JP6164749B2 - High frequency power coil and method of manufacturing the same - Google Patents

Description

  The present invention relates to a coil used in a circuit for supplying and transferring power at a high frequency, and a manufacturing method thereof.

  There are solder printing machines, component mounting machines, reflow machines, board inspection machines, etc. as board work equipment that produces boards with a large number of components mounted, and these are connected by a board transport device to build a board production line. There are many cases. Many of these board work devices have a movable part that moves above the board to perform a predetermined work, and use a non-contact power feeding device to feed power to the electric load on the movable part in a non-contact manner. There is. Conventionally, an electromagnetic induction method using a coil has been widely used as a method of a non-contact power supply device, but recently, an electrostatic coupling method in which a capacitor is configured by opposing electrodes has been used.

  In a non-contact power supply apparatus, in order to ensure a large power supply capacity and high power supply efficiency, it is common to configure a resonance circuit from a fixed part to a movable part and supply power using a high frequency of the resonance frequency. For this reason, a coil is used in addition to the capacitor in the electrostatic coupling method. In the coil for high frequency power used in the non-contact power feeding device, the skin effect is remarkably generated due to the high frequency. In other words, even if a large amount of current flows near the surface of the conductor, the current decreases as it enters the conductor, and the current per unit cross-sectional area of the conductor, that is, the current density is lower than in the case of commercial frequency AC or DC. . Nevertheless, due to restrictions on the manufacturing method, solid conductors have been used for manufacturing high-frequency power coils.

  Patent Document 1 discloses a technical example of a conductive wire suitable for this type of high frequency power application. The lightning rod lightning conductor of Patent Document 1 has a substantially cylindrical central insulator as a core, and a main conductor, a stress control layer, an intermediate insulating layer, a stress control layer, a shield conductor, and a jacket are provided outside the core insulator. They are arranged concentrically sequentially. That is, in order to reduce the influence of the skin effect when a high-frequency lightning current flows, a tubular main conductor is used instead of the solid conductor. Thus, it is described that the lightning current easily flows, the amount of conductors is small, the manufacturing cost can be reduced, and the workability during laying and transportation can be improved by weight reduction.

Registered Utility Model No. 3058547

  By the way, in the high frequency power coil using the solid conductor of the prior art, in order to supply sufficient power, it is necessary to increase the cross-sectional area of the conductor as much as the current density is reduced by the skin effect. As a result, the high-frequency power coil becomes heavy, which has become a bottleneck for reducing the weight of the non-contact power feeding device.

  Moreover, although the lightning conductor technique of Patent Document 1 is preferable in that the influence of the skin effect is reduced and the lightning current is easy to flow, it is not suitable for manufacturing a high frequency power coil. In other words, this lightning conductor is specially designed for grounding the lightning rod, a stress control layer is provided as a measure against the stress generated when a lightning strike current flows, and a shield conductor is provided as a measure to block the influence of noise. ing. Therefore, the structure is excessive for use in the coil. Further, since the rigidity is too large, it is actually difficult to wind in a spiral shape.

  The present invention has been made in view of the above problems of the background art, and can partially increase the current density at a high frequency as compared with the prior art, and can reduce the weight as compared with the prior art and can be easily manufactured. It is an object to be solved to provide a power coil and a manufacturing method thereof.

An example of the invention of the high-frequency power coil that solve the above problems, a conductor layer of two or more layers of the tubular disposed coaxially and out around the formed axial with a conductive material, specific gravity than the conductive material A center insulating layer formed of an insulating material having a small thickness and disposed at the axis, an interlayer insulating layer formed of an insulating material having a specific gravity smaller than that of the conductor material and interposed between the conductor layers, A coil for high-frequency power in which a multilayer wire consisting of an outer sheath layer that covers the outer side of the outer conductor layer is wound in a spiral shape, and includes two feeding electrodes on the fixed part side, a high-frequency power supply part, and 2 This is used for at least one of the resonance inductors of a non-contact power feeding apparatus configured by a single resonance inductor, two power reception electrodes on the movable portion side, and a power reception conversion unit.

In one example of the present invention, the high frequency power coil is used for the two resonance inductors, and the inductance values are equal to each other.

In one example of the present invention, the conductive material is a metal material, and the insulating material is a resin material or a ceramic material.

An example of the present invention is a method for manufacturing a high-frequency power coil, wherein an inner conductor layer forming step of forming an inner conductor layer by covering an outer periphery of the central insulating layer with the conductor material, and the inner conductor layer An insulating layer forming step of forming the interlayer insulating layer by covering the outer periphery of the insulating layer with the insulating material, a conductor layer forming step of forming the outer conductive layer by covering the outer periphery of the interlayer insulating layer with the conductive material, and an outer side A coating layer forming step of manufacturing the multilayer wire by forming the jacket layer on the outer periphery of the conductor layer, and a coil forming step of winding the multilayer wire in a spiral shape.

In an example of the present invention, the multilayer wire includes three or more conductor layers, and the insulating layer forming step and the conductor layer forming step are repeated according to the number of layers of the conductor layers.

The invention according to claim 1 is formed of two or more tubular conductor layers formed of a conductor material and arranged coaxially around the axis, and an insulating material having a specific gravity smaller than that of the conductor material. A central insulating layer disposed on the axis, an interlayer insulating layer formed of an insulating material having a specific gravity smaller than that of the conductive material and interposed between the conductive layers, and an outer side of the outermost conductive layer. A coil core forming step of forming the central insulating layer by forming the insulating material into a spiral shape, the method for manufacturing a coil for high-frequency power obtained by winding a multilayer wire consisting of an outer sheath layer in a spiral shape; An inner conductor layer forming step of forming the inner conductor layer by covering the outer periphery of the central insulating layer with the conductor material, and an insulation for covering the outer periphery of the inner conductor layer with the insulating material to form the interlayer insulating layer A layer forming step and an outer periphery of the interlayer insulating layer Having a conductor layer forming step of forming the conductive layer of the outer covering in the body material, the jacket layer forming step of forming the outer casing layer in the outer periphery of the outer of said conductive layer.

According to a second aspect of the present invention, in the first aspect , the multilayer wire material includes three or more conductive layers, and the insulating layer forming step and the conductive layer forming step according to the number of the conductive layers. repeat.

In one example of the present invention, the conductor material is a metal material, and at least part of the inner conductor layer forming step and the conductor layer forming step, the inner conductor layer or the outer conductor layer is formed by plating or vapor deposition. Form.

  The invention according to claim 9 is the method according to any one of claims 4 to 8, wherein the insulating material forming the interlayer insulating layer is a resin material or a ceramic material, and at least a part of the insulating layer forming step, The interlayer insulating layer is formed by dipping or vapor deposition.

  In the high frequency power coil according to the first aspect of the present invention, the conductor layers constituting the multilayer wire are separated into two or more tubular shapes and arranged inside and outside the coaxial, and the influence of the skin effect when the high frequency current flows is reduced. Therefore, the current density can be partially increased as compared with the conventional solid electric wire. This means that the amount of conductor material used can be reduced by reducing the cross-sectional area of the conductor. The central insulating layer and the interlayer insulating layer of the multilayer wire can be formed of an insulating material having a specific gravity smaller than that of the conductor material. For this reason, the weight of a multilayer wire becomes lighter than the solid conductor of the same cross-sectional area of the same conductor material, and the weight of the coil for high frequency electric power can be reduced conventionally.

In one example of the present invention, the high frequency power coil is used in a non-contact power feeding device. Thereby, the whole non-contact electric power feeder can be reduced in weight.

In one example of the present invention, the conductive material is a metal material, and the insulating material is a resin material or a ceramic material. The specific gravity of a resin material or a ceramic material is significantly smaller than the specific gravity of a metal material such as copper generally used as a conductor material. Therefore, the multilayer wire in which a part of the metal material constituting the solid conductor is replaced with a resin material or a ceramic material is significantly lighter than the solid conductor, and the high frequency power coil can be significantly reduced in weight.

  In the invention according to claim 4, first, a multilayer wire is manufactured by sequentially forming an inner conductor layer, an interlayer insulating layer, an outer conductor layer, and a jacket layer with the stretched central insulating layer as a core. Next, the high frequency power coil can be manufactured by winding the multilayer wire in a spiral shape. These manufacturing processes are easy and easy to manufacture.

  In the invention which concerns on Claim 5, according to the number of layers of three or more conductor layers in the stretched state, the insulating layer forming step and the conductor layer forming step are repeated. That is, even if the number of conductor layers of the multilayer wire is increased, the number of repetitions of the two steps is increased, so that the high frequency power coil can be easily manufactured.

  In the invention according to claim 6, first, an insulating material is molded into a spiral shape to form a central insulating layer corresponding to the coil core, and then an inner conductor layer, an interlayer insulating layer, an outer periphery around the central insulating layer The coil for high frequency power can be manufactured by sequentially forming the conductor layer and the covering layer. These manufacturing processes are not excessive or wasteful, and are particularly easy to manufacture because there is no need to bend and wind the multilayer wire.

  In the invention according to claim 7, the insulating layer forming step and the conductor layer forming step are repeated in accordance with the number of layers of three or more conductor layers in a spiral shape. That is, even if the number of conductor layers of the multilayer wire is increased, the number of repetitions of the two steps is increased, so that the high frequency power coil can be easily manufactured.

  In the invention according to claim 8, the conductor material is a metal material, and the inner conductor layer or the outer conductor layer is formed by plating or vapor deposition. The plating method and the vapor deposition method are industrially stable manufacturing techniques, and a conductor layer having a desired thickness can be formed with high quality.

  In the invention according to claim 9, the insulating material for forming the interlayer insulating layer is a resin material or a ceramic material, and the interlayer insulating layer is formed by dipping or vapor deposition. The dipping method and the vapor deposition method are industrially stable manufacturing techniques, and an interlayer insulating layer having a desired thickness can be formed with high quality.

It is a block diagram which illustrates typically the non-contact electric power feeder which can apply the coil for high frequency electric power of this invention. It is a figure explaining the multilayer wire used as the main material of the coil for high frequency electric power of this invention. It is a figure explaining the condition of the skin effect in the conventional solid conducting wire. It is a figure explaining the situation of the skin effect in the multilayer wire used for the coil for high frequency electric power of an embodiment. It is a figure of the flowchart explaining the manufacturing method of 1st Embodiment of the coil for high frequency electric power. It is a figure of the flowchart explaining the manufacturing method of 2nd Embodiment of the coil for high frequency electric power.

First, a non-contact power feeding device 9 to which the present invention can be applied will be described with reference to FIG. FIG. 1 is a configuration diagram schematically illustrating a non-contact power feeding device 9 to which the high frequency power coil of the present invention can be applied. In FIG. 1, the detailed structures of the fixed portion 91 shown on the lower side and the movable portion 92 shown on the upper side are omitted, but the movable portion 92 is movably mounted on the fixed portion 91. The non-contact power feeding device 9 is a device that performs non-contact power feeding from the fixed portion 91 to the electric load 99 on the movable portion 92 by an electrostatic coupling method. The non-contact power feeding device 9 includes two power feeding electrodes 931 and 932 on the fixed portion 91 side, a high frequency power source portion 94, two resonance inductors 951 and 952, and two power receiving electrodes on the movable portion 92 side. 961 and 962 and a power receiving conversion unit 97.

  The two first and second feeding electrodes 931 and 932 on the fixed portion 91 side are formed using a metal plate or the like. On the other hand, the two first and second power receiving electrodes 961 and 962 on the movable portion 92 side are also formed using a metal plate or the like. The first and second power feeding electrodes 931 and 932 and the first and second power receiving electrodes 961 and 962 are arranged in parallel with a one-to-one spacing. Thereby, two parallel plate-like first and second capacitors 963 and 964 having the same capacitance C are formed.

  The high frequency power supply unit 94 on the fixed unit 91 side supplies high frequency power having a power supply frequency of 100 kHz to MHz, for example. The power supply frequency and output voltage of the high-frequency power supply unit 94 can be adjusted, and examples of the output voltage waveform include a sine wave and a rectangular wave. One output terminal 941 of the high frequency power supply unit 94 is connected to the first resonance inductor 951, and the other output terminal 942 is connected to the second resonance inductor 952.

  The first resonance inductor 951 on the fixed portion 91 side is connected in series between one output terminal 941 of the high frequency power supply portion 94 and the first power feeding electrode 931. The second resonance inductor 952 is connected in series between the other output terminal 942 of the high frequency power supply unit 94 and the second power feeding electrode 932. As the first and second resonance inductors 951, coils having the same inductance value L are used.

  The power receiving conversion unit 97 on the movable unit 92 side has two input terminals 971 and 972 connected to the first and second power receiving electrodes 961 and 962, and two output terminals 973 and 974 connected to the electric load 99. . The power receiving conversion unit 97 converts the high frequency power received by the first and second power receiving electrodes 961 and 962 and supplies the electric load 99 with power. The power receiving conversion unit 97 is configured according to the power supply specifications of the electric load 99, and for example, a full-wave rectifier circuit or an inverter circuit is used.

  Here, a series resonant circuit is formed in order to improve the feeding capacity and feeding efficiency. That is, the capacitance C of the first and second capacitors 963 and 964 and the inductance value L of the first and second resonance inductors 951 and 952 are set so that series resonance occurs at the power supply frequency of the high-frequency power supply unit 94. Designed. The high frequency power coil of the present invention can be applied to the first and second resonance inductors 951 and 952.

  The coil for high frequency power of the present invention is manufactured by winding the multilayer wire 1 in a spiral shape. FIG. 2 is a view for explaining the multilayer wire 1 which is the main material of the high frequency power coil of the present invention. As shown in FIG. 2, the multilayer wire 1 has a five-layer structure arranged inside and outside the same axis.

  A central insulating layer 2 is disposed on the axis of the multilayer wire 1. The central insulating layer 2 is formed of a linear insulating material having a circular cross section. A tubular inner conductor layer 3 made of a conductor material is disposed on the outer periphery of the central insulating layer 2. An interlayer insulating layer 4 made of an insulating material is disposed on the outer periphery of the inner conductor layer 3. A tubular outer conductor layer 5 formed of a conductor material is disposed on the outer periphery of the interlayer insulating layer 4. An outer cover layer 6 made of an insulating material is disposed on the outer periphery of the outer conductor layer 5.

  Each of the five layers 2 to 6 is formed in close contact with each other in the radial direction. For the conductor material forming the inner conductor layer 3 and the outer conductor layer 5, for example, a metal material such as copper can be used, and the same material is preferable. This is because the inner conductor layer 3 and the outer conductor layer 5 are used in parallel, so that if the conductivity σ of both the layers 3 and 5 is different from each other, a large amount of current flows through one of the layers, This is because the layer cannot be used effectively.

  On the other hand, as the insulating material forming the central insulating layer 2 and the interlayer insulating layer 4, for example, a resin material or a ceramic material can be used, and the same material or different materials may be used. The specific gravity of these insulating materials is significantly smaller than the specific gravity of conductor materials including copper. The insulating material forming the outer cover layer 6 may be the same material as the central insulating layer 2 or the interlayer insulating layer 4 or may be a different material. However, since the jacket layer 6 is disposed on the outermost periphery of the multilayer wire 1 and is in contact with other structural members and the outside air, the insulating material has good mechanical strength and good environmental resistance in addition to good insulating performance. It is preferable to form using.

  The radial layer thicknesses of the inner conductor layer 3, the interlayer insulating layer 4, and the outer conductor layer 5 can be appropriately designed so as to reduce the influence of the skin effect on the high frequency. Also, a plurality of layers of the interlayer insulating layers 4 and the outer conductor layers 5 can be provided alternately to form a multilayer wire having three or more conductor layers.

  A coil for high frequency power according to the embodiment is obtained by winding the multilayer wire 1 described above in a spiral shape around a coil axis. The high frequency power coil may be a coil with an iron core having an iron core on the coil axis, or an air core coil having a hollow coil axis. In addition, the high frequency power coil may be a single-layer coil wound only from one end to the other end in the axial direction, or a two-layer coil folded at the other end to have a two-layer structure, or more than that. A multilayer coil may be used.

  Next, the operation and effect of the high frequency power coil according to the embodiment will be described focusing on the skin effect of the multilayer wire 1 and the conventional solid conductor 7. FIG. 3 is a diagram for explaining the situation of the skin effect in the conventional solid conductor 7. The upper side of FIG. 3 shows the cross-sectional shape of the solid conducting wire 7, and the lower side shows the current density J7 at the radial position. Moreover, FIG. 4 is a figure explaining the condition of the skin effect in the multilayer wire 1 used for the coil for high frequency electric power of embodiment. The upper side of FIG. 4 shows the cross-sectional shape of the multilayer wire 1, and the lower side shows the current density J1 at the radial position.

As shown in FIG. 3, the solid conducting wire 7 includes a columnar conductor 71 and a jacket layer 72 formed on the outer peripheral side of the conductor 71. The conductor 71 is made of the same material as the inner and outer conductor layers 3 and 5 of the multilayer wire 1, and the outer diameter D1 is equal to the outer diameter D1 of the outer conductor layer 5 of the multilayer wire 1 shown in FIG. 4. Match. In the solid conductor 7, the current density J7 is the maximum value Jmax on the surface of the conductor 71, and decreases as it enters the inside. In general, the state of the skin effect is represented by the skin depth δ as a representative value. The skin depth δ is a depth at which the current density J7 decreases from the maximum value Jmax on the surface of the conductor 71 to about 37% (= 1 / e), and is expressed by the following equation (1). However, the high frequency f applied, the magnetic permeability μ of the conductor material, and the conductivity σ.
Skin depth δ = (π · f · μ · σ) ^-0.5 ………………… (1)

  On the other hand, as shown in FIG. 4, the current density J1 of the multilayer wire 1 is distributed in the inner and outer conductor layers 3 and 5. In the outer conductor layer 5, the current density J1 is the maximum value Jmax on the outer surface, decreases halfway into the inside, and starts increasing as the inner surface is approached. The same applies to the inner conductor layer 3, and the current density J1 is large on the outer surface, decreases until entering the inside, and starts increasing as it approaches the inner surface.

  As described above, in the multilayer wire 1, by providing the interlayer insulating layer 4 and the central insulating layer 2, the influence of the skin effect of the conductor layers 3 and 5 when a high-frequency current flows is reduced. Therefore, the current density J1 of the multilayer wire 1 is partially higher than the current density J7 of the solid conductor 7. This means that the use amount of the conductor material can be reduced by reducing the cross-sectional area of the conductor layers 3 and 5. The multilayer wire 1 corresponds to a part in which the conductor 71 of the solid conductor 7 is replaced with the central insulating layer 2 and the interlayer insulating layer 4. Accordingly, this corresponds to the replacement of the conductor material having a large specific gravity with an insulating material having a small specific gravity, and the multilayer wire 1 is significantly lighter than the solid conductor 7 by the difference in specific gravity.

  Thereby, in the coil for high frequency electric power using the multilayer wire 1, the weight can be reduced remarkably compared with the past. Furthermore, the entire contactless power supply device 9 shown in FIG. 1 can be reduced in weight.

  Next, two types of manufacturing methods of the high frequency power coil of the embodiment will be described. FIG. 5 is a flowchart for explaining the manufacturing method of the first embodiment of the coil for high-frequency power. As shown in the drawing, the manufacturing method of the first embodiment includes an inner conductor layer forming step K1, an insulating layer forming step K2, a conductor layer forming step K3, an outer layer forming step K5, a coil forming step K6, and a terminal forming step. It consists of K7. In the first embodiment, first, a stretched multilayer wire 1 is manufactured, and then the multilayer wire 1 is wound in a spiral shape to manufacture a coil for high-frequency power.

  In the inner conductor layer forming step K1 in FIG. 5, the inner conductor layer 3 is formed by covering the outer periphery of the central insulating layer 2 with a conductor material. For the central insulating layer 2, for example, a wire made of a resin material and having a circular cross section and a predetermined outer diameter is used. Further, for example, copper is used as the conductor material, and the inner conductor layer 3 having a predetermined thickness is formed by plating or vapor deposition.

  Next, in an insulating layer forming step K2, the outer periphery of the inner conductor layer 3 is covered with an insulating material to form an interlayer insulating layer 4. For example, a melted resin material is used as the insulating material, and the interlayer insulating layer 4 having a predetermined thickness is formed by dipping.

  Next, in the conductor layer forming step K3, the outer conductor layer 5 is formed by covering the outer periphery of the interlayer insulating layer 4 with a conductor material. The method for performing this step K3 can be applied to the inner conductor layer forming step K1. Through the steps so far, the inner conductor layer 3 and the outer conductor layer 5, that is, two conductor layers are formed.

  In the next step K4, it is determined whether or not the number of conductor layers is a predetermined number. If the two conductor layers 3 and 5 are sufficient, the condition is satisfied, and the process proceeds to the coating layer forming step K5. If three or more conductor layers are required, the process returns to the insulating layer forming step K2. Then, the insulating layer forming step K2 and the conductor layer forming step K3 are repeated until the number of conductor layers reaches a predetermined number.

  When the number of conductor layers reaches a predetermined number, a multilayer wire 1 is manufactured by forming a jacket layer 6 on the outer periphery of the outer conductor layer 5 in a jacket layer forming step K5. In this step K5, the insulating material for forming the outer cover layer 6 may be the same material as the interlayer insulating layer 4, and the same implementation method as in the insulating layer forming step K2 may be applied. Further, in this step K5, the insulating material for forming the covering layer 6 may be made of a material different from that of the interlayer insulating layer 4, and an implementation method corresponding to the material may be adopted.

  Next, in the coil forming step K6, the multilayer wire 1 is wound into a spiral shape and formed into a coil. At this time, in a coil with an iron core, the multilayer wire 1 may be wound directly around the iron core and formed into a coil. Alternatively, the multilayer wire 1 may be wound around a cylindrical winding mold and formed into a coil, and then the winding mold may be replaced with an iron core. Moreover, in an air-core coil, after winding the multilayer wire 1 around a winding die and forming it into a coil, the winding die is removed.

  Next, in the terminal formation step K7, all the conductor layers 3 and 5 are electrically connected to each other at both ends of the multilayer wire 1 formed into a coil, and terminals for external connection are attached to the conductive portions. Thereby, the coil for high frequency electric power is completed.

  According to the manufacturing method of the first embodiment of the high frequency power coil described above, each of the steps K1 to K7 is not excessive or wasteful. If three or more conductor layers are required, the insulating layer forming step K2 and the conductor layer forming step K3 may be repeated according to the number of conductor layers in the stretched state. Therefore, it is easy to manufacture a high frequency power coil.

  Further, the inner conductor layer 3 and the outer conductor layer 5 are formed by plating or vapor deposition, and the interlayer insulating layer 4 is formed by dipping or vapor deposition. These manufacturing methods are industrially stable manufacturing techniques, and can form the high-quality multilayer wire 1 and the high-frequency power coil by forming the conductor layers 3 and 5 and the interlayer insulating layer 4 having a desired thickness. .

  Next, FIG. 6 is a flowchart for explaining a manufacturing method of the second embodiment of the coil for high frequency power. As shown in the figure, the manufacturing method of the second embodiment includes a coil core forming step K11, an inner conductor layer forming step K12, an insulating layer forming step K13, a conductor layer forming step K14, an outer layer forming step K16, and a terminal forming. Step K17 is included. In the second embodiment, first, the central insulating layer 2 corresponding to a spiral coil core is formed, and then the layers 3 to 6 are sequentially formed around the central insulating layer 2 to manufacture a coil for high frequency power. To do.

  In the coil core forming step K11 of FIG. 6, the central insulating layer 2 is formed by molding an insulating material into a spiral shape. The formed central insulating layer 2 becomes a coil core similar to the final coil shape. As the insulating material, for example, a wire made of a thermoplastic resin material and having a circular cross section and a predetermined outer diameter can be used. By heating the wire to soften it, winding it in a cylindrical winding mold with a gap, and then solidifying it and removing the winding mold, the central insulating layer 2 corresponding to the coil core can be formed. Alternatively, the center insulating layer 2 may be formed by casting a molten resin using a mold corresponding to the coil core. Furthermore, the center insulating layer 2 may be formed by sintering a powder ceramic material using a mold corresponding to a coil core.

  From the inner conductor layer forming step K12 to the outer coat layer forming step K16 in FIG. 6 except that the target is a spiral coil core, the inner conductor layer forming step K1 to the outer coat layer forming step of the first embodiment. K5 can be applied mutatis mutandis. In the insulating layer forming step K13, a ceramic material such as a metal oxide may be used as the insulating material, and the interlayer insulating layer 4 having a predetermined thickness may be formed by an evaporation method. At the end of the envelope layer forming step K16, the helical coil has been formed. In the next terminal formation step K17, all the conductor layers 3 and 5 are electrically connected to each other at both ends of the multilayer wire 1 and terminals for external connection are attached to the conductive portions. Thereby, the coil for high frequency electric power is completed.

  According to the manufacturing method of the above-described second embodiment of the coil for high-frequency power, the steps K11 to K17 are not excessive or wasteful, and in particular, it is not necessary to bend and wind the multilayer wire 1. It is very easy to manufacture the coil. Further, the effect of producing the high-quality multilayer wire 1 and the high frequency power coil by forming the conductor layers 3 and 5 by plating or vapor deposition and forming the interlayer insulating layer 4 by dipping or vapor deposition is as follows. This is the same as in the first embodiment.

  In addition, the conductor material and insulating material which comprise the multilayer wire 1 are not limited to description of embodiment, Various materials can be used. In addition, dimensions such as the thicknesses of the respective layers 2 to 6 constituting the multilayer wire 1 can be appropriately changed. Various other applications and modifications are possible for the present invention.

  The high-frequency power coil of the present invention can be used for a power supply coil and a power reception coil of an electromagnetic induction type non-contact power supply device in addition to a resonance inductor of an electrostatic coupling type non-contact power supply device. Furthermore, the present invention can be used for applications other than the non-contact power feeding device, for example, a winding of a high frequency transformer for transforming high frequency power, a high frequency welding machine, a high frequency induction furnace, an IH cooker, and the like.

1: Multi-layer wire 2: Central insulating layer 3: Inner conductor layer 4: Interlayer insulating layer 5: Outer conductor layer 6: Outer layer 7: Solid conductor 71: Conductor 72: Outer layer 9: Non-contact power feeding device 931, 932: First and second power feeding electrodes 94: High frequency power supply units 951, 952: First and second resonance inductors 961, 962: First and second power receiving electrodes 97: Power receiving conversion unit

Claims (2)

Two or more tubular conductor layers formed of a conductor material and arranged coaxially around the axis; and
A central insulating layer formed of an insulating material having a specific gravity smaller than that of the conductor material and disposed on the axis;
An interlayer insulating layer formed of an insulating material having a specific gravity smaller than that of the conductor material and interposed between the conductor layers;
A method of manufacturing a coil for high-frequency power, in which a multilayer wire comprising a sheath layer covering the outer side of the outermost conductor layer and wound in a spiral shape,
A coil core forming step of forming the central insulating layer by molding the insulating material into a spiral shape;
An inner conductor layer forming step of covering the outer periphery of the central insulating layer with the conductor material to form the inner conductor layer;
An insulating layer forming step of forming an interlayer insulating layer by covering an outer periphery of the inner conductor layer with the insulating material;
A conductor layer forming step of forming an outer conductor layer by covering the outer periphery of the interlayer insulating layer with the conductor material;
And a coating layer forming step of forming the coating layer on the outer periphery of the outer conductor layer. The multilayer wire according to claim 1, wherein the multilayer wire includes three or more conductor layers.
A method for manufacturing a high-frequency power coil in which the insulating layer forming step and the conductor layer forming step are repeated according to the number of conductor layers.

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