JP6312814B2 - Electronic circuit assembly equipment - Google Patents

Description

  The present invention relates to an electronic circuit assembly apparatus for assembling an electronic circuit by assembling an electronic component on a circuit board.

  Patent Documents 1 and 2 describe an electronic circuit assembly apparatus including a rotary head that receives an electronic component supplied from a tape feeder at a receiving position and mounts the electronic component at a predetermined position on a substrate at a mounting position. Yes. In this electronic circuit assembly apparatus, a correction position is provided between the receiving position and the mounting position of the rotary head, and the relative position of the electronic component with respect to the suction nozzle is corrected by a dedicated position correction apparatus. As a result, the electronic component can be accurately mounted at a predetermined position on the circuit board.

JP 2000-133998 A JP 62-60299 A

  An object of the present invention is to improve the positional accuracy of an electronic component relative to a circuit board in an electronic circuit assembly apparatus that picks up an electronic component accommodated in a tray and assembles an electronic circuit.

Means and effects for solving the problem

In the electronic circuit assembly apparatus according to the present invention, the electronic components accommodated in the tray are positioned inside the tray.
For example, when the tray is a package tray, the electronic components are not necessarily located at predetermined intervals. For this reason, there are cases where the electronic component accommodated in the tray cannot be picked up at an accurate position, or the electronic component cannot be picked up. On the other hand, it is possible to move the electronic components accommodated in the package tray to a dedicated tray. However, in this case, the number of work steps increases, which is not desirable.
Therefore, in the electronic circuit assembling apparatus according to the present invention, the electronic components are positioned inside the package tray. As a result, the electronic component can be picked up accurately and reliably by the component holding head, and the positional accuracy of the electronic component with respect to the circuit board can be improved.

It is a perspective view which shows the electronic circuit assembly apparatus which concerns on Example 1 of this invention. It is a top view (schematic diagram) which shows the components supply apparatus of the said electronic circuit assembly apparatus. (a) It is a perspective view which shows the component mounting apparatus of the said electronic circuit assembly apparatus. (b) It is a front view which shows the principal part of the said component mounting apparatus. It is a top view of the tray contained in the said component supply apparatus. (a) State before component position correction, (b) State after component position correction It is a block diagram which shows notionally the control apparatus of the said electronic circuit assembly apparatus. It is a flowchart which shows a part of work head control program memorize | stored in the memory | storage part of the said control apparatus. (a)-(c) It is an operation | movement figure of the chuck | zipper of a working head by execution of the said working head control program. It is a front view which shows the suction nozzle of the working head of the component mounting apparatus contained in the electronic circuit assembly apparatus which concerns on Example 2 of this invention, and is an operation | movement figure of a suction nozzle {(a)-(c)}.

Mode for carrying out the present invention

  Hereinafter, an electronic circuit assembly apparatus according to an embodiment of the present invention will be described with reference to the drawings.

As shown in FIG. 1, the electronic circuit assembly apparatus according to the first embodiment includes (i) an assembly apparatus main body 10, (ii) a board transfer holding apparatus 12, (iii) a component supply apparatus 14, and (iv) a component mounting apparatus 16. Etc.
The substrate transport / holding device 12 transports and holds the circuit board P (hereinafter abbreviated as “substrate P”) in a horizontal posture. In FIG. 1, x is the direction in which the substrate P is conveyed by the substrate conveyance holding device 12, y is the width direction of the substrate P, and z is the thickness direction of the substrate P, that is, the vertical direction of the electronic circuit assembly apparatus. These x direction, y direction, and z direction are orthogonal to each other.

  The component supply device 14 includes a tray-type component supply device that supplies electronic components (hereinafter, abbreviated as components) mounted on the board P. 2, the tray-type component supply device refers to a package tray (a tray packed with components stored therein) in which a plurality of components s (see FIGS. 3 and 4 and the like) are stored. And a tray moving device 22 for storing a plurality of 18, a tray moving device 22, and the like, and components are supplied using the package tray 18. The tray accommodating device 20 includes a stocker 24 that can accommodate a plurality of stages of the package tray 18 in the vertical direction, a stocker lifting device 26, and the like. The stocker 24 is provided with a plurality of tray accommodating portions 28 at predetermined intervals in the vertical direction, and each of the tray accommodating portions 28 is provided with a pair of internal belt conveyors 30a and 30b extending in the y direction. The package tray 18 is supported directly or via the pallet 32 on the pair of internal belt conveyors 30 a and 30 b provided in each of the tray accommodating portions 28. When the size of the package tray 18 deviates from the standard, it is supported via the pallet 32, and the package tray 18 is fixed at a predetermined position of the pallet 32 by a fixing device (not shown). The stocker elevating device 26 elevates and lowers the stocker 24. The stocker elevating device 26 includes a timing belt and a belt driving motor, and the stocker 24 is engaged with the timing belt so as to be movable up and down integrally.

The tray moving device 22 moves the package tray 18 to a predetermined component supply position outside the tray accommodating device 20. The tray moving device 22 includes a pair of external belt conveyors 34 a and 34 b extending in the y direction outside the tray accommodating device 20. The pair of external belt conveyors 34a, 34b and the pair of internal belt conveyors 30a, 30b have substantially the same distance in the x direction. The tray moving device 22 includes a supply position sensor 36. When the package tray 18 or the pallet 32 is detected by the supply position sensor 36, the external belt conveyors 34a and 34b are stopped.
In the component supply device 14, the package tray 18 containing the component s determined based on the production program or the like is selected, and the height of the selected package tray 18 facing the tray moving device 22 is controlled by the stocker lifting device 26. Is lifted and stopped. The package tray 18 or the pallet 32 is moved in the y direction by driving the pair of internal conveyor belts 30a and 30b and the pair of external conveyor belts 34a and 34b. It is moved to the specified position and stopped. At the supply position, the component s accommodated in the package tray 18 is picked up by the component mounting device 16.
As shown in FIGS. 4A, 4B, etc., the package tray 18 includes a plurality of concave portions Q formed regularly and continuously, and each of the concave portions Q accommodates one component s. It has been done. However, since it is not a dedicated tray, as shown in FIG. 4A, the parts s previously stored in each of the recesses Q are not necessarily in the same relative position with each other, and the parts s in each of the recesses Q are not necessarily located. The positional accuracy of each is low.

  The component mounting device 16 picks up the component s supplied by the component supply device 14 and places it on a predetermined position of the substrate P held by the substrate transfer holding device 12. The component mounting device 16 includes two work heads 41 and 42 and a work head moving device 43 as shown in FIG. The work head moving device 43 includes an x-axis moving device 44, a y-axis moving device 45, and z-axis moving devices 46 and 47, as shown in FIGS. The y-axis moving device 45 is engaged with (a) a linear motor 50 as a drive source, (b) a pair of y-axis guides 52a and 52b extending in the y direction, and (c) a pair of y-axis guides 52a and 52b. The y-axis slider 54 and the like are included. The x-axis moving device 44 is provided on the y-axis slider 54, and (a) an x-axis motor 56 as a driving source, (b) a pair of x-axis guides 58a, 58b, (c ) An x-axis slider 60 engaged with a pair of x-axis guides 58a and 58b, and (d) a ball as a driving force transmitting portion that converts the rotation of the x-axis motor 56 into a linear motion and transmits it to the x-axis slider 60. A screw mechanism 62 and the like are included. The z-axis moving devices 46 and 47 are provided on the x-axis slider 60, and extend in the z direction (a) z-axis motors 62 and 63 (see FIG. 5) as drive sources, respectively, and (b) not shown. A pair of z-axis guides, (c) z-axis sliders 64 and 65 respectively engaged with the pair of z-axis guides, and (d) the rotation of the z-axis motors 62 and 63 is converted into a linear movement to convert the z-axis A driving force transmission unit (not shown) that transmits to the sliders 64 and 65 is included.

The work heads 41 and 42 are held so as to be movable integrally with the z-axis sliders 64 and 65, respectively, and can be moved integrally in the x and y directions and individually in the z direction. Yes.
Further, each of the work heads 41 and 42 may be provided with, for example, a chuck 80 shown in FIG. The chuck 80 is a component holding tool that holds and holds a component, and includes a pair of claws 82a and 82b that can approach and separate from each other. The pair of claws 82a and 82b can be opened and closed by a driving source such as an air cylinder. As described above, the work heads 41 and 42 including the chuck 80 can be referred to as a component holding head. The work heads 41 and 42 may be heads that perform the same work or heads that perform different work. For example, one of the work heads 41 and 42 can be a component holding head, and the other can be an application head provided with a dispenser for applying an adhesive. Reference numeral 84 denotes a camera which can be moved in the x, y and z directions integrally with the work head 41.

  As shown in FIG. 5, the electronic circuit assembly apparatus includes a main control device 90 mainly composed of a computer, a board transfer control unit 92, a component supply control unit 94, a component mounting control unit 96, and the like. The main controller 90 is connected to the board transfer controller 92, the component supply controller 94, and the component mounting controller 96 in a state where they can communicate with each other and to the input device 98. The substrate transfer device 12, the component supply device 14, the component mounting device 16 and the like are controlled based on commands from the main control device 90, the substrate transfer control unit 92, the component supply control unit 94, the component mounting control unit 96 and the like, respectively. .

In the electronic circuit assembly apparatus configured as described above, each of the plurality of components s accommodated in each of the plurality of recesses Q of the package tray 18 at the supply position is caused by the chuck 80 of the work heads 41 and 42, respectively. It is picked up, moved to a predetermined position on the substrate P, and placed. In this case, the information regarding the position of each of the plurality of components s accommodated in the package tray 18, in other words, the information regarding the pickup position of each of the plurality of components s by the chuck 80 is input via the input device 98 in advance. . Since the position of the component s is determined by the position of the concave portion Q formed in the package tray 18, information on the position of the concave portion Q (for example, the shape such as the size of the concave portion Q, the concave portion Q such as the interval in the x and y directions). Information on the position of the part s can be acquired based on the formation rule of the
However, since the positional accuracy of each of the components s in each of the recesses Q is low even based on the information on the location of the components s acquired based on the information regarding the location of the recess Q, the chuck 80 determines the components s in advance. In some cases, it was not possible to accurately grip the part. Further, the position of the part s may be shifted beyond the opening width of the pair of claws 82 a and b of the chuck 80, and the part s may not be gripped by the chuck 80. Furthermore, when the component holding tool is a suction nozzle, at least a part of the opening may be detached from the component s, causing air to leak and picking up. On the other hand, a dedicated tray can be manufactured for the component s, and the component s can be transferred from the package tray 18 to the dedicated tray. However, the manufacturing of the dedicated tray takes a long time and is expensive. In addition, the number of work steps increases due to the transfer to a dedicated tray. Although it is possible to capture the parts s in each of the recesses Q of the package tray 18 with a camera and correct the pickup position by the chuck 30 based on the image data, it takes a long time to process the image data.

Therefore, in the present embodiment, in each of the plurality of recesses Q of the package tray 18, each of the parts s accommodated in advance is moved to the reference position A shown in FIG. If the relative positions of the parts s in each of the plurality of recesses Q are the same, information on the position of the part s can be accurately acquired based on the information on the position of the recess Q.
The reference position may be any position as long as it is inside the recess Q, but it is desirable that the position of the component s be a position that is accurately determined using components (for example, side surfaces) of the recess Q. . The reference position can be determined by the shape of the recess Q and the shape of the part s. For example, when the concave portion Q is composed of a bottom surface B and four side surfaces h1 to 4 and the opening in a plan view has a generally rectangular shape, and the component s has a generally rectangular parallelepiped shape, A position where the part s contacts the two side surfaces h1, 2 adjacent to each other of the recess Q can be set as the reference position A. As described above, if the position where the component s is in contact with two adjacent side surfaces of the recess Q is used as the reference position, the component s may be formed in an R shape or a cylindrical shape. It is possible to accurately determine the position of s in the recess Q. In this embodiment, making the position of the part s the reference position in each of the recesses Q, that is, moving the part s to reach the reference position is referred to as correcting the position of the part s.
The reference position may be a position determined using the corner Qc of the recess Q, or a position determined based on the corner Qc and at least one side surface h1 constituting the corner Qc.

  In the present embodiment, the position of the component s in each of the recesses Q is individually corrected using a chuck 80 as a component holding tool. Normally, the component supply device 14 is not provided with a device capable of correcting the position of the component s in each of the plurality of recesses Q formed in the package tray 18. Therefore, it is appropriate to use the chuck 80 that is a component of the component mounting device 16.

The position correction and pickup of the component s are performed by executing a work head control program represented by the flowchart of FIG.
In step 1 (hereinafter abbreviated as S1; the same applies to other steps), the position of the component s in the recess Q is corrected. As shown in FIGS. 4A, 4B, 7A, and 7B, after the chuck 80 is moved in the x direction from the side surface h4 toward the side surface h2, the side surface h3 is changed to the side surface h1. Moved in the y direction. Accordingly, the part s is pushed by the claw 82 a of the chuck 80, moved in the x direction and the y direction inside the recess Q, and reaches the reference position A. In S2, the component s is picked up by the chuck 80. As shown in FIG. 7C, the chuck 80 is moved based on the information regarding the position of the component s, the component s is picked up, moved to a predetermined position on the substrate P, and placed. In S3, it is determined whether or not the mounting of a predetermined set number of parts s has been completed. If not, the process returns to S1 and is moved to the next recess Q, hereinafter S1. ˜3 is repeatedly executed. When the mounting of the set number of parts s is completed, the determination in S3 is YES, and the mounting of the parts s accommodated in the package tray 18 is ended.

Thus, in this embodiment, each of the parts s previously stored in each of the recesses Q of the package tray 18 is individually moved to the reference position. Accordingly, the relative positions of the parts s in each of the recesses Q can be made the same, and the position of each of the parts s can be corrected to a position determined by information regarding the position of the recess Q. As a result, the chuck 80 is moved based on the information on the position of the component s (information acquired based on the information on the position of the concave portion Q), so that the component s can be picked up reliably and accurately. And the positional accuracy of the component s on the board P can be improved.
Since the chuck 80 not only mounts the component s but also corrects the position, it is necessary to provide a dedicated position correcting device for correcting the position of the component s as described in Patent Documents 1 and 2. Accordingly, an increase in the number of parts can be avoided, and an increase in cost can be avoided.
Furthermore, since the position correction and the pick-up for mounting are continuously performed individually for each of the plurality of parts s by the chuck 80, all of the plurality of parts s are corrected after the position correction is performed for the plurality of parts s. Compared with the case where the parts s are picked up in order, the time required for position correction can be shortened and the working time can be shortened.
Further, since the package tray 18 can be used as it is, it is not necessary to manufacture a dedicated tray and transfer the component s to the dedicated tray. As a result, the manufacturing time for the dedicated tray is not required, and the manufacturing cost is not required. In addition, an increase in work steps can be avoided, and the time required for assembling the electronic circuit can be shortened.

In this embodiment, the work heads 41 and 42 provided with the chuck 80, the part storage control unit 96 for storing S1 of the work head control program represented by the flowchart of FIG. 6, the part to be executed, the work head moving device A position correction device and a positioning device are configured by the component holding head moving device 43 as the component 43. Among them, the component moving part in the individual recess is constituted by the work head moving device 43 and the like, and the head control part and the head movement control part are constituted by the part storing S1 of the part mounting control part 96 and the part to execute.
It should be noted that the work head control program can be stored in the main control device 90 and executed. Further, S1 and S2 in the flowchart of FIG. 6 can be executed by different programs, and the program including S1 can be stored and executed in the component supply control unit 94. it can.

In the present embodiment, as shown in FIG. 8A, the package tray 110 is formed with a plurality of recesses Qa regularly and continuously, and a part sa is accommodated in each of the recesses Qa. In the package tray 110, the recess Qa is deep with respect to the component sa. Therefore, it is difficult to pick up the part sa by the chuck.
On the other hand, in the second embodiment, suction nozzles 120 for picking up components by suction are attached to the work heads 41 and 42. In this embodiment, as shown in FIG. 8 (a), the component sa is picked up (raised) by the suction nozzle 120 for position correction, and is standardized in the x and y directions inside the recess Qa. It is moved to the position and placed on the bottom surface of the recess Qa (lowered) as shown in FIG. Next, as shown in FIG. 8C, the suction nozzle 120 is moved based on the information on the position of the component sa, and the component sa is picked up for mounting.
Thus, since the component sa is picked up after being moved to the reference position, the position accuracy of the component sa relative to the substrate P can be improved by the suction nozzle 120. When the position of the part sa is corrected, the part sa can be slid in the x direction and the y direction without lifting the part sa.
In the first embodiment, the position of the component s is corrected by the claws 82a and 82b of the chuck 80. Similarly, the position of the component s is moved by the side portion of the suction nozzle 120 to adjust the position. It can also be corrected.

Further, in the first and second embodiments, the case where one component is accommodated in one recess of the package tray has been described. However, even when a plurality of components are accommodated in one recess, the suction is performed. It is possible to pick up while moving to a reference position in order by a nozzle or the like.
Furthermore, in the above-described embodiment, the position correction and pick-up of the components are continuously performed for each component, in other words, for each concave portion. It is also possible to pick up one by one after correcting the position of all the parts accommodated in the container. In this case, the component position correction may be performed using a jig provided in the component supply device 14.
In addition, the component s in each of the recesses Q is imaged in the package tray 18, the deviation of the component s from the reference position A is acquired based on the image data, the position is corrected when the deviation is large, and the deviation is small. Can also be left out of position correction.
Further, in each of the above embodiments, the case where the position of the component s is corrected using a component holding tool such as a chuck or a suction nozzle has been described, but the present invention is not limited to this. For example, a rod-shaped member extending in the z direction is attached to a working head or a component of a z-axis moving device that can move integrally with the working head, and the position of the part s is corrected using the rod-shaped member. can do. When the rod-like member is attached to the work head, the work head is a part holding head having a part holding tool, but not having a part holding tool (for example, a working head having a dispenser). May be. In these cases, the position correction device is constituted by a work head provided with a rod-shaped member, a work head moving device, and the like. On the other hand, when a rod-shaped member extending in the z direction is attached to the z-axis moving device, the position correcting device is configured by the rod-shaped member, the work head moving device as the rod-shaped member moving device, and the like. Note that the rod-shaped member can be provided so as to be extendable and retractable in order to avoid interference with a component holding tool, a dispenser and the like.
Further, the electronic component accommodated in the package tray can be applied to a lead component composed of a lead wire and a component main body or a component not provided with a lead wire.
In addition to the above-described embodiments, the present invention can be implemented in variously improved and modified forms.

  14: Component supply device 16: Component mounting device 18: Package tray 41, 42: Work head 80: Chuck 82: Claw 120: Suction nozzle

Claims (8)

An electronic circuit assembling apparatus that assembles an electronic circuit by picking up a plurality of components accommodated in a one-to-one correspondence with each of a plurality of concave portions of a tray at a predetermined position and mounting the picked up components on a circuit board. And
A component mounting device including a component holding head including a component holding tool capable of holding each of the plurality of components, and a holding head moving device that moves the component holding head;
Position correction for correcting the position of each of the at least one correction target parts by moving at least one correction target part of the plurality of parts to a predetermined reference position in a corresponding recess. Including the device,
The position correcting device controls the component mounting device, so that each of the at least one component to be corrected is applied to the component holding tool within the corresponding recess. It is moved to the reference position, which is a position that contacts both of the side surfaces,
After the position correction is performed for each of the at least one correction target component by the position correction device, the components corresponding to the at least one correction target component are picked up by the component holding tool, respectively, and the circuit board. An electronic circuit assembly apparatus, wherein the electronic circuit assembly apparatus is attached to the electronic circuit assembly. The electronic circuit assembly apparatus according to claim 1, wherein the component holding tool is a chuck that grips the component or a nozzle that sucks the component.   The position correction device causes the component holding tool to abut on each of the at least one correction target component without causing the component holding tool to grip or attract each of the at least one correction target component, The electronic circuit assembly apparatus according to claim 1, wherein each of the at least one correction target component is moved to the reference position by being moved. The electronic circuit assembly apparatus includes a camera that can move integrally with the component holding head,
  The position correction device causes the component holding tool to move each of the at least one correction target component to the reference position without causing the camera to image the at least one correction target component of the tray. The electronic circuit assembly apparatus according to claim 1. After the position correction device causes the component holding tool to abut each of the at least one component to be corrected on one side surface of the two side surfaces adjacent to each other inside each of the plurality of recesses. The electronic circuit assembly apparatus according to claim 1, wherein the electronic circuit assembly apparatus is moved to the reference position by being brought into contact with the other side surface. The at least one correction target component is a plurality of components housed in a one-to-one correspondence with each of the plurality of recesses of one tray.
  The position correcting device corrects the position for all of the plurality of parts housed in the one tray;
  The plurality of components are picked up one by one by the component holding tool and mounted on the circuit board after the correction of the positions of all of the plurality of components accommodated in the one tray is performed. Item 6. The electronic circuit assembling apparatus according to any one of Items 1 to 5. Said tray, an electronic circuit assembly according to any one of claims 1 a package tray 6.   The component whose position has been corrected by the position correcting device is in contact with the bottom surface of the concave portion at the reference position and is in a state of being separated from the component holding tool. An electronic circuit assembling apparatus described in 1.

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