JP6281162B2 - Processing liquid supply pipe, processing liquid supply apparatus, and liquid processing apparatus - Google Patents

Description

  The present invention relates to a processing liquid supply pipe for supplying a processing liquid to a substrate, a processing liquid supply apparatus, and a liquid processing apparatus using the processing liquid supply apparatus.

  The semiconductor manufacturing process includes a process (liquid processing) for processing a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display with a processing liquid. In a single wafer type liquid processing apparatus, the substrate is held by a spin chuck. Liquid processing for supplying the processing liquid to the substrate from the nozzle is performed. Liquid treatment includes resist solution coating used in resist pattern forming systems, developer coating, substrate cleaning with chemicals or pure water used in substrate cleaning systems, and insulating film deposition systems. Application of a chemical solution containing a precursor of an insulating film can be given.

  In performing such a liquid treatment, it may be necessary to maintain the treatment liquid at an appropriate temperature commensurate with the liquid treatment. For example, for resist solutions, etc., the film thickness is affected by the viscosity, so it is necessary to set the temperature appropriately. In substrate cleaning, the temperature is increased to a predetermined temperature to ensure a certain cleaning quality. It is necessary to keep. Just adjusting the temperature (temperature control) of the processing liquid on the processing liquid supply source side will change the liquid temperature before reaching the nozzle. For example, as described in Patent Documents 1 and 2, There is known a configuration in which a treatment liquid supply pipe to which one end side is connected is a triple pipe of an inner pipe, an intermediate pipe, and an outer pipe. In this processing liquid supply pipe, the inner pipe is configured as a processing liquid supply path, the path between the inner pipe and the middle pipe is a forward path for temperature-controlled water, and the path between the middle pipe and the outer pipe is configured as a return path for temperature-controlled water The temperature control water that flows from the other end side toward the one end side is turned back immediately before the nozzle, and the return path flows toward the other end side.

  However, since such a treatment liquid supply pipe has a triple pipe structure, the pipe diameter becomes large, and a wide drawing space for drawing the treatment liquid supply pipe is required. In addition, in order to increase the number of processing liquids used in the liquid processing apparatus, the area to which the processing liquid supply pipe is routed becomes larger, while downsizing of the liquid processing apparatus is required. There is a problem that a trade-off between miniaturization of the liquid processing apparatus and the liquid processing apparatus. If the tube wall is thinned to reduce the tube diameter of the triple tube, the durability is lowered.

JP 2003-297788 A JP 2012-23071 A

  The present invention has been made under such circumstances, and an object of the present invention is to supply a treatment liquid whose temperature is adjusted from the nozzle portion by flowing the temperature adjustment liquid into the treatment liquid supply pipe. The object is to provide a technique capable of reducing the diameter.

The processing liquid supply pipe of the present invention is a processing liquid supply pipe connected to a nozzle portion for supplying a processing liquid to a substrate,
An inner tube that forms a flow path for the treatment liquid ;
An outer tube surrounding the inner tube through a space;
Each along the outer periphery of the inner tube, is arranged in the circumferential direction of the inner tube to each other, temperature control liquid flow path and folded temperature control fluid flows after return for forward flow toward the nozzle part And a partition section that partitions the space in the circumferential direction in order to form a flow path for
The partition portion is a partition wall portion extending from one of an outer periphery portion of the inner tube and an inner periphery portion of the outer tube, and the partition wall portion is seen from a cross section of the treatment liquid supply tube and the outer periphery portion and the outer tube of the inner tube. It is characterized by being formed in a shape that expands toward the other side of the inner periphery of the .
The processing liquid supply pipe of the present invention is a processing liquid supply pipe connected to a nozzle portion for supplying a processing liquid to the substrate,
An inner tube that forms a flow path for the treatment liquid;
An outer tube surrounding the inner tube through a space;
Each of the inner pipes is arranged along the outer circumference of the inner pipe in the circumferential direction of the inner pipe, and a forward flow path in which the temperature adjustment liquid flows toward the nozzle portion and a return path in which the temperature adjustment liquid flows after being folded. And a partition section that partitions the space in the circumferential direction in order to form a flow path for
The partition portion is a partition wall portion extending from one of an outer periphery portion of the inner tube and an inner periphery portion of the outer tube, and the top surface of the partition wall portion, and the outer periphery portion and the outer tube of the inner tube facing the top surface. At least one of the other surface of the inner peripheral portion of the substrate is formed with unevenness that can be visually confirmed when viewed in the cross section of the treatment liquid supply pipe.

The processing liquid supply apparatus of the present invention is a processing liquid supply apparatus for supplying a processing liquid to a substrate.
A nozzle portion for discharging the treatment liquid;
The above-described processing liquid supply pipe having a tip end connected to the nozzle portion is provided.

  The liquid processing apparatus of the present invention includes a liquid processing module including a substrate holding unit that horizontally holds the substrate in order to process the substrate with the processing liquid, and a cup surrounding the substrate holding unit, the above-described processing liquid supply device, It is provided with.

  The present invention provides a processing liquid supply pipe whose tip side is connected to a nozzle, a flow path for the temperature control liquid and a flow path for the return path around the pipe forming the flow path of the processing liquid in the circumferential direction. Therefore, the treatment liquid supply pipe can be reduced in diameter.

It is a top view of an application unit. It is a perspective view of an application unit. It is a perspective view which shows the liquid processing apparatus which laminated | stacked the coating unit. It is a top view which shows the liquid processing apparatus which has arrange | positioned the coating unit side by side. It is a cross-sectional perspective view of the process liquid supply pipe | tube which concerns on embodiment of this invention. It is a cross-sectional view of a processing liquid supply pipe according to an embodiment of the present invention. It is a longitudinal cross-sectional view of a resist nozzle part, a process liquid supply pipe, and a block part. It is explanatory drawing explaining the flow of the temperature control water in the front end side of a process liquid supply pipe | tube. It is explanatory drawing which shows the supply system of the temperature control water in a liquid processing apparatus. It is sectional drawing which shows the other example of the process liquid supply pipe | tube which concerns on embodiment of this invention. It is sectional drawing which shows the other example of the process liquid supply pipe | tube which concerns on embodiment of this invention. It is sectional drawing which shows the other example of the process liquid supply pipe | tube which concerns on embodiment of this invention. It is sectional drawing which shows the other example of the process liquid supply pipe | tube which concerns on embodiment of this invention.

  An embodiment in which the treatment liquid supply apparatus of the present invention is applied to a coating unit 1 for coating a resist liquid will be described. FIG. 1 shows a part of a liquid processing apparatus including a coating unit 1 and a transport arm 20 that is a transport mechanism that moves along a guide 24 in order to carry in and out a wafer W that is a substrate with respect to the coating unit 1. Is shown. The coating unit 1 includes two liquid processing modules (cup modules) 11A and 11B that are arranged in the lateral direction (Y direction) and a processing liquid supply device 3, and a wafer W that is a substrate is in the preceding stage. It is conveyed from the processing unit to the liquid processing modules 11A and 11B. In addition, the coating unit 1 includes a casing 21 that surrounds the two liquid processing modules 11 </ b> A and 11 </ b> B and the processing liquid supply device 3, and two transfer ports 19 are provided on the side wall of the casing 21. The transfer arm 20 can transfer the wafer W between the liquid processing modules 11 </ b> A and 11 </ b> B through these transfer ports 19.

  The liquid processing modules 11 </ b> A and 11 </ b> B attract and hold the center of the back surface of the wafer W and hold it horizontally, and a spin chuck 12 that is a substrate holding part configured to be rotatable around a vertical axis, and a cup 15 surrounding the spin chuck 12. And. The cup 15 is configured so that the drainage and the processing atmosphere can be exhausted from the bottom side. In the cup 15, three wafers W are placed on the spin chuck 12 in cooperation with the transfer arm 20. Lifting pins 23 are provided.

  A dummy dispensing unit 14 is provided between the two liquid processing modules 11A and 11B. When the coating unit 1 is in a standby state in which the wafer W is not processed, the dummy dispensing unit 14 positions a pure water supply nozzle unit 82 and a thinner supply nozzle unit 83, which will be described later, above the dummy dispensing unit 14. Used for regular dummy dispensing.

  Next, the processing liquid supply device 3 will be described. The processing liquid supply device 3 is provided on the far side of the space between the liquid processing modules 11 </ b> A and 11 </ b> B when viewed from the transfer area where the transfer arm 20 is provided. As shown in FIGS. 1 and 2, the processing liquid supply device 3 is based on the rear side of a rotating plate 31 that is rotatable around a vertical axis when the transport port 19 side is the front side when viewed from the liquid processing modules 11A and 11B. A nozzle holding unit 30 is provided through a base 32. The nozzle holding unit 30 includes a nozzle holding unit 30 that holds one of the groups of resist nozzles 101 that is a nozzle unit for discharging a processing liquid waiting in a nozzle standby unit 91 described later. The nozzle holding unit 30 is provided along a guide 33 on the rear edge of the base 32 and a column 35 that can be moved in the X direction by a driving unit (not shown). A telescopic arm 60 composed of 62 and a tip portion 61 is provided.

  A square block-like nozzle head 68 is provided on the front end side of the back surface of the arm 60. As shown in FIG. 2, the nozzle head 68 is provided with a cylindrical holding member 69 for holding the resist nozzle portion 101, and the holding member 69 is provided with a protruding piece 67 protruding and retracting from the side surface. ing. The protruding piece 67 protrudes and retracts at the side periphery of the holding member 69 by adjusting the pressure inside the holding member 69 by supplying and exhausting air, for example. Further, a pure water supply nozzle portion 82 and a thinner supply nozzle portion 83 are provided at the tip of the arm 60 so as to open downward. The thinner supply nozzle portion 83 is configured to discharge thinner through a thinner supply pipe (not shown). The pure water supply nozzle section 82 is configured to supply pure water via a pure water supply pipe (not shown).

  On the front side of the rotating plate 31, a block portion 92 including a manifold of a temperature-controlled water pipe that is a temperature-controlling liquid and a nozzle standby portion 91 are provided by being stacked in this order from the bottom. The nozzle standby unit 91 is arranged in the Y direction and includes ten holes that are not visible in FIG. 2 each opened upward, and the resist nozzle unit 101 that supplies different types of resist solutions stands by, Drying of the tip of the nozzle 103, which will be described later, is prevented by a thinner. For example, ten resist nozzle portions 101 are provided and supply different types of resist solutions.

  As shown in FIG. 2, the resist nozzle unit 101 includes a square support unit 102, and the support unit 102 is provided with a nozzle 103 configured to discharge a resist solution downward. On the upper side of the support portion 102, a hole portion 105 opened upward is formed, and a recess 106 is formed on the side peripheral surface of the hole portion 105. The holding member 69 enters the hole 105, and a protrusion 67 protruding from the holding member 69 engages with the recess 106. As a result, the resist nozzle unit 101 is held by the arm 60 via the nozzle head 68. Each resist nozzle unit 101 is connected to a tip end of a processing liquid supply pipe 2 described later, and is configured to discharge a resist liquid.

  As the layout of the liquid processing apparatus, for example, as shown in FIG. 3, the coating unit 1 is laminated in three layers, and a transfer arm 20 is provided for each layer, or the coating unit 1 is Y as shown in FIG. For example, a configuration in which two transfer arms 1 are arranged side by side and a common transfer arm 20 is provided for the two coating units 1 may be used. Further, a plurality of layers of the structure shown in FIG. 4 may be stacked.

  Next, the processing liquid supply pipe 2 that is a pipe for supplying a resist liquid used in the resist liquid supply apparatus will be described with reference to FIGS. The processing liquid supply pipe 2 is composed of a flexible tube, for example, a resin tube, and is a space serving as a flow path for temperature control water that is a temperature control liquid and an inner pipe 41 that is a pipe forming a flow path for the processing liquid. And a double pipe structure including an outer pipe 42 surrounding the inner pipe 41. The space is divided into a plurality of partitions in the circumferential direction of the treatment liquid supply pipe 2, and in this example, the space is divided into two equal parts when viewed in cross section, and one of the divided spaces is a flow path 40A for the outgoing path of temperature-controlled water. The other partitioned space is a flow path 40B for returning the temperature-controlled water.

  The partition portion protrudes toward the central portion of the inner tube 41 from a position shifted from each other by 180 degrees on the inner peripheral surface of the outer tube 42, and forms a rib portion 43 serving as a partition wall portion extending in the length direction of the outer tube 42, And a groove portion 44 provided on the outer peripheral surface of the pipe 41 and into which the protrusion 43 is fitted with play. For this reason, a slight gap is formed between the ridge 43 and the groove 44. Since the pressure loss of the temperature-controlled water in this gap is large, the forward flow path 40A and the return path are caused by this gap. Almost no mixing of temperature-controlled water with the flow path 40B occurs. Further, since there is play between the protrusion 43 and the groove 44 in this way, the inner pipe 41 can be easily inserted into the outer pipe 42 to form the processing liquid supply pipe 2.

  FIG. 7 shows a connection structure between the block portion 92 and the processing liquid supply pipe 2. A first flow path 93 and a second flow path 94 are formed in the block portion 92 so as to be spaced apart from each other in the vertical direction and extend in the length direction of the block portion 92. The first flow path 93 is for supplying temperature-controlled water to the processing liquid supply pipe 2, and the second flow path 94 is for collecting temperature-controlled water from the processing liquid supply pipe 2.

  On the proximal end side of each processing liquid supply pipe 2, the forward flow path 40 </ b> A is connected to the first flow path 93, and the backward flow path 40 </ b> B is connected to the second flow path 94. In this example, since the resist standby portion 101 for discharging ten resist solutions is provided in the nozzle standby portion 91, ten treatment liquid supply pipes 2 are connected to the block portion 92. That is, as shown in FIG. 7, the first flow path 93 is connected in parallel with the forward flow path 40A in each processing liquid supply pipe 2, and the second flow path 94 is connected with each processing liquid. The return flow paths 40B in the supply pipe 2 are connected in parallel. Further, the inner pipe 41 in each processing liquid supply pipe 2 is connected to a resist supply pipe 95 that penetrates a block portion 92 provided for each processing liquid supply pipe 2 in the front-rear direction (X direction). In FIG. 7, the diameter of the treatment liquid supply pipe 2 is exaggerated.

  When the connection structure of these flow paths is described, a cylindrical portion 107 on which the outer tube 42 of the processing liquid supply pipe 2 is fitted is projected on the front surface of the block portion 92 and is surrounded by the cylindrical portion 107. Two holes 108 and 109 communicating with the first channel 93 and the second channel 94 are formed in the region. Further, a cylindrical part 110 to which the inner tube 41 is fitted is projected inside the cylindrical part 107, and a region surrounded by the cylindrical part 107 communicates with the resist supply pipe 95.

  A resist nozzle portion 101 is connected to the front end side of each processing liquid supply pipe 2. A cylindrical portion 111 on which the outer tube 42 of the processing liquid supply pipe 2 is fitted is projected on the side surface of the resist nozzle portion 101, and a cylindrical portion on which the inner tube 41 is fitted on the inner side of the cylindrical portion 111. 112 protrudes. In the resist nozzle portion 101, a resist flow path 104 extending from the nozzle 103 is formed, and the resist flow path 104 communicates with a region surrounded by the cylindrical portion 112. Since the region surrounded by the cylindrical portion 111 and the cylindrical portion 112 is a wall surface of the resist nozzle portion 101, the flow path on the tip side of the processing liquid supply pipe 2 can be obtained by connecting the resist nozzle portion 101. It is connected so that the opening of the space to be closed. As shown in FIG. 8, the protruding portion 43 provided so as to extend in the length direction of the processing liquid supply pipe 2 has its end positioned in front of the tip of the processing liquid supply pipe 2. Therefore, by connecting the resist nozzle portion 101 to the distal end side of the processing liquid supply pipe 2, the temperature-controlled water that has flowed from the proximal end side to the distal end side in the forward flow path 40 </ b> A is transferred to the distal end portion of the processing liquid supply pipe 2. Thus, a series of flow paths are formed so as to flow around the ridge 43 and flow in the backward flow path 40B from the distal end side toward the proximal end side.

  As shown in FIGS. 1 and 2, each processing liquid supply pipe 2 is connected so that its base end side is aligned with the block portion 92 in a left and right line (Y direction) and pulled toward the back side of the coating unit 1. It has been turned. Thereafter, the front end side of the processing liquid supply pipe 2 is bent upward in a U-shape and is then routed toward the front side, and different resist nozzles are provided at the front ends of the ten processing liquid supply pipes 2, respectively. Unit 101 is connected.

  The block portion 92 is provided for each coating unit 1, and these block portions 92 are connected in series with each other by a temperature-controlled water pipe forming the circulation path 100. For example, the temperature control water supply system shown in FIG. 9 corresponds to a system in which three layers of coating units 1 are stacked as shown in FIG. As shown in FIG. 9, the temperature adjustment water supplied from the temperature adjustment unit 5 flows through the block units 92 connected in series by the circulation pump 53 and then returns to the temperature adjustment unit 5 via the circulation path 100. . In each block unit 92, temperature-controlled water is supplied from the first flow path 93 to each processing liquid supply pipe 2, flows in parallel through each processing liquid supply pipe 2, and then flows through the second flow path 94. Then, it is discharged to a block portion 92 provided in the subsequent coating unit 1 or a temperature control portion. The temperature adjustment unit 5 includes a cooling unit 54 and a heating unit 55, and the controller 8 controls the heating operation and the cooling operation so as to adjust the temperature of the temperature-controlled water.

  In FIG. 9, reference numeral 7 denotes a control unit comprising a computer. In FIG. 9, reference numeral 71 denotes a bus. The bus 71 has a CPU 72, a memory 73 that stores the set temperature of temperature-controlled water set by a setting unit 75 such as a computer, and a program 74 that reads a set value. Is connected. The program 74 is stored in the program storage unit, but is abbreviated in FIG. The program 74 is stored in a storage medium such as a flexible disk, a compact disk, a hard disk, an MO (magneto-optical disk), or a memory card and installed in the control unit 7.

  Next, the operation of the above-described embodiment will be described by taking as an example a liquid processing apparatus in which the coating units shown in FIG. First, before the wafer W is subjected to the liquid processing, the flow of the temperature-controlled water to the processing liquid supply pipe 2 is started, and the temperature of the temperature-controlled water is set to 23 ° C. by the setting unit 75, for example. The temperature-controlled water supplied from the temperature adjustment unit 5 flows in a distributed manner into each forward flow path of, for example, 10 treatment liquid supply pipes 2 connected to the first flow path 93 in the block unit 92. The state of the temperature-controlled water flowing in each processing liquid supply pipe 2 will be described. The ridge 43 between the outer pipe 42 and the inner pipe 41 in the processing liquid supply pipe 2 from the first flow path 93 of the block 92. The temperature-controlled water flows into the forward flow path 40A partitioned by. As described above, a gap is formed between the protrusion 43 and the groove 44 on the inner tube 41 side. However, since the gap is small, the pressure loss is large, and thus the flow path 40A for the forward path flows. Temperature control water hardly flows out to the return path 40B. Therefore, the forward flow path 40A and the backward flow path 40B are substantially partitioned.

The temperature-controlled water that has flowed through the forward flow path 40A is folded back at the front end side of the processing liquid supply pipe 2, flows into the backward flow path 40B, and passes through the backward flow path 40B through the processing liquid supply pipe. After flowing toward the base end side of 2, it flows into the second flow path 94 in the block portion 92. As described above, the temperature-controlled water flowing through the return path 40B hardly flows into the forward path 40A.
The temperature-controlled water that has returned to the block unit 92 is sent to each of, for example, ten treatment liquid supply pipes 2 via the block unit 92 of the second-layer coating unit 1, and then blocks in the third-layer coating unit 1. For example, it is sent to each of the ten processing liquid supply pipes 2 via the unit 92 and returns to the temperature control unit 5. In this way, the temperature of the resist solution, which is the processing liquid in each of the groups of the processing liquid supply pipes 2 of each coating unit 1, is adjusted, and the resist liquid is maintained at the set temperature.

  Subsequently, dummy dispensing for discharging the resist solution is performed. Then, the wafer W is transferred by the transfer arm 20 to the spin chuck 12 via the lift pins 23 alternately in the order of the liquid processing modules 11A and 11B. Thereafter, the arm 60 moves up, moves backward, and moves horizontally, and the nozzle head 68 moves the resist nozzle unit 101 corresponding to the type of the wafer W from the group of resist nozzle units 101 waiting in the nozzle standby unit 91. Select and hold as described above. Thereafter, the rotating plate 31 rotates, and the tip of the nozzle holding unit 30 moves toward the liquid processing module 11A.

  When the arm 60 faces the liquid processing module 11A, the arm 60 moves forward and stops so that its tip is located on the outer edge of the opening 10 of the cup 15 in the liquid processing module 11A. Subsequently, the arm 60 moves forward, and the thinner supply nozzle portion 83 is positioned on the center of the wafer W. The wafer W rotates around the vertical axis and the thinner is supplied from the thinner supply nozzle 83 to the center of the wafer W. The supplied thinner spreads to the peripheral edge of the wafer W, and the wettability of the resist on the surface of the wafer W is improved.

  After stopping the supply of the thinner, the resist solution is supplied from the resist nozzle unit 101 to the central portion of the wafer W. The supplied resist solution spreads to the peripheral portion of the wafer W, and the resist solution is applied to the entire surface of the wafer W. Is done. As described above, since the temperature of the resist solution is controlled by the temperature-controlled water, the temperature-controlled resist solution is supplied to the wafer W. When the supply of the resist solution is stopped, the arm 60 moves backward so that the tip of the arm 60 comes out of the cup 15, and the rotating plate 31 rotates so that the tip of the arm 60 faces the liquid processing module 11B.

  Thereafter, similarly to the case where the processing is performed by the liquid processing module 11A, when the wafer W is loaded into the liquid processing module 11B, the arm 60 moves forward, and pre-wetting and resist coating processing are sequentially performed on the wafer W. In parallel with these pre-wetting and resist coating processes in the liquid processing module 11B, in the liquid processing module 11A, the rotation of the wafer W is stopped, and the wafer W is unloaded from the cup 15 by the transfer arm 20 and the lift pins 23 in order. Done. In this manner, the wafer W is repeatedly processed by the liquid processing modules 11A and 11B.

  According to the above-described embodiment, the processing liquid supply pipe 2 whose tip side is connected to the resist nozzle portion 101 is connected to the inner pipe 41 that forms the resist liquid flow path and the inner pipe 41 via the liquid passage space. The outer tube 42 is surrounded by a double tube structure. The liquid passing space is partitioned in the circumferential direction of the processing liquid supply pipe 2 to form the flow path 40A for the temperature adjustment liquid and the flow path 40B for the return path. The diameter can be reduced. By narrowing the processing liquid supply pipe 2, the space occupied by the processing liquid supply pipe 2 is narrowed, so that the space for arranging the processing liquid supply pipe 2 when the resist nozzle unit 101 is made to wait on the nozzle standby part 91 is narrowed. be able to.

  Further, since the processing liquid supply pipe 2 is thinned, the space through which the processing liquid supply pipe 2 passes is narrowed even when the resist nozzle unit 101 is moved above the liquid processing modules 11A and 11B. Therefore, the coating unit 1 can be reduced in size. In the above-described embodiment, ten processing liquid supply pipes 2 are extended from the block portion 92 to discharge ten kinds of resist liquids. However, the processing liquid supply pipe 2 becomes narrower. In order to increase the number of processing liquids supplied to the wafer W, the number of processing liquid supply pipes 2 that can be connected to the processing liquid supply pipe 2 block unit 92 can be increased.

  Further, as shown in FIG. 10, the processing liquid supply pipe 2 according to the embodiment of the present invention is provided with four protrusions 43 at equal intervals in the circumferential direction when the processing liquid supply pipe 2 is viewed in cross section, and the outer pipe The space between 42 and the inner pipe 41 may be divided into four, and the forward flow path 40A and the backward flow path 40B may be alternately formed in the circumferential direction. In this case, two openings are formed on the front surface of the block portion 92 at positions corresponding to the two forward passage channels 40A, respectively, and these two openings are formed as the first flow passages in the block portion 92. 93 is communicated. Similarly, two openings that communicate with the second flow path 94 in the block portion 92 are formed in the two return flow paths 40B. Then, the processing liquid supply pipe 2 is connected to the block portion 92 so that each of the two outward flow paths 40A and the two backward flow paths 40B communicates with the corresponding opening.

  As another example of the processing liquid supply pipe 2 below, the outer pipe 42 and the inner pipe 41 are divided into four, and each of the four divided flow paths is divided into a forward flow path 40A and a return flow path, respectively. The structure assigned to the path 40B will be described. As shown in a cross-sectional view in FIG. 11, the protrusion 43 is provided so as to extend from the inner peripheral portion of the outer tube 42 toward the inner tube 41, and the protrusion 43 has a thickness toward the inner tube 41. It is good also as a partition part by forming so that it may become large according to this and comprising so that the contact area of the protrusion part 43 and the outer peripheral part of the inner tube 41 may become large. Even when the temperature adjustment water flows through the forward flow path 40A and the backward flow path 40B and the pressure pushing the ridge 43 increases, the surface of the ridge 43 on the side of the inner pipe 41 and the inner pipe 41 Since the contact area with the outer peripheral portion is wide, the surface on the inner tube 41 side of the protrusion 43 and the outer peripheral portion of the inner tube 41 are difficult to separate, and the gap is difficult to open. Therefore, the temperature-adjusted water flowing through the forward flow path 40A and the backward flow path 40B is less likely to flow into the other backward flow path 40B and the forward flow path 40A, and the same effect is obtained.

  Further, as shown in FIG. 12, a protrusion 43 is provided so as to extend from the inner peripheral portion of the outer tube 42 toward the inner tube 41, and extends in the length direction of the processing liquid supply tube 2 on the top surface of the protrusion 43. It is good also as a partition part by providing the groove | channel 45. FIG. Even in such a configuration, the temperature loss of the temperature-controlled water that attempts to pass through the gap is prevented from flowing linearly by the groove 45, so that the pressure loss increases. Therefore, it is possible to partition the temperature-controlled water flowing in the forward path 40A and the return path 40B.

  Further, as shown in FIG. 13, a protrusion 43 projecting from the inner tube 41 toward the outer tube 42 is formed, while the outer tube 42 is provided with a pair of wall portions 46 along the length direction to form a pair. It is good also as a partition part arrange | positioning so that the protrusion part 43 may be pinched | interposed between the wall parts 46. FIG. Even in such a configuration, the same effect can be obtained.

  Moreover, about the structure of the division part in the above-mentioned example, the outside positional relationship may be reversed among the protrusion part 43 and the opposing surface which opposes this protrusion part 43. FIG. For example, the protrusion 43 may be extended from the inner tube 41 toward the outer tube 42, and the groove 44 may be formed at a position corresponding to the top surface of the protrusion 43 in the outer tube 42. Further, for example, the protrusion 43 extends from the outer tube 42 toward the inner tube 41, a pair of wall portions 46 is provided on the outer peripheral surface of the inner tube 41, and the protrusion 43 is sandwiched between the paired wall portions 46. You may arrange as follows. In the above example, the inner tube 41 and the outer tube 42 are separated from each other. However, the inner tube 41 and the outer tube 42 are connected to each other by the protrusion 43 so as to be integrated. It may be configured. Furthermore, the space between the outer tube 42 and the inner tube 41 in the processing liquid supply tube 2 is not limited to four divisions, and may be six divisions, eight divisions, or the like.

In the above-described embodiment, the temperature-controlled water temperature-controlled by the temperature adjustment unit 5 is supplied from the first flow path 93 to each treatment liquid supply pipe 2 in parallel. The first flow path 93 and each processing liquid supply pipe 2 may be connected in series. Moreover, you may be comprised so that the temperature control water temperature-controlled by the temperature control part 5 may be supplied to each block part 92 in parallel. Therefore, the temperature-controlled water temperature-controlled by the temperature adjustment unit 5 is supplied to each block unit 92 in parallel, and in each block 92, it is supplied from the first flow path 93 to each processing liquid supply pipe 2 in series. It may be configured.
Furthermore, the processing liquid supply pipe 2 of the present invention is not limited to the example used in the coating unit 1 for supplying the resist liquid. For example, in a substrate cleaning apparatus that supplies cleaning water to the wafer W to perform cleaning processing, It may be used. Or you may use for the film-forming system which apply | coats the chemical | medical solution containing the precursor of the insulating film for forming the insulating film in the wafer W, and can apply to all the liquid processing apparatuses.
[Confirmation test]

In order to verify the effects of the present invention, the following tests were conducted. A structure shown in FIG. 10 was used as the treatment liquid supply pipe 2. The treatment liquid supply pipe 2 was set such that the outer diameter of the outer pipe 42 was 6 mm, the inner diameter was 5.5 mm, the outer diameter of the inner pipe 41 was 4 mm, and the inner diameter was 3 mm. The thickness of the protrusion 43 was set to 0.4 mm. The length of the treatment liquid supply pipe was set to 2 m, and the pressure loss of the temperature-controlled water when the temperature-controlled water flowed through the secondary moment of section and the temperature-controlled flow path at a flow rate of 100 mL / min was obtained by simulation.
The cross-sectional second moment was 30.7 mm ⁴ . Moreover, the pressure loss of temperature control water was 0.00812 MPa. Therefore, it was found that the treatment liquid supply pipe 2 according to the embodiment is a pipe that is easy to bend and that the pressure loss of the temperature-controlled water is small.

DESCRIPTION OF SYMBOLS 1 Application | coating unit 2 Process liquid supply pipe 5 Temperature control part 7 Control part 8 Controller 40A Outward flow path 40B Return path flow path 41 Inner pipe 42 Outer pipe 43 Projection part 44 Groove part 92 Block part 93 1st flow path 94 Second channel 100 Circulation channel 101 Resist nozzle part

Claims (7)

A processing liquid supply pipe connected to a nozzle unit for supplying a processing liquid to a substrate,
An inner tube that forms a flow path for the treatment liquid ;
An outer tube surrounding the inner tube through a space;
Each along the outer periphery of the inner tube, is arranged in the circumferential direction of the inner tube to each other, temperature control liquid flow path and folded temperature control fluid flows after return for forward flow toward the nozzle part And a partition section that partitions the space in the circumferential direction in order to form a flow path for
The partition portion is a partition wall portion extending from one of an outer periphery portion of the inner tube and an inner periphery portion of the outer tube, and the partition wall portion is seen from a cross section of the treatment liquid supply tube and the outer periphery portion and the outer tube of the inner tube. A treatment liquid supply pipe characterized in that it is formed in a shape that expands toward the other of the inner peripheral part. A processing liquid supply pipe connected to a nozzle unit for supplying a processing liquid to a substrate,
An inner tube that forms a flow path for the treatment liquid ;
An outer tube surrounding the inner tube through a space;
Each along the outer periphery of the inner tube, is arranged in the circumferential direction of the inner tube to each other, temperature control liquid flow path and folded temperature control fluid flows after return for forward flow toward the nozzle part And a partition section that partitions the space in the circumferential direction in order to form a flow path for
The partition portion is a partition wall portion extending from one of an outer periphery portion of the inner tube and an inner periphery portion of the outer tube, and the top surface of the partition wall portion, and the outer periphery portion and the outer tube of the inner tube facing the top surface. A treatment liquid supply pipe, wherein at least one of the other surface of the inner peripheral part of the inner surface of the treatment liquid is viewed in a cross section of the treatment liquid supply pipe, and irregularities that can be visually confirmed are formed. Each flow path for the flow path and backward for the forward path, the treatment liquid supply pipe according to claim 1 or 2, characterized in that arranged in plural and in the circumferential direction of the processing liquid supply pipe. In a processing liquid supply apparatus for supplying a processing liquid to a substrate,
A nozzle portion for discharging the treatment liquid;
Process liquid supply apparatus characterized by comprising a treatment liquid supply pipe according to any one of 3 claims 1 its distal end is connected to the nozzle portion. A liquid comprising: a liquid processing module that includes a substrate holding unit that horizontally holds the substrate to process the substrate with the processing liquid; and a cup that surrounds the substrate holding unit; and the processing liquid supply device according to claim 4. Processing equipment. A nozzle holding part in which a plurality of the nozzle parts are held in common;
A plurality of processing liquid supply pipes respectively connected to the plurality of nozzle portions are connected side by side and a block portion provided with a first flow path and a second flow path is provided,
The forward flow paths of the plurality of treatment liquid supply pipes are connected in parallel to the first flow path, and the return flow paths of the plurality of treatment liquid supply pipes are connected to the second flow path. The liquid processing apparatus according to claim 5 , wherein the liquid processing apparatuses are connected in parallel to each other. A plurality of the nozzle holders;
A plurality of liquid processing modules or a group of a plurality of liquid processing modules respectively corresponding to a plurality of nozzle holding units,
The block part is provided for each nozzle holding part,
The block section corresponding to each nozzle holding section is characterized in that the second flow path of the upstream block section and the first flow path of the downstream block section are connected in series with each other. 6. The liquid processing apparatus according to 6 .

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