JP6300674B2 - Imaging device and manufacturing method of imaging device - Google Patents

Description

  The present invention includes an imaging device in which a plurality of external electrodes are arranged on an inclined surface, a wiring board in which a plurality of connection electrodes are arranged on a main surface, and a side surface is bonded to the back surface of the imaging device, The present invention relates to an image pickup apparatus including a plurality of wiring patterns arranged by an ink jet method for connecting an external electrode and a connection electrode, and a method for manufacturing the image pickup apparatus.

  In order to reduce the diameter of the imaging device, a chip size package (CSP) type imaging device is used. The image sensor is connected to a wiring board that transmits power and signals. For this reason, in order to reduce the diameter of the imaging device, it is necessary to consider a configuration including not only the imaging element but also the wiring board.

  Japanese Patent Application Laid-Open No. 2014-75764 discloses an imaging apparatus having a CSP-type imaging device in which external electrodes are arranged on an inclined surface that is inclined with respect to a light receiving surface among side surfaces of the imaging device. . The outer diameter in the direction orthogonal to the longitudinal direction of this imaging device is as small as the outer diameter of the imaging device.

  When the external electrode of the image sensor described in JP-A-2014-75764 and the connection electrode of the wiring board are to be joined by ultrasonic bonding or solder bonding, the joint location is in a state where the imaging element and the wiring board are inclined. Since it is necessary to apply a load to the surface, it is difficult to secure workability in production, which may increase the cost.

  On the other hand, by electrically connecting the external electrode and the connection electrode with the wiring pattern produced by the ink jet method, it is possible to reliably join without applying a load.

  In the inkjet method, a plurality of dots are continuously arranged on a line by discharging a droplet of conductive ink from a nozzle. The continuous liquid dots are connected to each other by interfacial tension and become linear. After that, when dried, it becomes a wiring pattern.

  However, if the wiring pattern is disposed by the ink jet method after the imaging element having the external electrode disposed on the inclined surface and the wiring board are bonded, the conductive ink is caused by the interfacial tension at the boundary between the inclined surface and the wiring board. It spreads along the boundary line. For this reason, since adjacent wiring patterns may be short-circuited, it is not easy to fabricate wiring patterns with high density.

  In Japanese Patent Application Laid-Open No. 2010-232332, dots are first arranged at a predetermined interval by an ink jet method, and isolated dots are arranged by drying and solidifying. Thereafter, a method of disposing a wiring pattern by connecting dots with conductive ink is disclosed.

JP 2014-75764 A JP 2010-232332 A

  Embodiments of the present invention include an imaging device having a wiring pattern disposed by an inkjet method in which an imaging element in which external electrodes are arranged on an inclined surface and a wiring board are connected with high density, and the imaging device It aims at providing the manufacturing method of.

  An imaging apparatus according to an embodiment of the present invention includes a light receiving surface, a back surface, and an inclined surface that is inclined with respect to the back surface, and an imaging unit is formed on the light receiving surface, and the imaging unit is formed on the inclined surface. A plurality of external electrodes that are electrically connected to each other and an adhesive surface and a main surface orthogonal to the adhesive surface, and the plurality of connection electrodes are arrayed on the main surface A wiring board in which the adhesive surface is bonded to the back surface of the image sensor so that an edge of the main surface is disposed at a boundary between the back surface and the inclined surface of the image sensor; Electrically connecting a plurality of relay members made of a gourd-type conductive material having two convex portions disposed at a boundary between the inclined surface of the element and the main surface of the wiring board, an external electrode, and a connection electrode Connected to the constricted portion between the two convex portions of the relay member. Comprising a plurality of wiring patterns arranged, the by Tsu preparative method.

  According to another embodiment of the present invention, there is provided a method for manufacturing an imaging device, which includes a light receiving surface, a back surface, and an inclined surface that is inclined with respect to the back surface, and an imaging unit is formed on the light receiving surface. A wiring having a step of manufacturing an imaging element in which an external electrode electrically connected to the imaging unit is disposed, a main surface on which a connection electrode is disposed, and an adhesive surface orthogonal to the main surface And aligning the boundary between the inclined surface and the back surface with the edge of the main surface, and bonding the back surface of the image sensor and the adhesive surface of the wiring board. A step, a step of disposing a relay member made of a gourd-type conductive material having two convex portions at a boundary between the inclined surface of the image sensor and the main surface of the wiring board, and an inkjet method Connecting the external electrode and the connection electrode, A step of disposing the constricted portion and connected to the wiring pattern between serial two protrusions comprises a.

  According to the present invention, in an imaging device having a wiring pattern that connects a CSP-type imaging device having an external electrode on an inclined surface and a wiring board, and a method for manufacturing the imaging device, an inkjet method is used. The formed wiring pattern can be arranged with high density.

It is a perspective view of a part of an imaging device of a 1st embodiment. 1 is a schematic perspective view of a part of an imaging apparatus according to a first embodiment. It is a perspective view of the imaging device of a 1st embodiment. It is sectional drawing of the imaging device of 1st Embodiment. It is a top view of the vicinity of the relay member of the imaging device of the first embodiment. It is sectional drawing along the VB-VB line | wire of FIG. 5A of the vicinity of the relay member of the imaging device of 1st Embodiment. It is sectional drawing along the VC-VC line | wire of FIG. 5A of the vicinity of the relay member of the imaging device of 1st Embodiment. It is a perspective view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is sectional drawing for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a perspective view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is sectional drawing for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a top view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a perspective view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is sectional drawing for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a top view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a top view of the vicinity of the relay member for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a perspective view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is sectional drawing for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a top view for demonstrating the manufacturing method of the imaging device of 1st Embodiment. It is a partial top view of the conventional imaging device. It is a partial top view for demonstrating the manufacturing method of the imaging device of the modification 1 of 1st Embodiment. It is a partial top view for demonstrating the manufacturing method of the imaging device of the modification 1 of 1st Embodiment. It is a partial top view for demonstrating the manufacturing method of the imaging device of the modification 2 of 1st Embodiment. It is a partial top view for demonstrating the manufacturing method of the imaging device of the modification 2 of 1st Embodiment. It is a perspective view of the imaging device of 2nd Embodiment. It is a partial top view of the imaging device of 2nd Embodiment. It is an exploded view for demonstrating the manufacturing method of the imaging device of 3rd Embodiment. It is a perspective view of the imaging device of 3rd Embodiment.

<First Embodiment>
First, the imaging elements 20 and 20X of the imaging apparatus 1 according to the present embodiment will be described with reference to FIGS. In the following description, the drawings based on the embodiments are schematic, and the relationship between the thickness and width of components (dimensional relationship), the ratio of the thickness of each part, and the like are different from the actual ones. It should be noted that there are cases in which parts having different dimensional relationships and ratios are included between the drawings. In addition, illustration of some components may be omitted.

  First, the image sensor 20X will be described. As shown in FIG. 1, an image pickup unit 21 such as a CCD made of a semiconductor circuit is formed on a light receiving surface 20SA of a rectangular parallelepiped image pickup element 20X made of a semiconductor such as silicon using a known semiconductor process. The imaging unit 21 is electrically connected to a plurality of electrodes 23 arranged in a row on the light receiving surface 20SA by wiring (not shown). A cover glass 10 that protects the imaging unit 21 is bonded to the light receiving surface 20SA.

  In the imaging element 20X, a trench 20T that is a groove having an opening is formed in the back surface 20SB facing the light receiving surface 20SA. The trench 20 </ b> T is a through hole that reaches the electrode 23. That is, a part of the back surface of the electrode 23 is exposed at the bottom surface of the trench 20T. The wall surface of the trench 20T is an inclined surface 20SS inclined at an angle θ1 with respect to the back surface 20SB.

  For example, when the imaging element 20X material is silicon and the back surface 20SB is a silicon (100) surface, when anisotropic wet etching is performed from the back surface 20SB side with an alkaline solution such as KOH or TMAH, the (111) surface The anisotropic etching is slower than the (100) plane. For this reason, the side surface of the trench 20T is the (111) plane, and the angle θ0 with respect to the (100) plane (the light receiving surface 20SA) is 54.7 degrees. Therefore, the inclination angle θ1 is (180-54.7) degrees, that is, 125.3 degrees. On the other hand, in the trench 20T formed by performing dry etching such as ICP-RIE, the inclination angle θ1 is, for example, (180-75) degrees, that is, 105 degrees. The angle θ1 is more than 90 degrees and less than 180 degrees, that is, an obtuse angle.

  The inclined surface 20SS is provided with a plurality of external electrodes 22 that are electrically connected to the electrodes 23 by wires (not shown), respectively. In the imaging device 1, the number of connection electrodes 32 is external. The number is the same as the number of electrodes 22 but may be different. That is, there may be a connection electrode 32 or an external electrode 22 that is not connected by the wiring pattern 50 (see FIG. 3 and the like).

  The image sensor 20X with a cover glass is manufactured by a wafer process. That is, a bonded wafer is manufactured by bonding a semiconductor wafer including a plurality of imaging elements 20X and a glass wafer with a transparent resin. Next, the trench 20T is formed by etching the bonded wafer from the back side of the semiconductor wafer. By cutting the bonded wafer after disposing the external electrode 22 and the like in the trench 20T, a plurality of substantially rectangular parallelepiped image sensors 20X with a cover glass are manufactured.

  The image pickup device 20 shown in FIG. 2 has the same basic configuration as the image pickup device 20X shown in FIG. However, the image sensor 20 does not have a portion corresponding to the end 20Y of the image sensor 20X. The end portion 20Y constitutes a wall surface on which the external electrode 22 of the trench 20T is not disposed. However, the end portion 20Y is not related to the function of the image sensor 20. The image sensor 20 is smaller than the image sensor 20X because the end 20Y is removed when the bonded wafer is cut.

  Similar to the image sensor 20X, the image sensor 20 has a light receiving surface 20SA, a back surface 20SB facing the light receiving surface 20SA, and an inclined surface 20SS that is inclined at an obtuse angle θ1 with respect to the back surface 20SB. An imaging unit 21 is formed on the surface 20SA, and a plurality of external electrodes 22 electrically connected to the imaging unit 21 are arranged on the inclined surface 20SS.

Next, with reference to FIG. 5 C from FIG. 3, a description will be given of an imaging device 1 having an imaging element 20. The imaging device 1 includes an imaging element 20, a wiring board 30, a relay member 40, and a wiring pattern 50.

  The substantially rectangular parallelepiped wiring board 30 has an adhesive surface 30SS and a main surface 30SA orthogonal to the adhesive surface 30SS. As shown in FIG. 3 and FIG. 4, the wiring board 30 is configured such that the adhesive surface 30SS is the back surface of the image sensor 20 in a state where the edge of the main surface 30SA is disposed at the boundary between the back surface 20SB and the inclined surface 20SS of the image sensor 20. Bonded to 20SB. Therefore, as shown in FIG. 4, the angle θ2 formed by the inclined surface 20SS of the image sensor 20 and the main surface 30SA of the wiring board 30 is (90 + θ0) degrees. When θ0 = 55.7 degrees, θ2 = 145.7 degrees, and when θ0 = 75 degrees, θ2 = 165 degrees.

  The angle θ2 is preferably 140 degrees or greater and 170 degrees or less. If it is 140 degrees or more, even a fine wiring pattern can be formed arbitrarily, and if it is 170 degrees or less, a trench can be formed to obtain a desired inclination angle.

  A plurality of connection electrodes 32 are arranged in a row on the main surface 30 SA of the wiring board 30. Although not shown, the connection electrode 32 is connected to a cable through wiring, and driving power is supplied to the image sensor 20 through the cable, and an image signal of the image sensor 20 is transmitted.

  A plurality of relay members 40 made of a conductive material are disposed at a boundary BL between the inclined surface 20SS of the image sensor 20 and the main surface 30SA of the wiring board 30. As shown in FIGS. 5A to 5C, the relay member 40 has two convex portions, and the shape when viewed from above is a gourd-shaped.

  The wiring pattern 50 electrically connects the external electrode 22 and the connection electrode 32. As shown in FIG. 4, in the imaging apparatus 1, the wiring pattern 50 includes a wiring pattern 50 </ b> A connecting the external electrode 22 and a constricted portion between two convex portions of the relay member 40, and a constriction of the relay member 40. And a wiring pattern 50B connecting the connection electrode 32 to the connection electrode 32. That is, the wiring pattern 50 passes through the constricted portion of the relay member 40.

  The wiring pattern 50 is disposed by an ink jet method. In the inkjet method, a conductive ink, that is, a dispersion liquid in which conductive fine particles are dispersed in a solvent, is ejected as droplets, and the dots in a liquid state are bonded and dried by interfacial tension, thereby arranging a wiring pattern. Is done. A drying treatment for drying the solvent is performed as necessary. As the conductive fine particles, it is preferable to use silver particles that are not oxidized even in a drying process in the air and can form a low-resistance wiring pattern.

  The liquid conductive ink spreads due to the interfacial tension along the boundary line BL at the boundary between the inclined surface 20SS and the main surface 30SA. However, in the imaging device 1, since the relay member 40 is disposed at the boundary between the inclined surface 20SS and the main surface 30SA, the conductive ink does not spread. Since there is no possibility that adjacent wiring patterns 50 are short-circuited, the wiring patterns 50 are arranged with high density in the imaging device 1.

  Furthermore, since the relay member 40 has conductivity, it is not necessary to directly connect the wiring pattern 50A and the wiring pattern 50B. Of course, the wiring pattern 50A and the wiring pattern 50B may be a single wiring pattern 50 having an overlapping region, but the conductive ink tends to spread in the overlapping portion.

  The imaging device 1 having the wiring pattern 50 including the wiring pattern 50A and the wiring pattern 50B can arrange the wiring patterns at a higher density.

  Next, a method for manufacturing the imaging device 1 will be briefly described with reference to FIGS. 6A to 9C. Hereinafter, the imaging device and the manufacturing method of the imaging device are referred to as an imaging device or the like.

<Image sensor fabrication process>
In the imaging element manufacturing process, the imaging unit 21 has the light receiving surface 20SA, the back surface 20SB, and the inclined surface 20SS, the imaging unit 21 is formed on the light receiving surface 20SA, and the imaging unit 21 is electrically connected to the inclined surface 20SS. The image sensor 20 in which the external electrodes 22 are arranged is manufactured. A cover glass 10 is bonded to the light receiving surface 20SA of the imaging element 20.

  That is, a bonded wafer manufactured by a wafer process substantially the same as the image sensor 20X with the bar glass already described is cut along the trench, whereby the CSP-type rectangular parallelepiped image sensor 20 to which the cover glass 10 is bonded is manufactured. Is done. The glass wafer used as the cover glass 10 should just be transparent in the wavelength range of the light to image, for example, uses borosilicate glass, quartz glass, or single crystal sapphire.

<Wiring board manufacturing process>
A wiring board 30 having a main surface 30SA in which a plurality of connection electrodes 32 are arranged and an adhesive surface 30SS orthogonal to the main surface 30SA is produced. The wiring board 30 may be a multilayer wiring board, an electronic component such as a chip capacitor may be mounted on the main surface 30SA, or an electronic component may be incorporated.

<Adhesion process>
And the image pick-up element 20 and the wiring board 30 are adhere | attached with an adhesive agent. That is, the back surface 20SB of the image sensor 20 and the bonding surface 30SS of the wiring board 30 are bonded so that the boundary between the inclined surface 20SS and the back surface 20SB is aligned with the end of the main surface 30SA.

  6A and 6B and the like, the back surface 20SB of the image sensor 20 and the bonding surface 30SS of the wiring board 30 may be different in size. However, it is necessary to align the boundary BL between the back surface SB of the image sensor 20 and the inclined surface 22SS and the edge of the main surface of the wiring board 30 as accurately as possible. For this reason, when the height of the back surface SB of the image sensor 20 (dimension in the heel direction in FIG. 4) and the height of the bonding surface 30SS of the wiring board 30 are different, the bonding for compensating for the height difference between the two. It is preferable that the jig is fixed to the bottom surface of the wiring board 30 or the image pickup device 20 and is aligned with respect to the bottom surface.

<Relay member placement process>
As shown in FIGS. 7A to 7C, a plurality of gourd-type conductive materials having two convex portions at a predetermined interval at the boundary BL between the inclined surface 22SS of the image sensor 20 and the main surface 30SA of the wiring board 30. The relay member 40 is disposed.

  The relay member 40 has two convex portions located on a line connecting the connection electrode 32 and the external electrode 22.

  The relay member 40 is formed by disposing two dots made of the first conductive ink on the boundary line so that the end portions overlap with each other using the ink jet method. That is, the gourd-type relay member 40 having two convex portions is formed by combining two liquid dots by surface tension.

  As the first conductive ink, it is preferable to use a dispersion liquid in which conductive fine particles having a viscosity μ1 of 20 Pa · s to 100 Pa · s are dispersed in an organic solvent or the like. Note that a conductive ink having a relatively high viscosity, such as the first conductive ink, may be referred to as a conductive paste. In the present specification, the viscosity is a value measured at 25 ° C. and 10 rpm using a B-type viscometer.

  Viscosity has a great influence on the dischargeability of liquid protruding by the ink jet method. In general, the lower the viscosity, the better the dischargeability. As already described, the wiring pattern made of the conductive ink in the liquid state spreads along the boundary line at the boundary BL between the inclined surface 20SS and the main surface 30SA. If the viscosity μ1 is 20 Pa · s or more, it can be allowed to spread along the boundary line, and if the viscosity μ1 is 100 Pa · s or less, there is sufficient dischargeability and workability is allowed. Can be within range.

  As the conductive ink, a silver paste containing silver fine particles is preferable. The gel-state dod provided by the inkjet method becomes a sol state when the solvent evaporates, and becomes a solid by a sintering process or a curing process.

  The size of the relay member 40 is appropriately selected. For example, the diameter of the two protrusions is 10 μm to 50 μm, the height of the protrusion is 3 μm to 30 μm, and the height of the constriction is 1 μm to 10 μm. The following is preferred. If the size of the relay member 40 is within the above range, the wiring pattern 50 can be reliably disposed at a predetermined interval of, for example, 15 μm or more and 75 μm or less without impairing workability.

  In addition, you may arrange | position the relay member 40 by methods other than the inkjet method. For example, it can arrange | position using the dispensing method or the pin transfer method.

<Wiring pattern placement process>
A wiring pattern 50 connected to the constricted portion between the two convex portions of the relay member 40, which connects the external electrode 22 and the connection electrode 32, is disposed using an inkjet method.

  As shown in FIGS. 8A to 8C, the external electrode 22 of the image sensor 20 and the relay member 40 are electrically connected by a wiring pattern 50 </ b> A disposed by an inkjet method using the second conductive ink.

  The viscosity μ2 of the second conductive ink is preferably 5 mPa · s or more and 30 mmPa · s or less. When the viscosity μ2 is 5 mPa · s or more, a fine wiring pattern can be formed, and when the viscosity μ2 is 30 mmPa · s or less, the discharge property is good and the workability can be within an allowable range.

  As the second conductive ink, for example, “Perfect Silver” made by vacuum metallurgy is used. “Perfect Silver” is a dispersion in which silver particles having a particle diameter of 0.01 μm are dispersed in toluene, and the viscosity μ1 is about 10 mPa · s.

  That is, the viscosity μ2 of the second conductive ink is lower than the viscosity μ1 of the first conductive ink. For this reason, the second conductive ink has better dischargeability and higher productivity than the first conductive ink. As the second conductive ink, for example, a silver ink having the above viscosity range containing silver nanoparticles can be used.

  Next, as shown in FIGS. 9A to 9C, the relay member 40 and the connection electrode 32 of the wiring board 30 are electrically connected by a wiring pattern 50 </ b> B disposed by the inkjet method using the second conductive ink. Connected.

  In addition, as long as the conductive ink used for arrangement | positioning of the wiring pattern 50B exists in the predetermined viscosity range, you may use the conductive ink different from the wiring pattern 50A.

  FIG. 10 shows a top view when the wiring pattern 50 is connected using the second conductive ink without providing the relay member 40. As already described, the second conductive ink spreads along the boundary line BL between the inclined surface 20SS and the main surface 30SA. For this reason, the wiring patterns 50 cannot be arranged with high density.

  On the other hand, according to the manufacturing method of the imaging device 1 of the embodiment, the adjacent wiring patterns 50 are not likely to be short-circuited, so that the wiring patterns 50 can be arranged efficiently and with high density.

<Modification of First Embodiment>
Next, imaging devices 1A, 1B, and the like according to the first and second modifications of the first embodiment will be described.

  Note that the imaging devices 1A, 1B, and the like of the first and second modifications are similar to the imaging device 1 and the like and have the effects of the imaging device 1 and the like. Omitted.

  In the imaging devices 1A and 1B of Modification 1 of the first embodiment, slits 22S that are at least partially covered with the wiring pattern 50 are formed on the back surface 20SB side of the external electrodes 22A and 22B.

  The slit 22S of the imaging device 1A shown in FIG. 11A has an opening on the end surface on the back surface side of the external electrode 22A, and is formed in the longitudinal direction of the wiring pattern 50. For this reason, when the wiring pattern 50A is disposed, the slit 22S is covered with the wiring pattern 50A as shown in FIG. 11B.

  The slits 22S2 and 22S3 of the imaging device 1A shown in FIG. 12A have openings on the back side of the side surface of the external electrode 22B, and are formed in the direction orthogonal to the wiring pattern 50. For this reason, as shown to FIG. 12B, slit 22S2, 22S3 is partially covered with the wiring pattern 50A.

  That is, in the manufacturing method of the imaging devices 1A and 1B according to the first and second modifications, the external electrode 22 provided in the imaging element manufacturing process has the slit 22S on the back surface side, and the slit 22S is provided in the wiring pattern arranging process. At least a part is covered with the wiring pattern 50.

  If the wiring pattern 50A is disposed on the inclined surface 20SS using a low-viscosity conductive ink with high workability, the conductive ink flows due to gravity, so the wiring pattern 50A near the external electrode 22 becomes thin and the electrical resistance increases. Or the reliability of the connection may be reduced.

  Even if the wiring patterns 50A are provided on the inclined surface 20SS using the second conductive ink having a relatively low viscosity, the imaging devices 1A and 1B have the slits in the external electrodes 22A and 22B. Ink hardly flows from the external electrodes 22A and 22B.

  For this reason, the imaging devices 1A, 1B, etc. can connect the external electrode and the wiring pattern 50A more reliably than the imaging device 1, etc.

Second Embodiment
Next, the imaging device 1C and the like according to the second embodiment will be described.
Since the imaging device 1C and the like are similar to the imaging device 1 and the like and have the effects of the imaging device 1 and the like, components having the same function are denoted by the same reference numerals and description thereof is omitted.

  As illustrated in FIGS. 13 and 14, in the imaging device 1 </ b> C, two groove portions 60 </ b> A and 60 </ b> B whose longitudinal direction is the same as the longitudinal direction of the wiring pattern 50 are formed between the wiring patterns 50.

  When the relay member 40 is disposed at the boundary between the inclined surface 20SS and the main surface 30SA, the conductive ink does not spread, and therefore there is no possibility that the adjacent wiring patterns 50 are short-circuited. However, when the relay member 40 is disposed by the inkjet method, the adjacent relay member 40 may be short-circuited if the pitch is narrowed.

  When the relay member 40 is disposed by the ink jet method, even if the conductive ink spreads along the boundary line BL, the spread is restricted by the groove 60. That is, the groove 60 has a dam function for storing conductive ink.

  The length, width, and depth of the groove 60 are appropriately selected. Further, the groove 60 may be formed by a mechanical processing method, an etching method, or the like.

  The imaging device 1 </ b> C can easily arrange a wiring pattern with a higher density (narrow pitch) than the imaging device 1.

<Third Embodiment>
Next, an imaging apparatus 1D and the like according to the third embodiment will be described.
Since the imaging device 1D and the like are similar to the imaging device 1 and the like and have the effects of the imaging device 1 and the like, components having the same function are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIGS. 15 and 16, the imaging apparatus 1 </ b> D further includes a flexible wiring board 70 having a plurality of second wiring patterns 71, and is arranged in a row with a plurality of external electrodes 22 arranged in a row. The plurality of connection electrodes 32 are electrically connected to each other by the wiring patterns 50A and 50B, and the external electrodes 22 and the connection electrodes 32 that are not connected by the wiring pattern 50 are the second of the flexible wiring board 70. These wiring patterns 71 are electrically connected.

  In addition, since the second wiring pattern 71 of the flexible wiring board is thicker than the wiring patterns 50A and 50B, the second wiring pattern 71 is connected to a terminal to which a high voltage or a large current is applied, such as a power supply terminal. Suitable for that. Further, the wiring patterns 50A and 50B are suitable for connecting to terminals such as a clock terminal and an IO terminal that apply a lower voltage or a smaller current than the former.

  The flexible wiring board 70 uses, for example, polyimide as a base, and a second wiring pattern 71 made of copper is disposed thereon.

  In the imaging apparatus 1D, the flexible wiring board 70 is disposed after the wiring patterns 50A and 50B are disposed. However, the flexible wiring board 70 may be disposed first.

  In the imaging apparatus 1D, it is easy to dispose a wiring pattern having a higher density (narrow pitch) than that of the imaging apparatus 1.

  The present invention is not limited to the above-described embodiments and the like, and various changes and modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1, 1A-1D ... Imaging device 10 ... Cover glass 20 ... Imaging element 20T ... Trench 21 ... Imaging part 22 ... External electrode 22S ... Slit 22SS ... Inclined surface 23 ... Electrode 30 ... Wiring board 32 ... Connection electrode 40 ... Relay member 50 ... Wiring pattern 60 ... Groove 70 ... Flexible wiring board 71 ... Wiring pattern

Claims (9)

A plurality of light receiving surfaces, a back surface, and an inclined surface that is inclined with respect to the back surface, an imaging unit is formed on the light receiving surface, and the imaging unit is electrically connected to the inclined surface. An imaging device in which external electrodes are arranged; and
An adhesive surface and a main surface orthogonal to the adhesive surface, wherein a plurality of connection electrodes are arranged on the main surface, and an end of the main surface at a boundary between the back surface and the inclined surface of the image sensor A wiring board in which the bonding surface is bonded to the back surface of the imaging element so that a side is disposed;
A plurality of relay members made of a gourd-type conductive material having two convex portions disposed at a boundary between the inclined surface of the image sensor and the main surface of the wiring board;
A plurality of wiring patterns that are electrically connected to the external electrode and the connection electrode and are arranged by an ink jet method connected to a constriction between the two convex portions of the relay member. An imaging device. The relay member is disposed by an inkjet method;
The first conductive ink used for disposing the relay member has a higher viscosity than the second conductive ink used for disposing the wiring pattern. Imaging device.   The imaging device according to claim 1, wherein a slit that is at least partially covered with the wiring pattern is formed on the back surface side of the external electrode.   The imaging apparatus according to claim 2, wherein two groove portions whose longitudinal direction is the same as the longitudinal direction of the wiring pattern are formed between the plurality of wiring patterns. A flexible wiring board having a plurality of second wiring patterns;
The plurality of external electrodes and the plurality of connection electrodes are electrically connected to each other by the wiring pattern,
The imaging apparatus according to claim 1, wherein the external electrode and the connection electrode that are not connected by the wiring pattern are electrically connected by the second wiring pattern of the flexible wiring board. . A light receiving surface, a back surface, and an inclined surface that is inclined with respect to the back surface, and an imaging unit is formed on the light receiving surface, and an external electrode electrically connected to the imaging unit is disposed on the inclined surface. A step of producing an installed image sensor;
Producing a wiring board having a main surface on which connection electrodes are disposed and an adhesive surface orthogonal to the main surface;
Aligning the boundary between the inclined surface and the back surface so as to overlap the edge of the main surface, and bonding the back surface of the imaging element and the adhesive surface of the wiring board;
Disposing a relay member made of a gourd-type conductive material having two convex portions at the boundary between the inclined surface of the image sensor and the main surface of the wiring board;
Disposing a wiring pattern connected to a constricted portion between the two convex portions of the relay member, which connects the external electrode and the connection electrode using an ink jet method. A method for manufacturing an imaging device. The relay member is provided by an ink jet method using a first conductive ink, and the first conductive ink has a higher viscosity than the second conductive ink used for the arrangement of the wiring pattern. The method of manufacturing an imaging device according to claim 6.   The wiring pattern disposing step includes a step of disposing a first wiring pattern from the external electrode to the relay member and a step of disposing a second wiring pattern from the relay member to the connection electrode. The manufacturing method of the imaging device according to claim 7. The external electrode disposed in the imaging element manufacturing process has a slit on the back side,
9. The method of manufacturing an imaging device according to claim 8, wherein in the wiring pattern arranging step, at least a part of the slit is covered with the wiring pattern.

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