JP6229601B2 - Electrode substrate film and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electrode substrate film used for a touch panel or the like, having a transparent substrate made of a resin film and a circuit pattern such as an electrode, and in particular, the circuit pattern such as the electrode is hardly visible even under high-intensity illumination. Furthermore, the present invention relates to an electrode substrate film in which a circuit pattern such as an electrode is difficult to be visually recognized even when an incident angle of incident light is increased, and a manufacturing method thereof.

  Conventionally, a “keyboard” has been used as an input device, and numerical values and characters have been input to a device by operating a “keyboard” key.

  However, in recent years, “touch panels” as human-machine interfaces have begun to spread in mobile phones such as smartphones, portable electronic document devices, vending machines, car navigation, convenience store registers, and the like.

  The “touch panel” is roughly classified into a resistance type and a capacitance type. A “resistive touch panel” is a transparent substrate made of a resin film, an X coordinate (or Y coordinate) detection electrode sheet and a Y coordinate (or X coordinate) detection electrode sheet provided on the substrate, and a space between these sheets The main part is comprised with the insulator spacer provided in this. The X-coordinate detection electrode sheet and the Y-coordinate detection electrode sheet are spatially separated from each other. However, when the X-coordinate detection electrode sheet is pressed with a pen or the like, the two coordinate detection electrode sheets are in electrical contact with each other and touched by the pen (X (Coordinates, Y-coordinates) are known, and when the pen is moved, the coordinates are recognized each time, and finally a character can be input. On the other hand, the “capacitance-type touch panel” has an X-coordinate (or Y-coordinate) detection electrode sheet and a Y-coordinate (or X-coordinate) detection electrode sheet laminated via an insulating sheet. It has a structure in which an insulator is disposed. When a finger is brought close to the insulator such as glass, the electric capacity of the X-coordinate detection electrode and the Y-coordinate detection electrode in the vicinity thereof changes so that the position can be detected.

  Conventionally, a transparent conductive film such as ITO (indium oxide-tin oxide) has been widely used as a conductive material constituting a circuit pattern such as an electrode (see Patent Document 1). In addition, with the recent increase in the size of touch panels, mesh-structured metal fine wires disclosed in Patent Document 2, Patent Document 3, and the like have begun to be used.

  By the way, when the transparent conductive film is compared with a metal fine wire, the transparent conductive film has an advantage that the circuit pattern such as an electrode is hardly visually recognized because of its excellent transparency in the visible wavelength region. Therefore, there is a disadvantage that is unsuitable for increasing the size of the touch panel and increasing the response speed. On the other hand, thin metal wires are suitable for increasing the size of touch panels and increasing the response speed because of their low electrical resistance, but they have high reflectivity in the visible wavelength region, so even if they are processed into a fine mesh structure. A circuit pattern may be visually recognized under high-intensity illumination, which has a drawback of reducing the product value.

  In order to reduce the reflectance in the visible wavelength region of the metal fine wire, an absorption multilayer film (for example, an oxide dielectric film layer and a metal absorption film) having an antireflection function between the transparent substrate and the metal fine wire. A method of providing an absorptive multilayer film composed of layers is under study. However, in the absorption multilayer film, the antireflection function is reduced when the incident angle of light incident on the absorption multilayer film is increased, so that it has not been sufficient as a method for avoiding the visibility problem.

JP 2003-151358 A (refer to claim 2) JP 2011-018194 A (refer to claim 1) JP 2013-0669261 A (see paragraph 0004) JP 2006-130841 A (refer to claim 1, paragraph 0004)

  The present invention has been made paying attention to such problems, and the problem is that circuit patterns such as electrodes are hardly visible even under high-intensity illumination, and the incident angle of incident light is increased. However, it is to provide an electrode substrate film in which a circuit pattern such as an electrode is hardly visually recognized and a manufacturing method thereof.

  In order to solve the above-mentioned problems, the present inventor has intensively investigated the prior art related to antireflection, and as a result, has found the method described in Patent Document 4.

  In other words, this method is a method in which an antireflection structure part composed of conical protrusions (see FIG. 1A) arranged in a matrix is provided on the surface of the optical component.

  And if it is an antireflection structure part for visible wavelength region, the cone-shaped projection groups are arranged in a matrix at a submicron pitch, and in the antireflection structure part having a pitch smaller than the wavelength of incident light, As shown in FIG. 1B, it can be considered as a substance whose refractive index continuously changes from the medium (air) to the substrate, and has a function of preventing reflection.

  Therefore, the present inventor applied the antireflection structure part of Patent Document 4 used for a lens element, a prism element, a mirror element, a lens barrel, etc. to an electrode substrate film not described in Patent Document 4. As a result, it was found that problems related to reflection from the circuit pattern such as electrodes can be avoided, and further, problems related to reflection can be avoided, so that the line width of the fine metal wires constituting the circuit pattern such as electrodes is made larger than the conventional width. It came to discover that it can be set. The present invention has been completed based on such technical examination and discovery.

That is, the first invention according to the present invention is:
In an electrode substrate film comprising a transparent substrate made of a resin film, and a circuit pattern having a mesh structure provided on at least one surface of the transparent substrate and made of a fine metal wire,
An antireflection structure part composed of a group of conical protrusions in which a plurality of conical protrusions are arranged in a matrix at a submicron pitch is provided on at least one surface of the transparent substrate, and a line is formed on the antireflection structure part. A circuit pattern composed of a thin metal wire having a width of 20 μm or less is provided , and between the antireflection structure and the thin metal wire constituting the circuit pattern, Cr alone, Ti, Al, V , W, Ta, Si, Ni, Cu Cr-based alloy added with one or more elements selected, or Ni alone, or selected from Ti, Al, V, W, Ta, Si, Cr, Cu A visible light absorbing film made of a Ni-based alloy to which one or more elements are added ,
The second invention is
In the electrode substrate film described in the first invention,
An anti-reflection composed of the above-mentioned cone-shaped projection group is manufactured by manufacturing an electroforming mold having the inverted shape of the above-mentioned cone-shaped projection group, and molding the resin film material for the transparent substrate by the nanoimprint method or casting method using this electromold. A structure portion is formed.

In addition, the third invention,
In the electrode substrate film described in the first invention or the second invention,
The metal fine wire is Cu alone, Cu-based alloy to which one or more elements selected from Ti, Al, V, W, Ta, Si, Cr, Ag are added, or Ag alone, or Ti It is composed of an Ag-based alloy to which one or more elements selected from Al, V, W, Ta, Si, Cr, and Cu are added,
The fourth invention is:
In the electrode substrate film described in the first invention or the third invention,
Cr-based alloy in which one or more elements selected from Cr, or Ti, Al, V, W, Ta, Si, Ni, Cu are added to the surface of the circuit pattern composed of the above-described thin metal wires, Alternatively, a visible light absorption film made of Ni alone or a Ni-based alloy to which one or more elements selected from Ti, Al, V, W, Ta, Si, Cr, and Cu are added is provided. As a feature,
The fifth invention is:
In the electrode substrate film described in any one of the first to fourth inventions,
Compared with the case where the antireflection film structure is not formed, the spectral reflectance in the visible wavelength region is 1 / in the range of the incident angle defined as the angle formed between the normal line and the incident light in the range of 0 ° to 40 °. It is characterized by being reduced to 2 or less.

Next, the sixth invention is:
In a method for producing an electrode substrate film comprising a transparent substrate made of a resin film, and a circuit pattern having a mesh structure provided on at least one surface of the transparent substrate and made of a fine metal wire,
Forming an antireflection structure part composed of a group of conical protrusions in which a plurality of conical protrusions are arranged in a matrix at a submicron pitch on at least one surface of the resin film, and on the antireflection structure part In addition, a circuit pattern composed of a thin metal wire having a line width of 20 μm or less is formed , and between the antireflection structure and the thin metal wire constituting the circuit pattern, Cr alone, or Ti, Al, V , W, Ta, Si, Ni, Cu Cr-based alloy added with one or more elements selected, or Ni alone, or selected from Ti, Al, V, W, Ta, Si, Cr, Cu Providing a visible light absorbing film made of a Ni-based alloy to which one or more elements are added ,
The seventh invention
In the method for producing an electrode substrate film described in the sixth invention,
An anti-reflection composed of the above-mentioned cone-shaped projection group is manufactured by manufacturing an electroforming mold having the inverted shape of the above-mentioned cone-shaped projection group, and molding the resin film material for the transparent substrate by the nanoimprint method or casting method using this electromold. A structure portion is formed.

Further, the eighth invention is
In the method for producing an electrode substrate film described in the sixth invention or the seventh invention,
The metal fine wire is Cu alone, Cu-based alloy to which one or more elements selected from Ti, Al, V, W, Ta, Si, Cr, Ag are added, or Ag alone, or Ti It is composed of an Ag-based alloy to which one or more elements selected from Al, V, W, Ta, Si, Cr, and Cu are added,
The ninth invention
In the method for producing an electrode substrate film described in the sixth invention or the eighth invention,
Cr-based alloy in which one or more elements selected from Cr, or Ti, Al, V, W, Ta, Si, Ni, Cu are added to the surface of the circuit pattern composed of the above-described thin metal wires, Or, it is characterized by providing a visible light absorbing film made of Ni alone or a Ni-based alloy to which one or more elements selected from Ti, Al, V, W, Ta, Si, Cr, Cu are added,
The tenth invention is
In the method for producing an electrode substrate film according to any one of the sixth to ninth inventions,
When the incident angle defined as the angle formed between the normal and the incident light is in the range of 0 ° to 40 °, the spectral reflectance in the visible wavelength region is 1 / It is characterized by being reduced to 2 or less.

  In the electrode substrate film according to the present invention, an antireflection structure part composed of a group of conical protrusions in which a plurality of conical protrusions are arranged in a matrix at a submicron pitch is provided on at least one side of the transparent substrate, and A circuit pattern composed of fine metal wires having a line width of 20 μm or less is provided on the antireflection structure.

  Further, since the antireflection structure part composed of a group of conical protrusions in which a plurality of conical protrusions are arranged in a matrix at a submicron pitch is provided on at least one surface of the transparent substrate made of a resin film, the antireflection structure It is possible to provide an electrode substrate film in which circuit patterns such as electrodes provided on the body part are difficult to be seen even under high-intensity illumination, and the anti-reflection structure part prevents reflection even when the incident angle of incident light increases. Since the effect does not become small, it is possible to provide an electrode substrate film having a small incident angle dependency of the spectral reflection characteristics, and further, since the circuit pattern such as an electrode is provided on the antireflection structure part, the line width is reduced as compared with the conventional case. Therefore, it is possible to provide an electrode substrate film having a low electric resistance value.

FIG. 1A is a schematic perspective view of a group of conical projections arranged in a matrix, and FIG. 1B is an antireflection structure comprising a group of conical projections provided on one side of a transparent substrate made of a resin film. The graph which shows the cross-sectional view of a body part, and the relationship between the cross-sectional structure of a reflection preventing structure part, and a refractive index. An electrode substrate film having an antireflection structure part composed of a conical projection group provided on one side of a transparent substrate made of a resin film and a circuit pattern provided on the antireflection structure part and composed of a thin metal wire Sectional drawing and the graph which shows the relationship between the cross-section of an electrode substrate film, and a refractive index. "Visible light absorbing film" "Metallic thin wire" provided with antireflection structure parts composed of conical projections on both sides of a transparent substrate made of resin film, and provided on each antireflection structure part in turn Sectional drawing of the electrode substrate film which has a circuit pattern comprised by "a visible light absorption film." The graph which shows the spectral reflection (regular reflection) characteristic in the incident angles 10 degrees, 20 degrees, 30 degrees, and 40 degrees of the transparent substrate (PET film) which concerns on the reference example 1 in which the reflection preventing structure part was formed in both surfaces of the transparent substrate. Figure. Electrode according to Reference Example 1 having a circuit pattern composed of a transparent substrate (PET film) having antireflection structure portions formed on both surfaces and metal (Cu) thin wires provided on each antireflection structure portion. The graph which shows the spectral reflection (regular reflection) characteristic in the incident angles of 10 degrees, 20 degrees, 30 degrees, and 40 degrees of a board | substrate film. The graph which shows the spectral reflection (regular reflection) characteristic in the incident angles 10 degrees, 20 degrees, 30 degrees, and 40 degrees of the transparent substrate (PET film) which concerns on the comparative example 1 in which the reflection preventing structure part is not formed. Incident angle of the electrode substrate film according to Comparative Example 1 having a circuit pattern composed of fine wires made of metal (Cu) provided on both surfaces of a transparent substrate (PET film) on which no antireflection structure is formed is 10 °. The graph which shows the spectral reflection (regular reflection) characteristic in 20 degrees, 30 degrees, and 40 degrees.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  Conventionally, in a “touch panel” installed on the surface of a flat panel display (FPD) such as a mobile phone, a portable electronic document device, and a car navigation, a circuit pattern such as an electrode constituted by a thin metal wire is a thinness that is difficult to see with the naked eye. However, since the metal thin wire has high reflectivity, it may be slightly recognized under high-intensity illumination as described above. This is caused by “Fresnel reflection” due to a difference in refractive index at the interface between the medium (air) and the metal fine wire, and at the interface between the transparent substrate made of a resin film and the metal fine wire.

  In order to reduce the reflection from the metal fine wire, as described above, it is possible to construct an antireflection film in combination with the oxide dielectric film layer, but the circuit pattern of the electrode made of the metal fine wire is as follows. Since it is processed by etching, the combination with the oxide dielectric film layer is not preferable. Further, in the antireflection film composed of the combination with the oxide dielectric film layer, as described above, it is incident on the antireflection film. When the incident angle of the light increases, the antireflection function is lowered.

  Therefore, as a result of intensive investigations on the prior art related to antireflection as described above, the present inventor has a patent in which an antireflection structure body composed of conical projections arranged in a matrix is provided on the surface of an optical component. Attention has been paid to the method described in Document 4, and application to an electrode substrate film not described in Patent Document 4 has been attempted, and the present invention has been completed.

  Unlike the antireflection film (optical thin film) that applies the interference effect by the combination with the oxide dielectric film layer, the antireflection structure part composed of the conical projection group is composed of only the constituent material (that is, It is possible to form an antireflection structure portion (only with a transparent substrate made of a resin film), and to reduce reflection by gradually changing the refractive index difference at the substance interface.

That is, the present invention
In an electrode substrate film comprising a transparent substrate made of a resin film, and a circuit pattern having a mesh structure provided on at least one surface of the transparent substrate and made of a fine metal wire,
An antireflection structure part composed of a group of conical protrusions in which a plurality of conical protrusions are arranged in a matrix at a submicron pitch is provided on at least one surface of the transparent substrate, and a line is formed on the antireflection structure part. A circuit pattern composed of a thin metal wire having a width of 20 μm or less is provided , and between the antireflection structure and the thin metal wire constituting the circuit pattern, Cr alone, Ti, Al, V , W, Ta, Si, Ni, Cu Cr-based alloy added with one or more elements selected, or Ni alone, or selected from Ti, Al, V, W, Ta, Si, Cr, Cu A visible light absorbing film made of a Ni-based alloy to which one or more elements are added is provided .

(1) Antireflection structure part constituted by conical protrusion groups The antireflection structure part according to the present invention constituted by conical protrusion groups is formed by the method described in Patent Document 4 as described above. be able to.

  That is, a step of performing nucleation with a catalytic function on the surface of the master material, a step of growing crystals on the formed nuclei to form needle crystals, and a master material on which needle crystals are formed are used. The antireflection structure part according to the present invention can be formed by a method including the steps of forming an electroforming mold and forming the conical protrusions on the molding material using the obtained electroforming mold. it can.

  As the above-mentioned process for forming a nucleus having a catalytic function, a process for forming an island crystal of Cr as a nucleus having a catalytic function on the surface of a single crystal silicon wafer substrate which is a master disk material, or a quartz which is a master disk material Examples include a step of forming island-like crystals of Pd as nuclei having a catalytic function on the surface of a glass substrate.

  In addition, as the above-mentioned step of growing a crystal on the formed nucleus to form a needle-like crystal, any one selected from chemical vapor deposition, vapor phase epitaxy, molecular beam epitaxy, and electroless plating can be used. Exemplified is a step of growing a crystal containing at least one selected from the group consisting of carbon, silicon, silicon nitride, silicon dioxide, boron nitride, and metal on the nucleus to form a needle crystal. Is done.

  Next, as the above-described step of forming the electroforming mold using the master material on which the needle crystal is formed, the surface of the single crystal silicon wafer substrate on which the silicon needle crystal is formed is activated with Pd, and no process is performed. After immersing in an electrolytic Ni—P plating solution to form a Ni—P plating layer on the surface of the needle-like crystal, electroplating is performed in a sulfamic acid Ni plating solution to obtain an electroforming mold. A step of obtaining an electroforming mold having an inverted shape of the needle-like crystal by releasing the crystalline silicon wafer substrate is exemplified.

  And as said process which forms a cone-shaped projection group in the raw material for shaping | molding (resin film material for transparent substrates) using the obtained electroforming mold, it is a transparent substrate by the injection molding method, the press molding method, and the thermal nanoimprint method. The process of forming the cone-shaped projection group on at least one surface of the resin film material for use is exemplified.

  In addition to the thermal nanoimprint method, it can also be formed by a UV nanoimprint method or a casting method, and roll embossing that is processed by a roll-to-roll process that can be considered as a part of the thermal nanoimprint method is also possible.

(2) Resin Film The material of the resin film material for transparent substrate used in the electrode substrate film according to the present invention is not particularly limited, and specific examples thereof include polyethylene terephthalate (PET), polyether sulfone (PES). ), Polyarylate (PAR), polycarbonate (PC), polyolefin (PO), triacetylcellulose (TAC), and a resin film selected from the resin materials of norbornene, or a resin film selected from the above resin materials And an acrylic organic film covering one side or both sides of the single body. In particular, as for norbornene resin materials, representative examples include ZEONOR (trade name) manufactured by ZEON Corporation, Arton (trade name) manufactured by JSR Corporation, and the like.

  However, when performing the thermal nanoimprint described above, it is necessary to determine the optimum mold pressure, mold temperature, and the like from various properties such as the viscosity of the resin film and the glass transition temperature.

  Since the electrode substrate film according to the present invention is used as a “touch panel”, among the resin film materials for transparent substrates, those having excellent transparency in the visible wavelength region are desirable.

(3) Metal fine wire As the metal fine wire constituting the circuit pattern such as an electrode, one or more elements selected from Cu alone or Ti, Al, V, W, Ta, Si, Cr, Ag are added. A thin wire made of a Cu-based alloy or an Ag-based alloy to which one or more elements selected from Ti, Al, V, W, Ta, Si, Cr, and Cu are added is preferable. In particular, Cu alone is desirable from the viewpoints of circuit pattern processability and resistance. Moreover, the line width of the thin metal wire provided on the antireflection structure is 20 μm or less, desirably 10 μm or less, and more desirably 5 μm or less. When the line width of the fine metal wire is reduced, visual recognition becomes difficult. In particular, when the line width is 10 μm or less, the visual recognition becomes difficult. The line width of the metal thin wire may be a line width that can be actually processed by etching or the like, and if it is 1 μm or more, processing by etching or the like is possible. In addition, the thickness of the metal fine wire may be appropriately set in consideration of the workability and conductivity (resistance value) of the metal fine wire, and the thickness is 2000 nm or less from the viewpoint of workability.

  In addition, it is desirable to provide the visible light absorption film (black layer) mentioned later in the surface by the side of a "touch panel" operator among the metal thin wires provided on an antireflection structure part.

  Next, in order to provide a thin metal wire constituting a circuit pattern such as an electrode on an antireflection structure formed on at least one side of a transparent substrate made of a resin film, a vacuum deposition method, an ion beam sputtering method, a magnetron sputtering method is used. A metal film may be formed on the surface of the antireflection structure portion by a film forming method such as an ion plating method or the like, and the formed metal film may be processed into a thin line by chemical etching. A visible light absorbing film (black layer) described later is also processed into a thin line by chemical etching. For chemical etching of the metal film, when the metal film is Cu, a ferric chloride aqueous solution or a cupric chloride aqueous solution may be used, and a permanganate aqueous solution may be used in combination.

(4) Visible light absorbing film (black layer)
The film that absorbs light in the visible wavelength range incident on the electrode substrate film is the visible light absorbing film (black layer) according to the present invention.

The visible light absorbing film (black layer) is made of a metal that forms an antireflection structure portion formed on at least one surface of a transparent substrate made of a resin film and a circuit pattern provided on the antireflection structure portion. required to be provided between the thin line, it is further preferably provided on the surface of the circuit pattern composed of metal thin wires provided on the anti-reflection structure portion on.

Further, in the case where the antireflection structure portions are formed on both surfaces of the transparent substrate and the thin metal wires constituting the circuit pattern are provided on each antireflection structure portion, each antireflection structure portion and the metal The visible light absorbing film (black layer) is required to be provided between the thin wires, and the visible light absorbing film (black color) is formed on the surface of the circuit pattern composed of metal thin wires provided on each antireflection structure. More preferably, a layer) is provided.

  In the case where an antireflection structure portion is formed on one surface of the transparent substrate and a metal fine wire constituting a circuit pattern is provided on the antireflection structure portion, the transparent portion in which the antireflection structure portion is not formed. It is preferable to provide a visible light absorption film (black layer) also on the other side of the substrate.

  Next, the material constituting the visible light absorbing film (black layer) is arbitrary as long as it is a material that absorbs light in the visible wavelength range, and Cr alone, Ti, Al, V, W, Ta, Si, Ni Cr-based alloy added with one or more elements selected from Cu, Ni simple substance, Ni-based added with one or more elements selected from Ti, Al, V, W, Ta, Si, Cr, Cu Examples include alloys.

  In addition, a visible light absorbing film (black layer) can be formed by using a film forming method such as vacuum deposition, ion beam sputtering, magnetron sputtering, or ion plating, for the visible light absorbing film (black layer). When a film is formed and provided on a metal fine wire constituting the circuit pattern, it may be processed into a fine wire by chemical etching as described above. In addition, when providing a visible light absorption film (black layer) on the antireflection structure part composed of the above-mentioned conical projections, an atomic layer deposition method (Atomic Layer) in which a single atomic layer is laminated by one of chemical vapor deposition methods. Deposition: ALD) is particularly excellent.

  In addition, the visible light absorption film (black layer) processed into a thin line shape depends on the additive and impurities of the film material, the residual gas at the time of film formation, the gas released from the resin film constituting the transparent substrate, the film formation speed, etc. The characteristics such as refractive index and absorption coefficient may differ greatly. For this reason, it is necessary to appropriately select these conditions and set the electrode substrate film to have desired characteristics.

  Next, in the case where the antireflection structure portion is formed on one surface of the transparent substrate and the fine metal wire constituting the circuit pattern is provided on the antireflection structure portion, the antireflection structure portion is not formed. When a visible light absorption film (black layer) is provided on the other side of the transparent substrate, plasma treatment or ion beam is applied to the resin film (transparent substrate) before the visible light absorption film (black layer) is provided. It is preferable to pre-adjust the resin film so that the transmittance of the resin film at a wavelength of 400 nm is attenuated by 1.0% or more as compared with that before the treatment. Such pre-adjustment may improve the flatness of the spectral transmission characteristics. Furthermore, adhesion between the visible light absorbing film (black layer) and the resin film (transparent substrate) may be achieved by plasma treatment or ion beam treatment. Therefore, when the electrode substrate film is exposed to a high temperature and high humidity environment, the visible light absorbing film (black layer) can be prevented from cracking.

(5) Electrode substrate film The electrode substrate film according to the present invention is a transparent substrate in which an antireflection structure part composed of a group of conical protrusions in which a plurality of conical protrusions are arranged in a matrix at a submicron pitch is made of a resin film. Are provided on at least one side of the antireflection structure portion and a circuit pattern made of a fine metal wire having a line width of 20 μm or less is formed on the antireflection structure portion and constitutes the circuit pattern with the antireflection structure portion. Between a thin metal wire, Cr alone, Cr-based alloy to which one or more elements selected from Ti, Al, V, W, Ta, Si, Ni, Cu are added, or Ni alone, or characterized Ti, Al, V, W, Ta, Si, Cr, that visible light absorbing film made of a Ni-based alloy in which one or more elements have been added that are selected from Cu are provided Than is.

  When the antireflection structure portion is constituted by the conical projection group shown in FIG. 1A in which a plurality of conical projections are arranged in a matrix at a submicron pitch, the refraction is refracted as shown in FIG. Since it can be considered as a substance whose rate changes continuously from the medium (air) to the transparent substrate, it has an antireflection function.

  For this reason, as shown in FIG. 2, a metal fine wire (a metal fine wire that reflects light in the visible wavelength region) is provided on the antireflection structure portion constituted by the conical protrusion group. If it is, it has an antireflection function.

  In addition, when providing the said metal fine wire on the single side | surface side of the transparent substrate which consists of a resin film, an antireflection structure part is not only the single side | surface side of the transparent substrate in which a metal fine wire is provided, but the transparent substrate in which a metal fine wire is not formed. It is desirable to have an antireflection structure on the other side, because it can reduce Fresnel reflection of the resin film (transparent substrate). If there is no antireflection structure on the other side of the transparent substrate on which the metal thin wire is not formed, the antireflection film made of the dielectric multilayer film may be formed. Furthermore, when the electrode substrate film according to the present invention is used in a medium other than air (for example, an adhesive), the dielectric multilayer film needs to be designed in a film structure in consideration of the refractive index of the medium. Further, as described above, a visible light absorption film (between the antireflection structure portion provided on the transparent substrate made of a resin film and the metal fine wire constituting the circuit pattern provided on the antireflection structure portion ( In the case where a black layer) is provided, in addition to the advantage that light in the visible wavelength range incident on the electrode substrate film is absorbed, the advantage that the adhesion of the metal fine wire to the resin film constituting the transparent substrate is enhanced Also have.

  An electrode substrate film provided with a circuit pattern composed of thin metal wires only on one side of a transparent substrate made of a resin film (provided that the antireflection structure composed of conical projections is on one side of the transparent substrate) Can be used for the “resistive touch panel” by applying two sets of electrode substrate films.

  Further, an electrode substrate film in which circuit patterns composed of fine metal wires are provided on both sides of a transparent substrate made of a resin film (however, the antireflection structure portion composed of conical projections is shown in FIG. Are provided on both sides of the transparent substrate), and can be used for the “capacitance type touch panel” by applying a set of electrode substrate films.

The electrode substrate film shown in FIG. 3 is a metal thin wires provided on both surfaces of the transparent substrate (circuit pattern) is interposed at structures visible light absorbing film (black layer), a metal thin wire The formation of the visible light absorbing film (black layer ) on the (circuit pattern) may be omitted.

  Examples of the present invention will be specifically described below with reference to comparative examples.

  The spectral reflectance is measured using a self-recording spectrophotometer manufactured by JASCO Corporation.

[ Reference Example 1 ]
The electrode substrate film according to Reference Example 1 includes a transparent substrate in which antireflection structure parts composed of conical projections are formed on both surfaces, and a metal provided on each antireflection structure part of the transparent substrate. It consists of a striped pattern made of fine wires.

  First, on both sides of a PET film (transparent substrate) having a thickness of 100 μm that is transparent in the visible wavelength range, a conical projection group having a height of 600 nm and a pitch of 200 nm is formed by a thermal nanoimprint method (also referred to as a direct nanoimprint method). An antireflection structure was formed. The mold pressure was 10 MPa and the mold temperature was 130 ° C.

The spectral reflectance (regular reflection) at the incident angles of 10 °, 20 °, 30 °, and 40 ° of the transparent substrate (PET film) surface according to Reference Example 1 in which the antireflection structure portions are formed on both surfaces is shown in FIG. Respectively.

Next, a Cu film having a thickness of about 500 nm was uniformly formed on each antireflection structure portion of the transparent substrate (PET film) by a sputtering method, and a photoresist was formed in a pattern on the Cu film. Thereafter, the Cu film exposed from the photoresist is chemically etched with an aqueous ferric chloride solution to form a stripe pattern (circuit pattern) composed of fine metal (Cu) wires having a line width of 5 μm and a space of 300 μm. The electrode substrate film according to Reference Example 1 was produced.

In addition, the spectral reflectance (regular reflection) in the incident angles of 10 °, 20 °, 30 °, and 40 ° of the obtained electrode substrate film according to Reference Example 1 is shown in FIG.

And, as understood from the spectral reflectance (see the graph of FIG. 4) of the transparent substrate (PET film) according to Reference Example 1 before the stripe pattern (circuit pattern) is formed, the incident angle is 10 °, The reflectance is as low as 0.5% or less under any of the incident angle conditions of an incident angle of 20 °, an incident angle of 30 °, and an incident angle of 40 °, and a reference after a stripe pattern (circuit pattern) is formed. As can be understood from the spectral reflectance of the electrode substrate film according to Example 1 (see the graph in FIG. 5), any of the incident angles of 10 °, 20 °, 30 °, and 40 °. Under the conditions, each reflectance was a low value of 1% to 4%, and it was confirmed that the dependency on the incident angle was extremely small.

For this reason, the electrode substrate film according to Reference Example 1 has an advantage that the stripe pattern (circuit pattern) is difficult to be visually recognized under high luminance illumination and even when the incident angle of incident light is increased.

[Example 2]
The electrode substrate film according to Example 2 includes a transparent substrate in which an antireflection structure composed of conical protrusions is formed on both surfaces, and a metal provided on each antireflection structure of the transparent substrate. A visible light absorption film (black layer) is provided between the antireflection structure portion of the transparent substrate and the metal thin wire.

First, on both surfaces of a PET film (transparent substrate) having a thickness of 100 μm that is transparent in the visible wavelength region, an antireflection structure part composed of conical protrusions having a height of 600 nm and a pitch of 200 nm was formed by thermal nanoimprinting. . Further, as in Reference Example 1 , the mold pressure was 10 MPa and the mold temperature was 130 ° C.

Next, a Ni-based alloy film having a thickness of about 30 nm and containing 7.5% by weight of Ti is uniformly formed on each antireflection structure portion of the transparent substrate (PET film) by sputtering, A Cu film having a thickness of about 470 nm is uniformly formed on the Ni-based alloy film by sputtering, and a photoresist similar to that of Reference Example 1 is formed on the Cu film in a pattern, and then the Ni-based alloy is formed. The film and the Cu film were simultaneously chemically etched to form a stripe pattern (circuit pattern and visible light absorption film pattern) composed of fine metal (Cu) wires having a line width of 5 μm and a space of 300 μm, Example 2 The electrode substrate film which concerns on this was manufactured.

Then, the incident angle 10 ° of the electrode substrate film according to Example 2 obtained, 20 °, where the spectral reflection (specular reflection) properties in 30 ° and 40 °, was measured using the self-recording spectrophotometer, reference There was no difference from Example 1 .

  For this reason, the electrode substrate film according to Example 2 also has an advantage that the stripe pattern (circuit pattern) is difficult to be visually recognized under high luminance illumination and even when the incident angle of incident light is increased.

[Comparative Example 1]
The electrode substrate film according to Comparative Example 1 includes a transparent substrate (PET film) in which the antireflection structure portion composed of the conical projection group is not formed on both surfaces, and a metal thin wire provided on both surfaces of the transparent substrate. And a stripe pattern consisting of

  The spectral reflectance (regular reflection) at the incident angles of 10 °, 20 °, 30 °, and 40 ° of the transparent substrate (PET film) surface according to Comparative Example 1 in which the antireflection structure is not formed on both surfaces is shown. 6 respectively.

First, a Cu film having a thickness of about 500 nm is uniformly formed on both surfaces of a transparent substrate (PET film) on which both surfaces of the antireflection structure are not formed, and Reference Example 1 is formed on the Cu film. After forming the same photoresist in a pattern, a chemical etching process was performed to form a stripe pattern (circuit pattern) composed of metal (Cu) thin wires having a line width of 5 μm and a space of 300 μm. Comparative Example 1 The electrode substrate film which concerns on this was manufactured.

  In addition, the spectral reflectance (regular reflection) in the incident angles 10 degrees, 20 degrees, 30 degrees, and 40 degrees of the obtained electrode substrate film according to Comparative Example 1 is shown in FIG.

And, as understood from the spectral reflectance (see the graph in FIG. 6) of the transparent substrate (PET film) according to Comparative Example 1 before the stripe pattern (circuit pattern) is formed, the incident angle is 10 °, Under the incident angle conditions of an incident angle of 20 °, an incident angle of 30 °, and an incident angle of 40 °, the reflectance is 6% to 7%, which is higher than that of Reference Example 1 , and a stripe pattern (circuit pattern) is formed . As will be understood from the spectral reflectance (see the graph of FIG. 7) of the electrode substrate film according to Comparative Example 1 later, any of an incident angle of 10 °, an incident angle of 20 °, an incident angle of 30 °, and an incident angle of 40 ° Even under the incident angle condition, each reflectance is as high as 40% to 50%, and it was confirmed that the dependency on the incident angle is extremely large.

  For this reason, the electrode substrate film according to Comparative Example 1 has a defect that the stripe pattern (circuit pattern) is easily visually recognized under high-luminance illumination and even when the incident angle of incident light is small.

[Comparative Example 2]
The electrode substrate film according to Comparative Example 2 includes a transparent substrate (PET film) in which the antireflection structure portion composed of the conical projection group is not formed on both surfaces, and a metal thin wire provided on both surfaces of the transparent substrate. And a visible light absorbing film (black layer) is provided between the transparent substrate and the thin metal wire.

First, a Ni-based alloy film having a thickness of about 30 nm and containing 7.5% by weight of Ti is uniformly formed on both surfaces of a transparent substrate (PET film) having no antireflection structure on both surfaces by sputtering. Further, a Cu film having a thickness of about 470 nm was uniformly formed on the Ni-based alloy film by sputtering, and a photoresist similar to that in Reference Example 1 was formed on the Cu film in a pattern. After that, the Ni-based alloy film and the Cu film are simultaneously chemically etched to form a stripe pattern (circuit pattern and visible light absorption film pattern) composed of fine metal (Cu) wires having a line width of 5 μm and a space of 300 μm. And the electrode substrate film which concerns on the comparative example 2 was manufactured.

  And when the spectral reflection (regular reflection) characteristic in the incident angles 10 degrees, 20 degrees, 30 degrees, and 40 degrees of the electrode substrate film which concerns on the obtained comparative example 2 was measured using the said self-recording spectrophotometer, it is a comparative example There was no difference from 1, and a reflectance as high as 40 to 50% due to the surface reflection of the visible light absorbing film (black layer) and the thin wire made of metal (Cu) was confirmed.

  For this reason, the electrode substrate film according to Comparative Example 2 also has a defect that the stripe pattern (circuit pattern) is easily visible under high-luminance illumination and even when the incident angle of incident light is small.

"Evaluation"
Compared with Comparative Examples 1 and 2, it is confirmed that the electrode substrate films according to Reference Examples 1 to 2 not only have a low reflectance, but also have an extremely small incident angle dependency.

For this reason, the electrode substrate films according to Reference Example 1 to Example 2 have the advantage that the stripe pattern (circuit pattern) is difficult to be seen under high luminance illumination and even when the incident angle of incident light is increased. doing.

  Since the electrode substrate film according to the present invention has not only low reflectance but also extremely small incident angle dependency, it has industrial potential to be used for a “touch panel” installed on the surface of an FPD (flat panel display). ing.

Claims (10)

In an electrode substrate film comprising a transparent substrate made of a resin film, and a circuit pattern having a mesh structure provided on at least one surface of the transparent substrate and made of a fine metal wire,
An antireflection structure part composed of a group of conical protrusions in which a plurality of conical protrusions are arranged in a matrix at a submicron pitch is provided on at least one surface of the transparent substrate, and a line is formed on the antireflection structure part. A circuit pattern composed of a thin metal wire having a width of 20 μm or less is provided , and between the antireflection structure and the thin metal wire constituting the circuit pattern, Cr alone, Ti, Al, V , W, Ta, Si, Ni, Cu Cr-based alloy added with one or more elements selected, or Ni alone, or selected from Ti, Al, V, W, Ta, Si, Cr, Cu An electrode substrate film comprising a visible light absorbing film made of a Ni-based alloy to which at least one element added is added .   An anti-reflection composed of the above-mentioned cone-shaped projection group is manufactured by manufacturing an electroforming mold having the inverted shape of the above-mentioned cone-shaped projection group, and molding the resin film material for the transparent substrate by the nanoimprint method or casting method using this electromold. The electrode substrate film according to claim 1, wherein a structure portion is formed.   The metal fine wire is Cu alone, Cu-based alloy to which one or more elements selected from Ti, Al, V, W, Ta, Si, Cr, Ag are added, or Ag alone, or Ti The electrode substrate film according to claim 1, wherein the electrode substrate film is made of an Ag-based alloy to which one or more elements selected from Al, V, W, Ta, Si, Cr, and Cu are added. . Cr-based alloy in which one or more elements selected from Cr, or Ti, Al, V, W, Ta, Si, Ni, Cu are added to the surface of the circuit pattern composed of the above-described thin metal wires, Alternatively, a visible light absorption film made of Ni alone or a Ni-based alloy to which one or more elements selected from Ti, Al, V, W, Ta, Si, Cr, and Cu are added is provided. electrode substrate film according to claim 1 or 3, characterized. Compared with the case where the antireflection film structure is not formed, the spectral reflectance in the visible wavelength region is 1 / in the range of the incident angle defined as the angle formed between the normal line and the incident light in the range of 0 ° to 40 °. electrode substrate film according to any one of claims 1 to 4, characterized in that it is reduced to 2 or less. In a method for producing an electrode substrate film comprising a transparent substrate made of a resin film, and a circuit pattern having a mesh structure provided on at least one surface of the transparent substrate and made of a fine metal wire,
Forming an antireflection structure part composed of a group of conical protrusions in which a plurality of conical protrusions are arranged in a matrix at a submicron pitch on at least one surface of the resin film, and on the antireflection structure part In addition, a circuit pattern composed of a thin metal wire having a line width of 20 μm or less is formed , and between the antireflection structure and the thin metal wire constituting the circuit pattern, Cr alone, or Ti, Al, V , W, Ta, Si, Ni, Cu Cr-based alloy added with one or more elements selected, or Ni alone, or selected from Ti, Al, V, W, Ta, Si, Cr, Cu A method for producing an electrode substrate film, comprising providing a visible light absorbing film made of a Ni-based alloy to which one or more elements are added . An anti-reflection composed of the above-mentioned cone-shaped projection group is manufactured by manufacturing an electroforming mold having the inverted shape of the above-mentioned cone-shaped projection group, and molding the resin film material for the transparent substrate by the nanoimprint method or casting method using this electromold. A structure part is formed, The manufacturing method of the electrode substrate film of Claim 6 characterized by the above-mentioned. The metal fine wire is Cu alone, Cu-based alloy to which one or more elements selected from Ti, Al, V, W, Ta, Si, Cr, Ag are added, or Ag alone, or Ti , the electrode substrate film according to claim 6 or 7, wherein Al, V, W, Ta, Si, Cr, that is composed of Ag-based alloy in which one or more elements have been added that are selected from Cu Manufacturing method. Cr-based alloy in which one or more elements selected from Cr, or Ti, Al, V, W, Ta, Si, Ni, Cu are added to the surface of the circuit pattern composed of the above-described thin metal wires, Alternatively, a visible light absorbing film made of Ni alone or a Ni-based alloy to which one or more elements selected from Ti, Al, V, W, Ta, Si, Cr, and Cu are added is provided. The manufacturing method of the electrode substrate film of Claim 6 or 8 . When the incident angle defined as the angle formed between the normal and the incident light is in the range of 0 ° to 40 °, the spectral reflectance in the visible wavelength region is 1 / method of producing an electrode substrate film according to any one of claims 6-9, characterized in that to reduce the 2 below.

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