JP6292026B2 - package - Google Patents

Description

  The present invention relates to a package.

  For example, a package in which an element such as a MEMS (Micro Electro Mechanical Systems) element is hermetically sealed is known (see, for example, Patent Documents 1 and 2).

  For example, in a package that accommodates an optical element such as a MEMS element for a biaxial sensor used in a vehicle-mounted HUD (Head Up Display) or the like, an opening in which a light transmissive member such as a glass material is disposed is used as a light capturing surface. A provided metal lid member is used. The lid member is joined to the package substrate by seam welding.

  A light transmissive member attached to a lid member when the lid member is joined to the package substrate by seam welding using a lid member in which the light capturing surface and the light transmissive member are inclined with respect to the element mounting surface of the package substrate There was a problem of cracks or cracks.

  An object of the present invention is to suppress damage to a light transmissive member when a lid member on which the light transmissive member is disposed is joined to a package substrate by seam welding.

  The package according to the present invention includes a package substrate, an element mounted on the package substrate, a lid member having an opening in a light capturing surface facing the package substrate, and joined to the package substrate by seam welding, A light transmissive member disposed in the opening of the light capturing surface of the lid member, and the light capturing surface of the lid member and the light transmissive member with respect to the mounting surface of the element of the package substrate. The light transmissive member has a plane dimension larger than that of the opening, and the peripheral portion of the light transmissive member is disposed around the opening so as to overlap the light capturing surface. The portion of the light transmissive member that overlaps the light capturing surface and is located relatively close to the package substrate It is characterized in that the thickness as compared with the portion disposed target position far is large.

  The package of the present invention can suppress damage to the light transmissive member when the lid member on which the light transmissive member is disposed is joined to the package substrate by seam welding.

It is the schematic sectional drawing and top view for demonstrating one Example of a package. It is the schematic sectional drawing and the top view for demonstrating the other Example of a package. It is the schematic sectional drawing and top view for demonstrating the further another Example of a package. It is the schematic sectional drawing and top view for demonstrating the further another Example of a package.

  In the case where the light capturing surface of the lid member and the light transmissive member are inclined, the inventor of the present application applies the light transmissive member portion disposed at a relatively close position to the package substrate during seam welding. It has been found that a relatively large stress occurs.

  In the first aspect of the package according to the present invention, the portion of the light transmissive member that overlaps the light capturing surface, and the portion that is disposed relatively close to the package substrate is positioned relatively far away. The thickness is larger than the portion where it is placed. Therefore, the first aspect of the package of the present invention can suppress damage to the light transmissive member even if stress is applied to the light transmissive member when the lid member is joined to the package substrate by seam welding.

  According to a second aspect of the package of the present invention, there is provided a package substrate, an element mounted on the package substrate, and a lid having an opening on a light capturing surface facing the package substrate and joined to the package substrate by seam welding. A light transmissive member disposed in the opening of the light capturing surface of the lid member, wherein the light capturing surface of the lid member and the light transmissive member are mounted on the element of the package substrate. The light-transmitting member has a larger planar dimension than the opening, and a peripheral portion of the light-transmitting member is disposed around the opening to form the light capturing surface. The portion of the light transmissive member that overlaps the light capturing surface and is positioned relatively close to the package substrate. Moieties are those wherein the area overlapping the light capture plane as compared to the portion that is located relatively far position is smaller.

  In the second aspect of the package of the present invention, the portion of the light-transmitting member that overlaps the light capturing surface and that is disposed at a relatively close position with respect to the package substrate is disposed at a relatively distant position. Compared to the portion, the area overlapping the light capturing surface is smaller. Therefore, the second aspect of the package of the present invention can reduce the stress applied to the light transmissive member when the lid member is joined to the package substrate by seam welding, and suppresses damage to the light transmissive member. Can do.

  According to a third aspect of the package of the present invention, there is provided a package substrate, an element mounted on the package substrate, a lid having an opening on a light capturing surface facing the package substrate, and joined to the package substrate by seam welding. A light transmissive member disposed in the opening of the light capturing surface of the lid member, wherein the light capturing surface of the lid member and the light transmissive member are mounted on the element of the package substrate. The light-transmitting member has a larger planar dimension than the opening, and a peripheral portion of the light-transmitting member is disposed around the opening to form the light capturing surface. The opening of the light capturing surface has a substantially circular planar shape and is disposed at a position relatively close to the package substrate. It is characterized in that the arc portion of the minute is cut out.

  In the third aspect of the package of the present invention, the opening of the light capturing surface has a substantially circular planar shape, and the arc portion of the portion disposed at a relatively close position with respect to the package substrate is cut away. Therefore, the third aspect of the package of the present invention can reduce the stress applied to the light transmissive member when the lid member is joined to the package substrate by seam welding, and suppresses damage to the light transmissive member. Can do.

  According to a fourth aspect of the package of the present invention, there is provided a package substrate, an element mounted on the package substrate, a lid having an opening on a light capturing surface facing the package substrate, and joined to the package substrate by seam welding. A light transmissive member disposed in the opening of the light capturing surface of the lid member, wherein the light capturing surface of the lid member and the light transmissive member are mounted on the element of the package substrate. The light-transmitting member has a larger planar dimension than the opening, and a peripheral portion of the light-transmitting member is disposed around the opening to form the light capturing surface. The light capturing surface of the lid member is a portion that does not overlap the light transmissive member and is relatively close to the package substrate. It is characterized in that the thickness compared to the portion where the portion disposed location is located in a position relatively far is large.

  In the fourth aspect of the package of the present invention, the light capturing surface of the lid member is a portion that does not overlap the light transmissive member, and a portion that is disposed at a relatively close position to the package substrate is a relatively far position. The thickness is larger than that of the portion disposed in the. Therefore, the fourth aspect of the package of the present invention can reduce the stress applied to the light transmissive member when the lid member is joined to the package substrate by seam welding, and suppresses damage to the light transmissive member. Can do.

  In the package of the present invention, an example in which the planar shape of the opening is circular or substantially circular can be given. Here, the substantially circular shape includes an ellipse or a shape obtained by cutting out a part of a circular or elliptical arc. In the package of the present invention, the planar shape of the opening is not limited to a circle or a substantially circle.

  In the package of the present invention, an example in which the lid member is formed of a metal material can be given. However, in the package of the present invention, the material of the lid member is not limited to a metal material.

  Further, in the package of the present invention, the lid member includes a flange on a side surface at a position spaced from the light capturing surface, and the flange of the lid member is joined to the package substrate by seam welding. Can be mentioned. However, in the package of the present invention, the shape of the lid member and the configuration of the seam welding portion are not limited to this configuration.

  In the package of the present invention, an example in which the lid member has a hollow, substantially cylindrical shape can be given. However, in the package of the present invention, the shape of the lid member is not limited to a hollow, substantially cylindrical shape.

  In the package of the present invention, an example in which the planar shape of the light transmissive member is circular or substantially circular can be given. Here, the substantially circular shape includes an ellipse or a shape obtained by cutting out a part of a circular or elliptical arc. In the package of the present invention, the planar shape of the light transmissive member is not limited to a circle or a substantially circle.

  In the package of the present invention, an example in which the light transmissive member is formed of a glass material can be given. Examples of the glass material include quartz glass and borosilicate glass. In the package of the present invention, the material of the light transmissive member is not limited to a glass material.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a schematic cross-sectional view and plan view for explaining an embodiment of a package. In FIG. 1, the cross-sectional view corresponds to the position AA in the plan view.

  The package 1 includes a package substrate 3, an element 5, a lid 7 (lid member), and a light transmissive member 9.

  The package substrate 3 is a ceramic substrate, for example. The package substrate 3 includes a plurality of electrodes 11 on the element mounting surface. Although not shown, the package substrate 3 has electrodes formed on the back surface opposite to the element mounting surface. The material of the package substrate 3 is not limited to ceramic.

  The electrode 11 on the element mounting surface side and the electrode on the back surface side are electrically connected via a conductive member formed inside the package substrate 3. The planar size of the package substrate 3 is, for example, 10 to 25 mm × 10 to 25 mm (millimeter). The thickness of the package substrate 3 is, for example, 1.0 to 2.5 mm.

  The element 5 is mounted on the element mounting surface of the package substrate 3. The element 5 is an optical element such as a MEMS mirror formed by the MEMS technique, for example. However, the element 5 is not limited to the MEMS mirror, and may be another element such as a digital mirror device, a light emitting element, a light receiving element, an optical element such as an optical sensor, or an electronic component.

  The element 5 includes a plurality of electrodes (not shown) on the surface opposite to the surface facing the package substrate 3. The electrodes of the package substrate 3 are electrically connected to the electrodes 11 of the package substrate 3 through bonding wires 13. The potential of the electrode of the element 5 is taken out to the electrode on the back surface of the package substrate 3 through the bonding wire 13, the electrode 11, and an internal conductive member.

  A seal ring 15 is formed on the element mounting surface of the package substrate 3. The seal ring 15 is made of a metal material, for example, a brazed Fe—Ni—Co alloy. The seal ring 15 is formed in a frame shape so as to surround the mounting position of the element 5 and the formation position of the electrode 11.

  The lid 7 includes a lid body 7a and a first light capturing surface 7b. The lid body 7a has a substantially cylindrical convex shape, for example, and has a flange portion 7c that extends outward at the lower end portion of the side surface of the convex shape. An opening 7e is formed in the second light capturing surface 7d at the upper end of the convex shape of the lid body 7a. The second light capturing surface 7 d is inclined with respect to the element mounting surface of the package substrate 3.

  For example, the lid body 7a is formed by press-drawing a metal plate having a thickness of 0.05 to 0.10 mm. The material of the lid body 7a is, for example, an Fe—Ni—Co alloy.

  The diameter of the cylindrical portion of the lid body 7a is, for example, 10 to 15 mm. The outer periphery dimension of the collar part 7c is 12-20 mm x 12-20 mm, for example. The second light capturing surface 7d is inclined, for example, by about 13 degrees with respect to the surface on which the flange portion 7c is formed. The height of the cylindrical portion of the lid body 7a is, for example, 1.0 to 1.5 mm at the lowest portion (left side in FIG. 1) and 5 to 8 mm at the highest portion (right side in FIG. 1). The opening 7e is, for example, a circle having a diameter of 5 to 13 mm. The opening 7e is formed substantially at the center of the second light capturing surface 7d.

The first light capturing surface 7b has an annular shape having an opening 7f at the center. The first light capturing surface 7b is disposed inside the lid main body 7a, and is attached to the second light capturing surface 7d with an adhesive, for example. The first light capturing surface 7 b is disposed to be inclined with respect to the element formation surface of the package substrate 3.
In this embodiment, the first light capturing surface 7b and the second light capturing surface 7d constitute a light capturing surface in the package of the present invention.

  The thickness of the first light capturing surface 7b is, for example, 0.1 to 0.5 mm. The outer diameter of the first light capturing surface 7b is, for example, 6 to 12 mm. The side surface of the opening 7f (inner diameter side surface of the first light capturing surface 7b) is formed in a tapered shape, for example. The size of the opening 7f is, for example, 5 to 10 mm on the side where the tapered shape is widened (the second light capturing surface 7d side), and 5 to 10 mm on the side where the tapered shape is narrowed (the light transmitting member 9 side). It is. The first light capturing surface 7b is made of, for example, a metal material, and here is made of an Fe—Ni—Co alloy.

  The light transmissive member 9 is disposed inside the lid 7 and is disposed so as to close the openings 7e and 7f of the second light capturing surface 7d and the first light capturing surface 7b. The light transmissive member 9 is attached to the first light capturing surface 7b by, for example, an adhesive or a brazing material. The light transmissive member 9 is made of a material that transmits light having a wavelength to be used, and is made of a glass material such as quartz glass or borosilicate glass. The light transmissive member 9 is attached to the second light capturing surface 7d via the first light capturing surface 7b. The light transmissive member 9 is disposed to be inclined with respect to the element formation surface of the package substrate 3.

  The planar shape of the light transmissive member 9 is, for example, a circle. The light transmissive member 9 has a larger planar dimension than the openings 7 e and 7 f of the lid 7. The outer diameter of the light transmissive member 9 is, for example, 10 to 18 mm. The peripheral portion of the light transmissive member 9 is disposed around the opening 7e and is disposed at a position overlapping the second light capturing surface 7d and the first light capturing surface 7b. In the present invention, the light transmissive member 9 only needs to have a larger planar dimension than the opening 7 f of the lid 7.

  Regarding the portion of the light transmissive member 9 that overlaps the second light capturing surface 7d and the first light capturing surface 7b, the thickness of the light transmissive member 9 is a relatively thick portion disposed at a position relatively close to the package substrate 3. The thickness is different between 9a and the thin portion 9b disposed at a relatively far position. The thick part 9a is thicker than the thin part 9b. The thickness of the thick portion 9a is, for example, 0.5 to 1.5 mm. The thickness of the thin portion 9b is, for example, 0.1 to 1.2 mm.

  As shown by a two-dot chain line in the plan view of FIG. 1, the thick portion 9a is provided in a portion surrounded by, for example, an arc and a chord. The planar shape of the thick portion 9a is not limited to this. For example, the planar shape of the thick portion 9a may be a sector shape.

  The flange portion 7c of the lid 7 and the seal ring 15 are joined by seam welding, and the element 5 arranged in the lid 7 is hermetically sealed.

  In this embodiment, the thick portion 9a that is overlapped with the light capturing surfaces 7b and 7d of the light transmissive member 9 and is relatively close to the package substrate 3 is disposed at a relatively distant position. The thickness is larger than the thin portion 9b. Therefore, in this embodiment, even when stress is applied to the light transmissive member 9 when the lid 7 is joined to the package substrate 3 by seam welding, the thickness of the thick portion 9a to which a large pressure is applied is large. Damage to the light transmissive member 9 can be suppressed.

  FIG. 2 is a schematic cross-sectional view and plan view for explaining another embodiment of the package. In FIG. 2, the cross-sectional view corresponds to the BB position in the plan view. In FIG. 2, portions having the same functions as those in FIG. 1 are denoted by the same reference numerals.

The package 1 of this embodiment is different in the shape of the light transmissive member 9 from the package 1 described with reference to FIG.
In this embodiment, the light transmissive member 9 has a substantially circular planar shape, and includes a notch portion 9c in which an arc portion is notched with respect to the circular shape. The thickness of the light transmissive member 9 is uniform, for example, 0.1 to 1.5 mm.

  The cutout portion 9 a of the light transmissive member 9 is disposed at a position relatively close to the package substrate 3 in the light transmissive member 9 disposed to be inclined with respect to the package substrate 3. The portion of the light transmissive member 9 that overlaps with the light capturing surfaces 7b and 7d, the portion disposed at a relatively close position with respect to the package substrate 3, is compared with the portion disposed at a relatively far position. The area overlapping the two light capturing surfaces 7d and the first light capturing surface 7b is small.

  Thereby, the package 1 of this embodiment can reduce the stress applied to the light transmissive member 9 when the lid 7 is joined to the package substrate 3 by seam welding, and suppresses damage to the light transmissive member 9. can do.

  FIG. 3 is a schematic cross-sectional view and plan view for explaining another embodiment of the package. In FIG. 3, the cross-sectional view corresponds to the CC position in the plan view. In FIG. 3, parts having the same functions as those in FIG.

The package 1 of this embodiment is different from the package 1 described with reference to FIG. 1 in the shape of the light transmissive member 9 and the shape of the opening 7f of the first light capturing surface 7b.
In this embodiment, the light transmissive member 9 has a circular planar shape and is formed with a uniform thickness. The thickness of the light transmissive member 9 is, for example, 0.1 to 1.5 mm.

  Further, the opening 7f of the first light capturing surface 7b has a substantially circular planar shape, and a circular arc portion that is disposed at a position relatively close to the package substrate 3 is notched.

  The package 1 of this embodiment can reduce the stress applied to the light transmissive member 9 when the lid 7 is joined to the package substrate 3 by seam welding, and can suppress damage to the light transmissive member 9. it can.

  FIG. 4 is a schematic cross-sectional view and plan view for explaining another embodiment of the package. In FIG. 4, the cross-sectional view corresponds to the DD position in the plan view. In FIG. 4, parts having the same functions as those in FIG.

The package 1 of this embodiment is different in the shape of the light transmissive member 9 and the structure of the lid 7 from the package 1 described with reference to FIG.
In this embodiment, the light transmissive member 9 has a circular planar shape and is formed with a uniform thickness. The thickness of the light transmissive member 9 is, for example, 0.1 to 1.5 mm.

  The lid 7 includes a reinforcing member 7g. The reinforcing member 7g is joined to the outer surface of the lid main body 7a through, for example, an adhesive or a brazing material. The reinforcing member 7g is formed over the flange portion 7c from the second light capturing surface 7d through the side surface of the lid main body 7a. On the second light capturing surface 7d, the reinforcing member 7g is arranged at a position relatively close to the package substrate 3 so as not to overlap the light transmissive member 9. Further, the reinforcing member 7g is arranged along a part of the side surface of the lid main body 7a and a part of the surface of the flange part 7c so as to continue from a part arranged on the second light capturing surface 7d.

  The portion of the reinforcing member 7g arranged on the second light capturing surface 7d constitutes the light capturing surface of the package of the present invention together with the first light capturing surface 7b and the second light capturing surface 7d. In the package 1 of this embodiment, the light capturing surface composed of the light capturing surfaces 7b and 7d and the reinforcing member 7g is a portion that does not overlap the light transmitting member 9 and is relatively close to the package substrate 3. The thickness of the portion arranged in the is larger than the portion arranged in a relatively far position. Thereby, the package 1 of this embodiment can reduce the stress applied to the light transmissive member 9 when the lid 7 is joined to the package substrate 3 by seam welding, and suppresses damage to the light transmissive member 9. can do.

  As mentioned above, although the Example of this invention was described, the numerical value, material, arrangement | positioning, number, etc. in the said Example are examples, This invention is not limited to these, It was described in the claim Various modifications are possible within the scope of the present invention.

  For example, in the above embodiment, the light capturing surface is formed by the plurality of light capturing surfaces 7b and 7d or the light capturing surfaces 7b and 7d and the reinforcing member 7g. However, in the package of the present invention, the configuration of the light capturing surface is these. It is not limited to. In the package of the present invention, the light capturing surface may be formed of a single layer member or may be formed by stacking four or more members.

1 Package 3 Package substrate 5 Element 7 Lid (lid member)
7b First light capturing surface 7c ridge 7d Second light capturing surfaces 7e, 7f Opening 9 Light transmitting member 9a Part 9b disposed relatively close to package substrate 9b Position relatively distant from package substrate The part placed in

JP 2009-194091 A JP 2010-166020 A

Claims (10)

A package substrate;
An element mounted on the package substrate;
A lid member having an opening in a light capturing surface facing the package substrate and joined to the package substrate by seam welding;
A light transmissive member disposed in the opening of the light capturing surface of the lid member,
The light capturing surface and the light transmissive member of the lid member are arranged to be inclined with respect to the mounting surface of the element of the package substrate,
The light transmissive member has a larger planar dimension than the opening;
A peripheral portion of the light transmissive member is disposed around the opening and is disposed at a position overlapping the light capturing surface;
The portion of the light transmissive member that overlaps the light capturing surface, and the portion that is disposed relatively close to the package substrate is thicker than the portion that is disposed relatively far away. Package characterized by becoming. A package substrate;
An element mounted on the package substrate;
A lid member having an opening in a light capturing surface facing the package substrate and joined to the package substrate by seam welding;
A light transmissive member disposed in the opening of the light capturing surface of the lid member,
The light capturing surface and the light transmissive member of the lid member are arranged to be inclined with respect to the mounting surface of the element of the package substrate,
The light transmissive member has a larger planar dimension than the opening;
A peripheral portion of the light transmissive member is disposed around the opening and is disposed at a position overlapping the light capturing surface;
The portion of the light transmissive member that overlaps the light capturing surface, the portion disposed at a relatively close position with respect to the package substrate, compared to the portion disposed at a relatively far position. A package characterized in that the area overlapping the surface is small. A package substrate;
An element mounted on the package substrate;
A lid member having an opening in a light capturing surface facing the package substrate and joined to the package substrate by seam welding;
A light transmissive member disposed in the opening of the light capturing surface of the lid member,
The light capturing surface and the light transmissive member of the lid member are arranged to be inclined with respect to the mounting surface of the element of the package substrate,
The light transmissive member has a larger planar dimension than the opening;
A peripheral portion of the light transmissive member is disposed around the opening and is disposed at a position overlapping the light capturing surface;
The package, wherein the opening of the light capturing surface has a substantially circular planar shape, and a circular arc portion of a portion disposed at a position relatively close to the package substrate is cut out. A package substrate;
An element mounted on the package substrate;
A lid member having an opening in a light capturing surface facing the package substrate and joined to the package substrate by seam welding;
A light transmissive member disposed in the opening of the light capturing surface of the lid member,
The light capturing surface and the light transmissive member of the lid member are arranged to be inclined with respect to the mounting surface of the element of the package substrate,
The light transmissive member has a larger planar dimension than the opening;
A peripheral portion of the light transmissive member is disposed around the opening and is disposed at a position overlapping the light capturing surface;
The light capturing surface of the lid member is a portion that does not overlap the light transmissive member, and a portion that is disposed relatively close to the package substrate is disposed relatively far away A package characterized in that it is thicker than.   The package according to claim 1, wherein the planar shape of the opening is circular or substantially circular.   The package according to any one of claims 1 to 5, wherein the lid member is formed of a metal material. The lid member includes a flange on a side surface at a position spaced from the light capturing surface,
The package according to any one of claims 1 to 6, wherein the flange portion of the lid member is joined to the package substrate by seam welding.   The package according to any one of claims 1 to 7, wherein the lid member has a hollow, substantially cylindrical shape.   The package according to any one of claims 1 to 8, wherein the planar shape of the light transmissive member is circular or substantially circular.   The package according to any one of claims 1 to 9, wherein the light transmissive member is formed of a glass material.

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