JP6296175B2 - Heater device - Google Patents

Description

Cross-reference to related applications

  This application is based on Japanese Patent Application No. 2015-10523 filed on January 22, 2015, the description of which is incorporated herein by reference.

  The present disclosure relates to a heater device.

  A conventionally known heater device is described in Patent Document 1, for example. The heater device of Patent Document 1 has a plurality of heat radiating portions and a plurality of heat generating portions. The heat generating part is formed in a thin plate shape. Further, the plurality of heat radiating portions are arranged in a distributed manner, and a low heat conducting portion is provided between two adjacent heat radiating portions. That is, the entire periphery of the heat radiating portion is surrounded by the low heat conducting portion, and thus the plurality of heat radiating portions are provided so as to be thermally separated from each other.

JP 2014-3000 A

  In the apparatus as described in Patent Document 1, it is preferable to reduce the temperature of the heat generating portion when an object comes into contact with the heater surface so as not to give a user a thermal discomfort. Therefore, a contact detection layer that detects the contact of the object with the heat generating layer is provided, and when the contact of the object with the heat generating layer is detected by this contact detection layer, the temperature of the heat generating layer is lowered to reduce the thermal to the user. It may be possible to reduce unpleasant discomfort.

  FIG. 21 shows a configuration example of a heater device including the heat generation layer 20 and the contact detection layer 30. A predetermined voltage V1 is applied to the heat generating layer 20. The heat generating layer 20 generates heat when a predetermined voltage V1 is applied.

  The contact detection layer 30 includes an insulating substrate 31a, an electrode layer 331 having an electrode wiring pattern 331a formed on one surface side of the insulating substrate 31a, and an electrode layer 332 having an electrode wiring pattern 332a formed on the other surface side of the insulating substrate 31a. And. A large number of dot-shaped (that is, dot-shaped) detection resistors 31 having positive temperature characteristics (that is, PTC characteristics) are formed on the insulating substrate 31a. The electrode wiring pattern 331 a and the electrode wiring pattern 332 a are connected via the detection resistor 31.

  When the temperature of the heat generating layer 20 is high, since the resistance value of the detection resistor 31 is large, no current flows between the electrode wiring patterns 331a and 332a. Further, when an object comes into contact with the heat generating layer 20 and the temperature of the heat generating layer 20 in the part in contact with the object decreases and the resistance value of the detection resistor 31 immediately below it decreases, the distance between the electrode wiring pattern 331a and the electrode wiring pattern 332a is reduced. Current flows through This change in the current value is detected as the contact of the object with the heat generating layer 20, and when it is detected that the object is in contact with the heat generating layer 20, the temperature of the heat generating layer 20 can be lowered.

  Such a heater device has a configuration in which a large number of detection resistors 31 are provided in parallel between the electrode wiring pattern 331a and the electrode wiring pattern 332a. Therefore, when the electrode wiring pattern 331a and the electrode wiring pattern 332a are damaged and disconnected in the middle, an undetectable region where an object cannot be detected is created. In this case, even if an object comes into contact with this non-detectable region, a predetermined current does not flow between the electrode wiring pattern 331a and the electrode wiring pattern 332a, and it is erroneously detected that no object is in contact with the heat generating layer 20. As described above, if the object is not in contact with the heat generating layer 20 even though the object is in contact with the heat generating layer 20, the temperature of the heat generating layer 20 cannot be lowered. That happens. As a result of detailed studies by the inventor, the above has been found.

  The present disclosure has been made in view of the above points, and an object thereof is to prevent erroneous detection of an object due to disconnection of an electrode wiring pattern.

In order to achieve the above object, according to one aspect of the present disclosure, a heater device includes:
A contact detection layer having a pair of electrode wiring patterns for detecting contact with the heater surface that generates heat when energized;
A disconnection determination unit that determines disconnection of the electrode wiring pattern based on a current value flowing between the both ends of the electrode wiring pattern when a predetermined voltage is applied between both ends of the at least one electrode wiring pattern;

  According to such a configuration, the disconnection determination unit disconnects the electrode wiring pattern based on the current value flowing between both ends of the electrode wiring pattern when a predetermined voltage is applied between both ends of the electrode wiring pattern. Determine. Therefore, erroneous detection of an object due to disconnection of the electrode wiring pattern can be prevented.

It is a figure which shows the heater apparatus which concerns on 1st Embodiment. It is a figure which shows the structure of the heater apparatus which concerns on 1st Embodiment. It is a figure which shows the structure of the heat-emitting layer as a heater part. It is sectional drawing along the IV-IV line in FIG. It is a top view for demonstrating the heat delivery path | route of the said heater part. FIG. 5B is a cross-sectional view taken along line VB-VB in FIG. 5A, showing a cross section including one heat radiating portion 23. It is sectional drawing along the VC-VC line in FIG. 5A, Comprising: It is the 1st figure which showed the cross section formed around the thermal radiation part 23 of FIG. 5B. It is sectional drawing which followed the VD-VD line | wire in FIG. 5A, Comprising: It is the 2nd figure which showed the cross section formed around the thermal radiation part 23 of FIG. 5B. It is a figure for demonstrating the said heater part of the heater apparatus which concerns on 1st Embodiment. It is a figure which shows the structure of the contact detection layer of the heater apparatus which concerns on 1st Embodiment. It is a schematic sectional drawing in alignment with the VIII-VIII line in FIG. It is the figure which showed the positional relationship of an upper layer electrode, a lower layer electrode, and detection resistance. It is a figure for demonstrating the synthetic resistance of the detection resistance at the time of low temperature. It is a figure for demonstrating the synthetic resistance of the detection resistance at the time of high temperature. It is a figure for demonstrating the combined resistance of the detection resistance at the time of an object contact. It is a figure for demonstrating the magnitude | size of the synthetic resistance of the detection resistance at the time of low temperature, high temperature, and a contact. It is a block block diagram of a heater apparatus. It is a figure for demonstrating contact detection mode. It is a figure for demonstrating upper layer disconnection detection mode. It is a figure for demonstrating lower layer disconnection detection mode. It is a flowchart of the control part of a heater apparatus. It is a figure for demonstrating each detection mode. It is a figure which shows the structure of the contact detection layer of the heater apparatus which concerns on 2nd Embodiment. It is a figure for demonstrating the objective of this indication.

  Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals in the drawings.

(First embodiment)
The first embodiment will be described with reference to FIGS. The heater device 10 according to the first embodiment is a radiation heater device. And the heater apparatus 10 is installed in the room | chamber interior of a road traveling vehicle, as shown in FIG. The heater device 10 constitutes a part of a room heating device. The heater device 10 is an electric heater that generates heat by being fed from a power source such as a battery or a generator mounted on a road vehicle. The heater device 10 is formed in a thin plate shape. The heater device 10 radiates radiant heat H mainly in a direction perpendicular to the surface in order to warm an object positioned in a direction perpendicular to the surface.

  A seat 11 for the passenger 12 to sit on is installed in the passenger compartment. The heater device 10 is installed in the room so as to radiate radiant heat H to the feet of the occupant 12. The heater device 10 can be used as a device for immediately providing warmth to the occupant 12 immediately after activation of another heating device, for example. The heater device 10 is installed so as to face the occupant 12 in the assumed normal posture. For example, the road traveling vehicle has a steering column 14 for supporting the handle 13. The heater device 10 can be installed on the lower side of the steering column 14 so as to face the occupant 12.

  In FIG. 2, the structure of the heater apparatus 10 in this embodiment is shown. The heater device 10 includes a heat generation layer 20 corresponding to the heater surface, and a contact detection layer 30 that detects contact of an object with the heat generation layer 20. The contact detection layer 30 is provided so as to be laminated with the heat generating layer 20.

  Next, the structure of the heat generating layer 20 will be described with reference to FIGS. The heat generating layer 20 extends along the XY plane defined by the axis X and the axis Y. The heat generating layer 20 has a thickness in the axis Z direction. The heat generating layer 20 is formed in a substantially rectangular thin plate shape. The heat generating layer 20 includes a substrate portion 21, a plurality of heat radiating portions 23, a plurality of heat generating portions 24, and a pair of terminals 27. The heat generating layer 20 can also be called a planar heater that radiates radiant heat R mainly in a direction perpendicular to the surface.

  The substrate portion 21 is made of a resin material that provides excellent electrical insulation and withstands high temperatures. The substrate unit 21 is a multilayer substrate. The substrate unit 21 includes a front surface layer 21a, a back surface layer 21b, and an intermediate layer 21c. The surface layer 21a faces the radiation direction of the radiant heat R. In other words, the surface layer 21a is a surface that is disposed to face a part of the occupant 12 that is the object to be heated in the installed state of the heat generating layer 20. The back layer 21 b is located on the back side of the heat generating layer 20. The back surface layer 21 b is in contact with the contact detection layer 30. The intermediate layer 21 c supports the heat radiating part 23 and the heat generating part 24. The substrate unit 21 is a member for supporting the plurality of heat dissipation units 23.

  Each of the plurality of heat radiating portions 23 is made of a material having high thermal conductivity. Furthermore, the heat radiation part 23 is made of an excellent electric conductor, that is, a material having a low electric resistance. The heat radiation part 23 can be made of a metal material.

  Each of the plurality of heat radiating portions 23 is formed in a thin plate shape parallel to the surface of the substrate portion 21. One heat radiating part 23 can radiate radiant heat R by heat supplied by energization. One heat radiating part 23 can radiate radiant heat R that makes the occupant 12, that is, a person feel warm, by being heated to a predetermined radiation temperature. The volume of one heat radiating part 23 is set so that the heat radiating part 23 can reach a temperature at which the heat radiating part 23 can radiate the radiant heat R by heat supplied from the heat generating part 24. The volume of one heat radiating part 23 is set so that the temperature of the heat radiating part 23 rises rapidly due to the heat supplied from the heat generating part 24. The volume of one heat radiating portion 23 is set to be small so that a rapid temperature drop is caused by heat radiating to an object in contact with the surface of the heat generating layer 20. The thickness of one heat radiating portion 23 is set to be thin in order to maximize the area parallel to the surface and minimize the volume. The area of one heat radiating part 23 is set to a size suitable for radiating radiant heat R. The area of one heat radiating part 23 is set smaller than an object positioned facing the surface of the heat generating layer 20, for example, a part of the occupant 12.

  One heat radiating part 23 of this embodiment is formed in a quadrangle in the XY plane. Even if the heat radiating portion 23 itself is energized, it does not generate heat that generates radiant heat R enough to make the occupant 12 feel warm. The heat radiation part 23 is a member only for heat radiation that does not generate heat.

  The plurality of heat dissipating parts 23 are arranged in a distributed manner with respect to the surface of the substrate part 21. In other words, the plurality of heat radiating portions 23 are arranged in a distributed manner on the surface that radiates the radiant heat R. The plurality of heat radiation portions 23 are arranged so as not to overlap each other. The plurality of heat dissipating parts 23 are arranged away from each other. The plurality of heat radiation portions 23 are regularly arranged so as to occupy a predetermined area on the XY plane in the drawing. The plurality of heat dissipation portions 23 can be referred to as a heat dissipation portion array. The plurality of heat radiation portions 23 are arranged so as to form an n × n grid with respect to the surface of the substrate portion 21. The plurality of heat radiating portions 23 are distributed along a rule set in advance with respect to the surface of the substrate portion 21. The plurality of heat radiating portions 23 are arranged on one or a plurality of energization paths formed between the pair of terminals 27. In the illustrated example, the plurality of heat dissipating parts 23 are arranged on a meandering energizing path.

  The plurality of heat radiating portions 23 are embedded in the substrate portion 21. Specifically, the plurality of heat radiation portions 23 are disposed between the surface layer 21a and the intermediate layer 21c. Therefore, the plurality of heat radiating portions 23 are not exposed on the surface of the substrate portion 21. The plurality of heat radiating portions 23 are protected by the substrate portion 21.

  Each of the plurality of heat generating portions 24 is made of a material that generates heat when energized. The heat generating part 24 can be made of a metal material. The plurality of heat generating portions 24 are also arranged in a distributed manner with respect to the surface of the substrate portion 21, similarly to the plurality of heat radiating portions 23.

  The heat generating part 24 is disposed between the two adjacent heat radiating parts 23, 23 and is connected to the two adjacent heat radiating parts 23, 23. Therefore, the heat generating part 24 is a member that is thermally connected to the heat radiating part 23 and generates heat when energized. The heat generating part 24 and the heat radiating part 23 are connected so that heat can be transferred. Thereby, the heat generated by the heat generating part 24 is directly transmitted to the directly connected heat radiating part 23. The heat generated by one heat generating portion 24 is transmitted to other heat radiating portions 23 located apart via a member such as the substrate portion 21. Furthermore, the heat generating part 24 and the heat radiating part 23 are also electrically connected. At least two heat generating parts 24 are connected to one heat radiating part 23. The plurality of heat generating portions 24 and the plurality of heat radiating portions 23 form a series of energization paths between the pair of terminals 27.

  The heat generating portion 24 is formed to have a small cross-sectional area along the energization direction in order to concentrate current. The heat generating portion 24 is formed so as to reduce the cross-sectional area between the two adjacent heat radiating portions 23 in order to suppress heat transfer between the two adjacent heat radiating portions 23. In the illustrated example, the heat generating part 24 is thicker than the heat radiating part 23. However, the width of the heat generating part 24 in the XY plane is smaller than the width of the heat radiating part 23. The width of the heat generating part 24 in the XY plane is smaller than half the width of the heat radiating part 23. The length of the heat generating portion 24 is set to have a predetermined length in order to obtain a predetermined heat generation amount. Furthermore, the length of the heat generating part 24 is set long in order to suppress heat transfer between two adjacent heat radiating parts 23. As a result, the heat generating portion 24 is given an elongated shape in the XY plane.

  In this embodiment, one heat generating part 24 is formed so as to fill between the two adjacent heat radiating parts 23, 23 and to be positioned under the two adjacent heat radiating parts 23, 23. The heat generating part 24 also radiates radiant heat R. However, since the area of the heat generating part 24 in the XY plane is small, the radiation amount of the radiant heat R is small. The heat generating part 24 is a member for heat generation and heat dissipation.

  The number of heat radiating portions 23 and the number of heat generating portions 24 are substantially equal. As a result, the amount of heat substantially equal to the amount of heat generated by one heat generating portion 24 is given to one heat radiating portion 23. The heat generated by one heat generating portion 24 and supplied to the heat radiating portion 23 is set so that the temperature of the associated one heat radiating portion 23 can reach the radiation temperature.

  Between the two adjacent heat radiating portions 23, a low heat conducting portion 26 for suppressing heat transfer between them is provided. The low heat conduction part 26 is mainly composed of a material constituting the substrate part 21. The low heat conducting portion 26 surrounds the entire circumference of one heat radiating portion 23 in the XY plane. The low heat conduction part 26 surrounding one heat dissipation part 23 suppresses the inflow of heat from the surroundings to the heat dissipation part 23. All the heat dissipating parts 23 are surrounded by the low heat conducting part 26 on the entire circumference. The low heat conduction part 26 provides a thermal barrier between the plurality of heat radiation parts 23 by surrounding the entire circumference of all the heat radiation parts 23. The low heat conducting unit 26 thermally separates the plurality of heat dissipating units 23 from each other.

  The low heat conduction part 26 surrounding one specific heat dissipation part 23 suppresses heat conduction from the periphery of the specific heat dissipation part 23 to the specific heat dissipation part 23. In addition, a specific heat radiation unit group can be assumed on the heat generation layer 20. The specific heat radiating portion group is a group of a plurality of heat radiating portions 23 positioned as a group. In this case, the low heat conduction unit 26 surrounding the specific heat dissipation unit group suppresses heat conduction from the periphery of the specific heat dissipation unit group to the specific heat dissipation unit group.

  In this embodiment, since the heat radiation part 23 is a quadrangle, the low heat conduction part 26 is arrange | positioned at the four sides. On at least one side of one heat radiating portion 23, a first low heat conducting portion 261 having only the substrate portion 21 is formed. The first low heat conducting portion 261 is formed on at least two sides of one heat radiating portion 23. On at least one side of one heat radiating part 23, a second low heat conducting part 262 having a substrate part 21 and a heat generating part 24 is formed. The second low heat conducting portion 261 is formed on at least one side of one heat radiating portion 23. In the case of the heat dissipating part 23 surrounded by the other heat dissipating part 23 on the four sides, the two first low heat conducting parts 261 and the two second low heat conducting parts 262 surround the heat dissipating part 23.

  FIG. 5B shows a cross section including one heat radiation part 23 shown in FIG. 5A which is a plan view. 5C and 5D each show a cross section formed around the heat dissipating part 23. FIG. Furthermore, in FIG. 5A, the main heat transfer directions are indicated by arrows. The first low thermal conductive portion 261 shown in cross section in FIG. 5D is composed of only the materials 21 a, 21 b, and 21 c constituting the substrate portion 21. Therefore, the average thermal conductivity K61 in the first low thermal conductivity portion 261 can be obtained based on the thermal conductivity of the substrate portion 21. The second low thermal conductive portion 262 shown in cross section in FIG. 5C is composed of materials 21 a, 21 b, 21 c constituting the substrate portion 21 and the heat generating portion 24. Therefore, the average thermal conductivity K62 in the second low thermal conductivity portion 262 can be obtained based on the thermal conductivity of the substrate portion 21 and the thermal conductivity of the heat generating portion 24. The average thermal conductivity K3R in the cross section traversing the heat radiating portion 23 (that is, the cross section shown as FIG. 5B) can be obtained based on the thermal conductivity of the substrate portion 21 and the thermal conductivity of the heat radiating portion 23.

  The thermal conductivity K2 of the resin material that forms the substrate portion 21 is significantly lower than the thermal conductivity K3 of the material that provides the heat radiating portion 23 and the thermal conductivity K4 of the material that provides the heat generating portion 24. That is, K2 << K3 and K2 << K4. Furthermore, the thermal conductivity K4 of the material that provides the heat generating portion 24 is lower than the thermal conductivity K3 of the material that provides the heat radiating portion 23. That is, K4 <K3. The thermal conductivity K62 is larger than the thermal conductivity K61. That is, K61 <K62. However, the thermal conductivity K3R is much larger than the thermal conductivity K61 and the thermal conductivity K62. That is, K61 << K3R and K62 << K3R.

  The heat dissipating part 23 surrounded by the four sides is surrounded by two first low heat conduction parts 261 and two second low heat conduction parts 262. Therefore, the average thermal conductivity KP in the entire circumference surrounding the heat radiating portion 23 is KP = 2 · K61 + 2 · K62. In this embodiment, the materials and dimensions are set so that KP <K3R. That is, the average thermal conductivity K3R in the cross section traversing the heat radiating portion 23 (that is, the cross section shown as FIG. 5B) is larger than the thermal conductivity KP of the entire circumference surrounding the heat radiating portion 23.

  According to this configuration, heat is rapidly transmitted in the cross section including the heat dissipation portion 23. Therefore, the temperature of one heat radiating part 23 can rise and fall rapidly. The amount of heat generated by the heat generating portion 24 is set so that a predetermined radiation temperature is obtained on the surface of the surface layer 21 a on the heat radiating portion 23 when no object is in contact with the surface of the heat generating layer 20. Thereby, the radiant heat R which can give warmth to the passenger | crew 12 is radiated | emitted. The amount of heat generated by the heat generating unit 24 can be adjusted by the material, size, and current value of the heat generating unit 24. When energization to the heat generating layer 20 is started, the surface temperature of the heat generating layer 20 rapidly rises to the predetermined radiation temperature. For this reason, warmth can be given to the passenger | crew 12 rapidly also in winter.

  When an object contacts the surface of the heat generating layer 20 on one specific heat radiating portion 23, the heat of the specific heat radiating portion 23 is rapidly transferred to the contacting object, as shown in FIG. As a result, the temperature of the specific heat radiating part 23 rapidly decreases. Therefore, the surface temperature of the heat generating layer 20 in the part in contact with the object is rapidly lowered. The heat of the specific heat dissipating unit 23 is transmitted to the contacting object and diffuses to the contacting object. For this reason, an excessive increase in the surface temperature of the contacting object is suppressed.

  Next, the configuration of the contact detection layer 30 will be described with reference to FIGS. The contact detection layer 30 has an insulating substrate 31a.

  The insulating substrate 31a is made of a resin having excellent insulating properties. A rectangular wave electrode wiring pattern 332a is formed on the surface of the insulating substrate 31a on the heat generating layer 20 side. Further, a rectangular wave electrode wiring pattern 331a is formed on one surface side of the insulating substrate 31a. Further, when viewed from the normal direction of the insulating substrate 31a, the electrode wiring pattern 331a and the electrode wiring pattern 332a cross each other so as to be orthogonal to each other. In addition, a large number of dot-shaped (that is, dot-shaped) detection resistors 31 having positive temperature characteristics are provided at portions where the electrode wiring pattern 331a and the electrode wiring pattern 332a intersect. These detection resistors 31 are arranged in a grid pattern. The electrode wiring pattern 331 body part a and the electrode wiring pattern 332 a are connected via the detection resistor 31. That is, the electrode wiring pattern 332a and the electrode wiring pattern 331a are arranged so as to overlap in the stacking direction (that is, the thickness direction of the contact detection layer 30) with a predetermined interval. The lamination direction is a lamination direction of the heat generating layer 20 and the contact detection layer 30. The thickness direction of the contact detection layer 30 is also the thickness direction of the heat generating layer 20.

  Next, the resistance value change of the combined resistance of the detection resistor 31 of the contact detection layer 30 will be described with reference to FIGS. 10 to 12 are equivalent circuits of the contact detection layer 30. FIG. 10 to 12, a predetermined voltage is applied between the electrode wiring pattern 331a and the electrode wiring pattern 332a.

When the temperature of the detection resistor 31 of the contact detection layer 30 is lower than a predetermined temperature (for example, Curie temperature), the resistance value of each detection resistor 31 is small as shown in FIG. A current I flows between the wiring pattern 331a and the electrode wiring pattern 332a. The resistance values of the detection resistors 31 are equal. Here, assuming that the resistance value of the detection resistor 31 is R _{(PTC, 1)} and the number of the detection resistors 31 is n, the combined resistance R _{min at} this time is expressed as R _min = R _{(PTC, 1)} / n. Can do.

Further, when the temperature of the detection resistor 31 of the contact detection layer 30 becomes higher than a predetermined temperature (for example, Curie temperature) due to heat generation of the heat generation layer 20, the combined resistance of each detection resistor 31 increases as shown in FIG. As a result, the electrode wiring pattern 331a and the electrode wiring pattern 332a are insulated. That is, no current flows between the electrode wiring pattern 331a and the electrode wiring pattern 332a. When the temperature coefficient of the resistance of the detection resistor 31 is α, the combined resistance R _{max at} this time can be expressed as R _max = αR _min .

As shown in FIG. 12, when the object F (for example, a user's finger) contacts the heat generating layer 20 at such a high temperature, the temperature of the contacted portion decreases. As a result, when the temperature of the detection resistor 31 of the contact detection layer 30 becomes lower than a predetermined temperature (for example, Curie temperature), the combined resistance value of each detection resistor 31 decreases rapidly, and between the electrode wiring patterns 331a and 332a. Current I flows. Here, the combined resistance R _touch when the temperature of one sensing resistor 31 becomes lower than a predetermined temperature (for example, Curie temperature) can be expressed as (nα / (n−1) + α) R _min .

As shown in FIG. 13, immediately after the heater device 10 starts operating, the temperature of the detection resistor 31 of the contact detection layer 30 is lower than a predetermined temperature (for example, Curie temperature), and the combined resistance of the detection resistor 31 is relatively small. R _min . When the temperature of the detection resistor 31 of the contact detection layer 30 becomes higher than a predetermined temperature (for example, Curie temperature) due to heat generation of the heat generation layer 20, the combined resistance of the detection resistor 31 becomes a relatively large _Rmax . When the object F (for example, a user's finger) contacts the heat generating layer 20 at a high temperature, the combined resistance of each detection resistor 31 decreases rapidly. The combined resistance R _touch at the time of contact is an intermediate value between the combined resistance R _min at the low temperature and the combined resistance R _max at the high temperature. The heater device 10 detects contact of an object based on the change in the resistance value.

  In FIG. 14, the block block diagram of this heater apparatus 10 is shown. The heater device 10 includes a heater temperature sensor 25, an operation unit 50, a heat generating unit 24, a detection resistor 31, a switching mechanism 42, and a control unit 40.

  For example, the heater temperature sensor 25 is provided in the center of the heat generating layer 20 and outputs a temperature signal corresponding to the temperature of the heat generating layer 20 to the control unit 40. The heater temperature sensor 25 can be configured using, for example, a thermistor.

  The operation unit 50 includes various switches such as a power switch and outputs a signal corresponding to a user's operation on the various switches to the control unit 40.

  The switching mechanism 42 switches the wiring connected to the electrode wiring patterns 331a and 332a. The switching mechanism 42 will be described in detail later.

  The control part 40 is comprised as a computer provided with CPU, ROM, RAM, I / O, etc., CPU implements various processes according to the program memorize | stored in ROM.

  The heater device 10 includes a contact detection mode for detecting contact of an object with the heat generating layer 20, an upper layer disconnection detection mode for detecting disconnection of the electrode wiring pattern 331a, and a lower layer disconnection detection mode for detecting disconnection of the electrode wiring pattern 332a. And have. The control unit 40 controls the switching mechanism 42 to switch each detection mode.

  As shown in FIGS. 15 to 17, the switching mechanism 42 includes changeover switches 42 a and 42 b and resistors 41 a and 41 b. The changeover switches 42a and 42b are switched according to control by the control unit 40, respectively.

  In the contact detection mode, as shown in FIG. 15, the control unit 40 controls the changeover switch 42a so that the electrode wiring pattern 331a is connected to the power source + V, and the resistor 41b connected to the electrode wiring pattern 332a is grounded. The changeover switch 42b is controlled so as to be performed. Thereby, the voltage of the power source + V is applied between the electrode wiring pattern 331a and the electrode wiring pattern 332a, and the contact of the object with the heat generating layer 20 can be detected.

  In the upper layer disconnection detection mode, as shown in FIG. 16, the control unit 40 controls the changeover switch 42a so that the electrode wiring pattern 331a is connected to the power source + V, and the resistor 41a connected to the electrode wiring pattern 331a is connected. The changeover switch 42b is controlled so as to be grounded. Thereby, the voltage of the power source + V is applied between both ends of the electrode wiring pattern 331a.

  In the lower layer disconnection detection mode, as shown in FIG. 17, the control unit 40 controls the changeover switch 42a so that the electrode wiring pattern 332a is connected to the power source + V, and the resistor 41b connected to the electrode wiring pattern 332a is connected. The changeover switch 42b is controlled so as to be grounded. Thereby, the voltage of the power source + V is applied between both ends of the electrode wiring pattern 332a.

  When the power switch of the operation unit 50 changes from the off state to the on state, the control unit 40 of the heater device 10 causes the temperature detected by the heater temperature sensor 25 to be a predetermined target temperature (for example, 100 ° C.). Energization of the heat generating layer 20 is started. Further, the control unit 40 performs energization control of the heat generating layer 20 while switching between the contact detection mode, the upper layer disconnection detection mode, and the lower layer disconnection detection mode.

  Next, this energization control will be described with reference to FIG. When the power switch of the operation unit 50 changes from the OFF state to the ON state and the heater temperature becomes equal to or higher than the predetermined temperature based on the temperature signal input from the heater temperature sensor 25, the control unit 40 performs the process illustrated in FIG. In addition, each control step in the flowchart of each drawing comprises the various function implementation | achievement part which the control part 40 has.

  First, in S100 shown in FIG. 18, the mode is changed to the contact detection mode. Specifically, the switching mechanism 42 is controlled so that the wiring is as shown in FIG. Thereby, the voltage of the power source + V is applied between the electrode wiring pattern 331a and the electrode wiring pattern 332a, and the contact of the object with the heat generating layer 20 can be detected.

  Next, in S102 of FIG. 18, it is determined whether or not an object contact with the heat generating layer 20 is detected. The operation unit 50 can monitor the voltage between the terminals of the resistors 41a and 41b. Here, when an object is in contact with the heat generating layer 20, as shown in FIG. 19A, a current flows between the electrode wiring pattern 331a and the electrode wiring pattern 332a. In this case, the voltage between the terminals of the resistor 41a is equal to or higher than the reference value, and it is determined that the contact of the object is detected. Further, when there is no contact of the object with the heat generating layer 20, no current flows between the electrode wiring pattern 331a and the electrode wiring pattern 332a. In this case, the voltage between the terminals of the resistor 41a is less than the reference value, and it is determined that the contact of the object is not detected.

  Here, when there is no contact of the object with the heat generating layer 20 and the voltage between the terminals of the resistor 41a is less than the reference value, next, in S110 of FIG. Specifically, the switching mechanism 42 is controlled so that the wiring is as shown in FIG. Thereby, the voltage of the power source + V is applied between both ends of the electrode wiring pattern 331a.

  Next, in S112 of FIG. 18, it is determined whether or not disconnection (ie, open) of the upper layer electrode (ie, electrode wiring pattern 331a) has been detected. Here, when the electrode wiring pattern 331a is not disconnected, a predetermined current flows through the resistor 41a. In this case, the voltage between the terminals of the resistor 41a is equal to or higher than the reference value, and it is determined that the upper layer electrode (that is, the electrode wiring pattern 331a) is not disconnected. Further, when the electrode wiring pattern 331a is disconnected, a predetermined current does not flow through the resistor 41a. In this case, the voltage between the terminals of the resistor 41a is less than the reference value, and it is determined that the upper layer electrode (that is, the electrode wiring pattern 331a) is disconnected.

  Here, when the electrode wiring pattern 331a is not disconnected and the voltage between the terminals of the resistor 41a is equal to or higher than the reference value, the determination in S112 of FIG. Transition to. Specifically, the switching mechanism 42 is controlled so that the wiring is as shown in FIG. Thereby, the voltage of the power source + V is applied between both ends of the electrode wiring pattern 332a.

  Here, when the electrode wiring pattern 332a is not disconnected, a predetermined current flows through the resistor 41b. In this case, the voltage between the terminals of the resistor 41b is equal to or higher than the reference value, and it is determined that the lower layer electrode (that is, the electrode wiring pattern 332a) is not disconnected. Further, when the electrode wiring pattern 332a is disconnected, a predetermined current does not flow through the resistor 41b. In this case, the voltage between the terminals of the resistor 41b is less than the reference value, and it is determined that the lower layer electrode (that is, the electrode wiring pattern 332a) is disconnected.

  Here, when the electrode wiring pattern 332a is not disconnected and the voltage between the terminals of the resistor 41b is equal to or higher than the reference value, the determination in S116 is NO and the process returns to S100.

  As described above, energization control to the heat generating layer 20 is performed while switching between the contact detection mode, the upper layer disconnection detection mode, and the lower layer disconnection detection mode.

  Further, when there is an object contact with the heat generating layer 20, after the transition to the contact detection mode, the determination in S102 is YES, and in S104, the heater control temperature is lowered. Specifically, the target temperature is lowered to a predetermined temperature (for example, 60 ° C.), and energization to the heat generating layer 20 is controlled so that the temperature detected by the heater temperature sensor 25 approaches the target temperature.

  Next, in S106 of FIG. 18, after waiting for a certain period to elapse, it is determined whether or not non-contact of the object to the heat generating layer 20 is detected. Here, when the object is no longer in contact with the heat generating layer 20, the decrease in the heater control temperature is canceled in S108 of FIG. Specifically, as in the state before the heater control temperature is lowered, the heating layer 20 is energized so that the temperature detected by the heater temperature sensor 25 becomes a predetermined target temperature (for example, 100 ° C.). Do.

  Here, as shown in FIG. 19B, when the upper layer electrode (that is, the electrode wiring pattern 331a) is disconnected, after the transition to the upper layer disconnection detection mode, the determination in S112 of FIG. 18 becomes YES, and in S118 Stop the heater. Specifically, energization to the heat generating layer 20 is stopped, and this process is terminated.

  Also, as shown in FIG. 19C, when the lower layer electrode (that is, the electrode wiring pattern 332a) is disconnected, after the transition to the lower layer disconnection detection mode, the determination of S116 of FIG. Stop. Specifically, energization to the heat generating layer 20 is stopped, and this process is terminated.

  Further, when there is an object contact with the heat generating layer 20 and the heater control temperature is lowered in S104, heat generation is performed when it is determined in S106 whether non-contact of the object with the heat generating layer 20 is detected. If the contact of the object with the layer 20 is continued, the determination in S106 is NO. If the determination in S106 is NO, a decrease in the heater control temperature is maintained in S120.

  Next, in S122, the state transits to the upper layer detection mode. Specifically, the switching mechanism 42 is controlled so that the wiring is as shown in FIG.

  Next, in S124 of FIG. 18, it is determined whether or not a disconnection (ie, open) of the upper layer electrode (ie, electrode wiring pattern 331a) has been detected. Here, if the electrode wiring pattern 331a is not disconnected, the determination in S124 is NO, and then in S126, the process proceeds to a lower-layer disconnection detection mode. Specifically, the switching mechanism 42 is controlled so that the wiring is as shown in FIG.

  Next, in S128 of FIG. 18, it is determined whether or not disconnection (ie, open) of the lower layer electrode (ie, electrode wiring pattern 332a) has been detected. Here, when the electrode wiring pattern 332a is not disconnected, the determination in S126 is NO, and the process returns to S106.

  If the upper layer electrode (that is, the electrode wiring pattern 331a) is disconnected, the determination in S124 is YES, and the heater is stopped in S118. Specifically, energization to the heat generating layer 20 is stopped, and this process is terminated.

  When the lower layer electrode (that is, the electrode wiring pattern 332a) is disconnected, the determination in S128 is YES, and the heater is stopped in S118. Specifically, energization to the heat generating layer 20 is stopped, and this process is terminated.

  According to the above-described configuration, when a predetermined voltage is applied between both ends of the electrode wiring patterns 331a and 332a, the electrode wiring patterns 331a and 332a are disconnected based on a current value flowing between both ends of the electrode wiring patterns 331a and 332a. Determine. Therefore, erroneous detection of an object due to disconnection of the electrode wiring pattern can be prevented.

  In addition, a resistor 31 whose resistance value changes with temperature change is provided between the pair of electrode wiring patterns. Therefore, when a predetermined voltage is applied between the pair of electrode wiring patterns 331a and 332a, the contact of the object to the contact detection layer 30 is detected based on the current value flowing between the pair of electrode wiring patterns 331a and 332a. can do.

  The pair of electrode wiring patterns 331a and 332a are arranged so that part or all of them overlap each other in the stacking direction (that is, the thickness direction of the contact detection layer 30) at a predetermined interval. The detection resistor 31 is provided between the electrode wiring patterns 331a and 332a arranged so as to overlap in the stacking direction. Therefore, even if one of the electrode wiring patterns 331a and 332a receives an external force, the impact on the detection resistor 31 is alleviated, and failure due to damage to the detection resistor 31 can be reduced.

  Further, when the contact detection layer 30 is viewed from the normal direction to the surface 30a of the contact detection layer 30, a part of the pair of electrode wiring patterns 331a and 332a intersect each other. The detection resistor 31 is provided at the intersecting portion of the electrode wiring patterns 331a and 332a. Accordingly, it is possible to reduce the amount of the members constituting the detection resistor 31 and to realize cost reduction. More specifically, the surface 30a of the contact detection layer 30 is a surface of the contact detection layer 30 alone. And the surface 30a of the contact detection layer 30 corresponds to the boundary surface between the heat generating layer 20 and the contact detection layer 30 in the heater device 10, for example, as shown in FIG.

  The heater device 10 includes a switching mechanism 42. Then, the switching mechanism 42 is arranged between a pair of electrode wiring patterns 331a and 332a for detecting a contact between the wiring for applying a predetermined voltage between both ends of the electrode wiring patterns 331a and 332a and the heating layer 20. The wiring to which a predetermined voltage is applied is switched. Therefore, switching of those wirings can be performed quickly.

  Further, when it is determined that at least one of the pair of electrode wiring patterns 331a and 332a is disconnected, the energization to the heat generating layer 20 corresponding to the heater surface is interrupted. Therefore, safety can be ensured.

(Second Embodiment)
Next, a configuration of the heater device 10 according to the second embodiment will be described with reference to FIG. The heater device 10 according to the first embodiment is formed such that the electrode wiring pattern 331a and the electrode wiring pattern 332a are orthogonally intersected when viewed from the normal direction of the contact detection layer 30. On the other hand, as shown in FIG. 20, the heater device 10 of the present embodiment is formed such that the electrode wiring pattern 331a and the electrode wiring pattern 332a are parallel to each other.

  Thus, the electrode wiring pattern 331a and the electrode wiring pattern 332a are parallel to each other, and the electrode wiring pattern 332a and the detection resistor 31 are protected by the electrode wiring pattern 331a.

(Other embodiments)
In the above-described embodiment, the example in which the heater device 10 is installed in a room of a road traveling vehicle is shown. However, the heater device 10 can be installed in a room of a moving body such as a ship or an aircraft.

  Further, in each of the above embodiments, the configuration in which the heat generating layer 20 that generates heat when energized is used as the heater surface is shown. However, instead of the heat generating layer 20, one of the pair of electrode wiring patterns 331a and electrode wiring patterns 332a is used as the heater. It can also be configured to be a surface. In this case, for example, the resistance values of the electrode wiring patterns 331 a and 332 a serving as the heater surface may be set to the same resistance value as that of the heat generating portion 24 of the heat generating layer 20. In short, when one of the pair of electrode wiring patterns 331a and 332a also has a heat generation function that generates heat by energization, the heat generation layer 20 is unnecessary.

  In each of the above embodiments, as shown in FIGS. 15 to 17, a resistor 41a is provided between the electrode wiring pattern 331a and the changeover switch 42b, and a resistor 41b is provided between the electrode wiring pattern 332a and the changeover switch 42b. I tried to provide it. In this regard, a resistor may be provided between the changeover switch 42b and the installation terminal instead of the resistors 41a and 41b. With such a configuration, the number of parts can be reduced.

  In each of the above embodiments, the heat generation layer 20 and the contact detection layer 30 are independent layers, but the heat generation layer 20 and the contact detection layer 30 may be disposed on the front and back of one layer, and the wiring of the heat generation layer 20 The electrode wiring pattern of the contact detection layer 30 may be arranged in parallel to form a single layer.

  In the first to seventh embodiments, the temperature of the heat generating layer is detected by the resistor having the positive temperature characteristic (that is, the PTC characteristic). However, the NTC characteristic member having the NTC characteristic and the CTR characteristic are provided. The temperature of the heat generating layer may be detected by a CTR characteristic member.

  In each of the above embodiments, the contact of the object with the heat generating layer 20 is detected based on the current value flowing between the electrode pattern 331a and the electrode pattern 332a connected via the detection resistor 31. In this regard, for example, the contact of the object with the heat generating layer 20 may be detected using a pressure-sensitive sensor that detects the pressure of the object on the heat generating layer 20.

  Moreover, although each said embodiment demonstrated the example which arrange | positions the heat-emitting part 24 between the adjacent heat-radiating parts 23 about the arrangement | positioning form of the heat-emitting part 24 and the heat-radiating part 23 in the heat-generating layer 20, it is not limited to this. For example, it is good also as an arrangement | positioning form which provides the heat generating part 24 in the area | region which comprises the thermal radiation part 23 in the heat generating layer 20. FIG.

  Note that the present disclosure is not limited to the above-described embodiment. The present disclosure includes various modifications and modifications within the equivalent range. Further, the above embodiments are not irrelevant to each other, and can be combined as appropriate unless the combination is clearly impossible. In each of the above-described embodiments, it is needless to say that elements constituting the embodiment are not necessarily indispensable except for the case where it is clearly indicated that the element is essential and the case where the element is clearly considered essential in principle. Yes. Further, in each of the above embodiments, when numerical values such as the number, numerical value, quantity, range, etc. of the constituent elements of the embodiment are mentioned, it is clearly limited to a specific number when clearly indicated as essential and in principle. The number is not limited to the specific number except for the case. In each of the above embodiments, when referring to the material, shape, positional relationship, etc. of the constituent elements, etc., unless otherwise specified, or in principle limited to a specific material, shape, positional relationship, etc. The material, shape, positional relationship, etc. are not limited.

  In the above embodiment, S110 to S116 and S122 to S128 correspond to a contact detection unit. S102 and S106 correspond to a disconnection determination unit. The switching mechanism 42 corresponds to a wiring switching unit. S118 corresponds to an energization cutoff unit.

Claims (5)

A contact detection layer (30) having a pair of electrode wiring patterns (331a, 332a) for detecting contact with the heater surface that generates heat by energization;
Disconnection determination unit (S102, S106) that determines disconnection of the electrode wiring pattern based on a current value flowing between both ends of the electrode wiring pattern when a predetermined voltage is applied between both ends of the electrode wiring pattern. and,
When a predetermined voltage is applied between the pair of electrode wiring patterns, a contact detection unit (S110 to S116) detects contact of an object with the heater surface based on a current value flowing between the pair of electrode wiring patterns. , S122 to S128),
Between the pair of electrode wiring patterns, there is provided a resistor (31) whose resistance value changes with temperature change,
The pair of electrode wiring patterns are arranged so that a part or all of them overlap with each other in the thickness direction of the contact detection layer at a predetermined interval.
The said resistor is the heater apparatus provided between the said electrode wiring patterns arrange | positioned so that it may overlap in the said thickness direction . When the contact detection layer is viewed from the normal direction to the surface (30a) of the contact detection layer, a part of the pair of electrode wiring patterns intersects each other,
The heater device according to claim 1 , wherein the resistor is provided at a portion where the electrode wiring pattern intersects. Wiring for applying a predetermined voltage between both ends of the at least one of the electrode wiring patterns; wiring for applying a predetermined voltage between the pair of electrode wiring patterns for detecting contact with the heater surface; The heater device according to claim 1, further comprising a wiring switching unit (42) that switches between the two . When at least one of the disconnection of the pair of electrode wiring patterns by the disconnection determination unit determines any one of claims 1 to 3 with a current blocking portion (S118) to block the energization of the heater surface The heater apparatus as described in. The heater device according to any one of claims 1 to 4 , wherein the heater surface is configured by any one of the pair of electrode wiring patterns.

Images