JP6340910B2 - Electronic equipment - Google Patents

Description

  The present invention relates to an electronic apparatus having a plurality of card slots in which a plurality of cards can be mounted, for example.

  In an electronic device such as a personal computer, a plurality of electronic boards on which electronic components are mounted are mounted at high density. When such an electronic device is operated, the electronic components on the electronic substrate in the electronic device become hot. For this reason, a structure in which an electronic component or the like is cooled using a cooling fan unit is employed in many electronic devices.

  Patent Document 1 discloses a technique for individually adjusting the amount of air sent to each of a plurality of heat generating cards (computer devices) that are cooling objects by electronic control. In the technique described in Patent Document 1, a temperature sensor and a movable louver are arranged in the vicinity of each of a plurality of air inlets provided corresponding to each of a plurality of heat generating cards. The temperature sensor measures the intake temperature and the exhaust temperature of the heat generating card in the vicinity of the intake port. Then, the control device compares the temperature difference (temperature rise amount) between the intake air temperature and the exhaust gas temperature measured by the temperature sensor with a reference temperature difference set in advance for each heat generation card. The louver was moved under control to change the wind direction to the heating unit. Thereby, the air volume to each heat generating card was adjusted. As a result, according to the technique described in Patent Document 1, each heat generating card can be cooled according to the temperature rise of each heat generating card.

JP 2009-123877 A

  However, in the technique described in Patent Document 1, the louver is moved based on the temperature rise amount measured by the temperature sensor and the reference temperature difference to adjust the air volume to the heat generating card. For this reason, if the electronic device that uses both a heat generating card that contains an electronic board and generates heat and a blank card that does not contain an electronic board and does not generate heat, the blank card does not generate heat. The reference value cannot be set, and the temperature rise value of the blank card cannot be measured. For this reason, the technique described in Patent Document 1 cannot be applied to an electronic device that uses both a heat generating card and a blank card.

  Further, the technique described in Patent Document 1 aims to keep the heat generating card below the recommended temperature without increasing the power consumption for cooling more than necessary. For this reason, in the technique described in Patent Document 1, the air volume to the heat generating card is adjusted to the minimum necessary air volume, but various devices are loaded and the various devices have a short life. Furthermore, in the technology described in Patent Document 1, since the temperature and humidity outside the housing change, it does not correspond to the case where the outside of the housing reaches the dew point temperature or less, so there is a possibility that condensation occurs in the housing. there were.

  The present invention has been made in view of such circumstances, and an object of the present invention is to reduce condensation that may occur due to environmental changes outside the housing with a simple configuration when a heat generating card and a blank card are used in combination. An object of the present invention is to provide an electronic device capable of cooling an exothermic card by controlling air outside the casing sent by a fan unit to an appropriate air volume and supplying the exothermic card while suppressing the air.

  The electronic device of the present invention is provided inside the housing, and can be mounted inside the housing so that each of the plurality of cards faces each other, and the air outside the housing A fan unit that sends to each of a plurality of card slots, and a fan unit that accommodates a board on which electronic components are mounted and can be mounted so as to be inserted into and removed from the card slot, and when mounted in the card slot, the fan unit The heat generating card configured to be able to supply air outside the housing sent to the card slot to the electronic component and the board on which the electronic component is not mounted is housed and can be mounted so as to be inserted into and removed from the card slot. And when mounted in the card slot, the fan portion sends the card slot to the card slot. A blank card having a movable shielding plate that blocks air; an internal temperature detector that detects an internal temperature of the housing; an internal temperature detected by the internal temperature detector; And a shielding plate movable portion that disposes the movable shielding plate at a position where air outside the housing sent to the card slot by the fan portion passes through the blank card based on the dew point temperature of apparatus.

  According to the technology of the present invention, the air outside the housing sent by the fan unit is adjusted to an appropriate air volume and supplied to the heat generating card with a simple configuration while suppressing condensation that may occur due to environmental changes outside the housing. The heat generating card can be cooled.

It is a permeation | transmission front view which shows the structure of the electronic device in embodiment of this invention. It is a perspective view which shows the structure of the electronic device in embodiment of this invention. It is a perspective view which extracts and shows a fan mounting unit, a card mounting unit, and an air intake unit among electronic devices in an embodiment of the invention. It is a perspective view which shows the example which installed the electronic device in embodiment of this invention in the apparatus accommodating box. It is a perspective view which shows the structure of a heat_generation | fever card. It is a perspective view which shows the structure of a blank card. Fig.6 (a) is a figure which shows the state which closed the movable shielding board. FIG. 6B is a diagram illustrating a state in which the movable shielding plate is opened. It is a block diagram which shows the electric circuit containing a movable shielding board control part. It is a figure which shows notionally the mode at the time of operating the electronic device in embodiment of this invention in a high temperature environment. It is a state when operating the electronic device in the embodiment of the present invention in a low temperature environment, and the electronic device is operated when the temperature inside the housing of the electronic device becomes equal to or lower than the dew point temperature inside the housing. It is a figure which shows the mode at the time notionally.

<Embodiment>
FIG. 1 is a transparent front view showing a configuration of an electronic apparatus 1000 according to an embodiment of the present invention.
FIG. 2 is a perspective view illustrating a configuration of the electronic apparatus 1000. FIG. 3 is a perspective view showing the fan-mounted unit 110, the card-mounted unit 120, and the intake unit 130 extracted from the electronic device 1000. 1 to 3 show the vertical direction G for convenience of explanation. In addition, the electronic apparatus 1000 illustrated in FIG. 1 is illustrated in a simplified manner in comparison with the configuration of the electronic apparatus 1000 illustrated in FIGS.

  As shown in FIGS. 1 and 2, the electronic apparatus 1000 includes a housing 100, a fan mounting unit 110, a card mounting unit 120, and an intake unit 130. The electronic device 1000 is, for example, a communication device such as a radio base station device installed in a communication station or the like, or a forced air cooling communication device such as an exchange. As shown in FIG. 2, the electronic device 1000 is used by being mounted in the housing 100. The housing 100 is also called a rack. The card mounting unit 120 is also called a shelf.

  The housing 100 corresponds to an exterior frame of the electronic device 1000. As shown in FIGS. 1 and 2, the housing 100 accommodates a fan mounting unit 110, a card mounting unit 120, and an intake unit 130. As shown in FIG. 2, a plurality of openings 101 are provided on the upper surface of the housing 100.

  As shown in FIG. 1, a fan unit side exhaust opening 140 is formed between the fan mounting unit 110 and the card mounting unit 120 at a position corresponding to the fan unit 111. Similarly, a card mounting unit side exhaust opening 150 is formed between the fan mounting unit 110 and the card mounting unit 120 at a position corresponding to each card slot 121 described later. Further, between the card mounting unit 120 and the air intake unit 130, a card mounting unit side intake opening 160 is formed at a position corresponding to each card slot 121.

  The card mounting unit side exhaust opening 150 and the card mounting unit side intake opening 160 are arranged so as to face each other. Thus, the fan unit side exhaust opening 140, the card mounting unit side exhaust opening 150, and the card mounting unit side intake opening 160 are provided in the housing 100. As a result, the air outside the casing 100 sucked from the intake unit 130 by the fan unit 111 is discharged out of the casing 100 via the intake unit 130, the card mounting unit 120, and the fan mounting unit 110.

  As shown in FIGS. 1, 2, and 3, the fan mounting unit 110 is disposed on the upper side in the vertical direction G in the housing 100. The fan mounting unit 110 is provided on the upper surface side of the card mounting unit 120.

  The fan mounting unit 110 has a fan unit 111. That is, the electronic apparatus 1000 has a structure in which a heat generating card 170 described later is forcibly cooled by air by the fan unit 111 (forced air cooling structure). The fan unit 111 is provided inside the housing 100 and sucks air outside the housing 100 from the intake unit 130 side. In addition, the fan unit 111 sends air sucked from the intake unit 130 side to each of a plurality of card slots 121 in the card mounting unit 200 described later.

  Further, the fan unit 111 exhausts air passing through each of the plurality of card slots 121 from the upper surface side of the housing 100 to the outside of the housing 100. The airflow of all the fan units 111 in the fan-mounted unit 110 is such that the airflow can maintain the device operating temperature or lower even when the heat generating card 170 is mounted in all of the card slots 121. Is set.

  For convenience of drawing, FIG. 1 shows two fan units 111, and FIG. 2 shows six fan units 111. However, it is sufficient that one or more fan units 111 are mounted on the fan mounting unit 110.

  As shown in FIGS. 1 and 2, the card mounting unit 120 is disposed between the fan mounting unit 110 and the intake unit 130. As shown in FIG. 1, a plurality of card slots 121 are provided in the card mounting unit 120.

  Each of the plurality of card slots 121 has a back plug-in structure, and a plurality of cards (a heat generating card 170 and a blank card 180) are mounted so that the card surfaces face each other. As shown in FIG. 1, the card mounting unit 120 includes a first card holding unit 122 and a second card holding unit 123. Each of the first card holder 122 and the first card holder 123 is provided for each card slot 121 as shown in FIG. The first card holding unit 122 holds the upper end of the card, and the second card holding unit 123 holds the lower end of the card. This prevents the card from falling out of the card slot 121 after being received in the card slot 121.

  FIG. 4 is a perspective view showing an example in which the electronic device 1000 is installed in the device housing box 2000. As shown in FIG. 4, the electronic device 1000 is installed in the device housing box 2000. The device housing box 2000 is normally a sealed room. The device housing box 2000 is provided with a door (not shown) that can be used by a person. The device housing box 2000 is air-conditioned and managed by the air conditioner 3000. The air conditioner 3000 is an air conditioner, for example. When a maintenance worker enters the device housing box 2000 due to maintenance work of the electronic device 1000 and the door is opened and closed, air outside the device housing box 2000 enters the device housing box 2000. For this reason, the environment (especially temperature and humidity) around the electronic device 1000 may change rapidly.

  Here, the plurality of cards include a heat generating card 170 and a blank card 180. That is, both the heat generating card 170 and the blank card 180 are mounted in each of the plurality of card slots 121 so that they can be inserted and removed along a direction substantially perpendicular to the front surface 100a of the housing. The configurations of the heat generating card 170 and the blank card 180 will be described.

  FIG. 5 is a perspective view showing the configuration of the heat generating card 170. FIG. 6 is a perspective view showing the configuration of the blank card 180. FIG. 6A is a diagram illustrating a state in which a movable shielding plate 185 described later is closed. FIG. 6B is a diagram showing a state in which the movable shielding plate 185 is opened.

  As shown in FIG. 5, the heat generating card 170 includes an electronic substrate 171 and a front protective plate 172. As shown in FIG. 5, electronic components 173 such as resistors and ICs are mounted on the substrate surface of the electronic substrate 171. At least one of the electronic components 173 is a CPU (Central Processing Unit), for example, and has heat generation. The front protective plate 172 is formed in a flat plate shape. The front protective plate 172 is attached to one end of the electronic substrate 171 along a direction substantially perpendicular to a surface parallel to the substrate surface of the electronic substrate 171. A pair of mounting screws 172 a are attached to the front protective plate 172. The mounting screw 172a is used to hold the heat generating card 170 in the housing 100 after the heat generating card 170 is mounted in the card slot 121. That is, in a state where the heat generating card 170 is accommodated in the card slot 121, the mounting screw 172a is attached to a screw hole (not shown) of the housing 100 and tightened to hold the heat generating card 170 in the housing 100. Can do.

  As shown in FIG. 1, in a state where the heat generating card 170 is housed in the card slot 121, the air outside the casing 100 sent to the card slot 121 by the fan unit 111 is supplied to the board surface of the electronic board 171 ( Arrows a1 to a3) in FIG. Thereby, the electronic component 173 on the electronic substrate 171 is cooled by the air supplied by the fan unit 111.

  As shown in FIGS. 6A and 6B, the blank card 180 includes a dummy substrate 181, a front protective plate 182, a movable shielding plate 185, an outside air temperature sensor 186, and an outside air humidity sensor 187. , A shielding plate movable unit 188 and a shielding plate control unit 190. Unlike the electronic substrate 170 described above, basically no electronic components (particularly electronic components having heat generation) are mounted on the dummy substrate 181. The front protective plate 182 is attached to one end of the dummy substrate 181 along a direction substantially perpendicular to a plane parallel to the substrate surface of the dummy substrate 181. A pair of attachment screws 182 a are attached to the front protective plate 182. The mounting screw 182 a is used to hold the blank card 180 in the housing 100 after the blank card 180 is mounted in the card slot 121. That is, the blank card 180 is held in the casing 100 by attaching the mounting screw 182a to the screw hole (not shown) of the casing 100 and tightening it with the blank card 180 accommodated in the card slot 121. Can do.

  As shown in FIGS. 1, 6 (a) and 6 (b), the movable shielding plate 185 is attached to the lower end portion of the dummy substrate 181. As shown in FIG. 1, FIG. 6A and FIG. 6B, the movable shielding plate 185 is attached to the dummy substrate 181 so as to be rotatable between α1 and α2 about the rotation shaft 185a. . The rotation shaft 185a is installed along the dummy substrate surface as shown in FIG. This movable shielding plate 185 is moved by a shielding plate movable portion 188 described later. The shielding plate movable unit 188 is controlled by the shielding plate control circuit unit 190.

  As shown in FIG. 1, when the movable shielding plate 185 is rotated to the α1 side while the blank card 180 is accommodated in the card slot 121, the movable shielding plate 185 is sent to the card slot 121 by the fan unit 111. Air outside the housing 100 can be blocked. As described above, when the movable shielding plate 185 is rotated to the α1 side while the blank card 180 is accommodated in the card slot 121, the air sent by the fan unit 111 is blocked by the movable shielding plate 185 (FIG. 1). Arrow c).

  As shown in FIG. 1, when the movable shielding plate 185 is rotated to the α2 side while the blank card 180 is accommodated in the card slot 121, the movable shielding plate 185 is sent to the card slot 121 by the fan unit 111. Air outside the casing 100 can be passed through the blank card 180. As described above, when the movable shielding plate 185 is rotated to the α2 side in a state where the blank card 180 is accommodated in the card slot 121, the air sent by the fan unit 111 is not blocked by the movable shielding plate 185, and is blanked. It passes through the card 180 (arrow d in FIG. 1).

  The outside air temperature sensor 186 measures the temperature outside the housing 100. The outside air temperature sensor 186 outputs the measured temperature, which is the temperature measurement result, to the movable shielding plate controller 190 described later.

  The outside air humidity sensor 187 measures the humidity outside the housing 100. The outside air humidity sensor 187 outputs the measured humidity, which is the humidity measurement result, to the movable shielding plate controller 190 described later.

  The shielding plate movable unit 188 moves the movable shielding plate according to control by a movable shielding plate control unit 190 described later.

  FIG. 7 is a block diagram showing an electric circuit including the movable shielding plate control unit 190. As shown in FIG. 7, the movable shielding plate control unit 190 is connected to the outside air temperature sensor 186, the outside air humidity sensor 187, and the shielding plate movable unit 188.

  As shown in FIG. 7, the movable shielding plate control unit 190 includes an outside air temperature detection unit 191, an outside air humidity detection unit 192, a cooling and warming control determination unit 193, a reference temperature memory 194, and a housing internal temperature detection unit 195. A temperature rise value storage memory 196, a dew point temperature detection unit 197, and a shielding plate opening / closing instruction unit 198.

  The outside air temperature detection unit 191 is connected to the outside air temperature sensor 186, the cooling and keeping control determination unit 193, and the in-casing temperature detection unit 195. The outside air temperature detection unit 191 detects the temperature measured by the outside air temperature sensor 186 as the outside air temperature. The outside air temperature detection unit 191 outputs the outside air temperature to the cooling heat insulation control determination unit 193 and the in-casing temperature detection unit 195.

  The outside air humidity detection unit 192 is connected to the outside air humidity sensor 187 and the dew point temperature detection unit 197. The outside air humidity detection unit 192 detects the humidity measured by the outside air humidity sensor 187 as the outside air humidity. The outside air humidity detector 192 outputs the outside air humidity to the dew point temperature detector 197.

  The cooling and warming control determination unit 193 compares the reference temperature T (° C.) stored in advance in the reference temperature storage memory 194 with the outside air temperature output by the outside air temperature detection unit 191. Then, based on the comparison result, the cooling and keeping control determination unit 193 outputs the cooling and keeping control signal S2 to the shielding plate opening / closing instruction unit 198. More specifically, when the outside air temperature output by the outside air temperature detecting unit 191 is higher than the reference temperature T (° C.), the cooling and keeping control determining unit 193 instructs the cooling and keeping control to instruct the control for cooling the inside of the housing 100. The signal S2 is output to the shielding plate opening / closing instruction unit 198. On the other hand, when the outside air temperature output by the outside air temperature detection unit 191 is not higher than the reference temperature T (° C.), the cooling and warming control determination unit 193 generates a cooling and warming control signal S2 instructing control for keeping the inside of the housing 100 warm. And output to the shielding plate opening / closing instruction unit 198.

  The reference temperature memory 194 stores a reference temperature T (° C.) for comparison with the outside air temperature output by the outside air temperature detection unit 191. The reference temperature is also called a threshold temperature.

  The casing internal temperature detection unit 195 is connected to the outside air temperature detection unit 191, the cooling and keeping control determination unit 193, the temperature rise value storage memory 196, and the dew point temperature detection unit 197. A card mounting number information signal S <b> 1 is input to the in-casing temperature detection unit 195. The card mounting number information signal S1 is a signal including information on the number of heat generating cards 170 accommodated in the card mounting unit 120 of the housing 100.

  The in-casing temperature detection unit 195 extracts a temperature increase value corresponding to the number of cards included in the card mounting number information signal S1 from the temperature increase value storage memory 196. Then, the casing internal temperature detection unit 195 detects the casing internal temperature based on the temperature increase value and the outside air temperature detected by the outside air temperature detection unit 191. The housing internal temperature is an assumed temperature inside the electronic apparatus 1000, and is a temperature rise value generated when the card (the heat generating card 170, the blank card 180) is accommodated in the card mounting unit 120 of the housing 100. It is calculated based on the temperature detection result detected by the outside air temperature detector 191. The casing internal temperature detection unit 195 outputs the internal temperature of the electronic device to the dew point temperature detection unit 197.

  The temperature rise value storage memory 196 is connected to the in-casing temperature detection unit 195. The temperature rise value storage memory 196 stores the number of heat generating cards 170 accommodated in the card mounting unit 120 of the housing 100 and the temperature rise value in the housing in association with each other. At this time, the temperature rise value inside the housing is set higher as the number of cards accommodated in the card mounting unit 120 of the housing 100 increases.

  The dew point temperature detection unit 197 is connected to the outside air humidity detection unit 192, the in-casing temperature detection unit 195, and the shielding plate opening / closing instruction unit 198. First, the dew point temperature detection unit 197 detects the dew point temperature in the housing 100 based on the outside air temperature detected by the outside air temperature detection unit 191 and the outside air humidity detected by the outside air humidity detection unit 192.

  Next, the dew point temperature detection unit 197 generates a dew point temperature alarm signal S3 based on the dew point temperature in the housing 100 and the housing internal temperature detected by the housing temperature detection unit 195, and the shielding plate opening / closing instruction unit 198. Output to. Specifically, when the internal temperature of the electronic device is lower than the dew point temperature in the housing 100, the dew point temperature detection unit 197 determines that condensation can occur in the housing 100 and blocks the dew point temperature alarm signal S3. Output to the plate opening / closing instruction unit 198.

  The shielding plate opening / closing instruction unit 198 is connected to the shielding plate movable unit 188, the cooling and keeping control determining unit 193, and the dew point temperature detecting unit 197.

  The shielding plate opening / closing instruction unit 198 outputs the shielding plate opening / closing command signal S4 to the shielding plate movable unit 188 based on the cooling insulation control signal S2 output from the cooling insulation control determination unit 193.

  More specifically, when the cooling / warming control signal S2 is a signal for instructing control for cooling the inside of the casing 100, the shielding plate opening / closing instruction unit 198 causes the shielding plate opening / closing command signal S4 to close the movable shielding plate 185. Is output to the shielding plate movable portion 188. On the other hand, when the cooling and keeping control signal S2 is a signal for instructing control for keeping the inside of the casing 100 warm, the shielding plate opening / closing instruction unit 198 sends the shielding plate opening / closing command signal S4 for opening the movable shielding plate 185 to the shielding plate movable. To the unit 188.

  Thus, when the outside air temperature output by the outside air temperature detection unit 191 is higher than the reference temperature T (° C.), the shielding plate opening / closing instruction unit 198 sends the shielding plate opening / closing command signal S4 for closing the movable shielding plate 185 to the shielding plate movable. The data can be output to the unit 188. As a result, the shielding plate movable unit 188 places the movable shielding plate 185 at a position on the α1 side, that is, a position that blocks the air outside the casing 100 sent to the card slot 121 by the fan unit 111.

  On the other hand, when the outside air temperature output by the outside air temperature detection unit 191 is not higher than the reference temperature T (° C.), the shielding plate opening / closing instruction unit 198 sends a shielding plate opening / closing command signal S4 for opening the movable shielding plate 185 to the shielding plate movable. The data can be output to the unit 188. As a result, the shielding plate movable unit 188 arranges the movable shielding plate 185 at a position on the α2 side, that is, a position where air outside the housing 100 sent to the card slot 121 by the fan unit 111 passes through the blank card 180. To do.

  Further, the shielding plate opening / closing instruction unit 198 opens the movable shielding plate 185 based on the dew point temperature alarm signal S3 output from the dew point temperature detection unit 195 in addition to the cooling and keeping control signal S2. Is output to the shielding plate movable portion 188. As a result, the shielding plate movable unit 188 arranges the movable shielding plate 185 at a position on the α2 side, that is, a position where air outside the housing 100 sent to the card slot 121 by the fan unit 111 passes through the blank card 180. To do. Thereby, it is possible to suppress inhalation of high humidity outside air into the heat generating card 170. Further, since the outside air with high humidity is not sucked into the heat generating card 170, the temperature in the housing 100 can be raised. As a result, the temperature in the housing 100 becomes higher than the dew point temperature in the housing 100, so that it is possible to prevent dew condensation from occurring in the housing 100.

  Here, when the shielding plate opening / closing instruction unit 198 outputs the shielding plate opening / closing command signal S4 to the shielding plate movable unit 188, the dew point temperature alarm signal S3 is prioritized over the cooling and keeping control signal S2.

  Next, the operation of electronic device 1000 in the embodiment of the present invention will be described.

  FIG. 8 is a diagram conceptually illustrating a state when the electronic apparatus 1000 is operated in a high temperature environment. Since the heat generating card 170 needs to be cooled in order to operate the electronic device 1000 in a high temperature environment, the state shown in FIG. 8 may be called a cooled state. FIG. 9 shows a state when the electronic apparatus 1000 is operated in a low temperature environment, and when the temperature inside the casing 100 of the electronic apparatus 1000 becomes equal to or lower than the dew point temperature in the casing 100. It is a figure which shows notionally the mode at the time of making it operate | move. In order to operate the electronic apparatus 1000 in a low temperature environment, it is necessary to keep the heat generating card 170 warm, so the state shown in FIG. 9 may be called a heat keeping state. In order to operate the electronic device 1000 when the temperature inside the housing 100 of the electronic device 1000 becomes equal to or lower than the dew point temperature inside the housing 100, it is necessary to prevent the inside of the housing 100 from condensing. The state shown in FIG. 9 is sometimes referred to as a dew condensation prevention state.

  As shown in FIGS. 8 and 9, a plurality of heat generating cards 170 and a plurality of blank cards 180 are mounted in each of a plurality of card slots 121 in the card mounting unit 120. 8 and 9, as shown in FIGS. 8 and 9, in the front view of the electronic device 100, a blank card 180 is mounted in the central card slot 121, and a heat generating card is provided at both ends sandwiching the central portion. Assume that 170 is mounted. In the present invention, the arrangement of the heat generating card 170 and the blank card 180 is not limited to the arrangement illustrated in FIGS. 8 and 9.

  First, each outside temperature detector 191 of each blank card 180 detects the outside temperature (temperature outside the housing 100) measured by the outside temperature sensor 186. Each outside air temperature detection unit 191 outputs the detected outside air temperature to the cooling and heat retention control determination unit 193 and the in-casing temperature detection unit 195.

  In addition, each outside air humidity detection unit 192 of each blank card 180 detects the outside air humidity (humidity outside the housing 100) measured by the outside air humidity sensor 187. Each outside air humidity detector 192 outputs the outside air humidity to the dew point temperature detector 197.

  Next, the cooling and keeping control determination unit 193 compares the reference temperature T (° C.) stored in advance in the reference temperature storage memory 194 with the outside air temperature output by the outside air temperature detection unit 191. Then, based on the comparison result, the cooling and keeping control determination unit 193 outputs the cooling and keeping control signal S2 to the shielding plate opening / closing instruction unit 198.

  A case where the outside air temperature output by the outside air temperature detector 191 is higher than a predetermined temperature T ° C. will be described. For example, it is assumed that the predetermined temperature T is T = 5 ° C.

  As described above, when the outside air temperature output by the outside air temperature detecting unit 191 is higher than the reference temperature (T = 5 (° C.)), the cooling and keeping control determining unit 193 instructs the cooling to control the inside of the housing 100. The heat retention control signal S2 is output to the shielding plate opening / closing instruction unit 198.

  Next, the shielding plate opening / closing instruction unit 198 outputs the shielding plate opening / closing command signal S4 to the shielding plate movable unit 188 based on the cooling insulation control signal S2 output from the cooling insulation keeping control determination unit 193. Specifically, when the cooling and keeping control signal S2 is a signal for instructing control for cooling the inside of the housing 100, the shielding plate opening / closing instruction unit 198 shields the shielding plate opening / closing command signal S4 for closing the movable shielding plate 185. It outputs to the plate movable part 188. Thus, when the outside air temperature output by the outside air temperature detection unit 191 is higher than the reference temperature T (° C.), the shielding plate opening / closing instruction unit 198 sends the shielding plate opening / closing command signal S4 for closing the movable shielding plate 185 to the shielding plate movable. The data can be output to the unit 188.

  Then, the movable shielding plate 185 moves based on the shielding plate opening / closing command signal S4 output by the shielding opening / closing instruction unit 198. Specifically, when the shielding plate opening / closing command signal S4 is a signal for closing the movable shielding plate 185, the shielding plate movable unit 188 moves the movable shielding plate 185 to the card slot 121 by the position on the α1 side, that is, the fan unit 111. It arrange | positions in the position which blocks | interrupts the air outside the housing | casing 100 sent to.

  At this time, the air outside the casing 100 sent by the fan unit 111 is shielded by the movable shielding plate 185 in the card slot 121 that accommodates the blank card 180. On the other hand, the air outside the casing 100 sent by the fan unit 111 passes through the heat generating card 170 so as to be supplied to the electronic component 173 on the electronic board 171 in the card slot 121 that accommodates the heat generating card 170. Passes from the intake unit 130 to the fan-mounted unit 110. At this time, in the card slot 121 that accommodates the blank card 180, the air sucked from the intake unit 130 is shielded by the movable shielding plate 185. Therefore, most of the air sucked from the intake unit 130 flows to the card slot 121 that houses the heat generating card 170 (arrow A in FIG. 8).

  Thus, for example, when the outside air temperature measured by the outside air temperature detection unit 191 is higher than a predetermined temperature (T = 5 ° C.), the card slot 121 that houses the heat generating card 170 with the movable shielding plate 185 closed. As a result, a large amount of wind can flow, and the cooling capacity for the heat generating card 170 can be concentrated and efficiently improved. For this reason, the structure of the electronic device 1000 when operating in a high temperature environment is also referred to as a cooling structure.

  Next, a case where the outside air temperature output by the outside air temperature detection unit 191 is not higher than the predetermined temperature T ° C. will be described. As in the case described above, for example, it is assumed that the predetermined temperature T is T = 5 ° C.

  As described above, when the outside air temperature output by the outside air temperature detecting unit 191 is lower than the reference temperature (T = 5 (° C.)), the cooling and keeping control determining unit 193 instructs the cooling to instruct the control to keep the inside of the casing 100 warm. The heat retention control signal S2 is output to the shielding plate opening / closing instruction unit 198.

  Next, the shielding plate opening / closing instruction unit 198 outputs the shielding plate opening / closing command signal S4 to the shielding plate movable unit 188 based on the cooling insulation control signal S2 output from the cooling insulation keeping control determination unit 193. Specifically, when the cooling and keeping control signal S2 is a signal for instructing control to keep the inside of the housing 100, the shielding plate opening / closing instruction unit 198 shields the shielding plate opening / closing command signal S4 for opening the movable shielding plate 185. It outputs to the plate movable part 188. Thus, when the outside air temperature output by the outside air temperature detection unit 191 is not higher than the reference temperature T (° C.), the shielding plate opening / closing instruction unit 198 sends a shielding plate opening / closing command signal S4 for opening the movable shielding plate 185 to the shielding plate. It can be output to the movable part 188. Thus, when the outside air temperature output by the outside air temperature detection unit 191 is not higher than the reference temperature T (° C.), the shielding plate opening / closing instruction unit 198 sends a shielding plate opening / closing command signal S4 for opening the movable shielding plate 185 to the shielding plate. It can be output to the movable part 188.

  Then, the movable shielding plate 185 moves based on the shielding plate opening / closing command signal S4 output by the shielding opening / closing instruction unit 198. Specifically, when the shielding plate opening / closing command signal S4 is a signal for opening the movable shielding plate 185, the shielding plate movable unit 188 moves the movable shielding plate 185 to the card slot 121 by the position on the α2 side, that is, the fan unit 111. It arrange | positions in the position which allows the air outside the housing | casing 100 sent to to pass through in the blank card | curd 180. FIG.

  Accordingly, when the outside air temperature output by the outside air temperature detection unit 191 is not higher than the reference temperature (T = 5 (° C.)), the shielding plate movable unit 188 opens the movable shielding plate 185. That is, the shield movable part 188 arranges the movable shield plate 185 at a position (position on the α1 side in FIG. 1) through which air outside the housing 100 sent to the card slot 121 by the fan part 111 passes inside the blank card 180. To do.

  At this time, the air outside the housing 100 sent by the fan unit 111 passes through the blank card 180 in the card slot 121 that accommodates the blank card 180 without being shielded by the movable shielding plate 185, and is thus sucked into the intake unit 130. To the fan-mounted unit 110. In addition, the air outside the casing 100 sent by the fan unit 111 passes through the heat generation card 170 and is sucked into the card slot 121 that accommodates the heat generation card 170 so as to be supplied to the electronic component 173 on the electronic board 171. The unit 130 passes through to the fan-mounted unit 110. At this time, in the blank card 180, the resistance to the air sent from the fan unit 111 (ventilation resistance) is smaller than the heat generation card 170 because the electronic component 173 is not accommodated. For this reason, in the card slot 121 that accommodates the blank card 180, the air sent from the fan unit 111 is larger than the amount of air passing through the card slot 121 that accommodates the heat generating card 170 (arrow B in FIG. 9). For this reason, the air volume of the air flowing into the card slot 121 that houses the heat generating card 170 can be suppressed (arrow C in FIG. 9).

  Thus, for example, when the outside air temperature detected by the outside air temperature detection unit 186 is not higher than a predetermined temperature (T = 5 (° C.)), the blank card 180 is accommodated with the movable shielding plate 185 opened. A large amount of air can flow to the card slot 121, and the amount of air to the card slot 121 that accommodates the heat generating card 170 can be reduced. As a result, it is possible to prevent the heat generating card 170 from being excessively cooled and to keep the heat. For this reason, the structure of the electronic device 1000 when operating in a low temperature environment is also referred to as a heat retaining structure.

  Next, it is assumed that the environment around the electronic device 1000 (particularly, the outside air temperature and the outside air humidity) changes abruptly. That is, for example, it is assumed that a maintenance worker opens and closes the door when entering the device housing box 2000 due to maintenance work of the electronic device 1000 or the like. At this time, air outside the device storage box 2000 enters the device storage box 2000 from the door. For this reason, the environment (especially outside temperature and outside humidity) around the electronic device 1000 changes rapidly.

  For example, before the maintenance worker enters the device housing box 2000, the inside of the device housing box 2000 is cooled to 20 (° C.), and the temperature inside the casing 100 of the electronic device 1000 is 25 (° C.). To do. In this example, for example, when a maintenance worker enters the device housing box 2000 and opens and closes the door, air having a high temperature of 35 (° C.) and a high humidity of 70 (%) flows into the housing 100. In addition, if the dew point temperature inside the housing 100 is 29 (° C.), condensation may occur in the housing 100.

  Here, it is assumed that air having a temperature of 35 (° C.) and a humidity of 70 (%) flows into the housing 100 from the outside of the device housing box 2000.

  The outside air temperature detection unit 191 detects the outside air temperature 35 (° C.) measured by the outside air temperature sensor 187 at a certain time T (s). The outside temperature 35 (° C.) detected by the outside temperature detector 191 is input from the outside temperature detector 191 to the inside temperature detector 195.

  In addition, the outside air humidity detection unit 192 detects the outside air humidity 70 (%) measured by the outside air humidity sensor 186 at a certain time T (s). The dew point temperature detector 197 receives the outside air humidity 70 (%) detected by the outside air humidity detector 192 from the outside air humidity detector 192.

  Here, it is assumed that the outside air temperature detection unit 191 and the outside air humidity detection unit 192 detect the outside air temperature and the outside air humidity at a cycle of 1 second. In this case, the outside air temperature detector 191 sets the outside air temperature 20 (° C.) at time (T−1) (s) (one second before the outside air temperature detector 191 detects the outside air temperature 35 (° C.)). Suppose it is detected.

Next, the internal temperature detection unit 195 extracts a temperature increase value corresponding to the number of cards included in the card mounting number information signal S1 from the temperature increase value storage memory 196. Here, it is assumed that the number of mounted cards is seven. The temperature increase value storage memory 196 stores a temperature increase value 5 (° C.) corresponding to the amount of heat generated when the number of cards mounted is seven. In this case, the in-casing temperature detection unit 195 extracts the temperature increase value 5 (° C.) from the temperature increase value storage memory 196.

  The in-casing temperature detection unit 195 detects the internal temperature of the electronic device based on the temperature increase value and the outside air temperature detected by the outside air temperature detection unit 191. Here, as described above, the temperature rise value is 5 (° C.). Further, the outside air temperature detection unit 191 detects the outside air temperature 20 (° C.) one second before detecting the outside air temperature 35 (° C.). Therefore, at time (T-1) (s) (one second before the outside air temperature detecting unit 191 detects the outside air temperature 35 (° C.)), the inside temperature detecting unit 195 detects the electronic device inside temperature 25 (° C.). Is detected.

  Next, the dew point temperature detection unit 197 is based on the outside air temperature 35 (° C.) detected by the outside air temperature detection unit 191 and the outside air humidity 70 (%) detected by the outside air humidity detection unit 192, for example, a housing Assume that a dew point temperature 29 (° C.) within 100 is detected.

Next, the dew point temperature detection unit 197 includes the dew point temperature 29 (° C.) in the housing 100 and the electronic device internal temperature 25 (° C.) detected by the housing temperature detection unit 195 at time (T−1) (s). ), The dew point temperature alarm signal S3 is output to the shielding plate opening / closing instruction unit 198. That is,
Since the internal temperature 25 (° C.) of the electronic device detected by the internal temperature detector 195 at time (T−1) (s) is lower than the dew point temperature 29 (° C.) in the housing 100, the dew point temperature detector 197 determines that condensation can occur in the housing 100 and outputs a dew point temperature alarm signal S3 to the shielding plate opening / closing instruction unit 198.

  In addition, the outside air temperature 35 (° C.) detected at the time T (s) by the outside air temperature detection unit 191 is input to the cooling and warming control determination unit 193.

  It is assumed that the reference temperature storage unit 194 stores a reference temperature T = 5 (° C.). Then, the cooling and keeping control determination unit 193 includes the reference temperature T = 5 (° C.) stored in the reference temperature storage memory 194 in advance, and the outside air temperature 35 (° C.) output at the time T by the outside air temperature detection unit 191. Compare Since the outside air temperature 35 (° C.) output by the outside air temperature detecting unit 191 is higher than the reference temperature T = 5 (° C.), the cooling and keeping control determining unit 193 instructs the cooling and keeping control to instruct the control for cooling the inside of the housing 100. The signal S2 is output to the shielding plate opening / closing instruction unit 198 (processing A). If the outside air temperature output by the outside air temperature detector 191 is 0 (° C.), the outside air temperature 0 (° C.) is lower than the reference temperature T = 5 (° C.). Outputs a cooling and keeping control signal S2 for instructing control for keeping the inside of the casing 100 to the shielding plate opening and closing instruction unit 198 (Process B).

  Here, the dew point temperature alarm signal S3 is input from the dew point temperature detection unit 197 to the shielding plate opening / closing instruction unit 198. Therefore, the shielding plate opening / closing instruction unit 198 outputs the shielding plate opening / closing command signal S4 for opening the movable shielding plate 185 to the shielding plate movable unit 188 in preference to the above-described processing A and processing B. Accordingly, when the electronic device internal temperature 25 (° C.) is lower than the dew point temperature 29 (° C.) in the housing 100, the shielding plate opening / closing instruction unit 198 sends a shielding plate opening / closing command signal S 4 for opening the movable shielding plate 185. It can output to the shielding plate movable part 188.

  Then, the movable shielding plate 185 moves based on the shielding plate opening / closing command signal S4 output by the shielding opening / closing instruction unit 198. Specifically, since the shielding plate opening / closing command signal S4 is a signal for opening the movable shielding plate 185, the shielding plate movable unit 188 moves the movable shielding plate 185 to the card slot 121 by the position on the α2 side, that is, the fan unit 111. It arrange | positions in the position which allows the air outside the housing | casing 100 sent to to pass through in the blank card | curd 180. FIG.

  Thereby, when the electronic device internal temperature 25 (° C.) is lower than the dew point temperature 29 (° C.) inside the housing 100, the shielding plate movable unit 188 opens the movable shielding plate 185. That is, the shield movable part 188 arranges the movable shield plate 185 at a position (position on the α1 side in FIG. 1) through which air outside the housing 100 sent to the card slot 121 by the fan part 111 passes inside the blank card 180. To do.

  At this time, the air outside the housing 100 sent by the fan unit 111 passes through the blank card 180 in the card slot 121 that accommodates the blank card 180 without being shielded by the movable shielding plate 185, and is thus sucked into the intake unit 130. To the fan-mounted unit 110. In addition, the air outside the casing 100 sent by the fan unit 111 passes through the heat generation card 170 and is sucked into the card slot 121 that accommodates the heat generation card 170 so as to be supplied to the electronic component 173 on the electronic board 171. The unit 130 passes through to the fan-mounted unit 110. At this time, in the blank card 180, the resistance to the air sent from the fan unit 111 (ventilation resistance) is smaller than the heat generation card 170 because the electronic component 173 is not accommodated. For this reason, in the card slot 121 that accommodates the blank card 180, the air sent from the fan unit 111 is larger than the amount of air passing through the card slot 121 that accommodates the heat generating card 170 (arrow B in FIG. 9). For this reason, the air volume of the air flowing into the card slot 121 that houses the heat generating card 170 can be suppressed (arrow C in FIG. 9). Thereby, it is possible to suppress inhalation of high humidity outside air into the heat generating card 170. Further, since the outside air with high humidity is not sucked into the heat generating card 170, the temperature in the housing 100 can be raised. As a result, the temperature in the housing 100 becomes higher than the dew point temperature in the housing 100, so that it is possible to prevent dew condensation from occurring in the housing 100.

  As described above, the electronic apparatus 1000 according to the embodiment of the present invention includes the plurality of card slots 121, the fan unit 111, the heat generation card 170, the blank card 180, the in-casing temperature detection unit 195, and the shielding plate movable unit. 188.

  The plurality of card slots 121 are provided inside the housing 100, and each of the plurality of cards (the heat generating card 170 and the blank card 180) can be mounted so as to face each other. The fan unit 111 is provided inside the housing 100 and sends air outside the housing 100 to each of the plurality of card slots 121. The heat generating card 170 can be mounted so as to accommodate a board (electronic board 171) on which the electronic component 173 is mounted and to be inserted into and removed from the card slot 121. Further, the heat generating card 170 is configured to supply air outside the housing 100 sent to the card slot 121 by the fan unit 111 to the electronic component 173 when it is mounted in the card slot 121. The blank card 180 can be mounted so as to accommodate a substrate (dummy substrate 181) on which the electronic component 173 is not mounted and to be inserted into and removed from the card slot 121. Further, the blank card 180 has a movable shielding plate 185 that blocks air outside the housing 100 sent to the card slot 121 by the fan unit 111 when it is mounted in the card slot 121. The case internal temperature detection unit 195 detects the temperature inside the case 100. The shielding plate movable unit 188 is sent to the card slot 121 by the fan unit 111 based on the temperature inside the case 100 detected by the in-case temperature detection unit 195 and the dew point temperature inside the case 100. The movable shielding plate 185 is moved so that outside air passes through the blank card 180.

  As described above, the electronic apparatus 1000 can be mounted so that the heat generating card 170 and the blank card 180 can be inserted into and removed from the plurality of card slots 121. The heat generating card 170 is configured to supply air outside the housing 100 sent to the card slot 121 by the fan unit 111 to the electronic component 173 when mounted in the card slot 121. For this reason, air outside the housing 100 that is always sent to the card slot 121 by the fan unit 111 is supplied to the electronic component 173 in the heat generating card 170 mounted in the card slot 121. The blank card 180 has a movable shielding plate 185 that blocks air outside the housing 100 sent to the card slot 121 by the fan unit 111 when it is mounted in the card slot 121. The blank card 180 mounted in the card slot 121 can block the air outside the casing 100 sent to the card slot 121 by the fan unit 111 by the movable shielding plate 185.

  Then, the shielding plate movable unit 188 passes the air outside the housing 100 sent to the card slot 121 by the fan unit 111 through the blank card 180 based on the temperature inside the housing 100 and the dew point temperature inside the housing 100. The movable shielding plate 185 is moved so that the

  Therefore, based on the temperature inside the case 100 and the dew point temperature inside the case 100, the position where the movable shielding plate 185 blocks the air outside the case 100 sent to the card slot 121 by the fan unit 111, or The air outside the casing 100 sent to the card slot 121 by the fan unit 111 can be disposed at a position where the air passes through the blank card 180.

  Thereby, the air volume supplied to the electronic component 173 in the heat generating card 170 can be adjusted based on the temperature inside the housing 100 and the dew point temperature inside the housing 100. That is, when dew condensation can occur in the housing 100 due to the relationship between the temperature inside the housing 100 and the dew point temperature inside the housing 100, it is possible to suppress inhalation of high humidity outside air into the heat generating card 170. At this time, since the outside air with high humidity is not sucked into the heat generating card 170, the temperature in the housing 100 can be raised. As a result, the temperature inside the housing 100 becomes higher than the dew point temperature inside the housing 100, so that it is possible to prevent dew condensation from occurring inside the housing 100.

  Therefore, according to the electronic apparatus 1000 in the embodiment of the present invention, the air outside the casing 100 sent by the fan unit 111 is suppressed with a simple configuration while suppressing condensation that may be caused by environmental changes outside the casing 100. The air flow can be adjusted to an appropriate amount and supplied to the heat generating card to cool the heat generating card.

  Note that, as described above, the technique described in Patent Document 1 aims to keep the heat generating card below the recommended temperature without increasing the power consumption for cooling more than necessary. For this reason, the air volume to the heat generating card is adjusted to the minimum necessary air volume by electronic control, but various devices are loaded and the various devices have a short life. On the other hand, in the electronic apparatus 1000 according to the embodiment of the present invention, there is no configuration for adjusting the air volume to the heat generating card to the necessary minimum air volume by electronic control. Therefore, unlike the technique described in Patent Document 1, there is no problem that various devices are loaded and the various devices have a short life.

  In addition, the electronic apparatus 1000 according to the embodiment of the present invention includes an outside air temperature detector 191, an outside air humidity detector 192, and a dew point temperature detector 197. The outside air temperature detection unit 191 detects the temperature outside the housing 100. The outside air humidity detection unit 192 detects the humidity outside the housing 100. The dew point temperature detection unit 197 detects the dew point temperature inside the housing 100 based on the temperature detected by the outside air temperature detection unit 191 and the humidity detected by the outside air humidity detection unit 192.

  When the temperature inside the casing 100 detected by the casing internal temperature detection unit 195 is lower than the dew point temperature inside the casing 100 detected by the dew point temperature detection unit 197, the shielding plate movable unit 188 includes the fan unit 111. The movable shielding plate 185 is disposed at a position where air outside the casing 100 sent to the card slot 121 can be passed through the blank card 180.

  As described above, when the temperature inside the housing 100 is lower than the dew point temperature inside the housing 100, dew condensation can occur in the housing 100. At this time, the shielding plate movable unit 188 arranges the movable shielding plate 185 at a position where air outside the housing 100 sent to the card slot 121 by the fan unit 111 passes through the blank card 180. Thereby, when dew condensation can occur in the housing 100, it is possible to suppress inhalation of high humidity outside air into the heat generating card 170. At this time, since the outside air with high humidity is not sucked into the heat generating card 170, the temperature in the housing 100 can be raised. As a result, the temperature inside the housing 100 becomes higher than the dew point temperature inside the housing 100, so that it is possible to prevent dew condensation from occurring inside the housing 100.

  Further, in electronic device 1000 according to the embodiment of the present invention, in addition to the temperature inside housing 100 detected by housing temperature detection unit 195 and the dew point temperature inside housing 100, it is detected by outside air temperature detection unit 191. On the basis of the temperature, the movable shielding plate 185 is moved so that the air outside the housing 100 sent to the card slot 121 by the fan unit 111 passes through the blank card 180.

  Then, the shielding plate movable unit 188 sends the card 100 to the card slot 121 by the fan unit 111 based on the temperature inside the case 100, the dew point temperature inside the case 100, and the temperature detected by the outside air temperature detection unit 191. The movable shielding plate 185 is moved so that air outside the casing 100 to be passed through the blank card 180.

  Therefore, the movable shielding plate 185 is sent to the card slot 121 by the fan unit 111 based not only on the temperature inside the case 100 and the dew point temperature inside the case 100 but also on the temperature detected by the outside air temperature detection unit 191. It can be arranged at a position where the air outside the casing 100 is blocked or at a position where the air outside the casing 100 sent to the card slot 121 by the fan unit 111 passes through the blank card 180.

  Thereby, the air volume supplied to the electronic component 173 in the heat generating card 170 is adjusted based on the temperature inside the housing 100, the dew point temperature inside the housing 100, and the temperature detected by the outside air temperature detection unit 191. be able to. That is, when dew condensation can occur in the housing 100 due to the relationship between the temperature inside the housing 100 and the dew point temperature inside the housing 100, it is possible to suppress inhalation of high humidity outside air into the heat generating card 170. At this time, since the outside air with high humidity is not sucked into the heat generating card 170, the temperature in the housing 100 can be raised. As a result, the temperature in the housing 100 becomes higher than the dew point temperature in the housing 100, so that it is possible to prevent dew condensation from occurring in the housing 100. In addition to this, the air outside the casing 100 sent by the fan unit 111 is adjusted to an appropriate amount of air according to the temperature outside the casing 100 and supplied to the heat generating card 170 to cool the heat generating card 170. Can do.

  The electronic apparatus 1000 according to the embodiment of the present invention includes an outside air temperature detection unit 191, an outside air humidity detection unit 192, and a dew point temperature detection unit 197. The outside air temperature detection unit 191 detects the temperature outside the housing 100. The outside air humidity detection unit 192 detects the humidity outside the housing 100. The dew point temperature detection unit 197 detects the dew point temperature inside the housing 100 based on the temperature detected by the outside air temperature detection unit 191 and the humidity detected by the outside air humidity detection unit 192.

  When the temperature inside the casing 100 detected by the casing internal temperature detection unit 195 is lower than the dew point temperature detected by the dew point temperature detection unit 197, the shielding plate movable unit 188 moves the movable shielding plate 185 to the fan unit. A first process is performed in which the air outside the casing 100 sent to the card slot 121 by 111 is passed through the blank card 180.

  Further, when the outside air temperature detected by the outside air temperature detection unit 195 is higher than a predetermined temperature, the shielding plate movable unit 188 sends the movable shielding plate 185 to the card slot 121 by the fan unit 111. A second process of arranging at a position to block is performed.

  When the outside air temperature detected by the outside air temperature detection unit 195 is not higher than a predetermined temperature, the shielding plate movable unit 188 moves the movable shielding plate 185 to the card slot 121 that is sent to the card slot 121 by the fan unit 111. A third process is performed in which air is disposed at a position where air passes through the blank card 121.

  The first process is executed with priority over the second and third processes.

  As described above, when the temperature inside the housing 100 is lower than the dew point temperature inside the housing 100, dew condensation can occur in the housing 100. At this time, the shielding plate movable unit 188 arranges the movable shielding plate 185 at a position where air outside the housing 100 sent to the card slot 121 by the fan unit 111 passes through the blank card 180 as a first process. . Thereby, when dew condensation can occur in the housing 100, it is possible to suppress inhalation of high humidity outside air into the heat generating card 170. At this time, since the outside air with high humidity is not sucked into the heat generating card 170, the temperature in the housing 100 can be raised. As a result, the temperature in the housing 100 becomes higher than the dew point temperature in the housing 100, so that it is possible to prevent dew condensation from occurring in the housing 100.

  When the outside air temperature detected by the outside air temperature detection unit 195 is higher than a predetermined temperature, the shield plate movable unit 188 sends the movable shield plate 185 to the card slot 121 by the fan unit 111 as the second process. It arrange | positions in the position which blocks the air outside the housing | casing 100. FIG.

  Thereby, in the card slot 121 that accommodates the blank card 180, the air outside the casing 100 sent by the fan unit 111 is blocked by the movable shielding plate 185. On the other hand, in the card slot 121 that accommodates the heat generating card 170, the air outside the casing 100 sent by the fan unit 111 is supplied to the electronic component 173. At this time, in the card slot 121 that accommodates the blank card 180, air sent by the fan unit 111 is shielded by the movable shielding plate 185, so that most of the air sent by the fan unit 111 accommodates the heat generating card 170. It flows to 121.

  Therefore, when the outside air temperature detected by the outside air temperature sensor 186 is higher than a predetermined temperature, a large amount of wind can be flown to the card slot 121 that accommodates the heat generating card 170 in a state where the movable shielding plate 185 is closed. The cooling capacity for the card 170 can be concentrated and efficiently improved.

  When the outside air temperature detected by the outside air temperature detection unit 195 is not higher than the predetermined temperature, the shield plate movable unit 188 sends the movable shield plate 185 to the card slot 121 by the fan unit 111 as the second process. It arrange | positions in the position which allows the air outside the housing | casing 100 passed through in the blank card 121.

  Thereby, in the card slot 121 that accommodates the blank card 180, the air outside the casing 100 sent by the fan unit 111 passes through the blank card 180 without being shielded by the movable shielding plate 185. On the other hand, in the card slot 121 that houses the heat generating card 170, the air outside the casing 100 sent by the fan unit 111 is supplied to the electronic component 173. At this time, in the blank card 180, the resistance to the air sucked from the intake unit 130 (ventilation resistance) is smaller than the heat generation card 170 because the electronic component 173 is not accommodated.

  For this reason, in the card slot 121 that accommodates the blank card 180, the air outside the casing 100 sent by the fan unit 111 is larger than the air volume that passes through the card slot 121 that accommodates the heat generating card 170. Therefore, the air volume of the air flowing into the card slot 121 that accommodates the heat generating card 170 can be suppressed.

  Therefore, when the outside air temperature detected by the outside air temperature sensor 186 is lower than the predetermined temperature T, a large amount of air can flow to the card slot 121 that accommodates the blank card 180 with the movable shielding plate 185 opened. The air volume to the card slot 121 that accommodates the heat generating card 170 can be reduced. As a result, it is possible to prevent the heat generating card 170 from being excessively cooled and to keep the heat.

  The first process is executed with priority over the second and third processes. For this reason, in particular, when condensation can occur in the housing 100, the first process for suppressing condensation is preferentially executed. As a result, regardless of whether or not the outside air temperature detected by the outside air temperature sensor 186 is lower than the predetermined temperature T, it is possible to reliably prevent dew condensation from occurring in the housing 100.

  In the electronic apparatus 1000 according to the embodiment of the present invention, the in-casing temperature detection unit 195 includes the temperature detected by the outside air temperature detection unit 191, the number of heat generating cards 170 and blank cards 180 mounted in the card slot 121. Based on the above, the temperature inside the casing 100 is detected. Thereby, the temperature inside the housing 100 can be easily estimated and calculated.

  In electronic device 1000 according to the embodiment of the present invention, fan unit 111 is provided on the vertically upper side of the plurality of card slots 121, and is a housing from the vertically lower side of the plurality of card slots 121 toward the vertically upper side. Send 100 out of air.

  Under a normal indoor environment, the air temperature increases as it goes upward in the vertical direction G, and the air temperature decreases as it goes downward in the vertical direction G. Therefore, the heat generating card 170 can be cooled more efficiently by the fan unit 111 sending the air outside the casing 100 from the vertically lower side to the vertically upper side of the plurality of card slots 121.

  In the above embodiment, it has been described that the movable shielding plate 185 is disposed at the position of α1 or α2. However, the movable shielding plate 185 may be disposed between α1 and α2. In this case, the movable shielding plate 185 may have a plurality of arrangement positions between α1 and α2.

  The present invention has been described above based on the embodiment. The embodiment is an exemplification, and various modifications, increases / decreases, and combinations may be added to the above-described embodiments without departing from the gist of the present invention. It will be understood by those skilled in the art that modifications to which these changes, increases / decreases, and combinations are also within the scope of the present invention.

DESCRIPTION OF SYMBOLS 100 Case 110 Fan mounting unit 111 Fan part 120 Card mounting unit 121 Card slot 130 Air intake unit 140 Fan unit side exhaust opening 150 Card mounting unit side exhaust opening 160 Card mounting unit side air intake opening 170 Heat generation card 171 Electronic board 172 Front protective plate 172a Mounting screw 173 Electronic component 180 Blank card 181 Dummy substrate 182 Front protective plate 182a Mounting screw 185 Movable shielding plate 186 Outside air temperature sensor 187 Outside air humidity sensor 188 Shielding plate movable portion 190 Movable shielding plate control portion 191 Outside air temperature sensor 192 Outside air humidity sensor 193 Cooling and heat retention control determination unit 194 Reference temperature storage memory 195 Housing temperature detection unit 196 Temperature rise value storage memory 197 Dew point temperature detection unit 198 Shield Cover plate opening / closing instruction unit 1000 Electronic device 2000 Device housing 3000 Air conditioner

Claims (5)

A plurality of card slots provided inside the housing and capable of being mounted so that each of the plurality of cards face each other;
A fan unit that is provided inside the housing and sends air outside the housing to each of the plurality of card slots;
Air outside the housing can be mounted so as to accommodate a board on which electronic components are mounted and can be inserted into and removed from the card slot, and is sent to the card slot by the fan unit when mounted in the card slot. A heat generating card configured to supply the electronic component to the electronic component;
Air that is mounted on the card slot so that it can be inserted into and removed from the card slot and that is not mounted with the electronic component is sent to the card slot by the fan unit when the board is mounted on the card slot. A blank card having a movable shielding plate for shielding,
A temperature detector inside the housing that detects the temperature inside the housing;
Based on the temperature inside the case detected by the temperature detection part inside the case and the dew point temperature inside the case, the air outside the case sent to the card slot by the fan part is inside the blank card. A shielding plate movable part that arranges the movable shielding plate at a position to be passed through at
An outside air temperature detector for detecting the temperature outside the housing;
An outside air humidity detector for detecting humidity outside the housing;
A dew point temperature detecting unit for detecting a dew point temperature inside the housing based on the temperature detected by the outside air temperature detecting unit and the humidity measured by the outside air humidity detecting unit;
When the internal temperature detected by the internal temperature detector is lower than the internal dew point detected by the dew point temperature detector, the shield plate movable unit is the air outside of the housing in a position to let through in the blank card, the movable shielding plate you place an electronic device to be sent to the card slot. A plurality of card slots provided inside the housing and capable of being mounted so that each of the plurality of cards face each other;
A fan unit that is provided inside the housing and sends air outside the housing to each of the plurality of card slots;
Air outside the housing can be mounted so as to accommodate a board on which electronic components are mounted and can be inserted into and removed from the card slot, and is sent to the card slot by the fan unit when mounted in the card slot. A heat generating card configured to supply the electronic component to the electronic component;
Air that is mounted on the card slot so that it can be inserted into and removed from the card slot and that is not mounted with the electronic component is sent to the card slot by the fan unit when the board is mounted on the card slot. A blank card having a movable shielding plate for shielding,
A temperature detector inside the housing that detects the temperature inside the housing;
Based on the temperature inside the case detected by the temperature detection part inside the case and the dew point temperature inside the case, the air outside the case sent to the card slot by the fan part is inside the blank card. A shielding plate movable part that arranges the movable shielding plate at a position to be passed through at
An outside air temperature detection unit for detecting the temperature outside the housing,
In addition to the temperature inside the casing and the dew point inside the casing detected by the casing internal temperature detection section , the shielding plate movable section is based on the temperature detected by the outside air temperature detection section, the air in the housing outer sent to the card slot so cause through in the blank card, the movable shielding plate Ru electronic device is moved by the fan unit. An outside air humidity sensor for detecting humidity before Kikatamitai external,
A dew point temperature detecting unit for detecting a dew point temperature inside the housing based on the temperature detected by the outside air temperature detecting unit and the humidity measured by the outside air humidity detecting unit;
When the internal temperature detected by the internal temperature detector is lower than the internal dew point detected by the dew point temperature detector, the shield plate movable unit is Performing a first process of arranging the movable shielding plate at a position where air outside the casing sent to the card slot passes through the blank card;
When the temperature detected by the outside air temperature detection unit is higher than a predetermined temperature, the shield plate movable unit moves the movable shield plate to a position where the fan unit blocks the air outside the casing sent to the card slot. Perform a second process to place,
When the temperature detected by the outside air temperature detection unit is not higher than the predetermined temperature, the shielding plate movable unit allows the outside of the housing, which is sent to the card slot by the fan unit, to pass through the blank card. Performing a third process of placing the movable shielding plate at a position;
The electronic device according to claim 2 , wherein the first process is executed with priority over the second and third processes. The internal temperature detection unit detects the internal temperature based on the temperature detected by the outside air temperature detection unit and the number of the heat generating card and the blank card mounted in the card slot. electronic device according to any one of claims 1 to 3. The fan unit, the provided vertically upper side of the plurality of card slots, one toward the vertically lower side of said plurality of card slots vertically upward side of the claims 1-4 to send the air in the housing outer 1 The electronic device according to item.

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