CN104347259B - Improved slim power inductance processing procedure - Google Patents
Improved slim power inductance processing procedure Download PDFInfo
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- CN104347259B CN104347259B CN201310311357.7A CN201310311357A CN104347259B CN 104347259 B CN104347259 B CN 104347259B CN 201310311357 A CN201310311357 A CN 201310311357A CN 104347259 B CN104347259 B CN 104347259B
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- Prior art keywords
- spiral inductor
- coil
- inductor coil
- insulating coating
- power inductance
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000011248 coating agent Substances 0.000 claims abstract description 24
- 238000000576 coating method Methods 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 239000000696 magnetic material Substances 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 238000007747 plating Methods 0.000 claims abstract description 9
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 3
- 230000004888 barrier function Effects 0.000 claims description 4
- 238000005253 cladding Methods 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000000084 colloidal system Substances 0.000 abstract description 9
- 239000002184 metal Substances 0.000 abstract description 8
- 229910052751 metal Inorganic materials 0.000 abstract description 8
- 239000002356 single layer Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000008034 disappearance Effects 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
A kind of improved slim power inductance processing procedure, on substrate, by metallic shield (metal mask), sputter process and plating copper wiring, form spiral inductor coil, colloid in the outside printing magnetic material configuration of this spiral inductor coil makes formation insulating coating again, is consequently formed monolayer power inductance；Work as repeat the above steps, sequentially make multilayer power inductance in the top of the slim power inductance of monolayer, and so that this multilayer power inductance is interconnected, you can form continuous helical shape inductance coil.
Description
Technical field
A kind of relevant improved slim power inductance processing procedure of the present invention, particularly relates to the spiral inductor coil of power inductance
With metallic shield, coordinate made by sputter process and plating copper wiring, the outer surface of spiral inductor coil after formation warp
Insulating coating is formed by the colloid of printing magnetic material configuration.
Background technology
Existing power inductance, is the wire rolled curl inductance coil institute using section for square or circle
Formed.This helical inductor coil has the multiple circles along the laminated extension of vertical direction, and two end connects to lead respectively
Line is connected with outer electrode.During making, first the spiral lead of welding lead is inserted in mold, and inject magnetic in mold
Property dusty material, then said magnetic powder material is pressed into block, then the demoulding and formed.
But these utilize Wire-wound curl inductance coil power inductance, volume larger it is impossible to meet existing electricity
Device product is light, thin, the requirement of microminiaturization etc..
In order to improve existing power inductance with the disappearance of wire coiling, the U.S. the 7th, 176,773B2 Patent Case proposes
Substrate first forms electrode basic unit with thin film manufacture process, in electrode basic unit, inductor conductor is successively formed with electroplating technology, enter
And forming the inductance of multilamellar cincture in the shape of a spiral, this U.S. the 7th, 176,773B2 Patent Case is claimed and be can control electricity by this processing procedure
The width of sense coil and the ratio of height, to be obtained high-density power inductance.
The step that thin film manufacture process manufactures high density inductance coil is utilized described in this U.S.'s 7,176,773B2 Patent Case
It is first on substrate, to form insulating barrier, then a base layer is formed at insulating barrier in the way of vapor deposition or sputter deposition
Top, the top of base layer forms the photoresist layer with uniform thickness with spin-coating method, and the thickness of this photoresist layer is equivalent to a layer line
The height of circle；With exposure sources, groove is formed on photoresist layer again, then in groove, instill molten metal, make metal deposit
In groove, stop when molten metal overflows groove；After molten metal cooling, the photoresist layer of metallic circumferential is removed,
It is consequently formed ground floor coil；Next the coiled wire-wound coil of the second layer, third layer etc. is gradually completed again according to same steps.
But, this U.S. the 7th, 176,773B2 Patent Case, although its manufacturing step can be obtained, to meet electric equipment products small
Change the inductance requiring, but its processing procedure is excessively complicated, manufacturing cost height is it is impossible to be applied to actual production line.
Manufacture in view of existing power inductance has above-mentioned disappearance, and the present inventor improves for above-mentioned disappearance, proposes
Technical scheme.
Content of the invention
Therefore, the present invention is intended to provide a kind of improved slim power inductance processing procedure, make the spiral inductor of power inductance
Coil is via metallic shield, coordinates sputter process and plating copper wiring to be formed.
According to the improved slim power inductance processing procedure of the present invention, the outside of its spiral inductor coil is via printing magnetic
The colloid of material configuration and form insulating coating, so that the inductance value of inductance lift, be a secondary purpose of the present invention.
Improved slim power inductance processing procedure under this invention, via repetition metallic shield, sputter process, plating copper wiring
With the colloid of printing magnetic material configuration, form continuous helical shape inductance coil, be another object of the present invention.
Improved slim power inductance processing procedure under this invention, with metallic shield, coordinate sputter process, plating copper wiring and
The colloid of printing magnetic material configuration, produces and meets the power inductance that slimming requires, and can be applicable to existing mobile phone, panel
Etc. the slimming specification of electric equipment products, it is a further object of the present invention.
Improved slim power inductance processing procedure under this invention, coordinates sputter process with metallic shield, not only can improve
The disappearance being made with thin film manufacture process, the work(that the result that working procedure simplifies can reach reduces cost again and makes production yield be lifted
Effect, is a further object of the present invention.
As for the detailed configuration of the present invention, application principle, effect and effect, then refer to following adjoint description
Understood completely.
Brief description
Fig. 1 is the substrate schematic perspective view of the present invention.
The schematic perspective view that Fig. 2 is projected with metallic shield for the present invention.
Fig. 3 forms the schematic perspective view of basic unit's spiral inductor coil for the present invention on substrate.
Fig. 4 is that the present invention forms the schematic perspective view of insulating coating in basic unit's spiral inductor coil outer.
Fig. 5 forms the three-dimensional signal of second layer spiral inductor coil for the present invention above basic unit's spiral inductor coil
Figure.
Fig. 6 is that the present invention forms the schematic perspective view of insulating coating in second layer spiral inductor coil outer.
Fig. 7 forms the three-dimensional signal of third layer spiral inductor coil for the present invention above basic unit's spiral inductor coil
Figure.
Fig. 8 is that the present invention forms the schematic perspective view of insulating coating in third layer spiral inductor coil outer.
Fig. 9 forms the three-dimensional signal of top layer spiral inductor coil for the present invention above basic unit's spiral inductor coil
Figure.
Figure 10 is that the present invention forms the schematic perspective view of insulating coating in top layer spiral inductor coil outer.
Symbol description：
100：Substrate
200：Metallic shield
201：Spiral inductor pattern
202：Spiral inductor coil Seed Layer
300：Basic unit's spiral inductor coil
40A、40B：Lateral electrode
500：Substrate insulation clad
301：Last line end
501：Breach
600：Second layer spiral inductor coil
40C、40D：Lateral electrode
601：Leading-out terminal
602：Second layer insulating coating
603：Last line end
604：Breach
700：Third layer spiral inductor coil
40E、40F：Lateral electrode
701：Leading-out terminal
800：Third layer insulating coating
702：Last line end
801：Breach
900：Top layer spiral inductor coil
40G、40H：Lateral electrode
901：Leading-out terminal
902：Last line end
90A：Top layer insulating coating
Specific embodiment
The improved slim power inductance processing procedure of the present invention, its making step includes：
Substrate processing step：With chemical solvents such as methanol or acetone, remove impurity and the oils and fatss on substrate 100 surface, then with
Fluohydric acid. removes the oxide of substrate surface, then substrate 100 is carried out with dewatering roast (Dehydration Bake) (as Fig. 1
Shown)；
Spiral inductor loop-formation step, a surface is formed with the metallic shield 200 of spiral inductor pattern 201,
It is placed in the top of substrate 100, using sputter process and plating copper wiring, form spiral inductor prior to the upper surface of substrate 100
Coil Seed Layer 202 (as shown in Figure 2)；Re-form basic unit's spiral inductor coil 300 and lateral electrode 40A, 40B, basic unit's spiral
One end of shape inductance coil 300 is connected (as shown in Figure 3) with lateral electrode 40A therein；
Substrate insulation clad forming step：The jel print that magnetic material is configured is in basic unit's spiral inductor coil
300 outside, to form the substrate insulation clad 500 of cladding basic unit spiral inductor coil 300；This substrate insulation clad
500 basic unit's spiral inductor coil 300 last line end 301 formed a breach 501, make the top hollow out of this last line end 301 (such as
Shown in Fig. 4)；
Second layer spiral inductor coil preparation process：Above substrate insulation clad 500, then pass through metal light
Cover, cooperation sputter process and plating copper wiring, form second layer spiral inductor coil 600 and lateral electrode 40C, 40D；The second layer
The leading-out terminal 601 of spiral inductor coil 600, via last line end 301 phase of breach 501 and basic unit's spiral inductor coil 300
Connect (as shown in Figure 5)；
Second layer insulating coating forming step：Outside printing magnetic material in second layer spiral inductor coil 600
The colloid of configuration, to form second layer insulating coating 602；This second layer insulating coating 602 is in second layer spiral inductor
Form a breach 604 (as shown in Figure 6) at the last line end 603 of coil 600；
Third layer spiral inductor coil preparation process：Above second layer insulating coating 602, then pass through metal light
Cover, cooperation sputter process and plating copper wiring, form third layer spiral inductor coil 700 and lateral electrode 40E, 40F；Third layer
The leading-out terminal 701 of spiral inductor coil 700, is connected with the last line end 603 of second layer spiral inductor coil via breach 604
Connect (as shown in Figure 7)；
Third layer insulating barrier forming step：Outside printing magnetic material configuration in third layer spiral inductor coil 700
Colloid, to form third layer insulating coating 800；This third layer insulating coating 800 is in third layer spiral inductor coil
Form a breach 801 (as shown in Figure 8) at 700 last line end 702；
Top layer spiral inductor coil preparation process：Above third layer insulating coating 800, then pass through metal light
Cover, cooperation sputter process and electrolytic copper processing procedure, form top layer spiral inductor coil 900 and lateral electrode 40G, 40H；Top layer spiral type
The leading-out terminal 901 of inductance coil 900, is connected with the last line end 702 of third layer spiral inductor coil via breach 801；Top
The last line end 902 of helical layer shape inductance coil 900 is connected with lateral electrode 40H (as shown in Figure 9)；
Top insulating layer forming step：Glue in the outside printing magnetic material configuration of top layer spiral inductor coil 900
Body, to form top layer insulating coating 90A (as shown in Figure 10).
Via above-mentioned processing procedure, the improved slim power inductance processing procedure of the present invention, each helical layer shape inductance coil is in shape
After one-tenth, insulating coating made by the colloid of all printing magnetic material configurations immediately, then carries out second layer spiral inductor line again
Circle and its making of insulating coating；Because each helical layer shape inductance coil is by individually with the colloid bag of magnetic material configuration
Cover, the inductance value of power inductance can be elevated.
Understand from the above, the improved slim power inductance processing procedure of the present invention, its overall process more simplifies, manufacture more
For easy, the disappearance of existing power inductance processing procedure can be improved.
As described above is only the preferable specific embodiment of the present invention, if the change made according to the conception of the present invention, its product
Raw function, still without departing from description and schema covered spiritual when, all should be within the scope of the invention.
Claims (1)
1. a kind of improved slim power inductance processing procedure, its making step includes：
Substrate processing step：With chemical solvent, substrate surface is processed；
Spiral inductor loop-formation step：The metallic shield that one surface is formed with spiral inductor pattern is placed in the upper of substrate
Side, via sputter process and plating copper wiring, the upper surface in substrate forms spiral inductor coil and the side having suitable thickness
Electrode；And wherein spiral inductor coil is multilamellar, is continuous helical shape inductance coil；
Insulating barrier forming step：The jel print that magnetic material is configured in the outside of spiral inductor coil, to form cladding
The insulating coating of spiral inductor coil；
Each of which helical layer shape inductance coil after its formation, is all initially formed insulating coating, then re-forms last layer spiral
Shape inductance coil and its insulating coating；Insulating coating outside each helical layer shape inductance coil is in spiral inductor coil
Last line end be respectively formed a breach, make upper strata spiral inductor coil leading-out terminal via this breach and lower floor's spiral inductor
The last line end of coil is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310311357.7A CN104347259B (en) | 2013-07-23 | 2013-07-23 | Improved slim power inductance processing procedure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310311357.7A CN104347259B (en) | 2013-07-23 | 2013-07-23 | Improved slim power inductance processing procedure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104347259A CN104347259A (en) | 2015-02-11 |
| CN104347259B true CN104347259B (en) | 2017-03-01 |
Family
ID=52502677
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310311357.7A Active CN104347259B (en) | 2013-07-23 | 2013-07-23 | Improved slim power inductance processing procedure |
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| Country | Link |
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| CN (1) | CN104347259B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11979030B2 (en) | 2020-08-03 | 2024-05-07 | Apple Inc. | Shared power converter for a wireless transmitter device |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10790699B2 (en) | 2015-09-24 | 2020-09-29 | Apple Inc. | Configurable wireless transmitter device |
| US10477741B1 (en) | 2015-09-29 | 2019-11-12 | Apple Inc. | Communication enabled EMF shield enclosures |
| US10651685B1 (en) | 2015-09-30 | 2020-05-12 | Apple Inc. | Selective activation of a wireless transmitter device |
| US10734840B2 (en) | 2016-08-26 | 2020-08-04 | Apple Inc. | Shared power converter for a wireless transmitter device |
| US10594160B2 (en) | 2017-01-11 | 2020-03-17 | Apple Inc. | Noise mitigation in wireless power systems |
| CN108233633A (en) * | 2017-12-21 | 2018-06-29 | 维沃移动通信有限公司 | A kind of flexible PCB, motor and mobile terminal |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1174451A (en) * | 1996-06-10 | 1998-02-25 | 富士电机株式会社 | Squelch filter for power converter |
| CN102867615A (en) * | 2011-07-04 | 2013-01-09 | 官淑燕 | Low-configuration and high-power inductor |
| WO2013031680A1 (en) * | 2011-08-26 | 2013-03-07 | ローム株式会社 | Magnetic metal substrate and inductance element |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3164068B2 (en) * | 1998-07-17 | 2001-05-08 | 株式会社村田製作所 | Electronic component and method of manufacturing the same |
| JP3914173B2 (en) * | 2003-05-29 | 2007-05-16 | 新科實業有限公司 | Thin film coil and method for forming the same, thin film magnetic head and method for manufacturing the same |
-
2013
- 2013-07-23 CN CN201310311357.7A patent/CN104347259B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1174451A (en) * | 1996-06-10 | 1998-02-25 | 富士电机株式会社 | Squelch filter for power converter |
| CN102867615A (en) * | 2011-07-04 | 2013-01-09 | 官淑燕 | Low-configuration and high-power inductor |
| WO2013031680A1 (en) * | 2011-08-26 | 2013-03-07 | ローム株式会社 | Magnetic metal substrate and inductance element |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11979030B2 (en) | 2020-08-03 | 2024-05-07 | Apple Inc. | Shared power converter for a wireless transmitter device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104347259A (en) | 2015-02-11 |
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