JP6207928B2 - Method for manufacturing light emitting device - Google Patents

Description

  The present invention relates to a light emitting device and a method for manufacturing the light emitting device.

  As one of the light sources of the light emitting device, an organic EL (Electroluminescence) element is used. The organic EL element has a structure in which a first electrode, an organic layer, and a second electrode are stacked in this order on a substrate. And in order to isolate | separate a 2nd electrode between adjacent organic EL elements, a partition may be provided between these organic EL elements.

  On the other hand, when a substrate of a light emitting element such as an organic EL element is made flexible, the light emitting device can be made flexible. For example, Patent Document 1 describes that a plurality of terminals connected to a light emitting element are formed side by side in a direction in which a dimensional change rate is small in a substrate.

JP 2008-249969 A

  In the case of forming a light-emitting device using a flexible substrate, the substrate of the light-emitting device is processed in a state of being placed on a support member, and then removed from the support member. At that time, the substrate is bent. In particular, the radius of curvature of the portion of the substrate that is finally peeled off from the support member tends to be small. For this reason, the organic EL element is easily damaged at that portion.

  As a problem to be solved by the present invention, when an organic EL element is formed on a flexible substrate using a support member, the organic EL element is prevented from being damaged when the substrate is removed from the support member. This is an example.

The invention according to claim 1 is a substrate curved in the first direction;
An organic EL element formed on the first surface side of the substrate;
A terminal that is formed on the first surface side of the substrate, is located at an end of the substrate on the first direction side, and is electrically connected to the organic EL element;
It is a light-emitting device provided with.

The invention according to claim 6 is a step of preparing a support member and a flexible substrate held on the support member;
Forming, on the first surface side of the substrate, an organic EL element and a terminal located at an end of the substrate on the first direction side and electrically connected to the organic EL element; ,
Connecting external wiring to the terminal via a connecting member;
A method for manufacturing a light emitting device comprising:

It is a top view which shows the structure of the light-emitting device which concerns on embodiment. It is AA sectional drawing of FIG. It is a figure which shows the modification of FIG. It is a figure for demonstrating the manufacturing method of a light-emitting device. 1 is a plan view of a light emitting device according to Example 1. FIG. It is BB sectional drawing of FIG. It is CC sectional drawing of FIG. It is DD sectional drawing of FIG. 6 is a cross-sectional view illustrating a configuration of a light emitting device according to Example 2. FIG. 6 is a plan view showing a configuration of a light emitting device according to Example 3. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

  FIG. 1 is a plan view showing a configuration of a light emitting device 10 according to the embodiment. FIG. 2 is a cross-sectional view taken along the line AA of FIG. The light emitting device 10 according to the embodiment includes a substrate 100, a plurality of partition walls 170, an organic EL element 101, and a terminal 220. As shown in FIG. 2, the substrate 100 has flexibility and is bent in a first direction (X direction in FIG. 1). The plurality of partition walls 170 are formed on the first surface side of the substrate 100, and all extend in a direction intersecting at an angle of 45 ° or more with respect to the first direction. In the example shown in this drawing, the plurality of partition walls 170 extend in a direction orthogonal to the first direction (Y direction in FIG. 1). The organic EL element 101 is formed on the first surface side of the substrate 100 and is provided between the plurality of partition walls 170. The terminal 220 is formed on the first surface side of the substrate 100 and is located at the end 104 on the first direction side of the substrate 100. The terminal 220 is electrically connected to the organic EL element 101.

  The external wiring 300 is connected to the terminal 220 through the connection member 30. The connection member 30 is, for example, an anisotropic conductive resin, and the external wiring 300 is, for example, a flexible substrate (FPC: Flexible Printed Circuits). Details will be described below.

The substrate 100 is, for example, a thin glass substrate, but may be a resin substrate. The partition 170 may be formed of, for example, a photosensitive insulating material such as a resist material or polyimide, or may be formed of an insulating material such as SiO ₂ .

  The substrate 100 is curved in the first direction. Therefore, as shown in FIG. 2, the partition wall 170 is higher than the partition wall 170 located on the center side of the substrate 100 with respect to the plane S including both ends of the substrate 100 in the first direction. It is inclined in the direction (Z direction in the figure). As a result, the partition 170 closest to the end of the substrate 100 in the first direction with respect to the plane S (for example, the partition 170 at both ends in the figure) is more than the partition 170 closest to the center of the substrate 100 in the first direction. Is also tilted.

  In the example shown in the figure, the substrate 100 is rectangular. The substrate 100 is curved in a direction along the first side, for example, the long side. The partition wall 170 extends in a direction orthogonal to the first side of the substrate 100, for example, a direction parallel to the short side. The terminal 220 is disposed in the vicinity of the side (second side) intersecting the first side of the substrate 100, for example, the short side.

  In the example illustrated in FIG. 2, the light emitting device 10 is curved in a direction in which the first surface side of the substrate 100 is convex. However, as illustrated in FIG. 3, the light emitting device 10 may be curved in a direction in which the first surface side of the substrate 100 is concave.

  FIG. 4 is a diagram for explaining a method for manufacturing the light emitting device 10. 4 (a) and 4 (b) are plan views, and FIG. 4 (c) is a cross-sectional view.

  First, as shown in FIG. 4A, an object in which the substrate 100 is placed on the support member 400 is prepared. The support member 400 is a glass substrate for support, for example. Next, the partition wall 170, the organic EL element 101, and the terminal 220 are formed on the substrate 100.

  Next, as shown in FIG. 4B, the external wiring 300 is connected to the terminal 220 using the connection member 30.

  Next, as shown in FIG. 4C, the substrate 100 is removed from the support member 400. At this time, the substrate 100 is peeled off from the end portion 102 opposite to the end portion 104 where the terminals 220 are provided. At this time, the direction in which the substrate 100 bends is a direction that is 45 ° or more with respect to the direction in which the partition wall 170 extends (the direction orthogonal to the example shown in the figure). Further, the part of the substrate 100 that is finally removed from the support member 400 is the end 104, that is, the part to which the connection member 30 and the external wiring 300 are attached. Therefore, the part of the substrate 100 that is finally removed from the support member 400 is reinforced by the connection member 30 and the external wiring 300.

  Thereafter, the substrate 100 is bent in a direction (for example, a direction orthogonal) with respect to the direction in which the partition wall 170 extends at 45 ° or more, and the state is maintained.

  According to the present embodiment, when the substrate 100 is removed from the support member 400, the direction in which the substrate 100 curves is a direction that is 45 ° or more with respect to the direction in which the partition wall 170 extends. Therefore, stress is hardly applied to the partition wall 170, and as a result, the partition wall 170 can be prevented from being damaged.

  Further, the part of the substrate 100 that is finally removed from the support member 400 is reinforced by the connection member 30 and the external wiring 300. For this reason, when the board | substrate 100 is removed from the supporting member 400, it can suppress that the curvature radius of the part removed from the supporting member 400 last among the board | substrates 100 becomes small. Therefore, it can further suppress that the partition 170 is damaged.

  Further, the partition wall 170 extends in a direction that intersects at an angle of 45 ° or more and 90 ° or less with respect to the direction in which the substrate 100 is curved. For this reason, the bending stress applied to the partition 170 between the partition 170 and the substrate 100 is reduced. In particular, when the extending direction of the partition wall 170 is orthogonal to the bending direction of the substrate 100, the bending stress applied to the partition wall 170 is particularly small. Therefore, even if the substrate 100 is maintained in a curved state, the partition wall 170 can be prevented from being damaged.

Example 1
FIG. 5 is a plan view of the light emitting device 10 according to the first embodiment. 6 is a cross-sectional view taken along line BB in FIG. 5, FIG. 7 is a cross-sectional view taken along line CC in FIG. 5, and FIG. 8 is a cross-sectional view taken along line DD in FIG. In FIG. 5, the lead-out wiring is shown large for easy understanding.

  The light emitting device 10 is, for example, a display. The light emitting device 10 includes a substrate 100, a first electrode 110, an insulating layer 120, a plurality of first openings 122, a plurality of second openings 124, a plurality of lead wires 130, an organic layer 140, a second electrode 150, and a plurality of lead wires. 160 and a plurality of partition walls 170. The organic EL element 101 has a configuration in which the organic layer 140 is sandwiched between the first electrode 110 and the second electrode 150. The substrate 100 is a glass substrate having a thickness of 0.03 mm to 0.3 mm, for example. For this reason, the light-emitting device 10 has flexibility.

  The first electrode 110 is formed on the first surface side of the substrate 100 and extends in a line shape in the first direction (X direction in FIG. 5). The first electrode 110 is a transparent electrode formed of an inorganic material such as ITO (Indium Thin Oxide) or IZO (indium zinc oxide) or a conductive polymer such as a polythiophene derivative. The first electrode 110 may be a metal thin film that is thin enough to transmit light. The end of the first electrode 110 is connected to the lead wiring 130.

  The lead wiring 130 is a wiring that connects the first electrode 110 and the outside including electric components such as a driving IC. The lead wire 130 is a metal wire made of a metal material or an alloy such as ITO, IZO, Al, Cr, or Ag, which is an oxidized conductive material, but is a wire formed of a conductive material other than metal. There may be. Further, the lead wiring 130 may have a laminated structure in which a plurality of layers are stacked. For example, the lead-out wiring 130 may have a configuration in which an alloy layer of Ni and Mo, an alloy layer of Mo and Nb, an Al layer, and an alloy layer of Ni and Mo are stacked in this order. The lead-out wiring 130 may have a configuration in which an alloy layer of Ni and Nb, an alloy layer of Al and Nd, and an alloy layer of Mo and Nb are stacked in this order.

  In the example shown in FIG. 5, the lead wiring 130 is formed on the lead wiring 132. The lead-out wiring 132 is made of the same material as that of the first electrode 110 and is integrated with the first electrode 110. In other words, the end portion of the first electrode 110 is drawn out to the outside of the organic EL element 101 to form the lead wiring 132.

  As shown in FIGS. 5 to 7, the insulating layer 120 is formed on and between the plurality of first electrodes 110. The insulating layer 120 is a photosensitive resin such as a polyimide resin, and is formed in a desired pattern by being exposed and developed. As the insulating layer 120, for example, a positive photosensitive resin is used. The insulating layer 120 may be a resin other than a polyimide resin, for example, an epoxy resin or an acrylic resin.

  A plurality of first openings 122 and a plurality of second openings 124 are formed in the insulating layer 120. The first opening 122 is located at the intersection of the first electrode 110 and the second electrode 150 in plan view. The plurality of first openings 122 are provided at predetermined intervals. The plurality of first openings 122 are arranged in the direction in which the first electrode 110 extends. The plurality of first openings 122 are also arranged in the extending direction of the second electrode 150. For this reason, the plurality of first openings 122 are arranged to form a matrix.

  The second opening 124 is located at one end of each of the plurality of second electrodes 150 in plan view. The second openings 124 are arranged along one side of the matrix formed by the first openings 122. When viewed in a direction along one side (for example, the X direction in FIG. 5), the second openings 124 are arranged at a predetermined interval in the direction along the first electrode 110. The lead wiring 160 or a part of the lead wiring 160 is exposed from the second opening 124.

  Note that the insulating layer 120 having the first opening 122 and the insulating layer 120 having the second opening 124 may be formed of the same material or different materials. Alternatively, the insulating layer 120 having the second opening 124 may be formed on the outer peripheral side of the substrate 100 with respect to the insulating layer 120 having the first opening 122. The insulating layer 120 having the first opening 122 and the insulating layer 120 having the second opening 124 may be continuous layers or separated layers (separated).

  An organic layer 140 is formed in a region overlapping with the first opening 122. The organic layer 140 is formed by stacking, for example, a hole transport layer, a light emitting layer, and an electron transport layer. The hole transport layer is in contact with the first electrode 110, and the electron transport layer is in contact with the second electrode 150. In this way, the organic layer 140 is sandwiched between the first electrode 110 and the second electrode 150.

  A hole injection layer may be formed between the first electrode 110 and the hole transport layer, or an electron injection layer may be formed between the second electrode 150 and the electron transport layer. . Also, not all of the above layers are necessary. For example, when recombination of holes and electrons occurs in the electron transport layer, the light-emitting layer is unnecessary because the electron transport layer also functions as the light-emitting layer. In addition, at least one of the first electrode 110, the hole injection layer, the hole transport layer, the electron transport layer, the electron injection layer, and the second electrode 150 is formed using a coating method such as an inkjet method. May be. Further, an electron injection layer made of an inorganic material such as LiF may be provided between the organic layer 140 and the second electrode 150.

  In the example shown in FIGS. 6 and 8, each layer constituting the organic layer 140 is shown to protrude to the outside of the first opening 122. And as shown in FIG. 8, each layer which comprises the organic layer 140 may be continuously formed between the adjacent 1st opening 122 in the direction where the partition 170 is extended, or continuously. It may not be formed. However, as shown in FIG. 7, the organic layer 140 is not formed in the second opening 124.

  As shown in FIGS. 5 to 7, the second electrode 150 is formed above the organic layer 140 and extends in a second direction (Y direction in FIG. 5) intersecting the first direction. The second electrode 150 is electrically connected to the organic layer 140. For example, the second electrode 150 may be formed on the organic layer 140 or may be formed on a conductive layer formed on the organic layer 140. The second electrode 150 is, for example, a metal layer formed of a metal material such as Ag or Al, or a layer formed of an oxidized conductive material such as IZO. The light emitting device 10 includes a plurality of second electrodes 150 that are parallel to each other. One second electrode 150 is formed in a direction passing through the plurality of first openings 122. The second electrode 150 is connected to the lead wiring 160. In the illustrated example, the end of the second electrode 150 is positioned on the second opening 124, whereby the second electrode 150 and the extraction wiring 160 are connected in the second opening 124.

  In the example of FIG. 5, a lead wiring 162 is formed under the lead wiring 160. In the example shown in FIG. 5, the width of the lead wiring 162 is larger than the width of the lead wiring 160, but may be small. The lead wires 160 and 162 are formed in a region where the first electrode 110 and the lead wires 130 and 132 are not formed on the first surface side of the substrate 100. The lead wiring 160 may be formed simultaneously with the lead wiring 130, for example, or may be formed in a separate process from the lead wiring 130. Similarly, the lead wiring 162 may be formed simultaneously with the lead wiring 132, for example, or may be formed in a separate process from the lead wiring 132.

  The lead-out wiring 162 is formed of the same kind or different material as the material constituting the first electrode 110. Here, as an example of the same type of material, when the first electrode 110 is formed of ITO, which is an oxidized conductive material, an oxide conductive material such as ITO having the same or different composition as the ITO constituting the first electrode 110, or IZO. Materials. Examples of different materials include metal materials such as Al.

  A part of one end side (light emitting part side) of the lead wiring 160 is exposed through the second opening 124. In the second opening 124, the second electrode 150 is connected to the lead wiring 160. A part of the other end side (outer peripheral side of the substrate) of the lead wiring 160 is drawn to the outside of the insulating layer 120. That is, the other end side of the lead wiring 160 is exposed from the insulating layer 120.

  A partition wall 170 is formed between the adjacent second electrodes 150. The partition wall 170 extends in parallel with the second electrode 150, that is, in the second direction. The base of the partition wall 170 is, for example, the insulating layer 120. The partition 170 is, for example, a photosensitive resin such as a polyimide resin, and is formed in a desired pattern by being exposed and developed. The partition wall 170 is formed using, for example, a negative photosensitive resin. The partition wall 170 may be made of a resin other than a polyimide resin, for example, an inorganic material such as an epoxy resin, an acrylic resin, or silicon dioxide.

  The partition wall 170 has a trapezoidal cross-sectional shape (reverse trapezoidal shape). That is, the width of the upper surface of the partition wall 170 is larger than the width of the lower surface of the partition wall 170. For this reason, if the partition 170 is formed before the second electrode 150, a plurality of second electrodes 150 are formed on the first surface side of the substrate by vapor deposition or sputtering. The two electrodes 150 can be formed at a time. Since the second electrode 150 formed on one surface is divided by the partition wall 170, the plurality of second electrodes 150 are provided on the organic layer 140. The position where the second electrode 150 is divided includes, for example, the insulating layer 120 which is the base of the partition 170, the side surface of the partition 170, or the like. Then, by changing the extending direction of the partition wall 170, the second electrode 150 can be patterned into a free shape such as a stripe shape, a dot shape, an icon shape, or a curve. Note that a conductive layer 152 made of the same material as the second electrode 150 is formed on the partition wall 170.

  In the case where the organic layer 140 is made of a coating material, the organic layer 140 is formed by applying the coating material to the plurality of first openings 122. When the coating material is applied to the plurality of first openings 122, the partition 170 is connected to the first openings 122 on both sides of the partition 170, and the first opening on one side of the partition 170 is connected to each other. It may have a function of preventing the organic layer 140 from continuing from 122 to the first opening 122 on the other side. In this case, the partition wall 170 is formed before the organic layer 140.

  A sealing film 210 is formed above the second electrode 150. The light emitting device 10 seals the organic EL element 101 and the partition 170. The sealing film 210 includes at least a layer made of an oxide, for example, an aluminum oxide film. The sealing film 210 may have a single layer structure or a structure in which a plurality of metal oxide films are stacked. The sealing film 210 is an aluminum oxide film, for example, and is formed using, for example, an ALD (Atomic Layer Deposition) method. In the example shown in this figure, the sealing film 210 is formed on the second electrode 150, but another film may exist between the second electrode 150 and the sealing film 210. The film thickness of the sealing film 210 is, for example, 10 nm or more and 1000 nm or less. A film formed by the ALD method has high step coverage. Here, the step coverage means the uniformity of the film thickness in a portion where there is a step. High step coverage means that the film thickness uniformity is high even in a stepped portion, and low step coverage means that the film thickness uniformity is low in a stepped portion. Note that the sealing film 210 may be formed using a film formation method other than the ALD method, for example, a CVD method.

  As shown in FIG. 5, the sealing film 210 covers the insulating layer 120, the extraction wiring 160, and the extraction wiring 130. An opening 212 is formed in a portion of the sealing film 210 located on the lead wiring 130 and a portion located on the lead wiring 160. The opening 212 is provided to electrically connect the lead wiring 130 and the lead wiring 160 to the outside. A terminal 220 is formed by the plurality of openings 212 and the lead wires 130 and 160 located therebelow.

  Next, a method for manufacturing the light emitting device 10 will be described. First, the thing which has arrange | positioned the board | substrate 100 on the support member 400 is prepared.

  Next, a conductive layer to be the first electrode 110 is formed on the substrate 100, and this conductive layer is selectively removed using etching (for example, dry etching or wet etching). As a result, the first electrode 110 and the lead wires 132 and 162 are formed on the substrate 100.

  Next, a conductive layer to be the lead wirings 130 and 160 is formed on the substrate 100, the first electrode 110, and the lead wirings 132 and 162, and the conductive layer is etched (for example, dry etching or wet etching). And selectively remove. Thereby, the lead wires 130 and 160 are formed.

  Next, an insulating layer is formed on the substrate 100, the first electrode 110, and the lead wirings 130 and 160, and this insulating layer is selectively removed using etching (for example, dry etching or wet etching). Thereby, the insulating layer 120, the first opening 122, and the second opening 124 are formed. For example, when the insulating layer 120 is formed of polyimide, the insulating layer 120 is subjected to heat treatment. Thereby, imidation of the insulating layer 120 proceeds.

  Next, an insulating film to be the partition wall 170 is formed over the insulating layer 120, and this insulating film is selectively removed by using etching (for example, dry etching or wet etching). Thereby, the partition 170 is formed. In the case where the partition 170 is formed using a photosensitive insulating film, the cross-sectional shape of the partition 170 can be changed to an inverted trapezoid by adjusting the conditions during exposure and development.

  When the partition 170 is a negative resist, the negative resist is cured at a portion irradiated with irradiation light from the exposure light source. The partition 170 is formed by dissolving and removing the uncured portion of the negative resist with a developer.

  Next, each layer to be the organic layer 140 is sequentially formed in the first opening 122. Among these layers, at least the hole injection layer is formed using a coating method such as spray coating, dispenser coating, inkjet, or printing. In this case, the coating material enters the first opening 122, and the coating material is dried, whereby the above-described layers are formed. As a coating material used in the coating method, a polymer material, a polymer material containing a low-molecular material, or the like is suitable. As the coating material, for example, a polyalkylthiophene derivative, a polyaniline derivative, triphenylamine, a sol-gel film of an inorganic compound, an organic compound film containing a Lewis acid, a conductive polymer, or the like can be used. The remaining layers (for example, electron transport layers) of the organic layer 140 are formed by a vapor deposition method. However, these layers may also be formed using any of the above-described coating methods.

  Next, the second electrode 150 is formed on the organic layer 140 by using, for example, a vapor deposition method or a sputtering method. At this time, the conductive layer 152 is formed on the upper surface of the partition wall 170.

  Note that at least one of the layers other than the organic layer 140, for example, the first electrode 110, the insulating layer 120, the lead-out wiring 130, the lead-out wiring 160, the second electrode 150, and the partition wall 170 is formed using any of the above-described coating methods. It may be formed.

  Next, the sealing film 210 is formed using an ALD method, and an opening 212 is formed in the sealing film 210.

  Next, the connection member 30 (for example, anisotropic conductive resin) is disposed on the plurality of openings 212, and the lead-out wirings 130 and 160 in the opening 212 are connected to the external wiring 300 using the connection member 30.

  Thereafter, the substrate 100 is removed from the support member 400. This removal method is as described in the embodiment. Thereafter, the substrate 100 is bent in a direction that intersects with the direction in which the partition wall 170 extends at an angle of 45 ° or more (for example, an orthogonal direction). In this way, the light emitting device 10 is formed.

  As described above, according to this embodiment, the partition wall 170 can be prevented from being damaged when the substrate 100 is detached from the support member 400. Further, when the substrate 100 is bent, the partition wall 170 can be prevented from being damaged.

  Moreover, since the organic EL element 101 is sealed using the sealing film 210 instead of the sealing member, the flexibility of the light emitting device 10 can be maintained.

  In particular, in this embodiment, a film (for example, an aluminum oxide film) manufactured by the ALD method is used as the sealing film 210, and a glass substrate is used as the substrate 100. Since the sealing film 210 also covers the partition wall 170, stress generated between the sealing film 210 and the base material 100 when the substrate 100 is bent is likely to be applied to the partition wall 170. For this reason, when the partition 170 is extended in a direction along the direction in which the substrate 100 is curved, the partition 170 is particularly easily damaged. Furthermore, there is a possibility that a portion of the sealing film 210 located above the partition wall 170 is damaged. In contrast, in this embodiment, the partition 170 extends in a direction intersecting at an angle of 45 ° or more and 90 ° or less with respect to the direction in which the substrate 100 is bent. It can control that it breaks.

  That is, when the light emitting device 10 is used while being kept bent in a certain direction, there is a possibility that at least one of the substrate 100 and the sealing film 210 may be damaged by a structure such as the partition wall 170. For this reason, it has been difficult to realize the long-life light emitting device 10. The light emitting device 10 having a long life can be provided by the device according to the present embodiment.

(Example 2)
FIG. 9 is a cross-sectional view illustrating a configuration of the light emitting device 10 according to the second embodiment. The light emitting device 10 according to this example has the same configuration as that of the light emitting device 10 according to the embodiment or example 1 except for the arrangement interval of the partition walls 170 in the first direction.

  Specifically, in the direction in which the substrate 100 is curved (first direction), the interval between the partition walls 170 becomes narrower as it approaches the center side of the substrate 100. As a result, the distance between the partition 170 closest to the end of the substrate 100 in the first direction and the partition 170 located next to the partition 170 is the same as the partition 170 closest to the center of the substrate 100 in the first direction. The distance between the partition walls 170 adjacent to the partition walls 170 is wider.

  Note that the difference between the interval between a certain partition wall 170 and the interval between adjacent partition walls 170 may always be the same or different. Further, the interval between any partition walls 170 and the interval between adjacent partition walls 170 may be the same.

  Also in this embodiment, the bending stress applied to the partition 170 between the partition 170 and the substrate 100 is reduced. Further, the interval between the partition walls 170 becomes narrower as it approaches the center side of the substrate 100. In other words, the width of the organic EL element 101 becomes narrower as it approaches the center side of the substrate 100. Therefore, even when the light emitting device 10 is curved, the width of the organic EL element 101 located on the center side of the substrate 100 and the organic EL element 101 located on the end side of the substrate 100 when viewed from the user U. The difference with the width becomes smaller.

(Example 3)
FIG. 10 is a plan view illustrating the configuration of the light emitting device 10 according to the third embodiment. In this embodiment, the light emitting device 10 is a lighting device. One organic EL element 101 extends between one partition 170. In other words, the light emitting device 10 has a plurality of stripe-shaped organic EL elements 101. A partition wall 170 extends between adjacent organic EL elements 101. In the drawing, the illustration of the sealing film 210 is omitted. In addition, the lead-out wiring is greatly illustrated for easy understanding.

  In the example shown in this figure, the insulating layer 120 is not provided. However, the insulating layer 120 may be provided only under the partition wall 170.

  Further, when the organic EL elements 101 that emit different colors (for example, red, green, and blue) are repeatedly formed on the substrate 100, the light emitting device 10 is controlled by controlling the emission intensity ratio of these organic EL elements 101. Can have color rendering properties.

  The method for manufacturing the light emitting device 10 in this example is the same as that in Example 1. For this reason, when removing the board | substrate 100 from the supporting member 400, it can suppress that the partition 170 is damaged. Further, when the substrate 100 is bent, the partition wall 170 can be prevented from being damaged.

  As mentioned above, although embodiment and the Example were described with reference to drawings, these are illustrations of this invention and can also employ | adopt various structures other than the above.

  As mentioned above, although embodiment and the Example were described with reference to drawings, these are illustrations of this invention and can also employ | adopt various structures other than the above.

100 Substrate 101 Organic EL Element 104 End 110 First Electrode 140 Organic Layer 150 Second Electrode 170 Partition 210 Sealing Film 212 Opening 220 Terminal 30 Connection Member 300 External Wiring 400 Support Member

Claims (4)

Preparing a support member and a flexible substrate held on the support member;
An organic EL element having a first electrode, an organic layer, and a second electrode on the first surface side of the substrate, and an end of the substrate on the first direction side and electrically connected to the organic EL element Forming a terminal connected to,
Dividing the second electrode on the first surface side of the substrate and forming a plurality of partition walls extending in a direction intersecting at an angle of 45 ° or more with respect to the first direction;
Connecting external wiring to the terminal via a connecting member;
Removing the substrate from the support member after connecting the external wiring to the terminal;
A method for manufacturing a light emitting device. In the manufacturing method of the light-emitting device according to claim 1 ,
The organic EL element is a method for manufacturing a light emitting device formed between the plurality of partition walls. In the manufacturing method of the light-emitting device of Claim 1 or 2 ,
In the step of removing the substrate from the support member, a method for manufacturing a light emitting device, wherein the substrate is removed from the support member from an end portion of the substrate opposite to an end portion where the terminal is provided. In the manufacturing method of the light-emitting device as described in any one of Claims 1-3 ,
A method of manufacturing a light emitting device, comprising: forming a sealing film for sealing the organic EL element after forming the organic EL element and the terminal and before connecting the external wiring to the terminal.

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