JP6264218B2 - 発光デバイス、波長変換部材及び波長変換部材の製造方法 - Google Patents
発光デバイス、波長変換部材及び波長変換部材の製造方法 Download PDFInfo
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- JP6264218B2 JP6264218B2 JP2014149456A JP2014149456A JP6264218B2 JP 6264218 B2 JP6264218 B2 JP 6264218B2 JP 2014149456 A JP2014149456 A JP 2014149456A JP 2014149456 A JP2014149456 A JP 2014149456A JP 6264218 B2 JP6264218 B2 JP 6264218B2
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- 238000006243 chemical reaction Methods 0.000 title claims description 74
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 239000002096 quantum dot Substances 0.000 claims description 107
- 239000002245 particle Substances 0.000 claims description 51
- 239000007788 liquid Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 11
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 9
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 6
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims description 6
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 5
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 22
- 229910052760 oxygen Inorganic materials 0.000 description 22
- 239000001301 oxygen Substances 0.000 description 22
- 230000005284 excitation Effects 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 230000006866 deterioration Effects 0.000 description 11
- 238000007789 sealing Methods 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 230000008859 change Effects 0.000 description 6
- 229910010272 inorganic material Inorganic materials 0.000 description 6
- 239000011147 inorganic material Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- 238000000149 argon plasma sintering Methods 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- 239000011342 resin composition Substances 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 4
- 239000013081 microcrystal Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 241000588731 Hafnia Species 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- QCCDYNYSHILRDG-UHFFFAOYSA-K cerium(3+);trifluoride Chemical compound [F-].[F-].[F-].[Ce+3] QCCDYNYSHILRDG-UHFFFAOYSA-K 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(IV) oxide Inorganic materials O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 2
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 238000004438 BET method Methods 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B38/00—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Description
図1は、第1の実施形態に係る発光デバイス1の模式的断面図である。
波長変換部材10の製造方法は、特に限定されない。波長変換部材10は、例えば、以下の要領で製造することができる。
まず、多孔質体12を作製する。多孔質体12は、例えば、担体粒子13を含むペーストを成形して得られた成形体を焼成することにより形成することができる。成形体には、例えば、樹脂やカーボン等の消失剤や、無機結合剤等を含ませておいてもよい。
第2の製造方法では、まず、担体粒子13と量子ドット14とを有するペーストを調製する。次に、そのペーストを成形し、成形体を得る。ペーストの成形方法は、特に限定されない。例えば、ペーストを、スクリーン印刷法やインクジェット印刷法等の印刷法により印刷し、乾燥させることにより成形してもよい。また、例えば、厚膜に印刷したペーストをさらにプレス成形してもよい。
図3は、第2の実施形態に係る発光デバイス1aの模式的断面図である。
図4は、第3の実施形態に係る発光デバイス1bの模式的断面図である。
図5は、第4の実施形態に係る波長変換部材10aの模式的斜視図である。図6は、第4の実施形態に係る波長変換部材10aの模式的断面図である。
図7は、第5の実施形態に係る発光デバイス1cの模式的断面図である。図7に示すように、第4の実施形態に係る波長変換部材10aを、光源11が搭載されたデバイス本体16に取り付けてもよい。
10,10a 波長変換部材
11 光源
12 多孔質体
13 担体粒子
14 量子ドット
15 セル
15a カバー部材
15b 貫通孔
16 デバイス本体
16a 実装基板
17 コーティング膜
18 反射部材
Claims (4)
- 連続気泡を有する多孔質体を準備する工程と、
前記多孔質体を、貫通孔を有するセル内に配する工程と、
前記貫通孔から量子ドットを含む液体を注入し、前記量子ドットを含む液体を前記多孔質体に含浸させる工程と、
前記量子ドットを含む液体を含浸した多孔質体を乾燥させることにより、前記多孔質体の内表面上に前記量子ドットを担持させる工程と、
前記貫通孔を塞ぐ工程と、
を備える、波長変換部材の製造方法。 - 前記液体は、ヘキサン、ヘプタン、ノナン、クロロホルム、トルエン、オクタン、ジエチルエーテル、酢酸エチル及び塩化メチレンからなる群から選ばれた少なくとも一種を含む、請求項1に記載の波長変換部材の製造方法。
- 担体粒子と、量子ドットとを有するペーストを調製する工程と、
前記ペーストを成形し、成形体を得る工程と、
前記成形体を乾燥させることにより、前記担体粒子により構成された多孔質体と、前記多孔質体の内表面上に担持された前記量子ドットとを有する波長変換部材を得る工程と、 を備える、波長変換部材の製造方法。 - 前記成形体を焼成する工程をさらに備える、請求項3に記載の波長変換部材の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014149456A JP6264218B2 (ja) | 2014-06-06 | 2014-07-23 | 発光デバイス、波長変換部材及び波長変換部材の製造方法 |
PCT/JP2015/064306 WO2015186504A1 (ja) | 2014-06-06 | 2015-05-19 | 発光デバイス、波長変換部材及び波長変換部材の製造方法 |
TW104117673A TW201547067A (zh) | 2014-06-06 | 2015-06-01 | 發光裝置、波長轉換構件及波長轉換構件之製造方法 |
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JP2014117997 | 2014-06-06 | ||
JP2014117997 | 2014-06-06 | ||
JP2014149456A JP6264218B2 (ja) | 2014-06-06 | 2014-07-23 | 発光デバイス、波長変換部材及び波長変換部材の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2016012711A JP2016012711A (ja) | 2016-01-21 |
JP6264218B2 true JP6264218B2 (ja) | 2018-01-24 |
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JP2014149456A Expired - Fee Related JP6264218B2 (ja) | 2014-06-06 | 2014-07-23 | 発光デバイス、波長変換部材及び波長変換部材の製造方法 |
Country Status (3)
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JP (1) | JP6264218B2 (ja) |
TW (1) | TW201547067A (ja) |
WO (1) | WO2015186504A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI579635B (zh) * | 2015-12-28 | 2017-04-21 | 中強光電股份有限公司 | 投影系統及其屏幕 |
WO2018030586A1 (ko) * | 2016-08-09 | 2018-02-15 | 주식회사 베이스 | 엘이디 색변환용 구조체 및 이를 포함하는 엘이디 패키지 |
WO2018235580A1 (ja) * | 2017-06-19 | 2018-12-27 | 日本電気硝子株式会社 | ナノ蛍光体付着無機粒子及び波長変換部材 |
WO2019017423A1 (ja) * | 2017-07-21 | 2019-01-24 | Dic株式会社 | インク組成物及びその製造方法、光変換層並びにカラーフィルタ |
US10442987B2 (en) * | 2017-08-31 | 2019-10-15 | Nichia Corporation | Fluorescent member, optical component, and light emitting device |
TWI650398B (zh) * | 2017-12-08 | 2019-02-11 | Chi Mei Corporation | 發光材料與應用之顯示裝置 |
CN111273484B (zh) * | 2020-03-11 | 2023-08-22 | 宁波东旭成新材料科技有限公司 | 一种无阻隔膜量子点膜 |
WO2022251195A1 (en) * | 2021-05-24 | 2022-12-01 | W. L. Gore & Associates, Inc. | Photoluminescent composites and processes for fabricating the same |
CN114512588B (zh) * | 2022-02-25 | 2023-06-16 | 苏州芯聚半导体有限公司 | 微发光二极管结构及制备方法、显示面板 |
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JPH05345685A (ja) * | 1992-06-15 | 1993-12-27 | Toshiba Ceramics Co Ltd | シリカ質多孔体の製造方法 |
JP2003201473A (ja) * | 2001-10-31 | 2003-07-18 | Nittetsu Mining Co Ltd | 酸化亜鉛−シリカ系無機多孔質蛍光体及びその製造方法 |
DE10316769A1 (de) * | 2003-04-10 | 2004-10-28 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Leuchtstoffbassierte LED und zugehöriger Leuchtstoff |
EP2669350B1 (en) * | 2011-01-28 | 2018-11-07 | Showa Denko K.K. | Composition containing quantum dot fluorescent body, molded body of quantum dot fluorescent body dispersion resin, structure containing quantum dot fluorescent body, light-emitting device, electronic apparatus, mechanical device, and method for producing molded body of quantum dot fluorescent body dispersion resin |
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2014
- 2014-07-23 JP JP2014149456A patent/JP6264218B2/ja not_active Expired - Fee Related
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2015
- 2015-05-19 WO PCT/JP2015/064306 patent/WO2015186504A1/ja active Application Filing
- 2015-06-01 TW TW104117673A patent/TW201547067A/zh unknown
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Publication number | Publication date |
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JP2016012711A (ja) | 2016-01-21 |
TW201547067A (zh) | 2015-12-16 |
WO2015186504A1 (ja) | 2015-12-10 |
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