CN104347259A - Improved thin power inductor manufacturing process - Google Patents
Improved thin power inductor manufacturing process Download PDFInfo
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- CN104347259A CN104347259A CN201310311357.7A CN201310311357A CN104347259A CN 104347259 A CN104347259 A CN 104347259A CN 201310311357 A CN201310311357 A CN 201310311357A CN 104347259 A CN104347259 A CN 104347259A
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- spiral inductor
- inductor coil
- coil
- layer
- processing procedure
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Abstract
An improved thin power inductor manufacturing process comprises the steps of forming a spiral inductance coil through metal mask, a sputtering process and a copper electroplating process on a base plate; then printing an adhesive configured for a magnetic material on the outside of the spiral inductance coil so as to form an insulation coating layer and accordingly form a single-layer power inductor; sequentially manufacturing multiple-layer power inductors above the single-layer power inductor and enabling the multiple-layer power inductors to be mutually communicated when repeating the steps and accordingly forming a continuous spiral inductance coil.
Description
Technical field
The present invention is about a kind of slim power inductance processing procedure of improvement, refer to that the spiral inductor coil of power inductance is with metallic shield especially, coordinate made by sputter process and electro-coppering processing procedure, form the outer surface of rear spiral inductor coil and form insulating coating via the colloid of printing magnetic material configuration.
Background technology
Existing power inductance utilizes cross section to be formed through being wound into helical inductor coil by the wire of square or circle.This helical inductor coil has multiple circles of vertically laminated extension, and two end connects wire respectively and is connected with outer electrode.During making, first the spiral lead of welding lead is inserted in mold, and inject said magnetic powder material in mold, then said magnetic powder material is pressed into block, then the demoulding and being formed.
But these utilize the power inductance of Wire-wound curl inductance coil, volume is comparatively large, cannot meet that existing electric equipment products are light, thin, the requirement of microminiaturization etc.
In order to improve existing power inductance with the disappearance of wire coiling, the U.S. the 7th, 176,773B2 Patent Case to propose on substrate and first forms electrode basic unit with thin film manufacture process, more successively forms inductor conductor with electroplating technology in electrode basic unit, so formed multilayer in the shape of a spiral around inductance, this U.S. the 7th, 176,773B2 Patent Case is claimed and can be controlled the width of inductance coil and the ratio of height, with obtained high-density power inductance by this processing procedure.
This U.S. the 7th, 176, the step utilizing thin film manufacture process to manufacture high density inductance coil described in 773B2 Patent Case is, first on substrate, form insulating barrier, again a base layer is formed in the top of insulating barrier in the mode of vapor deposition or sputter-deposited, the top of base layer forms the photoresist layer with uniform thickness with spin-coating method, the thickness of this photoresist layer is equivalent to the height of one deck coil; On photoresist layer, form groove with exposure sources again, then in groove, instill molten metal, metal is deposited in groove, until stop when molten metal overflows groove; After molten metal cooling, the photoresist layer of metallic circumferential is removed, form ground floor coil thus; Next the coiled wire-wound coil of the second layer, third layer etc. is completed again gradually according to same steps.
But this U.S. the 7th, 176,773B2 Patent Case, although its manufacturing step can obtain the inductance meeting the requirement of electric equipment products microminiaturization, its processing procedure is too complicated, and manufacturing cost is high, cannot be applied to actual production line.
Because the manufacture of existing power inductance has above-mentioned disappearance, the present inventor improves for above-mentioned disappearance, proposes technical scheme of the present invention.
Summary of the invention
Therefore, the present invention aims to provide a kind of slim power inductance processing procedure of improvement, makes the spiral inductor coil of power inductance be via metallic shield, coordinates sputter process and electro-coppering processing procedure to be formed.
According to the slim power inductance processing procedure of improvement of the present invention, the outside of its spiral inductor coil forms insulating coating via the colloid of printing magnetic material configuration, and making the inductance value of inductance promote by this, is an of the present invention object.
According to the slim power inductance processing procedure of improvement of the present invention, the colloid configured via repetition metallic shield, sputter process, electro-coppering processing procedure and printing magnetic material, forming continuous helical shape inductance coil, is another object of the present invention.
According to the slim power inductance processing procedure of improvement of the present invention, with metallic shield, coordinate the colloid that sputter process, electro-coppering processing procedure and printing magnetic material configure, produce the power inductance meeting slimming requirement, and can be applicable to the slimming specification of the electric equipment products such as existing mobile phone, panel, be another object of the present invention.
According to the slim power inductance processing procedure of improvement of the present invention, sputter process is coordinated with metallic shield, not only can improve the disappearance made with thin film manufacture process, the result that working procedure simplifies can reach again the effect reducing costs and make production Yield lmproved, is another object of the present invention.
As for detailed configuration of the present invention, application principle, effect and effect, then please refer to following adjoint description can be understood completely.
Accompanying drawing explanation
Fig. 1 is substrate schematic perspective view of the present invention.
Fig. 2 is the schematic perspective view that the present invention projects with metallic shield.
Fig. 3 is the schematic perspective view that the present invention forms basic unit's spiral inductor coil on substrate.
Fig. 4 is that the present invention forms the schematic perspective view of insulating coating at basic unit's spiral inductor coil outer.
Fig. 5 is the schematic perspective view that the present invention forms second layer spiral inductor coil above basic unit's spiral inductor coil.
Fig. 6 is that the present invention forms the schematic perspective view of insulating coating at second layer spiral inductor coil outer.
Fig. 7 is the schematic perspective view that the present invention forms third layer spiral inductor coil above basic unit's spiral inductor coil.
Fig. 8 is that the present invention forms the schematic perspective view of insulating coating at third layer spiral inductor coil outer.
Fig. 9 is the schematic perspective view that the present invention forms top layer spiral inductor coil above basic unit's spiral inductor coil.
Figure 10 is that the present invention forms the schematic perspective view of insulating coating at top layer spiral inductor coil outer.
Symbol description:
100: substrate
200: metallic shield
201: spiral inductor pattern
202: spiral inductor coil Seed Layer
300: basic unit's spiral inductor coil
40A, 40B: lateral electrode
500: substrate insulation coating layer
301: last line end
501: breach
600: second layer spiral inductor coil
40C, 40D: lateral electrode
601: leading-out terminal
602: second layer insulating coating
603: last line end
604: breach
700: third layer spiral inductor coil
40E, 40F: lateral electrode
701: leading-out terminal
800: third layer insulating coating
702: last line end
801: breach
900: top layer spiral inductor coil
40G, 40H: lateral electrode
901: leading-out terminal
902: last line end
90A: top layer insulating coating
Embodiment
The slim power inductance processing procedure of improvement of the present invention, its making step comprises:
Substrate processing step: with the chemical solvent such as methyl alcohol or acetone, remove impurity and the grease on substrate 100 surface, remove the oxide of substrate surface again with hydrofluoric acid, then dewatering roast (Dehydration Bake) (as shown in Figure 1) is carried out to substrate 100;
Spiral inductor loop-formation step, one surface is formed with the metallic shield 200 of spiral inductor pattern 201, be placed in the top of substrate 100, utilize sputter process and electro-coppering processing procedure, form spiral inductor coil Seed Layer 202 (as shown in Figure 2) prior to the upper surface of substrate 100; Form basic unit's spiral inductor coil 300 and lateral electrode 40A, 40B again, one end of basic unit's spiral inductor coil 300 is connected (as shown in Figure 3) with a lateral electrode 40A wherein;
Substrate insulation coating layer forming step: by the jel print of magnetic material configuration in the outside of basic unit's spiral inductor coil 300, to form the substrate insulation coating layer 500 of coated basic unit spiral inductor coil 300; This substrate insulation coating layer 500 forms a breach 501 at the last line end 301 of basic unit's spiral inductor coil 300, makes the top hollow out (as shown in Figure 4) of this last line end 301;
Second layer spiral inductor coil preparation process: above substrate insulation coating layer 500, then by metal light cover, coordinate sputter process and electro-coppering processing procedure, form second layer spiral inductor coil 600 and lateral electrode 40C, 40D; The leading-out terminal 601 of second layer spiral inductor coil 600, is connected (as shown in Figure 5) via breach 501 with the last line end 301 of basic unit spiral inductor coil 300;
Second layer insulating coating forming step: at the colloid of the outside of second layer spiral inductor coil 600 printing magnetic material configuration, to form second layer insulating coating 602; This second layer insulating coating 602 forms a breach 604 (as shown in Figure 6) at last line end 603 place of second layer spiral inductor coil 600;
Third layer spiral inductor coil preparation process: above second layer insulating coating 602, then by metal light cover, coordinate sputter process and electro-coppering processing procedure, form third layer spiral inductor coil 700 and lateral electrode 40E, 40F; The leading-out terminal 701 of third layer spiral inductor coil 700, is connected (as shown in Figure 7) via breach 604 with the last line end 603 of second layer spiral inductor coil;
Third layer insulating barrier forming step: at the colloid of the outside of third layer spiral inductor coil 700 printing magnetic material configuration, to form third layer insulating coating 800; This third layer insulating coating 800 forms a breach 801 (as shown in Figure 8) at last line end 702 place of third layer spiral inductor coil 700;
Top layer spiral inductor coil preparation process: above third layer insulating coating 800, then by metal light cover, coordinate sputter process and electrolytic copper processing procedure, form top layer spiral inductor coil 900 and lateral electrode 40G, 40H; The leading-out terminal 901 of top layer spiral inductor coil 900, is connected via the last line end 702 of breach 801 with third layer spiral inductor coil; The last line end 902 of top layer spiral inductor coil 900 is connected with lateral electrode 40H (as shown in Figure 9);
Top insulating layer forming step: at the colloid of the outside of top layer spiral inductor coil 900 printing magnetic material configuration, to form top layer insulating coating 90A (as shown in Figure 10).
Via above-mentioned processing procedure, the slim power inductance processing procedure of improvement of the present invention, upon formation, insulating coating made by the colloid printing magnetic material configuration all immediately to each helical layer shape inductance coil, and then carries out the making of second layer spiral inductor coil and insulating coating thereof; Because each helical layer shape inductance coil is by coated with the colloid of magnetic material configuration individually, the inductance value of power inductance can be promoted.
Known from the above, the slim power inductance processing procedure of improvement of the present invention, its overall process more simplifies, and it is more easy to manufacture, and can improve the disappearance of existing power inductance processing procedure.
As described above is only the better specific embodiment of the present invention, if the change done according to the conception of the present invention, its function produced, do not exceed yet specification and graphic contained spiritual time, all should be within the scope of the invention.
Claims (3)
1. the slim power inductance processing procedure improved, its making step comprises:
Substrate processing step: substrate surface is processed with chemical solvent;
Spiral inductor loop-formation step a: metallic shield surface being formed with spiral inductor pattern is placed in the top of substrate, via sputter process and electro-coppering processing procedure, in spiral inductor coil and the lateral electrode of the upper surface formation tool suitable thickness of substrate;
Insulating barrier forming step: by the jel print of magnetic material configuration in the outside of spiral inductor coil, to form the insulating coating of coated spiral inductor coil.
2. the slim power inductance processing procedure improved as claimed in claim 1, wherein spiral inductor coil is multilayer, is continuous helical shape inductance coil.
3. the slim power inductance processing procedure improved as claimed in claim 2, wherein each helical layer shape inductance coil after its formation, all first forms insulating coating, and then forms last layer spiral inductor coil and its insulating coating; The insulating coating of each helical layer shape inductance coil outside all forms a breach at the last line end of spiral inductor coil, and the leading-out terminal of upper strata spiral inductor coil must be connected with the last line end of lower floor spiral inductor coil via this breach.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310311357.7A CN104347259B (en) | 2013-07-23 | 2013-07-23 | Improved slim power inductance processing procedure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310311357.7A CN104347259B (en) | 2013-07-23 | 2013-07-23 | Improved slim power inductance processing procedure |
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| CN104347259A true CN104347259A (en) | 2015-02-11 |
| CN104347259B CN104347259B (en) | 2017-03-01 |
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| CN201310311357.7A Active CN104347259B (en) | 2013-07-23 | 2013-07-23 | Improved slim power inductance processing procedure |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108233633A (en) * | 2017-12-21 | 2018-06-29 | 维沃移动通信有限公司 | A kind of flexible PCB, motor and mobile terminal |
| US10477741B1 (en) | 2015-09-29 | 2019-11-12 | Apple Inc. | Communication enabled EMF shield enclosures |
| US10594160B2 (en) | 2017-01-11 | 2020-03-17 | Apple Inc. | Noise mitigation in wireless power systems |
| US10651685B1 (en) | 2015-09-30 | 2020-05-12 | Apple Inc. | Selective activation of a wireless transmitter device |
| US10734840B2 (en) | 2016-08-26 | 2020-08-04 | Apple Inc. | Shared power converter for a wireless transmitter device |
| US10790699B2 (en) | 2015-09-24 | 2020-09-29 | Apple Inc. | Configurable wireless transmitter device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1174451A (en) * | 1996-06-10 | 1998-02-25 | 富士电机株式会社 | Squelch filter for power converter |
| JP2000036413A (en) * | 1998-07-17 | 2000-02-02 | Murata Mfg Co Ltd | Electronic component and manufacture thereof |
| US20040240106A1 (en) * | 2003-05-29 | 2004-12-02 | Tdk Corporation | Thin film coil and method of forming the same, and thin film magnetic head and method of manufacturing the same |
| CN102867615A (en) * | 2011-07-04 | 2013-01-09 | 官淑燕 | Low-configuration and high-power inductor |
| WO2013031680A1 (en) * | 2011-08-26 | 2013-03-07 | ローム株式会社 | Magnetic metal substrate and inductance element |
-
2013
- 2013-07-23 CN CN201310311357.7A patent/CN104347259B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1174451A (en) * | 1996-06-10 | 1998-02-25 | 富士电机株式会社 | Squelch filter for power converter |
| JP2000036413A (en) * | 1998-07-17 | 2000-02-02 | Murata Mfg Co Ltd | Electronic component and manufacture thereof |
| US20040240106A1 (en) * | 2003-05-29 | 2004-12-02 | Tdk Corporation | Thin film coil and method of forming the same, and thin film magnetic head and method of manufacturing the same |
| CN102867615A (en) * | 2011-07-04 | 2013-01-09 | 官淑燕 | Low-configuration and high-power inductor |
| WO2013031680A1 (en) * | 2011-08-26 | 2013-03-07 | ローム株式会社 | Magnetic metal substrate and inductance element |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10790699B2 (en) | 2015-09-24 | 2020-09-29 | Apple Inc. | Configurable wireless transmitter device |
| US10477741B1 (en) | 2015-09-29 | 2019-11-12 | Apple Inc. | Communication enabled EMF shield enclosures |
| US10651685B1 (en) | 2015-09-30 | 2020-05-12 | Apple Inc. | Selective activation of a wireless transmitter device |
| US10734840B2 (en) | 2016-08-26 | 2020-08-04 | Apple Inc. | Shared power converter for a wireless transmitter device |
| US10594160B2 (en) | 2017-01-11 | 2020-03-17 | Apple Inc. | Noise mitigation in wireless power systems |
| CN108233633A (en) * | 2017-12-21 | 2018-06-29 | 维沃移动通信有限公司 | A kind of flexible PCB, motor and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104347259B (en) | 2017-03-01 |
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