JP6283476B2 - Euvリソグラフィ用の光学アセンブリ - Google Patents
Euvリソグラフィ用の光学アセンブリ Download PDFInfo
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- JP6283476B2 JP6283476B2 JP2013100482A JP2013100482A JP6283476B2 JP 6283476 B2 JP6283476 B2 JP 6283476B2 JP 2013100482 A JP2013100482 A JP 2013100482A JP 2013100482 A JP2013100482 A JP 2013100482A JP 6283476 B2 JP6283476 B2 JP 6283476B2
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- illumination
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
- G03F7/706—Aberration measurement
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0019—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors)
- G02B19/0023—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors) at least one surface having optical power
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0095—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with ultraviolet radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70133—Measurement of illumination distribution, in pupil plane or field plane
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Optical Elements Other Than Lenses (AREA)
- Lenses (AREA)
Description
P(M)=D(SA)/(D(SA)+D(CR))
として定義される。
Claims (12)
- 結合位置と中立位置との間で変位可能なEUVリソグラフィ用の光学アセンブリ(21)であって、
出力結合ミラー(22)と、
拡散ミラー(23)と、
入力結合ミラー(24)と、
を備え、
前記結合位置において、
前記出力結合ミラー(22)は、EUV光(3)を照明ビーム経路から出射結合し、
前記拡散ミラー(23)は、前記出力結合ミラー(22)の下流において前記光学アセンブリ(21)のビーム経路内にあり、
前記入力結合ミラー(24)は、拡散反射した前記EUV光(3)を前記照明ビーム経路に結合するために、前記拡散ミラー(23)の下流において前記光学アセンブリ(21)の前記ビーム経路内にあり、
前記中立位置において、前記照明ビーム経路から除去される、
EUVリソグラフィ用の光学アセンブリ。 - 請求項1に記載のアセンブリにおいて、前記拡散ミラー(23)は、反射EUV多層コーティング(26)を有するマイクロ構造又はナノ構造基板(25)を有することを特徴とするアセンブリ。
- 請求項1又は2に記載のアセンブリにおいて、前記出力結合ミラー(22)及び前記入力結合ミラー(24)を共通のミラーキャリア(27)に配置したことを特徴とするアセンブリ。
- 請求項1〜3のいずれか1項に記載のアセンブリにおいて、前記出力結合ミラー(22)及び前記入力結合ミラー(24)を共通のミラー基板(27)の鏡面として具現したことを特徴とするアセンブリ。
- 請求項1〜4のいずれか1項に記載のアセンブリにおいて、前記出力結合ミラー(22)及び前記入力結合ミラー(24)を変位駆動装置(28)に機械的に接続したことを特徴とするアセンブリ。
- 結像させる物体(14)を配置できる物体視野(15)を照明するEUVリソグラフィ用の照明光学ユニット(29)であって、請求項1〜5のいずれか1項に記載の光学アセンブリ(21)を特徴とする照明光学ユニット。
- 請求項6に記載の照明光学ユニットにおいて、EUV光(3)の反射に用いる瞳ファセットの配置に応じて物体照明の照明角分布を事前規定する複数の瞳ファセットを有し、前記光学アセンブリ(21)を下流に配置した瞳ファセットミラー(8)を特徴とする照明光学ユニット。
- 請求項6又は7に記載の照明光学ユニットにおいて、前記光学アセンブリ(21)を前記照明光学ユニット(20)の照明ビーム経路に近接場配置したことを特徴とする照明光学ユニット。
- 請求項6〜8のいずれか1項に記載の照明光学ユニット(20)を操作する方法であって、
照明設定を事前規定するステップと、
第1照明設定で少なくとも1つの物体照明を実行するステップと、
光学アセンブリ(21)を照明ビーム経路に導入するステップと、
前記光学アセンブリ(21)を前記照明ビーム経路に導入した状態で、物体面(13)において計量測定を実行するステップと、
前記光学アセンブリ(21)を前記照明ビーム経路から除去するステップと、
前記照明設定で少なくとも1つの物体照明を実行するステップと
を含む方法。 - 請求項6〜8のいずれか1項に記載の照明光学ユニット(20)と、物体視野(15)を像視野(17)に結像する投影光学ユニット(16)とを備えた光学系。
- 投影露光装置(1)であって、請求項10に記載の光学系とEUV光源(2)とを備えた投影露光装置。
- 構造化コンポーネントを製造する方法であって、
感光材料からなる層を少なくとも部分的に塗布したウェハ(19)を準備するステップと、
結像させる構造を有するレチクル(14)を準備するステップと、
請求項11に記載の投影露光装置(1)を準備するステップと、
前記投影露光装置(1)を用いて前記レチクル(14)の少なくとも一部を前記ウェハ(19)の前記層の領域に投影するステップと、
照明設定の変更時又は変更前に請求項9に記載の方法を実行するステップと
を含む方法。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE201210207865 DE102012207865B3 (de) | 2012-05-11 | 2012-05-11 | Optische Baugruppe für die EUV-Lithographie |
| DE102012207865.7 | 2012-05-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013239709A JP2013239709A (ja) | 2013-11-28 |
| JP6283476B2 true JP6283476B2 (ja) | 2018-02-21 |
Family
ID=48652773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013100482A Active JP6283476B2 (ja) | 2012-05-11 | 2013-05-10 | Euvリソグラフィ用の光学アセンブリ |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6283476B2 (ja) |
| DE (1) | DE102012207865B3 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017200428B3 (de) | 2017-01-12 | 2018-06-21 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage sowie Verfahren zum Vermessen eines Abbildungsfehlers |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3605055B2 (ja) * | 2001-07-31 | 2004-12-22 | キヤノン株式会社 | 照明光学系、露光装置及びデバイス製造方法 |
| TWI255970B (en) * | 2002-09-30 | 2006-06-01 | Asml Netherlands Bv | Lithographic apparatus and a measurement system |
| AU2003281995A1 (en) * | 2003-04-11 | 2004-11-01 | Carl Zeiss Smt Ag | Diffuser, wavefront source, wavefront sensor and projection lighting facility |
| JP2005294622A (ja) * | 2004-04-01 | 2005-10-20 | Nikon Corp | 反射型拡散ミラー及びeuv用照明光学装置 |
| US7982854B2 (en) * | 2005-04-20 | 2011-07-19 | Carl Zeiss Smt Gmbh | Projection exposure system, method for manufacturing a micro-structured structural member by the aid of such a projection exposure system and polarization-optical element adapted for use in such a system |
| DE102008004762A1 (de) * | 2008-01-16 | 2009-07-30 | Carl Zeiss Smt Ag | Projektionsbelichtungsanlage für die Mikrolithographie mit einer Messeinrichtung |
| JP2009253214A (ja) * | 2008-04-10 | 2009-10-29 | Canon Inc | 露光装置及びデバイス製造方法 |
-
2012
- 2012-05-11 DE DE201210207865 patent/DE102012207865B3/de active Active
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2013
- 2013-05-10 JP JP2013100482A patent/JP6283476B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013239709A (ja) | 2013-11-28 |
| DE102012207865B3 (de) | 2013-07-11 |
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