JP6267869B2 - Foam molding - Google Patents

Foam molding Download PDF

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JP6267869B2
JP6267869B2 JP2013070169A JP2013070169A JP6267869B2 JP 6267869 B2 JP6267869 B2 JP 6267869B2 JP 2013070169 A JP2013070169 A JP 2013070169A JP 2013070169 A JP2013070169 A JP 2013070169A JP 6267869 B2 JP6267869 B2 JP 6267869B2
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boron
molded product
foam
foamed molded
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JP2014193949A (en
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基理人 鈴木
基理人 鈴木
武彦 柳生
武彦 柳生
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Kaneka Corp
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Description

本発明は表面固有抵抗が低い発泡成形体に関する。   The present invention relates to a foamed molded article having a low surface resistivity.

ポリオレフィン系発泡成形体、またはポリスチレン系発泡成形体は電気製品や電子部品等の包装材として使用されている。   Polyolefin-based foam molded products or polystyrene-based foam molded products are used as packaging materials for electrical products and electronic parts.

しかし、ポリオレフィン系発泡成形体、ポリスチレン系発泡成形体は優れた絶縁体である反面、静電気が生じやすい性質を有している。そのため、上記電気製品や電子部品等の包装材に使用した際、包装材および被包装材に埃がついたりする問題が発生する。   However, polyolefin-based foam molded products and polystyrene-based foam molded products are excellent insulators, but have the property of easily generating static electricity. Therefore, when used for packaging materials such as the above-mentioned electric products and electronic parts, there arises a problem that dust is attached to the packaging material and the packaging material.

このような欠点を改良する方法として、
特許文献1では、特定炭素数の脂肪酸のグリセリンエステルと特定炭素数の脂肪族アルコールを用いたポリオレフィン系樹脂の予備発泡粒子を発泡させた発泡体成形が開示されている。しかしながら、表面固有抵抗を下げる効果は不十分であった。
As a method of improving such drawbacks,
Patent Document 1 discloses foam molding in which pre-expanded particles of a polyolefin resin using a glycerin ester of a fatty acid having a specific carbon number and an aliphatic alcohol having a specific carbon number are expanded. However, the effect of reducing the surface resistivity was insufficient.

特開2010−159388JP 2010-159388

本発明は、湿度の低い状態でも表面固有抵抗が低い性能を有することを特徴とする発泡成形体およびその製造方法を提供することである。   An object of the present invention is to provide a foamed molded article having a performance with low surface resistivity even in a low humidity state and a method for producing the same.

本発明は以下の構成を有するものである。   The present invention has the following configuration.

1). ホウ素系化合物が成形体表面に存在し、湿度12%における表面固有抵抗値が1.0×1010Ω以下であることを特徴とする発泡成形体。 1). A foamed molded article, wherein a boron-based compound is present on the surface of the molded article, and the surface resistivity at a humidity of 12% is 1.0 × 10 10 Ω or less.

2). ホウ素系化合物がアルコール化合物とのドナー・アクセプター構造を有することを特徴とする1)記載の発泡成形体。   2). The foamed molded article according to 1), wherein the boron compound has a donor-acceptor structure with an alcohol compound.

3). 発泡成形体の表面積に対し、ホウ素系化合物が5g/m以上存在することを特徴とする1)または2)に記載の発泡成形体。 3). The foamed molded product according to 1) or 2), wherein the boron-based compound is present in an amount of 5 g / m 2 or more relative to the surface area of the foamed molded product.

4). 発泡成形体の密度が15g/L〜200g/Lであることを特徴とする1)〜3)のいずれかに記載の発泡成形体。   4). The foam molded article according to any one of 1) to 3), wherein the density of the foam molded article is 15 g / L to 200 g / L.

5). 発泡成形体が予備発泡樹脂粒子を型内成形させてなることを特徴とする1)〜4)のいずれかに記載の発泡成形体。   5). The foamed molded product according to any one of 1) to 4), wherein the foamed molded product is obtained by molding pre-foamed resin particles in a mold.

6). 発泡体の基材樹脂がポリスチレン系樹脂、ポリオレフィン系樹脂、スチレン改質ポリオレフィン系樹脂のいずれかからなる1)〜5)のいずれかに記載の発泡成形体。   6). The foam molded article according to any one of 1) to 5), wherein the base resin of the foam is any one of a polystyrene-based resin, a polyolefin-based resin, and a styrene-modified polyolefin-based resin.

7). 発泡成形体の表面にホウ素系化合物の溶液を塗布、または噴霧することを特徴とする1)〜6)のいずれかに記載の発泡成形体の製造方法。   7). The method for producing a foamed molded product according to any one of 1) to 6), wherein a solution of a boron compound is applied to or sprayed on the surface of the foamed molded product.

本発明によって得られた発泡成形体は、湿度の低い状態での表面固有抵抗が低い性能に優れる。   The foamed molded product obtained by the present invention is excellent in performance with low surface resistivity in a low humidity state.

本発明において使用できる発泡成形体の基材樹脂としては、ポリスチレン系樹脂、ポリオレフィン系樹脂、スチレン改質ポリオレフィン系樹脂をあげることができる。発泡成形体としては、これらの基材樹脂の発泡体を用いることができる。   Examples of the base resin of the foamed molded product that can be used in the present invention include polystyrene resins, polyolefin resins, and styrene-modified polyolefin resins. As the foam molded article, foams of these base resin can be used.

ポリオレフィン発泡成形体としてはポリエチレン、ポリプロピレンを基材樹脂とした発泡成形体が好ましい。   As the polyolefin foam molding, a foam molding using polyethylene or polypropylene as a base resin is preferable.

ポリオレフィン系発泡成形体に使用されるポリプロピレン系樹脂としては、特に制限は無く、ポリプロピレンホモポリマー、エチレン/プロピレンランダム共重合体、ブテン−1/プロピレンランダム共重合体、エチレン/ブテン−1/プロピレンランダム共重合体、エチレン/プロピレンブロック共重合体、ブテン−1/プロピレンブロック共重体、プロピレン−塩素化ビニル共重合体、プロピレン/無水マレイン酸共重合体等が挙げられる。これらのなかでも、エチレン/プロピレンランダム共重合体、エチレン/ブテン−1/プロピレンランダム共重合体が良好な発泡性を有し、良好な成形性を有する点から好適である。   There is no restriction | limiting in particular as a polypropylene resin used for a polyolefin-type foaming molding, A polypropylene homopolymer, an ethylene / propylene random copolymer, a butene-1 / propylene random copolymer, an ethylene / butene-1 / propylene random Examples include copolymers, ethylene / propylene block copolymers, butene-1 / propylene block copolymers, propylene-chlorinated vinyl copolymers, propylene / maleic anhydride copolymers, and the like. Among these, an ethylene / propylene random copolymer and an ethylene / butene-1 / propylene random copolymer are preferable because they have good foamability and good moldability.

ポリエチレン系発泡成形体としては、低密度ポリエチレン、中密度ポリエチレン、高密度ポリエチレン、直鎖状低密度ポリエチレン、エチレン−酢酸ビニル共重合体などが上げられ、この中でも、直鎖状低密度ポリエチレンが良好な成形性を得られることから好ましい。   Low-density polyethylene, medium-density polyethylene, high-density polyethylene, linear low-density polyethylene, ethylene-vinyl acetate copolymer, etc. are raised as polyethylene-based foamed molded products. Among these, linear low-density polyethylene is preferable. It is preferable because a good moldability can be obtained.

ポリスチレン系発泡成形体に使用されるポリスチレン系樹脂としては、スチレンモノマーを塊状重合、懸濁重合するによって重合されたものを使用することができ、想定する発泡倍率によってポリスチレンの分子量や発泡剤の量を適宜コントロールすることができる。また、必要に応じて、アクリロニトリル、α−メチルスチレン、アクリル酸エステルなどを共重合しても良い。   As the polystyrene resin used in the polystyrene foam molded article, a polymer obtained by bulk polymerization or suspension polymerization of a styrene monomer can be used, and the molecular weight of polystyrene or the amount of foaming agent depends on the assumed expansion ratio. Can be appropriately controlled. Moreover, you may copolymerize acrylonitrile, (alpha) -methylstyrene, an acrylate ester etc. as needed.

スチレン改質ポリオレフィン系成形体に使用されるスチレン改質ポリオレフィン系樹脂は、ポリオレフィン成分にスチレン系モノマーを含浸させ、重合させたものである。ポリオレフィン成分として低密度ポリエチレン、中密度ポリエチレン、高密度ポリエチレン、直鎖状低密度ポリエチレン、エチレン−酢酸ビニル共重合体などから選択することができ、スチレンモノマーの含浸、重合条件はポリオレフィン種やスチレンモノマーの追加方法により適宜選択できる。また、必要に応じて、アクリロニトリル、α−メチルスチレン、アクリル酸エステルなどを共重合しても良い。   The styrene-modified polyolefin resin used in the styrene-modified polyolefin-based molded article is obtained by impregnating a polyolefin component with a styrene monomer and polymerizing the polyolefin component. The polyolefin component can be selected from low density polyethylene, medium density polyethylene, high density polyethylene, linear low density polyethylene, ethylene-vinyl acetate copolymer, etc., impregnation with styrene monomer, polymerization conditions are polyolefin species and styrene monomer It can be selected appropriately depending on the additional method. Moreover, you may copolymerize acrylonitrile, (alpha) -methylstyrene, an acrylate ester etc. as needed.

本発明の発泡成形体は懸濁重合や溶融押出により、粒子状にした粒子に発泡剤を使用して予備発泡し、型内成形をすることにより作製することが好ましい。粒子状の予備発泡粒子を使用することにより、発泡成形体の粒子間のくぼみにホウ素系化合物が留まりやすくなるため、表面固有抵抗値を低い状態と成しやすい。   The foamed molded article of the present invention is preferably produced by suspension foaming or melt extrusion, pre-foaming the particulate particles using a foaming agent, and performing in-mold molding. By using the particulate pre-expanded particles, the boron-based compound tends to stay in the recesses between the particles of the foam-molded product, so that the surface specific resistance value can be easily lowered.

また、ホウ素系化合物は繰り返し使用しても脱落しづらく、性能を維持しやすい。特に、ホウ素系化合物は数cm程度の距離であればその周辺にも帯電防止効果を及ぼすことから、発泡有成形体表面を完全に覆わなくても効果を発揮できるため、予備発泡粒子を使用した発泡成形体を使用した際、成形体表面のホウ素系化合物が脱落したとしても、粒子間の溝に残ったホウ素系化合物のみでも性能を長期間発揮できるという利点がある。   Moreover, even if it uses repeatedly, a boron-type compound does not fall out easily and it is easy to maintain performance. In particular, boron-based compounds have an antistatic effect on the periphery at a distance of about several centimeters, so the effect can be exerted without completely covering the surface of the foamed molded article, so pre-expanded particles were used. When a foamed molded product is used, even if the boron compound on the surface of the molded product falls off, there is an advantage that the performance can be exhibited for a long time only with the boron compound remaining in the groove between the particles.

各発泡粒子のサイズは、一般的なサイズのものを使用することができる。サイズが大きくなりすぎると、成形時の金型への充填性に問題がある上、ホウ素系化合物を成形体表面の粒子間に保持しにくくなる。   As the size of each expanded particle, those having a general size can be used. When the size is too large, there is a problem in the filling property into the mold at the time of molding, and it becomes difficult to hold the boron-based compound between the particles on the surface of the molded body.

各種基材樹脂を発泡するための発泡剤としては、公知のものが挙げられ、例えば、プロパン、イソブタン、ノルマルブタン、イソペンタン、ノルマルペンタン、ネオペンタン等の脂肪族炭化水素類、ジフルオロエタン、テトラフルオロエタン等のオゾン破壊係数がゼロであるハイドロフルオロカーボン類等の揮発性発泡剤、空気、窒素、炭酸ガス等の無機ガス、水等があげられる。そのようにして得られた発泡粒子は金型内に充填し、スチーム等を吹き込んで加熱し発泡させることで発泡成形体とすることができる。   Examples of the foaming agent for foaming various base resins include known ones, for example, aliphatic hydrocarbons such as propane, isobutane, normal butane, isopentane, normal pentane, and neopentane, difluoroethane, tetrafluoroethane, and the like. Volatile foaming agents such as hydrofluorocarbons having an ozone depletion coefficient of zero, inorganic gases such as air, nitrogen and carbon dioxide, water, and the like. The foamed particles thus obtained can be filled into a mold, blown with steam or the like, heated and foamed to obtain a foamed molded product.

本発明の発泡体表面の表面固有抵抗値の改良に使用される化合物としてはホウ素系化合物と脂肪族アルコール化合物とのドナー・アクセプター構造を有していることが好ましい。ドナー・アクセプター構造を有していることにより低湿度環境下で性能を発揮しやすくなり好ましい。脂肪族アルコール化合物としてアルキル基の構造は特に限定されないが、ドナー・アクセプター構造を形成する上で多価アルコールであることが好ましい。   The compound used for improving the surface resistivity of the foam surface of the present invention preferably has a donor-acceptor structure of a boron compound and an aliphatic alcohol compound. Having a donor-acceptor structure is preferable because performance is easily exhibited in a low-humidity environment. The structure of the alkyl group as the aliphatic alcohol compound is not particularly limited, but a polyhydric alcohol is preferable in forming a donor-acceptor structure.

ホウ素系化合物は成形体の表面に存在することで性能を発揮できるため、できるだけ均一的に存在していることが好ましく、そのためにホウ素系化合物を溶媒に溶解あるいは希釈して用いることが好ましい。溶解あるいは希釈に用いる溶媒としては、用いるホウ素系化合物や発泡成形体に影響を与えずホウ素系化合物が溶解あるいは分散するものであれば特に限定はないが、アルコール、水が好ましい。   Since the boron-based compound can exhibit its performance by being present on the surface of the molded body, it is preferably present as uniformly as possible. For this purpose, the boron-based compound is preferably dissolved or diluted in a solvent. The solvent used for dissolution or dilution is not particularly limited as long as the boron compound is dissolved or dispersed without affecting the boron compound to be used or the foamed molded product, but alcohol and water are preferable.

具体的には、メタノール、エタノール、イソプロパノール、水をあげることができるが、なかでも水を中心とした水溶液として使用することが好ましい。そしてその水溶液を塗布、または噴霧することにより簡便に均一に発泡成形体表面に塗布することが可能であり、効率的に性能を発揮させる上で好ましい。本発明に用いることができるホウ素化合物としては、例えばアンチスタH、ビオミセルBN、ビオミセルUB-502(以上、ボロン研究所製)が挙げられる。   Specifically, methanol, ethanol, isopropanol, and water can be mentioned, but it is preferable to use as an aqueous solution centered on water. The aqueous solution can be applied or sprayed easily and uniformly on the surface of the foamed molded product, which is preferable for efficiently exhibiting performance. Examples of boron compounds that can be used in the present invention include Antista H, Biomicel BN, Biomicel UB-502 (manufactured by Boron Laboratory).

発泡成形体表面のホウ素系化合物の量については5g/m以上となるように塗布または噴霧することが好ましく、さらには8g/m以上、特には25g/m以上が、表面固有抵抗値を安定的に低くする上で好ましい。また、100g/mを超えると、緩衝材として使用する際にホウ素系化合物による対象物の汚染が発生しやすくなるため、100g/m以下、さらには80g/m以下、特には60g/m以下で使用することが好ましい。 The amount of the boron-based compound on the surface of the foamed molded body is preferably applied or sprayed so as to be 5 g / m 2 or more, more preferably 8 g / m or more, particularly 25 g / m 2 or more. It is preferable for stably lowering. If it exceeds 100 g / m 2, since the contamination of the object by the boron compound when used as a cushioning material is likely to occur, 100 g / m 2 or less, still more 80 g / m 2 or less, particularly 60 g / It is preferable to use at m 2 or less.

以上のようにして得られた発泡成形体は低湿度環境下での表面固有抵抗性に優れ、湿度12%の様な乾燥状態でも表面固有抵抗値が1.0×1010Ω以下、さらには5.0×10Ω以下、特には1.0×10Ω以下となり、表面固有抵抗値の特徴性能を落とさずに使用することが可能である。 The foamed molded article obtained as described above is excellent in surface resistivity under a low humidity environment, and has a surface resistivity of 1.0 × 10 10 Ω or less even in a dry state such as 12% humidity. It becomes 5.0 × 10 9 Ω or less, particularly 1.0 × 10 9 Ω or less, and can be used without degrading the characteristic performance of the surface resistivity.

以下に実施例及び比較例をあげるが、これによって本発明は制限されるものではない。尚、測定評価については以下の通り実施した。   Examples and Comparative Examples are given below, but the present invention is not limited thereby. In addition, about measurement evaluation, it implemented as follows.

<表面固有抵抗値>
発泡成形体を100mm×100mm×10mm(t)の大きさのサンプルに切り出し、ホウ素系化合物が存在している切断していない面で表面固有抵抗値を測定した。35℃の乾燥室で12時間乾燥させた後、LH40−15P型 恒温恒湿槽(株式会社ナガノサイエンス製)内で24時間置くことでサンプルの温度を35℃、相対湿度を12%に調整した。
<Surface specific resistance value>
The foamed molded product was cut into a sample having a size of 100 mm × 100 mm × 10 mm (t), and the surface resistivity was measured on the uncut surface where the boron-based compound was present. After drying for 12 hours in a drying room at 35 ° C., the temperature of the sample was adjusted to 35 ° C. and the relative humidity to 12% by placing it in an LH40-15P type constant temperature and humidity chamber (manufactured by Nagano Science Co., Ltd.) for 24 hours. .

恒温恒湿曹内に設置していたサンプルチャンバー1270A型 RESISTANCE CHAMBER(株式会社 エーデイーシー製)で、デジタル超抵抗測定器(8340A型 ULTRA HIGH RESISTANCE METER(株式会社 エーデイーシー製)を用いて表面固有抵抗値を測定した(測定条件:30秒除電した後、1000Vで30秒荷電し、測定した。)。   Using the sample chamber 1270A type RESISTANCE CHAMBER (manufactured by ADECY Co., Ltd.) that had been installed in the thermo-hygrostat, the surface specific resistance value was measured using a digital super resistance measuring instrument (8340A type ULTRA HIGH RESISTANCE METER (manufactured by ADECY Co., Ltd.). Measurement was performed (measurement condition: after neutralizing for 30 seconds, charging was performed at 1000 V for 30 seconds, and measurement was performed).

<表面帯電量>
表面固有抵抗値の測定に用いる発泡成形体と同様に切り出して同様に状態調節した発泡成形体を、恒温恒湿槽から取り出した後直ちにポリエチレン製の袋(OK袋No.15、大倉工業株式会社製)を用いて成形体表面全体を素早く5往復擦り、直後1秒以内の成形体表面の表面電荷量を測定した。測定はElectrostatic Meter YC−102 (アズワン株式会社製)を使用し、測定距離30mmで実施した(擦り処理、電荷量測定は23℃、相対湿度50%の雰囲気下で行った)。
<Surface charge>
A polyethylene molded bag (OK bag No. 15, Okura Kogyo Co., Ltd.) immediately after the foam molded product cut out in the same manner as the foam molded product used for the measurement of the surface resistivity and taken out of the thermostat is taken out of the thermostatic chamber. The entire surface of the molded body was quickly rubbed back and forth 5 times, and the surface charge amount of the molded body surface within 1 second was measured immediately after that. The measurement was performed using Electrostatic Meter YC-102 (manufactured by As One Co., Ltd.) at a measurement distance of 30 mm (the rubbing treatment and the charge amount measurement were performed in an atmosphere of 23 ° C. and a relative humidity of 50%).

(実施例1)
ポリスチレン発泡性樹脂粒子(カネパール「SBS」、株式会社カネカ製)を通常の方法で予備発泡、型内で発泡成形して、成形体密度20g/Lのポリスチレン系発泡成形体(300mm×400mm×25mm(t))を作製した。測定に使用する面に、成形体表面積に対しホウ素系化合物溶液「アンチスタH(ボロン研究所、ホウ素系帯電防止剤濃度1%の水溶液)」をホウ素系化合物が30g/mとなるように、霧吹きでまんべんなく噴霧した。表面固有抵抗値と表面電荷量の結果を表1に示す。
(Example 1)
Polystyrene expandable resin particles (Kanepal "SBS", manufactured by Kaneka Co., Ltd.) are pre-expanded by a conventional method and expanded in a mold to form a polystyrene-based expanded molded product (300 mm x 400 mm x 25 mm) with a molded product density of 20 g / L. (t)) was produced. On the surface to be used for measurement, boron compound solution “Antista H (Boron Laboratories, Boron antistatic agent concentration 1% aqueous solution)” is used for the surface area of the molded body so that the boron compound is 30 g / m 2 . Sprayed evenly with a spray. Table 1 shows the results of the surface specific resistance value and the surface charge amount.

(実施例2)
ホウ素系化合物を10g/mとなるように噴霧した以外は実施例1と同様にして試料を作成した。
(Example 2)
A sample was prepared in the same manner as in Example 1 except that the boron compound was sprayed at 10 g / m 2 .

(実施例3)
ポリエチレン発泡粒子(エペラン「XL38」、株式会社カネカ製)を通常の方法で成形し、成形体密度25g/Lのポリエチレン系発泡成形体(300mm×400mm×25mm(t))を作製した。実施例1と同様に霧吹きでホウ素系化合物溶液を噴霧し、成形体表面に対しホウ素系化合物量が30g/mとした。
Example 3
Polyethylene foam particles (Eperan “XL38”, manufactured by Kaneka Corporation) were molded by a conventional method to produce a polyethylene foam molded product (300 mm × 400 mm × 25 mm (t)) having a molded product density of 25 g / L. The boron-based compound solution was sprayed by spraying in the same manner as in Example 1 to adjust the boron-based compound amount to 30 g / m 2 with respect to the surface of the molded body.

(実施例4)
ポリポリプロピレン発泡粒子(エペラン「LBS30」、株式会社カネカ製)を通常の方法で成形し、成形体密度30g/Lのポリプロピレン系発泡成形体(300mm×400mm×25mm(t))を作製した。実施例1と同様に霧吹きでホウ素系化合物溶液を噴霧し、成形体表面に対しホウ素系化合物量が30g/mとした。
Example 4
Polypolypropylene expanded particles (Eperan “LBS30”, manufactured by Kaneka Corporation) were molded by a conventional method to produce a polypropylene expanded molded product (300 mm × 400 mm × 25 mm (t)) having a molded product density of 30 g / L. The boron-based compound solution was sprayed by spraying in the same manner as in Example 1 to adjust the boron-based compound amount to 30 g / m 2 with respect to the surface of the molded body.

(実施例5)
特開WO2009/157374の実施例を参考に、(エペラン「LBS30」、カネカ製)を通常の方法で成形し、成形体密度30g/Lのポリプロピレン系発泡成形体(300mm×400mm×25mm(t))を作製した。実施例1と同様に霧吹きでホウ素系化合物溶液を噴霧し、成形体表面に対しホウ素系化合物量が30g/mとした。
(Example 5)
With reference to the examples of JP2009 / 157374, (Eperan “LBS30”, manufactured by Kaneka Co., Ltd.) was molded by a usual method, and a polypropylene-based foam molded product (300 mm × 400 mm × 25 mm (t)) having a molded product density of 30 g / L. ) Was produced. The boron-based compound solution was sprayed by spraying in the same manner as in Example 1 to adjust the boron-based compound amount to 30 g / m 2 with respect to the surface of the molded body.

(比較例1)
ホウ素系化合物を使用しなかった以外は実施例1と同様に発泡成形体を作製した。
(Comparative Example 1)
A foam-molded article was produced in the same manner as in Example 1 except that no boron-based compound was used.

(比較例2)
ホウ素系化合物を使用しなかった以外は実施例2と同様に発泡成形体を作製した。
(Comparative Example 2)
A foam molded article was produced in the same manner as in Example 2 except that no boron-based compound was used.

(比較例3)
ホウ素系化合物を使用しなかった以外は実施例3と同様に発泡成形体を作製した。
(Comparative Example 3)
A foam molded article was produced in the same manner as in Example 3 except that no boron-based compound was used.

(比較例4)
ホウ素系化合物を使用しなかった以外は実施例4と同様に発泡成形体を作製した。
(Comparative Example 4)
A foam-molded article was produced in the same manner as in Example 4 except that no boron-based compound was used.

(比較例5)
ホウ素系化合物を4g/mとなるようにホウ素系化合物溶液を噴霧した以外は実施例1と同様にして試料を作成した。
(Comparative Example 5)
A sample was prepared in the same manner as in Example 1 except that the boron compound solution was sprayed so that the boron compound was 4 g / m 2 .

(比較例6)
ホウ素系化合物を2g/mとなるようにホウ素系化合物溶液を噴霧した以外は実施例1と同様にして試料を作成した。
(Comparative Example 6)
A sample was prepared in the same manner as in Example 1 except that the boron compound solution was sprayed so that the boron compound was 2 g / m 2 .

(比較例7)
ホウ素系化合物の変わりに界面活性剤「EC-4(北広ケミカル株式会社製、ヒドロキシアルキルアミンとイソプロピルアルコールの水溶液)」を使用し、成形体表面の量が30g/mとなるように界面活性剤溶液を噴霧した以外は実施例1と同様にした。
(Comparative Example 7)
A surfactant “EC-4 (produced by Kitahiro Chemical Co., Ltd., aqueous solution of hydroxyalkylamine and isopropyl alcohol)” is used in place of the boron compound, and the surface activity is adjusted so that the amount of the molded body surface is 30 g / m 2. The procedure was the same as Example 1 except that the agent solution was sprayed.

Figure 0006267869
Figure 0006267869

Claims (7)

ポリスチレン系樹脂、ポリオレフィン系樹脂、スチレン改質ポリオレフィン系樹脂のいずれかからなる樹脂を基材樹脂とし、
ホウ素系化合物が成形体表面に5g/m 2 以上100g/m 2 以下の量で存在し、温度35℃、湿度12%における表面固有抵抗値が1.0×1010Ω以下であることを特徴とする発泡成形体。
The base resin is a resin composed of any one of a polystyrene resin, a polyolefin resin, and a styrene modified polyolefin resin,
The boron compound is present on the surface of the molded body in an amount of 5 g / m 2 or more and 100 g / m 2 or less, and the surface resistivity at a temperature of 35 ° C. and a humidity of 12% is 1.0 × 10 10 Ω or less. Foam molded body.
ホウ素系化合物がアルコール化合物とのドナー・アクセプター構造を有することを特徴とする請求項1記載の発泡成形体。   The foamed molded article according to claim 1, wherein the boron compound has a donor-acceptor structure with an alcohol compound. 発泡成形体の密度が15g/L〜200g/Lであることを特徴とする請求項1または2に記載の発泡成形体。 The density of a foaming molding is 15g / L-200g / L, The foaming molding of Claim 1 or 2 characterized by the above-mentioned. 発泡成形体が予備発泡樹脂粒子を型内成形させてなることを特徴とする請求項1〜のいずれかに記載の発泡成形体。 The foam-molded article according to any one of claims 1 to 3 , wherein the foam-molded article is obtained by molding pre-foamed resin particles in a mold. 発泡成形体の粒子間のくぼみにホウ素系化合物が存在している請求項1〜のいずれかに記載の発泡成形体。 The foamed molded product according to any one of claims 1 to 4 , wherein a boron-based compound is present in a recess between particles of the foamed molded product. 発泡成形体の表面にホウ素系化合物の水溶液を塗布、または噴霧することにより得られる請求項1〜のいずれかに記載の発泡成形体。 The foamed molded product according to any one of claims 1 to 5 , which is obtained by applying or spraying an aqueous solution of a boron compound on the surface of the foamed molded product. 発泡成形体の表面にホウ素系化合物の溶液を塗布、または噴霧することを特徴とする請求項1〜のいずれかに記載の発泡成形体の製造方法。 The method for producing a foamed molded product according to any one of claims 1 to 5 , wherein a solution of a boron compound is applied to or sprayed on the surface of the foamed molded product.
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