JP6225088B2 - 研磨方法および研磨装置 - Google Patents

研磨方法および研磨装置 Download PDF

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Publication number
JP6225088B2
JP6225088B2 JP2014186404A JP2014186404A JP6225088B2 JP 6225088 B2 JP6225088 B2 JP 6225088B2 JP 2014186404 A JP2014186404 A JP 2014186404A JP 2014186404 A JP2014186404 A JP 2014186404A JP 6225088 B2 JP6225088 B2 JP 6225088B2
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JP
Japan
Prior art keywords
fluid
pressure
valve
polishing
storage element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2014186404A
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English (en)
Japanese (ja)
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JP2016055412A5 (enExample
JP2016055412A (ja
Inventor
篠崎　弘行
弘行 篠崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2014186404A priority Critical patent/JP6225088B2/ja
Priority to US14/847,745 priority patent/US9707661B2/en
Publication of JP2016055412A publication Critical patent/JP2016055412A/ja
Publication of JP2016055412A5 publication Critical patent/JP2016055412A5/ja
Application granted granted Critical
Publication of JP6225088B2 publication Critical patent/JP6225088B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2014186404A 2014-09-12 2014-09-12 研磨方法および研磨装置 Active JP6225088B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014186404A JP6225088B2 (ja) 2014-09-12 2014-09-12 研磨方法および研磨装置
US14/847,745 US9707661B2 (en) 2014-09-12 2015-09-08 Polishing method and polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014186404A JP6225088B2 (ja) 2014-09-12 2014-09-12 研磨方法および研磨装置

Publications (3)

Publication Number Publication Date
JP2016055412A JP2016055412A (ja) 2016-04-21
JP2016055412A5 JP2016055412A5 (enExample) 2017-08-17
JP6225088B2 true JP6225088B2 (ja) 2017-11-01

Family

ID=55756955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014186404A Active JP6225088B2 (ja) 2014-09-12 2014-09-12 研磨方法および研磨装置

Country Status (2)

Country Link
US (1) US9707661B2 (enExample)
JP (1) JP6225088B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6427131B2 (ja) * 2016-03-18 2018-11-21 株式会社荏原製作所 研磨装置および研磨方法
US20190110560A1 (en) * 2017-10-12 2019-04-18 Pvh Corp. Easy releasing zipper
JP7319097B2 (ja) * 2019-06-13 2023-08-01 株式会社荏原製作所 基板研磨装置、基板リリース方法および定量気体供給装置
KR102712571B1 (ko) 2018-08-06 2024-10-04 가부시키가이샤 에바라 세이사꾸쇼 기판 보유 지지 장치 및 기판 연마 장치
KR102672852B1 (ko) * 2018-11-22 2024-06-10 주식회사 케이씨텍 기판 캐리어 및 이를 포함하는 기판 연마 시스템
CN110142689B (zh) * 2019-04-17 2021-09-14 杭州众硅电子科技有限公司 一种晶圆装载支架、晶圆装载系统及晶圆装片方法
WO2021111593A1 (ja) * 2019-12-05 2021-06-10 株式会社島津製作所 試料導入装置
KR20230165699A (ko) * 2022-05-27 2023-12-05 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
KR102813005B1 (ko) * 2023-10-16 2025-05-26 조엔 리 머시너리 씨오 엘티디 웨이퍼 연삭 장치의 탈진공용 유체 제어 장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100427425B1 (ko) * 1995-04-20 2005-08-01 가부시키 가이샤 에바라 세이사꾸쇼 박막증착장치
KR100304706B1 (ko) * 1999-06-16 2001-11-01 윤종용 화학기계적 연마장치 및 연마 헤드 내부의 오염 물질 세척방법
JP2005123485A (ja) 2003-10-17 2005-05-12 Ebara Corp 研磨装置
JP5390807B2 (ja) 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
JP5597033B2 (ja) * 2010-06-07 2014-10-01 株式会社荏原製作所 研磨装置および方法
US9105516B2 (en) * 2012-07-03 2015-08-11 Ebara Corporation Polishing apparatus and polishing method
US9662761B2 (en) * 2013-12-02 2017-05-30 Ebara Corporation Polishing apparatus
JP6092086B2 (ja) * 2013-12-02 2017-03-08 株式会社荏原製作所 研磨装置
JP6232295B2 (ja) * 2014-01-10 2017-11-15 株式会社荏原製作所 研磨装置
US9539699B2 (en) * 2014-08-28 2017-01-10 Ebara Corporation Polishing method

Also Published As

Publication number Publication date
JP2016055412A (ja) 2016-04-21
US20160114456A1 (en) 2016-04-28
US9707661B2 (en) 2017-07-18

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