JP6294084B2 - Laser welding method and laser welding system - Google Patents

Description

  The present invention relates to a laser welding method and a laser welding system in which a filler metal supplied to a welding target portion of a workpiece is melted by laser light to weld the welding target portion.

  Laser welding is used for brazing, for example, cooling fins of heat exchangers and fine parts of jewelry. In recent years, application to soldering of electronic parts to printed wiring boards has been studied. Yes.

  This type of laser soldering is performed by, for example, melting the thread solder supplied from the nozzle of the solder supply device to the welding target portion with laser light. However, in such laser soldering, the melted state of the tip of the thread solder varies from solder to solder, resulting in variations in the position of the tip of the thread solder. Therefore, an appropriate amount of thread solder is accurately applied to the welding target portion. It is not easy to supply. Therefore, for example, Patent Document 1 proposes a solder supply device that controls the supply amount of yarn solder to the welding target portion by recognizing the tip position of the yarn solder every time soldering is performed.

JP 2012-135774 A

  However, in the conventional technique such as Patent Document 1 described above, since the tolerance (dimensional tolerance or assembly tolerance) of the welding target portion is not taken into consideration, the welding target portion is related to the positional relationship between the tip of the thread solder and the welding target portion. Variation in tolerance dimensions will occur. If it does so, there exists a possibility that an appropriate quantity of thread solder (melting material) cannot be supplied to the appropriate position of a welding object part.

  The present invention has been made in consideration of such problems, and can supply an appropriate amount of filler material to an appropriate position of the welding target portion regardless of the tolerance of the welding target portion. An object of the present invention is to provide a laser welding method and a laser welding system capable of stabilizing the welding quality.

The laser welding method according to the present invention is a laser welding method in which a welding material supplied to a welding target portion of a workpiece is melted by a laser beam and the welding target portion is welded. An image information acquisition step of acquiring predetermined image information by imaging the target portion with an imaging means, and the position information of the welding target portion and the tip of the filler material from the image information acquired in the image information acquisition step A positioning step for calculating position information, and positioning for positioning the tip of the filler material and the welding target portion based on the position information of the welding target portion calculated in the calculation step and the tip position information of the filler material There lines and step, the image information acquisition step, a first imaging step of acquiring first image data by imaging a first region including the distal end portion and the welded portion of the filler material, the A second imaging step of acquiring second image information by imaging a second region that is the same region as the first region and includes the welding target portion and does not include the tip portion of the filler material, Further performing an image processing step of generating difference image information by extracting a difference between the first image information acquired in the first imaging step and the second image information acquired in the second imaging step; In the calculation step, position information of the welding target portion is calculated from the first image information acquired in the first imaging step or the second image information acquired in the second imaging step, and the image processing step The tip position information of the filler metal is calculated from the difference image information generated in step (1).

According to the laser welding method of the present invention, the tip of the filler material and the welding target part are positioned based on the position information of the welding target part calculated from the predetermined image information and the tip position information of the filler material. Thereby, since an appropriate quantity of filler material can be supplied to the appropriate position of a welding object part irrespective of the tolerance of a welding object part, stabilization of welding quality can be aimed at. Further, even when the tip shape of the filler material overlaps with the shape of the workpiece and the tip shape of the filler material cannot be recognized, the tip position information of the filler material is calculated from the difference image information. Therefore, the tip position information of the filler metal can be accurately calculated.

The laser welding method according to the present invention is a laser welding method in which a welding material supplied to a welding target portion of a workpiece is melted by a laser beam and the welding target portion is welded. An image information acquisition step of acquiring predetermined image information by imaging the target portion with an imaging means, and the position information of the welding target portion and the tip of the filler material from the image information acquired in the image information acquisition step A positioning step for calculating position information, and positioning for positioning the tip of the filler material and the welding target portion based on the position information of the welding target portion calculated in the calculation step and the tip position information of the filler material performs a process, wherein the image information acquisition step, a first imaging step of acquiring first image data by imaging a first region including the distal end portion of the filler material disposed in correspondence with the free ground The second imaging step of obtaining the second image information by capturing a second region including at least the welded portion a region different from the first region, has a, in said calculating step, the The tip position information of the filler material is calculated from the first image information acquired in the first imaging step, and the position information of the welding target portion is calculated from the second image information acquired in the second imaging step. It is characterized by doing .

According to such a method, the tip position information of the filler material is calculated from the first image information obtained by imaging the first region including the tip portion of the filler material arranged corresponding to the non-ground surface. Therefore, the tip position information of the filler metal can be accurately calculated. In this case, since it is not necessary to generate difference image information, the control can be simplified.

  In the laser welding method, in the calculation step, the shape of the tip of the filler material is calculated from the image information acquired in the image information acquisition step, and the tip of the filler material calculated in the calculation step You may further perform the determination process which determines the quality of the said filler material based on the shape of this.

  According to such a method, since the quality determination of the filler material is performed based on the shape of the tip of the filler metal calculated from the predetermined image information, welding failure due to the abnormal shape of the tip of the filler material is suppressed. can do. Therefore, the welding quality can be further stabilized.

  In the laser welding method, a confirmation step of determining whether or not each of the tip position of the filler material and the position of the welding target portion positioned in the positioning step is within an allowable range of a predetermined set position. Performing, if it is determined in the confirmation step that at least one of the tip position of the filler material and the position of the welding target portion is not within the allowable range of the set position, the image information acquisition step, The calculation step and the positioning step may be performed again.

  According to such a method, since the tip of the filler metal and the welding target portion can be reliably positioned within the allowable range of the predetermined set position, the welding quality can be further stabilized.

The laser welding system according to the present invention is a laser welding system in which a welding material supplied to a welding target portion of a workpiece is melted by a laser beam and the welding target portion is welded. Calculated by the imaging unit that images the target part, a calculation unit that calculates the position information of the welding target part and the tip position information of the filler material from the image information captured by the imaging unit, and the calculation unit Positioning control means for positioning the tip of the filler material and the welding target part based on the position information of the welding target part and the tip position information of the filler material, and the tip of the filler material and the welding target part. The first image information obtained by imaging the first area including the first image information and the first area is the same area as the first area, and includes the welding target part and does not include the tip of the filler material. 2 areas before E Bei and an image processing unit that generates a difference image information by extracting the difference between the second image information obtained by imaging by the imaging unit, the calculating unit, the first image information and the The position information of the welding target part is calculated from the second image information, and the tip position information of the filler material is calculated from the difference image information .

The laser welding system according to the present invention is a laser welding system in which a welding material supplied to a welding target portion of a workpiece is melted by a laser beam and the welding target portion is welded. Calculated by the imaging unit that images the target part, a calculation unit that calculates the position information of the welding target part and the tip position information of the filler material from the image information captured by the imaging unit, and the calculation unit Positioning control means for positioning the tip of the filler metal and the welding target part based on the position information of the welding target part and the tip position information of the filler material, and the calculation unit corresponds to a non-ground surface. and calculates the tip position information of the filler material of the first region including the distal end portion of the arranged the filler material from the first image information obtained by imaging by the imaging means, the first A region different from the region And calculates the position information of the welded portion from the second image information obtained by imaging by the imaging means and the second region including at least the welded portion comprising at.

  In the laser welding system, the calculation unit calculates the shape of the tip of the filler material from image information obtained by imaging with the imaging unit, and the filler material calculated by the calculation unit There may be further provided a determination unit that determines the quality of the filler material based on the shape of the tip portion.

  According to the present invention, since the tip of the filler material and the welding target portion are positioned based on the position information of the welding target portion calculated from the predetermined image information and the tip position information of the filler material, the tolerance of the welding target portion is determined. Regardless, an appropriate amount of filler metal can be supplied to an appropriate position of the welding target portion, and the welding quality can be stabilized.

1 is a block diagram showing a laser welding system according to a first embodiment of the present invention. It is a flowchart explaining the laser welding method which concerns on 1st Embodiment of this invention. It is a flowchart explaining a calculation process. It is a flowchart explaining a positioning process. It is a flowchart explaining a confirmation process. 6A is a plan view for explaining the first imaging step in FIG. 2, and FIG. 6B is a plan view for explaining the second imaging step in FIG. 7A is a first image captured in the first imaging process of FIG. 2, FIG. 7B is a second image captured in the second imaging process of FIG. 2, and FIG. 7C is an image processing process of FIG. It is the produced | generated difference image. FIG. 8A is a plan view showing a first example in which the shape of the solder tip is an abnormal shape, and FIG. 8B is a plan view showing a second example in which the shape of the solder tip is an abnormal shape. It is a top view explaining a positioning process. It is a top view explaining a soldering process. It is a flowchart explaining the laser welding method which concerns on 2nd Embodiment of this invention. It is a flowchart explaining the confirmation process of FIG. 13A is a plan view for explaining the first imaging step in FIG. 11, and FIG. 13B is a plan view for explaining the second imaging step in FIG. 14A is a first image captured in the first imaging step of FIG. 11, and FIG. 14B is a second image captured in the second imaging step of FIG. It is a flowchart explaining the laser welding method which concerns on 3rd Embodiment of this invention. It is a flowchart explaining the confirmation process of FIG. It is a top view explaining the imaging process of FIG. It is the image imaged at the imaging process of FIG.

  Hereinafter, preferred embodiments of a laser welding method and a laser welding system according to the present invention will be described with reference to the accompanying drawings.

(First embodiment)
As shown in FIG. 1, the laser welding system 10 according to the present embodiment melts solder S as a filler material supplied to the welding target portions 200a and 200b of the workpiece W with laser light L to weld the target portion 200a. , 200b is configured as a laser soldering system for soldering (welding). In this embodiment, an example in which through-hole mounting is performed using the laser welding system 10 will be described, but it is naturally possible to perform surface mounting using the laser welding system 10.

  As shown in FIGS. 1 and 6A, the workpiece W has a plurality (two in FIG. 6A) of welding target portions 200a and 200b. The welding target portion 200a includes an annular land 206a formed on the outer peripheral side of the through hole 204a formed in the printed wiring board 202, and a terminal 210a of the electronic component 208 inserted through the through hole 204a. Similarly, the welding target part 200b includes an annular land 206b formed on the outer peripheral side of the through hole 204b formed in the printed wiring board 202, and a terminal 210b of the electronic component 208 inserted through the through hole 204b. including. In each drawing, the distance between the land 206a and the terminal 210a (through hole 204a) and the distance between the land 206b and the terminal 210b (through hole 204b) are exaggerated. Conductive patterns 212a and 212b are electrically connected to the lands 206a and 206b.

  Such welded parts 200a and 200b have tolerances (dimensional tolerances and assembly tolerances). Therefore, in each welding object part 200a, 200b, the positional relationship between the lands 206a, 206b and the terminals 210a, 210b may vary. In the present embodiment, the center position of the land 206a and the center position of the terminal 210a are not aligned with each other in the welding target portion 200a, but the center position of the land 206b is shifted from the center position of the terminal 210b. Match.

  As shown in FIG. 1, the laser welding system 10 irradiates the workpiece W with a laser beam L toward the stage 12 that supports the workpiece W so as to be movable in directions parallel to the plane (X direction and Y direction). A laser device 14, a solder supply device 16 that supplies solder S (thread solder) to the welding target portions 200 a and 200 b, a control portion (control means) 18, and a display portion 20 are provided.

  The laser device 14 has a laser oscillator 22 that oscillates the laser light L, an optical fiber 24 that transmits the laser light L oscillated from the laser oscillator 22, and a laser light L emitted from the optical fiber 24 toward the workpiece W. And an emission unit 26 that emits light.

  The laser oscillator 22 includes an LD power source and an LD that oscillates a laser beam L having a predetermined wavelength based on a drive current of the LD power source. The LD power supply supplies drive current to the LD based on the laser control signal from the control unit 18. The LD oscillates an output laser beam L corresponding to the drive current supplied from the LD power source. The LD can be configured as a so-called FC-LD (fiber coupling laser diode). However, the laser oscillator 22 is not limited to the above configuration, and various configurations can be adopted.

  The emission unit 26 reflects the laser beam L emitted from the optical fiber 24 and collimated by the collimator lens 28 toward the workpiece W, and the light collecting unit that collects the laser beam L reflected by the mirror 30. The lens 32 and the protective glass 34 for protecting the condensing lens 32 are included. The mirror 30 reflects the laser light L and transmits light having a wavelength different from the wavelength of the laser light L. As the mirror 30, for example, a general-purpose dielectric multilayer mirror can be used.

  Further, the emission unit 26 further includes a condenser lens 36 and an imaging unit (imaging unit) 38. The condensing lens 36 condenses the light (visible light VL) transmitted through the mirror 30 on the imaging unit 38. The imaging unit 38 receives the visible light VL collected by the condenser lens 36 and images the workpiece W. The visual axis of the imaging unit 38 is the optical axis of the laser beam L irradiated toward the workpiece W. It is coaxial. Information (image information) captured by the imaging unit 38 is output to the control unit 18. As the imaging unit 38, for example, a CCD camera can be used.

  The solder supply device 16 is fed from the reel 40 around which the solder S is wound, a roller portion 42 for feeding the solder S from the reel 40, a support portion 43 that supports the reel 40 and the roller portion 42, and the reel 40. And a nozzle 44 for guiding the solder S to the welding target parts 200a and 200b. The support portion 43 is fixed to the emission unit 26.

  The nozzle 44 is supported by a slider 46 configured to be movable with respect to the emission unit 26 in the arrangement direction (Y direction) of the welding target portions 200a and 200b. Accordingly, the solder tip can be moved in the Y direction by moving the slider 46 with respect to the emission unit 26. The solder supply device 16 can employ any configuration, and for example, may be provided so as to be movable with respect to the workpiece W independently of the laser device 14.

  The control unit 18 includes a stage drive control unit 48, a laser oscillation control unit 50, a solder supply control unit 52, a slider drive control unit 54, an imaging control unit 56, a storage unit 58, an image processing unit 60, a calculation unit 62, and a display control unit. 64 and a determination unit 66.

  The stage drive control unit 48 moves the stage 12 in the X direction and the Y direction. The laser oscillation control unit 50 outputs a predetermined laser control signal to the laser oscillator 22 to oscillate the laser light L from the laser oscillator 22. The solder supply control unit 52 drives and controls the roller unit 42 of the solder supply device 16 to send and return the solder S. The slider drive control unit 54 drives and controls the slider 46 to slide the nozzle 44 of the solder supply device 16 in the Y direction.

  The imaging control unit 56 controls the imaging unit 38 to image the tip end portion of the solder S and the welding target portions 200a and 200b. The storage unit 58 stores the image information output from the imaging unit 38. The image processing unit 60 extracts difference image information from a plurality of pieces of image information captured by the imaging unit 38.

  The calculation unit 62 calculates position information (land position information and terminal position information) and solder tip position information of the welding target parts 200a and 200b. In the present embodiment, the land position information refers to information on the center positions (land positions P1) of the lands 206a and 206b, and the terminal position information refers to information on the center positions (terminal positions P2) of the terminals 210a and 210b. Further, the calculation unit 62 calculates the shape of the tip of the solder S. The display control unit 64 causes the display unit 20 to display the images captured by the imaging unit 38 (the first image 70 and the second image 74) and the difference image 76 generated by the image processing unit 60.

  The determination unit 66 determines whether or not the positions of the welding target portions 200a and 200b are within the allowable range of the predetermined set position. That is, the determination unit 66 determines whether or not the land position P1 is within the allowable range of the land setting position, and determines whether or not the terminal position P2 is within the allowable range of the terminal setting position. The determination unit 66 determines whether or not the solder tip position P3 is within an allowable range of the solder tip setting position. Further, the determination unit 66 determines whether or not the shape of the tip of the solder S is an abnormal shape.

  The laser welding system 10 according to the present embodiment is basically configured as described above. Hereinafter, a laser welding method (laser soldering method) using the laser welding system 10 will be described with reference to FIGS. This will be described with reference to FIG.

  First, the control part 18 performs a welding preparation process (step S1 of FIG. 2). That is, the slider drive control unit 54 moves the slider 46 in the Y direction, and the solder supply control unit 52 controls the driving of the roller unit 42 to send the solder S so that the tip of the solder S is within the imaging range of the imaging unit 38. To place. In addition, the stage drive control unit 48 arranges the welding target part 200 a to be soldered by moving the stage 12 in the X direction and the Y direction at a position where the laser beam L can be irradiated within the imaging range of the imaging unit 38.

  Subsequently, in the first imaging step, the imaging unit 38 images the first region 68 including the welding target portion 200a and the tip of the solder S (see step S2, FIG. 6A). The image information (first image information) captured in the first imaging process is output to the control unit 18 and stored in the storage unit 58. At this time, the display control unit 64 may cause the display unit 20 to display the first image 70 captured in the first imaging process (see FIG. 7A).

  Next, the control part 18 performs a movement process (refer step S3 and FIG. 6B). That is, the solder S is moved so that the tip of the solder S is located outside the imaging range of the imaging unit 38. In the present embodiment, the solder supply control unit 52 drives and controls the roller unit 42 to return the solder S. However, in the moving process, the slider drive control unit 54 may drive the slider 46 to move the solder S in the Y direction. Needless to say, in the moving step, the solder supply control unit 52 and the slider drive control unit 54 may move the solder S in the X direction and the Y direction.

  Thereafter, in the second imaging step, the imaging unit 38 images the second region 72 that includes the welding target portion 200a and does not include the solder tip (step S4, see FIG. 6B). The image information (second image information) captured in the second imaging process is output to the control unit 18 and stored in the storage unit 58. At this time, the display control unit 64 may display the second image 74 captured in the second imaging process on the display unit 20 (see FIG. 7B).

  In the image processing step, the image processing unit 60 generates difference image information from the first image information and the second image information stored in the storage unit 58 (step S5). As a result, only the solder tip portion of the first image information is extracted. At this time, the display control unit 64 may display the difference image 76 generated in the image processing step on the display unit 20 (see FIG. 7C).

  Subsequently, the control unit 18 performs a calculation process (step S6). That is, the calculation unit 62 calculates land position information from the first image information or the second image information (step S20 in FIG. 3). In addition, the calculation unit 62 calculates terminal position information from the first image information or the second image information (step S21).

  Further, the calculation unit 62 calculates solder tip position information from the difference image information (step S22). Furthermore, the calculation unit 62 calculates the shape of the tip of the solder S from the difference image information (step S23).

  Subsequently, the display control unit 64 causes the display unit 20 to display land position information, terminal position information, and solder tip position information (step S7 in FIG. 2). Then, the determination unit 66 determines whether or not the calculated shape of the tip of the solder S is an abnormal shape (step S8). In other words, the determination unit 66 determines the quality of the solder S based on the shape of the tip of the solder S.

  That is, the determination unit 66 determines that the shape is abnormal when the shape of the tip of the solder S affects the quality of soldering. In the present embodiment, for example, when the tip of the solder S is excessively bulged (see FIG. 8A), the determination unit 66 increases the supply amount of the solder S from an appropriate amount. It determines with the shape of the front-end | tip part being an abnormal shape. In addition, for example, when the tip of the solder S is excessively curved (see FIG. 8B), the determination unit 66 cannot supply the solder S to an appropriate solder supply position. It is determined that the shape is not an abnormal shape.

  When the determination unit 66 determines that the shape of the tip of the solder S is an abnormal shape (step S8: YES), the control unit 18 performs the laser welding system 10 (stage 12, laser device 14, and solder supply device 16). Is stopped (step S9). Thereby, the welding failure by the abnormal shape of the front-end | tip part of the solder S is suppressed. At this stage, the current flowchart ends. In this step S9, for example, an automatic solder cutting mechanism (cutter) (not shown) of the solder supply device 16 cuts the tip of the solder S or, for example, notifies that the solder supply device 16 is abnormal. The user may be prompted to cut the tip of the solder S or replace the reel 40. In this case, after the process of step S9, the process after step S1 can be performed.

  On the other hand, when the determination unit 66 determines that the shape of the tip of the solder S is not an abnormal shape (allowable shape) (step S8: NO), the control unit 18 performs a positioning process (step S10). That is, the stage drive control unit 48 corrects the land position P1 to a predetermined land setting position by moving the stage 12 in the X direction and the Y direction based on the calculated land position information (step S30 in FIG. 4). . Thereby, the laser beam L can be irradiated to the desired position of the welding target part 200a.

  Further, the control unit 18 corrects the solder tip position P3 to the solder tip setting position (step S31, see FIG. 9). Specifically, the slider drive control unit 54 moves the slider 46 in the Y direction based on the calculated solder tip position information, thereby causing the solder tip position P3 in the Y direction to correspond to the terminal position P2. Further, the solder supply control unit 52 rotates the roller unit 42 based on the calculated solder tip position information to send or return the solder S, thereby setting a predetermined interval between the solder tip position P3 and the terminal position P2 in the X direction. Make length.

  Then, the control part 18 performs a confirmation process (step S11 of FIG. 2). In this confirmation step, as shown in FIG. 5, the first imaging step (step S40), the moving step (step S41), the second imaging step (step S42), the image processing step (step S43), and the calculation step (step S44). ) And the display step (step S45) are sequentially performed.

  Since the processing from step S40 to step S45 is the same as the processing from step S2 to step S7 described above, detailed description thereof is omitted. However, in the calculation process of step S44, the process from step S20 to step S22 of FIG. 3 is performed, and the process of step S23 is not performed.

  Next, the determination unit 66 determines whether or not the land position P1 is within the allowable range of the land setting position (step S46). When the determination unit 66 determines that the land position P1 is not within the allowable range of the land setting position (step S46: NO), the processing after step S1 is performed.

  When the determination unit 66 determines that the land position P1 is within the allowable range of the land setting position (step S46: YES), the determination unit 66 determines whether the solder tip position P3 is within the allowable range of the solder tip setting position. It is determined whether or not (step S47). When it is determined by the determination unit 66 that the solder tip position P3 is not within the allowable range of the solder tip setting position (step S47: NO), the processing after step S1 is performed.

  When the determination unit 66 determines that the solder tip position P3 is within the allowable range of the solder tip setting position (step S47: YES), the control unit 18 performs a soldering process (step S12 in FIG. 2).

  In this soldering process, the solder supply control unit 52 drives and controls the roller unit 42 to start supplying the solder S. At this time, since the solder tip position P3 is within the allowable range of the solder tip setting position, the solder S is supplied to an appropriate position of the welding target portion 200a.

  Further, the laser oscillation control unit 50 drives and controls the laser oscillator 22 to oscillate the laser light L from the laser oscillator 22. The laser light L oscillated from the laser oscillator 22 is emitted from the optical fiber 24, collimated by the collimator lens 28, reflected by the mirror 30, and directed toward the solder S which is supplied by the condenser lens 32. Focused irradiation. At this time, since the land position P1 is within the allowable range of the land setting position and the terminal position P2 is within the allowable range of the terminal setting position, the laser beam L can be easily applied to an appropriate position (solder supply position) of the welding target portion 200a. And it can irradiate reliably (refer FIG. 10).

  Then, the solder S irradiated with the laser beam L melts and wets and spreads over the entire land 206a, and the terminals 210a and the land 206a are soldered. Thereafter, the laser oscillation control unit 50 stops the oscillation of the laser beam L from the laser oscillator 22 and the solder supply control unit 52 controls the roller unit 42 to stop the feeding of the solder S.

  In the soldering process, the land 206a may be irradiated with the laser light L before the supply of the solder S is started, and the land 206a may be preliminarily heated. In this way, the wettability of the solder S with respect to the land 206a can be improved.

  Next, the control unit 18 determines whether or not the soldering of all the welding target parts 200a and 200b has been completed (step S13). When the control unit 18 determines that the soldering of all the welding target portions 200a and 200b has not been completed (step S13: NO), the processing after step S1 is performed. That is, in this embodiment, after the soldering of the welding target part 200a is completed, the soldering process of the welding target part 200b is started. The description of the soldering of the welding target part 200b is the same as the soldering of the welding target part 200a described above, and will be omitted.

  On the other hand, when the control unit 18 determines that the soldering of all the welding target parts 200a and 200b is completed (step S13: YES), the current flowchart ends.

  According to this embodiment, the land position information and the terminal position information are calculated from the first image information or the second image information obtained in the image information acquisition process (first imaging process and second imaging process), and difference image information is obtained. Solder tip position information is calculated from (step S6). Then, based on the position information (land position information) of the welding target parts 200a and 200b and the solder tip position information, the welding target parts 200a and 200b and the tip of the solder S are positioned (step S10).

  Thereby, even if it is a case where terminal position P2 with respect to land position P1 changes with each welding object parts 200a and 200b, solder tip position P3 can be adjusted according to the assembly state of welding object parts 200a and 200b. Therefore, since an appropriate amount of solder S can be supplied to an appropriate position of the welding target parts 200a and 200b regardless of the tolerance of the welding target parts 200a and 200b, the welding quality can be stabilized.

  In the present embodiment, in the first image 70, since the conductive pattern 212a and the solder tip end overlap, the shape of the tip end of the solder S may not be accurately recognized. However, even in such a case, since the solder tip position information and the shape of the tip of the solder S are calculated based on the difference image information, the solder tip position information and the shape of the tip of the solder S are accurate. Can be calculated.

  Moreover, since the quality determination of the solder S is performed based on the shape of the tip part of the solder S calculated from the difference image information (step S8), it is possible to suppress poor welding due to an abnormality in the shape of the tip part of the solder S. it can. Therefore, the welding quality can be further stabilized.

  Furthermore, in this embodiment, in the confirmation process after the positioning process, when the land position P1 and the solder tip position P3 are not within the allowable range of the predetermined set position, the processes from step S1 to step S10 are performed again. As a result, each of the lands 206a, 206b and the tip of the solder S can be reliably positioned within the allowable range of the predetermined set position, so that the welding quality can be further stabilized.

(Second Embodiment)
Next, a laser welding method according to the second embodiment of the present invention will be described with reference to FIGS. The laser welding method according to the second embodiment is the same as the laser welding system 10 described in the first embodiment. In the laser welding method according to the present embodiment, detailed description of the same steps as those of the laser welding method according to the first embodiment described above is omitted. The same applies to a third embodiment to be described later.

  In the present embodiment, first, the control unit 18 performs a welding preparation process (step S50 in FIG. 11). That is, as shown in FIG. 13A, the slider drive control unit 54 moves the slider 46 in the Y direction and the solder supply control unit 52 drives and controls the roller unit 42 to feed or return the solder S. Is arranged within the imaging range of the imaging unit 38. Further, the slider drive control unit 54 moves the stage 12 and arranges the ungrounded surface of the printed wiring board 202 where the conductive patterns 212a and 212b are not formed at a position corresponding to the tip of the solder S. Note that the slider drive control unit 54 may move the stage 12 so that the non-ground surface of the members other than the printed wiring board 202 is disposed at a position corresponding to the tip of the solder S.

  Subsequently, in the first imaging step, the imaging unit 38 images the first region 78 including the tip of the solder S arranged corresponding to the ground surface of the printed wiring board 202 (step S51). The image information (first image information) captured in the first imaging process is output to the control unit 18 and stored in the storage unit 58. At this time, the display control unit 64 may cause the display unit 20 to display the first image 80 imaged in the first imaging process (see FIG. 14A).

  Next, the control part 18 performs a movement process (step S52). That is, the stage drive control unit 48 moves the stage 12 and arranges the welding target portion 200 a within the imaging range of the imaging unit 38.

  Thereafter, in the second imaging step, the imaging unit 38 images the second region 82 including at least the welding target portion 200a (see step S53, FIG. 13B). In the present embodiment, the second region 82 includes the tip portion of the solder S, but the tip portion of the solder S may not be included. The image information (second image information) captured in the second imaging process is output to the control unit 18 and stored in the storage unit 58. At this time, the display control unit 64 may display the second image 84 captured in the second imaging step on the display unit 20 (see FIG. 14B).

  And the control part 18 performs a calculation process (step S54). That is, the calculation unit 62 calculates land position information from the second image information (step S20 in FIG. 3). Further, the calculation unit 62 calculates terminal position information from the second image information (step S21). Further, the calculation unit 62 calculates solder tip position information from the first image information (step S22). Furthermore, the calculation unit 62 calculates the shape of the tip of the solder S from the first image information (step S23).

  Subsequently, the display control unit 64 displays the land position information, the terminal position information, and the solder tip position information on the display unit 20 (step S55 in FIG. 11). And when the determination part 66 determines with the shape of the front-end | tip part of the solder S being an abnormal shape (step S56: YES), the control part 18 stops operation | movement of the laser welding system 10 (step S57), and this time The flowchart ends.

  On the other hand, when the determination unit 66 determines that the shape of the tip of the solder S is not an abnormal shape (step S56: NO), the control unit 18 performs a positioning process (step S58). In this positioning step, the processes in steps S30 and S31 in FIG. 4 are performed.

  Thereafter, the control unit 18 performs a confirmation process (step S59). In this confirmation step, as shown in FIG. 12, the first imaging step (step S70), the moving step (step S71), the second imaging step (step S72), the calculation step (step S73), and the display step (step S74). ) Are performed sequentially. The processing from step S70 to step S74 is the same as the processing from step S51 to step S55 described above. However, in the calculation step of step S73, the processing from step S20 to step S22 in FIG. 3 is performed, and the processing of step S23 is not performed.

  Next, the determination part 66 performs the process of step S75 and step S76. The processing of step S75 and step S76 is the same as the processing of step S46 and step S47 of the first embodiment described above.

  Subsequently, after performing the soldering process (step S60 in FIG. 11), the control unit 18 does not complete the soldering of all the welding target parts 200a and 200b (step S61: NO), Returning to the process of step S50, soldering of the next welding target portion 200b is started. On the other hand, when the soldering of all the welding target portions 200a and 200b has been completed (step S61: YES), the current flowchart ends.

  According to the present embodiment, the solder tip position information is calculated from the first image information obtained by imaging the first region 68 including the tip portion of the solder S arranged corresponding to the ground surface of the printed wiring board 202. Therefore, the solder tip position information can be accurately calculated. In this case, since it is not necessary to generate difference image information, the control can be simplified.

(Third embodiment)
Next, a laser welding method according to the third embodiment of the present invention will be described with reference to FIGS. As can be seen from FIG. 17, in the third embodiment, the conductive patterns 212a and 212b are not formed on the workpiece W. That is, the vicinity of the welding target parts 200a and 200b in the printed wiring board 202 is ungrounded.

  In the present embodiment, first, the control unit 18 performs a welding preparation process (step S80 in FIG. 15). That is, the slider drive control unit 54 moves the slider 46 in the Y direction, and the solder supply control unit 52 controls the driving of the roller unit 42 to send the solder S so that the tip of the solder S is within the imaging range of the imaging unit 38. To place. Further, the slider drive control unit 54 moves the stage 12 and arranges the ungrounded surface of the printed wiring board 202 where the conductive patterns 212a and 212b are not formed at a position corresponding to the tip of the solder S.

  Subsequently, in the imaging process, the imaging unit 38 captures an area 86 including the tip end portion of the solder S and the welding target portion 200a disposed corresponding to the ground surface of the printed wiring board 202 (step S81, FIG. 17). reference). Image information captured in the imaging process is output to the control unit 18 and stored in the storage unit 58. At this time, the display control unit 64 may display the image 88 captured in the imaging process on the display unit 20 (see FIG. 18).

  Next, the control part 18 performs a calculation process (step S82). That is, the calculation unit 62 calculates land position information, terminal position information, and solder tip position information from the stored image information (steps S20 to S22 in FIG. 3). Further, the calculation unit 62 calculates the shape of the tip of the solder S from the image information (step S23).

  Subsequently, the display control unit 64 causes the display unit 20 to display land position information, terminal position information, and solder tip position information (step S83 in FIG. 15). And when the determination part 66 determines with the shape of the front-end | tip part of the solder S being an abnormal shape (step S84: YES), the control part 18 stops operation | movement of the laser welding system 10 (step S85), and this time The flowchart ends.

  On the other hand, when the determination unit 66 determines that the shape of the tip of the solder S is not an abnormal shape (step S84: NO), the control unit 18 performs a positioning process (step S86). In this positioning step, the processes in steps S30 and S31 in FIG. 4 are performed.

  Thereafter, the control unit 18 performs a confirmation process (step S87). In this confirmation process, as shown in FIG. 16, an imaging process (step S90), a calculation process (step S91), and a display process (step S92) are sequentially performed. The processing from step S90 to step S92 is the same as the processing from step S81 to step S83 described above. However, in the calculation process of step S91, the process from step S20 to step S22 of FIG. 3 is performed, and the process of step S23 is not performed.

  Next, the determination part 66 performs the process of step S93 and step S94. The processing of step S93 and step S94 is the same as the processing of step S46 and step S47 of the first embodiment described above.

  Subsequently, after performing the soldering process (step S88 in FIG. 15), the control unit 18 does not complete the soldering of all the welding target parts 200a and 200b (step S89: NO), Returning to the process of step S80, soldering of the next welding target part 200b is started. On the other hand, when the soldering of all the welding target parts 200a and 200b has been completed (step S89: YES), the current flowchart ends.

  According to the present embodiment, the land position information, the terminal position information, the solder tip position information, and the image information acquired by imaging the area 86 including the tip part of the solder S and the welding target parts 200a and 200b, and The shape of the tip of the solder S is calculated. Thereby, since the position information and the shape of the tip of the solder S can be calculated by one imaging, the number of laser welding processes can be reduced.

  The laser welding method and the laser welding system according to the present invention are not limited to the above-described first to third embodiments, and can of course adopt various configurations without departing from the gist of the present invention. In the above-described embodiment, laser soldering has been described. However, the laser welding system and the laser welding method according to the present invention are applied to laser brazing in which a brazing material as a filler material is melted by laser light to weld a plurality of workpieces. May be.

DESCRIPTION OF SYMBOLS 10 ... Laser welding system 12 ... Stage 14 ... Laser apparatus 16 ... Solder supply apparatus 18 ... Control part 20 ... Display part 22 ... Laser oscillator 38 ... Imaging unit (imaging means)
48 ... Stage drive control unit 50 ... Laser oscillation control unit 52 ... Solder supply control unit 56 ... Imaging control unit 60 ... Image processing unit 62 ... Calculation unit 64 ... Display control unit 66 ... Determination unit 68, 78 ... First region 70, 80 ... 1st image 72, 82 ... 2nd area | region 74, 84 ... 2nd image 76 ... Difference image 200a, 200b ... Welding object part 202 ... Printed wiring board 204a, 204b ... Through hole 206a, 206b ... Land 208 ... Electronic component 210a, 210b ... terminals 212a, 212b ... conductive pattern L ... laser beam S ... solder W ... work

Claims (7)

In the laser welding method of welding the welding target part by melting the filler material supplied to the welding target part of the workpiece with laser light,
An image information acquisition step of acquiring predetermined image information by imaging the tip portion of the filler material and the welding target portion with an imaging means;
A calculation step of calculating position information of the welding target portion and tip position information of the filler material from the image information acquired in the image information acquisition step;
There lines and positioning step, the positioning of the tip and the welded portion of the filler material on the basis of the position information and end position information of the filler material of the welded portion that has been calculated in the calculation step,
The image information acquisition step includes a first imaging step of acquiring first image information by imaging a first region including a tip portion of the filler material and the welding target portion;
A second imaging step of acquiring second image information by imaging a second region that is the same region as the first region and includes the welding target portion and does not include the tip portion of the filler metal. And
Further performing an image processing step of generating difference image information by extracting a difference between the first image information acquired in the first imaging step and the second image information acquired in the second imaging step;
In the calculation step, position information of the welding target portion is calculated from the first image information acquired in the first imaging step or the second image information acquired in the second imaging step, and the image processing step The tip position information of the filler material is calculated from the difference image information generated in
And a laser welding method. In the laser welding method of welding the welding target part by melting the filler material supplied to the welding target part of the workpiece with laser light,
An image information acquisition step of acquiring predetermined image information by imaging the tip portion of the filler material and the welding target portion with an imaging means;
A calculation step of calculating position information of the welding target portion and tip position information of the filler material from the image information acquired in the image information acquisition step;
A positioning step of positioning the tip of the filler material and the welding target portion based on the position information of the welding target portion calculated in the calculation step and the tip position information of the filler material, and
The image information acquisition step includes a first imaging step of acquiring first image information by imaging a first region including a tip portion of the filler material arranged corresponding to a ground surface;
A second imaging step of acquiring second image information by imaging a second region that is different from the first region and includes at least the welding target portion;
In the calculation step, tip position information of the filler material is calculated from the first image information acquired in the first imaging step, and the welding target is calculated from the second image information acquired in the second imaging step. Calculating the position information of the part,
And a laser welding method. In the laser welding method according to claim 1 or 2 ,
In the calculation step, the shape of the tip of the filler material is calculated from the image information acquired in the image information acquisition step,
Further performing a determination step of determining pass / fail of the filler material based on the shape of the tip of the filler material calculated in the calculation step.
And a laser welding method. In the laser welding method of any one of Claims 1-3 ,
Further performing a confirmation step of determining whether or not each of the tip position of the filler material and the position of the welding target portion positioned in the positioning step is within an allowable range of a predetermined set position,
When it is determined in the confirmation step that at least one of the tip position of the filler material and the position of the welding target portion is not within the allowable range of the set position, the image information acquisition step, the calculation step And the positioning step is performed again.
And a laser welding method. In the laser welding system for welding the welding target part by melting the filler material supplied to the welding target part of the workpiece with laser light,
Imaging means for imaging the tip of the filler material and the welding target part;
A calculation unit that calculates position information of the welding target part and tip position information of the filler material from image information captured by the imaging unit;
Positioning control means for positioning the tip of the filler material and the welding target part based on the position information of the welding target part calculated by the calculation part and the tip position information of the filler material;
The first image information obtained by imaging the first region including the tip of the filler material and the welding target portion with the imaging means is the same region as the first region, and the welding target portion is An image processing unit that generates difference image information by extracting a difference from the second image information obtained by imaging the second region that does not include the tip of the filler material by the imaging unit; Bei to give a,
The calculation unit calculates position information of the welding target portion from the first image information or the second image information, and calculates tip position information of the filler material from the difference image information.
A laser welding system characterized by that. In the laser welding system for welding the welding target part by melting the filler material supplied to the welding target part of the workpiece with laser light,
Imaging means for imaging the tip of the filler material and the welding target part;
A calculation unit that calculates position information of the welding target part and tip position information of the filler material from image information captured by the imaging unit;
Positioning control means for positioning the tip of the filler material and the welding object part based on the position information of the welding object part calculated by the calculation part and the tip position information of the filler material,
The calculator calculates the tip of the filler material from the first image information obtained by imaging the first region including the tip of the filler material arranged corresponding to a non-ground surface with the imaging means. The position information is calculated, and from the second image information obtained by imaging the second region that is different from the first region and includes at least the welding target portion with the imaging unit, the position of the welding target portion is calculated. Calculate location information,
A laser welding system characterized by that. The laser welding system according to claim 5 or 6 ,
The calculation unit calculates the shape of the tip of the filler material from image information obtained by imaging with the imaging unit,
A determination unit for determining the quality of the filler material based on the shape of the tip of the filler material calculated by the calculation unit;
A laser welding system characterized by that.

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