JP6199076B2 - 超音波振動子および超音波振動子の製造方法 - Google Patents

超音波振動子および超音波振動子の製造方法 Download PDF

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Publication number
JP6199076B2
JP6199076B2 JP2013104613A JP2013104613A JP6199076B2 JP 6199076 B2 JP6199076 B2 JP 6199076B2 JP 2013104613 A JP2013104613 A JP 2013104613A JP 2013104613 A JP2013104613 A JP 2013104613A JP 6199076 B2 JP6199076 B2 JP 6199076B2
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Japan
Prior art keywords
interposer
solder
acoustic
layer
integrated circuit
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JP2013104613A
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English (en)
Japanese (ja)
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JP2013243668A (ja
JP2013243668A5 (https=
Inventor
アラン・チー−チュン・タイ
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General Electric Co
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General Electric Co
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Publication of JP2013243668A5 publication Critical patent/JP2013243668A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
    • A61B8/4461—Features of the scanning mechanism, e.g. for moving the transducer within the housing of the probe
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/48—Diagnostic techniques
    • A61B8/483—Diagnostic techniques involving the acquisition of a 3D volume of data
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Molecular Biology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Physics & Mathematics (AREA)
  • Biomedical Technology (AREA)
  • Gynecology & Obstetrics (AREA)
  • Medical Informatics (AREA)
  • Biophysics (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Mechanical Engineering (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
JP2013104613A 2012-05-22 2013-05-17 超音波振動子および超音波振動子の製造方法 Active JP6199076B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/477,948 US9180490B2 (en) 2012-05-22 2012-05-22 Ultrasound transducer and method for manufacturing an ultrasound transducer
US13/477,948 2012-05-22

Publications (3)

Publication Number Publication Date
JP2013243668A JP2013243668A (ja) 2013-12-05
JP2013243668A5 JP2013243668A5 (https=) 2016-06-30
JP6199076B2 true JP6199076B2 (ja) 2017-09-20

Family

ID=49547134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013104613A Active JP6199076B2 (ja) 2012-05-22 2013-05-17 超音波振動子および超音波振動子の製造方法

Country Status (5)

Country Link
US (1) US9180490B2 (https=)
JP (1) JP6199076B2 (https=)
CN (1) CN103417247B (https=)
DE (1) DE102013105167A1 (https=)
FR (1) FR2991127A1 (https=)

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KR20200052224A (ko) * 2018-11-06 2020-05-14 지멘스 메디컬 솔루션즈 유에스에이, 인크. 다차원 트랜스듀서 어레이를 위한 인터포저를 갖는 칩-온-어레이

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US9037419B2 (en) 2011-05-10 2015-05-19 Edison Welding Institute, Inc. Portable matrix phased array spot weld inspection system
US9063059B2 (en) 2011-05-10 2015-06-23 Edison Welding Institute, Inc. Three-dimensional matrix phased array spot weld inspection system
US20150115773A1 (en) * 2013-10-31 2015-04-30 General Electric Company Ultrasound transducer and method for manufacturing an ultrasound transducer
KR101613413B1 (ko) * 2013-12-09 2016-04-19 삼성메디슨 주식회사 초음파 프로브 및 그 제조방법
US9539667B2 (en) 2013-12-30 2017-01-10 General Electric Company Systems and methods for connection to a transducer in ultrasound probes
JP6505453B2 (ja) * 2014-02-10 2019-04-24 キヤノンメディカルシステムズ株式会社 超音波プローブ
US20160114193A1 (en) * 2014-10-23 2016-04-28 Oleg Prus Multilayer ultrasound transducers for high-power transmission
JP6675142B2 (ja) * 2014-10-29 2020-04-01 キヤノンメディカルシステムズ株式会社 超音波プローブ
KR102406927B1 (ko) * 2014-12-02 2022-06-10 삼성메디슨 주식회사 초음파 프로브 및 그 제조방법
WO2016104820A1 (ko) * 2014-12-22 2016-06-30 알피니언메디칼시스템 주식회사 연성 인쇄회로기판의 금속층이 두꺼운 초음파 트랜스듀서 및 그 제조방법
KR102373132B1 (ko) * 2014-12-26 2022-03-11 삼성메디슨 주식회사 초음파 프로브 장치 및 초음파 촬영 장치
CN107106133B (zh) * 2015-01-13 2020-06-30 皇家飞利浦有限公司 与弹簧电气互连的内插器
WO2016176663A1 (en) 2015-04-29 2016-11-03 Flodesign Sonics, Inc. Acoustophoretic device for angled wave particle deflection
US9751108B2 (en) * 2015-07-31 2017-09-05 Texas Instruments Incorporated Extended range ultrasound transducer
KR102591372B1 (ko) * 2015-10-27 2023-10-20 삼성메디슨 주식회사 초음파 프로브
US10905398B2 (en) 2016-01-04 2021-02-02 General Electric Company Ultrasound transducer array with separated acoustic and electric module
US11134918B2 (en) 2016-02-18 2021-10-05 University Of Southern California Modular piezoelectric sensor array with co-integrated electronics and beamforming channels
US20170343346A1 (en) * 2016-05-31 2017-11-30 Qualcomm Incorporated Ultrasonic tilt sensor and related methods
US10918356B2 (en) 2016-11-22 2021-02-16 General Electric Company Ultrasound transducers having electrical traces on acoustic backing structures and methods of making the same
US10510628B2 (en) * 2017-05-11 2019-12-17 Siemens Medical Solutions Usa, Inc. Contact pads for electrical module assembly with multidimensional transducer arrays
CN107202630A (zh) * 2017-06-28 2017-09-26 上海理工大学 用于计量管理的超声波多层传感器
DE102017115493B4 (de) * 2017-07-11 2019-02-14 Valeo Schalter Und Sensoren Gmbh Elektrische Verbindungseinrichtung für einen Ultraschallsensor eines Kraftfahrzeugs, Verfahren zum Herstellen eines Ultraschallsensors, Ultraschallsensor sowie Kraftfahrzeug
WO2019018328A1 (en) * 2017-07-17 2019-01-24 Cornell University ACOUSTIC TEST METHOD, APPARATUS AND APPARATUS
US10710116B2 (en) * 2017-09-21 2020-07-14 General Electric Company Methods and systems for manufacturing an ultrasound probe
CA3107647A1 (en) 2018-07-31 2020-02-06 Resonant Acoustics International Inc. Ultrasonic transducer
JP7275808B2 (ja) * 2019-04-23 2023-05-18 コニカミノルタ株式会社 超音波探触子及び超音波診断装置
FI4062128T3 (fi) * 2019-11-18 2025-12-02 Resonant Acoustics Int Inc Ultraäänianturit, taustarakenteet ja niihin liittyvät menetelmät
US11731165B2 (en) * 2019-12-20 2023-08-22 GE Precision Healthcare LLC Stressed-skin backing panel for image artifacts prevention
US11656355B2 (en) 2020-07-15 2023-05-23 Siemens Medical Solutions Usa, Inc. Direct chip-on-array for a multidimensional transducer array
CA3203037A1 (en) * 2020-12-31 2022-07-07 Ariel Sverdlik Cooling of ultrasound energizers mounted on printed circuit boards
KR102608457B1 (ko) * 2022-10-17 2023-12-01 주식회사 소닉랩 초음파 진단용 프로브 및 그 제조방법
CN117732703A (zh) * 2023-12-29 2024-03-22 武汉联影医疗科技有限公司 一种超声换能器、超声探头以及超声设备
FR3166264A1 (fr) * 2024-09-11 2026-03-13 Vermon Procédé d'assemblage d'un composant électroacoustique à un circuit électronique par soudure par refusion

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JP5204101B2 (ja) 2006-06-26 2013-06-05 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 形成された結合を有するフリップチップ相互接続
CN101479845A (zh) 2006-06-26 2009-07-08 皇家飞利浦电子股份有限公司 利用小的钝化层开口的倒装互连
US20120143060A1 (en) * 2007-12-27 2012-06-07 Koninklijke Philips Electronics N.V. Ultrasound transducer assembly with improved thermal behavior
US20100249598A1 (en) * 2009-03-25 2010-09-30 General Electric Company Ultrasound probe with replaceable head portion
US8207652B2 (en) * 2009-06-16 2012-06-26 General Electric Company Ultrasound transducer with improved acoustic performance
US8345508B2 (en) * 2009-09-20 2013-01-01 General Electric Company Large area modular sensor array assembly and method for making the same
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200052224A (ko) * 2018-11-06 2020-05-14 지멘스 메디컬 솔루션즈 유에스에이, 인크. 다차원 트랜스듀서 어레이를 위한 인터포저를 갖는 칩-온-어레이
KR102367351B1 (ko) 2018-11-06 2022-02-23 지멘스 메디컬 솔루션즈 유에스에이, 인크. 다차원 트랜스듀서 어레이를 위한 인터포저를 갖는 칩-온-어레이

Also Published As

Publication number Publication date
DE102013105167A1 (de) 2013-11-28
FR2991127A1 (fr) 2013-11-29
CN103417247B (zh) 2017-06-27
US9180490B2 (en) 2015-11-10
JP2013243668A (ja) 2013-12-05
CN103417247A (zh) 2013-12-04
US20130315035A1 (en) 2013-11-28

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