γ-halogen-containing silanes such as γ-chloropropyltrimethoxysilane; γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropyltriethoxysilane, γ-acryloxypropyltrimethoxysilane, γ -(Meth) acrylic group-containing silanes such as methacryloxypropylmethyldimethoxysilane and γ-methacryloxypropylmethyldiethoxysilane; γ-isocyanatopropyltrimethoxysilane, γ-isocyanate Over preparative triethoxysilane, .gamma. isocyanate propyl methyl diethoxy silane, isocyanate group-containing silanes such as .gamma. isocyanate propyl methyl dimethoxysilane and the like. Of these, aminosilanes such as γ-aminopropylmethyldiethoxysilane and epoxysilanes such as γ-glycidoxypropyltriethoxysilane are preferably used from the viewpoint of affinity with polyamide elastomer.

  The silane coupling agent is preferably added at 0.01 to 0.3% by weight of the total weight of the polyamide elastomer composition, more preferably 0.05 to 0.3% by weight, and 0.1 to 0. 2% by weight is particularly preferred. When the amount of the silane coupling agent is less than 0.01% by weight, the effect of improving the adhesiveness and the flexibility of the composition tends to be low. There is.

(Other ingredients)
In the polyamide elastomer composition according to the present invention, the heat resistance agent, the ultraviolet absorber, the light stabilizer, the antioxidant, the antistatic agent, the lubricant, the slip agent, the crystal nucleating agent, and the tackifier are provided as long as the characteristics are not inhibited. An agent, a sealing property improving agent, an antifogging agent, a release agent, a plasticizer, a pigment, a dye, a fragrance, a flame retardant, a reinforcing material, and the like can be appropriately added as necessary.

(Production method)
The method for producing the polyamide elastomer composition of the present invention is not particularly limited, and according to a conventional method, a polyamide elastomer, an inorganic filler, a silane coupling agent, and other components added as necessary. After dry blending, it can be produced by melt-kneading.

  The kneading apparatus is not particularly limited, and examples thereof include conventionally known vertical reaction vessels, mixing tanks, kneading tanks or uniaxial or multiaxial horizontal kneading apparatuses, such as uniaxial or multiaxial ruders and kneaders. The mixing temperature is preferably 160 to 260 ° C., and the mixing time is preferably 2 to 200 seconds, although it depends on the mixing apparatus and the mixing temperature.

(Applications: Laminates, sealing materials, adhesives, electronic parts, heat dissipation members)
The polyamide elastomer composition of the present invention is excellent in flexibility, thermal conductivity, and sealing performance, and can be suitably used as a laminate, a sealing material, an adhesive, an electronic component, and a heat dissipation member.

  Since the polyamide elastomer composition of the present invention has good adhesiveness with a thermosetting resin used in an electronic substrate such as a glass epoxy resin, a polyimide resin, or a phenol resin, hot pressing with these resins, etc. It can be bonded by a method to form a laminate. Since the laminated body has a shape such as a planar shape or a fin shape and can improve heat dissipation, it can be used as a heat dissipation sealing material or the like.

In addition, the polyamide elastomer composition of the present invention is used as a sealing material and an adhesive for a heat dissipation member, particularly in an electronic component sealing material at a site where insulation and heat dissipation are required in an electronic member such as a casing of a personal computer. And useful as a heat-dissipating adhesive.
Furthermore, the use of the polyamide elastomer composition of the present invention is not limited to the sealing material and adhesive of the heat radiating member, but includes electronic parts such as passive parts, connecting parts, conversion parts, power supplies and high frequency parts, and automobile parts. Can also be used for home appliance parts. It can also be used for applications requiring rubber elasticity in a wide range of fields such as electric wire coating, medical parts, footwear, and sundries.

  EXAMPLES Hereinafter, although this invention is demonstrated concretely based on an Example, these do not limit the objective of this invention.

First, the measurement method used in this example is shown below.
(Thermal conductivity)
The composition obtained by melt-kneading was molded into a plate shape having a thickness of 3 mm with an injection molding machine, and measured with a steady-state thermal conductivity measuring device (manufactured by ULVAC-RIKO, Inc.).

(Ease of molding)
The evaluation pellets were measured according to JIS K7210 using a melt flow index tester (manufactured by Yasuda Seiki Seisakusho Co., Ltd.), and the moldability was evaluated according to the following evaluation criteria.
S: Over 10 g / 10 min.
A: It exceeds 7 g / 10min and is 10 g / 10min or less.
B: It exceeds 5 g / 10min and is 7 g / 10min or less.
C: It exceeds 3 g / 10min and is 5 g / 10min or less.
D: 3 g / 10 min or less.

(Volume resistivity)
The composition obtained by melt-kneading is molded into a plate of 100 × 70 × 3 mm with an injection molding machine, and using Histar UP manufactured by Mitsubishi Analytech Co., Ltd., according to the MCC-A method. It was measured.

(Heat dissipation)
Electric power of 0.1 W is applied from the electrodes at both ends of the evaluation board to generate heat in the resistance part of the evaluation product in an environment at room temperature of 25 ° C., and the temperature of the chip resistance is measured using a thermocouple. From the temperature, heat dissipation was evaluated according to the following evaluation criteria.
S: The measured temperature is 40 ° C. or lower.
A: The measured temperature exceeds 40 ° C. and is 50 ° C. or less.
B: The measured temperature exceeds 50 ° C. and is 60 ° C. or less.
C: The measured temperature exceeds 60 ° C. and is 80 ° C. or less.
D: The measured temperature is over 80 ° C.

(Encapsulation durability)
The evaluation substrate is exposed for 30 minutes in an environment of -70 ° C. Then, it exposes for 30 minutes in a 60 degreeC environment. This is one cycle, and after each cycle, the insulation resistance value is measured by immersing in a normal temperature water bath at 23 ° C., and the test is performed until the insulation resistance value is 1 × 10 ⁶ Ω or less. The sealing durability was evaluated according to the following evaluation criteria by the number of cycles in which the resistance value was maintained at 1 × 10 ⁶ Ω or more.
S: Hold for 50 cycles or more.
A: For 40 cycles or more and less than 50 cycles.
B: Hold for 30 cycles or more and less than 40 cycles.
C: Retained for 20 cycles or more and less than 30 cycles.
D: Only 20 cycles were held.

Example 1
A polyamide elastomer composition was prepared according to the formulation shown in Table 1. Specifically, the polyamide elastomer 1 (polyetheramide elastomer: manufactured by Ube Industries, Ltd .: UBESTA XPA 9040X1) manufactured at a ratio of hard segment to soft segment of 40/60 is 84.9% by weight. 15% by weight of magnesium oxide blended with several different particle diameters described in 2012-043640, silane coupling agent (aminosilane: manufactured by Momentive Performance Materials, Inc .: SILQUEST A-1100) 0.1% by weight in cylinder The mixture was put into a mold mixer and dry blended. The obtained mixture is introduced into a twin-screw kneader (manufactured by Nippon Steel Co., Ltd .: TEX44), melt-kneaded at a set temperature of 200 ° C., a screw speed of 200 rpm, and a discharge rate of 40 kg / hr, extruded into a string, After cooling, pellets of polyamide elastomer composition were obtained using a pelletizer. The obtained pellets were molded into a 3 mm thick resin plate by injection molding (cylinder temperature 200 ° C., mold temperature 20 ° C., cooling time 30 seconds). The obtained molded product was bonded to a glass epoxy substrate (manufactured by Tees Co., Ltd .: created according to the shape described in JIS Z3197) using a hot press (manufactured by Shinto Metal Industry Co., Ltd.) with a set temperature of 150 ° C. Evaluation product was obtained. Table 1 shows the results of measurement of the thermal conductivity, moldability, volume resistivity, and heat dissipation and sealing durability of the evaluated product.

(Examples 2 to 4)
A polyamide elastomer composition and an evaluation product were obtained in the same manner as in Example 1 except that the blending ratio of the polyamide elastomer and magnesium oxide was changed. Table 1 shows the results of measurement of the thermal conductivity, moldability, volume resistivity, and heat dissipation and sealing durability of the evaluated product.

(Example 5)
A molded product (3 mm thick resin plate) obtained in the same manner as in Example 4 was hot-pressed at a preset temperature of 170 ° C. (Shinto Metal Industries Co., Ltd.) on a polyimide resin substrate prepared according to the shape described in JIS Z3197. The product for evaluation was obtained. Table 1 shows the results of measurement of the thermal conductivity, moldability, volume resistivity, and heat dissipation and sealing durability of the evaluated product.

(Example 6)
A molded product (3 mm-thick resin plate) obtained in the same manner as in Example 4 was hot-pressed at a preset temperature of 170 ° C. (Shinto Metal Industries Co., Ltd.) on a phenolic resin substrate prepared in accordance with the shape described in JIS Z3197. The product for evaluation was obtained. Table 1 shows the results of measurement of the thermal conductivity, moldability, volume resistivity, and heat dissipation and sealing durability of the evaluated product.

(Examples 7 and 8)
A polyamide elastomer composition and an evaluation product were obtained in the same manner as in Example 4 except that the blending ratio of the polyamide elastomer and the silane coupling agent was changed. Table 1 shows the results of measurement of the thermal conductivity, moldability, volume resistivity, and heat dissipation and sealing durability of the evaluated product.

Example 9
A polyamide elastomer composition and an evaluation product were obtained in the same manner as in Example 4, except that the silane coupling agent was changed to epoxy silane (manufactured by Shin-Etsu Chemical Co., Ltd .: KBM403). Table 1 shows the results of measurement of the thermal conductivity, moldability, volume resistivity, and heat dissipation and sealing durability of the evaluated product.

(Example 10)
A polyamide elastomer composition and an evaluation product were obtained in the same manner as in Example 4 except that the shape of the substrate was changed to a fin shape. Table 1 shows the results of measurement of the thermal conductivity, moldability, volume resistivity, and heat dissipation and sealing durability of the evaluated product.

(Example 11)
A polyamide elastomer composition and an evaluation product were obtained in the same manner as in Example 4 except that talc (Nippon Talc Co., Ltd .: Simgon M) having flat particles (average particle diameter of 8 μm) was used instead of magnesium oxide. Obtained. Table 1 shows the results of measurement of the thermal conductivity, moldability, volume resistivity, and heat dissipation and sealing durability of the evaluated product.

(Example 12)
Except for changing the polyamide elastomer 1 to a polyamide elastomer 2 (polyetheramide elastomer: UBE Kosan Co., Ltd .: UBESTA XPA 9048X1) manufactured at a 50/50 ratio of hard segment to soft segment, the same as in Example 4 A polyamide elastomer composition and an evaluation product were obtained by the method. Table 1 shows the results of measurement of the thermal conductivity, moldability, volume resistivity, and heat dissipation and sealing durability of the evaluated product.

(Example 13)
Example 4 except that the polyamide elastomer 1 was changed to a polyamide elastomer 3 (polyetheramide elastomer: Ube Industries, Ltd .: UBESTA XPA 9055X1) manufactured at a hard segment / soft segment ratio of 60/40. A polyamide elastomer composition and an evaluation product were obtained by the method. Table 1 shows the results of measurement of the thermal conductivity, moldability, volume resistivity, and heat dissipation and sealing durability of the evaluated product.

(Example 14)
Example 4 except that the polyamide elastomer 1 was changed to a polyamide elastomer 4 (polyetheramide elastomer: Ube Industries, Ltd .: UBESTA XPA 9035X1) manufactured with a hard segment / soft segment ratio of 30/70. A polyamide elastomer composition and an evaluation product were obtained by the method. Table 1 shows the results of measurement of the thermal conductivity, moldability, volume resistivity, and heat dissipation and sealing durability of the evaluated product.

(Example 15)
A polyamide elastomer composition and an evaluation product were obtained in the same manner as in Example 4 except that the polyamide elastomer 1 was changed to the polyamide elastomer 5 (polyether ester amide elastomer: manufactured by ARKEMA: Pebax 5533). Table 1 shows the results of measurement of the thermal conductivity, moldability, volume resistivity, and heat dissipation and sealing durability of the evaluated product.

(Example 16)
A polyamide elastomer composition and an evaluation product were obtained in the same manner as in Example 4 except that the polyamide elastomer 1 was changed to the polyamide elastomer 6 (polyether ester amide elastomer: manufactured by ARKEMA: Pebax 4033). Table 1 shows the results of measurement of the thermal conductivity, moldability, volume resistivity, and heat dissipation and sealing durability of the evaluated product.

(Comparative Example 1)
A polyamide elastomer composition and an evaluation product were obtained in the same manner as in Example 4 except that the silane coupling agent was not added. Table 1 shows the results of measurement of the thermal conductivity, moldability, volume resistivity, and heat dissipation and sealing durability of the evaluated product.

(Comparative Example 2)
A polyamide elastomer composition and an evaluation product were obtained in the same manner as in Example 4 except that the inorganic filler was not added. Table 1 shows the results of measurement of the thermal conductivity, moldability, volume resistivity, and heat dissipation and sealing durability of the evaluated product.

(Comparative Example 3)
A polyester elastomer (Toyobo Co., Ltd .: Viroshot) was molded into a 3 mm thick resin plate by injection molding (cylinder temperature 200 ° C., mold temperature 20 ° C., cooling time 30 seconds). The obtained molded product was bonded to a glass epoxy substrate (manufactured by Tees Co., Ltd .: created according to the shape described in JIS Z3197) using a hot press (manufactured by Shinto Metal Industry Co., Ltd.) with a set temperature of 150 ° C. Evaluation product was obtained. Table 1 shows the results of measurement of the thermal conductivity, moldability, volume resistivity, and heat dissipation and sealing durability of the evaluated product.

(Comparative Example 4)
A polyamide elastomer composition and an evaluation product were obtained in the same manner as in Example 1 except that the blending ratio of the polyamide elastomer and magnesium oxide was changed. Table 1 shows the results of measurement of the thermal conductivity, moldability, volume resistivity, and heat dissipation and sealing durability of the evaluated product.

  From the above, it was found that the polyamide elastomer composition to which the inorganic filler and the silane coupling agent were added can improve the sealing durability while maintaining the thermal conductivity of the composition. Further, it was found that even when adhered to a thermosetting resin substrate, it has sufficient sealing durability.

Claims (9)

A polyamide elastomer composition containing an inorganic filler, a silane coupling agent, and a polyamide elastomer as a base resin ,
Containing 10 to 80 wt% of the inorganic filler ,
Containing 0.01 to 0.3 wt% of the silane coupling agent,
Polyamide elastomer composition ratio of hard segment and soft segment of the polyamide elastomer, characterized in 60 / 40-30 / 70 Der Rukoto. The polyamide elastomer composition according to claim 1, wherein the base resin is composed only of a polyamide elastomer.   The polyamide elastomer composition according to claim 1 or 2, wherein the inorganic filler is one or more of magnesium oxide and talc. A laminate comprising the polyamide elastomer composition according to any one of claims 1 to 3 adhered to a thermosetting resin. The laminate according to claim 4 , wherein the polyamide elastomer composition has one of a planar shape and a fin shape. Sealing material, characterized in that it comprises a claims 1 to 3 polyamide elastomer composition according to any one. An adhesive comprising the polyamide elastomer composition according to any one of claims 1 to 3 . Electronic component characterized in that it comprises a claims 1 to 3 polyamide elastomer composition according to any one. Radiating member characterized by including the claims 1 to 3 polyamide elastomer composition according to any one.