JP6202973B2 - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP6202973B2 JP6202973B2 JP2013210174A JP2013210174A JP6202973B2 JP 6202973 B2 JP6202973 B2 JP 6202973B2 JP 2013210174 A JP2013210174 A JP 2013210174A JP 2013210174 A JP2013210174 A JP 2013210174A JP 6202973 B2 JP6202973 B2 JP 6202973B2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- board
- plug
- substrate
- jack connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/56—Means for preventing chafing or fracture of flexible leads at outlet from coupling part
- H01R13/567—Traverse cable outlet or wire connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/56—Means for preventing chafing or fracture of flexible leads at outlet from coupling part
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/58—Contacts spaced along longitudinal axis of engagement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
- H01R4/489—Clamped connections, spring connections utilising a spring, clip, or other resilient member spring force increased by screw, cam, wedge, or other fastening means
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Studio Devices (AREA)
Description
4 側面カバー
5 端子カバー
7 マイクジャックコネクタ
8 プラグ
9 基板
11 ビス
71 補強端子
92 補強ランド
101 掛止爪
102 先端部
105 片持ちばね部
Claims (6)
- プラグが挿抜されるジャックコネクタと、
前記ジャックコネクタが実装されるコネクタ基板と、
前記プラグの挿入方向に延設されて前記コネクタ基板が取り付けられる片持ちばね部を有するシャーシと、
前記コネクタ基板を前記片持ちばね部に固定する固定部材と、を備え、
前記片持ちばね部には、前記コネクタ基板に形成した穴を貫通して前記コネクタ基板に掛止される掛止爪が前記プラグの挿入方向と垂直な方向である前記コネクタ基板の幅方向の両側に設けられ、
前記固定部材は、前記プラグの挿入方向と同一直線上で、かつ前記ジャックコネクタのプラグ挿入口と反対側に配置され、
前記コネクタ基板が撓んでいない状態では、前記コネクタ基板と前記掛止爪の先端部との間に隙間が形成されることを特徴とする電子機器。 - 前記ジャックコネクタには、前記コネクタ基板に設けられた補強ランドと半田接合される補強端子が設けられることを特徴とする請求項1に記載の電子機器。
- 前記補強端子、及び前記補強ランドは、前記プラグの挿入方向と垂直な方向である前記コネクタ基板の幅方向に沿って延びる線上に配置されることを特徴とする請求項2に記載の電子機器。
- 前記片持ちばね部、及び前記コネクタ基板は、同一厚さであることを特徴とする請求項1乃至3のいずれか一項に記載の電子機器。
- 前記シャーシは、グランドに電気的に接続され、
前記コネクタ基板のグランド信号は、前記固定部材を介して前記シャーシに電気的に接続されることを特徴とする請求項1乃至4のいずれか一項に記載の電子機器。 - 前記ジャックコネクタは、マイクジャックコネクタ、USBコネクタ、及びHDMI(登録商標)コネクタのいずれかであることを特徴とする請求項1乃至5のいずれか一項に記載の電子機器。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013210174A JP6202973B2 (ja) | 2013-10-07 | 2013-10-07 | 電子機器 |
| US14/502,671 US9402327B2 (en) | 2013-10-07 | 2014-09-30 | Electronic apparatus having jack connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013210174A JP6202973B2 (ja) | 2013-10-07 | 2013-10-07 | 電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015076439A JP2015076439A (ja) | 2015-04-20 |
| JP6202973B2 true JP6202973B2 (ja) | 2017-09-27 |
Family
ID=52776780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013210174A Expired - Fee Related JP6202973B2 (ja) | 2013-10-07 | 2013-10-07 | 電子機器 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9402327B2 (ja) |
| JP (1) | JP6202973B2 (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD775683S1 (en) * | 2014-04-08 | 2017-01-03 | Leica Camera Ag | Connector pin |
| JP6448399B2 (ja) * | 2015-02-04 | 2019-01-09 | キヤノン株式会社 | 電子機器 |
| USD808338S1 (en) * | 2016-04-19 | 2018-01-23 | Karim Messadek | Connector |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3190516B2 (ja) * | 1994-04-25 | 2001-07-23 | 松下電器産業株式会社 | ジャックの取付構造 |
| JPH0964504A (ja) * | 1995-08-21 | 1997-03-07 | Sony Corp | リードフレーム付ハイブリッドic及びハイブリッドicのマザー基板実装方法 |
| JP3758290B2 (ja) | 1997-04-16 | 2006-03-22 | ブラザー工業株式会社 | ジャック基板 |
| JP2003234547A (ja) | 2001-12-07 | 2003-08-22 | Seiko Epson Corp | 基板および基板ユニット |
| JP4370827B2 (ja) * | 2003-06-27 | 2009-11-25 | 富士ゼロックス株式会社 | 電子機器 |
| US7059915B1 (en) * | 2005-06-28 | 2006-06-13 | Molex Incorporated | Panel mounted modular jack terminated to a circuit board |
| JP4877001B2 (ja) * | 2007-03-26 | 2012-02-15 | 船井電機株式会社 | コネクタ基板及びこれを用いたスピーカの入力端子の接続構造 |
| JP5550326B2 (ja) * | 2009-12-18 | 2014-07-16 | キヤノン株式会社 | 電子機器 |
| JP2012043701A (ja) * | 2010-08-20 | 2012-03-01 | Canon Inc | 電子機器及びコネクタジャックの取り付け方法 |
-
2013
- 2013-10-07 JP JP2013210174A patent/JP6202973B2/ja not_active Expired - Fee Related
-
2014
- 2014-09-30 US US14/502,671 patent/US9402327B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015076439A (ja) | 2015-04-20 |
| US20150098201A1 (en) | 2015-04-09 |
| US9402327B2 (en) | 2016-07-26 |
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