JP6226810B2 - Method for regulating misalignment of board and connector - Google Patents

Description

  The present invention relates to a substrate on which a connector is mounted, and a positional deviation regulating method when the connector is mounted on the substrate.

In order to reduce the thickness direction of the product, the connector may be mounted with a part of the connector protruding from the edge of the board. At this time, if the weight balance of the connector is poor, the side of the portion that protrudes from the edge of the board sinks, and the connector is mounted in a tilted state with respect to the surface of the board.
Further, in order to enable automatic mounting of the connector, there is a soldering technique called a pin-in-paste method. In the pin-in-paste method, a solder paste is buried in a through hole of a substrate and a connector lead terminal is inserted. In consideration of automatic mounting by a machine, the inner diameter of the through hole of the substrate is formed larger than the inner diameter when mounting by human hands is assumed. For this reason, the lead terminal of the connector is likely to be mounted in a state where it moves in the through hole and is displaced from the desired position.

  In this way, when a connector is displaced from a desired position or mounted in a tilted state, it interferes with another connector mounted next to it, or the mating connectors of the adjacent mounted connectors interfere with each other. In the worst case, the connection with the mating connector becomes impossible. Further, when inspection is performed by bringing a pogo pin into contact after mounting, the pogo pin does not make good contact with the connector pin of the connector, and may be treated as a contact failure in the line inspection.

As a technique for positioning the connector when the connector is soldered to the substrate, for example, there is one disclosed in Patent Document 1.
According to Patent Document 1, soldering is performed in a state in which a positioning notch for fitting a fitting portion of a connector is provided in a discarded substrate portion, and positioning is performed by fitting the fitting portion of the connector to the positioning notch. .

JP-A-6-164117

  However, the technique disclosed in Patent Document 1 can be applied only to a connector in which a fitting portion is formed, and has low versatility.

  The present invention has been made in order to solve the above-described problems, and an object of the present invention is to provide a substrate and a method capable of restricting misalignment and inclination when a connector having no positioning shape is mounted.

A board according to the present invention is mounted with a connector including a connector portion coupled to a mating connector and a housing having a lead terminal, and a through hole into which the lead terminal is inserted and soldered, and a connector portion And a relief hole that extends inwardly from the side surface of the relief hole, contacts the connector when the connector swings in a direction that shifts in position, and contacts the connector when the connector swings in a tilting direction. And a misalignment prevention protrusion for restricting misalignment and inclination of the connector.

Further, the connector displacement control method according to the present invention is such that a connector having a connector portion coupled to a mating connector and a housing having a lead terminal is mounted on a substrate on which a discarded substrate is connected to form a through hole. When the lead terminal is inserted into the through hole, the connector part fits in the relief hole formed by the board and the discard board, and the misalignment of the escape hole extends from the side surface on the discard board side toward the connector part. The prevention protrusion contacts the connector when the connector swings in the direction of displacement, and contacts the connector when the connector swings in the direction of tilting to regulate the displacement and tilt of the connector. In addition, after the lead terminals of the connector whose inclination is regulated are soldered, the board is discarded from the board.

  According to the present invention, the misalignment prevention protrusion extending from the side surface of the escape hole of the board or from the side surface of the escape hole formed by the board and the discard board comes into contact with the connector portion. Therefore, even if there is no positioning shape on the connector side, the positional deviation and inclination of the connector can be restricted.

It is the perspective view and top view when a connector is mounted in the board | substrate which concerns on Embodiment 1 of this invention. It is a perspective view at the time of the connector being mounted in the board | substrate which concerns on Embodiment 2 of this invention. It is a flowchart which shows the process at the time of mounting a connector on the board | substrate which concerns on Embodiment 2 of this invention.

Embodiment 1 FIG.
FIG. 1 shows a perspective view and a plan view of a connector mounted on a substrate according to Embodiment 1 of the present invention. FIG. 1A is a perspective view, and FIG. 1B is a plan view when viewed from a surface opposite to the connector mounting surface of the substrate 1. In FIG. 1, the thickness direction of the substrate 1, that is, the vertical direction of the connector 2 is X, and the horizontal direction of the connector 2 is Y.
The connector 2 is formed by a bottomed substantially cylindrical connector portion 21 and a substantially rectangular parallelepiped housing 22. The connector portion 21 is coupled with a mating connector (not shown), and a connector pin 23 projects from the bottom portion. A lead terminal 24 protrudes from the housing 22. The connector pin 23 and the lead terminal 24 are electrically connected inside the connector 2.

  The connector portion 21 is formed such that the lower end in the thickness direction (X direction) of the substrate 1 is lower than the lower end of the housing 22. This is to reduce the overall thickness of the substrate 1 and the connector 2 after mounting. A through hole in which the lower end portion of the connector portion 21 is placed in the relief hole 11 formed in the edge of the substrate 1 and the lead terminal 24 is formed in the substrate 1 so that the lower end of the connector portion 21 and the surface of the substrate 1 do not interfere with each other. The connector 2 is mounted on the substrate 1 while being inserted into the hole 13.

The mounting shown in FIG. 1 is performed, for example, by a pin-in-paste method in which a solder paste is buried in the through hole 13 of the substrate 1 and the lead terminals 24 of the connector 2 are inserted and soldered.
Since the pin-in-paste method is automatic mounting by a machine, the through hole 13 of the board 1 includes a margin that allows the machine to efficiently insert the lead terminal 24 of the connector 2 into the through hole 13 of the board 1. Is formed larger than the diameter of the lead terminal 24. For this reason, in a state before the soldering is completed, the lead terminal 24 moves in the through hole 13 and the connector 2 may swing in the Y direction (left and right direction) in FIG. is there.
However, as shown in FIG. 1, the misalignment prevention protrusion 12 extends in the escape hole 11 of the substrate 1 inward from the side surface thereof, that is, toward the connector portion 21 of the connector 2.
When the connector 2 is about to swing greatly in the left-right direction, the misalignment prevention protrusion 12 comes into contact with the outer edge 21 a of the connector portion 21 to restrict further movement of the connector portion 21. That is, the positional deviation prevention protrusion 12 restricts the horizontal deflection of the connector portion 21 within a certain range, and the deviation of the entire connector 2 from a desired position is also restricted.

If the center of gravity of the connector 2 is close to the connector portion 21 side, the connector portion 21 may swing in the X direction (vertical direction) and further sink into the escape hole 11 before the soldering is completed. is there.
Also in such a case, when the misalignment prevention protrusion 12 comes into contact with the outer edge 21a of the connector portion 21, the vertical deflection of the connector portion 21 is restricted within a certain range, and the connector 2 as a whole is moved from a desired position. The tilt is also regulated.

  The certain range is a range in which the connector portion 21 can swing in the vertical and horizontal directions, and is determined by the shape, size, and the like of the misalignment prevention protrusion 12. Therefore, the shape and size of the misalignment prevention protrusion 12 are determined so that the certain range can accommodate the misalignment and inclination of the connector 2 within the allowable range at the time of mounting.

  Further, when the lead terminal 24 of the connector 2 is inserted into the through hole 13 of the substrate 1 by a human hand, the inner diameter of the through hole 13 is formed smaller than that when inserted by a machine. For this reason, the movement width of the lead terminal 24 in the through hole 13 is reduced, but the connector 2 is shaken by the movement width. And regulating the tilt is useful even in this case.

  As described above, according to the substrate according to the first embodiment, the position of the connector 2 is prevented by the misalignment prevention protrusion 12 extending inward from the side surface of the escape hole 11 in which the lower end portion of the connector portion 21 of the connector 2 is accommodated. Deviation and tilt are regulated. Therefore, even if the connector 2 does not have a positioning shape, the displacement and inclination of the connector 2 during mounting can be restricted.

Embodiment 2. FIG.
In the second embodiment, a case will be described in which a configuration corresponding to the misalignment prevention protrusion 12 that restricts the misalignment and inclination of the connector 2 shown in the first embodiment is provided on the discard substrate 3.
FIG. 2 is a perspective view of the connector 2 mounted on the board 1 on which the discarded board 3 is integrally formed. In addition, the same code | symbol is attached | subjected about the part which is the same as that of FIG. 1, or the description, and the description is abbreviate | omitted or simplified.

The discarded substrate 3 is connected to the substrate 1 via the connecting portion 4, and a space formed by the side surface of the facing substrate 1 and the side surface of the discarded substrate 3 is formed between the lower end of the connector portion 21 of the connector 2 and the substrate 1. It functions as a relief hole 11 in which the lower end of the connector portion 21 is accommodated while avoiding interference with the surface.
From the side surface of the escape hole 11 on the side of the discard substrate 3, a misalignment prevention protrusion 31 extends toward the connector portion 21.

When the connector 2 is mounted on the substrate 1, first, the lead terminal 24 of the connector 2 is inserted into the through hole 13 of the substrate 1, and the lower end portion of the connector portion 21 is stored in the escape hole 11.
At this time, the misalignment prevention protrusion 31 is the same as the misalignment prevention protrusion 12 shown in the first embodiment in the left-right direction of the connector portion 21 due to the lead terminal 24 moving in the through hole 13 (in FIG. The deflection in the Y direction) is regulated within a certain range, and the deviation of the entire connector 2 from the desired position is regulated.
Similarly to the misalignment prevention protrusion 12 shown in the first embodiment, the misalignment prevention protrusion 31 extends in the vertical direction (X direction in FIG. 2) in which the connector portion 21 further sinks into the escape hole 11. The deflection is restricted within a certain range, and the inclination of the entire connector 2 from a desired position is restricted.

  The connector 2 is mounted by, for example, the Pin-in-Paste method in a state where the positional deviation and the inclination of the connector 2 are regulated by the positional deviation prevention protrusion 31. After the completion, the connecting portion 4 is cut and discarded. The substrate 3 is removed from the substrate 1.

An example of processing when the connector 2 is mounted on the substrate 1 to which the discarded substrate 3 is connected by the Pin-in-Paste method will be described with reference to the flowchart shown in FIG.
First, the mounting apparatus inserts the lead terminal 24 of the connector 2 into the through hole 13 of the substrate 1 filled with the solder paste (step ST1). At this time, the lower end portion of the connector portion 21 is accommodated in the escape hole 11.
At that time, the positional deviation prevention protrusion 31 abuts on the outer edge 21a of the connector part 21, thereby suppressing the vertical and lateral vibrations of the connector part 21 within a certain range and restricting the positional deviation and inclination of the connector 2 ( Step ST2).

Subsequently, the soldering apparatus performs soldering of the lead terminals 24 inserted into the through holes 13 filled with the solder paste (step ST3).
Subsequently, the cutting machine cuts the connecting portion 4, separates the substrate 1 and the discarded substrate 3, and removes the discarded substrate 3 (step ST4).
The process of inserting the lead terminal 24 into the through hole 13 in step ST1 and the process of cutting the connecting portion 4 and removing the discard substrate 3 in step ST4 may be performed manually.

  As described above, according to the second embodiment, the misalignment prevention protrusion 31 that extends toward the connector portion 21 from the side surface of the escape hole 11 that accommodates the lower end portion of the connector portion 21 of the connector 2 toward the discard substrate 3 side. The positional deviation and inclination of the connector 2 are restricted. Therefore, even if the connector 2 does not have a positioning shape, the displacement and inclination of the connector 2 during mounting can be restricted.

In the present invention, within the scope of the invention, any combination of the embodiments, or any modification of any component in each embodiment, or omission of any component in each embodiment is possible. .
In addition, the configuration in which the positional deviation and inclination of the connector 2 are regulated by the positional deviation prevention protrusions 12 and 31 should be adopted regardless of the soldering method such as the soldering by the pin-in-paste method and the soldering by the flow method. Is possible.

  DESCRIPTION OF SYMBOLS 1 Board | substrate, 2 Connector, 3 Discarded board, 4 Connection part, 11 Relief hole, 12 Position shift prevention protrusion, 13 Through hole, 21 Connector part, 21a Outer edge, 22 Housing, 23 Connector pin, 24 Lead terminal, 31 Position shift prevention Protrusion.

Claims (2)

In a board on which a connector having a connector portion coupled to a mating connector and a housing having a lead terminal is mounted,
A through hole into which the lead terminal is inserted and soldered;
An escape hole for receiving the connector portion;
Extending inward from the side surface of the escape hole, when the connector is swung in the direction of displacement, abuts on the connector part, and when the connector is swung in a tilting direction, abuts on the connector part, A board having a misalignment prevention protrusion for regulating misalignment and inclination of the connector. A method for restricting the displacement of a connector when a connector having a connector portion coupled to a mating connector and a housing having a lead terminal is mounted on a substrate on which a discarded substrate is connected and a through hole is formed. ,
In a state where the lead terminal is inserted into the through hole, the connector portion is accommodated in an escape hole formed by the substrate and the discard substrate, and from the side surface of the escape hole on the discard substrate side toward the connector portion. The extended misalignment prevention protrusion abuts on the connector portion when the connector is swung in the direction of displacement, and abuts on the connector portion when the connector is swung in the tilt direction. And a method of restricting displacement of a connector, wherein after the lead terminal of the connector with restricted displacement and inclination is soldered, the discarded substrate is removed from the substrate.

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