WO2014045375A1 - Contactless power supply device - Google Patents

Contactless power supply device Download PDF

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Publication number
WO2014045375A1
WO2014045375A1 PCT/JP2012/074091 JP2012074091W WO2014045375A1 WO 2014045375 A1 WO2014045375 A1 WO 2014045375A1 JP 2012074091 W JP2012074091 W JP 2012074091W WO 2014045375 A1 WO2014045375 A1 WO 2014045375A1
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WO
WIPO (PCT)
Prior art keywords
power
power feeding
power receiving
receiving element
heat
Prior art date
Application number
PCT/JP2012/074091
Other languages
French (fr)
Japanese (ja)
Inventor
将志 沖
壮志 野村
慎二 瀧川
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2012/074091 priority Critical patent/WO2014045375A1/en
Priority to JP2014536478A priority patent/JP6170055B2/en
Publication of WO2014045375A1 publication Critical patent/WO2014045375A1/en

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/005—Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/05—Circuit arrangements or systems for wireless supply or distribution of electric power using capacitive coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/0885—Power supply

Definitions

  • the present invention relates to a non-contact power supply device that supplies power to an electric load on a movable part in a non-contact manner, and more particularly to a cooling structure that cools the movable part.
  • a linear motor device generally includes a track member in which N poles and S poles of a plurality of magnets are alternately arranged along a moving direction, and a movable portion configured to include an armature having a core and a coil. Is.
  • an electromagnetic induction method using a coil has been widely used as a method of a non-contact power feeding device, but recently, an electrostatic coupling method in which a capacitor is configured by electrodes facing each other has been used.
  • a magnetic resonance method has been studied.
  • Applications of contactless power supply devices are not limited to work equipment for substrates, but are spreading to a wide range of fields such as industrial equipment and household appliances in other industries, and their use in electric railways and electric vehicles is also being considered. ing.
  • the mounting head which is the movable part of the component mounting machine, is equipped with an air pump that generates negative pressure at the suction nozzle that picks up and picks up components, a drive motor that rotates and lifts the suction nozzle, and a controller for these.
  • the inspection head which is a movable part of the board inspection machine, is equipped with a camera for imaging the wiring pattern on the board and the mounting state of the components, its data transmission unit, and a control unit.
  • the armature of the linear motor device is a kind of electric load.
  • Patent Document 1 A technical example of a cooling structure for this type of non-contact power feeding apparatus is disclosed in Patent Document 1.
  • the power receiving device of Patent Document 1 is mounted on a vehicle and receives microwaves by a power receiving antenna.
  • the power receiving device includes a heat radiating unit attached to the chassis, and a cooling fan and a blower unit as a cooling unit for cooling the heat radiating unit.
  • the energy supply system in which the power receiving device and the power transmission device are combined has a cooling unit on the side of the power transmission device that transmits microwaves. Accordingly, it is described that the heat generated in the power receiving antenna is absorbed by the heat radiating means and is cooled by the cooling air from the cooling fan, so that the temperature rise near the power receiving antenna can be suppressed.
  • the power receiving device of Patent Document 1 has a heat radiating means and a cooling means in a chassis (movable part).
  • the heat sink shown as a heat radiating means in the embodiment and the cooling fan shown as a cooling means have a considerable weight and require a large installation space. Therefore, the chassis (movable part) becomes thicker and longer than the members constituting the cooling structure, and the vehicle performance is degraded.
  • the energy supply system of Patent Document 1 has a cooling means on the power transmission device side (fixed portion side), and is preferable in that the increase in the thickness of the chassis (movable portion) can be reduced.
  • the cooling air sent from the fixed part does not efficiently reach the radiation fins of the movable part, and the cooling performance is reduced. It tends to decline.
  • the present invention has been made in view of the above problems of the background art, and can improve the cooling performance for cooling the movable part and suppress the temperature increase of the electric load on the movable part, and can reduce the size and weight of the movable part.
  • Providing a non-contact power supply device is a problem to be solved.
  • the invention of the non-contact power feeding device includes a power feeding element provided in a fixed portion, a high-frequency power supply circuit that feeds high-frequency power to the power feeding element, and movable to the fixed portion Provided on the movable part mounted on the power supply element, receiving the high-frequency power in a non-contact manner and spaced apart from the power supply element, and converting the high-frequency power received by the power reception element on the movable part
  • a non-contact power feeding device comprising a power receiving circuit for feeding power to an electric load, wherein the heat receiving member that promotes heat conduction from the electric load to the power receiving element and the fixed portion side is provided for the power receiving And an active cooling means for actively cooling the device.
  • the invention according to claim 2 is the refrigerant supply device according to claim 1, wherein the active cooling means causes a refrigerant fluid to flow between the power feeding element and the power receiving element.
  • the power feeding element and the power receiving element are electrodes, respectively, and the refrigerant supply device supplies the refrigerant fluid from a discharge hole formed in the power feeding element.
  • the ink is discharged between the power feeding element and the power receiving element.
  • the power feeding element has a heat radiation fin on the inner surface of the discharge hole.
  • the invention according to claim 5 is the cooling radiation device according to claim 1, wherein the active cooling means cools the power receiving element by cooling the power feeding element to cool the power receiving element.
  • the power feeding element and the power receiving element are electrodes, respectively, and the cold radiation device is disposed on a surface of the power feeding element that does not face the power receiving element.
  • the power receiving element radiates heat generated and conducted by the electrical load with high radiation on a surface that is spaced apart from the power feeding element.
  • the power supply element has a heat absorption layer or a heat absorption surface that absorbs heat at a high absorptance on a surface that is spaced apart from the power receiving element.
  • a cross-sectional shape perpendicular to a moving direction of the movable portion extends from the base portion and the base portion.
  • a comb-shaped electrode composed of a plurality of tooth portions, wherein the plurality of tooth portions are alternately fitted while being spaced apart from each other.
  • the power receiving element that receives the high frequency power on the movable part is also used as the heat radiating fin, and heat conduction from the electric load to the power receiving element is promoted by the heat transfer member,
  • the active cooling means on the fixed part side cools the power receiving element.
  • produces with an electrical load can be dissipated efficiently, and a temperature rise can be suppressed.
  • the power receiving element necessary for non-contact power supply is also used as the heat radiating fin, a dedicated heat radiating fin is not required for the movable part, and the active cooling means only needs to be provided in the fixed part. it can.
  • the active cooling means is a refrigerant supply device for flowing a refrigerant fluid between the power feeding element and the power receiving element.
  • a refrigerant fluid for example, cooling air, cooling oil, or the like can be used as the refrigerant fluid, and the power receiving element can be efficiently cooled by forced convection to suppress an increase in the temperature of the electric load.
  • each of the power feeding element and the power receiving element is an electrode
  • the refrigerant supply device supplies the refrigerant fluid between the power feeding element and the power receiving element through a discharge hole formed in the power feeding element.
  • the refrigerant fluid is discharged between the discharge holes of the power supply electrode, the entire amount of the refrigerant fluid is effectively used for cooling.
  • the refrigerant fluid flows between the narrowed electrodes, both the power receiving electrode and the power feeding electrode can be efficiently cooled. With the above three overall actions, the power receiving electrode can be cooled extremely efficiently, and the temperature rise of the electric load can be remarkably suppressed.
  • the power supply electrode since the power supply electrode has the radiation fin on the inner surface of the discharge hole, the power supply electrode is cooled more efficiently. Thereby, the temperature difference between the power receiving electrode and the power feeding electrode is increased, and the amount of heat radiation from the power receiving electrode to the power feeding electrode is increased, which can contribute to the suppression of the temperature rise of the electric load.
  • the active cooling means is a cold radiation device that cools the power receiving element by cooling the power feeding element to cool the power receiving element. That is, if the power supply element is cooled to lower the temperature, the temperature difference from the power reception element increases, and the amount of heat radiation from the power reception element to the power supply element increases accordingly. Thereby, the power receiving element can be efficiently cooled, and the temperature rise of the electric load can be suppressed.
  • each of the power feeding element and the power receiving element is an electrode
  • the cold radiation device includes at least one of a Peltier element or a radiation fin disposed on a surface of the power feeding element that does not face the power receiving element.
  • the non-contact power feeding of the electrostatic coupling method using the feeding electrode and the receiving electrode in order to increase the feeding power and increase the feeding efficiency, a large electrode area is secured and the distance between the parallel electrodes is reduced. . Therefore, cooling radiation is efficiently performed by cooling the power feeding electrode using a Peltier element or a radiation fin, and the power receiving electrode is cooled extremely efficiently, and the temperature rise of the electric load can be remarkably suppressed.
  • the power receiving element has a heat radiation layer or a heat radiation surface
  • the power feeding element has a heat absorption layer or a heat absorption surface.
  • the power feeding element and the power receiving element are comb-shaped electrodes.
  • a large electrode surface area is secured as compared with the planar electrode in order to increase the power supply power and improve the power supply efficiency.
  • the large electrode surface area is advantageous in any of forced convection, cold radiation, and thermal radiation, and the power receiving element can be more efficiently cooled to further suppress the temperature increase of the electric load.
  • FIG. 1 is a perspective view showing the overall configuration of a component mounter 10 to which the non-contact power feeding device of the present invention can be applied.
  • the component mounter 10 is a device that mounts a large number of components on a board, and is configured by two sets of component mounting units having the same structure arranged substantially symmetrically.
  • the component mounting unit in a state where the right front cover of FIG. 1 is removed will be described as an example.
  • the width direction of the component mounter 10 from the left back side to the right front side in the figure is the X-axis direction
  • the longitudinal direction of the component mounter 10 is the Y-axis direction.
  • the component mounter 10 is configured by assembling a substrate transport device 110, a component supply device 120, two component transfer devices 130, 140, and the like on a machine base 190.
  • the board transfer device 110 is disposed so as to cross the vicinity of the center in the longitudinal direction of the component mounting machine 10 in the X-axis direction.
  • the substrate transport device 110 has a transport conveyor (not shown) and transports the substrate in the X-axis direction.
  • substrate conveyance apparatus 110 has an unillustrated clamp apparatus, and fixes and hold
  • the component supply device 120 is provided at the front portion (left front side in FIG. 1) and the rear portion (not visible in the drawing) of the component mounter 10.
  • the component supply device 120 includes a plurality of cassette-type feeders 121, and supplies components continuously to the two component transfer devices 130 and 140 from the carrier tape set in each feeder 121.
  • the two component transfer devices 130 and 140 are so-called XY robot type devices that can move in the X-axis direction and the Y-axis direction.
  • the two component transfer apparatuses 130 and 140 are disposed on the front side and the rear side in the longitudinal direction of the component mounter 10 so as to face each other.
  • Each component transfer device 130, 140 has a linear motor device 150 for movement in the Y-axis direction.
  • the linear motor device 150 includes a track member 151 and an auxiliary rail 155 common to the two component transfer devices 130 and 140, and a linear movable portion 153 for each of the two component transfer devices 130 and 140.
  • the track member 151 corresponds to a part of the fixed portion 2 of the present invention, and extends in the Y-axis direction that is the moving direction of the linear movable portion 153.
  • the track member 151 includes a bottom surface disposed below the linear movable portion 153 and side surfaces disposed on both sides of the linear movable portion 153, and has a groove shape opening upward.
  • a plurality of magnets 152 are arranged in a row along the Y-axis direction on the inner side of the facing side surfaces of the track member 151.
  • the linear movable part 153 is movably mounted on the track member 151.
  • the linear movable portion 153 corresponds to the movable portion 3 of the present invention, and includes a movable main body portion 160, an X-axis rail 161, a mounting head 170, and the like.
  • the movable main body 160 extends in the Y-axis direction, and armatures that generate a propulsive force are disposed on opposite sides of the movable main body 160 so as to face the magnets 152 of the track member 151.
  • the X-axis rail 161 extends from the movable main body 160 in the X-axis direction.
  • One end 162 of the X-axis rail 161 is coupled to the movable main body 160 and the other end 163 is movably mounted on the auxiliary rail 155 so that the X-axis rail 161 moves integrally with the movable main body 160 in the Y-axis direction. It has become.
  • the component mounting head 170 is mounted on the X-axis rail 161 and moves in the X-axis direction.
  • a suction nozzle (not shown) is provided at the lower end of the component mounting head 170. The suction nozzle sucks and collects components from the component supply device 120 using negative pressure and mounts them on the substrate at the mounting work position.
  • a ball screw feed mechanism (not shown) provided on the X-axis rail 161 is driven by an X-axis motor disposed in the movable main body 160 to drive the component mounting head 170 in the X-axis direction.
  • the component mounter 10 further includes a display setting device 180 for exchanging information with an operator, a camera (not shown) that images a board and components, and the like.
  • the X-axis motor and armature on the movable main body 160 correspond to the electric load of the present invention that generates heat during operation and requires cooling. Also, other electrical components and control boards disposed on the movable main body 160 are part of the electrical load.
  • the non-contact power feeding device 1 is configured to include a cooling structure for cooling these electric loads.
  • FIG. 2 is a configuration diagram conceptually illustrating the non-contact power feeding device 1 of the first embodiment.
  • the non-contact power feeding device 1 is a device that performs non-contact power feeding by the electrostatic coupling method from the fixing unit 2 on the machine mount 190 side of the component mounting machine 10 to the movable unit 3 of the linear motor mechanism 150.
  • the non-contact power feeding device 1 includes a power feeding element 21, a high frequency power supply circuit 25, a power receiving element 31, a power receiving circuit 35, a heat transfer member 4, a refrigerant supply device 5 as active cooling means, and the like.
  • broken arrows E1 to E4 indicate the flow of electric power
  • solid arrows H1 to H3 indicate the flow of refrigerant fluid.
  • the two power supply elements 21 are power supply electrodes provided on the fixed portion 2 and are formed of a metal material.
  • the power feeding element 21 is disposed over substantially the entire length of the track member 151 of the fixed portion 2.
  • the high frequency power supply circuit 25 is disposed in the fixed portion 2 and outputs high frequency power.
  • One of the two output terminals of the high frequency power supply circuit 25 is connected to the first power feeding element 21 by the power line 251 and the other is connected to the second power feeding element 21.
  • the output frequency of the high-frequency power supply circuit 25 can exemplify the 100 kHz to MHz band, and the output voltage waveform can be exemplified by a sine wave or a rectangular wave.
  • the two power receiving elements 31 are power receiving electrodes provided on the movable portion 3 and are formed of a metal material.
  • the power receiving element 31 and the power feeding element 21 have a large facing area in order to obtain predetermined power feeding power, and are disposed facing each other with a slight separation distance. Therefore, the two power receiving elements 31 and the power feeding element 21 electrically form two sets of parallel plate capacitors. Even when the movable part 3 is driven by the linear motor mechanism 150, the separation distance is kept substantially constant, and the capacitance of the parallel plate capacitor is also kept substantially constant.
  • the power receiving circuit 35 is provided in the movable part 3, transforms the high frequency power input from the non-contact power receiving element 31, and outputs it to the electric load 91.
  • the electrical load 91 to be fed by non-contact power feeding is the X-axis motor, armature, electrical component, control board, and the like on the movable main body 160 described above.
  • the electric load 91 is divided into two parts, but is not limited thereto, and may actually be three or more. Further, the operating voltages of the plurality of electric loads 91 may be different.
  • One input terminal of the power receiving circuit 35 is connected to the first power receiving element 31 by the power line 351 and the other is connected to the second power receiving element 31.
  • An output terminal of the power receiving circuit 35 is connected to the electric load 91 by a power supply line 352.
  • the electric load 91 may be either a DC load or an AC load, and the magnitude of the operating voltage is not limited, but the power receiving circuit 35 needs to have a voltage output function corresponding to the electric load 91.
  • the power receiving circuit 35 for example, a full-wave rectifier circuit that converts input high-frequency power into DC power, an inverter circuit that converts it into commercial-frequency AC power, or the like can be used. Further, when the operating voltages and frequencies of the plurality of electric loads 91 are different, a multi-output type power receiving circuit 35 can be used.
  • the high-frequency power supply circuit 25 the two power feeding elements 21, the two power receiving elements 31, and the power receiving circuit 35 are closed to perform non-contact power feeding to the electric load 91 by an electrostatic coupling method.
  • a circuit is configured.
  • the high-frequency power output from the high-frequency power supply circuit 25 is input to the two power feeding elements 21 via the power supply line 251 (broken line arrow E1 in FIG. 2), and the two high-frequency powers are caused by the electrostatic coupling action of the parallel plate capacitor.
  • Contactless power is supplied to the power receiving element 31 (broken line arrow E2).
  • the high frequency power received by the two power receiving elements 31 is input to the power receiving circuit 35 via the power line 351 (broken line arrow E3), transformed inside the power receiving circuit 35, and fed to the electric load 91. (Dashed arrow E4).
  • the electrical load 91 operates and heat loss occurs.
  • the heat transfer member 4 is disposed between the electric load 91 and the power receiving element 31.
  • the heat transfer member 4 is a member that promotes heat conduction from the electrical load 91 to the power receiving element 31 and maintains electrical insulation between the two.
  • a heat transfer sheet formed of a material having a relatively high thermal conductivity among resins can be used.
  • the heat transfer member 4 is preferably thin as long as the heat transfer member 4 is in close contact with both the electric load 91 and the power receiving element 31 and can conduct heat well, and limits such as electrical insulation and mechanical strength are allowed.
  • the power receiving element 31 has a heat radiation layer 32 on a surface facing the non-contact power feeding element 21 at a distance.
  • the heat radiation layer 32 radiates heat generated and conducted by the electrical load 91 with high emissivity.
  • a sheet material or a coating film formed by including a functional material that converts heat into far infrared rays and emits it can be used.
  • a plurality of types of functional materials that convert heat into far-infrared rays and radiate them are already on the market, but their chemical composition and the like are hardly disclosed.
  • the surface of the power receiving element 31 may be a black painted surface having a high thermal emissivity, instead of the heat radiation layer 32.
  • it may be a plated surface with a high thermal emissivity, or a processed surface with a high thermal emissivity by providing minute irregularities.
  • the heat radiation layer 32 can also serve as an insulating layer. As a result, the heat radiation layer 32 can reinforce the electrical insulation between the power receiving element 31 and the power feeding element 21 and improve the insulation performance.
  • the power supply element 21 on the fixed portion 2 side has a heat absorption layer 22 that absorbs heat at a high absorption rate on the surface that is spaced apart from the power reception element 31.
  • the heat absorption layer 22 may have the same configuration as the heat radiation layer 32 of the power receiving element 31 or may have a different configuration.
  • the heat absorption layer 22 can be replaced with a black painted surface, a plated surface, a processed surface, or the like.
  • the heat absorption layer 22 can be formed of an insulating material and can also serve as an insulating layer.
  • discharge holes 23 are formed in the power feeding element 21, and six are illustrated in FIG.
  • the discharge hole 23 is drilled from the back surface of the power feeding element 21 through the heat absorption layer 22 on the front surface side.
  • the outlet of the discharge hole 23 opens toward the power receiving element 31.
  • small uneven fins 24 are formed on the inner surface of the discharge hole 23, small uneven fins 24 are formed.
  • a refrigerant supply device 5 as an active cooling means is disposed on the fixed portion 2 side.
  • the refrigerant supply device 5 discharges the refrigerant fluid between the power supply element 21 and the power reception element 31 from the discharge hole 23 formed in the power supply element 21.
  • cooling air is used as the refrigerant fluid
  • an air pump is used as the refrigerant supply device 5.
  • An air duct 51 is formed between the refrigerant supply device 5 and the inlet of the discharge hole 23 so as not to leak.
  • the air duct 51 can be formed, for example, with the bottom surface of the track member 151 of the fixed portion 2 being a double bottom.
  • the cooling air is sucked from outside air and supplied to the air duct 51.
  • the cooling air is supplied to the inlet of the discharge hole 23 via the air duct 51 (solid arrow H1 in FIG. 2).
  • the cooling air passes through the discharge hole 23 (solid arrow H2), hits the radiation fin 24 at that time, and cools the power feeding element 21.
  • the cooling air is discharged from the outlet of the discharge hole 23 between the power feeding element 21 and the power receiving element 31.
  • the discharge state of the cooling air in the power supply element 21 is similar in image to the operation state of a game machine called air hockey.
  • the discharged cooling air flows between the power feeding element 21 and the power receiving element 31 (solid arrow H3), cools both the elements 21 and 31 by forced convection, and is finally exhausted to the outside.
  • cooling oil is circulated and used by using cooling oil as the refrigerant fluid and an oil pump in the refrigerant supply device 5.
  • a supply oil duct is provided instead of the air duct 51 from the refrigerant supply device 5 to the inlet of the discharge hole 23, and in addition, the cooling oil discharged from between the power feeding element 21 and the power receiving element 31 is supplied.
  • a recovery oil duct is provided to return to the oil pump.
  • refrigerant fluids other than cooling air and cooling oil can also be used.
  • a part of the total amount of heat generated by the electrical load 91 is directly dissipated from the surface of the movable portion 3 to the outside, but the other amount of heat is conducted to the power receiving element 31 via the heat transfer member 4.
  • the power receiving element 31 is also used as a heat radiation fin, and heat conduction from the electric load 9 to the power receiving element 31 is promoted by the heat transfer member 4.
  • the heat of the power receiving element 31 is radiated into the air by the action of the heat radiation layer 32, and most of the radiated heat is absorbed by the power feeding element 21 by the action of the heat absorption layer 22.
  • each of the power feeding element 21 and the power receiving element 31 is an electrode, a large electrode area is ensured, and the distance between the parallel electrodes is narrowed. Therefore, heat radiation from the power receiving electrode 31 to the power feeding electrode 21 is efficiently performed, and considerable heat is also dissipated from the power feeding electrode 21 to the outside. Thereby, both the elements 21 and 31 play the role of a radiation fin, and an effective heat radiation area increases.
  • both elements 21 and 22 are forcedly convectively cooled by the cooling air flowing between the power feeding element 21 and the power receiving element 31.
  • the coolant fluid is discharged between the electrodes 21 and 31 from the discharge hole 23 of the power feeding electrode 21, the entire amount of the cooling air is effectively used for cooling.
  • the cooling air passes between the narrowed electrodes 21 and 31, both the power receiving electrode 31 and the power feeding electrode 21 can be efficiently cooled.
  • the power feeding element 21 is also cooled by the forced convection cooling by the radiating fins 24 on the inner surface of the projecting hole 23 so as to be more efficiently cooled.
  • the power receiving electrode 31 can be cooled extremely efficiently, and the temperature rise of the electric load 91 can be remarkably suppressed.
  • the movable portion 3 since the power receiving element 31 necessary for the non-contact power supply is also used as the radiation fin, the movable portion 3 does not need a dedicated radiation fin.
  • the refrigerant supply device 5 can be provided on the fixed portion 2 side. Therefore, the movable part 3 can be reduced in size and weight. Thereby, the driving force for driving the movable part 3 can be small, and the restriction on the moving speed of the movable part 3 is reduced.
  • FIG. 3 is a configuration diagram conceptually illustrating the contactless power feeding device 1A of the second embodiment.
  • the non-contact power feeding apparatus 1A of the second embodiment includes the same high frequency power supply circuit 25, power receiving element 31, power receiving circuit 35, and heat transfer member 4 as in the first embodiment, and is provided in the refrigerant supply apparatus 5 as active cooling means. Instead, a cold radiation device is provided.
  • dashed arrows E1 to E4 indicate the flow of power as in the first embodiment.
  • the power feeding element 21A on the fixed portion 2A side of the second embodiment has the same heat absorption layer 22 as that of the first embodiment, and does not have the discharge holes 23.
  • the Peltier element 6 as a cold radiation device is provided on the back surface of the power feeding element 21A opposite to the heat absorption layer 22.
  • the Peltier element 6 utilizes a Peltier effect in which heat is transferred from one metal to the other when an electric current is passed through a joint between two kinds of metals.
  • the endothermic surface 61 of the Peltier element 6 on the low temperature side is attached to the power feeding element 21A, and the heat dissipation surface 62 on the high temperature side is naturally cooled by the outside air.
  • the power feeding element 21A includes heat radiating fins 7 as cold radiation devices on both narrow end faces.
  • both the Peltier device 6 and the radiation fin 7 are provided, it is not limited to this. In other words, as long as the power feeding element 21A can be sufficiently cooled, only one of the elements may be provided, or another means may be provided as a cold radiation device.
  • a part of the total amount of heat generated by the electrical load 91 is directly dissipated from the surface of the movable portion 3 to the outside, but the other amount of heat is conducted to the power receiving element 31 via the heat transfer member 4.
  • the power receiving element 31 is also used as a heat radiation fin, and heat conduction from the electric load 9 to the power receiving element 31 is promoted by the heat transfer member 4.
  • the power feeding element 21A is cooled by the Peltier element 6 and the heat radiating fins 7, and the temperature of the power feeding element 21A is reduced, and the temperature difference from the power receiving element 31 is increased. Thereby, cold radiation from the power feeding element 21A to the power receiving element 31 is performed.
  • each of the power feeding element 21A and the power receiving element 31 is an electrode, a large electrode area is ensured, and the distance between the parallel electrodes is narrowed. Therefore, cold radiation is performed efficiently, and the amount of heat radiation from the power receiving element 31 to the power feeding element 21A increases by an amount corresponding to the cold radiation. Therefore, the power receiving electrode 31 can be cooled extremely efficiently, and the temperature rise of the electric load 91 can be remarkably suppressed.
  • the movable part 3 can be reduced in size and weight, the driving force for driving the movable part 3 can be small, and the movement speed restriction of the movable part 3 is reduced.
  • FIG. 4 is a configuration diagram conceptually illustrating the non-contact power feeding device 1B of the third embodiment.
  • the non-contact power feeding device 1B of the third embodiment includes the same high-frequency power supply circuit 25, power receiving circuit 35, heat transfer member 4, and refrigerant supply device 5 as in the first embodiment, and the power feeding element 21B and the power receiving element 31B are combs. Type electrode.
  • dashed arrows E1 to E4 indicate the flow of power as in the first embodiment.
  • the power feeding element 21B on the fixed portion 2B side is a comb-shaped electrode as shown in the drawing. More specifically, two rectangular cross-section tooth portions 27 are erected apart from the upper surface of the horizontally extending base portion 26 vertically upward. The surfaces of the base portion 26 and the tooth portion 27 that are spaced apart from the power receiving element 31B are covered with the heat absorption layer 22B.
  • a large number of discharge holes 23B are formed in the power feeding element 21B, and six are illustrated in FIG. The discharge hole 23B is drilled through the base portion 26 and the heat absorption layer 22B. The outlet of the discharge hole 23B opens toward the power receiving element 31B.
  • no radiation fin is attached to the inner surface of the discharge hole 23B.
  • the power receiving element 31B on the movable part 3B side is also an electrode having a comb-shaped cross section. More specifically, three rectangular cross-sectioned tooth portions 37 are erected apart from the lower surface of the horizontally extending base portion 36 in a vertically downward direction. The surfaces of the base portion 36 and the tooth portion 37 facing the power feeding element 21B are covered with the heat radiation layer 32B.
  • the power feeding element 21 ⁇ / b> B and the power receiving element 31 ⁇ / b> B are used in a state where the tooth portions 27 and 37 are alternately fitted while being separated from each other by a substantially constant separation distance. This state is maintained even if the movable part 3 moves in the Y-axis direction (the front and back direction on the paper).
  • the case where there are two tooth portions 27 and three tooth portions 37 is illustrated, but in practice, a larger number of tooth portions are provided and alternately fitted. Can do.
  • the capacitor constituted by the power feeding element 21B and the power receiving element 31B has a significantly increased surface area facing the first embodiment, and the capacitance is significantly increased. Further, the surface area that contributes to thermal radiation from the power receiving element 31B to the power feeding element 21B is also greatly increased. Further, the refrigerant fluid is discharged from the refrigerant supply device 5 between the power receiving element 31B and the power feeding element 21B via the discharge hole 23B, and the cooling surface area is greatly expanded even in the forced convection cooling.
  • the surface area that contributes to thermal radiation and forced convection cooling is significantly expanded compared to the first embodiment. Therefore, the power receiving element 31B can be cooled extremely efficiently, and the temperature rise of the electric load 91 can be remarkably suppressed. Further, similarly to the first embodiment, the movable portion 3 can be reduced in size and weight, the driving force for driving the movable portion 3 can be small, and the movement speed restriction of the movable portion 3 is small.
  • the first to third embodiments can be used together, and for example, both the refrigerant supply device 5 and the Peltier element 6 may be provided.
  • the present invention is preferably applied to the electrostatic coupling type non-contact power feeding devices 1, 1 ⁇ / b> A, and 1 ⁇ / b> B, but can also be applied to other types of non-contact power feeding devices such as an electromagnetic induction method and a magnetic field resonance method.
  • non-contact power feeding devices such as an electromagnetic induction method and a magnetic field resonance method.
  • the non-contact power feeding device of the present invention is not limited to work equipment for substrates such as component mounting machines, but also to industrial equipment of other industries that have movable parts and need non-contact power feeding. Widely available. Further, it can be used for a non-contact power supply without using a pantograph or the like to a running train, or a non-contact power supply from a road surface to a running electric vehicle.
  • Non-contact power feeding device 2 2A, 2B: Fixed portion 21, 21A, 21B: Power feeding element 22, 22B: Heat absorption layer 23, 23B: Discharge hole 24: Radiation fin 25: High frequency power supply circuit 26: Base 27: Tooth part 3, 3B: Movable part 31, 31B: Power receiving element 32, 32B: Thermal radiation layer 35: Power receiving circuit 36: Base part 37: Tooth part 4: Heat transfer member 5: Refrigerant supply device 51: Air duct 6: Peltier element (Cool radiation device) 61: endothermic surface 62: heat radiating surface 7: heat radiating fin (cold radiation device) 91: Electric load 10: Component mounter 110: Board transfer device 120: Component supply device 130, 140: Component transfer device 150: Linear motor mechanism 151: Track member 160: Movable main body 161: X-axis rail 170: Mounting head 180: Display setting device 190: Machine base

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Abstract

This contactless power supply device is provided with: a power supply element furnished to a stationary part; a high-frequency power supply circuit for supplying high-frequency power to the power supply element; a power reception element furnished to a moveable part that is moveably mounted on the stationary part, and facing the power supply element across a gap, for receiving high-frequency power in contactless fashion; and a power reception circuit for converting the high-frequency power received by the power reception element, and supplying power to an electrical load on the moveable part; and is further provided with: a heat transfer member for facilitating transfer of heat from the electrical load to the power reception element; and an active cooling means (for example, a coolant supply device or the like) furnished to the stationary part, for active cooling of the power reception element. In so doing, the moveable part can be made smaller in size and lighter in weight, while improving the cooling ability to cool the moveable part, and minimizing rise in temperature of the electrical load on the moveable part.

Description

非接触給電装置Non-contact power feeding device
　本発明は、可動部上の電気負荷に非接触で給電する非接触給電装置に関し、より詳細には、可動部を冷却する冷却構造に関する。 The present invention relates to a non-contact power supply device that supplies power to an electric load on a movable part in a non-contact manner, and more particularly to a cooling structure that cools the movable part.
　多数の部品が実装された基板を生産する基板用作業機器として、はんだ印刷機、部品実装機、リフロー機、基板検査機などがあり、これらを基板搬送装置で連結して基板生産ラインを構築する場合が多い。これらの基板用作業機器の多くは基板上を移動して所定の作業を行う可動部を備えており、可動部を駆動する一手段としてリニアモータ装置を用いることができる。リニアモータ装置は、移動方向に沿い複数の磁石のＮ極およびＳ極が交互に列設された軌道部材と、コアおよびコイルを有する電機子を含んで構成された可動部とを備えるのが一般的である。可動部上の電気負荷に給電するために、従来から変形可能な給電用ケーブルが用いられてきた。また、近年では、給電用ケーブルによる荷搬重量の増加や金属疲労による断線のリスクなどの弊害を解消するために、非接触給電装置の適用が提案されている。 There are solder printing machines, component mounting machines, reflow machines, board inspection machines, etc. as board work equipment that produces boards with a large number of components mounted, and these are connected by a board transport device to build a board production line. There are many cases. Many of these substrate working devices include a movable portion that moves on the substrate and performs a predetermined operation, and a linear motor device can be used as one means for driving the movable portion. A linear motor device generally includes a track member in which N poles and S poles of a plurality of magnets are alternately arranged along a moving direction, and a movable portion configured to include an armature having a core and a coil. Is. Conventionally, a deformable power supply cable has been used to supply power to the electric load on the movable part. In recent years, the application of a non-contact power feeding device has been proposed in order to eliminate adverse effects such as an increase in the carrying weight due to a power feeding cable and a risk of disconnection due to metal fatigue.
　非接触給電装置の方式として、従来からコイルを用いた電磁誘導方式が多用されてきたが、最近では離隔対向する電極によりコンデンサを構成した静電結合方式も用いられるようになってきており、他に磁界共鳴方式なども検討されている。非接触給電装置の用途は、基板用作業機器に限定されるものではなく、他の業種の産業用機器や家電製品などの幅広い分野に広まりつつあり、電気鉄道や電気自動車への利用も検討されている。 Conventionally, an electromagnetic induction method using a coil has been widely used as a method of a non-contact power feeding device, but recently, an electrostatic coupling method in which a capacitor is configured by electrodes facing each other has been used. In addition, a magnetic resonance method has been studied. Applications of contactless power supply devices are not limited to work equipment for substrates, but are spreading to a wide range of fields such as industrial equipment and household appliances in other industries, and their use in electric railways and electric vehicles is also being considered. ing.
　基板用作業機器に戻り、可動部に搭載される電気負荷には次のようなものがある。例えば、部品実装機の可動部となる実装ヘッドには、部品を吸着採取する吸着ノズルに負圧を発生させるエアポンプや、吸着ノズルを回動および昇降させる駆動モータ、およびこれらの制御部などが搭載されている。また、基板検査機の可動部となる検査ヘッドには、基板上の配線パターンや部品の実装状態を撮像するカメラやそのデータ伝送部、および制御部などが搭載されている。さらには、リニアモータ装置の電機子も電気負荷の一種である。可動部上の電気負荷で発生する熱を放散して温度上昇を抑制するために、放熱フィンや冷却ファンなどを設ける場合がある。この種の非接触給電装置の冷却構造の技術例が特許文献１に開示されている。 Returning to the work equipment for substrates, there are the following electrical loads mounted on the movable part. For example, the mounting head, which is the movable part of the component mounting machine, is equipped with an air pump that generates negative pressure at the suction nozzle that picks up and picks up components, a drive motor that rotates and lifts the suction nozzle, and a controller for these. Has been. In addition, the inspection head, which is a movable part of the board inspection machine, is equipped with a camera for imaging the wiring pattern on the board and the mounting state of the components, its data transmission unit, and a control unit. Furthermore, the armature of the linear motor device is a kind of electric load. In order to dissipate the heat generated by the electric load on the movable part and suppress the temperature rise, there are cases where a radiating fin, a cooling fan, or the like is provided. A technical example of a cooling structure for this type of non-contact power feeding apparatus is disclosed in Patent Document 1.
　特許文献１の受電装置は、車両に搭載されて受電アンテナによりマイクロ波を受電するものである。この受電装置は、受電アンテナの他に、シャーシに取り付けられた放熱手段と、放熱手段を冷却する冷却手段としての冷却ファンおよび送風手段と、を有している。さらに、この受電装置と送電装置とを組み合わせたエネルギー供給システムは、マイクロ波を送信する送電装置側に冷却手段を有している。これにより、受電アンテナで発生した熱は放熱手段に吸収され、冷却ファンからの冷却風により冷却されるので、受電アンテナ付近の温度上昇を抑制できる、と記載されている。 The power receiving device of Patent Document 1 is mounted on a vehicle and receives microwaves by a power receiving antenna. In addition to the power receiving antenna, the power receiving device includes a heat radiating unit attached to the chassis, and a cooling fan and a blower unit as a cooling unit for cooling the heat radiating unit. Furthermore, the energy supply system in which the power receiving device and the power transmission device are combined has a cooling unit on the side of the power transmission device that transmits microwaves. Accordingly, it is described that the heat generated in the power receiving antenna is absorbed by the heat radiating means and is cooled by the cooling air from the cooling fan, so that the temperature rise near the power receiving antenna can be suppressed.
特許第４８６５４５０号公報Japanese Patent No. 4865450
　ところで、特許文献１の受電装置は、シャーシ（可動部）に放熱手段および冷却手段を有している。そして、実施形態に放熱手段として示される放熱フィンや冷却手段として示される冷却ファンは、かなりの重量を有し、かつ大きな設置スペースを必要とする。したがって、冷却構造を構成する部材の分だけシャーシ（可動部）が重厚長大化し、車両性能が低下する。 By the way, the power receiving device of Patent Document 1 has a heat radiating means and a cooling means in a chassis (movable part). And the heat sink shown as a heat radiating means in the embodiment and the cooling fan shown as a cooling means have a considerable weight and require a large installation space. Therefore, the chassis (movable part) becomes thicker and longer than the members constituting the cooling structure, and the vehicle performance is degraded.
　また、特許文献１のエネルギー供給システムは、送電装置側（固定部側）に冷却手段を有しており、シャーシ（可動部）の重厚長大化を軽減できる点は好ましい。しかしながら、固定部側から可動部を遠隔的に冷却する構造では、例えば、可動部が移動すると固定部から送る冷却風が効率的に可動部の放熱フィンに到達しなくなったりして、冷却性能が低下しがちである。 Further, the energy supply system of Patent Document 1 has a cooling means on the power transmission device side (fixed portion side), and is preferable in that the increase in the thickness of the chassis (movable portion) can be reduced. However, in the structure where the movable part is cooled remotely from the fixed part side, for example, when the movable part moves, the cooling air sent from the fixed part does not efficiently reach the radiation fins of the movable part, and the cooling performance is reduced. It tends to decline.
　類似の問題点は、基板用作業機器の非接触給電装置でも発生する。すなわち、部品実装機の実装ヘッドや基板検査機の検査ヘッドを始めとする可動部に冷却構造を設けると、その分だけ可動部が重厚長大化する。これにより、可動部を駆動するための駆動力を大きくする必要が生じる問題点や、可動部の移動速度が制約されるという問題点などが発生する。また、基板用作業機器の固定部側の冷却ファンから送風しても、可動部が移動したりして、冷却性能は低下しがちである。 類似 Similar problems also occur in non-contact power supply devices for substrate work equipment. That is, when a cooling structure is provided in a movable part such as a mounting head of a component mounting machine or an inspection head of a board inspection machine, the movable part becomes thicker by that amount. This causes a problem that it is necessary to increase the driving force for driving the movable part, a problem that the moving speed of the movable part is restricted, and the like. In addition, even if air is blown from the cooling fan on the fixed part side of the substrate working equipment, the movable part moves and the cooling performance tends to be lowered.
　本発明は、上記背景技術の問題点に鑑みてなされたもので、可動部を冷却する冷却性能を向上して可動部上の電気負荷の温度上昇を抑制しつつ、可動部を小形軽量化できる非接触給電装置を提供することを解決すべき課題とする。 The present invention has been made in view of the above problems of the background art, and can improve the cooling performance for cooling the movable part and suppress the temperature increase of the electric load on the movable part, and can reduce the size and weight of the movable part. Providing a non-contact power supply device is a problem to be solved.
　上記課題を解決する請求項１に係る非接触給電装置の発明は、固定部に設けられた給電用素子と、前記給電用素子に高周波電力を給電する高周波電源回路と、前記固定部に移動可能に装架された可動部に設けられ、前記給電用素子に離隔対向して非接触で高周波電力を受け取る受電用素子と、前記受電用素子が受け取った高周波電力を変換して前記可動部上の電気負荷に給電する受電回路とを備える非接触給電装置であって、前記電気負荷から前記受電用素子への熱の伝導を促進する伝熱部材と、前記固定部側に設けられて前記受電用素子を能動的に冷却する能動冷却手段と、をさらに備えた。 The invention of the non-contact power feeding device according to claim 1 that solves the above-described problem includes a power feeding element provided in a fixed portion, a high-frequency power supply circuit that feeds high-frequency power to the power feeding element, and movable to the fixed portion Provided on the movable part mounted on the power supply element, receiving the high-frequency power in a non-contact manner and spaced apart from the power supply element, and converting the high-frequency power received by the power reception element on the movable part A non-contact power feeding device comprising a power receiving circuit for feeding power to an electric load, wherein the heat receiving member that promotes heat conduction from the electric load to the power receiving element and the fixed portion side is provided for the power receiving And an active cooling means for actively cooling the device.
　請求項２に係る発明は、請求項１において、前記能動冷却手段は、冷媒流体を前記給電用素子と前記受電用素子との間に流す冷媒供給装置である。 The invention according to claim 2 is the refrigerant supply device according to claim 1, wherein the active cooling means causes a refrigerant fluid to flow between the power feeding element and the power receiving element.
　請求項３に係る発明は、請求項２において、前記給電用素子および前記受電用素子はそれぞれ電極であり、前記冷媒供給装置は、前記給電用素子に穿設された吐出孔から前記冷媒流体を前記給電用素子と前記受電用素子との間に吐出する。 According to a third aspect of the present invention, in the second aspect, the power feeding element and the power receiving element are electrodes, respectively, and the refrigerant supply device supplies the refrigerant fluid from a discharge hole formed in the power feeding element. The ink is discharged between the power feeding element and the power receiving element.
　請求項４に係る発明は、請求項３において、前記給電用素子は前記吐出孔の内面に放熱フィンを有する。 According to a fourth aspect of the present invention, in the third aspect, the power feeding element has a heat radiation fin on the inner surface of the discharge hole.
　請求項５に係る発明は、請求項１において、前記能動冷却手段は、前記給電用素子を冷却することにより冷輻射を行って前記受電用素子を冷却する冷輻射装置である。 The invention according to claim 5 is the cooling radiation device according to claim 1, wherein the active cooling means cools the power receiving element by cooling the power feeding element to cool the power receiving element.
　請求項６に係る発明は、請求項５において、前記給電用素子および前記受電用素子はそれぞれ電極であり、前記冷輻射装置は、前記給電用素子の前記受電用素子に対向しない面に配設されたペルチェ素子または放熱フィンの少なくとも一方を含む。 According to a sixth aspect of the present invention, in the fifth aspect, the power feeding element and the power receiving element are electrodes, respectively, and the cold radiation device is disposed on a surface of the power feeding element that does not face the power receiving element. Including at least one of a Peltier element or a heat radiating fin.
　請求項７に係る発明は、請求項１～６のいずれか一項において、前記受電用素子は、前記給電用素子に離隔対向する表面に、前記電気負荷で発生して伝導した熱を高い放射率で放射する熱放射層または熱放射面を有し、前記給電用素子は、前記受電用素子に離隔対向する表面に、熱を高い吸収率で吸収する熱吸収層または熱吸収面を有する。 According to a seventh aspect of the invention, in any one of the first to sixth aspects, the power receiving element radiates heat generated and conducted by the electrical load with high radiation on a surface that is spaced apart from the power feeding element. The power supply element has a heat absorption layer or a heat absorption surface that absorbs heat at a high absorptance on a surface that is spaced apart from the power receiving element.
　請求項８に係る発明は、請求項１～７のいずれか一項において、前記給電用素子および前記受電用素子は、前記可動部の移動方向と直角な断面形状が基部および前記基部から延在する複数の歯部からなる櫛型であって、前記複数の歯部同士が相互に離隔しつつ互い違いに嵌合した櫛型電極である。 According to an eighth aspect of the present invention, in the power feeding element and the power receiving element according to any one of the first to seventh aspects, a cross-sectional shape perpendicular to a moving direction of the movable portion extends from the base portion and the base portion. A comb-shaped electrode composed of a plurality of tooth portions, wherein the plurality of tooth portions are alternately fitted while being spaced apart from each other.
　請求項１に係る非接触給電装置の発明では、可動部上で高周波電力を受け取る受電用素子が放熱フィンに兼用され、伝熱部材で電気負荷から受電用素子への熱の伝導が促進され、固定部側の能動冷却手段は受電用素子を冷却する。これにより、電気負荷で発生する熱を効率良く放散して温度上昇を抑制できる。また、非接触給電に必要な受電用素子を放熱フィンに兼用するので可動部には専用の放熱フィンが不要になり、能動冷却手段は固定部に設ければよいので、可動部を小形軽量化できる。 In the invention of the non-contact power feeding device according to claim 1, the power receiving element that receives the high frequency power on the movable part is also used as the heat radiating fin, and heat conduction from the electric load to the power receiving element is promoted by the heat transfer member, The active cooling means on the fixed part side cools the power receiving element. Thereby, the heat which generate | occur | produces with an electrical load can be dissipated efficiently, and a temperature rise can be suppressed. In addition, since the power receiving element necessary for non-contact power supply is also used as the heat radiating fin, a dedicated heat radiating fin is not required for the movable part, and the active cooling means only needs to be provided in the fixed part. it can.
　請求項２に係る発明では、能動冷却手段は、冷媒流体を給電用素子と受電用素子との間に流す冷媒供給装置とされている。冷媒流体には、例えば冷却エアや冷却オイルなどを用いることができ、強制対流により受電用素子を効率良く冷却して、電気負荷の温度上昇を抑制できる。 In the invention according to claim 2, the active cooling means is a refrigerant supply device for flowing a refrigerant fluid between the power feeding element and the power receiving element. For example, cooling air, cooling oil, or the like can be used as the refrigerant fluid, and the power receiving element can be efficiently cooled by forced convection to suppress an increase in the temperature of the electric load.
　請求項３に係る発明では、給電用素子および受電用素子はそれぞれ電極であり、冷媒供給装置は、給電用素子に穿設された吐出孔から冷媒流体を給電用素子と受電用素子との間に吐出する。給電用電極および受電用電極を用いた静電結合方式の非接触給電では、給電電力を増やし給電効率を高めるために、大きな電極面積が確保され、かつ平行する電極間の距離が狭められている。したがって、第１に、受電用電極から給電用電極への熱輻射が効率良く行われて給電用電極からもかなりの熱が放散され、実効的な放熱面積が増加する。第２に、給電用電極の吐出孔から冷媒流体を電極間に吐出するので、冷媒流体の全量が冷却に有効利用される。第３に、冷媒流体が狭められた電極間を流れるので、効率良く受電用電極および給電用電極の両方を冷却できる。以上の３つの総合的な作用により、受電用電極を極めて効率良く冷却して、電気負荷の温度上昇を格段に抑制できる。 In the invention according to claim 3, each of the power feeding element and the power receiving element is an electrode, and the refrigerant supply device supplies the refrigerant fluid between the power feeding element and the power receiving element through a discharge hole formed in the power feeding element. To discharge. In the non-contact power feeding of the electrostatic coupling method using the feeding electrode and the receiving electrode, in order to increase the feeding power and increase the feeding efficiency, a large electrode area is secured and the distance between the parallel electrodes is reduced. . Therefore, first, heat radiation from the power receiving electrode to the power feeding electrode is efficiently performed, and a considerable amount of heat is dissipated from the power feeding electrode, thereby increasing an effective heat radiation area. Second, since the refrigerant fluid is discharged between the discharge holes of the power supply electrode, the entire amount of the refrigerant fluid is effectively used for cooling. Third, since the refrigerant fluid flows between the narrowed electrodes, both the power receiving electrode and the power feeding electrode can be efficiently cooled. With the above three overall actions, the power receiving electrode can be cooled extremely efficiently, and the temperature rise of the electric load can be remarkably suppressed.
　請求項４に係る発明では、給電用電極は吐出孔の内面に放熱フィンを有するので、給電用電極が一層効率良く冷却される。これにより、受電用電極と給電用電極との温度差が増加し、受電用電極から給電用電極への熱輻射量が増加するので、電気負荷の温度上昇の抑制に寄与できる。 In the invention according to claim 4, since the power supply electrode has the radiation fin on the inner surface of the discharge hole, the power supply electrode is cooled more efficiently. Thereby, the temperature difference between the power receiving electrode and the power feeding electrode is increased, and the amount of heat radiation from the power receiving electrode to the power feeding electrode is increased, which can contribute to the suppression of the temperature rise of the electric load.
　請求項５に係る発明では、能動冷却手段は、給電用素子を冷却することにより冷輻射を行って受電用素子を冷却する冷輻射装置とされている。つまり、給電用素子を冷却して温度を下げてやれば受電用素子との温度差が大きくなるので、その分だけ受電用素子から給電用素子への熱輻射量が増加する。これにより、受電用素子を効率良く冷却して、電気負荷の温度上昇を抑制できる。 In the invention according to claim 5, the active cooling means is a cold radiation device that cools the power receiving element by cooling the power feeding element to cool the power receiving element. That is, if the power supply element is cooled to lower the temperature, the temperature difference from the power reception element increases, and the amount of heat radiation from the power reception element to the power supply element increases accordingly. Thereby, the power receiving element can be efficiently cooled, and the temperature rise of the electric load can be suppressed.
　請求項６に係る発明では、給電用素子および前記受電用素子はそれぞれ電極であり、冷輻射装置は、給電用素子の受電用素子に対向しない面に配設されたペルチェ素子または放熱フィンの少なくとも一方を含んでいる。給電用電極および受電用電極を用いた静電結合方式の非接触給電では、給電電力を増やし給電効率を高めるために、大きな電極面積が確保され、かつ平行する電極間の距離が狭められている。したがって、ペルチェ素子や放熱フィンを用いて給電用電極を冷却することにより冷輻射が効率良く行われ、受電用電極を極めて効率良く冷却して、電気負荷の温度上昇を格段に抑制できる。 In the invention according to claim 6, each of the power feeding element and the power receiving element is an electrode, and the cold radiation device includes at least one of a Peltier element or a radiation fin disposed on a surface of the power feeding element that does not face the power receiving element. Includes one. In the non-contact power feeding of the electrostatic coupling method using the feeding electrode and the receiving electrode, in order to increase the feeding power and increase the feeding efficiency, a large electrode area is secured and the distance between the parallel electrodes is reduced. . Therefore, cooling radiation is efficiently performed by cooling the power feeding electrode using a Peltier element or a radiation fin, and the power receiving electrode is cooled extremely efficiently, and the temperature rise of the electric load can be remarkably suppressed.
　請求項７に係る発明では、受電用素子は熱放射層または熱放射面を有し、給電用素子は熱吸収層または熱吸収面を有している。これにより、受電用素子から離隔対向する給電用素子への熱輻射が効率化されて、実効的な放熱面積が増加する。さらに、能動冷却手段との協働により、電気負荷で発生する熱を効率良く放散して温度上昇を抑制できる。 In the invention according to claim 7, the power receiving element has a heat radiation layer or a heat radiation surface, and the power feeding element has a heat absorption layer or a heat absorption surface. As a result, the heat radiation from the power receiving element to the power feeding element spaced apart from the power receiving element is made efficient, and the effective heat radiation area increases. Furthermore, by cooperating with the active cooling means, it is possible to efficiently dissipate the heat generated by the electric load and suppress the temperature rise.
　請求項８に係る発明では、給電用素子および受電用素子は櫛型電極とされている。櫛型電極では、給電電力を増やし給電効率を向上するために、平面電極と比較して大きな電極表面積が確保されている。大きな電極表面積は、強制対流、冷輻射、および熱輻射のいずれにおいても有利であり、受電用素子を一層効率良く冷却して、電気負荷の温度上昇を一層抑制できる。 In the invention according to claim 8, the power feeding element and the power receiving element are comb-shaped electrodes. In the comb-shaped electrode, a large electrode surface area is secured as compared with the planar electrode in order to increase the power supply power and improve the power supply efficiency. The large electrode surface area is advantageous in any of forced convection, cold radiation, and thermal radiation, and the power receiving element can be more efficiently cooled to further suppress the temperature increase of the electric load.
本発明の非接触給電装置を適用できる部品実装機の全体構成を示した斜視図である。It is the perspective view which showed the whole structure of the component mounting machine which can apply the non-contact electric power feeder of this invention. 第１実施形態の非接触給電装置を概念的に説明する構成図である。It is a lineblock diagram explaining the non-contact electric supply device of a 1st embodiment notionally. 第２実施形態の非接触給電装置を概念的に説明する構成図である。It is a block diagram which illustrates notionally the non-contact electric power feeder of 2nd Embodiment. 第３実施形態の非接触給電装置を概念的に説明する構成図である。It is a block diagram which illustrates notionally the non-contact electric power supply of 3rd Embodiment.
　まず、本発明を適用できる部品実装機１０について、図１を参考にして説明する。図１は、本発明の非接触給電装置を適用できる部品実装機１０の全体構成を示した斜視図である。部品実装機１０は、基板に多数の部品を実装する装置であり、２セットの同一構造の部品実装ユニットが概ね左右対称に配置されて構成されている。ここでは、図１の右手前側のカバーを取り外した状態の部品実装ユニットを例にして説明する。なお、図中の左奥側から右手前側に向かう部品実装機１０の幅方向をＸ軸方向とし、部品実装機１０の長手方向をＹ軸方向とする。 First, a component mounter 10 to which the present invention can be applied will be described with reference to FIG. FIG. 1 is a perspective view showing the overall configuration of a component mounter 10 to which the non-contact power feeding device of the present invention can be applied. The component mounter 10 is a device that mounts a large number of components on a board, and is configured by two sets of component mounting units having the same structure arranged substantially symmetrically. Here, the component mounting unit in a state where the right front cover of FIG. 1 is removed will be described as an example. In the drawing, the width direction of the component mounter 10 from the left back side to the right front side in the figure is the X-axis direction, and the longitudinal direction of the component mounter 10 is the Y-axis direction.
　部品実装機１０は、基板搬送装置１１０、部品供給装置１２０、２つの部品移載装置１３０、１４０などが機台１９０に組み付けられて構成されている。基板搬送装置１１０は、部品実装機１０の長手方向の中央付近をＸ軸方向に横断するように配設されている。基板搬送装置１１０は、図略の搬送コンベアを有しており、基板をＸ軸方向に搬送する。また、基板搬送装置１１０は、図略のクランプ装置を有しており、基板を所定の実装作業位置に固定および保持する。部品供給装置１２０は、部品実装機１０の長手方向の前部（図１の左前側）及び後部（図には見えない）に設けられている。部品供給装置１２０は、複数のカセット式フィーダ１２１を有し、各フィーダ１２１にセットされたキャリアテープから２つの部品移載装置１３０、１４０に連続的に部品を供給するようになっている。 The component mounter 10 is configured by assembling a substrate transport device 110, a component supply device 120, two component transfer devices 130, 140, and the like on a machine base 190. The board transfer device 110 is disposed so as to cross the vicinity of the center in the longitudinal direction of the component mounting machine 10 in the X-axis direction. The substrate transport device 110 has a transport conveyor (not shown) and transports the substrate in the X-axis direction. Moreover, the board | substrate conveyance apparatus 110 has an unillustrated clamp apparatus, and fixes and hold | maintains a board | substrate in a predetermined mounting operation position. The component supply device 120 is provided at the front portion (left front side in FIG. 1) and the rear portion (not visible in the drawing) of the component mounter 10. The component supply device 120 includes a plurality of cassette-type feeders 121, and supplies components continuously to the two component transfer devices 130 and 140 from the carrier tape set in each feeder 121.
　２つの部品移載装置１３０、１４０は、Ｘ軸方向およびＹ軸方向に移動可能ないわゆるＸＹロボットタイプの装置である。２つの部品移載装置１３０、１４０は、部品実装機１０の長手方向の前側および後側に、相互に対向するように配設されている。各部品移載装置１３０、１４０は、Ｙ軸方向の移動のためのリニアモータ装置１５０を有している。 The two component transfer devices 130 and 140 are so-called XY robot type devices that can move in the X-axis direction and the Y-axis direction. The two component transfer apparatuses 130 and 140 are disposed on the front side and the rear side in the longitudinal direction of the component mounter 10 so as to face each other. Each component transfer device 130, 140 has a linear motor device 150 for movement in the Y-axis direction.
　リニアモータ装置１５０は、２つの部品移載装置１３０、１４０に共通な軌道部材１５１および補助レール１５５と、２つの部品移載装置１３０、１４０ごとのリニア可動部１５３で構成されている。軌道部材１５１は、本発明の固定部２の一部に相当し、リニア可動部１５３の移動方向となるＹ軸方向に延在している。軌道部材１５１は、リニア可動部１５３の下側に配置された底面、およびリニア可動部１５３の両側に配置された側面からなり、上方に開口する溝形状になっている。軌道部材１５１の向かい合う側面の内側には、Ｙ軸方向に沿って複数の磁石１５２が列設されている。 The linear motor device 150 includes a track member 151 and an auxiliary rail 155 common to the two component transfer devices 130 and 140, and a linear movable portion 153 for each of the two component transfer devices 130 and 140. The track member 151 corresponds to a part of the fixed portion 2 of the present invention, and extends in the Y-axis direction that is the moving direction of the linear movable portion 153. The track member 151 includes a bottom surface disposed below the linear movable portion 153 and side surfaces disposed on both sides of the linear movable portion 153, and has a groove shape opening upward. A plurality of magnets 152 are arranged in a row along the Y-axis direction on the inner side of the facing side surfaces of the track member 151.
　リニア可動部１５３は、軌道部材１５１に移動可能に装架されている。リニア可動部１５３は、本発明の可動部３に相当し、可動本体部１６０、Ｘ軸レール１６１、および実装ヘッド１７０などで構成されている。可動本体部１６０は、Ｙ軸方向に延在しており、その両側面には軌道部材１５１の磁石１５２に対向して推進力を発生する電機子が配設されている。Ｘ軸レール１６１は、可動本体部１６０からＸ軸方向に延在している。Ｘ軸レール１６１は、一端１６２が可動本体部１６０に結合され、他端１６３が補助レール１５５に移動可能に装架されており、可動本体部１６０と一体的にＹ軸方向に移動するようになっている。 The linear movable part 153 is movably mounted on the track member 151. The linear movable portion 153 corresponds to the movable portion 3 of the present invention, and includes a movable main body portion 160, an X-axis rail 161, a mounting head 170, and the like. The movable main body 160 extends in the Y-axis direction, and armatures that generate a propulsive force are disposed on opposite sides of the movable main body 160 so as to face the magnets 152 of the track member 151. The X-axis rail 161 extends from the movable main body 160 in the X-axis direction. One end 162 of the X-axis rail 161 is coupled to the movable main body 160 and the other end 163 is movably mounted on the auxiliary rail 155 so that the X-axis rail 161 moves integrally with the movable main body 160 in the Y-axis direction. It has become.
　部品実装ヘッド１７０は、Ｘ軸レール１６１に装架され、Ｘ軸方向に移動するようになっている。部品実装ヘッド１７０の下端には図略の吸着ノズルが設けられている。吸着ノズルは、負圧を利用して部品供給装置１２０から部品を吸着採取し、実装作業位置の基板に実装する。Ｘ軸レール１６１上に設けられた図略のボールねじ送り機構は、可動本体部１６０に配設されたＸ軸モータにより駆動されて、部品実装ヘッド１７０をＸ軸方向に駆動する。 The component mounting head 170 is mounted on the X-axis rail 161 and moves in the X-axis direction. A suction nozzle (not shown) is provided at the lower end of the component mounting head 170. The suction nozzle sucks and collects components from the component supply device 120 using negative pressure and mounts them on the substrate at the mounting work position. A ball screw feed mechanism (not shown) provided on the X-axis rail 161 is driven by an X-axis motor disposed in the movable main body 160 to drive the component mounting head 170 in the X-axis direction.
　部品実装機１０は、他に、オペレータと情報を交換するための表示設定装置１８０および、基板や部品を撮像する図略のカメラなどを備えている。 The component mounter 10 further includes a display setting device 180 for exchanging information with an operator, a camera (not shown) that images a board and components, and the like.
　可動本体部１６０上のＸ軸モータならびに電機子は、動作時に発熱して冷却を必要とする本発明の電気負荷に相当する。また、可動本体部１６０上に配設されたその他の電装品や制御基板なども電気負荷の一部である。 The X-axis motor and armature on the movable main body 160 correspond to the electric load of the present invention that generates heat during operation and requires cooling. Also, other electrical components and control boards disposed on the movable main body 160 are part of the electrical load.
　これらの電気負荷を冷却する冷却構造を備えて、本発明の第１実施形態の非接触給電装置１が構成されている。図２は、第１実施形態の非接触給電装置１を概念的に説明する構成図である。非接触給電装置１は、前述した部品実装機１０の機台１９０側の固定部２から、リニアモータ機構１５０の可動部３に静電結合方式で非接触給電する装置である。非接触給電装置１は、給電用素子２１、高周波電源回路２５、受電用素子３１、受電回路３５、伝熱部材４、能動冷却手段としての冷媒供給装置５などで構成されている。なお、図２で、破線の矢印Ｅ１～Ｅ４は電力の流れを示し、実線の矢印Ｈ１～Ｈ３は冷媒流体の流れを示している。 The non-contact power feeding device 1 according to the first embodiment of the present invention is configured to include a cooling structure for cooling these electric loads. FIG. 2 is a configuration diagram conceptually illustrating the non-contact power feeding device 1 of the first embodiment. The non-contact power feeding device 1 is a device that performs non-contact power feeding by the electrostatic coupling method from the fixing unit 2 on the machine mount 190 side of the component mounting machine 10 to the movable unit 3 of the linear motor mechanism 150. The non-contact power feeding device 1 includes a power feeding element 21, a high frequency power supply circuit 25, a power receiving element 31, a power receiving circuit 35, a heat transfer member 4, a refrigerant supply device 5 as active cooling means, and the like. In FIG. 2, broken arrows E1 to E4 indicate the flow of electric power, and solid arrows H1 to H3 indicate the flow of refrigerant fluid.
　２個の給電用素子２１は、固定部２に設けられた給電用電極であり、金属材料で形成されている。給電用素子２１は、固定部２の軌道部材１５１の概ね全長にわたって配設されている。高周波電源回路２５は、固定部２に配設されており、高周波電力を出力する。高周波電源回路２５の２つの出力端子は、電源線２５１により一方が第１の給電用素子２１に接続され、他方が第２の給電用素子２１に接続されている。高周波電源回路２５の出力周波数は１００ｋＨｚ～ＭＨｚ帯を例示でき、出力電圧波形として正弦波や矩形波などを例示できる。 The two power supply elements 21 are power supply electrodes provided on the fixed portion 2 and are formed of a metal material. The power feeding element 21 is disposed over substantially the entire length of the track member 151 of the fixed portion 2. The high frequency power supply circuit 25 is disposed in the fixed portion 2 and outputs high frequency power. One of the two output terminals of the high frequency power supply circuit 25 is connected to the first power feeding element 21 by the power line 251 and the other is connected to the second power feeding element 21. The output frequency of the high-frequency power supply circuit 25 can exemplify the 100 kHz to MHz band, and the output voltage waveform can be exemplified by a sine wave or a rectangular wave.
　２個の受電用素子３１は、可動部３に設けられた受電用電極であり、金属材料で形成されている。受電用素子３１および給電用素子２１は、所定の給電電力を得るために大きな対向面積が確保されており、わずかな離隔距離を有して対向配置されている。したがって、２個の受電用素子３１および給電用素子２１は、電気的には２組の平行板コンデンサを構成している。可動部３がリニアモータ機構１５０により駆動されても、離隔距離は概ね一定に保たれ、平行板コンデンサの静電容量も概ね一定に保たれる。 The two power receiving elements 31 are power receiving electrodes provided on the movable portion 3 and are formed of a metal material. The power receiving element 31 and the power feeding element 21 have a large facing area in order to obtain predetermined power feeding power, and are disposed facing each other with a slight separation distance. Therefore, the two power receiving elements 31 and the power feeding element 21 electrically form two sets of parallel plate capacitors. Even when the movable part 3 is driven by the linear motor mechanism 150, the separation distance is kept substantially constant, and the capacitance of the parallel plate capacitor is also kept substantially constant.
　受電回路３５は、可動部３に設けられており、非接触受電用素子３１から入力された高周波電力を変成して、電気負荷９１に出力する。非接触給電の給電対象となる電気負荷９１は、具体的には前述した可動本体部１６０上のＸ軸モータ、電機子、電装品、および制御基板などである。図２において、電気負荷９１は二分割されて示されているが、これに限定されず、実際には３個以上であってもよい。また、複数の電気負荷９１の動作電圧が異なっていてもよい。 The power receiving circuit 35 is provided in the movable part 3, transforms the high frequency power input from the non-contact power receiving element 31, and outputs it to the electric load 91. Specifically, the electrical load 91 to be fed by non-contact power feeding is the X-axis motor, armature, electrical component, control board, and the like on the movable main body 160 described above. In FIG. 2, the electric load 91 is divided into two parts, but is not limited thereto, and may actually be three or more. Further, the operating voltages of the plurality of electric loads 91 may be different.
　受電回路３５の入力端子は、電源線３５１により一方が第１の受電用素子３１に接続され、他方が第２の受電用素子３１に接続されている。受電回路３５の出力端子は、給電線３５２により電気負荷９１に接続されている。電気負荷９１は直流負荷および交流負荷のいずれでもよく動作電圧の大きさも限定されないが、受電回路３５は電気負荷９１に対応した電圧出力機能を具備する必要がある。受電回路３５には、例えば、入力された高周波電力を直流電力に変換する全波整流回路や、商用周波交流電力に変換するインバータ回路などを用いることができる。また、複数の電気負荷９１の動作電圧や周波数が異なる場合には、マルチ出力形の受電回路３５を用いることができる。 One input terminal of the power receiving circuit 35 is connected to the first power receiving element 31 by the power line 351 and the other is connected to the second power receiving element 31. An output terminal of the power receiving circuit 35 is connected to the electric load 91 by a power supply line 352. The electric load 91 may be either a DC load or an AC load, and the magnitude of the operating voltage is not limited, but the power receiving circuit 35 needs to have a voltage output function corresponding to the electric load 91. As the power receiving circuit 35, for example, a full-wave rectifier circuit that converts input high-frequency power into DC power, an inverter circuit that converts it into commercial-frequency AC power, or the like can be used. Further, when the operating voltages and frequencies of the plurality of electric loads 91 are different, a multi-output type power receiving circuit 35 can be used.
　図２に示されるように、高周波電源回路２５、２個の給電用素子２１、２個の受電用素子３１、および受電回路３５により、電気負荷９１に静電結合方式で非接触給電を行う閉回路が構成されている。高周波電源回路２５から出力された高周波電力は、電源線２５１を介して２個の給電用素子２１に入力され（図２の破線矢印Ｅ１）、平行板コンデンサの静電結合の作用により２個の受電用素子３１に非接触給電される（破線矢印Ｅ２）。さらに、２個の受電用素子３１が受け取った高周波電力は、電源線３５１を介して受電回路３５に入力され（破線矢印Ｅ３）、受電回路３５の内部で変成されて電気負荷９１に給電される（破線矢印Ｅ４）。これにより、電気負荷９１が動作して、熱損失が発生する。 As shown in FIG. 2, the high-frequency power supply circuit 25, the two power feeding elements 21, the two power receiving elements 31, and the power receiving circuit 35 are closed to perform non-contact power feeding to the electric load 91 by an electrostatic coupling method. A circuit is configured. The high-frequency power output from the high-frequency power supply circuit 25 is input to the two power feeding elements 21 via the power supply line 251 (broken line arrow E1 in FIG. 2), and the two high-frequency powers are caused by the electrostatic coupling action of the parallel plate capacitor. Contactless power is supplied to the power receiving element 31 (broken line arrow E2). Further, the high frequency power received by the two power receiving elements 31 is input to the power receiving circuit 35 via the power line 351 (broken line arrow E3), transformed inside the power receiving circuit 35, and fed to the electric load 91. (Dashed arrow E4). As a result, the electrical load 91 operates and heat loss occurs.
　次に、実施形態の非接触給電装置１の冷却構造（熱的な構成）について説明する。電気負荷９１と受電用素子３１との間には、伝熱部材４が配設されている。伝熱部材４は、電気負荷９１から受電用素子３１への熱伝導を促進するとともに、両者の間の電気絶縁を保つ部材である。伝熱部材４には、例えば、樹脂のうち熱伝導率が比較的大きな材質で形成した伝熱シートを用いることができる。伝熱部材４は、電気負荷９１および受電用素子３１の双方に密着して良好に熱伝導を行えるとともに、電気絶縁や機械的強度などの制約が許す範囲で薄いことが好ましい。 Next, the cooling structure (thermal configuration) of the contactless power supply device 1 of the embodiment will be described. The heat transfer member 4 is disposed between the electric load 91 and the power receiving element 31. The heat transfer member 4 is a member that promotes heat conduction from the electrical load 91 to the power receiving element 31 and maintains electrical insulation between the two. For the heat transfer member 4, for example, a heat transfer sheet formed of a material having a relatively high thermal conductivity among resins can be used. The heat transfer member 4 is preferably thin as long as the heat transfer member 4 is in close contact with both the electric load 91 and the power receiving element 31 and can conduct heat well, and limits such as electrical insulation and mechanical strength are allowed.
　受電用素子３１は、非接触給電用素子２１に離隔対向する表面に、熱放射層３２を有している。熱放射層３２は、電気負荷９１で発生して伝導した熱を高い放射率で放射するものである。熱放射層３２には、例えば、熱を遠赤外線に変換して放射する機能材料を含んで形成されたシート材または塗膜を用いることができる。熱を遠赤外線に変換して放射する機能材料は、既に複数種類が市販されているが、化学的組成などは殆ど公開されていない。これに限定されず、熱放射層３２に代えて、受電用素子３１の表面を熱放射率の高い黒色塗装面としてもよい。さらには、熱放射率の高いメッキ面としたり、微小凹凸を設けて熱放射率を高くした加工処理面としたりしてもよい。 The power receiving element 31 has a heat radiation layer 32 on a surface facing the non-contact power feeding element 21 at a distance. The heat radiation layer 32 radiates heat generated and conducted by the electrical load 91 with high emissivity. For the heat radiation layer 32, for example, a sheet material or a coating film formed by including a functional material that converts heat into far infrared rays and emits it can be used. A plurality of types of functional materials that convert heat into far-infrared rays and radiate them are already on the market, but their chemical composition and the like are hardly disclosed. However, the surface of the power receiving element 31 may be a black painted surface having a high thermal emissivity, instead of the heat radiation layer 32. Furthermore, it may be a plated surface with a high thermal emissivity, or a processed surface with a high thermal emissivity by providing minute irregularities.
　また、熱放射層３２を絶縁材料で形成することにより、絶縁層を兼ねることができる。これにより、熱放射層３２で、受電用素子３１と給電用素子２１との間の電気絶縁を補強して、絶縁性能を向上できる。 Also, by forming the heat radiation layer 32 with an insulating material, it can also serve as an insulating layer. As a result, the heat radiation layer 32 can reinforce the electrical insulation between the power receiving element 31 and the power feeding element 21 and improve the insulation performance.
　一方、固定部２側の給電用素子２１は、受電用素子３１に離隔対向する表面に、熱を高い吸収率で吸収する熱吸収層２２を有している。熱吸収層２２は、受電用素子３１の熱放射層３２と同じ構成とすることができ、あるいは異なる構成でもよい。さらには、熱放射層３２と同様に、熱吸収層２２を黒色塗装面、メッキ面、加工処理面などに代えることもできる。また、熱吸収層２２を絶縁材料で形成して絶縁層を兼ねることができるのも同様である。 On the other hand, the power supply element 21 on the fixed portion 2 side has a heat absorption layer 22 that absorbs heat at a high absorption rate on the surface that is spaced apart from the power reception element 31. The heat absorption layer 22 may have the same configuration as the heat radiation layer 32 of the power receiving element 31 or may have a different configuration. Furthermore, similarly to the heat radiation layer 32, the heat absorption layer 22 can be replaced with a black painted surface, a plated surface, a processed surface, or the like. Similarly, the heat absorption layer 22 can be formed of an insulating material and can also serve as an insulating layer.
　また、給電用素子２１には、多数の吐出孔２３が形成されており、図２には６個が例示されている。吐出孔２３は、給電用素子２１の裏面から表面側の熱吸収層２２を貫通して穿設されている。吐出孔２３の出口は、受電用素子３１に向かって開口している。吐出孔２３の内面には、小さな凹凸状の放熱フィン２４が形成されている。 Further, a large number of discharge holes 23 are formed in the power feeding element 21, and six are illustrated in FIG. The discharge hole 23 is drilled from the back surface of the power feeding element 21 through the heat absorption layer 22 on the front surface side. The outlet of the discharge hole 23 opens toward the power receiving element 31. On the inner surface of the discharge hole 23, small uneven fins 24 are formed.
　さらに、能動冷却手段としての冷媒供給装置５が固定部２側に配設されている。冷媒供給装置５は、給電用素子２１に穿設された吐出孔２３から冷媒流体を給電用素子２１と受電用素子３１との間に吐出する。本第１実施形態では、冷媒流体に冷却エアを用い、冷媒供給装置５にエアポンプを用いる。冷媒供給装置５から吐出孔２３の入口までの間は、エアダクト５１が形成されて漏気しないようになっている。エアダクト５１は、例えば、固定部２の軌道部材１５１の底面を二重底にして形成することができる。 Furthermore, a refrigerant supply device 5 as an active cooling means is disposed on the fixed portion 2 side. The refrigerant supply device 5 discharges the refrigerant fluid between the power supply element 21 and the power reception element 31 from the discharge hole 23 formed in the power supply element 21. In the first embodiment, cooling air is used as the refrigerant fluid, and an air pump is used as the refrigerant supply device 5. An air duct 51 is formed between the refrigerant supply device 5 and the inlet of the discharge hole 23 so as not to leak. The air duct 51 can be formed, for example, with the bottom surface of the track member 151 of the fixed portion 2 being a double bottom.
　冷媒供給装置５が動作すると、外気から冷却エアを吸入して、エアダクト５１に送給する。冷却エアは、エアダクト５１を経由して吐出孔２３の入口に供給される（図２の実線矢印Ｈ１）。冷却エアは、吐出孔２３を通り抜け（実線矢印Ｈ２）、その際に放熱フィン２４に当たって給電用素子２１を冷却する。その後、冷却エアは、吐出孔２３の出口から給電用素子２１と受電用素子３１との間に吐出される。給電用素子２１における冷却エアの吐出状況は、エアホッケーと呼ばれる遊戯機の動作状況とイメージ的に類似している。吐出された冷却エアは、給電用素子２１と受電用素子３１との間を流れながら（実線矢印Ｈ３）、強制対流によって両素子２１、３１を冷却し、最終的には外部に排気される。 When the refrigerant supply device 5 operates, the cooling air is sucked from outside air and supplied to the air duct 51. The cooling air is supplied to the inlet of the discharge hole 23 via the air duct 51 (solid arrow H1 in FIG. 2). The cooling air passes through the discharge hole 23 (solid arrow H2), hits the radiation fin 24 at that time, and cools the power feeding element 21. Thereafter, the cooling air is discharged from the outlet of the discharge hole 23 between the power feeding element 21 and the power receiving element 31. The discharge state of the cooling air in the power supply element 21 is similar in image to the operation state of a game machine called air hockey. The discharged cooling air flows between the power feeding element 21 and the power receiving element 31 (solid arrow H3), cools both the elements 21 and 31 by forced convection, and is finally exhausted to the outside.
　なお、冷媒流体に冷却オイルを用い、冷媒供給装置５にオイルポンプを用いて、冷却オイルを循環使用する構成を採用することもできる。この場合には、冷媒供給装置５から吐出孔２３の入口までのエアダクト５１に代えて供給オイルダクトを設け、加えて、給電用素子２１と受電用素子３１との間から排出された冷却オイルをオイルポンプに戻すための回収オイルダクトを設ける。また、冷却エアや冷却オイル以外の冷媒流体を用いることもできる。 In addition, it is also possible to employ a configuration in which cooling oil is circulated and used by using cooling oil as the refrigerant fluid and an oil pump in the refrigerant supply device 5. In this case, a supply oil duct is provided instead of the air duct 51 from the refrigerant supply device 5 to the inlet of the discharge hole 23, and in addition, the cooling oil discharged from between the power feeding element 21 and the power receiving element 31 is supplied. A recovery oil duct is provided to return to the oil pump. Moreover, refrigerant fluids other than cooling air and cooling oil can also be used.
　次に、上述のように構成された第１実施形態の非接触給電装置１の冷却作用、および効果について説明する。電気負荷９１で発生した全熱量のうちの一部は可動部３の表面から直接的に外部に放散されるが、その他の熱量は伝熱部材４を経由して受電用素子３１に伝導する。受電用素子３１は放熱フィンに兼用されており、伝熱部材４で電気負荷９から受電用素子３１への熱の伝導が促進されている。 Next, the cooling action and effects of the non-contact power feeding device 1 according to the first embodiment configured as described above will be described. A part of the total amount of heat generated by the electrical load 91 is directly dissipated from the surface of the movable portion 3 to the outside, but the other amount of heat is conducted to the power receiving element 31 via the heat transfer member 4. The power receiving element 31 is also used as a heat radiation fin, and heat conduction from the electric load 9 to the power receiving element 31 is promoted by the heat transfer member 4.
　受電用素子３１の熱は、熱放射層３２の作用により空気中に放射され、放射された熱の多くは熱吸収層２２の作用により給電用素子２１に吸収される。ここで、給電用素子２１および受電用素子３１はそれぞれ電極であり、大きな電極面積が確保され、かつ平行する電極間の距離が狭められている。したがって、受電用電極３１から給電用電極２１への熱輻射が効率良く行われ、給電用電極２１からもかなりの熱が外部に放散される。これにより、両素子２１、３１が放熱フィンの役割を果たして、実効的な放熱面積が増加する。 The heat of the power receiving element 31 is radiated into the air by the action of the heat radiation layer 32, and most of the radiated heat is absorbed by the power feeding element 21 by the action of the heat absorption layer 22. Here, each of the power feeding element 21 and the power receiving element 31 is an electrode, a large electrode area is ensured, and the distance between the parallel electrodes is narrowed. Therefore, heat radiation from the power receiving electrode 31 to the power feeding electrode 21 is efficiently performed, and considerable heat is also dissipated from the power feeding electrode 21 to the outside. Thereby, both the elements 21 and 31 play the role of a radiation fin, and an effective heat radiation area increases.
　さらに、能動的な冷却として、冷却エアによる強制対流冷却が行われる。すなわち、給電用素子２１と受電用素子３１との間を流れる冷却エアにより、両素子２１、２２が強制対流冷却される。ここで、給電用電極２１の吐出孔２３から冷媒流体を電極２１、３１間に吐出するので、冷却エアの全量が冷却に有効利用される。また、冷却エアが狭められた電極２１、３１間を通るので、効率良く受電用電極３１および給電用電極２１の両方を冷却できる。さらに、給電用素子２１は、突出孔２３の内面の放熱フィン２４によっても強制対流冷却されて一層効率良く冷却される。 Furthermore, forced convection cooling with cooling air is performed as active cooling. That is, both elements 21 and 22 are forcedly convectively cooled by the cooling air flowing between the power feeding element 21 and the power receiving element 31. Here, since the coolant fluid is discharged between the electrodes 21 and 31 from the discharge hole 23 of the power feeding electrode 21, the entire amount of the cooling air is effectively used for cooling. Moreover, since the cooling air passes between the narrowed electrodes 21 and 31, both the power receiving electrode 31 and the power feeding electrode 21 can be efficiently cooled. Furthermore, the power feeding element 21 is also cooled by the forced convection cooling by the radiating fins 24 on the inner surface of the projecting hole 23 so as to be more efficiently cooled.
　以上の総合的な作用により、受電用電極３１を極めて効率良く冷却して、電気負荷９１の温度上昇を格段に抑制できる。また、非接触給電に必要な受電用素子３１を放熱フィンに兼用するので可動部３には専用の放熱フィンが不要になる。加えて、冷媒供給装置５は固定部２側に設けることができる。したがって、可動部３を小形軽量化できる。これにより、可動部３を駆動するための駆動力は小さくて済み、可動部３の移動速度の制約も少なくなる。 Due to the above comprehensive action, the power receiving electrode 31 can be cooled extremely efficiently, and the temperature rise of the electric load 91 can be remarkably suppressed. In addition, since the power receiving element 31 necessary for the non-contact power supply is also used as the radiation fin, the movable portion 3 does not need a dedicated radiation fin. In addition, the refrigerant supply device 5 can be provided on the fixed portion 2 side. Therefore, the movable part 3 can be reduced in size and weight. Thereby, the driving force for driving the movable part 3 can be small, and the restriction on the moving speed of the movable part 3 is reduced.
　次に、能動冷却手段が異なる第２実施形態の非接触給電装置１Ａについて、第１実施形態と異なる点を主に説明する。図３は、第２実施形態の非接触給電装置１Ａを概念的に説明する構成図である。第２実施形態の非接触給電装置１Ａは、第１実施形態と同じ高周波電源回路２５、受電用素子３１、受電回路３５、および伝熱部材４を備え、能動冷却手段としての冷媒供給装置５に代え冷輻射装置を備えて構成されている。なお、図３で、破線の矢印Ｅ１～Ｅ４は、第１実施形態と同様に電力の流れを示している。 Next, the non-contact power feeding apparatus 1A of the second embodiment having a different active cooling means will be described mainly with respect to differences from the first embodiment. FIG. 3 is a configuration diagram conceptually illustrating the contactless power feeding device 1A of the second embodiment. The non-contact power feeding apparatus 1A of the second embodiment includes the same high frequency power supply circuit 25, power receiving element 31, power receiving circuit 35, and heat transfer member 4 as in the first embodiment, and is provided in the refrigerant supply apparatus 5 as active cooling means. Instead, a cold radiation device is provided. In FIG. 3, dashed arrows E1 to E4 indicate the flow of power as in the first embodiment.
　第２実施形態の固定部２Ａ側の給電用素子２１Ａは、第１実施形態と同じ熱吸収層２２を有し、吐出孔２３は有さない。そして、給電用素子２１Ａの熱吸収層２２と反対側の裏面に、冷輻射装置としてのペルチェ素子６を有している。ペルチェ素子６は、２種類の金属の接合部に電流を流すと、一方の金属から他方の金属へ熱が移動するというペルチェ効果（Peltier effect）を利用したものである。ペルチェ素子６の低温になる側の吸熱面６１は給電用素子２１Ａに貼設され、高温になる側の放熱面６２は外気で自然冷却されるようになっている。 The power feeding element 21A on the fixed portion 2A side of the second embodiment has the same heat absorption layer 22 as that of the first embodiment, and does not have the discharge holes 23. The Peltier element 6 as a cold radiation device is provided on the back surface of the power feeding element 21A opposite to the heat absorption layer 22. The Peltier element 6 utilizes a Peltier effect in which heat is transferred from one metal to the other when an electric current is passed through a joint between two kinds of metals. The endothermic surface 61 of the Peltier element 6 on the low temperature side is attached to the power feeding element 21A, and the heat dissipation surface 62 on the high temperature side is naturally cooled by the outside air.
　さらに、給電用素子２１Ａは、両方の狭い端面に、冷輻射装置としての放熱フィン７を備えている。なお、第２実施形態ではペルチェ素子６および放熱フィン７の両方を備えるがこれに限定されない。つまり、給電用素子２１Ａを十分に冷却できるのであればどちらか一方のみを備える構成としてもよく、冷輻射装置として他の手段を備える構成としてもよい。 Furthermore, the power feeding element 21A includes heat radiating fins 7 as cold radiation devices on both narrow end faces. In addition, in 2nd Embodiment, although both the Peltier device 6 and the radiation fin 7 are provided, it is not limited to this. In other words, as long as the power feeding element 21A can be sufficiently cooled, only one of the elements may be provided, or another means may be provided as a cold radiation device.
　次に、第２実施形態の非接触給電装置１Ａの冷却作用、および効果について説明する。電気負荷９１で発生した全熱量のうちの一部は可動部３の表面から直接的に外部に放散されるが、その他の熱量は伝熱部材４を経由して受電用素子３１に伝導する。受電用素子３１は放熱フィンに兼用されており、伝熱部材４で電気負荷９から受電用素子３１への熱の伝導が促進されている。 Next, the cooling action and effects of the non-contact power feeding device 1A of the second embodiment will be described. A part of the total amount of heat generated by the electrical load 91 is directly dissipated from the surface of the movable portion 3 to the outside, but the other amount of heat is conducted to the power receiving element 31 via the heat transfer member 4. The power receiving element 31 is also used as a heat radiation fin, and heat conduction from the electric load 9 to the power receiving element 31 is promoted by the heat transfer member 4.
　一方、給電素子２１Ａは、ペルチェ素子６および放熱フィン７により冷却されてその温度が下がり、受電用素子３１との温度差が大きくなる。これにより、給電素子２１Ａから受電用素子３１への冷輻射が行われる。ここで、給電用素子２１Ａおよび受電用素子３１はそれぞれ電極であり、大きな電極面積が確保され、かつ平行する電極間の距離が狭められている。したがって、冷輻射が効率良く行われ、冷輻射に相当する分だけ受電用素子３１から給電用素子２１Ａへの熱輻射量が増加する。したがって、受電用電極３１を極めて効率良く冷却して、電気負荷９１の温度上昇を格段に抑制できる。 On the other hand, the power feeding element 21A is cooled by the Peltier element 6 and the heat radiating fins 7, and the temperature of the power feeding element 21A is reduced, and the temperature difference from the power receiving element 31 is increased. Thereby, cold radiation from the power feeding element 21A to the power receiving element 31 is performed. Here, each of the power feeding element 21A and the power receiving element 31 is an electrode, a large electrode area is ensured, and the distance between the parallel electrodes is narrowed. Therefore, cold radiation is performed efficiently, and the amount of heat radiation from the power receiving element 31 to the power feeding element 21A increases by an amount corresponding to the cold radiation. Therefore, the power receiving electrode 31 can be cooled extremely efficiently, and the temperature rise of the electric load 91 can be remarkably suppressed.
　また、第１実施形態と同様に可動部３を小形軽量化でき、可動部３を駆動するための駆動力は小さくて済み、可動部３の移動速度の制約も少なくなる。 Further, similarly to the first embodiment, the movable part 3 can be reduced in size and weight, the driving force for driving the movable part 3 can be small, and the movement speed restriction of the movable part 3 is reduced.
　次に、給電用素子２１Ｂおよび受電用素子３１Ｂの形状が異なる第３実施形態の非接触給電装置１Ｂについて、第１および第２実施形態と異なる点を主に説明する。図４は、第３実施形態の非接触給電装置１Ｂを概念的に説明する構成図である。第３実施形態の非接触給電装置１Ｂは、第１実施形態と同じ高周波電源回路２５、受電回路３５、伝熱部材４、冷媒供給装置５を備え、給電用素子２１Ｂおよび受電用素子３１Ｂは櫛型電極とされている。なお、図４で、破線の矢印Ｅ１～Ｅ４は、第１実施形態と同様に電力の流れを示している。 Next, the non-contact power feeding device 1B of the third embodiment in which the shapes of the power feeding element 21B and the power receiving element 31B are different will be described mainly with respect to differences from the first and second embodiments. FIG. 4 is a configuration diagram conceptually illustrating the non-contact power feeding device 1B of the third embodiment. The non-contact power feeding device 1B of the third embodiment includes the same high-frequency power supply circuit 25, power receiving circuit 35, heat transfer member 4, and refrigerant supply device 5 as in the first embodiment, and the power feeding element 21B and the power receiving element 31B are combs. Type electrode. In FIG. 4, dashed arrows E1 to E4 indicate the flow of power as in the first embodiment.
　第３実施形態において、固定部２Ｂ側の給電用素子２１Ｂは、図示されるように断面形状が櫛型形状の電極になっている。詳述すると、水平に延在した基部２６の上面から垂直上方に向けて、２つの矩形断面の歯部２７が互いに離隔して立設されている。基部２６および歯部２７の受電用素子３１Ｂに離隔対向する表面は、熱吸収層２２Ｂで覆われている。また、給電用素子２１Ｂには、多数の吐出孔２３Ｂが形成されており、図４には６個が例示されている。吐出孔２３Ｂは、基部２６および熱吸収層２２Ｂを貫通して穿設されている。吐出孔２３Ｂの出口は、受電用素子３１Ｂに向かって開口している。なお、第３実施形態では、吐出孔２３Ｂの内面に放熱フィンは不付きとされている。 In the third embodiment, the power feeding element 21B on the fixed portion 2B side is a comb-shaped electrode as shown in the drawing. More specifically, two rectangular cross-section tooth portions 27 are erected apart from the upper surface of the horizontally extending base portion 26 vertically upward. The surfaces of the base portion 26 and the tooth portion 27 that are spaced apart from the power receiving element 31B are covered with the heat absorption layer 22B. In addition, a large number of discharge holes 23B are formed in the power feeding element 21B, and six are illustrated in FIG. The discharge hole 23B is drilled through the base portion 26 and the heat absorption layer 22B. The outlet of the discharge hole 23B opens toward the power receiving element 31B. In the third embodiment, no radiation fin is attached to the inner surface of the discharge hole 23B.
　一方、可動部３Ｂ側の受電用素子３１Ｂも、断面形状が櫛型形状の電極になっている。詳述すると、水平に延在した基部３６の下面から垂直下方に向けて、３つの矩形断面の歯部３７が互いに離隔して立設されている。基部３６および歯部３７の給電用素子２１Ｂに離隔対向する表面は、熱放射層３２Ｂで覆われている。 On the other hand, the power receiving element 31B on the movable part 3B side is also an electrode having a comb-shaped cross section. More specifically, three rectangular cross-sectioned tooth portions 37 are erected apart from the lower surface of the horizontally extending base portion 36 in a vertically downward direction. The surfaces of the base portion 36 and the tooth portion 37 facing the power feeding element 21B are covered with the heat radiation layer 32B.
　給電用素子２１Ｂと受電用素子３１Ｂとは、歯部２７、３７同士が相互に概ね一定の離間距離で離隔しつつ互い違いに嵌合した状態で使用される。この状態は、可動部３がＹ軸方向（紙面表裏方向）に移動しても維持される。なお、図４を見易くするために、歯部２７が２個で歯部３７が３個の場合を例示しているが、実際には、より多数の歯部を設けて互い違いに嵌合させることができる。 The power feeding element 21 </ b> B and the power receiving element 31 </ b> B are used in a state where the tooth portions 27 and 37 are alternately fitted while being separated from each other by a substantially constant separation distance. This state is maintained even if the movable part 3 moves in the Y-axis direction (the front and back direction on the paper). In addition, in order to make FIG. 4 easy to see, the case where there are two tooth portions 27 and three tooth portions 37 is illustrated, but in practice, a larger number of tooth portions are provided and alternately fitted. Can do.
　第３実施形態で給電用素子２１Ｂと受電用素子３１Ｂとにより構成されるコンデンサは、第１実施形態と比較して対向する表面積が格段に拡がり、静電容量が格段に大きくなる。また、受電用素子３１Ｂから給電用素子２１Ｂへの熱輻射に寄与する表面積も格段に拡がる。さらに、冷媒供給装置５から吐出孔２３Ｂを経由して受電用素子３１Ｂと給電用素子２１Ｂとの間に冷媒流体が吐出され、これによる強制対流冷却においても冷却表面積が格段に拡がる。 In the third embodiment, the capacitor constituted by the power feeding element 21B and the power receiving element 31B has a significantly increased surface area facing the first embodiment, and the capacitance is significantly increased. Further, the surface area that contributes to thermal radiation from the power receiving element 31B to the power feeding element 21B is also greatly increased. Further, the refrigerant fluid is discharged from the refrigerant supply device 5 between the power receiving element 31B and the power feeding element 21B via the discharge hole 23B, and the cooling surface area is greatly expanded even in the forced convection cooling.
　上記したように、第３実施形態では熱輻射および強制対流冷却に寄与する表面積が第１実施形態よりも格段に拡がる。したがって、受電用素子３１Ｂを極めて効率良く冷却して、電気負荷９１の温度上昇を格段に抑制できる。また、第１実施形態と同様に可動部３を小形軽量化でき、可動部３を駆動するための駆動力は小さくて済み、可動部３の移動速度の制約は小さい。 As described above, in the third embodiment, the surface area that contributes to thermal radiation and forced convection cooling is significantly expanded compared to the first embodiment. Therefore, the power receiving element 31B can be cooled extremely efficiently, and the temperature rise of the electric load 91 can be remarkably suppressed. Further, similarly to the first embodiment, the movable portion 3 can be reduced in size and weight, the driving force for driving the movable portion 3 can be small, and the movement speed restriction of the movable portion 3 is small.
　なお、第１～第３実施形態は併用することができ、例えば、冷媒供給装置５とペルチェ素子６との両方を備えるようにしてもよい。また、本発明は、静電結合方式の非接触給電装置１、１Ａ、１Ｂへの適用が好ましいが、電磁誘導方式や磁界共鳴方式などの他方式の非接触給電装置へ適用することもできる。本発明は、その他にも様々な応用や変形が可能である。 The first to third embodiments can be used together, and for example, both the refrigerant supply device 5 and the Peltier element 6 may be provided. Further, the present invention is preferably applied to the electrostatic coupling type non-contact power feeding devices 1, 1 </ b> A, and 1 </ b> B, but can also be applied to other types of non-contact power feeding devices such as an electromagnetic induction method and a magnetic field resonance method. Various other applications and modifications are possible for the present invention.
　本発明の非接触給電装置は、部品実装機を始めとする基板用作業機器に限定されるものでなく、可動部を有して非接触給電を必要とする他の業種の産業用機器にも広く利用できる。さらには、走行中の電車に対してパンタグラフなどを用いずに非接触給電する用途や、走行中の電気自動車に対して路面から非接触給電する用途などにも利用可能である。 The non-contact power feeding device of the present invention is not limited to work equipment for substrates such as component mounting machines, but also to industrial equipment of other industries that have movable parts and need non-contact power feeding. Widely available. Further, it can be used for a non-contact power supply without using a pantograph or the like to a running train, or a non-contact power supply from a road surface to a running electric vehicle.
　　１：非接触給電装置
　　２、２Ａ、２Ｂ：固定部
　　２１、２１Ａ、２１Ｂ：給電用素子　　２２、２２Ｂ：熱吸収層
　　２３、２３Ｂ：吐出孔　　２４：放熱フィン
　　２５：高周波電源回路　　２６：基部　　２７：歯部
　　３、３Ｂ：可動部
　　３１、３１Ｂ：受電用素子　　３２、３２Ｂ：熱放射層
　　３５：受電回路　　３６：基部　　３７：歯部
　　４：伝熱部材
　　５：冷媒供給装置　　５１：エアダクト
　　６：ペルチェ素子（冷輻射装置）
　　６１：吸熱面　　６２：放熱面
　　７：放熱フィン（冷輻射装置）
　　９１：電気負荷
　　１０：部品実装機
　　１１０：基板搬送装置　　１２０：部品供給装置
　　１３０、１４０：部品移載装置　　１５０：リニアモータ機構
　　１５１：軌道部材　　１６０：可動本体部　　１６１：Ｘ軸レール
　　１７０：実装ヘッド　　１８０：表示設定装置　　１９０：機台 1: Non-contact power feeding device 2, 2A, 2B: Fixed portion 21, 21A, 21B: Power feeding element 22, 22B: Heat absorption layer 23, 23B: Discharge hole 24: Radiation fin 25: High frequency power supply circuit 26: Base 27: Tooth part 3, 3B: Movable part 31, 31B: Power receiving element 32, 32B: Thermal radiation layer 35: Power receiving circuit 36: Base part 37: Tooth part 4: Heat transfer member 5: Refrigerant supply device 51: Air duct 6: Peltier element (Cool radiation device)
61: endothermic surface 62: heat radiating surface 7: heat radiating fin (cold radiation device)
91: Electric load 10: Component mounter 110: Board transfer device 120: Component supply device 130, 140: Component transfer device 150: Linear motor mechanism 151: Track member 160: Movable main body 161: X-axis rail 170: Mounting head 180: Display setting device 190: Machine base

Claims (8)

  1. 　固定部に設けられた給電用素子と、
    　前記給電用素子に高周波電力を給電する高周波電源回路と、
    　前記固定部に移動可能に装架された可動部に設けられ、前記給電用素子に離隔対向して非接触で高周波電力を受け取る受電用素子と、
    　前記受電用素子が受け取った高周波電力を変換して前記可動部上の電気負荷に給電する受電回路とを備える非接触給電装置であって、
    　前記電気負荷から前記受電用素子への熱の伝導を促進する伝熱部材と、
    　前記固定部側に設けられて前記受電用素子を能動的に冷却する能動冷却手段と、をさらに備えた非接触給電装置。     A power feeding element provided in the fixed portion;
    A high frequency power supply circuit for supplying high frequency power to the power supply element;
    A power receiving element that is provided in a movable part that is movably mounted on the fixed part, and that receives the high frequency power in a non-contact manner, spaced apart from the power feeding element;
    A non-contact power feeding device comprising: a power receiving circuit that converts high frequency power received by the power receiving element and supplies power to the electric load on the movable part;
    A heat transfer member that promotes conduction of heat from the electrical load to the power receiving element;
    A non-contact power feeding device further comprising: active cooling means provided on the fixed portion side for actively cooling the power receiving element.
  2. 　請求項１において、前記能動冷却手段は、冷媒流体を前記給電用素子と前記受電用素子との間に流す冷媒供給装置である非接触給電装置。 2. The non-contact power feeding apparatus according to claim 1, wherein the active cooling means is a refrigerant supply apparatus that causes a refrigerant fluid to flow between the power feeding element and the power receiving element.
  3. 　請求項２において、
    　前記給電用素子および前記受電用素子はそれぞれ電極であり、
    　前記冷媒供給装置は、前記給電用素子に穿設された吐出孔から前記冷媒流体を前記給電用素子と前記受電用素子との間に吐出する非接触給電装置。     In claim 2,
    Each of the power feeding element and the power receiving element is an electrode,
    The refrigerant supply device is a non-contact power supply device that discharges the refrigerant fluid between the power supply element and the power receiving element from a discharge hole formed in the power supply element.
  4. 　請求項３において、前記給電用素子は前記吐出孔の内面に放熱フィンを有する非接触給電装置。 4. The non-contact power feeding device according to claim 3, wherein the power feeding element has a radiation fin on an inner surface of the discharge hole.
  5. 　請求項１において、前記能動冷却手段は、前記給電用素子を冷却することにより冷輻射を行って前記受電用素子を冷却する冷輻射装置である非接触給電装置。 2. The non-contact power feeding device according to claim 1, wherein the active cooling means is a cold radiation device that cools the power receiving element by cooling the power feeding element to cool the power receiving element.
  6. 　請求項５において、
    　前記給電用素子および前記受電用素子はそれぞれ電極であり、
    　前記冷輻射装置は、前記給電用素子の前記受電用素子に対向しない面に配設されたペルチェ素子または放熱フィンの少なくとも一方を含む非接触給電装置。     In claim 5,
    Each of the power feeding element and the power receiving element is an electrode,
    The said cold radiation apparatus is a non-contact electric power feeding apparatus containing at least one of the Peltier element or the radiation fin arrange | positioned in the surface which does not oppose the said electric power receiving element of the said electric power feeding element.
  7. 　請求項１～６のいずれか一項において、
    　前記受電用素子は、前記給電用素子に離隔対向する表面に、前記電気負荷で発生して伝導した熱を高い放射率で放射する熱放射層または熱放射面を有し、
    　前記給電用素子は、前記受電用素子に離隔対向する表面に、熱を高い吸収率で吸収する熱吸収層または熱吸収面を有する非接触給電装置。     In any one of claims 1 to 6,
    The power receiving element has a heat radiating layer or a heat radiating surface that radiates heat generated and conducted by the electric load at a high emissivity on a surface facing the power feeding element.
    The non-contact power feeding device, wherein the power feeding element has a heat absorbing layer or a heat absorbing surface that absorbs heat at a high absorption rate on a surface facing the power receiving element.
  8. 　請求項１～７のいずれか一項において、
    　前記給電用素子および前記受電用素子は、前記可動部の移動方向と直角な断面形状が基部および前記基部から延在する複数の歯部からなる櫛型であって、前記複数の歯部同士が相互に離隔しつつ互い違いに嵌合した櫛型電極である非接触給電装置。     In any one of claims 1 to 7,
    The power feeding element and the power receiving element are comb-shaped in which a cross-sectional shape perpendicular to the moving direction of the movable part is a base part and a plurality of tooth parts extending from the base part. A non-contact power feeding device which is a comb-shaped electrode which is alternately fitted while being separated from each other.
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EP3151368A1 (en) * 2014-09-17 2017-04-05 Toyota Jidosha Kabushiki Kaisha Non-contact power transmitting/receiving system and power receiving device and power transmission device in non-contact power transmitting/receiving system
JP7358296B2 (en) 2020-05-19 2023-10-10 新光電気工業株式会社 Contactless power supply device

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