JP6289118B2 - Signal transmission path - Google Patents

Signal transmission path Download PDF

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JP6289118B2
JP6289118B2 JP2014009443A JP2014009443A JP6289118B2 JP 6289118 B2 JP6289118 B2 JP 6289118B2 JP 2014009443 A JP2014009443 A JP 2014009443A JP 2014009443 A JP2014009443 A JP 2014009443A JP 6289118 B2 JP6289118 B2 JP 6289118B2
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signal line
line conductors
conductor
cross
dielectric layer
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JP2015097371A (en
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崇 桑原
崇 桑原
慶洋 明星
慶洋 明星
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Mitsubishi Electric Corp
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Description

この発明は、複数の信号線導体の間隙を狭くすることで配線の高密度化が図られている信号伝送路に関するものである。   The present invention relates to a signal transmission line in which wirings are densified by narrowing gaps between a plurality of signal line conductors.

近年、高速のシリアル伝送路が複数本束ねられる多レーン化方式が登場しており、多レーン化方式によって信号伝送レートの向上が図られている。
しかし、高速のシリアル伝送路を束ねる場合、信号線間の信号漏洩（クロストーク）が発生してしまう問題がある。
クロストークを改善（低減）する対策として、複数の信号線の間隔を広げる方法は、簡単で効果的な方法であるが、近年の回路基板の小型化の要求に反する。
そこで、最近では、複数の信号線の間隔を広げることなく、クロストークを改善（低減）する方法が提案されている。 In recent years, a multi-lane system in which a plurality of high-speed serial transmission paths are bundled has appeared, and the signal transmission rate is improved by the multi-lane system.
However, when bundling high-speed serial transmission lines, there is a problem that signal leakage (crosstalk) occurs between signal lines.
As a measure for improving (reducing) crosstalk, a method of widening the interval between a plurality of signal lines is a simple and effective method, but it is contrary to the recent demand for miniaturization of circuit boards.
Therefore, recently, a method for improving (reducing) crosstalk without increasing the interval between a plurality of signal lines has been proposed.

例えば、以下の特許文献１には、基板平面と平行する方向の長さ（導体幅）が、基板厚さ方向の長さ（導体厚さ）よりも短くなるように、信号線導体の形状を設計することで、複数の信号線導体の間隔を広げることなく、クロストークを改善している信号伝送路が開示されている。
しかし、一般的な回路基板では、基板実装におけるエッチング処理などのし易さから、信号線導体の形状は、導体幅が導体厚さよりも長くなるように設計されるのが通例である。 For example, in Patent Document 1 below, the shape of the signal line conductor is set so that the length in the direction parallel to the substrate plane (conductor width) is shorter than the length in the substrate thickness direction (conductor thickness). A signal transmission path that improves crosstalk without increasing the interval between a plurality of signal line conductors by designing is disclosed.
However, in general circuit boards, the shape of the signal line conductors is usually designed so that the conductor width is longer than the conductor thickness, because of the ease of etching processing in board mounting.

また、以下の特許文献２には、信号線導体の長さに応じて、信号線導体の断面積の大きさ（縦横の寸法）を変えている信号伝送路が開示されている。
信号線導体の断面積を小さくすれば、信号線導体の高密度化を図ることができるが、その信号線導体の特性インピーダンスが変化するだけでなく、その信号線導体の直流抵抗値が大きくなる。 Patent Document 2 below discloses a signal transmission path in which the size (vertical and horizontal dimensions) of the cross-sectional area of the signal line conductor is changed according to the length of the signal line conductor.
If the cross-sectional area of the signal line conductor is reduced, the density of the signal line conductor can be increased, but not only the characteristic impedance of the signal line conductor changes, but also the DC resistance value of the signal line conductor increases. .

特開平５−２２００４号公報（段落番号［０００７］、図２）Japanese Patent Laid-Open No. 5-22004 (paragraph number [0007], FIG. 2) 特開平５−２９９７９０号公報（段落番号［００１３］、図１０）Japanese Patent Laid-Open No. 5-299790 (paragraph number [0013], FIG. 10)

従来の信号伝送路は以上のように構成されているので、導体幅が導体厚さよりも短くなるように、信号線導体の形状を設計すれば、複数の信号線導体の間隔を広げることなく、クロストークを改善することができる。しかし、導体厚さが導体幅よりも長い場合、基板実装におけるエッチング処理などが難しく、高精度に信号伝送路を製造することが困難である課題があった。
また、信号線導体の断面積を小さくすることで、信号線導体の高密度化を図る場合、その信号線導体の直流抵抗値が大きくなるため、信号の減衰率が大きくなってしまう課題があった。 Since the conventional signal transmission path is configured as described above, if the shape of the signal line conductor is designed so that the conductor width is shorter than the conductor thickness, without increasing the interval between the plurality of signal line conductors, Crosstalk can be improved. However, when the conductor thickness is longer than the conductor width, there is a problem that it is difficult to perform an etching process or the like in the substrate mounting, and it is difficult to manufacture a signal transmission path with high accuracy.
In addition, when the density of a signal line conductor is increased by reducing the cross-sectional area of the signal line conductor, the DC resistance value of the signal line conductor increases, and thus there is a problem that the signal attenuation rate increases. It was.

この発明は上記のような課題を解決するためになされたもので、信号線導体の直流抵抗値の増加を招くことなく、複数の信号線導体の間隔を広げずに、クロストークを改善することができる製造が容易な信号伝送路を得ることを目的とする。   The present invention has been made to solve the above-described problems, and improves crosstalk without increasing the DC resistance value of signal line conductors and without increasing the interval between a plurality of signal line conductors. It is an object to obtain a signal transmission path that can be manufactured easily.

この発明に係る信号伝送路は、上下をグラウンド層で挟まれている誘電体層と、それぞれが、その誘電体層内に配線され、断面形状が断面中心に対して点対称な正多角形であり、差動信号線を構成する、隣り合っている一対の信号線導体と、一対の信号線導体を上下から挟み込む、誘電体層よりも誘電率が低い誘電層と備えたものである。 The signal transmission line according to the present invention is a regular polygon in which a dielectric layer sandwiched between upper and lower ground layers, and each of which is wired in the dielectric layer, and whose sectional shape is point-symmetric with respect to the sectional center. And a pair of adjacent signal line conductors constituting a differential signal line and a dielectric layer having a dielectric constant lower than that of the dielectric layer sandwiching the pair of signal line conductors from above and below .

この発明によれば、上下をグラウンド層で挟まれている誘電体層と、それぞれが、その誘電体層内に配線され、断面中心に対して点対称な正多角形であり、差動信号線を構成する、隣り合っている一対の信号線導体と、一対の信号線導体を上下から挟み込む、誘電体層よりも誘電率が低い誘電層を設けたので、一対の信号線導体の直流抵抗値の増加を招くことなく、一対の信号線導体の間隔を広げずに、クロストークを改善することができる製造が容易な信号伝送路が得られる効果がある。 According to the present invention, the dielectric layers sandwiched between the upper and lower ground layers, and each of which is a regular polygon that is wired in the dielectric layer and point-symmetric with respect to the center of the cross section , constituting a pair of signal line conductors which are adjacent, sandwich the pair of signal line conductors from the vertical, since dielectric constant than the dielectric layer is provided with a lower dielectric layer, the DC resistance value of the pair of signal line conductors There is an effect that a signal transmission path that is easy to manufacture and can improve crosstalk without increasing the distance between the pair of signal line conductors without increasing the distance between the pair of signal line conductors.

この発明の実施の形態１による信号伝送路を示す基板断面図である。It is a board | substrate sectional drawing which shows the signal transmission line by Embodiment 1 of this invention. 基板断面における寸法縦横比と基板断面横方向の長さとの関係を示す電磁界解析例の説明図である。It is explanatory drawing of the example of an electromagnetic field analysis which shows the relationship between the dimension aspect ratio in a board | substrate cross section, and the length of a board | substrate cross section horizontal direction. 断面形状が正六角形（正多角形）である信号線導体の例を示す断面図である。It is sectional drawing which shows the example of the signal wire | line conductor whose cross-sectional shape is a regular hexagon (regular polygon). 隣り合っている正方形の信号線導体の１つの頂点同士が最近端となるように、前記複数の信号線導体が配置されている例を示す基板断面図である。It is board | substrate sectional drawing which shows the example in which the said several signal line conductor is arrange | positioned so that one vertex of adjacent square signal line conductors may become the nearest end. 隣り合っている正六角形の信号線導体の１つの頂点同士が最近端となるように、前記複数の信号線導体が配置されている例を示す基板断面図である。It is board | substrate sectional drawing which shows the example in which the said several signal line conductor is arrange | positioned so that one vertex of adjacent signal hexagonal signal line conductors may become the nearest end. 隣り合っている正六角形の信号線導体の１つの辺同士が最近端となるように、前記複数の信号線導体が配置されている例を示す基板断面図である。It is board | substrate sectional drawing which shows the example in which the said several signal line conductor is arrange | positioned so that one edge | side of the adjacent signal hexagonal signal line conductor may become the nearest end. この発明の実施の形態５による信号伝送路を示す基板断面図である。It is board | substrate sectional drawing which shows the signal transmission path by Embodiment 5 of this invention. この発明の実施の形態６による信号伝送路を示す基板断面図である。It is board | substrate sectional drawing which shows the signal transmission path by Embodiment 6 of this invention. この発明の実施の形態７による信号伝送路を示す基板断面図である。It is board | substrate sectional drawing which shows the signal transmission path by Embodiment 7 of this invention. この発明の実施の形態８による信号伝送路を示す基板断面図である。It is board | substrate sectional drawing which shows the signal transmission path by Embodiment 8 of this invention. この発明の実施の形態９による信号伝送路を示す基板断面図である。It is board | substrate sectional drawing which shows the signal transmission path by Embodiment 9 of this invention. この発明の実施の形態１０による信号伝送路を示す基板断面図である。It is board | substrate sectional drawing which shows the signal transmission line by Embodiment 10 of this invention. この発明の実施の形態１１による信号伝送路を示す基板断面図である。It is board | substrate sectional drawing which shows the signal transmission path by Embodiment 11 of this invention.

実施の形態１．
図１はこの発明の実施の形態１による信号伝送路を示す基板断面図である。
図１において、基板１は、誘電体層２と、その誘電体層２を上下から挟んでいるグラウンド層３とから構成されている。
誘電体層２を構成している誘電体としては、例えば、ガラスエポキシ樹脂（ＦＲ４）などが使用される。
誘電体層２の中には、ストリップラインと呼ばれる複数の信号線導体１０，１１が配線されており、信号線導体１０，１１の断面形状は正方形である。
この実施の形態１では、信号線導体１０，１１の断面形状が正方形である例を説明するが、信号線導体１０，１１の断面形状は、断面中心に対して点対称な正多角形であればよく、断面形状が正方形であるものに限るものではない。 Embodiment 1 FIG.
1 is a cross-sectional view of a substrate showing a signal transmission line according to Embodiment 1 of the present invention.
In FIG. 1, a substrate 1 is composed of a dielectric layer 2 and a ground layer 3 sandwiching the dielectric layer 2 from above and below.
For example, glass epoxy resin (FR4) is used as the dielectric constituting the dielectric layer 2.
In the dielectric layer 2, a plurality of signal line conductors 10 and 11 called strip lines are wired, and the cross-sectional shape of the signal line conductors 10 and 11 is a square.
In the first embodiment, an example in which the cross-sectional shapes of the signal line conductors 10 and 11 are squares will be described. The cross-sectional shape is not limited to a square shape.

図１では、２本の信号線導体１０，１１だけが誘電体層２内に配線されているが、実際には、２本以上の信号線導体が誘電体層２内に配線されている。
２本の信号線導体１０，１１は、一対の差動信号線を構成しており、複数の差動信号線が誘電体層２内に配線されている。 In FIG. 1, only two signal line conductors 10 and 11 are wired in the dielectric layer 2, but actually two or more signal line conductors are wired in the dielectric layer 2.
The two signal line conductors 10 and 11 constitute a pair of differential signal lines, and a plurality of differential signal lines are wired in the dielectric layer 2.

次に動作について説明する。
２本の信号線導体１０，１１からなる差動信号線の差動特性インピーダンス（Ｄｉｆｆｅｒｅｎｔｉａｌ Ｍｏｄｅ Ｃｈａｒａｃｔｅｒｉｓｔｉｃ Ｉｍｐｅｄａｎｃｅ）は、通常Ｚｄｉｆｆと表され、多くの測定器がＺ0＝５０Ωで整合されていることから、大抵は、Ｚｄｉｆｆ＝２×Ｚ0＝１００Ωとなるように、２本の信号線導体１０，１１の寸法が設計されている。
また、差動特性インピーダンスＺｄｉｆｆの値が差動信号線の途中で変化してしまうと、その変化している部分で、信号の反射が起こって、受信波形が劣化する原因となるため、差動特性インピーダンスＺｄｉｆｆは、ドライバ（信号出力端）からレシーバ（信号受信端）までの間で、基本的に同じ値を目標として設計される。 Next, the operation will be described.
The differential characteristic impedance (Differential Mode Characteristic Impedance) of the differential signal line composed of the two signal line conductors 10 and 11 is usually expressed as Zdiff, and many measuring instruments are matched with Z 0 = 50Ω. In most cases, the dimensions of the two signal line conductors 10 and 11 are designed so that Zdiff = 2 × Z 0 = 100Ω.
In addition, if the value of the differential characteristic impedance Zdiff changes in the middle of the differential signal line, signal reflection occurs at the changed portion, causing the reception waveform to deteriorate. The characteristic impedance Zdiff is designed from the driver (signal output end) to the receiver (signal reception end) basically with the same value as the target.

この実施の形態１では、差動特性インピーダンスＺｄｉｆｆが１００Ωとなるように各種の寸法が決められているものとする。
また、２本の信号線導体１０，１１の抵抗値を同一に保つために、信号線導体１０，１１の断面積を或る一定値に固定する条件の下、信号線導体１０，１１の導体幅をｗ、導体厚さをｔとし、信号線導体１０と信号線導体１１間の距離（以下、「間隙」と称する）をＳとする。 In the first embodiment, it is assumed that various dimensions are determined so that the differential characteristic impedance Zdiff is 100Ω.
Further, in order to keep the resistance values of the two signal line conductors 10 and 11 the same, the conductors of the signal line conductors 10 and 11 are fixed under the condition that the cross-sectional area of the signal line conductors 10 and 11 is fixed to a certain constant value. The width is w, the conductor thickness is t, and the distance between the signal line conductor 10 and the signal line conductor 11 (hereinafter referred to as “gap”) is S.

ここで、信号線導体１０，１１の断面積が一定であり、かつ、差動特性インピーダンスＺｄｉｆｆが１００Ωである条件の下で、信号線導体１０，１１の形状が正方形形状である場合と横長形状である場合の実装密度を比較すると、正方形形状の場合、横長形状よりも導体幅ｗを縮小することができるため、２つの信号線導体１０，１１が占める配線領域を縮小することができる。
２つの信号線導体１０，１１の導体幅ｗと、２つの信号線導体１０，１１の間隙Ｓとが占める配線領域は、下記の式（１）のように表される。
配線領域＝２ｗ＋Ｓ （１） Here, under the condition that the cross-sectional areas of the signal line conductors 10 and 11 are constant and the differential characteristic impedance Zdiff is 100Ω, the signal line conductors 10 and 11 have a square shape and a horizontally long shape. In the case of a square shape, the conductor width w can be reduced as compared with the horizontally long shape, so that the wiring area occupied by the two signal line conductors 10 and 11 can be reduced.
The wiring area occupied by the conductor width w of the two signal line conductors 10 and 11 and the gap S between the two signal line conductors 10 and 11 is expressed by the following equation (1).
Wiring area = 2w + S (1)

信号線導体１０，１１の導体幅ｗの縮小による配線領域の改善効果が、断面形状を横長形状から正方形形状にすることに伴って増加する導体厚さｔによる信号線導体１０，１１間の結合の増加効果よりも大きいことが、電磁界解析などで確認することができる。
図２は基板断面における寸法縦横比と基板断面横方向の長さとの関係を示す電磁界解析例の説明図である。
図２の例では、信号線導体１０，１１の導体面積（導体厚さｔ×導体幅ｗ）が一定である条件の下で、Ｚｄｉｆｆ＝１００Ωとなるように信号線導体１０，１１の間隙Ｓを変えている。
図２の横軸は、寸法縦横比（導体厚さtを導体幅ｗで割った値）であり、縦軸は基板断面横方向の長さである。 The effect of improving the wiring region by reducing the conductor width w of the signal line conductors 10 and 11 is the coupling between the signal line conductors 10 and 11 due to the conductor thickness t increasing as the cross-sectional shape is changed from the horizontally long shape to the square shape. It can be confirmed by electromagnetic field analysis or the like that it is larger than the increase effect.
FIG. 2 is an explanatory diagram of an electromagnetic field analysis example showing the relationship between the dimension aspect ratio in the substrate cross section and the length in the horizontal direction of the substrate cross section.
In the example of FIG. 2, the gap S between the signal line conductors 10 and 11 is set such that Zdiff = 100Ω under the condition that the conductor area (conductor thickness t × conductor width w) of the signal line conductors 10 and 11 is constant. Is changing.
The horizontal axis in FIG. 2 is the dimension aspect ratio (the value obtained by dividing the conductor thickness t by the conductor width w), and the vertical axis is the length in the horizontal direction of the substrate cross section.

図２では、２本のグラフ線を示しているが、図中、下側の◇が付されているグラフ線が２つの信号線導体１０，１１の間隙Ｓである。
また、図中、上側の□が付されているグラフ線が２つの信号線導体１０，１１が占める配線領域（２ｗ＋Ｓ）である。
図２から分かるように、間隙Ｓのグラフも、配線領域（２ｗ＋Ｓ）のグラフも、横軸の値がｔ／ｗ＝１（信号線導体１０，１１の導体厚さｔと導体幅ｗが同じ寸法）である場合に最小値を取る。
ｔ／ｗ＝１は、信号線導体１０，１１の断面形状が正方形であることを表しており、断面形状が正方形であるときに、差動信号線を構成する信号線導体１０，１１が占める配線領域（２ｗ＋Ｓ）が最小値を取るため、最も信号線導体の高密度化に貢献することができる。 In FIG. 2, two graph lines are shown. In the drawing, the lower graph line marked with ◇ is the gap S between the two signal line conductors 10 and 11.
Further, in the drawing, the graph line with the upper square is the wiring region (2w + S) occupied by the two signal line conductors 10 and 11.
As can be seen from FIG. 2, in the graph of the gap S and the graph of the wiring region (2w + S), the value of the horizontal axis is t / w = 1 (the conductor thickness t and the conductor width w of the signal line conductors 10 and 11 are the same). Take the minimum value.
t / w = 1 represents that the cross-sectional shape of the signal line conductors 10 and 11 is a square, and when the cross-sectional shape is a square, the signal line conductors 10 and 11 constituting the differential signal line occupy. Since the wiring region (2w + S) takes the minimum value, it can contribute to the highest density of signal line conductors.

このことは、定性的には、以下のように解釈することができる。
正方形形状（ｔ／ｗ＝１）と横長形状（ｔ／ｗ＜１）の実装密度を比較すると、正方形形状では、導体幅ｗを縮小することができるため、間隙Ｓを確保することができる。配線領域は、２つの信号線導体１０，１１の導体幅ｗと間隙Ｓの和（２ｗ＋Ｓ）であるため、この導体幅ｗの縮小による配線領域の改善効果は、断面形状を横長形状から正方形形状にすることに伴って増加する導体厚さｔによる信号線導体１０，１１間の結合の増加効果よりも大きいということになる。
また、正方形形状と縦長形状（ｔ／ｗ＞１）の実装密度を比較すると、縦長形状では、導体幅ｗを縮小することができる一方、導体厚さｔの増加で、信号線導体１０，１１間の結合が急増してしまうため、やはり、クロストークの低減効果は、正方形形状の方が有利である。 This can be qualitatively interpreted as follows.
Comparing the mounting density of the square shape (t / w = 1) and the horizontally long shape (t / w <1), the conductor width w can be reduced in the square shape, so that the gap S can be secured. Since the wiring area is the sum of the conductor width w and the gap S of the two signal line conductors 10 and 11 (2w + S), the effect of improving the wiring area by reducing the conductor width w is from This means that the effect of increasing the coupling between the signal line conductors 10 and 11 due to the increased conductor thickness t is greater.
Further, when comparing the mounting density of the square shape and the vertically long shape (t / w> 1), the conductor width w can be reduced in the vertically long shape, while the signal line conductors 10 and 11 are increased by increasing the conductor thickness t. Since the coupling between the two increases rapidly, the square shape is more advantageous in reducing the crosstalk.

このことから、差動信号線を構成する信号線導体１０，１１が占める配線領域（２ｗ＋Ｓ）は、信号線導体１０，１１の断面形状が正方形である場合に最小値を取るため、配線領域（２ｗ＋Ｓ）を一定にする条件下で、信号線導体１０，１１の間隙Ｓを変える場合、信号線導体１０，１１の断面形状が正方形であるとき、横長形状（ｔ／ｗ＜１）や縦長形状（ｔ／ｗ＞１）であるときよりも、クロストーク量が小さくなる。
ただし、実装上の問題から、断面形状を正確な正方形形状にすることが困難な場合もあるが、一般的に、導体厚さｔと導体幅ｗの寸法差が±１０％程度や、上底と下底の長さが導体厚さｔとほぼ同じ長さの台形であれば、断面形状が正方形である場合と同様の効果を期待することができる。 From this, the wiring region (2w + S) occupied by the signal line conductors 10 and 11 constituting the differential signal line takes a minimum value when the cross-sectional shape of the signal line conductors 10 and 11 is a square. When the gap S between the signal line conductors 10 and 11 is changed under the condition that 2w + S) is constant, when the cross-sectional shape of the signal line conductors 10 and 11 is a square, a horizontally long shape (t / w <1) or a vertically long shape The amount of crosstalk is smaller than when (t / w> 1).
However, due to mounting problems, it may be difficult to make the cross-sectional shape an accurate square shape. Generally, however, the dimensional difference between the conductor thickness t and the conductor width w is about ± 10%, If the length of the bottom base is a trapezoid whose length is substantially the same as the conductor thickness t, the same effect as when the cross-sectional shape is a square can be expected.

以上で明らかなように、この実施の形態１によれば、信号線導体１０，１１の断面形状が正方形であるように構成したので、信号線導体１０，１１の直流抵抗値の増加を招くことなく、信号線導体１０，１１の間隔を広げずに、クロストークを改善することができる製造が容易な信号伝送路が得られる効果がある。
即ち、この実施の形態１によれば、信号線導体１０，１１の導体厚さｔと導体幅ｗが等しく、従来例のように、導体厚さｔが導体幅ｗよりも長くないので、基板実装におけるエッチング処理などが容易であり、高精度に信号伝送路を製造することが可能である。
また、この実施の形態１によれば、信号線導体１０，１１の導体厚さｔと導体幅ｗを等しくするものであって、信号線導体１０，１１の断面積を小さくするものではないので、信号線導体１０，１１の直流抵抗値が大きくなることはなく、信号の減衰率が大きくなることもない。 As apparent from the above, according to the first embodiment, since the signal line conductors 10 and 11 are configured to have a square cross-sectional shape, the DC resistance values of the signal line conductors 10 and 11 are increased. In addition, there is an effect that a signal transmission path that can improve crosstalk without increasing the interval between the signal line conductors 10 and 11 and that can be easily manufactured can be obtained.
That is, according to the first embodiment, the conductor thickness t and the conductor width w of the signal line conductors 10 and 11 are equal, and the conductor thickness t is not longer than the conductor width w as in the conventional example. Etching processing in mounting is easy, and a signal transmission path can be manufactured with high accuracy.
Further, according to the first embodiment, the signal line conductors 10 and 11 are made equal to the conductor thickness t and the conductor width w, and the cross-sectional area of the signal line conductors 10 and 11 is not reduced. The DC resistance values of the signal line conductors 10 and 11 do not increase, and the signal attenuation rate does not increase.

実施の形態２．
上記実施の形態１では、信号線導体１０，１１の断面形状が正方形である例を示したが、この実施の形態２では、信号線導体１０，１１の断面形状が正方形以外の正多角形であるものについて説明する。
図３は断面形状が正六角形（正多角形）である信号線導体１０，１１の例を示す断面図である。 Embodiment 2. FIG.
In the first embodiment, an example in which the cross-sectional shape of the signal line conductors 10 and 11 is a square is shown. However, in the second embodiment, the cross-sectional shape of the signal line conductors 10 and 11 is a regular polygon other than a square. Some things will be described.
FIG. 3 is a cross-sectional view showing an example of the signal line conductors 10 and 11 having a regular hexagonal shape (regular polygon).

上記実施の形態１では、信号線導体１０，１１の断面形状が正方形であることで、信号線導体１０，１１の直流抵抗値の増加を招くことなく、信号線導体１０，１１の間隔を広げずに、クロストークを改善できる効果が得られることを説明したが、信号線導体１０，１１の断面形状が、断面中心に対して点対称な正多角形であれば、図３のような正六角形や、正八角形、それ以上の正多角形でも同様の効果が得られる。
ただし、正四角形（正方形）以外の正多角形の場合、単純に導体幅ｗ×導体高さｔ＝Ｓのように表すことができないが、信号線導体１０，１１の断面積から正多角形の一辺の長さを求めることができるので、同様の傾向を確認することができる。 In the first embodiment, since the cross-sectional shape of the signal line conductors 10 and 11 is a square, the interval between the signal line conductors 10 and 11 is increased without increasing the DC resistance value of the signal line conductors 10 and 11. However, if the cross-sectional shape of the signal line conductors 10 and 11 is a regular polygon that is point-symmetric with respect to the center of the cross-section, the regular hexagon as shown in FIG. The same effect can be obtained with a square, regular octagon, or more regular polygon.
However, in the case of a regular polygon other than a regular square (square), it cannot be simply expressed as conductor width w × conductor height t = S. However, from the cross-sectional area of the signal line conductors 10 and 11, the regular polygon Since the length of one side can be obtained, the same tendency can be confirmed.

例えば、正ｎ角形がｎ＝６である正六角形の場合、図３に示すように、正ｎ角形の中心点を頂点とする二等辺三角形（ｎ個に等分して生成される二等辺三角形）３１は、辺Ａが底辺となり、二等辺三角形３１の面積がｗ・ｔ／ｎ、二等辺三角形３１の辺Ａと対向する位置にある頂点（正角形の中心点部分）の角度が３６０／ｎ度、二等辺三角形３１の辺Ａの両角が（１８０−（３６０／ｎ）／２）度になることが明らかであることから、正ｎ角形の幅ｗと高さｔを計算で導出することができる。   For example, when the regular n-gon is a regular hexagon with n = 6, as shown in FIG. 3, an isosceles triangle having an apex at the center point of the regular n-gon (an isosceles triangle generated by equally dividing into n pieces) ) 31, the side A is the base, the area of the isosceles triangle 31 is w · t / n, and the angle of the apex (the central point portion of the equiangular shape) at the position facing the side A of the isosceles triangle 31 is 360 / Since it is clear that both angles of the side A of the isosceles triangle 31 are (180- (360 / n) / 2) degrees, the width w and height t of the regular n-gon are derived by calculation. be able to.

例えば、正六角形の場合、頂点の角度が３６０／６＝６０度であり、辺Ａの両角が（１８０−（３６０／６））／２＝６０度となる。
また、正八角形の場合、頂点の角度が３６０／８＝４５度であり、辺Ａの両角が（１８０−（３６０／８））／２＝６７．５度となる。
なお、辺Ａの長さａを求める方法としては、例えば、下記に示すホームページで一般公開されている。
「http://keisan.casio.jp/exec/system/1355982077」
また、同ページには、長さａを求める数式も記載されている。
以上より、信号線導体１０，１１の断面形状を正多角形にすることにより、従来から一般的に用いられている横長の導体形状よりも、差動信号線間の間隙Ｓを小さくすることができる。 For example, in the case of a regular hexagon, the angle of the vertex is 360/6 = 60 degrees, and both angles of the side A are (180− (360/6)) / 2 = 60 degrees.
In the case of a regular octagon, the angle of the vertex is 360/8 = 45 degrees, and both angles of the side A are (180− (360/8)) / 2 = 67.5 degrees.
In addition, as a method of calculating | requiring the length a of the edge | side A, it is publicly disclosed on the homepage shown below, for example.
"Http://keisan.casio.jp/exec/system/1355982077"
The page also includes a mathematical expression for obtaining the length a.
From the above, by making the cross-sectional shape of the signal line conductors 10 and 11 regular polygons, the gap S between the differential signal lines can be made smaller than the horizontally long and generally used conductor shape. it can.

実施の形態３．
上記実施の形態１，２では、複数の信号線導体１０，１１が誘電体層２の中に配線されているものを示したが、この実施の形態３では、差動特性インピーダンス値が一定の条件の下で、信号線導体１０と信号線導体１１の１つの頂点同士が最近端箇所になるように、正方形（正多角形）の中心点を中心にして回転させるようにしている。即ち、隣り合っている正方形（正多角形）の１つの頂点同士が最近端となるように、信号線導体１０，１１を配置している。
図４はｎ＝４の正多角形である正方形を４５度（＝（３６０度／ｎ）／２）回転させて、菱形の信号線導体１０，１１を配置している例を示している。
このように、信号線導体１０と信号線導体１１の１つの頂点同士が最近端箇所になるように配置することで、断面形状が円の形状よりも、信号線導体１０と信号線導体１１の間隙Ｓを小さくすることができる。 Embodiment 3 FIG.
In the first and second embodiments, the signal line conductors 10 and 11 are wired in the dielectric layer 2, but in the third embodiment, the differential characteristic impedance value is constant. Under the condition, the signal line conductor 10 and the signal line conductor 11 are rotated around the center point of the square (regular polygon) so that the vertices of the signal line conductor 10 and the signal line conductor 11 become the nearest end point. That is, the signal line conductors 10 and 11 are arranged so that one vertex of adjacent squares (regular polygons) is the nearest end.
FIG. 4 shows an example in which rhombic signal line conductors 10 and 11 are arranged by rotating a square which is a regular polygon of n = 4 by 45 degrees (= (360 degrees / n) / 2).
As described above, the signal line conductor 10 and the signal line conductor 11 are arranged so that the vertices of the signal line conductor 10 and the signal line conductor 11 are located at the nearest ends, so that the cross-sectional shape of the signal line conductor 10 and the signal line conductor 11 is less than the circular shape. The gap S can be reduced.

ここでは、断面形状が正方形の信号線導体１０，１１の配置について示したが、差動特性インピーダンス値が一定の条件の下で、正六角形の信号線導体１０，１１を配置する場合、図５のようになる。
図５では、隣り合っている正六角形の１つの頂点同士が最近端となるように、信号線導体１０，１１を配置している。
この場合も、断面形状が円の形状よりも、信号線導体１０と信号線導体１１の間隙Ｓを小さくすることができる。 Here, the arrangement of the signal line conductors 10 and 11 having a square cross section is shown. However, when the regular hexagonal signal line conductors 10 and 11 are arranged under the condition that the differential characteristic impedance value is constant, FIG. become that way.
In FIG. 5, the signal line conductors 10 and 11 are arranged so that one apex of adjacent regular hexagons is the nearest end.
Also in this case, the gap S between the signal line conductor 10 and the signal line conductor 11 can be made smaller than the circular cross section.

実施の形態４．
上記実施の形態１，２では、複数の信号線導体１０，１１が誘電体層２の中に配線されているものを示したが、この実施の形態４では、差動特性インピーダンス値が一定の条件の下で、信号線導体１０と信号線導体１１の１つの辺同士が最近端箇所になるように、正六角形（正多角形）の中心点を中心にして回転させるようにしている。即ち、隣り合っている正六角形（正多角形）の１つの頂点同士が最近端となるように、信号線導体１０，１１を配置している。
図６はｎ＝６の正多角形である正六角形を３０度（＝（３６０度／ｎ）／２）回転させている例を示している。 Embodiment 4 FIG.
In the first and second embodiments, the signal line conductors 10 and 11 are wired in the dielectric layer 2, but in the fourth embodiment, the differential characteristic impedance value is constant. Under the condition, the signal line conductor 10 and the signal line conductor 11 are rotated around the center point of a regular hexagon (regular polygon) so that the sides of the signal line conductor 10 and the signal line conductor 11 are closest to each other. That is, the signal line conductors 10 and 11 are arranged such that one vertex of adjacent regular hexagons (regular polygons) is the nearest end.
FIG. 6 shows an example in which a regular hexagon that is a regular polygon of n = 6 is rotated by 30 degrees (= (360 degrees / n) / 2).

このように、信号線導体１０と信号線導体１１の１つの辺同士が最近端箇所になるように配置することで、断面形状が円の形状の場合よりも、信号線導体１０と信号線導体１１の間隙Ｓが若干増えるが、導体幅ｗが円の直径よりも小さくなるため、差動信号線を構成する信号線導体１０，１１が占める配線領域（２ｗ＋Ｓ）を小さくすることができる。
本効果については、正方形を除く、正多角形の辺の数ｎが６以上のときに、断面形状が円の形状の場合よりも、信号線導体１０，１１が占める配線領域（２ｗ＋Ｓ）を縮小できることを確認している。 In this way, the signal line conductor 10 and the signal line conductor 11 are arranged so that one side of the signal line conductor 10 and the signal line conductor 11 is the nearest end portion, so that the signal line conductor 10 and the signal line conductor are more than the case where the cross-sectional shape is a circular shape. 11 is slightly increased, but the conductor width w is smaller than the diameter of the circle, so that the wiring area (2w + S) occupied by the signal line conductors 10 and 11 constituting the differential signal line can be reduced.
With respect to this effect, when the number n of regular polygon sides excluding a square is 6 or more, the wiring area (2w + S) occupied by the signal line conductors 10 and 11 is reduced as compared with the case where the cross-sectional shape is a circular shape. I have confirmed that I can do it.

実施の形態５．
図７はこの発明の実施の形態５による信号伝送路を示す基板断面図であり、図において、図１と同一符号は同一または相当部分を示すので説明を省略する。
この実施の形態５では、差動信号線を構成している信号線導体１０と信号線導体１１の間隙に、誘電体層２よりも誘電率が低い誘電体２１が挿入されている。 Embodiment 5. FIG.
FIG. 7 is a substrate sectional view showing a signal transmission line according to Embodiment 5 of the present invention. In the figure, the same reference numerals as those in FIG.
In the fifth embodiment, a dielectric 21 having a dielectric constant lower than that of the dielectric layer 2 is inserted in the gap between the signal line conductor 10 and the signal line conductor 11 constituting the differential signal line.

差動信号線を構成している信号線導体１０と信号線導体１１の間隙に、誘電体層２よりも誘電率が低い誘電体２１が挿入された場合、差動信号線の差動特性インピーダンスＺｄｉｆｆが一定である（Ｚｄｉｆｆ＝１００Ω）条件の下では、信号線導体１０と信号線導体１１の結合が弱くなるため、２つの信号線導体１０，１１の間隙Ｓを小さくすることができる。
したがって、上記実施の形態１よりも、信号線導体の高密度化を図ることができる効果を奏する。
図７では、信号線導体１０，１１の断面形状が正方形である例を示しているが、断面中心に対して点対称な正多角形であれば、断面形状が正方形であるものに限るものではない。 When a dielectric 21 having a dielectric constant lower than that of the dielectric layer 2 is inserted in the gap between the signal line conductor 10 and the signal line conductor 11 constituting the differential signal line, the differential characteristic impedance of the differential signal line Under the condition that Zdiff is constant (Zdiff = 100Ω), since the coupling between the signal line conductor 10 and the signal line conductor 11 is weak, the gap S between the two signal line conductors 10 and 11 can be reduced.
Therefore, the signal line conductor can be densified more than in the first embodiment.
FIG. 7 shows an example in which the cross-sectional shapes of the signal line conductors 10 and 11 are square. However, if the regular polygon is point-symmetric with respect to the cross-sectional center, the cross-sectional shape is not limited to a square. Absent.

実施の形態６．
図８はこの発明の実施の形態６による信号伝送路を示す基板断面図であり、図において、図１と同一符号は同一または相当部分を示すので説明を省略する。
この実施の形態６では、差動信号線を構成している信号線導体１０と信号線導体１１の間隙に、空気層２２が挿入されている。 Embodiment 6 FIG.
8 is a cross-sectional view of a substrate showing a signal transmission line according to Embodiment 6 of the present invention. In the figure, the same reference numerals as those in FIG.
In the sixth embodiment, the air layer 22 is inserted in the gap between the signal line conductor 10 and the signal line conductor 11 constituting the differential signal line.

空気層２２の誘電率は１．０であり、誘電体層２よりも誘電率が低いため、差動信号線を構成している信号線導体１０と信号線導体１１の間隙に誘電体２１が挿入された場合と同様に、差動信号線の差動特性インピーダンスＺｄｉｆｆが一定である（Ｚｄｉｆｆ＝１００Ω）条件の下では、信号線導体１０と信号線導体１１の結合が弱くなるため、２つの信号線導体１０，１１の間隙Ｓを小さくすることができる。
したがって、上記実施の形態１よりも、信号線導体の高密度化を図ることができる効果を奏する。
図８では、信号線導体１０，１１の断面形状が正方形である例を示しているが、断面中心に対して点対称な正多角形であれば、断面形状が正方形であるものに限るものではない。 Since the dielectric constant of the air layer 22 is 1.0 and the dielectric constant is lower than that of the dielectric layer 2, the dielectric 21 is placed in the gap between the signal line conductor 10 and the signal line conductor 11 constituting the differential signal line. As in the case of the insertion, under the condition that the differential characteristic impedance Zdiff of the differential signal line is constant (Zdiff = 100Ω), the coupling between the signal line conductor 10 and the signal line conductor 11 becomes weak. The gap S between the signal line conductors 10 and 11 can be reduced.
Therefore, the signal line conductor can be densified more than in the first embodiment.
FIG. 8 shows an example in which the cross-sectional shape of the signal line conductors 10 and 11 is a square. However, as long as the regular polygon is point-symmetric with respect to the center of the cross-section, the cross-sectional shape is not limited to a square. Absent.

実施の形態７．
図９はこの発明の実施の形態７による信号伝送路を示す基板断面図であり、図において、図１と同一符号は同一または相当部分を示すので説明を省略する。
この実施の形態７では、誘電体層２よりも誘電率が低い誘電体２３によって、差動信号線を構成している信号線導体１０，１１が上下から挟み込まれている。 Embodiment 7 FIG.
FIG. 9 is a cross-sectional view of a substrate showing a signal transmission line according to Embodiment 7 of the present invention. In the figure, the same reference numerals as those in FIG.
In the seventh embodiment, the signal line conductors 10 and 11 constituting the differential signal line are sandwiched from above and below by the dielectric 23 having a dielectric constant lower than that of the dielectric layer 2.

誘電体層２よりも誘電率が低い誘電体２３によって、差動信号線を構成している信号線導体１０，１１を上下から挟み込んでいる場合、差動信号線の差動特性インピーダンスＺｄｉｆｆが一定である（Ｚｄｉｆｆ＝１００Ω）条件の下では、信号線導体１０と信号線導体１１の結合が弱くなるため、２つの信号線導体１０，１１の間隙Ｓを小さくすることができる。
したがって、上記実施の形態１よりも、信号線導体の高密度化を図ることができる効果を奏する。
図９では、信号線導体１０，１１の断面形状が正方形である例を示しているが、断面中心に対して点対称な正多角形であれば、断面形状が正方形であるものに限るものではない。 When the signal line conductors 10 and 11 constituting the differential signal line are sandwiched from above and below by the dielectric 23 having a dielectric constant lower than that of the dielectric layer 2, the differential characteristic impedance Zdiff of the differential signal line is constant. Under the condition (Zdiff = 100Ω), since the coupling between the signal line conductor 10 and the signal line conductor 11 becomes weak, the gap S between the two signal line conductors 10 and 11 can be reduced.
Therefore, the signal line conductor can be densified more than in the first embodiment.
FIG. 9 shows an example in which the cross-sectional shapes of the signal line conductors 10 and 11 are square. However, if the regular polygon is point-symmetric with respect to the cross-sectional center, the cross-sectional shape is not limited to a square. Absent.

実施の形態８．
図１０はこの発明の実施の形態８による信号伝送路を示す基板断面図であり、図において、図１と同一符号は同一または相当部分を示すので説明を省略する。
この実施の形態８では、差動信号線を構成している信号線導体１０，１１を上下から挟み込むように、誘電体層２よりも誘電率が低い誘電体層２４が配置されている。 Embodiment 8 FIG.
FIG. 10 is a cross-sectional view of a substrate showing a signal transmission line according to Embodiment 8 of the present invention. In the figure, the same reference numerals as those in FIG.
In the eighth embodiment, the dielectric layer 24 having a dielectric constant lower than that of the dielectric layer 2 is disposed so as to sandwich the signal line conductors 10 and 11 constituting the differential signal line from above and below.

差動信号線を構成している信号線導体１０，１１を上下から挟み込むように、誘電体層２よりも誘電率が低い誘電体層２４が配置された場合、差動信号線の差動特性インピーダンスＺｄｉｆｆが一定である（Ｚｄｉｆｆ＝１００Ω）条件の下では、信号線導体１０と信号線導体１１の結合が弱くなるため、２つの信号線導体１０，１１の間隙Ｓを小さくすることができる。
したがって、上記実施の形態１よりも、信号線導体の高密度化を図ることができる効果を奏する。
図１０では、信号線導体１０，１１の断面形状が正方形である例を示しているが、断面中心に対して点対称な正多角形であれば、断面形状が正方形であるものに限るものではない。 When the dielectric layer 24 having a dielectric constant lower than that of the dielectric layer 2 is disposed so as to sandwich the signal line conductors 10 and 11 constituting the differential signal line from above and below, the differential characteristics of the differential signal line Under the condition that the impedance Zdiff is constant (Zdiff = 100Ω), since the coupling between the signal line conductor 10 and the signal line conductor 11 is weak, the gap S between the two signal line conductors 10 and 11 can be reduced.
Therefore, the signal line conductor can be densified more than in the first embodiment.
FIG. 10 shows an example in which the cross-sectional shape of the signal line conductors 10 and 11 is a square. However, the cross-sectional shape is not limited to a square if it is a regular polygon that is point-symmetric with respect to the cross-sectional center. Absent.

実施の形態９．
図１１はこの発明の実施の形態９による信号伝送路を示す基板断面図であり、図において、図１と同一符号は同一または相当部分を示すので説明を省略する。
誘電体層２の中には、シングルエンドの信号線である信号線導体１２が配線されており、信号線導体１２の断面形状は正方形である。
図１１では、１本の信号線導体１２だけが誘電体層２内に配線されているが、実際には、２本以上の信号線導体が誘電体層２内に配線されている。 Embodiment 9 FIG.
FIG. 11 is a substrate sectional view showing a signal transmission line according to Embodiment 9 of the present invention. In the figure, the same reference numerals as those in FIG.
A signal line conductor 12, which is a single-ended signal line, is wired in the dielectric layer 2, and the signal line conductor 12 has a square cross-sectional shape.
In FIG. 11, only one signal line conductor 12 is wired in the dielectric layer 2, but actually two or more signal line conductors are wired in the dielectric layer 2.

信号線導体１２がシングルエンドの信号線である場合も、信号線導体１２の断面形状が正方形であれば、差動信号線を構成している場合と同様に、図示せぬ隣の信号線導体とのクロストークを低減することができる。
このため、上記実施の形態１と同様に、信号線導体１２の直流抵抗値の増加を招くことなく、信号線導体１２と図示せぬ隣の信号線導体の間隔を広げずに、クロストークを改善することができる製造が容易な信号伝送路が得られる効果がある。
図１１では、信号線導体１２の断面形状が正方形である例を示しているが、断面中心に対して点対称な正多角形であれば、断面形状が正方形であるものに限るものではない。 Even when the signal line conductor 12 is a single-ended signal line, if the cross-sectional shape of the signal line conductor 12 is a square, the adjacent signal line conductor (not shown) is formed as in the case of forming a differential signal line. And crosstalk can be reduced.
For this reason, as in the first embodiment, crosstalk can be performed without increasing the DC resistance value of the signal line conductor 12 and without increasing the interval between the signal line conductor 12 and an adjacent signal line conductor (not shown). There is an effect that a signal transmission path that can be improved and can be easily manufactured is obtained.
FIG. 11 shows an example in which the cross-sectional shape of the signal line conductor 12 is a square, but the cross-sectional shape is not limited to a square as long as it is a regular polygon that is point-symmetric with respect to the cross-sectional center.

実施の形態１０．
図１２はこの発明の実施の形態１０による信号伝送路を示す基板断面図であり、図において、図１と同一符号は同一または相当部分を示すので説明を省略する。
上記実施の形態１では、差動信号線を構成している信号線導体１０，１１が誘電体層２内に配線されているものを示したが、信号線導体１０，１１が誘電体層２の上に配線されて、信号線導体１０，１１が差動マイクロストリップラインを構成するようにしてもよい。
この場合も、信号線導体１０，１１の断面形状を正方形とすることで、上記実施の形態１と同様に、信号線導体１０，１１の直流抵抗値の増加を招くことなく、信号線導体１０，１１の間隔を広げずに、クロストークを改善することができる製造が容易な信号伝送路が得られる効果を奏する。
図１２では、信号線導体１０，１１の断面形状が正方形である例を示しているが、断面中心に対して点対称な正多角形であれば、断面形状が正方形であるものに限るものではない。 Embodiment 10 FIG.
FIG. 12 is a substrate cross-sectional view showing a signal transmission line according to Embodiment 10 of the present invention. In the figure, the same reference numerals as those in FIG.
In the first embodiment, the signal line conductors 10 and 11 constituting the differential signal line are wired in the dielectric layer 2. However, the signal line conductors 10 and 11 are in the dielectric layer 2. The signal line conductors 10 and 11 may be configured to form a differential microstrip line.
Also in this case, the signal line conductors 10 and 11 have a square cross-sectional shape, so that the signal line conductors 10 and 11 do not increase in the DC resistance value of the signal line conductors 10 and 11 as in the first embodiment. , 11 without widening the interval, it is possible to obtain a signal transmission path that can improve crosstalk and is easy to manufacture.
FIG. 12 shows an example in which the cross-sectional shape of the signal line conductors 10 and 11 is a square. However, if the regular polygon is point-symmetric with respect to the cross-sectional center, the cross-sectional shape is not limited to a square. Absent.

実施の形態１１．
図１３はこの発明の実施の形態１１による信号伝送路を示す基板断面図であり、図において、図１１と同一符号は同一または相当部分を示すので説明を省略する。
上記実施の形態９では、シングルエンドの信号線である信号線導体１２が誘電体層２内に配線されているものを示したが、信号線導体１２が誘電体層２の上に配線されて、信号線導体１２がマイクロストリップラインを構成するようにしてもよい。
この場合も、信号線導体１２の断面形状を正方形とすることで、上記実施の形態９と同様に、信号線導体１２の直流抵抗値の増加を招くことなく、信号線導体１２と図示せぬ隣の信号線導体の間隔を広げずに、クロストークを改善することができる製造が容易な信号伝送路が得られる効果を奏する。
図１３では、信号線導体１２の断面形状が正方形である例を示しているが、断面中心に対して点対称な正多角形であれば、断面形状が正方形であるものに限るものではない。 Embodiment 11 FIG.
13 is a cross-sectional view of a substrate showing a signal transmission line according to Embodiment 11 of the present invention. In the figure, the same reference numerals as those in FIG.
In the ninth embodiment, the signal line conductor 12, which is a single-ended signal line, is wired in the dielectric layer 2. However, the signal line conductor 12 is wired on the dielectric layer 2. The signal line conductor 12 may constitute a microstrip line.
Also in this case, the signal line conductor 12 is not shown in the figure without causing an increase in the DC resistance value of the signal line conductor 12 by making the cross-sectional shape of the signal line conductor 12 square, as in the ninth embodiment. There is an effect that a signal transmission path that can improve crosstalk without increasing the interval between adjacent signal line conductors and that can be easily manufactured can be obtained.
FIG. 13 illustrates an example in which the cross-sectional shape of the signal line conductor 12 is a square, but the cross-sectional shape is not limited to a square as long as it is a regular polygon that is point-symmetric with respect to the center of the cross-section.

なお、本願発明はその発明の範囲内において、各実施の形態の自由な組み合わせ、あるいは各実施の形態の任意の構成要素の変形、もしくは各実施の形態において任意の構成要素の省略が可能である。   In the present invention, within the scope of the invention, any combination of the embodiments, or any modification of any component in each embodiment, or omission of any component in each embodiment is possible. .

１ 基板、２ 誘電体層、３ グラウンド層、１０，１１，１２ 信号線導体、２１ 誘電体、２２ 空気層、２３ 誘電体、２４ 誘電体層、３１ 二等辺三角形。   1 substrate, 2 dielectric layer, 3 ground layer, 10, 11, 12 signal line conductor, 21 dielectric, 22 air layer, 23 dielectric, 24 dielectric layer, 31 isosceles triangle.

Claims (7)

上下をグラウンド層で挟まれている誘電体層と、
それぞれが、前記誘電体層内に配線され、断面形状が断面中心に対して点対称な正多角形であり、差動信号線を構成する、隣り合っている一対の信号線導体と、
前記一対の信号線導体を上下から挟み込む、前記誘電体層よりも誘電率が低い誘電体と、
を備えた信号伝送路。 A dielectric layer sandwiched between upper and lower ground layers;
Respectively, wherein the wiring in the dielectric layer, a point-symmetric regular polygonal cross-sectional shape with respect to the cross-sectional center, forming the differential signal lines, and a pair of signal line conductors which are adjacent,
A dielectric having a dielectric constant lower than that of the dielectric layer, sandwiching the pair of signal line conductors from above and below ,
A signal transmission line with 上下をグラウンド層で挟まれている誘電体層と、
それぞれが、前記誘電体層内に配線され、断面形状が断面中心に対して点対称な正多角形であり、差動信号線を構成する、隣り合っている一対の信号線導体と、
前記一対の信号線導体を上下から挟み込む、前記誘電体層よりも誘電率が低い誘電層と、
を備えた信号伝送路。 A dielectric layer sandwiched between upper and lower ground layers;
A pair of adjacent signal line conductors, each of which is wired in the dielectric layer, and whose cross-sectional shape is a regular polygon that is point-symmetric with respect to the cross-sectional center, and that constitutes a differential signal line,
A dielectric layer having a dielectric constant lower than that of the dielectric layer , sandwiching the pair of signal line conductors from above and below ,
A signal transmission line with 前記一対の信号線導体は、１つの頂点同士が最近端となるように配置されていることを特徴とする請求項１または請求項２記載の信号伝送路。 The pair of signal line conductors, the claim 1 or claim 2 signal transmission line according one of apexes is characterized in that it is placed so that the proximate end. 前記一対の信号線導体は、１つの辺同士が最近端となるように配置されていることを特徴とする請求項１または請求項２記載の信号伝送路。 The pair of signal line conductors, the claim 1 or claim 2 signal transmission line according one of the sides to each other, characterized in that it is placed so that the proximate end. 前記一対の信号線導体の断面形状が正方形であることを特徴とする請求項１から請求項４のうちのいずれか１項記載の信号伝送路。 Signal transmission path according to any one of claims 1 to 4, the cross-sectional shape of the pair of signal line conductors is characterized in that it is a square. 前記一対の信号線導体の間隙に、前記誘電体層よりも誘電率が低い誘電体が挿入されていることを特徴とする請求項１から請求項５のうちのいずれか１項記載の信号伝送路。 6. The signal transmission according to claim 1 , wherein a dielectric having a dielectric constant lower than that of the dielectric layer is inserted in a gap between the pair of signal line conductors. Road. 前記一対の信号線導体の間隙に、空気層が挿入されていることを特徴とする請求項１から請求項５のうちのいずれか１項記載の信号伝送路。 6. The signal transmission path according to claim 1 , wherein an air layer is inserted in a gap between the pair of signal line conductors.
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