JP6184832B2 - ゲートバルブ装置及びプラズマ処理装置 - Google Patents

ゲートバルブ装置及びプラズマ処理装置 Download PDF

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Publication number
JP6184832B2
JP6184832B2 JP2013219320A JP2013219320A JP6184832B2 JP 6184832 B2 JP6184832 B2 JP 6184832B2 JP 2013219320 A JP2013219320 A JP 2013219320A JP 2013219320 A JP2013219320 A JP 2013219320A JP 6184832 B2 JP6184832 B2 JP 6184832B2
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Japan
Prior art keywords
valve body
opening
processing container
valve
interposed
Prior art date
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Active
Application number
JP2013219320A
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English (en)
Japanese (ja)
Other versions
JP2015081633A (ja
Inventor
裕樹 鍋山
裕樹 鍋山
田中 誠治
誠治 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2013219320A priority Critical patent/JP6184832B2/ja
Priority to TW103135361A priority patent/TWI642868B/zh
Priority to KR20140141741A priority patent/KR20150046739A/ko
Priority to CN201410569365.6A priority patent/CN104576283B/zh
Publication of JP2015081633A publication Critical patent/JP2015081633A/ja
Application granted granted Critical
Publication of JP6184832B2 publication Critical patent/JP6184832B2/ja
Priority to KR1020180002099A priority patent/KR20180006473A/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K25/00Details relating to contact between valve members and seat
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K3/00Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
    • F16K3/02Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
    • F16K3/04Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with pivoted closure members
    • F16K3/06Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with pivoted closure members in the form of closure plates arranged between supply and discharge passages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/18Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/18Vacuum control means
    • H01J2237/186Valves
JP2013219320A 2013-10-22 2013-10-22 ゲートバルブ装置及びプラズマ処理装置 Active JP6184832B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013219320A JP6184832B2 (ja) 2013-10-22 2013-10-22 ゲートバルブ装置及びプラズマ処理装置
TW103135361A TWI642868B (zh) 2013-10-22 2014-10-13 Gate valve device and plasma processing device
KR20140141741A KR20150046739A (ko) 2013-10-22 2014-10-20 게이트 밸브 장치 및 플라즈마 처리 장치
CN201410569365.6A CN104576283B (zh) 2013-10-22 2014-10-22 闸阀装置和等离子体处理装置
KR1020180002099A KR20180006473A (ko) 2013-10-22 2018-01-08 게이트 밸브 장치 및 플라즈마 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013219320A JP6184832B2 (ja) 2013-10-22 2013-10-22 ゲートバルブ装置及びプラズマ処理装置

Publications (2)

Publication Number Publication Date
JP2015081633A JP2015081633A (ja) 2015-04-27
JP6184832B2 true JP6184832B2 (ja) 2017-08-23

Family

ID=53012353

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013219320A Active JP6184832B2 (ja) 2013-10-22 2013-10-22 ゲートバルブ装置及びプラズマ処理装置

Country Status (4)

Country Link
JP (1) JP6184832B2 (zh)
KR (2) KR20150046739A (zh)
CN (1) CN104576283B (zh)
TW (1) TWI642868B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6899697B2 (ja) * 2017-05-11 2021-07-07 東京エレクトロン株式会社 ゲートバルブ装置及び基板処理システム
US10636629B2 (en) * 2017-10-05 2020-04-28 Applied Materials, Inc. Split slit liner door
DE102019133555A1 (de) * 2019-12-09 2021-06-10 Vat Holding Ag Vakuumventil oder Vakuumtür
JP2023151607A (ja) 2022-03-31 2023-10-16 東京エレクトロン株式会社 ゲートバルブ装置及び半導体製造装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05196150A (ja) * 1991-09-30 1993-08-06 Tokyo Electron Yamanashi Kk ゲートバルブ
JPH10339377A (ja) * 1997-06-06 1998-12-22 Nec Corp ゲートバルブ
JP4547119B2 (ja) * 1999-06-02 2010-09-22 東京エレクトロン株式会社 真空処理装置
KR100595418B1 (ko) * 2004-07-27 2006-07-03 (주)아이씨디 알루미늄 플라즈마 챔버 및 그 제조 방법
US7699957B2 (en) * 2006-03-03 2010-04-20 Advanced Display Process Engineering Co., Ltd. Plasma processing apparatus
KR101020160B1 (ko) * 2006-03-03 2011-03-09 엘아이지에이디피 주식회사 플라즈마 처리장치
JP5243089B2 (ja) * 2008-04-09 2013-07-24 東京エレクトロン株式会社 プラズマ処理装置のシール構造、シール方法およびプラズマ処理装置
JP5190387B2 (ja) * 2009-01-16 2013-04-24 東京エレクトロン株式会社 真空装置及び基板処理装置
JP5342295B2 (ja) * 2009-03-27 2013-11-13 東京エレクトロン株式会社 ゲートバルブ装置
KR101124209B1 (ko) * 2010-07-26 2012-03-28 엘아이지에이디피 주식회사 플라즈마 처리장치
JP5806827B2 (ja) * 2011-03-18 2015-11-10 東京エレクトロン株式会社 ゲートバルブ装置及び基板処理装置並びにその基板処理方法

Also Published As

Publication number Publication date
TW201533358A (zh) 2015-09-01
KR20180006473A (ko) 2018-01-17
KR20150046739A (ko) 2015-04-30
JP2015081633A (ja) 2015-04-27
CN104576283B (zh) 2017-07-04
TWI642868B (zh) 2018-12-01
CN104576283A (zh) 2015-04-29

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