JP6160756B2 - Flexure substrate for suspension, suspension, suspension with head, and hard disk drive - Google Patents

Description

  The present invention relates to a suspension flexure substrate used in a hard disk drive (HDD), and more particularly to a suspension flexure substrate with reduced warpage.

  In recent years, due to the spread of the Internet and the like, there has been a demand for an increase in the amount of information processing of personal computers and an increase in information processing speed, and along with this, the capacity of hard disk drives (HDD) incorporated in personal computers has increased. Increasing information transmission speed is required.

  A hard disk drive is a magnetic disk that is a magnetic recording medium, a spindle motor that rotates the magnetic disk at high speed, a magnetic head that reads or writes information on the magnetic disk, and each component that moves it while holding it with high precision. Drive control circuit and signal processing circuit.

  In addition, a component called a magnetic head suspension that supports the magnetic head used in this hard disk drive also has a signal line such as a copper wiring directly formed on a stainless steel spring from a conventional type in which a signal line such as a gold wire is connected. The so-called wireless suspension has been shifted to a wiring integrated type (flexure).

  The wiring in such a flexure substrate for suspension generally has a configuration in which a pair of write wirings and a pair of lead wirings are respectively disposed on an insulating layer formed on a metal support substrate. (Patent Document 1).

  In order to prevent the occurrence of signal transmission errors, a structure in which a pair of write wirings or a pair of lead wirings are stacked so as to overlap in plan view and a ground wiring is provided on the upper layer side is also proposed (patent) Reference 2).

  Further, as a wiring configuration capable of reducing the differential impedance, a pair of wirings for transmitting the first electrical signal and a pair of transmitting the second electrical signal having an opposite phase to the first electrical signal. A wiring configuration (interleaved wiring structure) in which these wirings are alternately arranged has been proposed (Patent Document 3).

FIG. 5 is an explanatory diagram illustrating an example of a basic configuration of the above-described interleaved wiring structure.
As shown in FIG. 5, in the interleaved wiring structure, a pair of wirings 51 and 52 that are electrically connected by jumper wires 53 to form a circularly closed line are sandwiched between substantially U-shaped portions. In a portion where the wirings 51 and 52 run side by side, a total of four wirings of two wirings 51 and two wirings 52 are arranged alternately.

  By adopting such a configuration, in the interleaved wiring structure, the differential impedance can be reduced as compared with a configuration in which two pairs of wirings such as normal differential wiring are arranged. However, in the interleaved wiring structure, the number of wirings increases from 2 to 4 or more, for example.

  Further, even in a high-performance magnetic head of a heat-assisted magnetic recording method (for example, Patent Document 4) and a high-frequency magnetic field assist recording method (for example, Patent Document 5) proposed for recent high-density HDDs, the number of wirings is More than before.

  In other words, the number of wirings in the suspension flexure substrate tends to increase as the functionality increases.

JP 2004-133888 A JP 2009-206379 A JP-A-10-124837 JP 2001-283403 A JP 2010-40060 A

  In order to cope with the increase in the number of wirings as described above, the wiring structure in the suspension flexure substrate has a first layer via an insulating layer rather than the single-layer wiring structure in which the wiring layer is formed on the same plane. A laminated wiring structure in which a wiring layer and a second wiring layer are formed is suitable.

  Here, in the suspension flexure substrate having the conventional laminated wiring structure, the distribution of the plurality of wirings arranged in the first wiring layer and the second wiring layer does not change in the middle of the longitudinal direction of the wiring. In general, the same amount was allocated.

  However, in the laminated wiring structure as described above, in addition to the first insulating layer that insulates between the metal support substrate and the first wiring layer, the first wiring layer and the second wiring layer are insulated. It is necessary to provide a second insulating layer, and the total thickness of the first insulating layer and the second insulating layer is larger than the thickness of the insulating layer in the case of the single-layer wiring structure described above.

  And, resin such as polyimide used for the insulating layer has the property of easily causing expansion and contraction due to moisture absorption and temperature change, for example, a metal support substrate made of stainless steel has the same phenomenon. Therefore, the suspension flexure substrate having the conventional laminated wiring structure has a problem in that it tends to warp in the longitudinal direction of the wiring due to moisture absorption or the like.

  The present invention has been made in view of the above circumstances, and a main object of the present invention is to provide a suspension flexure substrate in which warpage occurring in the longitudinal direction of the wiring is reduced while accommodating an increase in the number of wirings.

  As a result of various studies, the present inventor has found that a larger number of wirings are provided in the second wiring than in the first wiring layer in the suspension flexure substrate having the laminated wiring structure having the first wiring layer and the second wiring layer. The present invention has been completed by finding that the above-mentioned problems can be solved by allocating to the layers.

  That is, the invention according to claim 1 of the present invention is a metal supporting substrate, a first insulating layer formed on the metal supporting substrate, and a first insulating layer formed on the first insulating layer. A wiring layer; a second insulating layer formed on the first wiring layer or the first insulating layer; and a second wiring layer formed on the second insulating layer. The gimbal portion provided on the tip end side of the metal support substrate and the connection terminal portion provided on the tail side end portion are connected to the first wiring layer and the second wiring layer. A plurality of wirings are arranged, and the distribution of the wirings arranged in the first wiring layer and the second wiring layer changes in the longitudinal direction of the wirings, and is in the vicinity of the gimbal part. And a structure in which more wirings are distributed to the second wiring layer than to the first wiring layer. That is a flexible substrate for suspension.

  According to a second aspect of the present invention, there is provided a metal supporting substrate, a first insulating layer formed on the metal supporting substrate, and a first insulating layer formed on the first insulating layer. A wiring layer; a second insulating layer formed on the first wiring layer or the first insulating layer; and a second wiring layer formed on the second insulating layer. The gimbal portion provided on the tip end side of the metal support substrate and the connection terminal portion provided on the tail side end portion are connected to the first wiring layer and the second wiring layer. A plurality of wirings are arranged, and the distribution of the wirings arranged in the first wiring layer and the second wiring layer changes in the longitudinal direction of the wiring, and the connection terminal portion In this case, the suspension has a structure in which a larger number of wirings are distributed to the second wiring layer than to the first wiring layer. It is a flexible substrate for Pensions.

  In the invention according to claim 3 of the present invention, the plurality of wirings connecting the gimbal part and the connection terminal part include read wiring, write wiring, power supply wiring, and ground wiring, In the vicinity of the gimbal portion, the power supply wiring and the ground wiring are disposed in the first wiring layer, and the read wiring and the write wiring are disposed in the second wiring layer. The suspension flexure substrate according to claim 1.

  In the invention according to claim 4 of the present invention, in the connection terminal portion, all of the wiring is disposed in the second wiring layer. It is a flexure substrate for use.

  In the invention according to claim 5 of the present invention, the plurality of wirings connecting the gimbal portion and the connection terminal portion include a read wiring and a write wiring, and the read wiring and / or the write wiring. In the wiring, two or more transmission lines that transmit the first electric signal and two or more transmission lines that transmit the second electric signal having the opposite phase to the first electric signal alternate in a plane. The transmission lines are arranged alternately in the second wiring layer, and the first wiring layer is electrically connected between the alternately arranged transmission lines of the same phase. 5. The suspension flexure substrate according to claim 1, further comprising a connection line for connection.

  In the invention according to claim 6 of the present invention, the material of the metal supporting board is stainless steel, the material of the first wiring layer and the second wiring layer is copper or a copper alloy, 6. The suspension flexure substrate according to claim 1, wherein the material of the first insulating layer and the second insulating layer is polyimide.

  The invention according to claim 7 of the present invention is a suspension including the flexure substrate for suspension according to any one of claims 1 to 6.

  According to an eighth aspect of the present invention, there is provided a suspension with a head comprising the suspension according to the seventh aspect and a magnetic head slider mounted on the suspension.

  According to a ninth aspect of the present invention, there is provided a hard disk drive including the suspension with a head according to the eighth aspect.

  According to the present invention, more wiring is distributed to the second wiring layer than the first wiring layer, and the more wiring allocated to the second wiring layer causes expansion and contraction of the insulating layer. In order to counteract, it is possible to provide a flexure substrate for suspension in which the warpage in the longitudinal direction of the wiring is reduced while having a laminated wiring structure corresponding to the increase in the number of wirings.

It is a schematic plan view showing an example of a flexure substrate for suspension according to the present invention. It is a figure which shows the cross-sectional structure of an example of the flexure board | substrate for suspensions which concerns on this invention, (a) is AA sectional drawing in FIG. 1, (b) is BB sectional drawing in FIG. It is a figure explaining the wiring structure of an example of the flexure substrate for suspensions concerning this invention, (a) is explanatory drawing of the 2nd wiring layer of R area | region in FIG. 1, (b) is R area | region of FIG. It is explanatory drawing of a 1st wiring layer. It is a figure which shows the cross-sectional structure of the other example of the flexure board | substrate for suspensions concerning this invention, (a) is AA sectional drawing in FIG. 1, (b) is BB sectional drawing in FIG. . It is explanatory drawing which shows the example of the basic composition of an interleave wiring structure.

  The suspension flexure substrate, suspension, suspension with head, and hard disk drive of the present invention will be described in detail below.

[Flexible substrate for suspension]
First, the suspension flexure substrate of the present invention will be described.
FIG. 1 is a schematic plan view showing an example of a flexure substrate for suspension according to the present invention.
A suspension flexure substrate 1 shown in FIG. 1 has a gimbal portion 2 for mounting a magnetic head slider on the tip side, and a connection terminal portion 3 for connecting to an external circuit on a tail side end portion. Between the gimbal portion 2 and the connection terminal portion 3, a plurality of wirings 4 and 5 for electrically connecting the magnetic head and an external circuit are provided, and the rigidity of the flexure substrate for suspension is adjusted in the body portion. Or it has the opening part 6 utilized as a jig | tool hole for load beam connection.

(First embodiment)
2 is a diagram showing a cross-sectional configuration of an example of a flexure substrate for suspension according to the present invention, (a) is a cross-sectional view taken along the line AA in FIG. It is.
A flexure substrate for suspension according to the present invention includes a metal support substrate, a first insulating layer formed on the metal support substrate, and a first wiring layer formed on the first insulating layer. A second insulating layer formed on the first wiring layer or the first insulating layer, and a second wiring layer formed on the second insulating layer, The distribution of the wiring arranged in the first wiring layer and the second wiring layer has a configuration that changes in the longitudinal direction of the wiring.

  For example, as shown in FIG. 2A, a plurality of wirings 4 and 5 connecting the gimbal portion 2 and the connection terminal portion 3 include a lead wiring (R1, R2), a write wiring (W1, W2), and a power source. Wiring (DC) and ground wiring (G) are included, and in the vicinity of the gimbal portion 2, the power supply wiring is provided in the first wiring layer (between the first insulating layer 22 and the second insulating layer 23). (DC) and the ground wiring (G) are disposed, and the lead wiring (R1, R2) and the write wiring (W1, W2) are provided on the second wiring layer (on the second insulating layer 23). ) Is arranged.

  On the other hand, as shown in FIG. 2B, in the region on the tail side, all of the wirings (R1, R2, W1, W2, DC, G) are connected to the second wiring layer (second insulating layer 23). Above).

Since it has such a structure, the flexure substrate for suspension according to the present invention can distribute more wiring to the second wiring layer than to the first wiring layer.
And since the 2nd wiring layer is in the position of an outer layer from a metal support substrate rather than the 1st wiring layer, the flexure board for suspensions will change by expansion and contraction of the 1st insulating layer and the 2nd insulating layer. On the other hand, the first wiring layer acts to prevent the deformation.

  That is, the insulating layer sandwiched between the second wiring layer and the metal supporting substrate is both the first insulating layer and the second insulating layer, and the insulating layer that is a material that easily expands or contracts is expanded or contracted. A structure in which more wiring is distributed to the second wiring layer than to the first wiring layer because the second wiring layer and the metal supporting board made of a metal-based material that does not easily shrink are held from both the front and back sides. Can reduce the warpage in the longitudinal direction of the wiring as compared with the structure in which more wiring is distributed to the first wiring layer than to the second wiring layer.

  Therefore, the flexure substrate for suspension according to the present invention has a multilayer wiring structure in which the combined thickness of each insulating layer is thicker than that of a single-layer wiring structure, but warps in the longitudinal direction of the wiring. Can be reduced.

In order to achieve the above effects, as many wirings as possible, for example, as shown in FIG. 2B, all the wirings should be distributed to the second wiring layer in as many regions as possible. Is preferred.
That is, in the suspension flexure substrate according to the present invention, all of the wiring is arranged in the second wiring layer in a part of the region between the gimbal portion and the connection terminal portion. In addition, it is preferable that all of the wiring is disposed in the second wiring layer in as many portions as possible in the region between the gimbal portion and the connection terminal portion. .

Here, as shown in FIG. 1, generally, the metal support substrate of the flexure substrate for suspension has an opening 6 used as a jig hole for adjusting rigidity and connecting a load beam in the trunk portion. ing.
Therefore, for example, in the flexure substrate for suspension according to the present invention, all of the wiring is arranged in the second wiring layer in the region from the tail side end of the opening to the connection terminal. It is preferable. This is because, in the above-described region, it is easier to secure a space for arranging all of the wiring in the second wiring layer than in the region where the opening is provided.

  When there are a plurality of openings, for example, all of the wirings are arranged on the second wiring layer in a region from the tail side end of the opening located closest to the tail to the connection terminal. It is preferable that the configuration is provided. This is because it is easy to secure a space for arranging all of the wiring in the second wiring layer.

  On the other hand, in a region where it is difficult to secure a space for arranging all of the wiring in the second wiring layer, for example, in the vicinity of the gimbal portion, the wiring is also distributed to the first wiring layer. However, in this case as well, it is preferable to distribute as many wirings as possible to the second wiring layer.

For example, as shown in FIG. 2A, when a plurality of wirings connecting the gimbal part and the connection terminal part include a lead wiring, a write wiring, a power wiring, and a ground wiring, In the vicinity of the gimbal portion, the power supply wiring and the ground wiring are disposed in the first wiring layer, and the read wiring and the write wiring are disposed in the second wiring layer. Is preferred.
Since the read wiring and the write wiring are normally composed of a pair of two or more differential wirings, the above-described configuration has more in the second wiring layer than in the first wiring layer. This is because the wiring can be distributed.

Here, a configuration of a portion where the distribution of wiring in the first wiring layer and the second wiring layer changes will be described.
3 shows an example in which the distribution of wiring changes from the wiring configuration shown in FIG. 2A to the wiring configuration shown in FIG. 2B in the R region in FIG. FIG. 3 is an explanatory diagram of the second wiring layer in the R region in FIG. 1, and FIG. 3B is an explanatory diagram of the first wiring layer in the R region in FIG.

First, as shown in FIG. 3 (a), on the right side of FIG. 3 (a), that is, from the R region toward the tail side, three wirings of a ground wiring (G) and lead wirings (R1, R2) are provided. Are arranged in the second wiring layer, but only two lead wirings (R1, R2) are provided on the left side of FIG. Arranged in layers.
On the other hand, the ground wiring (G) moves from the second wiring layer to the first wiring layer via the connection via (BH1), and extends from the R region toward the tip side as shown in FIG. 3B. Yes.
As described above, for example, by using connection vias, the distribution of wiring in the first wiring layer and the second wiring layer can be changed.

  Here, in the above description, the wiring configuration on the left side in FIGS. 2A and 2B, that is, the wiring configuration of the ground wiring (G) and the lead wiring (R1, R2) has been described as an example. For example, the wiring configuration on the right side in FIGS. 2A and 2B, that is, the wiring configuration of the power supply wiring (DC) and the write wiring (W1, W2) is described in the same manner.

  Note that the types and arrangements of the wirings described above are a preferable example. In the present invention, the types of wirings distributed to the first wiring layer and the second wiring layer are limited to the above. Instead, any configuration may be used as long as more wires are distributed to the second wiring layer than the first wiring layer.

  Note that a cover layer 24 is preferably provided on the second wiring layer as shown in FIGS. 2 (a) and 2 (b). This is because deterioration due to corrosion or the like of the wiring disposed in the second wiring layer can be prevented.

(Second Embodiment)
4 is a view showing a cross-sectional configuration of another example of the flexure substrate for suspension according to the present invention, (a) is a cross-sectional view taken along line AA in FIG. 1, and (b) is a cross-sectional view taken along line BB in FIG. It is sectional drawing.

In the second embodiment, the read wiring and / or the write wiring in the first embodiment described above are the two or more transmission lines that transmit the first electric signal, and the first electric signal is reversed. Two or more transmission lines that transmit the second electrical signal in phase have an interleaved structure alternately arranged in a plane, and the transmission lines are alternately arranged in the second wiring layer, A connection line for electrically connecting the alternately arranged transmission lines having the same phase is disposed on the first wiring layer.
This is because with the configuration as described above, more wiring can be distributed to the second wiring layer than to the first wiring layer in the wiring configuration having the interleave structure.

  For example, in the example shown in FIGS. 4A and 4B, the write wiring has two transmission lines (W1, W3) for transmitting the first electrical signal and 2 for transmitting the second electrical signal. The transmission lines (W2, W4) have an interleaved structure alternately arranged in a plane, and the transmission lines (W1, W2, W3, W4) are alternately arranged in the second wiring layer. In the first wiring layer, a connection line (CL) for electrically connecting the transmission lines (W1, W3) having the same phase is disposed.

  The transmission lines (W1, W3) and the connection line (CL) are electrically connected via connection vias (BH2, BH3) formed in the second insulating layer 23. That is, the connection vias (BH2, BH3) and the connection line (CL) shown in FIG. 4A constitute the jumper line 53 shown in FIG.

  Moreover, in the above-mentioned example, the example in which the connection line (CL) of the interleave structure is formed at the position of the AA cross section of FIG. 1 is shown, but in the present invention, the second wiring layer includes The transmission lines may be alternately arranged, and a connection line for electrically connecting the alternately arranged transmission lines having the same phase may be provided in the first wiring layer. ) Is not particularly limited.

  In the above example, the write wiring has an interleave structure. However, in the present invention, the read wiring may have an interleave structure, and both the read wiring and the write wiring are It may have an interleave structure.

  Hereinafter, members constituting the suspension flexure substrate of the present invention will be described.

[Metal support substrate]
The material for the metal support substrate is not particularly limited as long as it functions as a support for the flexure substrate for suspension and has a desired spring property. For example, stainless steel can be used.
The thickness of the metal support substrate is, for example, preferably in the range of 10 μm to 30 μm, and more preferably in the range of 15 μm to 25 μm.

[First wiring layer and second wiring layer]
The material of the first wiring layer and the second wiring layer is not particularly limited as long as it has desired conductivity, and examples thereof include copper (Cu) or a copper alloy. The wiring of the first wiring layer and the second wiring layer may have a protective plating layer formed of nickel (Ni) or gold (Au) on the surface thereof.

  The wiring thickness of the first wiring layer and the second wiring layer is, for example, preferably in the range of 4 μm to 18 μm, and more preferably in the range of 5 μm to 15 μm. If the wiring thickness is too small, it may not be possible to achieve a sufficiently low impedance. If the wiring thickness is too large, the suspension flexure substrate may become too rigid. .

  The line width of the wirings of the first wiring layer and the second wiring layer is preferably in the range of 10 μm to 100 μm, for example. If the wiring line width is too small, the desired conductivity may not be obtained. If the wiring line width is too large, the suspension flexure substrate may not be sufficiently densified. Because there is.

  Moreover, it is preferable that the distance between wirings exists in the range of 10 micrometers-100 micrometers, for example. If this distance is too small, high processing accuracy is required, leading to an increase in cost, etc., which is not preferable. On the other hand, if this distance is too large, the suspension flexure substrate cannot be sufficiently densified. Because there is a possibility.

[First insulating layer]
The first insulating layer is formed on the surface of the metal supporting substrate, and electrically insulates the wiring formed on the first insulating layer from the metal supporting substrate. The material of the first insulating layer is not particularly limited as long as it has a desired insulating property, and examples thereof include polyimide. The material of the first insulating layer may be a photosensitive material or a non-photosensitive material. The thickness of the first insulating layer is preferably in the range of 5 μm to 30 μm, for example.

[Second insulating layer]
The second insulating layer is formed on the first wiring layer or the first insulating layer, and electrically insulates the first wiring layer and the second wiring layer. Examples of the material for the second insulating layer include polyimide. The material of the second insulating layer may be a photosensitive material or a non-photosensitive material. The thickness of the second insulating layer only needs to form a desired capacitive coupling, and is preferably in the range of 5 μm to 30 μm, for example.

[Cover layer]
In order to prevent deterioration due to corrosion or the like, the transmission line, the conductor film, and the connection line are preferably covered with a cover layer. An example of the material for the cover layer is polyimide. The material of the cover layer may be a photosensitive material or a non-photosensitive material. The thickness of the cover layer is preferably in the range of 3 μm to 30 μm, for example.

[suspension]
Next, the suspension of the present invention will be described. The suspension according to the present invention includes the above-described suspension flexure substrate.

  The suspension of the present invention includes the above-described suspension flexure substrate 1 and a load beam provided on the surface of the suspension flexure substrate 1 opposite to the surface on which the gimbal portion 2 is formed. As the load beam, the same load beam used for a general suspension can be used.

  According to the present invention, the use of the above-described flexure substrate for suspension with reduced warpage improves the quality, and further improves the workability of installing the load beam. Therefore, a more reliable suspension can be obtained. .

[Suspension with head]
Next, the head suspension according to the present invention will be described. The suspension with a head of the present invention includes the above-described suspension and a magnetic head slider mounted on the suspension.
Since the suspension is the same as described above, description thereof is omitted here. Further, the magnetic head slider can be the same as the magnetic head slider used in a general suspension with a head.

  According to the present invention, since the quality is improved by using the above-described suspension, and the workability of mounting the magnetic head slider is also improved, a more reliable suspension with a head can be obtained.

[Hard disk drive]
Next, the hard disk drive of the present invention will be described. The hard disk drive of the present invention includes the above-described suspension with a head.

  The hard disk drive of the present invention has at least a suspension with a head, and usually further includes a disk, a spindle motor, an arm, and a voice coil motor. Since the suspension with a head is the same as described above, description thereof is omitted here. As other members, the same members as those used in a general hard disk drive can be used.

  According to the present invention, a hard disk drive with higher reliability can be obtained by using the suspension with a head described above.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described more specifically with reference to examples.

Example 1
The metal support substrate is made of stainless steel having a thickness of 20 μm, the first insulating layer and the second insulating layer are made of polyimide having a thickness of 10 μm, and the first wiring layer and the second wiring layer are used. 2 uses copper having a thickness of 12 μm, and the cover layer is formed using polyimide to have a thickness of 17 μm from the second insulating layer, as shown in FIGS. 2A and 2B. A flexure substrate for suspension according to the present invention having the structure was obtained.
Here, each of the lead wiring, the write wiring, the power supply wiring, and the ground wiring has a line width of 40 μm.
In the region extending from the tail side end of the opening located on the most tail side of the flexure substrate for suspension to the connection terminal portion, all of the wiring is arranged in the second wiring layer, and the gimbal portion In the vicinity, the power wiring and the ground wiring are disposed in the first wiring layer, and the read wiring and the write wiring are disposed in the second wiring layer.

(Example 2)
The metal support substrate is made of stainless steel having a thickness of 20 μm, the first insulating layer and the second insulating layer are made of polyimide having a thickness of 10 μm, and the first wiring layer and the second wiring layer are used. Is made of 12 μm thick copper, the cover layer is made of polyimide, and the thickness from the second insulating layer is 17 μm, as shown in FIGS. 4A and 4B. A flexure substrate for suspension according to the present invention having the structure was obtained.
Here, each of the lead wiring, the power supply wiring, and the ground wiring has a line width of 40 μm, and the write wiring has an interleaved structure in which four wirings having a line width of 20 μm are alternately arranged.
Then, in the region from the tail side end of the opening located on the most tail side of the flexure substrate for suspension to the connection terminal, all of the wiring is arranged in the second wiring layer, and the gimbal In the vicinity of the portion, the power wiring and the ground wiring are arranged in the first wiring layer, and the read wiring and the write wiring are arranged in the second wiring layer.

DESCRIPTION OF SYMBOLS 1 ... Flexure board | substrate for suspension 2 ... Gimbal part 3 ... Connection terminal part 4, 5 ... Wiring 6 ... Opening part 21 ... Metal support board 22 ... 1st insulating layer 23 ... Second insulating layer 24 ... Cover layer 50 ... Interleaved wiring 51,52 ... Wiring 53 ... Jumper wire 54 ... Connection terminals R1, R2 ... Lead wiring W1, W2, W3, W4 ... Write wiring G ... Ground wiring DC ... Power supply wiring BH1, BH2, BH3 ... Connection via CL ... Connection line

Claims (9)

A metal support substrate;
A first insulating layer formed on the metal support substrate;
A first wiring layer formed on the first insulating layer;
A second insulating layer formed on the first wiring layer or the first insulating layer;
A second wiring layer formed on the second insulating layer;
With
In the first wiring layer and the second wiring layer,
A plurality of wirings connecting the gimbal portion provided on the tip end side of the metal support substrate and the connection terminal portion provided on the tail side end portion are disposed,
The distribution of the wiring arranged in the first wiring layer and the second wiring layer is changed in the longitudinal direction of the wiring,
A suspension flexure substrate having a structure in which more wires are distributed to a second wiring layer than to a first wiring layer in the vicinity of the gimbal portion. A metal support substrate;
A first insulating layer formed on the metal support substrate;
A first wiring layer formed on the first insulating layer;
A second insulating layer formed on the first wiring layer or the first insulating layer;
A second wiring layer formed on the second insulating layer;
With
In the first wiring layer and the second wiring layer,
A plurality of wirings connecting the gimbal portion provided on the tip end side of the metal support substrate and the connection terminal portion provided on the tail side end portion are disposed,
The distribution of the wiring arranged in the first wiring layer and the second wiring layer is changed in the longitudinal direction of the wiring,
The suspension flexure substrate, wherein the connection terminal portion has a structure in which more wiring is distributed to the second wiring layer than to the first wiring layer. In the plurality of wirings connecting the gimbal part and the connection terminal part,
Includes lead wiring, write wiring, power supply wiring, and ground wiring,
In the vicinity of the gimbal part,
The power wiring and the ground wiring are disposed in the first wiring layer,
The suspension flexure substrate according to claim 1, wherein the lead wiring and the write wiring are disposed in the second wiring layer.   3. The suspension flexure substrate according to claim 2, wherein all of the wirings are arranged in the second wiring layer in the connection terminal portion. 4. In the plurality of wirings connecting the gimbal part and the connection terminal part,
Includes lead wiring and write wiring.
The read wiring and / or the write wiring are
Two or more transmission lines for transmitting the first electrical signal;
Two or more transmission lines that transmit a second electrical signal that is opposite in phase to the first electrical signal,
It has an interleaved structure that is arranged alternately in a plane,
The transmission lines are alternately arranged in the second wiring layer,
5. The connection line for electrically connecting the alternately arranged transmission lines having the same phase is disposed in the first wiring layer. 6. Flexure substrate for suspension. The material of the metal support substrate is stainless steel,
The material of the first wiring layer and the second wiring layer is copper or a copper alloy,
The suspension flexure substrate according to any one of claims 1 to 5, wherein a material of the first insulating layer and the second insulating layer is polyimide.   A suspension comprising the flexure substrate for suspension according to any one of claims 1 to 6.   A suspension with a head, comprising: the suspension according to claim 7; and a magnetic head slider mounted on the suspension.   A hard disk drive comprising the suspension with a head according to claim 8.

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