JP6170055B2 - Non-contact power feeding device - Google Patents

Description

  The present invention relates to a non-contact power supply device that supplies power to an electric load on a movable part in a non-contact manner, and more particularly to a cooling structure that cools the movable part.

  There are solder printing machines, component mounting machines, reflow machines, board inspection machines, etc. as board work equipment that produces boards with a large number of components mounted, and these are connected by a board transport device to build a board production line. There are many cases. Many of these substrate working devices include a movable portion that moves on the substrate and performs a predetermined operation, and a linear motor device can be used as one means for driving the movable portion. A linear motor device generally includes a track member in which N poles and S poles of a plurality of magnets are alternately arranged along a moving direction, and a movable portion configured to include an armature having a core and a coil. Is. Conventionally, a deformable power supply cable has been used to supply power to the electric load on the movable part. In recent years, the application of a non-contact power feeding device has been proposed in order to eliminate adverse effects such as an increase in the carrying weight due to a power feeding cable and a risk of disconnection due to metal fatigue.

  Conventionally, an electromagnetic induction method using a coil has been widely used as a method of a non-contact power feeding device, but recently, an electrostatic coupling method in which a capacitor is configured by electrodes facing each other has been used. In addition, a magnetic resonance method has been studied. Applications of contactless power supply devices are not limited to work equipment for substrates, but are spreading to a wide range of fields such as industrial equipment and household appliances in other industries, and their use in electric railways and electric vehicles is also being considered. ing.

  Returning to the substrate working equipment, the following electric loads are mounted on the movable part. For example, the mounting head, which is the movable part of the component mounting machine, is equipped with an air pump that generates negative pressure at the suction nozzle that picks up and picks up components, a drive motor that rotates and lifts the suction nozzle, and a controller for these. Has been. In addition, the inspection head, which is a movable part of the board inspection machine, is equipped with a camera for imaging the wiring pattern on the board and the mounting state of the components, its data transmission unit, and a control unit. Furthermore, the armature of the linear motor device is a kind of electric load. In order to dissipate the heat generated by the electric load on the movable part and suppress the temperature rise, there are cases where a radiating fin, a cooling fan, or the like is provided. A technical example of a cooling structure for this type of non-contact power feeding apparatus is disclosed in Patent Document 1.

  The power receiving device of Patent Document 1 is mounted on a vehicle and receives microwaves by a power receiving antenna. In addition to the power receiving antenna, the power receiving device includes a heat radiating unit attached to the chassis, and a cooling fan and a blower unit as a cooling unit for cooling the heat radiating unit. Furthermore, the energy supply system in which the power receiving device and the power transmission device are combined has a cooling unit on the side of the power transmission device that transmits microwaves. Accordingly, it is described that the heat generated in the power receiving antenna is absorbed by the heat radiating means and is cooled by the cooling air from the cooling fan, so that the temperature rise near the power receiving antenna can be suppressed.

Japanese Patent No. 4865450

  By the way, the power receiving device of Patent Document 1 includes a heat radiating unit and a cooling unit in a chassis (movable part). And the heat sink shown as a heat radiating means in the embodiment and the cooling fan shown as a cooling means have a considerable weight and require a large installation space. Therefore, the chassis (movable part) becomes thicker and longer than the members constituting the cooling structure, and the vehicle performance is degraded.

  Moreover, the energy supply system of patent document 1 has a cooling means in the power transmission apparatus side (fixed part side), and the point which can reduce the heavy enlargement of a chassis (movable part) is preferable. However, in the structure where the movable part is cooled remotely from the fixed part side, for example, when the movable part moves, the cooling air sent from the fixed part does not efficiently reach the radiation fins of the movable part, and the cooling performance is reduced. It tends to decline.

  Similar problems also occur in the non-contact power feeding device of the work equipment for substrates. That is, when a cooling structure is provided in a movable part such as a mounting head of a component mounting machine or an inspection head of a board inspection machine, the movable part becomes thicker by that amount. This causes a problem that it is necessary to increase the driving force for driving the movable part, a problem that the moving speed of the movable part is restricted, and the like. In addition, even if air is blown from the cooling fan on the fixed part side of the substrate working equipment, the movable part moves and the cooling performance tends to be lowered.

  The present invention has been made in view of the above problems of the background art, and can improve the cooling performance for cooling the movable part and suppress the temperature increase of the electric load on the movable part, and can reduce the size and weight of the movable part. Providing a non-contact power supply device is a problem to be solved.

The invention of the non-contact power feeding device according to claim 1 that solves the above-described problem includes a power feeding element provided in a fixed portion, a high-frequency power supply circuit that feeds high-frequency power to the power feeding element, and movable to the fixed portion Provided on the movable part mounted on the power supply element, receiving the high-frequency power in a non-contact manner and spaced apart from the power supply element, and converting the high-frequency power received by the power reception element on the movable part A non-contact power feeding device comprising a power receiving circuit for feeding power to an electric load, wherein the heat receiving member that promotes heat conduction from the electric load to the power receiving element and the fixed portion side is provided for the power receiving A cooling means for cooling the element , wherein the power feeding element and the power receiving element have a cross-sectional shape perpendicular to the moving direction of the movable part and a comb having a base part and a plurality of tooth parts extending from the base part. A mold, said plurality Tooth portions are comb electrodes fitted alternately while spaced from each other.
According to a second aspect of the present invention, in the first aspect, the cooling unit is an active cooling unit that actively cools the power receiving element.

The invention according to claim 3 is the refrigerant supply device according to claim 2 , wherein the active cooling means causes a refrigerant fluid to flow between the power feeding element and the power receiving element.

According to a fourth aspect of the present invention, in the third aspect , the power feeding element and the power receiving element are electrodes, respectively, and the refrigerant supply device supplies the refrigerant fluid from an ejection hole formed in the power feeding element. The ink is discharged between the power feeding element and the power receiving element.

According to a fifth aspect of the present invention, in the fourth aspect , the power feeding element has a heat radiation fin on the inner surface of the discharge hole.

A sixth aspect of the present invention is the cold radiation device according to the second aspect , wherein the active cooling means cools the power receiving element by cooling the power feeding element to cool the power receiving element.

According to a seventh aspect of the present invention, in the sixth aspect , each of the power feeding element and the power receiving element is an electrode, and the cold radiation device is disposed on a surface of the power feeding element that does not face the power receiving element. Including at least one of a Peltier element or a heat radiating fin.

The invention according to an eighth aspect is the invention according to any one of the first to seventh aspects, wherein the power receiving element radiates heat generated and conducted by the electric load on a surface that is spaced apart from the power feeding element. The power supply element has a heat absorption layer or a heat absorption surface that absorbs heat at a high absorptance on a surface that is spaced apart from the power receiving element.

In the invention of the non-contact power feeding device according to claim 1, the power receiving element that receives the high frequency power on the movable part is also used as the heat radiating fin, and heat conduction from the electric load to the power receiving element is promoted by the heat transfer member, The cooling means on the fixed part side cools the power receiving element. Thereby, the heat which generate | occur | produces with an electrical load can be dissipated efficiently, and a temperature rise can be suppressed. In addition, since the power receiving element necessary for non-contact power supply is also used as the heat radiating fin, a dedicated heat radiating fin is not required for the movable part, and the cooling means only needs to be provided in the fixed part. .
The power feeding element and the power receiving element are comb-shaped electrodes. In the comb-shaped electrode, a large electrode surface area is secured as compared with the planar electrode in order to increase the power supply power and improve the power supply efficiency. The large electrode surface area is advantageous in any of forced convection, cold radiation, and thermal radiation, and the power receiving element can be more efficiently cooled to further suppress the temperature increase of the electric load.

In the invention according to claim 2, the cooling means is active cooling means, and in the invention according to claim 3, the active cooling means is a refrigerant supply device for flowing a refrigerant fluid between the power feeding element and the power receiving element. It is said that. For example, cooling air, cooling oil, or the like can be used as the refrigerant fluid, and the power receiving element can be efficiently cooled by forced convection to suppress an increase in the temperature of the electric load.

In the invention according to claim 4 , each of the power feeding element and the power receiving element is an electrode, and the refrigerant supply device supplies the refrigerant fluid between the power feeding element and the power receiving element through an ejection hole formed in the power feeding element. To discharge. In the non-contact power feeding of the electrostatic coupling method using the feeding electrode and the receiving electrode, in order to increase the feeding power and increase the feeding efficiency, a large electrode area is secured and the distance between the parallel electrodes is reduced. . Therefore, first, heat radiation from the power receiving electrode to the power feeding electrode is efficiently performed, and a considerable amount of heat is dissipated from the power feeding electrode, thereby increasing an effective heat radiation area. Second, since the refrigerant fluid is discharged between the discharge holes of the power supply electrode, the entire amount of the refrigerant fluid is effectively used for cooling. Third, since the refrigerant fluid flows between the narrowed electrodes, both the power receiving electrode and the power feeding electrode can be efficiently cooled. With the above three overall actions, the power receiving electrode can be cooled extremely efficiently, and the temperature rise of the electric load can be remarkably suppressed.

In the invention according to claim 5 , since the power feeding electrode has the heat radiation fin on the inner surface of the discharge hole, the power feeding electrode is cooled more efficiently. Thereby, the temperature difference between the power receiving electrode and the power feeding electrode is increased, and the amount of heat radiation from the power receiving electrode to the power feeding electrode is increased, which can contribute to the suppression of the temperature rise of the electric load.

In the invention according to claim 6 , the active cooling means is a cold radiation apparatus that cools the power receiving element by cooling the power feeding element to cool the power receiving element. That is, if the power supply element is cooled to lower the temperature, the temperature difference from the power reception element increases, and the amount of heat radiation from the power reception element to the power supply element increases accordingly. Thereby, the power receiving element can be efficiently cooled, and the temperature rise of the electric load can be suppressed.

In the invention according to claim 7 , each of the power feeding element and the power receiving element is an electrode, and the cold radiation device includes at least one of a Peltier element or a radiation fin disposed on a surface of the power feeding element that does not face the power receiving element. Includes one. In the non-contact power feeding of the electrostatic coupling method using the feeding electrode and the receiving electrode, in order to increase the feeding power and increase the feeding efficiency, a large electrode area is secured and the distance between the parallel electrodes is reduced. . Therefore, cooling radiation is efficiently performed by cooling the power feeding electrode using a Peltier element or a radiation fin, and the power receiving electrode is cooled extremely efficiently, and the temperature rise of the electric load can be remarkably suppressed.

In the invention according to claim 8 , the power receiving element has a heat radiation layer or a heat radiation surface, and the power feeding element has a heat absorption layer or a heat absorption surface. As a result, the heat radiation from the power receiving element to the power feeding element spaced apart from the power receiving element is made efficient, and the effective heat radiation area increases. Furthermore, by cooperating with the cooling means, it is possible to efficiently dissipate the heat generated by the electric load and suppress the temperature rise.

It is the perspective view which showed the whole structure of the component mounting machine which can apply the non-contact electric power feeder of this invention. It is a lineblock diagram explaining the non-contact electric supply device of a 1st embodiment notionally. It is a block diagram which illustrates notionally the non-contact electric power feeder of 2nd Embodiment. It is a block diagram which illustrates notionally the non-contact electric power supply of 3rd Embodiment.

  First, a component mounter 10 to which the present invention can be applied will be described with reference to FIG. FIG. 1 is a perspective view showing the overall configuration of a component mounter 10 to which the non-contact power feeding device of the present invention can be applied. The component mounter 10 is a device that mounts a large number of components on a board, and is configured by two sets of component mounting units having the same structure arranged substantially symmetrically. Here, the component mounting unit in a state where the right front cover of FIG. 1 is removed will be described as an example. In the drawing, the width direction of the component mounter 10 from the left back side to the right front side in the figure is the X-axis direction, and the longitudinal direction of the component mounter 10 is the Y-axis direction.

  The component mounter 10 is configured by assembling a substrate transport device 110, a component supply device 120, two component transfer devices 130 and 140, and the like on a machine base 190. The board transfer device 110 is disposed so as to cross the vicinity of the center in the longitudinal direction of the component mounting machine 10 in the X-axis direction. The substrate transport device 110 has a transport conveyor (not shown) and transports the substrate in the X-axis direction. Moreover, the board | substrate conveyance apparatus 110 has an unillustrated clamp apparatus, and fixes and hold | maintains a board | substrate in a predetermined mounting operation position. The component supply device 120 is provided at the front portion (left front side in FIG. 1) and the rear portion (not visible in the drawing) of the component mounter 10. The component supply device 120 includes a plurality of cassette-type feeders 121, and supplies components continuously to the two component transfer devices 130 and 140 from the carrier tape set in each feeder 121.

The two component transfer devices 130 and 140 are so-called XY robot type devices that can move in the X-axis direction and the Y-axis direction. The two component transfer apparatuses 130 and 140 are disposed on the front side and the rear side in the longitudinal direction of the component mounter 10 so as to face each other. Each component transfer device 130, 140 has a linear motor mechanism 150 for movement in the Y-axis direction.

The linear motor mechanism 150 includes a track member 151 and an auxiliary rail 155 common to the two component transfer devices 130 and 140, and a linear movable portion 153 for each of the two component transfer devices 130 and 140. The track member 151 corresponds to a part of the fixed portion 2 of the present invention, and extends in the Y-axis direction that is the moving direction of the linear movable portion 153. The track member 151 includes a bottom surface disposed below the linear movable portion 153 and side surfaces disposed on both sides of the linear movable portion 153, and has a groove shape opening upward. A plurality of magnets 152 are arranged in a row along the Y-axis direction on the inner side of the facing side surfaces of the track member 151.

  The linear movable part 153 is movably mounted on the track member 151. The linear movable portion 153 corresponds to the movable portion 3 of the present invention, and includes a movable main body portion 160, an X-axis rail 161, a mounting head 170, and the like. The movable main body 160 extends in the Y-axis direction, and armatures that generate a propulsive force are disposed on opposite sides of the movable main body 160 so as to face the magnets 152 of the track member 151. The X-axis rail 161 extends from the movable main body 160 in the X-axis direction. One end 162 of the X-axis rail 161 is coupled to the movable main body 160 and the other end 163 is movably mounted on the auxiliary rail 155 so that the X-axis rail 161 moves integrally with the movable main body 160 in the Y-axis direction. It has become.

The mounting head 170 is mounted on the X-axis rail 161 and moves in the X-axis direction. A suction nozzle (not shown) is provided at the lower end of the mounting head 170 . The suction nozzle sucks and collects components from the component supply device 120 using negative pressure and mounts them on the substrate at the mounting work position. A ball screw feed mechanism (not shown) provided on the X-axis rail 161 is driven by an X-axis motor disposed in the movable main body 160 to drive the mounting head 170 in the X-axis direction.

  In addition, the component mounter 10 further includes a display setting device 180 for exchanging information with an operator, a camera (not shown) that images a board and components, and the like.

  The X-axis motor and armature on the movable main body 160 correspond to the electric load of the present invention that generates heat during operation and requires cooling. Also, other electrical components and control boards disposed on the movable main body 160 are part of the electrical load.

  A non-contact power feeding device 1 according to the first embodiment of the present invention is configured by including a cooling structure for cooling these electric loads. FIG. 2 is a configuration diagram conceptually illustrating the non-contact power feeding device 1 of the first embodiment. The non-contact power feeding device 1 is a device that performs non-contact power feeding by the electrostatic coupling method from the fixing unit 2 on the machine mount 190 side of the component mounting machine 10 to the movable unit 3 of the linear motor mechanism 150. The non-contact power feeding device 1 includes a power feeding element 21, a high frequency power supply circuit 25, a power receiving element 31, a power receiving circuit 35, a heat transfer member 4, a refrigerant supply device 5 as active cooling means, and the like. In FIG. 2, broken arrows E1 to E4 indicate the flow of electric power, and solid arrows H1 to H3 indicate the flow of the refrigerant fluid.

  The two power supply elements 21 are power supply electrodes provided on the fixed portion 2 and are formed of a metal material. The power feeding element 21 is disposed over substantially the entire length of the track member 151 of the fixed portion 2. The high frequency power supply circuit 25 is disposed in the fixed portion 2 and outputs high frequency power. One of the two output terminals of the high frequency power supply circuit 25 is connected to the first power feeding element 21 by the power line 251 and the other is connected to the second power feeding element 21. The output frequency of the high-frequency power supply circuit 25 can exemplify a 100 kHz to MHz band, and the output voltage waveform can be exemplified by a sine wave or a rectangular wave.

  The two power receiving elements 31 are power receiving electrodes provided on the movable portion 3 and are formed of a metal material. The power receiving element 31 and the power feeding element 21 have a large facing area in order to obtain predetermined power feeding power, and are disposed facing each other with a slight separation distance. Therefore, the two power receiving elements 31 and the power feeding element 21 electrically form two sets of parallel plate capacitors. Even when the movable part 3 is driven by the linear motor mechanism 150, the separation distance is kept substantially constant, and the capacitance of the parallel plate capacitor is also kept substantially constant.

The power receiving circuit 35 is provided in the movable portion 3, transforms the high frequency power input from the power receiving element 31, and outputs it to the electric load 91. Specifically, the electrical load 91 to be fed by non-contact power feeding is the X-axis motor, armature, electrical component, control board, and the like on the movable main body 160 described above. In FIG. 2, the electric load 91 is divided into two parts, but is not limited thereto, and may actually be three or more. Further, the operating voltages of the plurality of electric loads 91 may be different.

  One of the input terminals of the power receiving circuit 35 is connected to the first power receiving element 31 by the power line 351, and the other is connected to the second power receiving element 31. An output terminal of the power receiving circuit 35 is connected to the electric load 91 by a power supply line 352. The electric load 91 may be either a DC load or an AC load, and the magnitude of the operating voltage is not limited, but the power receiving circuit 35 needs to have a voltage output function corresponding to the electric load 91. As the power receiving circuit 35, for example, a full-wave rectifier circuit that converts input high-frequency power into DC power, an inverter circuit that converts it into commercial-frequency AC power, or the like can be used. Further, when the operating voltages and frequencies of the plurality of electric loads 91 are different, a multi-output type power receiving circuit 35 can be used.

  As shown in FIG. 2, the high-frequency power supply circuit 25, the two power feeding elements 21, the two power receiving elements 31, and the power receiving circuit 35 are closed to perform non-contact power feeding to the electric load 91 by an electrostatic coupling method. A circuit is configured. The high-frequency power output from the high-frequency power supply circuit 25 is input to the two power feeding elements 21 via the power supply line 251 (broken line arrow E1 in FIG. 2), and the two high-frequency powers are caused by the electrostatic coupling action of the parallel plate capacitor. Contactless power is supplied to the power receiving element 31 (broken line arrow E2). Further, the high frequency power received by the two power receiving elements 31 is input to the power receiving circuit 35 via the power line 351 (broken line arrow E3), transformed inside the power receiving circuit 35, and fed to the electric load 91. (Dashed arrow E4). As a result, the electrical load 91 operates and heat loss occurs.

  Next, a cooling structure (thermal configuration) of the contactless power supply device 1 of the embodiment will be described. The heat transfer member 4 is disposed between the electric load 91 and the power receiving element 31. The heat transfer member 4 is a member that promotes heat conduction from the electrical load 91 to the power receiving element 31 and maintains electrical insulation between the two. For the heat transfer member 4, for example, a heat transfer sheet formed of a material having a relatively high thermal conductivity among resins can be used. The heat transfer member 4 is preferably thin as long as the heat transfer member 4 is in close contact with both the electric load 91 and the power receiving element 31 and can conduct heat well, and limits such as electrical insulation and mechanical strength are allowed.

The power receiving element 31 has a heat radiation layer 32 on the surface facing the power feeding element 21 at a distance. The heat radiation layer 32 radiates heat generated and conducted by the electrical load 91 with high emissivity. For the heat radiation layer 32, for example, a sheet material or a coating film formed by including a functional material that converts heat into far infrared rays and emits it can be used. A plurality of types of functional materials that convert heat into far-infrared rays and radiate them are already on the market, but their chemical composition and the like are hardly disclosed. However, the surface of the power receiving element 31 may be a black painted surface having a high thermal emissivity, instead of the heat radiation layer 32. Furthermore, it may be a plated surface with a high thermal emissivity, or a processed surface with a high thermal emissivity by providing minute irregularities.

  Moreover, by forming the heat radiation layer 32 with an insulating material, it can also serve as an insulating layer. As a result, the heat radiation layer 32 can reinforce the electrical insulation between the power receiving element 31 and the power feeding element 21 and improve the insulation performance.

  On the other hand, the power feeding element 21 on the fixed portion 2 side has a heat absorption layer 22 that absorbs heat at a high absorption rate on the surface that is spaced apart from the power receiving element 31. The heat absorption layer 22 may have the same configuration as the heat radiation layer 32 of the power receiving element 31 or may have a different configuration. Furthermore, similarly to the heat radiation layer 32, the heat absorption layer 22 can be replaced with a black painted surface, a plated surface, a processed surface, or the like. Similarly, the heat absorption layer 22 can be formed of an insulating material and can also serve as an insulating layer.

  In addition, a large number of discharge holes 23 are formed in the power feeding element 21, and six are illustrated in FIG. 2. The discharge hole 23 is drilled from the back surface of the power feeding element 21 through the heat absorption layer 22 on the front surface side. The outlet of the discharge hole 23 opens toward the power receiving element 31. On the inner surface of the discharge hole 23, small uneven fins 24 are formed.

  Further, a refrigerant supply device 5 as an active cooling means is disposed on the fixed portion 2 side. The refrigerant supply device 5 discharges the refrigerant fluid between the power supply element 21 and the power reception element 31 from the discharge hole 23 formed in the power supply element 21. In the first embodiment, cooling air is used as the refrigerant fluid, and an air pump is used as the refrigerant supply device 5. An air duct 51 is formed between the refrigerant supply device 5 and the inlet of the discharge hole 23 so as not to leak. The air duct 51 can be formed, for example, with the bottom surface of the track member 151 of the fixed portion 2 being a double bottom.

  When the refrigerant supply device 5 operates, the cooling air is sucked from outside air and supplied to the air duct 51. The cooling air is supplied to the inlet of the discharge hole 23 via the air duct 51 (solid arrow H1 in FIG. 2). The cooling air passes through the discharge hole 23 (solid arrow H2), hits the radiation fin 24 at that time, and cools the power feeding element 21. Thereafter, the cooling air is discharged from the outlet of the discharge hole 23 between the power feeding element 21 and the power receiving element 31. The discharge state of the cooling air in the power supply element 21 is similar in image to the operation state of a game machine called air hockey. The discharged cooling air flows between the power feeding element 21 and the power receiving element 31 (solid arrow H3), cools both the elements 21 and 31 by forced convection, and is finally exhausted to the outside.

  It is also possible to employ a configuration in which cooling oil is used as the refrigerant fluid and an oil pump is used as the refrigerant supply device 5 to circulate and use the cooling oil. In this case, a supply oil duct is provided instead of the air duct 51 from the refrigerant supply device 5 to the inlet of the discharge hole 23, and in addition, the cooling oil discharged from between the power feeding element 21 and the power receiving element 31 is supplied. A recovery oil duct is provided to return to the oil pump. Moreover, refrigerant fluids other than cooling air and cooling oil can also be used.

  Next, the cooling effect | action and effect of the non-contact electric power feeder 1 of 1st Embodiment comprised as mentioned above are demonstrated. A part of the total amount of heat generated by the electrical load 91 is directly dissipated from the surface of the movable portion 3 to the outside, but the other amount of heat is conducted to the power receiving element 31 via the heat transfer member 4. The power receiving element 31 is also used as a heat radiation fin, and heat conduction from the electric load 9 to the power receiving element 31 is promoted by the heat transfer member 4.

The heat of the power receiving element 31 is radiated into the air by the action of the heat radiation layer 32, and most of the radiated heat is absorbed by the power feeding element 21 by the action of the heat absorption layer 22. Here, each of the power feeding element 21 and the power receiving element 31 is an electrode, a large electrode area is ensured, and the distance between the parallel electrodes is narrowed. Therefore, heat radiation from the power receiving element 31 to the power feeding element 21 is efficiently performed, and considerable heat is also dissipated from the power feeding element 21 to the outside. Thereby, both the elements 21 and 31 play the role of a radiation fin, and an effective heat radiation area increases.

Furthermore, forced convection cooling with cooling air is performed as active cooling. That is, both elements 21 and 31 are forcedly convectively cooled by the cooling air flowing between the power feeding element 21 and the power receiving element 31. Here, since the coolant fluid is discharged between the elements 21 and 31 from the discharge hole 23 of the power supply element 21 , the entire amount of the cooling air is effectively used for cooling. Further, since the cooling air passes between the narrowed elements 21 and 31 , both the power receiving element 31 and the power feeding element 21 can be efficiently cooled. Further, the power feeding element 21 is cooled by forced convection cooling by the heat dissipating fins 24 on the inner surface of the discharge hole 23 to be further efficiently cooled.

With the above comprehensive action, the power receiving element 31 can be cooled extremely efficiently, and the temperature rise of the electric load 91 can be remarkably suppressed. In addition, since the power receiving element 31 necessary for the non-contact power supply is also used as the radiation fin, the movable portion 3 does not need a dedicated radiation fin. In addition, the refrigerant supply device 5 can be provided on the fixed portion 2 side. Therefore, the movable part 3 can be reduced in size and weight. Thereby, the driving force for driving the movable part 3 can be small, and the restriction on the moving speed of the movable part 3 is reduced.

  Next, the non-contact power feeding apparatus 1A of the second embodiment having a different active cooling means will be described mainly with respect to differences from the first embodiment. FIG. 3 is a configuration diagram conceptually illustrating the contactless power feeding device 1A of the second embodiment. The non-contact power feeding apparatus 1A of the second embodiment includes the same high frequency power supply circuit 25, power receiving element 31, power receiving circuit 35, and heat transfer member 4 as in the first embodiment, and is provided in the refrigerant supply apparatus 5 as active cooling means. Instead, a cold radiation device is provided. In FIG. 3, dashed arrows E1 to E4 indicate the flow of power as in the first embodiment.

  The power feeding element 21A on the fixing portion 2A side of the second embodiment has the same heat absorption layer 22 as that of the first embodiment, and does not have the discharge holes 23. The Peltier element 6 as a cold radiation device is provided on the back surface of the power feeding element 21A opposite to the heat absorption layer 22. The Peltier element 6 utilizes a Peltier effect in which heat is transferred from one metal to the other when a current is passed through a joint between two kinds of metals. The endothermic surface 61 of the Peltier element 6 on the low temperature side is attached to the power feeding element 21A, and the heat dissipation surface 62 on the high temperature side is naturally cooled by the outside air.

  Furthermore, the power feeding element 21A includes heat radiating fins 7 as cold radiation devices on both narrow end faces. In addition, in 2nd Embodiment, although both the Peltier device 6 and the radiation fin 7 are provided, it is not limited to this. In other words, as long as the power feeding element 21A can be sufficiently cooled, only one of the elements may be provided, or another means may be provided as a cold radiation device.

  Next, the cooling action and effects of the non-contact power feeding apparatus 1A of the second embodiment will be described. A part of the total amount of heat generated by the electrical load 91 is directly dissipated from the surface of the movable portion 3 to the outside, but the other amount of heat is conducted to the power receiving element 31 via the heat transfer member 4. The power receiving element 31 is also used as a heat radiation fin, and heat conduction from the electric load 9 to the power receiving element 31 is promoted by the heat transfer member 4.

On the other hand, the power feeding element 21 </ b> A is cooled by the Peltier element 6 and the heat radiating fins 7, and the temperature thereof decreases, and the temperature difference from the power receiving element 31 increases. Thereby, cold radiation from the power feeding element 21A to the power receiving element 31 is performed. Here, each of the power feeding element 21A and the power receiving element 31 is an electrode, a large electrode area is ensured, and the distance between the parallel electrodes is narrowed. Therefore, cold radiation is performed efficiently, and the amount of heat radiation from the power receiving element 31 to the power feeding element 21A increases by an amount corresponding to the cold radiation. Therefore, the power receiving element 31 can be cooled extremely efficiently, and the temperature rise of the electric load 91 can be remarkably suppressed.

  Further, similarly to the first embodiment, the movable portion 3 can be reduced in size and weight, the driving force for driving the movable portion 3 can be small, and the restriction on the moving speed of the movable portion 3 is reduced.

  Next, with respect to the non-contact power feeding device 1B of the third embodiment in which the shapes of the power feeding element 21B and the power receiving element 31B are different, differences from the first and second embodiments will be mainly described. FIG. 4 is a configuration diagram conceptually illustrating the non-contact power feeding device 1B of the third embodiment. The non-contact power feeding device 1B of the third embodiment includes the same high-frequency power supply circuit 25, power receiving circuit 35, heat transfer member 4, and refrigerant supply device 5 as in the first embodiment, and the power feeding element 21B and the power receiving element 31B are combs. Type electrode. In FIG. 4, dashed arrows E1 to E4 indicate the flow of electric power as in the first embodiment.

  In the third embodiment, the power feeding element 21B on the fixed portion 2B side is an electrode having a comb-shaped cross section as illustrated. More specifically, two rectangular cross-section tooth portions 27 are erected apart from the upper surface of the horizontally extending base portion 26 vertically upward. The surfaces of the base portion 26 and the tooth portion 27 that are spaced apart from the power receiving element 31B are covered with the heat absorption layer 22B. In addition, a large number of discharge holes 23B are formed in the power feeding element 21B, and six are illustrated in FIG. The discharge hole 23B is drilled through the base portion 26 and the heat absorption layer 22B. The outlet of the discharge hole 23B opens toward the power receiving element 31B. In the third embodiment, no radiation fin is attached to the inner surface of the discharge hole 23B.

  On the other hand, the power receiving element 31B on the movable portion 3B side is also an electrode having a comb-shaped cross section. More specifically, three rectangular cross-sectioned tooth portions 37 are erected apart from the lower surface of the horizontally extending base portion 36 in a vertically downward direction. The surfaces of the base portion 36 and the tooth portion 37 facing the power feeding element 21B are covered with the heat radiation layer 32B.

  The power feeding element 21 </ b> B and the power receiving element 31 </ b> B are used in a state where the tooth portions 27 and 37 are alternately fitted while being separated from each other by a substantially constant separation distance. This state is maintained even if the movable part 3 moves in the Y-axis direction (the front and back direction on the paper). In addition, in order to make FIG. 4 easy to see, the case where there are two tooth portions 27 and three tooth portions 37 is illustrated, but in practice, a larger number of tooth portions are provided and alternately fitted. Can do.

  In the third embodiment, the capacitor composed of the power feeding element 21B and the power receiving element 31B has a significantly increased surface area opposed to the first embodiment, and the capacitance is significantly increased. Further, the surface area that contributes to thermal radiation from the power receiving element 31B to the power feeding element 21B is also greatly increased. Further, the refrigerant fluid is discharged from the refrigerant supply device 5 between the power receiving element 31B and the power feeding element 21B via the discharge hole 23B, and the cooling surface area is greatly expanded even in the forced convection cooling.

  As described above, in the third embodiment, the surface area that contributes to thermal radiation and forced convection cooling is significantly expanded compared to the first embodiment. Therefore, the power receiving element 31B can be cooled extremely efficiently, and the temperature rise of the electric load 91 can be remarkably suppressed. Further, similarly to the first embodiment, the movable portion 3 can be reduced in size and weight, the driving force for driving the movable portion 3 can be small, and the movement speed restriction of the movable portion 3 is small.

  The first to third embodiments can be used in combination, and for example, both the refrigerant supply device 5 and the Peltier element 6 may be provided. Further, the present invention is preferably applied to the electrostatic coupling type non-contact power feeding devices 1, 1 </ b> A, and 1 </ b> B, but can also be applied to other types of non-contact power feeding devices such as an electromagnetic induction method and a magnetic field resonance method. Various other applications and modifications are possible for the present invention.

  The non-contact power feeding device of the present invention is not limited to work equipment for substrates such as component mounting machines, but also to industrial equipment of other industries that have movable parts and need non-contact power feeding. Widely available. Further, it can be used for a non-contact power supply without using a pantograph or the like to a running train, or a non-contact power supply from a road surface to a running electric vehicle.

1: Non-contact power feeding device 2, 2A, 2B: Fixed portion 21, 21A, 21B: Power feeding element 22, 22B: Heat absorption layer 23, 23B: Discharge hole 24: Radiation fin 25: High frequency power supply circuit 26: Base 27: Tooth part 3, 3B: Movable part 31, 31B: Power receiving element 32, 32B: Thermal radiation layer 35: Power receiving circuit 36: Base part 37: Tooth part 4: Heat transfer member 5: Refrigerant supply device 51: Air duct 6: Peltier element (Cool radiation device)
61: endothermic surface 62: heat radiating surface 7: heat radiating fin (cold radiation device)
91: Electric load 10: Component mounter 110: Board transfer device 120: Component supply device 130, 140: Component transfer device 150: Linear motor mechanism 151: Track member 160: Movable main body 161: X-axis rail 170: Mounting head 180: Display setting device 190: Machine base

Claims (8)

A power feeding element provided in the fixed portion;
A high frequency power supply circuit for supplying high frequency power to the power supply element;
A power receiving element that is provided in a movable part that is movably mounted on the fixed part, and that receives the high frequency power in a non-contact manner, spaced apart from the power feeding element;
A non-contact power feeding device comprising: a power receiving circuit that converts high frequency power received by the power receiving element and supplies power to the electric load on the movable part;
A heat transfer member that promotes conduction of heat from the electrical load to the power receiving element;
Cooling means provided on the fixed portion side for cooling the power receiving element ,
The power feeding element and the power receiving element are comb-shaped in which a cross-sectional shape perpendicular to the moving direction of the movable part is a base part and a plurality of tooth parts extending from the base part. A non-contact power feeding device which is a comb-shaped electrode which is alternately fitted while being separated from each other .
Non-contact power feeding device.   The contactless power feeding device according to claim 1, wherein the cooling unit is an active cooling unit that actively cools the power receiving element. 3. The non-contact power feeding device according to claim 2 , wherein the active cooling means is a refrigerant supply device that causes a refrigerant fluid to flow between the power feeding element and the power receiving element. In claim 3 ,
Each of the power feeding element and the power receiving element is an electrode,
The refrigerant supply device is a non-contact power supply device that discharges the refrigerant fluid between the power supply element and the power receiving element from a discharge hole formed in the power supply element. 5. The non-contact power feeding device according to claim 4 , wherein the power feeding element has a heat radiation fin on an inner surface of the discharge hole. 3. The non-contact power feeding device according to claim 2 , wherein the active cooling means is a cold radiation device that cools the power receiving element by performing cold radiation by cooling the power feeding element. In claim 6 ,
Each of the power feeding element and the power receiving element is an electrode,
The said cold radiation apparatus is a non-contact electric power feeding apparatus containing at least one of the Peltier element or the radiation fin arrange | positioned in the surface which does not oppose the said electric power receiving element of the said electric power feeding element. In any one of Claims 1-7 ,
The power receiving element has a heat radiating layer or a heat radiating surface that radiates heat generated and conducted by the electric load at a high emissivity on a surface facing the power feeding element.
The non-contact power feeding device, wherein the power feeding element has a heat absorbing layer or a heat absorbing surface that absorbs heat at a high absorption rate on a surface facing the power receiving element.

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