JP6336240B2 - 保護素子 - Google Patents
保護素子 Download PDFInfo
- Publication number
- JP6336240B2 JP6336240B2 JP2012286472A JP2012286472A JP6336240B2 JP 6336240 B2 JP6336240 B2 JP 6336240B2 JP 2012286472 A JP2012286472 A JP 2012286472A JP 2012286472 A JP2012286472 A JP 2012286472A JP 6336240 B2 JP6336240 B2 JP 6336240B2
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- JP
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- melting point
- fuse element
- metal layer
- point metal
- alloy
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- 230000001681 protective effect Effects 0.000 title description 3
- 239000002184 metal Substances 0.000 claims description 126
- 229910052751 metal Inorganic materials 0.000 claims description 126
- 238000002844 melting Methods 0.000 claims description 89
- 230000008018 melting Effects 0.000 claims description 89
- 229910045601 alloy Inorganic materials 0.000 claims description 38
- 239000000956 alloy Substances 0.000 claims description 38
- 239000003870 refractory metal Substances 0.000 claims description 11
- 229910052718 tin Inorganic materials 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 6
- 229910020830 Sn-Bi Inorganic materials 0.000 claims description 5
- 229910020888 Sn-Cu Inorganic materials 0.000 claims description 5
- 229910018728 Sn—Bi Inorganic materials 0.000 claims description 5
- 229910019204 Sn—Cu Inorganic materials 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 20
- 238000007747 plating Methods 0.000 description 17
- 230000002093 peripheral effect Effects 0.000 description 16
- 238000000034 method Methods 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 229910016334 Bi—In Inorganic materials 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 229910020836 Sn-Ag Inorganic materials 0.000 description 3
- 229910020994 Sn-Zn Inorganic materials 0.000 description 3
- 229910020988 Sn—Ag Inorganic materials 0.000 description 3
- 229910009069 Sn—Zn Inorganic materials 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 229910000521 B alloy Inorganic materials 0.000 description 2
- 229910001152 Bi alloy Inorganic materials 0.000 description 2
- 229910016331 Bi—Ag Inorganic materials 0.000 description 2
- 229910020630 Co Ni Inorganic materials 0.000 description 2
- 229910002440 Co–Ni Inorganic materials 0.000 description 2
- 229910017932 Cu—Sb Inorganic materials 0.000 description 2
- 229910000927 Ge alloy Inorganic materials 0.000 description 2
- 229910017709 Ni Co Inorganic materials 0.000 description 2
- 229910003267 Ni-Co Inorganic materials 0.000 description 2
- 229910003262 Ni‐Co Inorganic materials 0.000 description 2
- 229910020882 Sn-Cu-Ni Inorganic materials 0.000 description 2
- 229910020935 Sn-Sb Inorganic materials 0.000 description 2
- 229910008757 Sn—Sb Inorganic materials 0.000 description 2
- -1 Zn-Fe Alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910020598 Co Fe Inorganic materials 0.000 description 1
- 229910002519 Co-Fe Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910020900 Sn-Fe Inorganic materials 0.000 description 1
- 229910019343 Sn—Cu—Sb Inorganic materials 0.000 description 1
- 229910019314 Sn—Fe Inorganic materials 0.000 description 1
- 229910018956 Sn—In Inorganic materials 0.000 description 1
- 229910007567 Zn-Ni Inorganic materials 0.000 description 1
- 229910007564 Zn—Co Inorganic materials 0.000 description 1
- 229910007614 Zn—Ni Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/06—Fusible members characterised by the fusible material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/027—Thermal properties
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/08—Fusible members characterised by the shape or form of the fusible member
- H01H85/11—Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Fuses (AREA)
Description
図1および図2に示す本発明のヒューズ素子を製造した。但し、ヒューズエレメント40を有する周辺貫通開口部14は、周状に等間隔で8つ形成した。
スズメッキ処理に代えて、それぞれ、Sn−Cu(Cu 4重量%)メッキ処理、およびSn−Bi(Bi 16重量%)メッキ処理を行うこと以外は、実施例1と同様にして、実施例2〜3のヒューズ素子を得た。
スズメッキ処理に代えて、ニッケルメッキ処理を行い、該ニッケルメッキ処理により形成されるニッケルメッキ層の厚さが、それぞれ、4.5、6.5、および8.5μmであること以外は、実施例1と同様にして、比較例1〜3のヒューズ素子を得た。
実施例1〜3および比較例1〜3のヒューズ素子に、一方の導電性金属層22から他方の導電性金属層24に、下記表2に示す電流を流し、10分間通電した際にヒューズエレメントがブローしない電流値を調査した(60Vdc設定)。それぞれにおいてヒューズエレメントがブロー(溶断)しない最大電流値を定格容量とした。結果を表2に示す。なお、表中「○」は10分間ブローしなかったことを示し、「×」は10分内にブローしたことを示し、「−」はデータなしを示す。
実施例1〜3および比較例1〜3のヒューズ素子に、一方の導電性金属層22から他方の導電性金属層24に、それぞれの定格容量の150%、200%、300%、および400%の過剰電流を流し、電流遮断時間(即ち、ヒューズエレメントがブローするまでの時間)を測定した。結果を下記表3に示す。
16…層状要素、18,20…主表面、22,24…導電性金属層、
26,28…別の導電性金属層、30…内側周、34…外側周、36…本体部分、
38…側面、40…ヒューズエレメント、41…高融点金属層、42…低融点金属層
Claims (5)
- 少なくとも1つの高融点金属により形成される高融点金属層および少なくとも1つの低融点金属により形成される低融点金属層を有して成るヒューズエレメントを有するヒューズ素子であって、前記ヒューズエレメントの各金属層が積層され、各金属層の電流の流れ方向に沿った長さが実質的に等しく、前記少なくとも1つの高融点金属がNiであり、前記少なくとも1つの低融点金属がSn、Sn−Cu合金またはSn−Bi合金であり、高融点金属層の厚みの総和と低融点金属層の厚みの総和との比が、1:100〜2:1であることを特徴とする、ヒューズ素子。
- 1つの高融点金属層および1つの低融点金属層が積層されて成るヒューズエレメントを有して成る、請求項1に記載のヒューズ素子。
- 2つの低融点金属層の間に1つの高融点金属層が位置するように積層されて成るヒューズエレメントを有して成る、請求項1または2に記載のヒューズ素子。
- 2つの高融点金属層の間に1つの低融点金属層が位置するように積層されて成るヒューズエレメントを有して成る、請求項1〜3のいずれかに記載のヒューズ素子。
- 高融点金属層の厚みの総和が、0.1〜10μmであり、低融点金属層の厚みの総和が、0.1〜20μmである、請求項1〜4のいずれかに記載のヒューズ素子。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012286472A JP6336240B2 (ja) | 2012-12-28 | 2012-12-28 | 保護素子 |
CN201380068310.0A CN104871283A (zh) | 2012-12-28 | 2013-12-20 | 保护元件 |
KR1020157020106A KR20150102081A (ko) | 2012-12-28 | 2013-12-20 | 보호 소자 |
PCT/JP2013/084222 WO2014103916A1 (ja) | 2012-12-28 | 2013-12-20 | 保護素子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012286472A JP6336240B2 (ja) | 2012-12-28 | 2012-12-28 | 保護素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014130685A JP2014130685A (ja) | 2014-07-10 |
JP6336240B2 true JP6336240B2 (ja) | 2018-06-06 |
Family
ID=51021000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012286472A Active JP6336240B2 (ja) | 2012-12-28 | 2012-12-28 | 保護素子 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6336240B2 (ja) |
KR (1) | KR20150102081A (ja) |
CN (1) | CN104871283A (ja) |
WO (1) | WO2014103916A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6756490B2 (ja) * | 2016-02-19 | 2020-09-16 | デクセリアルズ株式会社 | 電流ヒューズ |
CN107644797A (zh) * | 2016-07-21 | 2018-01-30 | 东莞华恒电子有限公司 | 保护元件 |
CN113334874B (zh) * | 2021-05-28 | 2023-05-02 | 西安交通大学 | 一种高强低熔点层状双金属互嵌复合材料及其制备工艺 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1128100A (en) * | 1979-03-21 | 1982-07-20 | Vojislav Narancic | Electric fuses employing composite metal fuse elements |
JP2002042632A (ja) * | 2000-07-25 | 2002-02-08 | Matsuo Electric Co Ltd | 超小型ヒューズ及びその製造方法 |
JP2004185960A (ja) * | 2002-12-03 | 2004-07-02 | Kamaya Denki Kk | 回路保護素子とその製造方法 |
JP4207686B2 (ja) * | 2003-07-01 | 2009-01-14 | パナソニック株式会社 | ヒューズ、それを用いたパック電池およびヒューズ製造方法 |
KR20080041636A (ko) * | 2005-08-04 | 2008-05-13 | 타이코 일렉트로닉스 레이켐 케이. 케이. | 전기 복합 소자 |
US20090027821A1 (en) * | 2007-07-26 | 2009-01-29 | Littelfuse, Inc. | Integrated thermistor and metallic element device and method |
WO2011111700A1 (ja) * | 2010-03-09 | 2011-09-15 | 北陸電気工業株式会社 | チップヒューズ |
-
2012
- 2012-12-28 JP JP2012286472A patent/JP6336240B2/ja active Active
-
2013
- 2013-12-20 KR KR1020157020106A patent/KR20150102081A/ko not_active Application Discontinuation
- 2013-12-20 CN CN201380068310.0A patent/CN104871283A/zh active Pending
- 2013-12-20 WO PCT/JP2013/084222 patent/WO2014103916A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR20150102081A (ko) | 2015-09-04 |
WO2014103916A1 (ja) | 2014-07-03 |
JP2014130685A (ja) | 2014-07-10 |
CN104871283A (zh) | 2015-08-26 |
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