JP6200891B2 - 蛍光体材料及び関連デバイス - Google Patents
蛍光体材料及び関連デバイス Download PDFInfo
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- JP6200891B2 JP6200891B2 JP2014533614A JP2014533614A JP6200891B2 JP 6200891 B2 JP6200891 B2 JP 6200891B2 JP 2014533614 A JP2014533614 A JP 2014533614A JP 2014533614 A JP2014533614 A JP 2014533614A JP 6200891 B2 JP6200891 B2 JP 6200891B2
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- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D301/00—Preparation of oxiranes
- C07D301/02—Synthesis of the oxirane ring
- C07D301/03—Synthesis of the oxirane ring by oxidation of unsaturated compounds, or of mixtures of unsaturated and saturated compounds
- C07D301/19—Synthesis of the oxirane ring by oxidation of unsaturated compounds, or of mixtures of unsaturated and saturated compounds with organic hydroperoxides
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- C07C1/24—Preparation of hydrocarbons from one or more compounds, none of them being a hydrocarbon starting from organic compounds containing only oxygen atoms as heteroatoms by elimination of water
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- C07C29/132—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by reduction of an oxygen containing functional group
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- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
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- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
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- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/77742—Silicates
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
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- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
- C09K11/77927—Silicon Nitrides or Silicon Oxynitrides
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- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/38—Devices for influencing the colour or wavelength of the light
- H01J61/42—Devices for influencing the colour or wavelength of the light by transforming the wavelength of the light by luminescence
- H01J61/44—Devices characterised by the luminescent material
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H01L33/502—Wavelength conversion materials
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- C07C2601/00—Systems containing only non-condensed rings
- C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
- C07C2601/14—The ring being saturated
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
Claims (8)
- 一般式(Ca 1-z Ce z ) 3 Sc 2 Si n-w Ge w O 12 の組成物を含む第1の蛍光体(式中、2.5≦n≦3.5、0≦w≦1及び0<z≦0.3である。)と、
マンガン(Mn4+)がドープされた複合フッ化物を含む一般式A2[MF6]:Mn4+(式中、AはNa、K、Rb、Cs、NH4又はそれらの組合せを含み、MはSi、Ti、Zr、Mn又はそれらの組合せを含む。)の第2の蛍光体と、
520nm〜680nmに発光ピークを有する蛍光体組成物を含む第3の蛍光体と
のブレンドを含む、蛍光体材料。 - 第3の蛍光体がガーネット、窒化物、酸窒化物又はそれらの組合せを含む、請求項1記載の蛍光体材料。
- 第3の蛍光体が一般式(A,Ce)3M5-aO12-3/2aのガーネットを含む(式中、0≦a≦0.5であり、AはY、Gd、Tb、La、Sm、Pr、Lu又はそれらの組合せを含み、MはSc、Al、Ga又はそれらの組合せを含む。)、請求項2記載の蛍光体材料。
- 第3の蛍光体が一般式(A,Eu)xSiyNzの窒化物を含む(式中、2x+3y=4zであり、AはBa、Ca、Sr又はそれらの組合せを含む。)、請求項2記載の蛍光体材料。
- 第3の蛍光体がA2Si5N8:Eu2+,Ce2+を含む(式中、AはBa、Ca、Sr又はそれらの組合せを含む。)、請求項2記載の蛍光体材料。
- 第3の蛍光体が一般式ApBqOrNs:Rの酸窒化物を含む(式中、Aはバリウムを含み、Bは、ケイ素を含み、Rは、ユウロピウムを含み、2<p<6、8<q<10、0.1<r<6、10<s<15である。)、請求項2記載の蛍光体材料。
- 400nm〜480nmの範囲の放射光を放射することができる光源、及び
光源と放射結合した請求項1乃至請求項6のいずれか1項記載の蛍光体材料
を備える照明装置。 - 前記光源が発光ダイオード(LED)を含む、請求項7記載の照明装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IN3392CH2011 | 2011-09-30 | ||
IN3392/CHE/2011 | 2011-09-30 | ||
PCT/US2012/056299 WO2013048865A1 (en) | 2011-09-30 | 2012-09-20 | Phosphor materials and related devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015505327A JP2015505327A (ja) | 2015-02-19 |
JP6200891B2 true JP6200891B2 (ja) | 2017-09-20 |
Family
ID=47003241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014533614A Active JP6200891B2 (ja) | 2011-09-30 | 2012-09-20 | 蛍光体材料及び関連デバイス |
Country Status (8)
Country | Link |
---|---|
US (1) | US9611237B2 (ja) |
EP (1) | EP2760970B1 (ja) |
JP (1) | JP6200891B2 (ja) |
KR (1) | KR101971752B1 (ja) |
CN (1) | CN103827259B (ja) |
CA (1) | CA2848917A1 (ja) |
MX (1) | MX351531B (ja) |
WO (1) | WO2013048865A1 (ja) |
Families Citing this family (17)
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US10381527B2 (en) | 2014-02-10 | 2019-08-13 | Consumer Lighting, Llc | Enhanced color-preference LED light sources using yag, nitride, and PFS phosphors |
MX362658B (es) | 2013-09-09 | 2019-01-30 | Ge Lighting Solutions Llc | Fuentes de luz de preferencia de color mejorado. |
TWI638962B (zh) * | 2014-03-06 | 2018-10-21 | 晶元光電股份有限公司 | 發光裝置 |
US9929319B2 (en) * | 2014-06-13 | 2018-03-27 | General Electric Company | LED package with red-emitting phosphors |
EP3194529A1 (en) * | 2014-09-09 | 2017-07-26 | GE Lighting Solutions, LLC | Enhanced color-preference led light sources using lag, nitride and pfs phosphors |
TWI709711B (zh) * | 2014-09-16 | 2020-11-11 | 美商Ge照明解決方案公司 | 增強的色彩偏好光源 |
KR20160069724A (ko) * | 2014-12-09 | 2016-06-17 | 엘지이노텍 주식회사 | 형광체 조성물, 이를 포함하는 발광 소자 패키지 및 조명 장치 |
KR102355081B1 (ko) | 2014-12-26 | 2022-01-26 | 삼성전자주식회사 | 불화물 형광체 제조방법, 백색 발광장치, 디스플레이 장치 및 조명장치 |
DE102016121692A1 (de) | 2016-08-12 | 2018-02-15 | Osram Gmbh | Leuchtstoff und Verfahren zur Herstellung eines Leuchtstoffs |
US11851596B2 (en) | 2016-08-12 | 2023-12-26 | Osram Oled Gmbh | Lighting device |
US11114591B2 (en) | 2016-08-17 | 2021-09-07 | Current Lighting Solutions, Llc | Core-shell materials with red-emitting phosphors |
DE112018004067A5 (de) | 2017-08-10 | 2020-04-23 | Osram Oled Gmbh | Dimmbare Lichtquelle |
CN113841238A (zh) | 2019-03-18 | 2021-12-24 | 英特曼帝克司公司 | Led灯丝 |
US11781714B2 (en) | 2019-03-18 | 2023-10-10 | Bridgelux, Inc. | LED-filaments and LED-filament lamps |
CN113826225A (zh) | 2019-03-18 | 2021-12-21 | 英特曼帝克司公司 | 包括光致发光层状结构的封装白色发光装置 |
US11342311B2 (en) | 2019-03-18 | 2022-05-24 | Intematix Corporation | LED-filaments and LED-filament lamps utilizing manganese-activated fluoride red photoluminescence material |
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JP2011159809A (ja) * | 2010-02-01 | 2011-08-18 | Mitsubishi Chemicals Corp | 白色発光装置 |
US20120019126A1 (en) | 2010-07-22 | 2012-01-26 | General Electric Company | Oxynitride phosphors, method of preparation, and light emitting instrument |
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EP2760970B1 (en) | 2015-12-16 |
MX351531B (es) | 2017-10-18 |
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JP2015505327A (ja) | 2015-02-19 |
WO2013048865A1 (en) | 2013-04-04 |
KR20140081842A (ko) | 2014-07-01 |
MX2014003844A (es) | 2014-04-30 |
EP2760970A1 (en) | 2014-08-06 |
CA2848917A1 (en) | 2013-04-04 |
CN103827259A (zh) | 2014-05-28 |
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US9611237B2 (en) | 2017-04-04 |
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