JP6154459B2 - リソグラフィ装置用の燃料システム、euv源、リソグラフィ装置及び燃料フィルタリング方法 - Google Patents
リソグラフィ装置用の燃料システム、euv源、リソグラフィ装置及び燃料フィルタリング方法 Download PDFInfo
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
- H05G2/003—Production of X-ray radiation generated from plasma the plasma being generated from a material in a liquid or gas state
- H05G2/006—Production of X-ray radiation generated from plasma the plasma being generated from a material in a liquid or gas state details of the ejection system, e.g. constructional details of the nozzle
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
- H05G2/008—Production of X-ray radiation generated from plasma involving an energy-carrying beam in the process of plasma generation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
- H05G2/003—Production of X-ray radiation generated from plasma the plasma being generated from a material in a liquid or gas state
- H05G2/005—Production of X-ray radiation generated from plasma the plasma being generated from a material in a liquid or gas state containing a metal as principal radiation generating component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/794—With means for separating solid material from the fluid
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- X-Ray Techniques (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
但し、λは、使用される放射の波長、NAは、パターンを印刷するために使用される投影システムの開口数、k1は、レイリー定数とも呼ばれるプロセス依存調整係数であり、CDは、印刷されるフィーチャのフィーチャサイズ(すなわちクリティカルディメンション)である。式(1)から、フィーチャの印刷可能な最小サイズの縮小は3つの方法、すなわち、露光波長λの短縮によるもの、開口数NAの増加によるもの、又はk1の値の減少によるもの、によって達成可能であることが分かる。
放射ビームB(例えばEUV放射)を調節するように構成された照明システム(イルミネータ)ILと、
パターニングデバイス(例えばマスク又はレチクル)MAを支持するように構成され、パターニングデバイスを正確に位置決めするように構成された第1のポジショナPMに接続された支持構造(例えばマスクテーブル)MTと、
基板(例えばレジストコートウェーハ)Wを保持するように構築され、基板を正確に位置決めするように構成された第2のポジショナPWに接続された基板テーブル(例えばウェーハテーブル)WTと、
パターニングデバイスMAによって放射ビームBに与えられたパターンを基板Wのターゲット部分C(例えば1つ以上のダイを含む)に投影するように構成された投影システム(例えば屈折投影レンズシステム)PSと、を備える。
上式で、媒体及び微粒子の密度はそれぞれPf及びPpで表され、対応する圧縮可能性はcf及びcpである。従って、力Fαは媒体及び粒子の密度に依存し、圧縮可能性は音速に依存する。液体スズ及びスズ(II)及び(IV)酸化物の密度は互いに10%以内であるため、式2は下式に近似される。
Claims (15)
- 一定量の燃料を貯留するリザーバと、
前記リザーバと流体連通し、プラズマ形成場所へ向けて軌道に沿って燃料の流れを誘導するノズルと、
前記燃料から汚染微粒子を分離するように動作可能な燃料汚染制御装置であって、音響フィルタを備える燃料汚染制御装置と、を備える放射線源用の燃料供給源。 - 前記燃料汚染制御装置が、前記汚染微粒子を前記ノズルを通過しないように運ぶ、請求項1に記載の燃料供給源。
- 前記音響フィルタが前記リザーバと前記ノズルとの間に配置される、請求項1に記載の燃料供給源。
- 前記音響フィルタが前記リザーバへの補給ライン上に配置される、請求項1に記載の燃料供給源。
- 前記音響フィルタが、前記リザーバ上又は前記リザーバの上流にある別のリザーバ上に配置される、請求項1に記載の燃料供給源。
- 前記音響フィルタが、前記燃料内の前記フィルタ付近で定在波を生成するように動作可能であり、それによって前記汚染微粒子が前記定在波の最大値及び/又は最小値に整列する、請求項1に記載の燃料供給源。
- 前記燃料汚染制御装置が、汚染摘出ノズルをさらに備え、当該汚染摘出ノズルを通じて前記汚染微粒子が誘導され除去され、
前記音響フィルタが、前記燃料内で前記汚染微粒子が前記汚染摘出ノズルへ向けて整列するような形態を有する前記定在波を生成するように動作可能である、請求項6に記載の燃料供給源。 - 前記定在波は、フィルタリングされる前記燃料を横切り、前記燃料の両端部に節を有する半波長を有する、請求項6に記載の燃料供給源。
- 前記音響フィルタがピエゾセラミック素子を備える、請求項1に記載の燃料供給源。
- 前記音響フィルタが結合層を介して前記燃料に結合される、請求項1に記載の燃料供給源。
- 前記音響フィルタが、1〜10MHzの範囲内の周波数で放出する、請求項1に記載の燃料供給源。
- 請求項1〜11のいずれか1項に記載の燃料供給源と、
前記プラズマ形成場所の前記燃料流にレーザ放射線を誘導して、使用時に、放射線生成プラズマを生成するレーザと、を備えるEUV放射源。 - EUV放射ビームを生成する請求項12に記載のEUV放射源と、
前記放射ビームを調節する照明システムと、
前記放射ビームの断面にパターンを付与してパターン付放射ビームを形成することが可能なパターニングデバイスを支持する支持体と、
基板を保持する基板テーブルと、
前記パターン付放射ビームを前記基板のターゲット部分上に投影する投影システムと、を備えるリソグラフィ装置。 - 放射線源用の燃料供給源内の汚染を制御する方法であって、
前記燃料供給源内に含まれる前記燃料の部分内の汚染微粒子が前記定在波の最大値及び/又は最小値に整列するように、前記燃料の部分内で音響定在波を生成するステップと、
前記整列した汚染微粒子を前記燃料供給源のノズルを通過しないように誘導するステップと、を含む方法。 - 前記誘導するステップが、1つ以上の汚染摘出ノズルへ向けて前記整列した汚染微粒子を誘導するステップを含む、請求項14に記載の方法。
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US201261616117P | 2012-03-27 | 2012-03-27 | |
US61/616,117 | 2012-03-27 | ||
PCT/EP2013/052342 WO2013143733A1 (en) | 2012-03-27 | 2013-02-06 | Fuel system for lithographic apparatus, euv source,lithographic apparatus and fuel filtering method |
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JP6154459B2 true JP6154459B2 (ja) | 2017-06-28 |
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US (1) | US9648714B2 (ja) |
JP (1) | JP6154459B2 (ja) |
WO (1) | WO2013143733A1 (ja) |
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JP6845245B2 (ja) * | 2015-12-17 | 2021-03-17 | エーエスエムエル ネザーランズ ビー.ブイ. | 液滴ジェネレータ及びレーザ生成プラズマ放射源 |
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US4055491A (en) * | 1976-06-02 | 1977-10-25 | Porath Furedi Asher | Apparatus and method for removing fine particles from a liquid medium by ultrasonic waves |
JPS58151949A (ja) | 1982-03-05 | 1983-09-09 | Sumitomo Metal Ind Ltd | 浸漬ノズルの詰り防止方法 |
JPH11347392A (ja) | 1998-06-11 | 1999-12-21 | Hitachi Ltd | 攪拌装置 |
US20060255298A1 (en) | 2005-02-25 | 2006-11-16 | Cymer, Inc. | Laser produced plasma EUV light source with pre-pulse |
US7405416B2 (en) * | 2005-02-25 | 2008-07-29 | Cymer, Inc. | Method and apparatus for EUV plasma source target delivery |
US20050077655A1 (en) * | 2002-02-18 | 2005-04-14 | Nissan Kenzai Co., Ltd. | Method of preventing adhesion of gypsum foreign matter of gypsum slurry, gypsum slurry supply stabilizing device with gypsum foreign matter adhesion prevention device, and method of manufacturing gypsum board by using the stabilizing device |
US6835944B2 (en) * | 2002-10-11 | 2004-12-28 | University Of Central Florida Research Foundation | Low vapor pressure, low debris solid target for EUV production |
WO2005002710A1 (en) * | 2003-04-04 | 2005-01-13 | Donaldson Company, Inc. | Acoustical cavity for removal of contaminants from fluid |
US7449703B2 (en) | 2005-02-25 | 2008-11-11 | Cymer, Inc. | Method and apparatus for EUV plasma source target delivery target material handling |
JP4780394B2 (ja) | 2005-07-29 | 2011-09-28 | 独立行政法人産業技術総合研究所 | 液滴供給方法及び装置 |
EP2481815B1 (en) | 2006-05-11 | 2016-01-27 | Raindance Technologies, Inc. | Microfluidic devices |
EP1872952A1 (en) * | 2006-06-28 | 2008-01-02 | Océ-Technologies B.V. | Ink jet printhead with an acoustic filter |
JP5386799B2 (ja) | 2007-07-06 | 2014-01-15 | 株式会社ニコン | Euv光源、euv露光装置、euv光放射方法、euv露光方法および電子デバイスの製造方法 |
EP2154574B1 (en) * | 2008-08-14 | 2011-12-07 | ASML Netherlands BV | Radiation source and method of generating radiation |
WO2010040394A1 (en) | 2008-10-08 | 2010-04-15 | Foss Analytical A/S | Separation of particles in liquids by use of a standing ultrasonic wave |
JP5455661B2 (ja) | 2009-01-29 | 2014-03-26 | ギガフォトン株式会社 | 極端紫外光源装置 |
PL2556176T3 (pl) | 2010-04-09 | 2020-08-24 | Southwire Company, Llc | Ultradźwiękowe odgazowywanie stopionych metali |
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