JP6255176B2 - Thermal management structure of electronic equipment - Google Patents

Description

  The present invention relates to a thermal management structure for electronic equipment.

Conventionally, in an electronic device configured to electrically connect an electronic component or an electric component (heat generating component) that generates heat when energized to a substrate, the heat generating component is fixed to a heat sink (heat radiating member), and the substrate is positioned above the heat sink. Many thermal management structures are used.
By the way, in an electronic device having such a thermal management structure, there is a portion (cooling required portion) that needs to be cooled in a circuit (a circuit constituted by electronic components, wiring, and the like) formed on a substrate. In addition to the heat source portion that generates heat when energized, the cooling required portion includes a portion that is not preferably heated by the heat-generating component on the heat sink and the heat source portion on the substrate. Conventionally, it has been considered to prevent heating of the required cooling part formed on the substrate by filling the gap between the heat sink and the substrate with a heat radiating resin (a resin having a high thermal conductivity).

  In addition, in a conventional electronic device, for example, as in Patent Document 1, a partition plate that partitions a space in a case is provided in a case that houses a substrate on which a heat generating component or another electronic component is mounted. There is also a case where the divided space is filled with a heat-dissipating resin after being arranged in one divided space. In this configuration, since the heat generating component is embedded in the heat radiating resin, the heat of the heat generating component can be released from the heat radiating resin to the case. In addition, since the resin is filled only in the divided space, the amount of resin filling is reduced, and the weight of the electronic device is reduced.

JP 2003-249780 A

However, if the entire gap between the heat sink and the substrate is filled with the heat-dissipating resin, the amount of heat-dissipating resin is unnecessarily increased, which increases the weight of the electronic device. In particular, in the case of an in-vehicle electronic device, the weight of the entire vehicle is increased, which is not preferable.
Although the amount of the heat radiation resin can be suppressed by providing a partition plate as in Patent Document 1, the partition plate is provided integrally with the case that accommodates the substrate. There is a problem that it is necessary to manufacture and versatility is low.
Furthermore, when another heat source (for example, a heat generating component) is provided in the vicinity of the cooling required portion, the heat from the heat source is transmitted to the heat radiating resin, so that the heat dissipation efficiency of the cooling required portion is reduced or the cooling required portion is different. There is also a problem of being heated by a heat source.

  The present invention has been made in view of the above-described circumstances, and can prevent a reduction in heat dissipation efficiency of the cooling required portion and heating of the cooling required portion by another heat source, and further has high versatility while achieving weight reduction. It aims at providing the thermal management structure of an electronic device.

In order to solve this problem, the thermal management structure for an electronic device according to the present invention includes a substrate on which electronic components are mounted on at least one main surface to form a circuit, and a position spaced from the main surface of the substrate. A heat dissipating member, a cylindrical resin filling case extending from the main surface of the substrate to the heat dissipating member, a heat dissipating resin filled in the resin filling case, and surrounding the resin filling case. And a cylindrical heat insulating member extending from the main surface of the substrate to the heat radiating member, and the resin-filled case is arranged so as to surround a required cooling portion of the circuit that requires cooling, and the heat radiating resin is, The resin filling case located on the heat radiating member side is filled with no gap, and at least the second end part of the resin filling case located on the substrate side is in contact with the cooling required part. Main face And at least one surface of the opposing surfaces of the heat radiating member facing the main surface is provided with a heat generating portion that generates heat by energization, and the installation region of the heat generating portion on the one surface and the arrangement of the resin-filled case A blocking hole is formed between the region and recessed from the one surface to partition the installation region and the arrangement region, and the heat insulating member has a heat insulating protrusion inserted into the blocking hole, When viewed from one surface side, the blocking hole and the heat insulating protrusion cross the region between the installation region and the placement region in a direction intersecting the arrangement direction of the placement region and the placement region. The heat insulating member is arranged with a space with respect to the outer peripheral surface of the resin-filled case, a heat-insulating layer is formed in a gap between the resin-filled case and the heat-insulating member, and the heat-insulating layer is Heat transfer than heat dissipation resin Characterized in that it is a heat insulating resin layer having a low rate a resin material.

  According to the present invention, it is possible to efficiently release the heat of the cooling required portion from the heat radiating resin (also through the resin-filled case) to the heat radiating member. Furthermore, by disposing the heat insulating member on the outside of the resin-filled case, it is possible to prevent the heat dissipation efficiency of the cooling required part from being lowered or the cooling required part from being heated by another heat source. Moreover, since the usage amount of the heat radiating resin is limited and reduced by the resin-filled case, the weight of the electronic device can be reduced. Furthermore, since it is only necessary to prepare a resin-filled case and a heat insulating member having a size matching the size of the cooling required part and the gap between the substrate and the heat radiating member, the versatility of the heat management structure can be improved.

It is a sectional side view which shows the thermal management structure of the electronic device which concerns on 1st embodiment of this invention. It is a schematic perspective view which shows the resin filling case with which the thermal management structure of FIG. 1 is equipped. It is a top view which shows the metal flat plate used when manufacturing the resin filling case of FIG. 2 by a bending process. It is a schematic perspective view which shows the heat insulation member with which the thermal management structure of FIG. 1 is equipped. In the thermal management structure of FIG. 1, it is a top view which shows the installation area | region of the 1st heat-emitting component in the upper surface of a 1st heat radiating member, and the arrangement | positioning area | region of a 1st resin filling case and a 1st heat insulation member. It is a top view which shows the state which looked at the 1st resin filling case and the 1st heat insulation member of FIG. 1 from the upper surface side of the board | substrate. It is a sectional side view which shows the thermal management structure of the electronic device which concerns on 2nd embodiment of this invention. It is a top view which shows the state which looked at the 1st resin filling case and the 1st heat insulation member of FIG. 7 from the upper surface side of the board | substrate. It is a sectional side view which shows the modification of the thermal management structure shown to FIG. It is a sectional side view which shows the modification of the thermal management structure shown to FIG.

[First embodiment]
The first embodiment of the present invention will be described below with reference to FIGS.
As shown in FIG. 1, the thermal management structure of the electronic device according to this embodiment includes a substrate 1, two heat radiating members 2, 3, two resin-filled cases 4, 5, a heat radiating resin 6, and two Insulating members 7 and 8 are provided.
A wiring pattern (not shown) is formed on the substrate 1, and a circuit is formed by electrically connecting the electronic components 9 to 12 to the wiring pattern. In the present embodiment, electronic components 9, 10, and 12 are mounted on both main surfaces (upper surface 1 a and lower surface 1 b) of the substrate 1. In the present embodiment, an electronic component 11 (hereinafter referred to as a first heat generating component (heat generating portion) 11) mounted on the first heat radiating member 2 is electrically connected to the substrate 1.

  The two electronic components 9 and 10 mounted on the substrate 1 are those that generate heat when energized, or those that have low heat resistance and require cooling. In the present embodiment, the first electronic component 9 is mounted on the lower surface 1 b of the substrate 1 facing the first heat radiating member 2. The second electronic component 10 is mounted on the upper surface 1 a of the substrate 1 facing the second heat radiating member 3. The first electronic component 9 and the second electronic component 10 in the illustrated example are chip components that are surface-mounted on the substrate 1, but may be lead components that are mounted on the substrate 1 through holes.

The remaining one electronic component 12 (hereinafter referred to as a second heat generating component (heat generating portion) 12) mounted on the substrate 1 generates heat by energization, such as a power device such as a power transistor. The second heat generating component 12 includes a main body 12A and an external terminal 12B for electrical connection protruding from the main body 12A.
The main body 12A is configured, for example, by embedding a semiconductor element (not shown) that generates heat when energized in a resin. The main body 12A is fixed to the upper surface 1a of the substrate 1 by screwing or soldering. On the other hand, the tip of the external terminal 12B is joined to the substrate 1 by solder (not shown). Thereby, the second heat generating component 12 is electrically connected to the wiring pattern of the substrate 1. The second heat-generating component 12 in the illustrated example is a surface-mount type semiconductor device in which the tip of the external terminal 12B is disposed on the upper surface 1a of the substrate 1 and joined by soldering. It may be a through-hole mounting type semiconductor device that is inserted through and joined. The second heat generating component 12 is disposed near the second electronic component 10.

  The first heat radiating member 2 is configured by forming a conductive material having excellent thermal conductivity such as aluminum in a plate shape, for example. The first heat radiating member 2 is disposed at a position spaced from the lower surface 1 b of the substrate 1. The substrate 1 and the first heat radiating member 2 are fixed to each other by, for example, screwing or the like. In the present embodiment, the above-described first heat generating component 11 is mounted on the upper surface (opposing surface) 2a of the first heat radiating member 2 facing the lower surface 1b of the substrate 1.

The first heat generating component 11 of the present embodiment generates heat by energization, such as a power device, for example, similarly to the second heat generating component 12 described above, and the main body portion 11A and the electrical connection protruding from the main body portion 11A. And an external terminal 11B for use.
The main body 11A is configured, for example, by embedding a semiconductor element (not shown) that generates heat when energized in a resin. The main body 11A is fixed to the upper surface 2a of the first heat radiating member 2 using screws, springs, or the like. On the other hand, the external terminal 11B protrudes toward the substrate 1 from the main body 11A. The front end portion of the external terminal 11B is inserted into a through hole 13 penetrating in the thickness direction of the substrate 1 and then joined to the substrate 1 with solder 14 on the upper surface 1a of the substrate 1. As a result, the first heat generating component 11 is electrically connected to the wiring pattern of the substrate 1. The first heat generating component 11 is arranged near the first electronic component 9.

  Similar to the first heat radiating member 2, the second heat radiating member 3 is made of a conductive material having excellent thermal conductivity, such as copper or aluminum, and is disposed at a position spaced apart from the upper surface 1a of the substrate 1. ing. The second heat radiating member 3 of the present embodiment is a cover that covers the upper surface 2a of the first heat radiating member 2 and the substrate 1, and is fixed to the first heat radiating member 2 by, for example, screwing or the like.

As shown in FIGS. 1 and 2, the resin-filled cases 4 and 5 are formed in a cylindrical shape and are arranged so as to extend from the substrate 1 to the heat radiating members 2 and 3.
In the present embodiment, the resin-filled cases 4 and 5 that are located on the side of the heat-dissipating members 2 and 3 extend in the radial direction of the resin-filled cases 4 and 5 at one axial end (first end portions 21 and 31). Flat plate portions 23 and 33 are formed. The flat plate portions 23 and 33 can come into surface contact with the heat radiating members 2 and 3. In the present embodiment, the flat plate portions 23 and 33 extend radially inward. That is, the resin-filled cases 4 and 5 of this embodiment are formed in a bottomed cylindrical shape, and the flat plate portions 23 and 33 are the bottom wall plate portions 23 and 33 of the resin-filled cases 4 and 5. The bottom wall plates 23 and 33 are formed with through holes 24 and 34 penetrating in the thickness direction.

  The bottom wall plate portion 33 of the second resin-filled case 5 is configured so that a screw 42 can be screwed thereon. In the present embodiment, the through hole 34 itself formed in the bottom wall plate portion 33 of the second resin filled case 5 is a screw hole. Further, the through-hole 34 is formed longer than the thickness of the bottom wall plate portion 33 by a cylindrical rib 37 so that the screw 42 can be securely screwed. The rib 37 protrudes from the periphery of the through hole 34 in the bottom wall plate portion 33 toward the other end (second end portion 32) side of the second resin-filled case 5 in the axial direction. The rib 37 can be formed, for example, by burring or nut press-fitting.

  Moreover, in this embodiment, the connection protrusions 25 and 35 which protrude in the axial direction of the resin filling cases 4 and 5 are formed in the 2nd end parts 22 and 32 of each resin filling case 4 and 5 located in the board | substrate 1 side. ing. The connection protrusions 25 and 35 are portions that are inserted into the substrate 1 when the resin-filled cases 4 and 5 are attached to the substrate 1. A plurality of connection protrusions 25 and 35 are arranged at intervals in the circumferential direction of the resin-filled cases 4 and 5.

The resin-filled cases 4 and 5 of the present embodiment configured as described above may be formed in a cylindrical shape having a rectangular shape in plan view as in the illustrated example, but are formed in an arbitrary cylindrical shape such as a cylindrical shape, for example. Also good.
The resin-filled cases 4 and 5 may be made of metal or resin, for example, but are more preferably formed of a material having a higher thermal conductivity than the heat radiation resin 6. Moreover, it is preferable that the resin filling cases 4 and 5 have conductivity.

When the resin-filled cases 4 and 5 are made of metal, the resin-filled cases 4 and 5 can be manufactured, for example, by subjecting a metal plate to deep drawing or bending.
For example, when the metal resin-filled cases 4 and 5 formed in a bottomed cylindrical shape having a rectangular shape in plan view shown in FIG. 2 are manufactured by bending, for example, as shown in FIG. After forming a metal flat plate in which the side wall portions 26 and 36 are connected to each side of the wall plate portions 23 and 33, the metal plate may be bent at the boundary line between the bottom wall plate portions 23 and 33 and the side wall portions 26 and 36. In addition, when there is a gap between the side wall portions 26 and 36 adjacent to each other in the state after the bending, the heat radiation resin 6 filled in the resin filling cases 4 and 5 is not leaked to the outside from the gap. What is necessary is just to fill a clearance gap by welding etc.

On the other hand, for example, when the metal resin-filled cases 4 and 5 are manufactured by deep drawing, the gap as described above does not occur, so that the number of manufacturing steps is small compared to the case of bending. There is. Further, there is an advantage that the heat radiation resin 6 can be easily and reliably prevented from leaking to the outside.
When the resin-filled cases 4 and 5 are made of resin, they can be easily manufactured by resin molding or the like. When the resin filled cases 4 and 5 made of resin are fixed to the substrate 1 with the solder 15 as shown in FIG. 1, the metal connection protrusions 25 and 35 may be insert-molded, or the resin connection The protrusions 25 and 35 may be tin-plated.

  The first end portions 21 and 31 of the resin-filled cases 4 and 5 configured as described above are fixed to the heat radiating members 2 and 3, and the second end portions 22 and 32 are fixed to the substrate 1. Yes. Hereinafter, specific fixing of the resin-filled cases 4 and 5 to the heat dissipating members 2 and 3 and the substrate 1 will be described.

The first end 21 of the first resin-filled case 4 is fixed to the first heat radiating member 2. In the present embodiment, the shaft portion of the screw 41 is inserted into the through hole 24 of the first resin-filled case 4 and then screwed into the screw hole 16 formed in the upper surface 2 a of the first heat radiating member 2. Accordingly, the bottom wall plate portion 23 of the first resin filling case 4 is sandwiched between the head of the screw 41 and the upper surface 2 a of the first heat radiating member 2, and the first resin filling case 4 is fixed to the first heat radiating member 2. Is done.
In the present embodiment, the heat radiation sheet 43 or the heat radiation grease 44 is sandwiched between the first end portion 21 (bottom wall plate portion 23) of the first resin-filled case 4 and the upper surface 2a of the first heat radiation member 2. ing. The heat radiation sheet 43 and the heat radiation grease 44 are softer than the first resin filling case 4 and the first heat radiation member 2 and can be deformed. A gap formed between the heat radiating member 2 can be filled.

The second end portion 22 of the first resin filling case 4 is fixed to the lower surface 1 b of the substrate 1. As a result, the first resin-filled case 4 surrounds the first electronic component 9 mounted on the lower surface 1 b of the substrate 1.
In the present embodiment, the connection protrusion 25 of the first resin-filled case 4 is inserted through the through hole 17 penetrating in the thickness direction of the substrate 1 and then joined by the solder 15 on the upper surface 1 a of the substrate 1. When a gap is formed between the lower surface 1b of the substrate 1 and the second end 22 of the first resin-filled case 4 in a state where the connection protrusions 25 are joined, the gap is made of resin or the like. Filled with adhesive 18.

  As described above, the internal space of the first resin-filled case 4 fixed to the first heat radiating member 2 and the substrate 1 communicates with the outside through the resin injection holes 19 formed in the substrate 1 as shown in FIG. doing. The resin injection hole 19 is formed so as to penetrate in the thickness direction of the substrate 1 at a position adjacent to the first electronic component 9.

On the other hand, as shown in FIG. 1, the first end portion 31 of the second resin-filled case 5 is fixed to the second heat radiating member 3. In this embodiment, the shaft portion of the screw 42 is inserted into the screw insertion hole (resin injection hole) 20 that penetrates the second heat radiating member 3 in the thickness direction, and then the through hole 34 of the second resin filling case 5. It is screwed on. Thereby, the second heat radiating member 3 is sandwiched between the head of the screw 42 and the bottom wall plate portion 33 of the second resin filled case 5, and the second resin filled case 5 is fixed to the second heat radiating member 3. .
In the present embodiment, similarly to the case of the first resin filled case 4, the heat radiating sheet is provided between the first end portion 31 (bottom wall plate portion 33) of the second resin filled case 5 and the second heat radiating member 3. 43 or the heat radiation grease 44 is sandwiched, so that a gap generated between the first end portion 31 of the second resin-filled case 5 and the second heat radiation member 3 can be filled.

The second end portion 32 of the second resin-filled case 5 is fixed to the upper surface 1 a of the substrate 1. Thereby, the second resin-filled case 5 surrounds the second electronic component 10 mounted on the upper surface 1 a of the substrate 1.
In the present embodiment, the connection protrusion 35 of the second resin-filled case 5 is inserted through the through hole 17 penetrating in the thickness direction of the substrate 1 and then joined by the solder 15 on the lower surface 1 b of the substrate 1. When a gap is generated between the upper surface 1 a of the substrate 1 and the second end portion 32 of the second resin-filled case 5 in a state where the connection protrusion 35 is joined, the gap is formed by the adhesive 18. Buried.

  When the resin-filled cases 4 and 5 have conductivity, the ground wiring (not shown) of the substrate 1 is fixed to the substrate 1 and the resin-filled cases 4 and 5 as described above. ) Is preferably electrically connected to the heat dissipating members 2 and 3 through the resin-filled cases 4 and 5, respectively. In the present embodiment, the ground wiring of the substrate 1 and the resin-filled cases 4 and 5 can be electrically connected by the solder 15. Further, the resin-filled cases 4 and 5 and the heat radiating members 2 and 3 can be electrically connected by screws 41 and 42.

  The heat-dissipating resin 6 filled in each of the resin-filled cases 4 and 5 is preferably a resin material having high thermal conductivity, for example, a silicone resin. The heat-dissipating resin 6 is filled without gaps at the first end portions 21 and 31 of the resin-filled cases 4 and 5 located on the heat-dissipating members 2 and 3 side, At 32, the electronic components 9 and 10 are in contact with each other. In the present embodiment, the heat radiation resin 6 is filled in the resin filling cases 4 and 5 without any gaps. Thereby, the heat dissipation resin 6 comes into contact with the upper surface 1 a and the lower surface 1 b of the substrate 1, and the electronic components 9 and 10 are embedded in the heat dissipation resin 6.

As shown in FIGS. 1, 4, and 6, each of the heat insulating members 7 and 8 is formed in a cylindrical shape like the resin-filled cases 4 and 5, and is arranged so as to extend from the substrate 1 to the heat radiating members 2 and 3. ing. The heat insulating members 7 and 8 of the present embodiment may be formed in a cylindrical shape having a rectangular shape in plan view as in the illustrated example, but may be formed in an arbitrary cylindrical shape such as a cylindrical shape.
Moreover, each heat insulation member 7 and 8 is provided so that the outer side of the resin filling cases 4 and 5 may be enclosed. In this embodiment, each heat insulation member 7 and 8 is distribute | arranged with respect to the outer peripheral surface of the resin filling cases 4 and 5. Heat insulating layers 71 and 81 are formed in the gaps between the resin-filled cases 4 and 5 and the heat insulating members 7 and 8. The heat insulating layers 71 and 81 of the present embodiment are air layers made of air with low thermal conductivity.

Connection protrusions 51 and 61 projecting in the axial direction of the heat insulating members 7 and 8 are formed at one end of the heat insulating members 7 and 8 in the axial direction. The connection protrusions 51 and 61 are portions inserted through the substrate 1 and the second heat dissipation member 3 when the heat insulating members 7 and 8 are attached to the substrate 1 and the second heat dissipation member 3. A plurality of connection protrusions 51 and 61 are arranged at intervals in the circumferential direction of the heat insulating members 7 and 8.
At the other end in the axial direction of each heat insulating member 7, 8, heat insulating protrusions 52, 62 protruding in the axial direction of the heat insulating members 7, 8 are formed. The heat insulating protrusions 52 and 62 protrude from a part of the circumferential direction among the other axial ends of the heat insulating members 7 and 8. Although the heat insulation protrusion parts 52 and 62 of this embodiment may be formed in the flat plate shape which protrudes from the whole one edge | side of the heat insulation members 7 and 8 formed in the cylindrical shape of planar view like FIG. This is not a limitation. For example, when the heat insulating protrusions 52 and 62 protrude from the corners of the heat insulating members 7 and 8 formed in a rectangular shape in plan view, the heat insulating protrusions 52 and 62 may be formed in a shape obtained by bending a flat plate. . For example, when the heat insulating members 7 and 8 are formed in a cylindrical shape, the heat insulating protrusions 52 and 62 may be formed in a curved plate shape.
Each of the heat insulating members 7 and 8 may be made of metal or resin, for example, but is preferably made of a material having low thermal conductivity. Examples of the material having low thermal conductivity include resin materials such as polybutylene terephthalate.
The heat insulating members 7 and 8 can be manufactured in the same manner as the resin-filled cases 4 and 5 described above.

As shown in FIG. 1, the first heat insulating member 7 is disposed so as to extend from the lower surface 1 b of the substrate 1 to the first heat radiating member 2 so as to surround the outer side of the first resin-filled case 4.
One end of the first heat insulating member 7 in the axial direction is disposed on the lower surface 1 b side of the substrate 1. In the present embodiment, as in the case of the first resin-filled case 4, the connection protrusion 51 of the first heat insulating member 7 is inserted through the through hole 53 penetrating in the thickness direction of the substrate 1 and then the substrate 1. The upper surface 1a is joined by an adhesive 59 made of solder, resin, or the like. In addition, when a gap is generated between the lower surface 1b of the substrate 1 and the first heat insulating member 7 in a state where the connection protrusion 51 is bonded, the gap may be filled with an adhesive or the like, for example.

The other end of the first heat insulating member 7 in the axial direction is disposed on the upper surface 2 a side of the first heat radiating member 2.
A heat insulating protrusion 52 formed at the other end of the first heat insulating member 7 is inserted into a blocking hole 54 formed in the first heat radiating member 2. As shown in FIGS. 1 and 5, the blocking hole 54 has a first heat dissipation between the installation area of the first heat generating component 11 and the arrangement area of the first resin-filled case 4 on the upper surface 2 a of the first heat dissipation member 2. The member 2 is formed to be recessed from the upper surface 2a. In the present embodiment, the blocking hole 54 penetrates in the thickness direction of the first heat radiating member 2.

The plan view shape of the blocking hole 54 viewed from the upper surface 2 a of the first heat radiating member 2 corresponds to the shape and size of the heat insulating protrusion 52. The blocking hole 54 of the present embodiment extends linearly in plan view so as to correspond to the shape and size of the heat insulating protrusion 52 formed in a flat plate shape.
Further, the blocking hole 54 is an area between the installation area of the first heat generating component 11 and the arrangement area of the first resin-filled case 4 on the upper surface 2a of the first heat radiating member 2. It is formed so as to cross in a direction that intersects the direction (a direction that is orthogonal in the illustrated example). That is, the blocking hole 54 divides the installation area and the arrangement area described above.
In the illustrated example, a gap is formed between the heat insulating protrusion 52 inserted into the blocking hole 54 and the inner surface of the blocking hole 54 facing the arrangement direction of the installation region and the arrangement region described above. This is not a limitation. However, it is more preferable that there is a gap between the inner side surface of the blocking hole 54 located on the arrangement region side and the heat insulating protrusion 52.

The other end of the first heat insulating member 7 excluding the portion where the heat insulating protrusion 52 is formed is disposed on the upper surface 2 a side of the first heat radiating member 2. In the present embodiment, the other end of the first heat insulating member 7 excluding the portion where the heat insulating protrusion 52 is formed is inserted into a bottomed positioning groove 55 formed in the first heat radiating member 2. The positioning groove 55 is formed to be recessed from the upper surface 2 a of the first heat radiating member 2. Both ends in the longitudinal direction of the positioning groove 55 are connected to both ends in the longitudinal direction of the blocking hole 54 described above. The planar view shape of the positioning groove 55 corresponds to the planar view shape of the first heat insulating member 7. In the illustrated example, the planar view shape including the blocking hole 54 and the positioning groove 55 is formed in a rectangular shape so as to correspond to the first heat insulating member 7 formed in a rectangular shape in the planar view.
Although the positioning groove 55 in the illustrated example is formed wider than the other end of the first heat insulating member 7, it is not limited to this. Further, the other end of the first heat insulating member 7 and the heat insulating protrusion 52 may be fixed to the first heat radiating member 2 with an adhesive while being inserted into the positioning groove 55 and the blocking hole 54, respectively. It does not have to be done. Further, the positioning groove 55 may not be formed, for example. In this case, the other end of the first heat insulating member 7 excluding the portion where the heat insulating protrusion 52 is formed is disposed on the upper surface 2 a of the first heat radiating member 2.

As shown in FIG. 1, the second heat insulating member 8 is disposed so as to extend from the upper surface 1 a of the substrate 1 to the second heat radiating member 3 so as to surround the outside of the second resin-filled case 5.
One end of the second heat insulating member 8 in the axial direction is disposed on the second heat radiating member 3 side. In the present embodiment, the connection protrusion 61 of the second heat insulating member 8 is inserted through the insertion hole 63 that penetrates in the thickness direction of the second heat radiating member 3. In addition, although the connection protrusion 61 penetrated by the penetration hole 63 may be fixed to the 2nd heat radiating member 3 with an adhesive agent, it does not need to be fixed, for example.

The other end in the axial direction of the second heat insulating member 8 is disposed on the upper surface 1 a side of the substrate 1.
A heat insulating protrusion 62 formed at the other end of the second heat insulating member 8 is inserted into a blocking hole 64 formed in the substrate 1. As in the case of the first heat radiating member 2, the blocking hole 64 is located on the upper surface of the substrate 1 between the region where the second heat generating component 12 is disposed on the upper surface 1 a of the substrate 1 and the region where the second resin-filled case 5 is disposed. It is recessed from 1a. In the present embodiment, the blocking hole 64 penetrates in the thickness direction of the substrate 1. In the illustrated example, the heat insulating protrusion 62 of the second heat insulating member 8 is inserted through the blocking hole 64 and protrudes from the lower surface 1b of the substrate 1, but protrudes in the same manner as in the case of the heat insulating protrusion 52 of the first heat insulating member 7, for example. It does not have to be.

The plan view shape of the blocking hole 64 viewed from the upper surface 1 a of the substrate 1 is the same as that of the first heat radiating member 2 and corresponds to the shape and size of the heat insulating protrusion 62. Further, as in the case of the first heat radiating member 2, the blocking hole 64 of the substrate 1 is provided between the region where the second heat generating component 12 is disposed and the region where the second resin filled case 5 is disposed on the upper surface 1 a of the substrate 1. The region is formed so as to cross in a direction (for example, a direction orthogonal) intersecting the arrangement direction of the installation region and the placement region. That is, the blocking hole 64 partitions the installation area and the arrangement area.
In the illustrated example, there is no gap between the inner surface of the blocking hole 64 and the heat insulating protrusion 62 inserted into the blocking hole 64, but for example, the same as in the case of the first heat radiating member 2 and the first heat insulating member 7. There may be a gap.
Further, for example, a connection projection similar to that of the first heat insulation member 7 is formed on the other end of the second heat insulation member 8 excluding a portion where the heat insulation projection 62 is formed, and this connection projection is inserted into the through hole of the substrate 1. Also good. Further, the connection protrusion may be fixed to the substrate 1 with solder or the like.

In the heat management structure of the present embodiment configured as described above, for example, even if the first electronic component 9 or the second electronic component 10 generates heat due to energization, this heat is transferred from the heat radiation resin 6 to each resin-filled case 4, 5. It is possible to efficiently escape to each of the heat dissipating members 2 and 3 via. In this embodiment, heat can be radiated from the resin-filled cases 4 and 5 to the heat radiating members 2 and 3 through the screws 41 and 42, the heat radiating sheet 43, and the heat radiating grease 44.
Further, since the heat insulating members 7 and 8 are disposed outside the resin-filled cases 4 and 5, even if the heat generating components 11 and 12 (another heat source) are disposed in the vicinity of the electronic components 9 and 10, these are provided. It can suppress that the heat | fever of the heat-emitting components 11 and 12 reaches | attains each heat radiating member 2 and 3 via the resin filling cases 4 and 5 and the heat radiating resin 6. FIG. Therefore, it is possible to prevent the heat dissipation efficiency of the electronic components 9 and 10 described above from being lowered and to prevent the electronic components 9 and 10 from being heated by the heat generating components 11 and 12.

Furthermore, in the heat management structure of the present embodiment, the amount of the heat radiation resin 6 used is limited by the resin-filled cases 4 and 5 so that the weight of the electronic device can be reduced.
Further, in the thermal management structure of the present embodiment, the resin-filled cases 4, 5 sized according to the size of the electronic components 9, 10 mounted on the substrate 1 and the gap between the substrate 1 and each of the heat radiating members 2, 3 and It is only necessary to prepare the heat insulating members 7 and 8 and arrange the resin-filled cases 4 and 5 and the heat insulating members 7 and 8 in accordance with the positions of the electronic components 9 and 10, thereby providing a highly versatile heat management structure. It becomes possible.

Further, according to the heat management structure of the present embodiment, the heat insulating protrusions 52 and 62 of the heat insulating members 7 and 8 are inserted into the first heat radiating member 2 and the blocking holes 54 and 64 of the substrate 1. By the portions 52 and 62 and the blocking holes 54 and 64, heat insulation between the installation area of the heat generating components 11 and 12 and the arrangement area of the resin-filled cases 4 and 5 can be achieved. In particular, in this embodiment, since the blocking holes 54 and 64 penetrate the first heat radiating member 2 and the substrate 1 in the thickness direction, the installation area of the heat generating components 11 and 12 and the arrangement area of the resin-filled cases 4 and 5 are arranged. The thermal insulation between the two can be further improved.
As a result, heat transmitted from the heat generating components 11 and 12 to the first heat dissipating member 2 and the substrate 1 on which the heat generating components 11 and 12 are installed is prevented from being transmitted from the heat generating components 11 and 12 to the resin filled cases 4 and 5. it can. Therefore, even if the first heat generating component 11 is provided on the upper surface 2 a of the first heat radiating member 2, the heat of the first electronic component 9 is efficiently released to the arrangement region of the first resin-filled case 4 in the first heat radiating member 2. be able to. Further, even if the second heat generating component 12 is provided on the upper surface 1 a of the substrate 1, the second electronic component 10 provided on the upper surface 1 a of the substrate 1 is more reliably prevented from being heated by the second heat generating component 12. it can.

  Furthermore, according to the heat management structure of this embodiment, since the heat insulating layers 71 and 81 are formed between the resin-filled cases 4 and 5 and the heat insulating members 7 and 8, the heat insulating layers 71 and 81 are also heated. Since the air layer has a low conductivity, the resin-filled cases 4 and 5 and the heat insulating members 7 and 8 can be further insulated. For this reason, the heat of the heat generating components 11 and 12 provided in the vicinity of the electronic components 9 and 10 is less likely to reach the resin filled cases 4 and 5 and the heat radiating resin 6. Therefore, it is possible to more reliably prevent the heat dissipation efficiency of the electronic components 9 and 10 described above from being lowered and the heating of the electronic components 9 and 10 by the heat generating components 11 and 12.

  Furthermore, according to the heat management structure of the present embodiment, a gap generated between the first end portions 21 and 31 of the resin-filled cases 4 and 5 and the heat radiating members 2 and 3 is formed by the heat radiating sheet 43 and the heat radiating grease 44. Therefore, it is possible to efficiently radiate heat from the resin-filled cases 4 and 5 to the heat radiating members 2 and 3 as compared with the case where the heat radiating sheet 43 and the heat radiating grease 44 are not provided (when the gap is present).

Further, in the thermal management structure of the present embodiment, if the ground wiring of the substrate 1 is electrically connected to the heat radiating members 2 and 3 via the resin-filled cases 4 and 5 having conductivity, the grounding of the substrate 1 is separately provided by a component. There is no need to electrically connect the wiring to the heat dissipating members 2 and 3, and the number of components of the electronic device can be reduced.
Further, since the resin-filled cases 4 and 5 are grounded, the potential of the circuit formed on the substrate 1 can be stabilized.

Further, in the thermal management structure of the present embodiment, since the resin injection hole 19 and the screw insertion hole 20 communicating with each of the resin filling cases 4 and 5 are formed in the substrate 1 and the second heat radiating member 3, After the cases 4 and 5 are attached to the substrate 1 and the second heat radiating member 3, the heat radiating resin 6 can be injected into the resin-filled cases 4 and 5.
For example, when the heat radiating resin 6 is injected into the first resin filling case 4, the first resin filling case 4 may be attached between the substrate 1 and the first heat radiating member 2 with the solder 15 or the screw 41. In this attachment, the gap may be filled with an adhesive 18 or the like so that no gap is generated between the second end portion 22 of the first resin-filled case 4 and the lower surface 1b of the substrate 1. Thereby, since the inside of the first resin filling case 4 communicates with the outside only through the resin injection hole 19, the heat radiation resin 6 can be injected into the first resin filling case 4 from the resin injection hole 19.

  For example, when injecting the heat-dissipating resin 6 into the second resin-filled case, the second resin-filled case 5 is attached to the substrate 1 with the solder 15, and the screw insertion hole 20 of the second heat-dissipating member 3 is the first. The second heat radiating member 3 may be disposed on the first end portion 31 of the second resin filling case 5 so as to overlap the through hole 34 of the two resin filling case 5. Further, the gap may be filled with an adhesive 18 or the like so that no gap is generated between the second end portion 32 of the second resin filling case 5 and the upper surface 1a of the substrate 1. In this state, since the inside of the second resin filling case 5 communicates with the outside only through the screw insertion holes 20, the heat radiation resin 6 can be injected into the second resin filling case 5 from the screw insertion holes 20. In addition, after filling the heat radiation resin 6 into the second resin filling case 5, the first end portion 31 of the second resin filling case 5 may be fixed to the second heat radiation member 3 with the screw 42. However, this fixing needs to be performed before the heat radiation resin 6 injected into the second resin filling case 5 is cured because the shaft portion of the screw 42 needs to be screwed into the through hole 34 of the second resin filling case 5. More preferably.

  Furthermore, the heat management structure of the present embodiment injects the heat radiation resin 6 into the first resin filling case 4 from the opening on the second end 22 side of the first resin filling case 4 disposed on the lower surface 1b of the substrate 1. In addition, the second resin filling case 5 arranged on the upper surface 1 a of the substrate 1 is poured into the second resin filling case 5 from the opening on the first end portion 31 side. For this reason, without changing the direction of the board | substrate 1, the thermal radiation resin 6 can be inject | poured in the two resin filling cases 4 and 5, respectively, and can be hardened simultaneously. That is, the process of filling the heat radiating resin 6 in the two resin filling cases 4 and 5 can be performed in a short time in a lump.

Furthermore, in the thermal management structure of the present embodiment, the resin-filled cases 4 and 5 and the heat insulating members 7 and 8 are configured to insert the connection protrusions 25, 35, 51 and the heat insulating protrusion 62 into the substrate 1. The positioning of the resin-filled cases 4 and 5 and the heat insulating members 7 and 8 with respect to the substrate 1 can be easily performed.
Moreover, in this embodiment, since the blocking hole 54 and the positioning groove | channel 55 which insert the edge part of the 1st heat radiating member 7 are formed in the 1st heat radiating member 2, the 1st heat radiating member 7 with respect to the 1st heat radiating member 2 is formed. Can be easily positioned.

Furthermore, in the thermal management structure of this embodiment, since the resin-filled cases 4 and 5 are formed in a bottomed cylindrical shape, compared with the case where the resin-filled cases 4 and 5 do not have the bottom wall plate portions 23 and 33. The first end portions 21 and 31 of the resin-filled cases 4 and 5 can be fixed to the heat radiating members 2 and 3 easily and reliably. In particular, in this embodiment, since the bottom wall plate portions 23 and 33 of the resin-filled cases 4 and 5 are screwed to the heat-dissipating members 2 and 3 using screws 41 and 42, the resin-filled cases 4 and 5 are easily radiated. It can be fixed to the members 2 and 3.
Further, in the thermal management structure of the present embodiment, since the resin-filled cases 4 and 5 are fixed to the heat radiating members 2 and 3 by screws 41 and 42, various shapes and It is possible to fix the resin-filled cases 4 and 5 having a size. Therefore, a more versatile thermal management structure can be provided.
Further, the bottom wall plate portions 23 and 33 of the resin filling cases 4 and 5 are fixed to the heat radiating members 2 and 3, so that heat is efficiently applied from the resin filling cases 4 and 5 to the heat radiating members 2 and 3. I can escape.

[Second Embodiment]
It will now be described a second embodiment of the present invention with reference to FIGS.
In this embodiment, as compared with the heat management structure of the first embodiment, only the heat insulating layer formed between the resin-filled cases 4 and 5 and the heat insulating members 7 and 8 and the structure associated therewith are different. Other configurations are the same as those in the first embodiment. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
As shown in FIG. 7, the thermal management structure of this embodiment, the heat insulating layer between the resin-filled casing 4 and 5 and the heat insulating member 7, 8, made of resin having low heat-conductive material than the heat radiating resin 6 The heat insulating resin layers 72 and 82 are formed. Specific examples of the resin material forming the heat insulating resin layers 72 and 82 include an epoxy resin.

Further, as shown in FIGS. 7 and 8 , the substrate 1 and the second heat radiating member 3 are penetrated in the thickness direction so that the gaps between the resin-filled cases 4 and 5 and the heat insulating members 7 and 8 communicate with the outside. Resin injection holes 57 and 67 are formed. The resin injection holes 57 and 67 are formed through the through holes 17 and 53 of the substrate 1 through which the connection protrusions 25 and 51 of the first resin filling case 4 and the first heat insulating member 7 are inserted, and the connection protrusions 61 of the second heat insulating member 8. The circumferential direction of the first resin-filled case 4 and the heat insulating members 7 and 8 with respect to the through holes 17 and 53 and the insertion holes 63 so as not to interfere with the insertion holes 63 (see FIG. 1) of the second heat radiating member 3 to be inserted. It is formed at a shifted position.
In the present embodiment, the resin injection holes 57 and 67 are formed at positions corresponding to intermediate portions of the sides of the first resin filling case 4 and the heat insulating members 7 and 8 formed in a rectangular shape in plan view. This prevents the resin injection holes 57 and 67 from interfering with the through holes 17 and 53 and the insertion holes 63 formed at positions corresponding to the corners of the first resin filling case 4 and the heat insulating members 7 and 8. Yes. In the present embodiment, a plurality of resin injection holes 57 and 67 are formed. The plurality of resin injection holes 57 and 67 are arranged at intervals in the circumferential direction of the first resin filling case 4 and the heat insulating members 7 and 8.

According to the thermal management structure of the present embodiment, the same effects as in the first embodiment can be obtained.
Further, according to the heat management structure of the present embodiment, the heat insulating resin layers 72 and 82 made of a resin material having a lower thermal conductivity than the heat radiating resin 6 in the gap between the resin filled cases 4 and 5 and the heat insulating members 7 and 8. Therefore, the heat of the heat generating components 11 and 12 provided in the vicinity of the electronic components 9 and 10 does not easily reach the resin filled cases 4 and 5 and the heat radiating resin 6. Further, it is possible to suppress the heat of the electronic components 9 and 10 from being transmitted to the heat insulating resin layers 72 and 82 via the heat radiation resin 6. Therefore, it is possible to reliably prevent the above-described reduction in heat dissipation efficiency of the electronic components 9 and 10 and heating of the electronic components 9 and 10 by the heat generating components 11 and 12.

Furthermore, according to the thermal management structure of the present embodiment, the resin injection holes 57 and 67 communicating with the gaps between the resin filling cases 4 and 5 and the heat insulating members 7 and 8 are formed in the substrate 1 and the second heat radiating member 3. Therefore, after the resin-filled cases 4 and 5 and the heat insulating members 7 and 8 are attached between the substrate 1 and the heat radiating members 2 and 3, the resin-filled cases 4 and 5 and the heat insulating members 7 and 8 are inserted into the gaps. The heat insulating resin layers 72 and 82 can be formed by injecting molten resin.
When the molten resin is injected into the gap between the resin filling cases 4 and 5 and the heat insulating members 7 and 8 to form the heat insulating resin layers 72 and 82, the gap between the resin filled cases 4 and 5 and the heat insulating members 7 and 8 is used. May be previously filled with an adhesive or the like between the end portions of the heat insulating members 7 and 8 and the substrate 1 or the heat radiating members 2 and 3 so as not to communicate with the outside in portions other than the resin injection holes 57 and 67. . For example, the gap between the inner surface of the positioning groove 55 and the other end of the first heat insulating member 7 accommodated in the positioning groove 55 may be filled with an adhesive. Further, for example, as shown in FIG. 7 , the inner surface of the blocking hole 54 located on the arrangement region side of the first resin-filled case 4 and the heat insulating protrusion 52 inserted into the blocking hole 54 are bonded without any gap by an adhesive. That's fine.

  In the second embodiment, even if the resin injection hole for the heat insulating resin layer is formed in the substrate 1 or the second heat radiating member 3, the heat insulation between the resin filling cases 4, 5 and the heat insulating members 7, 8 is performed. The layer may be an air layer similar to that of the first embodiment, for example.

Although the details of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.
For example, the heat-dissipating resin 6 is not limited to being filled in the first resin-filled case 4 without a gap as in the above-described embodiment, and may be at least filled with the electronic component 9 mounted on the substrate 1. Good. Therefore, for example, as shown in FIG. 9, the heat radiating resin 6 may be filled so that a gap is formed between the heat radiating resin 6 and the substrate 1. In this configuration, since the amount of the heat radiation resin 6 to be used can be further reduced, it is possible to further reduce the weight of the electronic device.
When the heat radiating resin 6 is filled in the first resin filling case 4 as described above, the gap between the substrate 1 and the second end 22 of the first resin filling case 4 when the heat radiating resin 6 is injected. Therefore, the heat radiation resin 6 does not leak out. Therefore, it is not necessary to fill this gap with the adhesive 18, and the electronic device can be easily manufactured.

Moreover, in the said embodiment, although the through-hole 34 itself formed in the bottom wall board part 33 of the 2nd resin filling case 5 is a screw hole, as shown, for example in FIG. 10, the cylinder shape which has a screw hole The member 45 may be fitted into the through hole 34 of the second resin filled case 5 by press fitting or the like.
Furthermore, in the said embodiment, although the heat insulation layer is formed between the outer peripheral surface of the resin filling cases 4 and 5, and the heat insulation members 7 and 8, for example, the heat insulation members 7 and 8 are the resin filling cases 4 and 5. The heat insulating layer may not be formed in contact with the outer peripheral surface.

Further, the blocking holes 54 and 64 are not limited to penetrating in the thickness direction of the first heat radiating member 2 and the substrate 1, and are formed to be recessed from at least the upper surface 2 a of the first heat radiating member 2 and the upper surface 1 a of the substrate 1. Just do it. In this case, the blocking hole 54 formed in the first heat radiating member 2 may be the same as the positioning groove 55, for example. Further, the blocking holes 54 and 64 and the positioning groove 55 may not be formed, for example.
Furthermore, for example, the connection protrusions 51 and 61 may not be formed on each of the heat insulating members 7 and 8. In this case, one end of the heat insulating members 7 and 8 in the axial direction may be bonded to the lower surface 1b of the substrate 1 or the facing surface of the second heat radiating member 3 facing the upper surface of the substrate 1 with an adhesive, for example.

Moreover, in the said embodiment, although the heat radiating members 2 and 3 and the 1st end parts 21 and 31 of the resin filling cases 4 and 5 are connected by both the screws 41 and 42 and the heat radiating sheet 43 or the heat radiating grease 44. For example, it may be connected only by the screws 41 and 42 or only by the heat radiating sheet 43 and the heat radiating grease 44. Moreover, the heat radiating members 2 and 3 and the first end portions 21 and 31 of the resin-filled cases 4 and 5 may be connected by, for example, adhesion.
When the heat radiating members 2 and 3 and the first end portions 21 and 31 of the resin-filled cases 4 and 5 are connected only by the heat radiating sheet 43 and the heat radiating grease 44, the substrate 1 and the second heat radiating member 3 are connected to the first heat radiating member. What is necessary is just to press the resin filling cases 4 and 5 against each heat radiating member 2 and 3 using the force fixed to the member 2. FIG.

Furthermore, when the first end portion 21 of the first resin filling case 4 is fixed to the first heat radiating member 2 by adhesion, the through hole 24 is not formed in the bottom wall plate portion 23 of the first resin filling case 4. Good.
Further, when the resin-filled cases 4 and 5 are fixed to the heat radiating members 2 and 3 by bonding, the flat plate portions 23 and 33 may not be formed on the first end portions 21 and 31 of the resin-filled cases 4 and 5. . However, if the resin-filled cases 4 and 5 have the flat plate portions 23 and 33, the bonding area between the resin-filled cases 4 and 5 and the heat radiating members 2 and 3 is enlarged by the flat plate portions 23 and 33. There is an advantage that the resin-filled cases 4 and 5 can be securely fixed to the heat radiating members 2 and 3.

Furthermore, the heat-dissipating resin 6 is not limited to contact with the electronic components 9 and 10 mounted on the substrate 1 as in the above-described embodiment, and at least a required cooling unit that needs to be cooled among circuits formed on the substrate 1. Just touch. Examples of such a cooling required part include, in addition to the electronic components 9 and 10, a part of the wiring pattern that generates heat when energized (for example, a part of the main circuit in which a large current flows in the wiring pattern).
Further, the resin-filled cases 4 and 5 and the heat insulating members 7 and 8 are not limited to being arranged on both main surfaces (the upper surface 1a and the lower surface 1b) of the substrate 1, but at least so as to surround at least the cooling required part of the electronic device. What is necessary is just to distribute | arrange to one main surface (upper surface 1a or lower surface 1b) of the board | substrate 1. FIG.
Furthermore, the heat generating components 11 and 12 arranged outside the heat insulating members 7 and 8 are not limited to one and may be, for example, a plurality. Further, the heat generating portion disposed outside the heat insulating members 7 and 8 is not limited to being configured by one or a plurality of heat generating components 11 and 12, for example, a wiring pattern formed on the substrate 1 and through which a large current flows. It may be a combination of the heat generating components 11 and 12 and the wiring pattern.

1 Substrate 1a Upper surface (main surface)
1b Bottom surface (main surface)
2 First heat dissipation member 2a Top surface (opposite surface)
3 2nd heat radiating member 4 1st resin filling case 5 2nd resin filling case 6 heat radiating resin 7 1st heat insulation member 8 2nd heat insulation member 9 1st electronic component (cooling required part)
10 Second electronic components (cooling required)
11 First heat generating part (heat generating part)
12 Second heat generating component (heat generating part)
21, 31 First end portion 22, 32 Second end portion 52, 62 Heat insulation protrusions 54, 64 Blocking hole 57, 67 Resin injection hole 71, 81 Heat insulation layer 72, 82 Heat insulation resin layer (heat insulation layer)

Claims (3)

A substrate on which an electronic component is mounted on at least one main surface to form a circuit, a heat radiating member disposed at a position spaced from the main surface of the substrate, and a cylinder extending from the main surface of the substrate to the heat radiating member A resin-filled case, a heat-dissipating resin filled in the resin-filled case, a cylindrical heat-insulating member provided to surround the outside of the resin-filled case and extending from the main surface of the substrate to the heat dissipating member, With
The resin-filled case is arranged so as to surround a cooling required portion that requires cooling in the circuit,
The heat-dissipating resin is filled without a gap at the first end of the resin-filled case located on the heat-dissipating member side, and at least contacts the cooling required part at the second end of the resin-filled case located on the substrate side And
A heating part that generates heat by energization is provided on at least one of the main surface of the substrate and the opposing surface of the heat dissipation member that faces the main surface,
Between the installation area of the heat generating part on the one surface and the arrangement area of the resin-filled case, a blocking hole is formed that is recessed from the one surface and divides the installation area and the arrangement area,
The heat insulating member has a heat insulating protrusion inserted into the blocking hole;
When viewed from the one surface side, the blocking hole and the heat insulating protrusion cross the region between the installation region and the arrangement region in a direction intersecting the arrangement direction of the installation region and the arrangement region. is formed so as to,
The heat insulating member is arranged with an interval with respect to the outer peripheral surface of the resin-filled case,
A heat insulating layer is formed in the gap between the resin filled case and the heat insulating member,
The heat management structure of an electronic device , wherein the heat insulating layer is a heat insulating resin layer made of a resin material having a lower thermal conductivity than the heat dissipation resin .   2. The thermal management structure for an electronic device according to claim 1, wherein the blocking hole penetrates in the thickness direction of the substrate or the heat dissipating member orthogonal to the one surface. The thermal management of the electronic device according to claim 1 , wherein a resin injection hole communicating with a gap between the resin-filled case and the heat insulating member is formed in the heat radiating member or the substrate. Construction.

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