JP6266038B2 - Light emitting device - Google Patents

Description

Light-emitting devices, especially organic light-emitting elements (OLED: Organic) formed on plastic substrates
The present invention relates to a light emitting device having a light emitting device. The present invention also relates to an OLED module in which an IC including a controller is mounted on the OLED panel. In this specification,
Both OLED panels and OLED modules are collectively referred to as light emitting devices. The present invention further relates to an electronic apparatus using the light emitting device.

In recent years, a technique for forming a thin film transistor (TFT) using a semiconductor thin film (having a thickness of about several to several hundred nm) formed on a substrate having an insulating surface has attracted attention. Thin film transistors are widely applied to electronic devices such as ICs and electro-optical devices, and development of switching devices for image display devices is urgently required.

Various applications using such an image display device are expected, but the use for portable devices is attracting attention. Currently, many glass substrates and quartz substrates are used, but they have the disadvantage of being easily broken and heavy. Further, in mass production, it is difficult to increase the size of a glass substrate or a quartz substrate, which is not suitable. Therefore, attempts have been made to form TFT elements on a flexible substrate, typically a flexible plastic film.

However, since the heat resistance of the plastic film is low, the maximum temperature of the process has to be lowered, and as a result, TFTs having better electrical characteristics cannot be formed than when formed on a glass substrate. For this reason, a high-performance light-emitting element using a plastic film has not been realized.

In recent years, an active matrix light-emitting device (hereinafter, referred to as an active matrix light-emitting device) having an OLED as a self-luminous element.
Research on the light-emitting device is active. The light emitting device is an organic light emitting device (OELD: Or
ganic EL Display) or organic light emitting diode (OLED: Organic Ligh)
t Emitting Diode).

The OLED emits light by itself and has high visibility, is not required for a backlight necessary for a liquid crystal display device (LCD), is optimal for thinning, and has no restriction on the viewing angle. For this reason, light emitting devices using OLEDs have attracted attention as display devices that replace CRTs and LCDs.

If a flexible substrate such as a plastic film is used, an organic light emitting device (OLED:
If a light emitting device having an organic light emitting device) can be manufactured, it can be used for a display having a curved surface, a show window, and the like in addition to being thin and lightweight. Therefore, the application is not limited to portable devices, and the application range is very wide.

However, a substrate made of plastic is generally easy to transmit moisture and oxygen, and deterioration of the organic light emitting layer is promoted by these materials. Therefore, the lifetime of the light emitting device is particularly likely to be shortened. Therefore, conventionally, an insulating film made of silicon nitride, silicon nitride oxide, or the like is provided between the plastic substrate and the OLED to prevent moisture and oxygen from being mixed into the organic light emitting layer. However, it has been difficult to sufficiently prevent moisture and oxygen from being mixed into the organic light emitting layer with an insulating film made of silicon nitride, silicon nitride oxide, or the like.

In addition, a substrate such as a plastic film is generally vulnerable to heat, and if the film formation temperature of an insulating film such as silicon nitride or silicon nitride oxide is too high, the substrate is likely to be deformed.
On the other hand, if the film formation temperature is too low, the film quality is deteriorated and it is difficult to sufficiently prevent the permeation of moisture and oxygen.

Another problem is that when a device provided on a substrate such as a plastic film is driven, heat is locally generated and a part of the substrate is deformed or deteriorated.

Further, when the thickness of an insulating film such as silicon nitride or silicon nitride oxide is increased in order to prevent moisture and oxygen from permeating, stress increases and cracks are likely to occur. Further, when the film thickness is increased, the film is likely to crack when the substrate is bent. Further, when the substrate is peeled off, the peeled layer is bent, and the peeled layer may be cracked.

In addition to moisture and oxygen, TFT characteristics easily change when impurities of alkali metals (Li, Cs, Na, etc.), alkaline earth metals (Ca, Mg, etc.) and other metal elements diffuse into the active layer. .

In addition, even after the final product is formed, other impurities such as human sweat and impurities from connection parts diffuse and mix in the organic light emitting layer and the active layer of the TFT, which may promote deterioration and deterioration. .

In view of the above problems, the present invention includes a light emitting device capable of suppressing deterioration due to diffusion of impurities such as moisture, oxygen, alkali metal, and alkaline earth metal, specifically, an OLED formed on a plastic substrate. An object is to provide a light-emitting device.

The present invention prevents AlN and moisture from entering an organic light emitting layer of an OLED on a plastic substrate and prevents impurities such as alkali metals and alkaline earth metals from entering an active layer of a TFT. _A film (hereinafter referred to as a barrier film) including a layer represented by _X O _Y is provided.

The structure of the invention disclosed in this specification is a light-emitting device including a light-emitting element including a cathode, an organic compound layer in contact with the cathode, and an anode in contact with the organic compound layer on a substrate having an insulating surface. The light emitting device is characterized in that a layer indicated by AlN _X O _Y is provided in contact with the substrate.

Note that the nitrided oxide layer containing aluminum is a film containing 2.5 to 47.5 atm% nitrogen, and has a high thermal conductivity and a heat dissipation effect in addition to the effect of blocking moisture and oxygen. In addition, it has a feature that the translucency is very high. In addition, impurities such as alkali metals and alkaline earth metals can be prevented from entering the active layer of the TFT.

Further, it may be configured to prevent oxygen and moisture from entering the organic light emitting layer of the OLED by sandwiching the two substrates. The other configuration of the present invention includes a cathode, an organic compound layer in contact with the cathode, and the organic compound layer. A light emitting device in which a light emitting element having an anode in contact with a compound layer is sandwiched between a first substrate and a second substrate, wherein the first substrate or the second substrate has an AlN _X O _Y in the layer is provided as shown, and, the light emitting element is a light emitting apparatus characterized by being covered with a layer indicated by AlN _X O _Y.

Further, when sandwiching between two substrates, the substrates are bonded to each other with an adhesive layer. However, even if a barrier film is provided on both substrates, impurities such as moisture and oxygen penetrate through the adhesive layer. There is a risk of coming. Therefore, as a passivation film (also called a protective film) covering the light emitting element, AlN _x
Using the layer represented by O _Y, it is preferable that the structure surrounding the light emitting element in the barrier film and the passivation film. In addition, two or more passivation films made of AlN _X O _Y are provided so as to cover the light emitting element, and a stress relaxation film containing a resin between the two passivation films (hereinafter referred to as stress relaxation film). May be provided). By sandwiching a stress relaxation film having a smaller stress than the passivation film between the stress relaxation films, the overall stress can be relaxed.

The present invention also provides a laminate of a barrier film that prevents oxygen and moisture from entering an organic light emitting layer of an OLED and a layer made of an organic resin having a lower stress than the barrier film (stress relaxation film) on a plastic substrate. Other configurations of the present invention include a cathode on a substrate having an insulating surface,
A light-emitting device including a light-emitting element having an organic compound layer in contact with the cathode and an anode in contact with the organic compound layer, wherein the layer is made of AlN _X O _Y in contact with the substrate and a layer made of an organic resin The light emitting device is provided with a stack of layers.

Further, it may be configured to prevent oxygen and moisture from entering the organic light emitting layer of the OLED by sandwiching the two substrates. The other configuration of the present invention includes a cathode, an organic compound layer in contact with the cathode, and the organic compound layer. A light emitting device in which a light emitting element having an anode in contact with a compound layer is sandwiched between a first substrate and a second substrate, wherein the first substrate or the second substrate has an AlN _X O _Y And a layer made of an organic resin, and the light-emitting element is covered with a layer represented by AlN _x O _Y.

Specifically, two or more barrier films made of AlN _X O _Y are provided, and a stress relaxation film containing a resin between the two barrier films (hereinafter referred to as a stress relaxation film). Provide. And
A light emitting device is formed by forming and sealing an OLED on the three or more insulating films.

In the present invention, by laminating a plurality of barrier films composed of layers represented by AlN _X O _Y , impurities such as moisture and oxygen enter the organic light emitting layer even if cracks occur in the barrier film. Can be effectively prevented, and impurities such as alkali metals can be effectively prevented from entering the active layer of the TFT.

In addition, the entire stress can be relaxed by sandwiching a stress relaxation film having a smaller stress than the barrier film between the stress relaxation films. Therefore, even if the total barrier film thickness is the same,
Compared to a single-layer barrier film, a barrier film with a stress relaxation film interposed therebetween is less prone to cracking due to stress.

Therefore, even if the total thickness of the barrier film is the same as that of the single barrier film, it is possible to effectively prevent impurities such as moisture and oxygen from being mixed into the organic light emitting layer. Hard to crack due to stress.

Further, the lamination of the barrier film and the stress relaxation film makes it more flexible and can prevent cracks when bent.

In each of the above structures, the layer made of the organic resin is made of a material having a stress lower than that of the layer represented by AlN _X O _Y , for example, polyimide, acrylic, polyamide, polyimide amide,
It is characterized by comprising a single layer selected from benzocyclobutene or an epoxy resin, or a laminate thereof. In each of the above structures, the layer made of the organic resin includes an adhesive layer that adheres the substrate.

Moreover, in each said structure, although the said board | substrate will not be specifically limited if it is a plastic substrate which has flexibility, For example, a polyethylene terephthalate (PET), a polyether sulfone (PES), a polyethylene naphthalate (PEN), polycarbonate ( PC), nylon, polyetheretherketone (PEEK), polysulfone (PSF), polyetherimide (PEI), polyarylate (PAR), polybutylene terephthalate (PB)
T), a plastic substrate made of one or more selected from polyimide.

In addition, another configuration of the present invention is a polyimide substrate in which a layer made of an organic resin on a layer represented by AlN _X O _Y and a layer represented by AlN _X O _Y are laminated on the layer. A light-emitting device including a light-emitting element having a cathode, an organic compound layer in contact with the cathode, and an anode in contact with the organic compound layer.

In addition, another configuration of the present invention is a polyethylene sulfide substrate in which a layer made of an organic resin on a layer represented by AlN _x O _Y and a layer represented by AlN _x O _Y are laminated on the layer. The light emitting device further includes a light emitting element having a cathode, an organic compound layer in contact with the cathode, and an anode in contact with the organic compound layer.

In addition, another configuration of the present invention is a polycarbonate substrate in which a layer made of an organic resin on a layer represented by AlN _X O _Y and a layer represented by AlN _X O _Y are stacked on the layer. A light-emitting device including a light-emitting element having a cathode, an organic compound layer in contact with the cathode, and an anode in contact with the organic compound layer.

In addition, another configuration of the present invention is a polyethylene terephthalate substrate in which a layer made of an organic resin on a layer represented by AlN _X O _Y and a layer represented by AlN _X O _Y are laminated on the layer. ,
A light-emitting device including a light-emitting element having a cathode, an organic compound layer in contact with the cathode, and an anode in contact with the organic compound layer.

Another configuration of the present invention is a polyethylene naphthalate substrate in which a layer made of an organic resin on a layer represented by AlN _X O _Y and a layer represented by AlN _X O _Y are laminated on the layer. The light emitting device further includes a light emitting element having a cathode, an organic compound layer in contact with the cathode, and an anode in contact with the organic compound layer.

Another embodiment of the present invention is an electronic device including a single layer or a multilayer of a layer represented by AlN _X O _Y or a layer made of an organic resin between the light emitting device and the outside. .

In each of the above structures, the layer represented by AlN _X O _Y includes 0.1 to 5 atm% impurities of a periodic group 13 element or a periodic group 15 element.

In each of the above structures, the light-emitting device includes 0.1 atm% to 5 atm% of a phosphorus element or a boron element.

In addition, the layer represented by the AlN _X O _Y in each of the above-described structures has an effect of suppressing the deterioration of the element by diffusing the heat generation of the element and protecting the deformation and alteration of the plastic substrate.

In this specification, all layers formed between the anode and the cathode of the OLED are defined as organic light emitting layers. Specifically, the organic light emitting layer includes a light emitting layer, a hole injection layer, an electron injection layer, a hole transport layer, an electron transport layer, and the like. Basically, the OLED has a structure in which an anode / light emitting layer / cathode is laminated in this order. In addition to this structure, the anode / hole injection layer / light emitting layer / cathode and the anode / hole injection layer / The light emitting layer / electron transport layer / cathode may be stacked in this order.

OLEDs emit luminescence (Electroluminescence) generated by applying an electric field.
), A layer containing an organic compound (organic light emitting material) (hereinafter referred to as an organic light emitting layer), an anode, and a cathode. Luminescence in organic compounds includes light emission (fluorescence) when returning from the singlet excited state to the ground state and light emission (phosphorescence) when returning from the triplet excited state to the ground state. Any one of the above-described light emission may be used, or both light emission may be used.

By laminating a plurality of barrier films (AlN _X O _Y films) of the present invention, even if a crack occurs in the barrier film, other barrier films effectively mix impurities such as moisture and oxygen into the organic light emitting layer. Can be prevented. Further, the barrier film (AlN _X O _Y film) of the present invention has the effect of suppressing the deterioration of the element by diffusing the heat generation of the element and protecting the deformation and alteration of the plastic substrate.

In addition, the barrier film (AlN _X O _Y film) of the present invention can effectively prevent impurities such as alkali metals and alkaline earth metals from being mixed into the active layer and the organic light emitting layer of the TFT.

Moreover, the stress of the whole insulating film can be relieved by sandwiching a stress relaxation film having a smaller stress than the barrier film (AlN _X O _Y film) of the present invention between the plurality of barrier films.
Therefore, a flexible light-emitting device can be obtained without being broken even when an external force is applied.

The top view and sectional drawing of EL module. The external view of an EL module when an external force is applied. 10A and 10B show a manufacturing process of a TFT. 10A and 10B show a manufacturing process of a TFT. Sectional drawing of the active-matrix board | substrate with which OLED was provided. Process sectional drawing explaining Example 3. FIG. Process sectional drawing explaining Example 3. FIG. Sectional drawing of EL module explaining Example 4. FIG. Sectional drawing of EL module explaining Example 5. FIG. FIG. 14 illustrates an example of an electronic device. FIG. 14 illustrates an example of an electronic device. Is a graph showing the transmittance of the AlN _X O _Y film of the present invention. A ESCA analysis of AlN _X O _Y film of the present invention. MOS characteristics (AlN _x O _y film) under BT stress. MOS characteristics (SiN film) under BT stress. (Comparative example)

  Embodiments of the present invention will be described below.

1A is a top view showing an EL module, and FIG. 1B is a cross-sectional view taken along line AA ′ of FIG. 1A. In FIG. 1 (B), the surface (also referred to as AlN _X O _Y film) layer represented by AlN _X O _Y which functions as a barrier film and 10b, and the stress relaxation layer (organic resin) 10c, Al
A flexible film substrate 10 a (for example, a plastic substrate) provided with a laminate with the N _X O _Y film 10 d is bonded to the insulating film 11 with an adhesive layer 33. Note that the adhesive layer 33 may also function as a stress relaxation film using a material having a stress smaller than that of the barrier film. in this way,
By laminating the plurality of barrier films 10b and 10d, even if a crack occurs in the barrier film, it is possible to effectively prevent impurities such as moisture and oxygen from entering the organic light emitting layer in the other barrier films. In addition, by providing a stress relaxation film between the plurality of barrier films, a more flexible light-emitting device can be obtained and cracks when bent can be prevented.

Further, the transmittance of the AlN _x O _y film at a film thickness of 100 nm is shown in FIG. As shown in FIG. 12, the AlN _X O _Y film has very high translucency (transmittance of 80% to 91.3% in the visible light region) and does not hinder light emission from the light emitting element.

In the present invention, the AlN _X O _Y film is formed by sputtering, for example, aluminum nitride (A
lN) Using a target, film formation is performed in an atmosphere in which argon gas, nitrogen gas, and oxygen gas are mixed. The AlN _X O _Y film contains several atm% or more of nitrogen, preferably 2.5 atm% to 47.5 atm%.
The nitrogen concentration can be adjusted by appropriately adjusting the sputtering conditions (substrate temperature, source gas and its flow rate, film forming pressure, etc.). The obtained Al
Fig. 1 shows the composition of N _X O _Y film analyzed by ESCA (Electron Spectroscopy for Analysis).
3 shows. Alternatively, an aluminum (Al) target may be used to form a film in an atmosphere containing nitrogen gas and oxygen gas. Note that the present invention is not limited to the sputtering method, and a vapor deposition method or other known techniques may be used.

Further, in order to confirm the blocking effect of moisture and oxygen by the AlN _X O _Y film, the film thickness is 200
a sample in which an OLED is sealed with a film substrate provided with a nm AlN _x O _y film, and a film thickness of 2
A sample in which an OLED was sealed with a film substrate provided with a 00 nm SiN film was prepared, and an experiment was conducted to examine changes over time in a steam atmosphere heated to 85 degrees.
Compared with the film sample, the AlN _X O _Y film sample had a longer OLED life and could emit light for a long time. From this experimental result, it can be read that the AlN _X O _Y film is a material film that can prevent a substance that promotes deterioration of the organic compound layer, such as impurities such as moisture and oxygen, from entering from the outside of the SiN film.

Further, in order to confirm the alkali metal blocking effect by the AlN _X O _Y film, a 50 nm thick thermal oxide film is provided on the silicon substrate, and a 40 nm thick AlN _X O _Y film is provided thereon.
An aluminum electrode containing Li is provided thereon, an aluminum electrode containing Si is provided on the surface of the silicon substrate opposite to the surface on which these films are provided, heat treatment is performed at 300 ° C. for 1 hour, and then BT stress is applied. Test (± 1.7 MV / cm, 150 ° C., 1 hour) was conducted to obtain MOS characteristics (C
-V characteristic) was measured. The experimental results are shown in FIG. The CV characteristic shown in FIG. 14 is shifted to the positive side when a positive voltage is applied, that is, at + BT. Therefore, the cause of the shift is not Li but the alkali metal by the AlN _X O _Y film. It was confirmed that there was a blocking effect. For comparison, an AlLi alloy was formed above the MOS via an insulating film (a silicon nitride film having a thickness of 100 nm), and the characteristic variation of the MOS was similarly examined. The results are shown in FIG. When a positive voltage is applied, that is, at + BT, the CV characteristic fluctuation shown in FIG. 15 is greatly shifted to the negative side, and the cause is that Li is mainly mixed into the active layer. Conceivable.

Further, a configuration may be adopted that in AlN _X O _Y film covering only both sides of the plastic substrate.

Here, the insulating film 11 and the insulating film 20 are provided over a heat-resistant substrate, and the pixel portion 22, the source side driver circuit 14, and the gate side driver circuit 13 are provided thereon, and then a cover material is bonded thereto. The film substrate is attached after the substrate having heat resistance is peeled off, but is not particularly limited, and can withstand the formation temperature of the pixel portion 22, the source side driver circuit 14, and the gate side driver circuit 13. If it is a film substrate to be obtained, the pixel unit 22 and the source side drive circuit 1 are provided on the film substrate
4 and the gate side drive circuit 13 may be formed. In that case, it is not necessary to provide an adhesive layer.

The technology for peeling off a substrate having heat resistance (a glass substrate or a quartz substrate) is not particularly limited, and here, a peeling method using the internal stress of the film, specifically, on a substrate having heat resistance After providing a stack of a first material layer and a second material layer that does not cause a process abnormality such as film peeling (peeling) by heat treatment, and forming an element (TFT or light emitting element) on the stack,
Use a method that can be easily separated in the layer or interface of the second material layer by applying physical means, typically mechanical force, for example, by peeling it with a human hand. While the bonding force between the first material layer and the second material layer has a strength that can withstand thermal energy,
Immediately before the separation, the first material layer having a tensile stress and the second material layer having a compressive stress have a stress strain, so that they are weak against mechanical energy and are separated. here,
Since the tungsten film is used as the first material layer and the silicon material film formed by sputtering is used as the second material layer, the insulating film 11 corresponds to the second material layer.

Further, as another technique for peeling a substrate having heat resistance, a peeling method for peeling a layer to be peeled existing through a separation layer from the substrate (JP-A-10-125929, JP-A-10-1).
25931) may be used. The technique described in the above publication provides a separation layer made of amorphous silicon (or polysilicon), passes through the substrate, and irradiates laser light to release hydrogen contained in the amorphous silicon. This causes the substrate to be separated.

In FIG. 1B, a pixel portion 12 and a gate side driving circuit 13 are formed on an insulating film 20, and the pixel portion 12 is a pixel electrode (cathode) electrically connected to a current control TFT 21 and its drain. ) 22. Although a p-channel TFT can be used as the current control TFT 21, it is preferable to use an n-channel TFT. The gate side drive circuit 13 is formed using a CMOS circuit in which an n-channel TFT 23 and a p-channel TFT 24 are combined. As the active layer of each TFT, a semiconductor film having a crystal structure (polysilicon film) or a semiconductor film having an amorphous structure (such as an amorphous silicon film) is used.

The pixel electrode 22 functions as a cathode of a light emitting element (OLED). In addition, the pixel electrode 2
Banks 25 are formed at both ends of the organic layer 26, and an organic compound layer 26 and an anode 27 of the light emitting element are formed on the pixel electrode 22.

As the organic compound layer 26, an organic compound layer (a layer for emitting light and moving carriers therefor) may be formed by freely combining a light emitting layer, a charge transport layer, or a charge injection layer. For example, a low molecular organic compound material or a high molecular organic compound material may be used. Further, as the organic compound layer 26, a thin film made of a light emitting material (singlet compound) that emits light (fluorescence) by singlet excitation, or a thin film made of a light emitting material (triplet compound) that emits light (phosphorescence) by triplet excitation is used. it can. It is also possible to use an inorganic material such as silicon carbide for the charge transport layer or the charge injection layer. As these organic materials and inorganic materials, known materials can be used.

The anode 27 also functions as a wiring common to all pixels, and is electrically connected to the FPC 19 via the connection wiring 18. Further, all elements included in the pixel portion 12 and the gate side driving circuit 13 are covered with the anode 27, the organic resin 28, and the protective film 29.

In FIG. 1A, 28 is an organic resin, 29 is a protective film, the pixel portion 12 and the drive circuits 13 and 14 are covered with the organic resin 28, and the organic resin is a protective film (AlN _X O _Y film). 29
Covered with. In addition, as the organic resin 28, it is preferable to use a material that is as transparent or translucent as possible to visible light. The organic resin 28 is desirably a material that does not transmit impurities such as moisture and oxygen as much as possible.

Further, the pixel portion 12 and the drive circuits 13 and 14 are sealed with a cover material 30a using an adhesive. The cover material 30a is bonded as a support before peeling.
Note that when the cover material 30a serving as the support is bonded and then peeled off, the wiring lead-out terminal portions (connection portions) are only the insulating films 20 and 11, and the mechanical strength is weakened.
19 is attached and further fixed with an organic resin 32.

Here, in order to withstand deformation due to heat or external force, the cover material 30a is preferably made of the same material as the film substrate 10a, for example, a plastic substrate. Incidentally, to prevent impurities such as moisture and oxygen ingress, the cover member 30a is formed in advance AlN _X O _Y film 30b.
Here, since light emission is allowed to pass through the cover material, a single barrier layer (AlN _x O _y film 30
However, as in the case of the film substrate 10a, a plurality of barrier films and a layer (stress relaxation film) having a stress smaller than that of the barrier films may be provided between the barrier films. In that case, a highly light-transmitting film is used as the stress relaxation film.

Reference numeral 18 denotes a wiring for transmitting a signal input to the source side driving circuit 14 and the gate side driving circuit 13, and FPC (flexible printed circuit) serving as an external input terminal.
19 receives a video signal and a clock signal. Although only the FPC is shown here, this FPC has a printed wiring board (PWB).
May be attached. The EL module in this specification includes not only a substrate body provided with a light-emitting element but also a state in which an FPC or PWB is attached thereto.

With the structure as described above, the light emitting elements are barrier films 10b and 10d represented by AlN _X O _Y and Al.
By enclosing with a protective film 29 indicated by N _X O _Y , the light emitting element can be completely shielded from the outside air, and the deterioration mainly caused by oxidation of the organic compound layer by moisture, oxygen, etc. is promoted from outside the apparatus. Substances can be prevented from entering. In addition, heat generation can be dissipated by the AlN _X O _Y film having thermal conductivity. Therefore, a highly reliable light-emitting device can be obtained.

In addition, by providing a stress relaxation film between the plurality of barrier films, a flexible light-emitting device is obtained without being broken even when an external force is applied.

FIG. 2 shows an external view of the flexible light emitting device 45 to which an external force is applied. In FIG. 2, 40 is a pixel portion, 41 is an FPC, 42a and 42b are integrated circuits, 43a and 43b are gate side drive circuits, 44 is a source side drive circuit, and 45a and 45b are film substrates. The film substrate 45a and the film substrate 45b are provided with a laminate of a layer represented by AlN _X O _Y and a layer made of an organic resin on one or both sides, and impurities such as moisture, oxygen, and alkali metals from the outside are present. It prevents intrusion and protects the OLED and TFT.

Further, when a laminate of a layer indicated by AlN _X O _Y and a layer made of an organic resin is provided on the outer surface of the substrate, the layer indicated by AlN _X O _Y or an organic resin is provided between the light emitting device and the outside. The structure has a single layer or multiple layers, and impurity diffusion from the outside can be prevented. In this specification, the term “external” refers to a generic name including an element or an IC chip that is externally connected to the EL module, a package that contacts the EL module, and other members.

Note that a pixel portion 40, a drive circuit, and a light emitting element are provided on the film substrate 45a, and these elements are sandwiched between the film substrate 45b. Complex integrated circuits (memory, CPU, controller, D / A converter, etc.) 42a on the same substrate as these pixel units and drive circuits
, 42b can be formed, but it is difficult to manufacture with a small number of masks. Therefore, an IC chip equipped with a memory, CPU, controller, D / A converter, etc.
It is preferable to mount by an on glass) method, a TAB (tape automated bonding) method, or a wire bonding method.
An IC chip may be mounted after the film substrate 45a and the film substrate 45b are bonded, or may be sealed with the film substrate 45b after the IC chip is mounted on the film substrate 45a.

Although only the FPC is shown here, this FPC has a printed wiring board (P
WB) may be attached.

Alternatively, the pixel electrode may be an anode, and an organic compound layer and a cathode may be stacked to emit light in the direction opposite to that in FIG. In that case, a p-channel TFT is preferably used as the current control TFT.

The present invention having the above-described configuration will be described in more detail with the following examples.

An embodiment of the present invention will be described with reference to FIGS. Here, first, n on the same substrate
A method for simultaneously manufacturing a CMOS circuit in which a channel TFT and a p-channel TFT are complementarily combined will be described in detail.

First, a first material layer 101, a second material layer 102, and a base insulating film 103 are formed over a substrate 100 to obtain a semiconductor film having a crystal structure, and then etched into a desired shape to form an island shape. Separated semiconductor layers 104 and 105 are formed.

  As the substrate 100, a glass substrate (# 1737) is used.

The first material layer 101 has a thickness of 1 to 1 × 10 ¹⁰ immediately after film formation or immediately before peeling.
It is characterized by having a tensile stress in the range of (Dyne / cm ² ). The first material layer is not particularly limited as long as it is a material having a tensile stress in the above range, and a metal material (Ti, Al
, Ta, W, Mo, Cu, Cr, Nd, Fe, Ni, Co, Zr, Zn, Ru, Rh, P
d, Os, Ir, Pt, or the like), a semiconductor material (eg, Si, Ge, or the like), an insulator material, an organic material, or a stacked layer thereof can be used. Among these, a tungsten film, a tungsten nitride film, and a titanium nitride film are preferable. In addition, 1-1 x 10 ¹⁰ (Dyne / cm ²
The film having a greater tensile stress than) tends to peel when subjected to heat treatment.
Here, a titanium nitride film having a thickness of 100 nm is used by sputtering. Note that a buffer layer may be provided when adhesion to the substrate 100 is poor.

The second material layer 102 is characterized by having a compressive stress in the range of −1 to −1 × 10 ¹⁰ (Dyne / cm ² ). The second material layer is not particularly limited as long as it has a compressive stress in the above range, and is not limited to a metal material (Ti, Al, Ta, W, Mo, Cu, C
r, Nd, Fe, Ni, Co, Zr, Zn, Ru, Rh, Pd, Os, Ir, Pt, etc.)
Any one layer of a semiconductor material (eg, Si, Ge, etc.), an insulator material, an organic material, or a stacked layer thereof can be used. Note that a film having a compressive stress larger than −1 × 10 ¹⁰ (Dyne / cm ² ) is prone to peeling when heat treatment is applied. Among these, a single layer made of a silicon oxide material or a metal oxide material, or a stacked layer thereof is preferable. Here, a silicon oxide film having a thickness of 200 nm is used by a sputtering method. The bonding force between the first material layer 101 and the second material layer 102 is strong during heat treatment and does not cause film peeling (also referred to as peeling). Alternatively, it can be peeled off at the interface.

Further, as the base insulating film 103, a film formation temperature of 400 ° C. and a source gas S are formed by plasma CVD.
Silicon oxynitride film made of iH ₄ , NH ₃ , N ₂ O (composition ratio Si = 32%, O = 2
7%, N = 24%, H = 17%) is formed to 50 nm (preferably 10 to 200 nm). Next, after cleaning the surface with ozone water, the oxide film on the surface is removed with dilute hydrofluoric acid (1/100 dilution). Next, a silicon oxynitride film formed from a plasma CVD method using a film forming temperature of 400 ° C. and source gases SiH ₄ and N ₂ O (composition ratio Si = 32%, O = 59%, N = 7%, H = 2%) 10
A semiconductor film (in this case, an amorphous structure) having a thickness of 0 nm (preferably 50 to 200 nm) and having an amorphous structure with a film forming temperature of 300 ° C. and a film forming gas of SiH ₄ by plasma CVD without being exposed to the atmosphere. A silicon film is formed with a thickness of 54 nm (preferably 25 to 80 nm).

Although the base film 103 is shown as a two-layer structure in this embodiment, it may be formed as a single layer film of the insulating film or a structure in which two or more layers are stacked. The material of the semiconductor film is not limited, but is preferably silicon or silicon germanium (Si _x Ge _1-x (X = 0.0001 to 0.02).
)) An alloy or the like may be used and formed by a known means (such as sputtering, LPCVD, or plasma CVD). The plasma CVD apparatus may be a single wafer type apparatus or a batch type apparatus. Alternatively, the base insulating film and the semiconductor film may be successively formed without being exposed to the air in the same film formation chamber.

Next, after cleaning the surface of the semiconductor film having an amorphous structure, the surface is about 2 nm with ozone water.
An extremely thin oxide film is formed.

Next, a nickel acetate salt solution containing 10 ppm of nickel by weight is applied by a spinner. Instead of coating, a method of spreading nickel element over the entire surface by sputtering may be used.

Next, heat treatment is performed for crystallization, so that a semiconductor film having a crystal structure is formed.
For this heat treatment, heat treatment in an electric furnace or irradiation with strong light may be used. When the heat treatment is performed in an electric furnace, the heat treatment may be performed at 500 ° C. to 650 ° C. for 4 to 24 hours. Here, after heat treatment for dehydrogenation (500 ° C., 1 hour), heat treatment for crystallization (550 ° C., 4 hours) is performed to obtain a silicon film having a crystal structure. Note that although crystallization is performed here using heat treatment using a furnace, crystallization may be performed using a lamp annealing apparatus. Although a crystallization technique using nickel as a metal element for promoting crystallization of silicon is used here, other known crystallization techniques such as a solid phase growth method and a laser crystallization method may be used.

Next, after removing the oxide film on the surface of the silicon film having a crystal structure with dilute hydrofluoric acid or the like, a first laser beam (XeCl: wavelength 308 nm) for increasing the crystallization rate and repairing defects left in the crystal grains ) Is performed in the air or in an oxygen atmosphere. Laser light has a wavelength of 400nm
The following excimer laser light, second harmonic and third harmonic of YAG laser or YVO ₄ laser are used. The first laser light may be pulsed oscillation or continuous oscillation. In the case of pulse oscillation, a pulsed laser beam with a repetition frequency of about 10 to 1000 Hz is used, the laser beam is focused to 100 to 500 mJ / cm ² by an optical system, and irradiated with an overlap rate of 90 to 95%. The film surface may be scanned. Here, repetition frequency 30Hz
The first laser beam is irradiated in the atmosphere at an energy density of 393 mJ / cm ² . Note that an oxide film is formed on the surface by irradiation with the first laser light because it is performed in the air or in an oxygen atmosphere.

Next, after removing the oxide film formed by irradiation with the first laser beam with dilute hydrofluoric acid, irradiation with the second laser beam is performed in a nitrogen atmosphere or in a vacuum to flatten the surface of the semiconductor film.
This laser light (second laser light) includes excimer laser light with a wavelength of 400 nm or less, Y
The second harmonic and the third harmonic of the AG laser are used. The energy density of the second laser light is larger than the energy density of the first laser light, preferably 30 to 60 mJ / cm ^2.
Enlarge. Here, the second laser beam is irradiated at a repetition frequency of 30 Hz and an energy density of 453 mJ / cm ² , and the PV value of the unevenness on the surface of the semiconductor film (Peak to Valley, the difference between the maximum value and the minimum value) Becomes 50 nm or less. This PV value is AFM (atomic force microscope).
Is obtained.

In this embodiment, the second laser beam is irradiated on the entire surface. However, since the reduction of the off-current is particularly effective for the TFT in the pixel portion, it is possible to selectively irradiate at least the pixel portion. Good.

Next, the surface is treated with ozone water for 120 seconds to form a barrier layer made of an oxide film having a total thickness of 1 to 5 nm.

Next, an amorphous silicon film containing an argon element serving as a gettering site is formed with a thickness of 150 nm on the barrier layer by a sputtering method. The film formation conditions by the sputtering method of this example are as follows:
Deposition pressure is 0.3 Pa and gas (Ar) flow rate is 50 (sccm)
The film forming power is 3 kW, and the substrate temperature is 150 ° C. Note that the atomic concentration of the argon element contained in the amorphous silicon film under the above conditions is 3 × 10 ²⁰ / cm ^{3 to} 6 × 10 ²⁰ / c.
The atomic concentration of m ³ and oxygen is 1 × 10 ¹⁹ / cm ^{3 to} 3 × 10 ¹⁹ / cm ³ . Thereafter, heat treatment is performed at 650 ° C. for 3 minutes using a lamp annealing apparatus to perform gettering.

Next, the amorphous silicon film containing an argon element as a gettering site is selectively removed using the barrier layer as an etching stopper, and then the barrier layer is selectively removed with dilute hydrofluoric acid. Note that during gettering, nickel tends to move to a region with a high oxygen concentration, and thus it is desirable to remove the barrier layer made of an oxide film after gettering. Here, an example in which gettering is performed is shown, but there is no particular limitation, and other gettering methods may be used.

Next, after forming a thin oxide film with ozone water on the surface of the obtained silicon film having a crystal structure (also called a polysilicon film), a mask made of resist is formed and etched into a desired shape to form islands. The semiconductor layers 104 and 105 separated into two are formed. After the semiconductor layer is formed, the resist mask is removed.

Next, the oxide film is removed with an etchant containing hydrofluoric acid, and at the same time, the surface of the silicon film is washed, and then an insulating film containing silicon as a main component to be the gate insulating film 106 is formed. In this embodiment, a silicon oxynitride film (composition ratio Si = 32) is formed to a thickness of 115 nm by plasma CVD.
%, O = 59%, N = 7%, H = 2%).

Next, as illustrated in FIG. 3B, a first conductive film 107 with a thickness of 20 to 100 nm and a second conductive film 108 with a thickness of 100 to 400 nm are stacked over the gate insulating film 106.
In this embodiment, a tantalum nitride film having a film thickness of 50 nm and a film thickness of 370 nm are formed on the gate insulating film 106.
The tungsten films are sequentially stacked.

As the conductive material for forming the first conductive film and the second conductive film, Ta, W, Ti, Mo,
It is formed of an element selected from Al and Cu, or an alloy material or a compound material containing the element as a main component. Alternatively, a semiconductor film typified by a polycrystalline silicon film doped with an impurity element such as phosphorus, or an AgPdCu alloy may be used as the first conductive film and the second conductive film. Moreover, it is not limited to a two-layer structure, for example, a tungsten film with a film thickness of 50 nm, a film thickness of 500 n
A three-layer structure in which an aluminum alloy film (Al—Si) of m and a titanium nitride film with a thickness of 30 nm are sequentially stacked may be employed. In the case of a three-layer structure, tungsten nitride may be used instead of tungsten of the first conductive film, or aluminum instead of the aluminum and silicon alloy (Al-Si) film of the second conductive film. A titanium alloy film (Al—Ti) may be used, or a titanium film may be used instead of the titanium nitride film of the third conductive film. Moreover, a single layer structure may be sufficient.

Next, as shown in FIG. 3C, a resist mask 109 is formed by a light exposure process, and a first etching process is performed to form a gate electrode and a wiring. ICP (Inductively Coupled Plasma) for etching
An etching method may be used. Using the ICP etching method, the film is formed into a desired taper shape by appropriately adjusting the etching conditions (the amount of power applied to the coil-type electrode, the amount of power applied to the substrate-side electrode, the electrode temperature on the substrate side, etc.) Can be etched. In addition,
As an etching gas, a chlorine-based gas typified by Cl ₂ , BCl ₃ , SiCl ₄ , CCl ₄ or the like, a fluorine-based gas typified by CF ₄ , SF ₆ , NF ₃ , or the like, or O ₂ is appropriately used. Can do.

In the first etching process, the end can be tapered by the shape of the mask made of resist and the effect of the bias voltage applied to the substrate side. The angle of the taper part is 15-4
Set to 5 °. In order to etch without leaving a residue on the gate insulating film, it is preferable to increase the etching time at a rate of about 10 to 20%. Since the selection ratio of the silicon oxynitride film to the W film is 2 to 4 (typically 3), the surface where the silicon oxynitride film is exposed is etched by about 20 to 50 nm by the over-etching process. Thus, the first shape conductive layer 1 composed of the first conductive film and the second conductive film is formed by the first etching process.
10, 111 (first conductive layers 110a and 111a and second conductive layers 110b and 111b) are formed.
Reference numeral 112 denotes a gate insulating film, and a region not covered with the first shape conductive layer is etched and thinned by about 20 to 50 nm.

Then, a first doping process is performed to dope n-type impurities (donors). (Fig. 3
(D)) The method is performed by ion doping or ion implantation. The ion doping method is performed at a dose of 1 × 10 ^{13 to} 5 × 10 ¹⁴ / cm ² . As the impurity element imparting n-type, an element belonging to Group 15, typically phosphorus (P) or arsenic (As) is used. In this case, the first shape conductive layers 110 and 111 serve as a mask for the element to be doped, and the acceleration voltage is appropriately adjusted (for example, 20 to 60 keV). (N + regions) 113 and 114 are formed. For example, the impurity region (n
The phosphorus (P) concentration in the (+ region) is in the range of 1 × 10 ²⁰ to 1 × 10 ²¹ / cm ³ .

Next, a second doping process is performed as shown in FIG. The n-type impurity (donor) is doped under a condition of a high acceleration voltage with a lower dose than in the first doping process. For example, the acceleration voltage is 70 to 120 keV, and the dose is 1 × 10 ¹³ / cm ² .
In D), an impurity region is formed inside the first impurity region formed in the semiconductor layer. Doping is performed using the second conductive films 110b and 111b as masks against the impurity elements so that the impurity elements are added to regions below the first conductive films 110a and 111a. Thus, an impurity region (n−region) 115 overlapping with the first conductive films 110a and 111a,
116 is formed. In this impurity region, since the second conductive layers 110a and 111a remain with substantially the same film thickness, the concentration difference in the direction along the second conductive layer is small and 1 × 1.
It is formed at a concentration of 0 ¹⁷ to 1 × 10 ¹⁹ / cm ³ .

Next, a second etching process is performed as shown in FIG. The etching uses an ICP etching method, and CF ₄ , Cl _2, and O ₂ are mixed in an etching gas, and plasma is generated by supplying 500 W of RF power (13.56 MHz) to a coil-type electrode at a pressure of 1 Pa. . 50 W RF (13.56 MHz) power is applied to the substrate side (sample stage), and a lower self-bias voltage is applied than in the first etching process. Under such conditions, the tungsten film is anisotropically etched to leave the tantalum nitride film or titanium film as the first conductive layer. Thus, the second shape conductive layers 117 and 118 (first conductive films 117a and 1
18a and second conductive films 117b and 118b) are formed. 119 is a gate insulating film,
Regions not covered with the second shape conductive layers 117 and 118 are further etched by about 20 to 50 nm to reduce the film thickness.

Then, as shown in FIG. 4C, a resist mask 120 is formed, and a p-type impurity (acceptor) is doped into the semiconductor layer for forming the p-channel TFT. Typically, boron (B) is used. The impurity concentration of the impurity regions (p + regions) 121 and 122 is 2 × 1.
The conductivity type is inverted by adding boron of 1.5 to 3 times the concentration of phosphorus contained, so as to be 0 ^{20 to} 2 × 10 ²¹ / cm ³ .

Through the above steps, impurity regions are formed in the respective semiconductor layers. Second shape conductive layer 11
7 and 118 are gate electrodes. After that, as shown in FIG. 4D, a protective insulating film 123 made of a silicon nitride film or a silicon oxynitride film is formed by a plasma CVD method. Then, a process of activating the impurity element added to each semiconductor layer is performed for the purpose of controlling the conductivity type.

Further, a silicon nitride film 124 is formed and hydrogenation is performed. As a result, hydrogenation can be achieved by diffusing hydrogen in the silicon nitride film 124 into the semiconductor layer.

Next, an interlayer insulating film 125 is formed. The interlayer insulating film 125 is formed using an organic insulating material such as polyimide or acrylic. Of course, TEOS (Tetraethyl Ortho) is formed by plasma CVD.
Although a silicon oxide film formed using silicate may be applied, it is preferable to use the organic material from the viewpoint of improving flatness.

Next, contact holes are formed, aluminum (Al), titanium (Ti)
Source wiring or drain wiring 126 to 128 is formed using tantalum (Ta) or the like.

Through the above process, C is a complementary combination of an n-channel TFT and a p-channel TFT.
A MOS circuit can be obtained.

The p-channel TFT has a channel formation region 130 and impurity regions 121 and 122 that function as a source region or a drain region.

The n-channel TFT includes a channel formation region 131, an impurity region 116a (Gate Overlapped Drain: GOLD region) overlapping the gate electrode 118 made of the second shape conductive layer, and an impurity region 116b (LDD region) formed outside the gate electrode. )
And an impurity region 119 functioning as a source region or a drain region.

Such a CMOS circuit can form part of a driver circuit in an active matrix light-emitting device or an active matrix liquid crystal display device. In addition, such an n-channel TFT or a p-channel TFT can be applied to a transistor in a pixel portion.

By combining such CMOS circuits, basic logic circuits can be configured, and more complex logic circuits (signal division circuits, D / A converters, operational amplifiers, γ correction circuits, etc.) can be configured, and memory It is also possible to form a microprocessor.

Here, an example in which a light-emitting device having an OLED is manufactured using the TFT obtained in Example 1 will be described with reference to FIGS.

FIG. 5 shows an example of a light-emitting device having a pixel portion and a driving circuit for driving the pixel portion on the same insulator (but a state before sealing). Note that a CMOS circuit serving as a basic unit is shown in the driver circuit, and one pixel is shown in the pixel portion. This CMOS circuit can be obtained according to the first embodiment.

In FIG. 5, 200 is a substrate, 201 is a first material layer, 202 is a second material layer,
On the base insulating layer 203 provided on the element formation substrate, a driving circuit 204 including an n-channel TFT and a p-channel TFT, a switching TFT including a p-channel TFT, and a current control TFT including an n-channel TFT are provided. Is formed. In this embodiment, all TFTs are formed by top gate type TFTs.

Description of the n-channel TFT and the p-channel TFT will be omitted because the first embodiment can be referred to. The switching TFT is a p-channel TFT having a structure (double gate structure) having two channel formation regions between a source region and a drain region. Note that this embodiment is not limited to the double gate structure, and may be a single gate structure in which one channel formation region is formed or a triple gate structure in which three channel formation regions are formed.

In addition, a contact hole is provided in the first interlayer insulating film 207 before the second interlayer insulating film 208 is provided on the drain region 206 of the current control TFT. This is to simplify the etching process when forming a contact hole in the second interlayer insulating film 208.
A contact hole is formed in the second interlayer insulating film 208 so as to reach the drain region 206, and a pixel electrode 209 connected to the drain region 206 is provided. Pixel electrode 20
Reference numeral 9 denotes an electrode that functions as a cathode of the OLED, and is formed using a conductive film containing an element belonging to Group 1 or Group 2 of the periodic table. In this embodiment, a conductive film made of a compound of lithium and aluminum is used.

Next, reference numeral 213 denotes an insulating film provided so as to cover the end portion of the pixel electrode 209 and is referred to as a bank in this specification. The bank 213 may be formed using an insulating film or a resin film containing silicon. When a resin film is used, the specific resistance of the resin film is 1 × 10 ⁶ to 1 × 10 ¹² Ωm (preferably 1 ×
When carbon particles or metal particles are added so as to be 10 ⁸ to 1 × 10 ¹⁰ Ωm), dielectric breakdown during film formation can be suppressed.

The OLED 210 includes a pixel electrode (cathode) 209, an organic compound layer 211, and an anode 21.
It consists of two. As the anode 212, a conductive film having a high work function, typically an oxide conductive film, is used. As the oxide conductive film, indium oxide, tin oxide, zinc oxide, or a compound thereof may be used.

In this specification, the organic compound layer is a general term for a layer in which a hole injection layer, a hole transport layer, a hole blocking layer, an electron transport layer, an electron injection layer, or an electron blocking layer are combined with the light emitting layer. It is defined as However, the organic compound layer includes a case where the organic compound film is used as a single layer.

The light emitting layer is not particularly limited as long as it is an organic compound material, and a high molecular material or a low molecular material may be used. For example, a thin film made of a light emitting material that emits light by doublet excitation, or triplet excitation. A thin film made of a light emitting material that emits light can be used.

Although not shown here, it is effective to provide a passivation film so as to completely cover the OLED 210 after the anode 212 is formed. As the passivation film, a film having thermal conductivity, for example, a layer represented by AlN _X O _Y is suitable. In addition, as another passivation film, an insulating film including a DLC film, a silicon nitride film, or a silicon nitride oxide film may be stacked, or a stack combining these may be used.

Next, in order to protect the OLED 210, a substrate 200 provided with a first material layer 201 is provided after a cover material that serves as a support is attached as shown in the embodiment and a sealing (or encapsulation) process is performed. Tear off. Then, the film substrate is bonded to the second material layer with an adhesive layer. A plurality of barrier films on the film substrate to be bonded, and a layer having a smaller stress than the barrier film (stress relaxation film) between the barrier films
1 are provided, and the state after bonding is shown in FIG. 1A and FIG.
(B). The second material layer 202 corresponds to the insulating film 11.

Here, an example different from the process shown in Example 2 is shown, and specifically, a more detailed description of the peeling process and the bonding process will be described with reference to FIGS.

In FIG. 6A, 300 is a substrate, 301 is a nitride layer, 302 is an oxide layer, 303 is a base insulating layer, 304a to 304c are elements, 305 is an OLED, and 306 is an interlayer insulating film.

In FIG. 6A, a glass substrate, a quartz substrate, a ceramic substrate, or the like can be used as the substrate 300. Further, a silicon substrate, a metal substrate, or a stainless steel substrate may be used.

First, as shown in FIG. 6A, the first material layer 3 is formed on the substrate 300 according to the embodiment.
01 and the second material layer 302 are formed. It is important to make the film stress of the first material layer 301 different from the film stress of the second material layer 302. Each film thickness is from 1 nm to 1000 nm.
What is necessary is just to set suitably in the range of nm and to adjust each film | membrane stress.

Next, a layer to be peeled is formed over the second material layer 302. The layer to be peeled may be a layer including various elements typified by TFTs (thin film diodes, photoelectric conversion elements made of silicon PIN junctions, and silicon resistance elements). Further, heat treatment within a range that the substrate 300 can withstand can be performed. In the present invention, the film stress of the second material layer 302 and the first material layer 301
Even if the film stresses are different from each other, film peeling or the like does not occur due to the heat treatment in the manufacturing process of the layer to be peeled. Here, the element 30 of the driver circuit 23 is formed over the base insulating layer 303 as a layer to be peeled.
4a and 304b and the element 304c of the pixel portion 304 are formed, and the element 30 of the pixel portion 304 is formed.
The OLED 15 electrically connected to 4c is formed, and the film thickness is 10 nm to 1 so as to cover the OLED
An interlayer insulating film (an organic resin having a light transmitting property) 306 having a thickness of 000 nm is formed. (Fig. 1 (A
))

In the case where unevenness is formed on the surface by the first material layer 301 or the second material layer 302, the surface may be planarized before and after the base insulating layer is formed. The planarization is preferable because the coverage in the layer to be peeled is good and the layer to be peeled including the element is formed because the element characteristics are easily stabilized. Note that as this planarization treatment, an etch-back method in which a coating film (resist film or the like) is formed and then planarized by etching or the like, a mechanical chemical polishing method (CMP method), or the like may be used.

Next, a nitride oxide film 307 containing aluminum, which is an AlN _x O _Y film having a thickness of 10 nm to 1000 nm, is formed over the interlayer insulating film 306. (Fig. 6 (B)
The AlN _X O _Y film 307 functions as a protective film. Here, aluminum nitride (Al
N) Using a target, a film is formed in an atmosphere in which argon gas (20 sccm), nitrogen gas (15 sccm), and oxygen gas (5 sccm) are mixed. Alternatively, an aluminum (Al) target may be used to form a film in an atmosphere containing nitrogen gas and oxygen gas. Al
The N _X O _Y film 307 also has an effect of preventing the entry of substances that promote the deterioration of the OLED 15 such as impurities such as moisture and oxygen from the outside of the apparatus.

Next, the FPC 310 and the IC chip (not shown) are attached by a COG (chip on glass) method, a TAB (tape automated bonding) method, or a wire bonding method. Also,
Each wiring of each TFT element and the input / output terminal 311 are connected by wiring (connection wiring), and the FPC 310 is bonded to the input / output terminal 311 with an anisotropic conductive material. Anisotropic conductive material is resin and surface A
It consists of conductive particles with a diameter of several tens to several hundreds μm plated with u and the like, and the input / output terminals and the wiring formed on the FPC are electrically connected by the conductive particles. Similarly, an IC chip having a memory, CPU, controller, D / A converter, etc. is also bonded to the substrate with an anisotropic conductive material, and input / output terminals provided on the IC chip by conductive particles mixed in the resin. Are electrically connected to the lead wire or connection wiring and the input / output terminal.

Next, in order to peel off the substrate 300 by physical means, a support for fixing a layer to be peeled (
A cover material 309 made of a plastic substrate is attached with an adhesive layer 308 such as an epoxy resin. Here, FIG. 6C shows an example in which the mechanical strength of the layer to be peeled is assumed to be insufficient. However, if the mechanical strength of the layer to be peeled is sufficient, It can also peel without the support body which fixes. Since the support body 309 is attached so as to cover the FPC 310 and the IC chip, the connection between the input / output terminal 311 and the FPC can be further fixed by adhesion of the support body 309. Although an example in which the support is bonded after the FPC or IC chip is bonded is shown here, the FPC or IC chip may be mounted after the support is bonded.

Next, the substrate 300 over which the first material layer 301 is provided is peeled off by physical means. Since the film stress of the second material layer 302 and the film stress of the first material layer 301 are different,
It can be peeled off with a relatively small force. While the bonding force between the first material layer 301 and the second material layer 302 has a strength that can withstand thermal energy, the film stresses differ from each other.
Since there is a stress strain between the first material layer 301 and the second material layer 302, it is weak to mechanical energy and is optimal for peeling. In this manner, the layer to be peeled formed over the second material layer 302 can be separated from the substrate 300. The state after peeling is shown in FIG. Note that this peeling method allows not only peeling of a layer to be peeled having a small area but also peeling of a layer to be peeled having a large area over the entire surface with a high yield.

Next, the second material layer 302 is transferred to the transfer body 309a by an adhesive layer 308 such as an epoxy resin.
Paste to. In the embodiment, an example in which there is a gap between the cover material and the protective film is shown.
In this embodiment, an example in which an adhesive layer is bonded to the protective film 307 is shown.

Here, the transfer body 309a is a plastic film substrate to reduce the weight. Further, (also referred to as AlN _X O _Y film) layer represented by AlN _X O _Y which serves as a barrier film onto the transfer member 309a and 309b, and the stress relaxation layer (organic resin) 309c, AlN _X O _Y
By providing a stack with the film 309d and effectively preventing impurities such as moisture and oxygen from entering the organic light emitting layer in the barrier film, and providing a stress relaxation film between the plurality of barrier films,
It becomes a more flexible light-emitting device and can prevent cracks when bent.

In this way, a light emitting device having an OLED formed on a flexible plastic substrate is completed.

Note that in this specification, the transfer body is to be bonded to the layer to be peeled after being peeled, and is not particularly limited, and may be a base material having any composition such as plastic, glass, metal, ceramics and the like. Further, in this specification, the support is for adhering to the layer to be peeled when peeling by physical means, and is not particularly limited, and may be plastic, glass, metal,
A base material of any composition such as ceramics may be used. Further, the shape of the transfer body and the shape of the support are not particularly limited, and may be a flat surface, a curved surface, a bendable shape, or a film shape. If weight reduction is the top priority, a film-like plastic substrate such as polyethylene terephthalate (PET), polyethersulfone (
PES)
, Polyethylene naphthalate (PEN), polycarbonate (PC), nylon, polyetheretherketone (PEEK), polysulfone (PSF), polyetherimide (P
Plastic substrates such as EI), polyarylate (PAR), and polybutylene terephthalate (PBT) are preferred.

In this embodiment, the pixel electrode is used as an anode, and an organic compound layer and a cathode are stacked to form an embodiment (FIG. 1).
FIG. 8 shows an example of a configuration that emits light in the opposite direction to (). The top view is the same as FIG.

The sectional structure shown in FIG. 8 will be described below. A film substrate 1000a provided with a stack of an AlN _X O _Y film 1000b, a stress relaxation film 1000c, and an AlN _X O _Y film 1000d is bonded to the insulating film 1001 and an adhesive layer 1023. An insulating film 1010 is provided over the insulating film 1001. Above the insulating film 1010, the pixel portion 1002 and the gate side driver circuit 10 are provided.
03 is formed, and the pixel portion 1002 is formed by a plurality of pixels including a current control TFT 1011 and a pixel electrode 1012 electrically connected to the drain thereof. TF for current control
As T1011, an n-channel TFT can be used, but a p-channel TFT is preferably used. The gate side driver circuit 1003 includes an n-channel TFT 1013.
And a p-channel TFT 1014 are used to form a CMOS circuit.

These TFTs (including 1011, 1013, and 1014) may be manufactured according to the n-channel TFT 201 of the first embodiment and the p-channel TFT 202 of the first embodiment.

The pixel electrode 1012 functions as an anode of a light emitting element (OLED). Further, the pixel electrode 10
Banks 1015 are formed on both ends of the organic compound layer 101 on the pixel electrode 1012.
6 and the cathode 1017 of the light emitting element are formed.

The cathode 1017 also functions as a wiring common to all pixels, and the FP is connected via the connection wiring 1008.
C1009 is electrically connected. Further, the pixel portion 1002 and the gate side driving circuit 1
All elements included in 003 are covered with a cathode 1017, an organic resin 1018, and a protective film 1019. As the protective film 1019, the same AlN _x O _y film as 1000b may be used. Further, the cover material 1020 is bonded to the adhesive layer. Further, the cover material is provided with a recess, and a desiccant 1021 is provided.

Further, when the cover material 1020 has the concave shape shown in FIG. 8, the cover material 10 serving as a support body.
After bonding 20, the wiring lead-out terminal portion becomes only the insulating film 1010 at the time of peeling, and the mechanical strength is weakened. Therefore, FPC 1009 is attached before peeling, and the organic resin 1022 is further peeled off.
It is desirable to fix with.

In FIG. 8, since the pixel electrode is an anode and the organic compound layer and the cathode are stacked, the light emission direction is the direction of the arrow shown in FIG.

Although the top gate type TFT has been described as an example here, the present invention can be applied regardless of the TFT structure. For example, it can be applied to a bottom gate type (reverse stagger type) TFT or a forward stagger type TFT. Is possible.

In the embodiment, an example using a top gate type TFT is shown, but a bottom gate type TF is used.
It is also possible to use T. Here, an example using a bottom gate TFT is shown in FIG.

As shown in FIG. 9, n-channel TFT 1113, p-channel TFT 1114, n
All the channel TFTs 1111 have a bottom gate structure. These bottom gate structures may be manufactured using a known technique. Note that the active layer of these TFTs may be a semiconductor film (such as polysilicon) having a crystal structure or a semiconductor film (such as amorphous silicon) having an amorphous structure.

In FIG. 9, 1100a is a flexible film substrate (for example, plastic substrate), 1100b, 1100d is an AlN _X O _Y film, 1100c is a stress relaxation film (organic resin), and 1101 is a second film substrate. 1102 is a pixel portion, 1103 is a gate side driving circuit, 1110 is an insulating film, 1112 is a pixel electrode (cathode),
1115 is a bank, 1116 is an organic compound layer, 1117 is an anode, 1118 is an organic resin, 1
Reference numeral 119 denotes a protective film (AlN _X O _Y film), 1120 denotes a cover material, 1121 denotes a desiccant, 1122 denotes an organic resin, and 1123 denotes an adhesive layer.

In addition, an n-channel TFT 1113, a p-channel TFT 1114, and an n-channel TF
Since the configuration other than T1111 is the same as that of the embodiment, the description thereof is omitted here.

An EL module formed by implementing the present invention can be used for display portions of various electronic devices. That is, the present invention can be implemented in all electronic devices in which the EL module is incorporated in the display portion.

Such electronic devices include video cameras, digital cameras, head mounted displays (goggles type displays), car navigation systems, projectors, car stereos,
A personal computer, a portable information terminal (such as a mobile computer, a mobile phone, or an electronic book) can be used. Examples of these are shown in FIGS.

FIG. 10A illustrates a personal computer, which includes a main body 2001, an image input portion 2002, a display portion 2003, a keyboard 2004, and the like. The present invention can be applied to the display portion 2003.

FIG. 10B illustrates a video camera, which includes a main body 2101, a display portion 2102, and an audio input portion 210.
3, an operation switch 2104, a battery 2105, an image receiving unit 2106, and the like. The present invention can be applied to the display portion 2102.

FIG. 10C shows a mobile computer (mobile computer).
A camera unit 2202, an image receiving unit 2203, an operation switch 2204, a display unit 2205, and the like are included.
The present invention can be applied to the display portion 2205.

FIG. 10D illustrates a goggle type display, which includes a main body 2301, a display portion 2302, an arm portion 2303, and the like. The present invention can be applied to the display portion 2302.

FIG. 10E shows a player using a recording medium (hereinafter referred to as a recording medium) on which a program is recorded. The main body 2401, the display portion 2402, the speaker portion 2403, the recording medium 2404,
Operation switch 2405 and the like are included. This player uses DVD (Dig as a recording medium).
(tial Versatile Disc), CD, etc. can be used for music appreciation, movie appreciation, games and the Internet. The present invention can be applied to the display portion 2402.

FIG. 10F illustrates a digital camera, which includes a main body 2501, a display portion 2502, and an eyepiece portion 250.
3, an operation switch 2504, an image receiving unit (not shown), and the like. The present invention can be applied to the display portion 2502.

FIG. 11A illustrates a mobile phone, which includes a main body 2901, an audio output unit 2902, and an audio input unit 29.
03, display unit 2904, operation switch 2905, antenna 2906, image input unit (CCD
2907 and the like. The present invention can be applied to the display portion 2904.

FIG. 11B illustrates a portable book (electronic book), which includes a main body 3001 and display portions 3002 and 300.
3, a storage medium 3004, an operation switch 3005, an antenna 3006, and the like. The present invention can be applied to the display portions 3002 and 3003.

FIG. 11C illustrates a display, which includes a main body 3101, a support base 3102, and a display portion 3103.
Etc. The present invention can be applied to the display portion 3103.

By the way, the display shown in FIG. 11C is a small or medium size display, for example, 5-20.
Inch screen size. Further, in order to form a display portion having such a size, it is preferable to use a substrate having a side of 1 m and perform mass production by performing multiple chamfering.

As described above, the applicable range of the present invention is so wide that it can be applied to manufacturing methods of electronic devices in various fields. Moreover, the electronic apparatus of a present Example is realizable even if it uses the structure which consists of what combination of Examples 1-5.

Claims (3)

A first barrier film on a plastic substrate;
A first organic resin film on the first barrier film;
A second barrier film on the first organic resin film;
An adhesive layer on the second barrier film;
An insulating film on the adhesive layer;
A thin film transistor on the insulating film;
A light emitting device comprising an anode, a cathode and an organic light emitting layer between the anode and the cathode, electrically connected to the thin film transistor, on the thin film transistor;
A second organic resin film covering the light emitting element;
A protective film covering the second organic resin film,
The thin film transistor and the light emitting element are sealed with a cover material provided with a nitrided oxide film containing aluminum using an adhesive,
Light emission from the light emitting element is emitted through the cover material. A first barrier film on a plastic substrate;
A first organic resin film on the first barrier film;
A second barrier film on the first organic resin film;
An adhesive layer on the second barrier film;
An insulating film on the adhesive layer;
A thin film transistor on the insulating film;
A light emitting device comprising an anode, a cathode and an organic light emitting layer between the anode and the cathode, electrically connected to the thin film transistor, on the thin film transistor;
A second organic resin film covering the light emitting element;
A protective film covering the second organic resin film,
The thin film transistor and the light emitting element are sealed with a cover material provided with a nitrided oxide film containing aluminum using an adhesive,
Light emission from the light emitting element is emitted through the plastic substrate. A first barrier film on a plastic substrate;
A first organic resin film on the first barrier film;
A second barrier film on the first organic resin film;
An adhesive layer on the second barrier film;
An insulating film on the adhesive layer;
A thin film transistor on the insulating film;
A light emitting device comprising an anode, a cathode and an organic light emitting layer between the anode and the cathode, electrically connected to the thin film transistor, on the thin film transistor;
A second organic resin film covering the light emitting element;
A protective film covering the second organic resin film,
The light-emitting device, wherein the thin film transistor and the light-emitting element are sealed with a cover material provided with a nitride oxide film containing aluminum using an adhesive.

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