JP6196119B2 - 形状測定装置及び形状測定方法 - Google Patents
形状測定装置及び形状測定方法 Download PDFInfo
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- JP6196119B2 JP6196119B2 JP2013213455A JP2013213455A JP6196119B2 JP 6196119 B2 JP6196119 B2 JP 6196119B2 JP 2013213455 A JP2013213455 A JP 2013213455A JP 2013213455 A JP2013213455 A JP 2013213455A JP 6196119 B2 JP6196119 B2 JP 6196119B2
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- 238000000034 method Methods 0.000 title description 14
- 230000003287 optical effect Effects 0.000 claims description 72
- 238000001228 spectrum Methods 0.000 claims description 36
- 238000003384 imaging method Methods 0.000 claims description 26
- 239000010409 thin film Substances 0.000 claims description 23
- 230000007246 mechanism Effects 0.000 claims description 19
- 238000004364 calculation method Methods 0.000 claims description 16
- 238000005259 measurement Methods 0.000 claims description 16
- 239000010408 film Substances 0.000 claims description 15
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000000691 measurement method Methods 0.000 claims 1
- 238000000985 reflectance spectrum Methods 0.000 description 14
- 238000004458 analytical method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000835 fiber Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 description 1
- 240000006829 Ficus sundaica Species 0.000 description 1
- 241000724291 Tobacco streak virus Species 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052805 deuterium Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
- G01J3/2823—Imaging spectrometer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95653—Through-holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Instruments For Measurement Of Length By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Description
Claims (5)
- 表面の少なくとも一部に薄膜を有するサンプルの表面に対向する参照平面を有する透光性の光学部品と、
前記光学部品を通じて、前記サンプルの表面に所定の波長領域を有する光を照射する光源と、
前記サンプルの表面に定義される線状領域の各位置について反射スペクトルを測定するイメージング分光器と、
前記サンプルの表面と前記参照平面との距離を調整する調整機構と、
互いに異なる距離で測定された複数の反射スペクトルに基づいて、前記サンプルの表面と前記参照平面との距離に由来する周波数成分と、前記薄膜の膜厚に由来する周波数成分とを同定し、前記線状領域の各位置と前記参照平面との距離と、前記線状領域の各位置における前記薄膜の膜厚とを算出する演算部と、
を備える形状測定装置。 - 前記光が照射される領域を、前記線状領域に対応する領域に絞る視野絞りをさらに備える、
請求項1に記載の形状測定装置。 - 前記サンプルが配置されるステージに配置される、前記光学部品の支持機構をさらに備える、
請求項1または2に記載の形状測定装置。 - 前記サンプルからの反射光を受光する測定ヘッドと、前記サンプルが配置されるステージとを支持する支持フレームに配置される、前記光学部品の支持機構をさらに備える、
請求項1または2に記載の形状測定装置。 - 表面の少なくとも一部に薄膜を有するサンプルの表面に対向する参照平面を有する透光性の光学部品を通じて、前記サンプルの表面に所定の波長領域を有する光を照射し、
イメージング分光器により、前記サンプルの表面に定義される線状領域の各位置について第1の反射スペクトルを測定し、
前記サンプルの表面と前記参照平面との距離を変更し、
イメージング分光器により、前記線状領域の各位置について第2の反射スペクトルを測定し、
互いに異なる距離で測定された第1及び第2の反射スペクトルに基づいて、前記サンプルの表面と前記参照平面との距離に由来する周波数成分と、前記薄膜の膜厚に由来する周波数成分とを同定し、前記線状領域の各位置と前記参照平面との距離と、前記線状領域の各位置における前記薄膜の膜厚とを算出する、
形状測定方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013213455A JP6196119B2 (ja) | 2013-10-11 | 2013-10-11 | 形状測定装置及び形状測定方法 |
TW103130497A TWI634311B (zh) | 2013-10-11 | 2014-09-03 | 形狀測定裝置及形狀測定方法 |
KR1020140134901A KR101919639B1 (ko) | 2013-10-11 | 2014-10-07 | 형상 측정 장치 및 형상 측정 방법 |
US14/511,159 US20150106057A1 (en) | 2013-10-11 | 2014-10-09 | Profile measurement system and profile measurement method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013213455A JP6196119B2 (ja) | 2013-10-11 | 2013-10-11 | 形状測定装置及び形状測定方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015075452A JP2015075452A (ja) | 2015-04-20 |
JP6196119B2 true JP6196119B2 (ja) | 2017-09-13 |
Family
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JP2013213455A Active JP6196119B2 (ja) | 2013-10-11 | 2013-10-11 | 形状測定装置及び形状測定方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20150106057A1 (ja) |
JP (1) | JP6196119B2 (ja) |
KR (1) | KR101919639B1 (ja) |
TW (1) | TWI634311B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9863756B1 (en) * | 2014-10-07 | 2018-01-09 | Kla-Tencor Corporation | Line scan spectroscopic white light interferometry for semiconductor inspection and metrology |
US10495446B2 (en) * | 2015-06-29 | 2019-12-03 | Kla-Tencor Corporation | Methods and apparatus for measuring height on a semiconductor wafer |
US11557048B2 (en) | 2015-11-16 | 2023-01-17 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
US10565701B2 (en) * | 2015-11-16 | 2020-02-18 | Applied Materials, Inc. | Color imaging for CMP monitoring |
JP6762221B2 (ja) * | 2016-12-19 | 2020-09-30 | 大塚電子株式会社 | 光学特性測定装置および光学特性測定方法 |
CN107036539B (zh) * | 2017-06-14 | 2018-07-13 | 深圳中科飞测科技有限公司 | 膜厚测量系统及方法 |
CN109387155B (zh) * | 2017-08-10 | 2020-09-22 | 上海微电子装备(集团)股份有限公司 | 形貌检测装置与形貌检测方法 |
US10571334B2 (en) | 2017-12-15 | 2020-02-25 | Horiba Instruments Incorporated | System and method for selective resolution for concave grating spectrometer |
JP6402273B1 (ja) * | 2018-05-18 | 2018-10-10 | 大塚電子株式会社 | 光学測定装置及び光学測定方法 |
JP6797329B2 (ja) * | 2018-06-12 | 2020-12-09 | 三菱電機株式会社 | 光測距装置及び加工装置 |
US11035790B2 (en) * | 2018-12-31 | 2021-06-15 | Industrial Cooperation Foundation Chonbuk National University | Inspection apparatus and inspection method |
US11100628B2 (en) | 2019-02-07 | 2021-08-24 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0432005U (ja) * | 1990-07-13 | 1992-03-16 | ||
JPH04184106A (ja) * | 1990-11-16 | 1992-07-01 | Olympus Optical Co Ltd | 干渉測定方法およびその装置 |
JP2002202109A (ja) * | 2000-11-01 | 2002-07-19 | Seiko Epson Corp | 間隙測定方法、間隙測定装置、形状測定方法、形状測定装置並びに液晶装置の製造方法 |
TW513552B (en) * | 2001-10-26 | 2002-12-11 | Toray Eng Co Ltd | Surface shape detection method and device |
US7483147B2 (en) * | 2004-11-10 | 2009-01-27 | Korea Advanced Institute Of Science And Technology (Kaist) | Apparatus and method for measuring thickness and profile of transparent thin film using white-light interferometer |
JP5147468B2 (ja) * | 2008-03-11 | 2013-02-20 | キヤノン株式会社 | 計測装置および露光装置 |
JP5060678B2 (ja) * | 2008-05-08 | 2012-10-31 | 株式会社キーエンス | 光学式変位計 |
US9305341B2 (en) * | 2011-01-21 | 2016-04-05 | Christopher L. Claypool | System and method for measurement of through silicon structures |
KR101243337B1 (ko) * | 2011-05-30 | 2013-03-14 | 부산대학교 산학협력단 | 진동 잡음 효과 감쇄 특성을 갖는 광학 간섭계 시스템 |
JP2013024734A (ja) * | 2011-07-21 | 2013-02-04 | Nikon Corp | 形状測定装置および形状測定方法 |
KR20130044865A (ko) * | 2011-10-25 | 2013-05-03 | 삼성전기주식회사 | 시편 휨 특성 측정장치 |
TWI431240B (zh) * | 2011-11-21 | 2014-03-21 | Univ Southern Taiwan Tech | 三維量測系統 |
KR20130106178A (ko) * | 2012-03-19 | 2013-09-27 | (주)파이버프로 | 광학적 방법을 이용한 두께 및 형상 측정 장치 및 측정 방법 |
SG11201502436SA (en) * | 2012-09-28 | 2015-04-29 | Rudolph Technologies Inc | Inspection of substrates using calibration and imaging |
JPWO2015022851A1 (ja) * | 2013-08-15 | 2017-03-02 | 富士通株式会社 | 光干渉法を用いた計測装置及び光干渉法を用いた計測方法 |
-
2013
- 2013-10-11 JP JP2013213455A patent/JP6196119B2/ja active Active
-
2014
- 2014-09-03 TW TW103130497A patent/TWI634311B/zh active
- 2014-10-07 KR KR1020140134901A patent/KR101919639B1/ko active IP Right Grant
- 2014-10-09 US US14/511,159 patent/US20150106057A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR20150042713A (ko) | 2015-04-21 |
TW201518679A (zh) | 2015-05-16 |
TWI634311B (zh) | 2018-09-01 |
US20150106057A1 (en) | 2015-04-16 |
KR101919639B1 (ko) | 2018-11-16 |
JP2015075452A (ja) | 2015-04-20 |
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