JP6135183B2 - Laser processing equipment - Google Patents

Description

  The present invention relates to a laser processing apparatus, and more particularly to a laser processing apparatus that forms a slit by laser light on a workpiece by relatively moving a processing table and a processing head.

Conventionally, a laser oscillator that generates laser light, a processing table that supports a workpiece, a processing head that incorporates a condensing lens that irradiates the workpiece with laser light, and the processing table and the processing head are relative to each other. There is known a laser processing apparatus including a moving means for moving.
Such a laser processing apparatus is controlled by a control unit, and the control unit controls the laser oscillator and the moving unit based on a processing program, so that a slit having a predetermined width can be formed on the workpiece. It is used for processing a groove (slit) for embedding a blade (cutting blade) in a cutting die (die board) such as cardboard (Patent Documents 1 and 2).

JP-A-56-129911 Japanese Utility Model Publication No. 1-127734

Here, for example, when wood is used as the material of the die board and the workpiece to be laser processed is wood, the output of the laser light from the processing head and the relative movement speed by the moving means, the workpiece Even if the distance between the focusing lens and the condenser lens is constant, the processing width of the slit formed by the laser beam may differ depending on the direction of the grain of the workpiece (plate grain, grid).
Thus, if the machining width varies depending on the machining direction with respect to the grain, an error occurs in the product dimensions in the cutting process, and when the slit is formed in the die board, the above-mentioned cutting blade cannot be inserted into the slit, Problems such as rattling and falling off occurred.
In view of such problems, the present invention provides a laser processing apparatus capable of forming a slit according to a designed processing width even when the processing width varies depending on the processing direction. is there.

That is, a laser processing apparatus according to the present invention includes a laser oscillator that generates laser light, a processing table that supports a workpiece, a processing head that includes a condenser lens that irradiates the workpiece with laser light, Laser processing comprising a moving means for moving the processing table and the processing head relative to each other, and a control means for reading the processing program and controlling the operation of the laser oscillator and the moving means, and forming a slit having a predetermined width on the workpiece. In the device
In the machining program, information on the design width of the slit and the relative two-dimensional movement direction of the machining table and the machining head by the moving means for forming a linear slit is described. ,
The control means registers a plurality of different machining conditions set for each linear slit machining direction corresponding to the relative two-dimensional movement direction of the machining table and machining head described in the machining program. Machining condition registration means,
Further, when the control means recognizes the processing direction of the linear slit from the relative two-dimensional movement direction of the processing table and the processing head described in the processing program , the control condition registration means determines the linear direction. A processing condition corresponding to the processing direction of the slit is selected, and a linear slit is formed in the workpiece so that the actual processing width matches the designed processing width.

  According to the above invention, the actual machining width varies depending on the machining direction by registering the machining conditions for each machining direction and the designed machining width in the machining condition registration means. However, it is possible to easily change the machining conditions so that the actual machining width of the formed slit matches the designed machining width.

The schematic of the laser processing apparatus concerning a present Example. The top view of the die board as a to-be-processed object. The top view of the test piece for registering processing conditions.

The illustrated embodiment will be described below. FIG. 1 shows a laser processing apparatus 1 according to the present invention, in which a die board 2 as a workpiece is irradiated with laser light to form a slit 2a.
The die board 2 is formed by laminating a plurality of pieces of wood, and the slit 2a is intermittently formed along the outer edge of the developed cardboard box as shown in FIG. Are formed in a straight line.
In the slit 2a, although not shown in the figure, a metal and long thin plate-shaped punching blade is inserted and mounted so that its teeth protrude from the surface of the die board 2.

The laser processing apparatus 1 includes a laser oscillator 3 that generates laser light, a processing table 4 that supports the die board 2, a processing head 5 that irradiates the die board 2 with laser light, and the processing table 4 and processing head 5. And control means 6 for forming the slit 2a by the laser beam on the die board 2 by controlling the above.
The processing table 4 supports the die board 2 on its upper surface and includes an X direction table 7 and a Y direction table 8 as moving means, and moves the die board 2 in a horizontal two-dimensional direction.
The processing head 5 is provided above the processing table 4, and the laser beam emitted from the laser oscillator 3 is guided by a light guide means (not shown) and then collected in the processing head 5. The light is condensed by the lens 5 a and irradiated onto the die board 2 supported by the processing table 4.
Further, the processing head 5 is moved up and down by the lifting means 9 to adjust the distance between the die board 2 and the condensing lens 5a, so that the diameter of the focal point of the laser beam irradiated onto the die board 2 can be adjusted. . It is also possible to adjust the diameter of the focal point of the laser beam by raising and lowering the condenser lens 5a inside the processing head 5.
In this embodiment, the X direction and Y direction tables 7 and 8 are used as moving means for relatively moving the processing table 4 and the processing head 5 two-dimensionally. However, the processing head 5 is moved in the two-dimensional direction. It is good also as a structure moved to.

The control means 6 is based on so-called computer numerical control, the X and Y direction tables 7 and 8 of the processing table 4, the lifting means 9 of the processing head 5 (condensing lens 5a), and the output of the laser oscillator 3. In order to perform this numerical control, the control means 6 reads a machining program consisting of a plurality of lines of commands.
In order to generate the machining program, a machining figure for the slit 2a formed in the die board 2 is created in advance by a machining figure creating means 10 such as CAD (Computer Aided Design).
The processed figure data created by the processed figure creating means 10 is converted into the machining program by the machining program creating means 11 such as CAM (Computer Aided Manufacturing).
Specifically, the processed figure is configured as information on the relative two-dimensional movement direction of the processing table 4 and the processing head 5 by the X direction and Y direction tables 7 and 8 for forming the slit 2a. For each of the start point and end point of each slit 2a, coordinate values in the processing table 4 are set, and other information such as the height of the processing head 5 and the position of the condenser lens is described in the processing program.
Further, in the machining program created by the machining program creation means 11 of the present embodiment, information on the width of the slit 2a, that is, the designed machining width is described for all the slits 2a constituting the die board 2.
The machining program creation means 11 may have a CAD function in addition to the CAM function.
When the control means 6 reads the machining program, the control program 6 processes the machining program in order from the first line, moves the X and Y direction tables 7 and 8 in the machining table 4, and lifts and lowering means 9 of the machining head 5. Thus, the slit 2a based on the processed figure is formed on the die board 2.

Here, when the workpiece is wood constituting the die board 2, there may be a difference in the actual machining width depending on the grain of the wood, depending on the machining direction of the linear slit 2a.
Specifically, even if the moving speed of the processing table 4 and the output of the laser beam from the processing head 5 are constant, the slit 2a formed linearly along the grain and the slit 2a intersecting the grain Then, it is known that the slit 2a formed along the grain becomes thinner.
In other words, if there is no change in the actual processing width even if the processing direction is changed as with a metal plate, any processing direction can be processed under the same processing conditions, but in the case of materials such as wood, changing the processing direction is the same. Even under the processing conditions, the actual processing width varies, and the slit 2a may not be formed according to the designed processing width.
If there is an error between the designed machining width and the actual machining width, when the punching blade is attached to the slit 2a of the die board 2, the slit 2a is wider than the designed machining width. If the slit 2a is narrower than the designed processing width, there is a problem that it is difficult to mount the punching blade.

Therefore, in the laser processing apparatus 1 of the present embodiment, all the slits 2a are formed with the designed processing width regardless of the grain direction of the die board 2 so that the above-described cutting blade can be appropriately mounted. Is.
The laser processing apparatus 1 of the present embodiment has a processing direction of the linear slit 2a, that is, a relative two-dimensional movement direction between the processing table 4 and the processing head 5 by the X direction and Y direction tables 7 and 8, and the above design. The machining condition registration means 12 for registering the machining conditions associated with each of the upper machining widths, and the machining code for assigning a required machining code to the machining program according to the machining direction of the slit 2a and the designed machining width, respectively. Providing means 13.
The processing condition registration means 12 is provided in the control means 6, and the processing conditions include the relative two-dimensional movement speed between the processing table 4 and the processing head 5, the processing head 5 with respect to the die board 2, These are set values for the interval between the condenser lenses 5a and the output of the laser oscillator 3, and are set for each processing direction and design processing width of the slit 2a and the thickness of the die board 2 that is a workpiece. Is.

Hereinafter, the procedure for registering the processing conditions in the processing condition registration means 12 will be described. First, a test piece 14 made of the same wood as the die board 2 is placed on the processing table 4, and at this time, the same direction as the grain of the die board 2 Place it so that it faces.
The control means 6 reads a machining program for setting created to register the machining conditions, and the machining program for setting includes, in addition to the coordinate value of the linear slit 2a and the designed machining width, the above-mentioned machining program. Information such as the moving speed of the test piece 14 by the processing table 4 and the output of the laser beam emitted from the processing head 5 is described.
The control means 6 uses this setting processing program to make the output of the laser light emitted from the processing head 5 constant, and to keep the moving speed of the test piece 14 by the processing table 4 constant. The processing head 5 is moved in a relative and linear two-dimensional movement direction so that the relative movement speed between the head 14 and the processing head 5 is constant.
The control means 6 is the direction of the grain (X direction), the direction orthogonal to the grain (Y direction), the direction inclined 45 ° counterclockwise with respect to the X direction (XY1 direction) with respect to the test piece 14, Linear slits 2a are formed in a total of four directions, ie, directions inclined in the clockwise direction by 45 ° with respect to the X direction (XY2 directions). As shown in FIG. 3, the slits 2a are not necessarily crossed.
When the slit 2a is formed in the test piece 14 in this way, the actual machining width of each slit 2a formed in the test piece 14 in each machining direction is measured, and this is described in the machining program for setting. Compare with the designed machining width.

Next, based on the error between the actual machining width obtained by comparison and the designed machining width, the machining head 5 and the machining table 4 are adjusted so that the actual machining width matches the designed machining width. Set machining conditions.
Specifically, when the actual machining width is larger than the designed machining width, for example, the movement speed of the machining table 4 may be set faster with respect to the operation based on the machining program for setting. If the actual machining width is narrower than the designed machining width, the moving speed of the machining table 4 may be set slower.
In addition to this, the diameter of the focal point of the laser beam is increased by moving the machining head 5 up and down by the elevating means 9 or changing the position of the condenser lens 5a in response to the operation of the setting processing program. -It can reduce and change the actual processing width of the slit 2a.
These processing conditions are set for each processing direction of the slit 2a for each processing width of the material and thickness of the die board 2 and the linear slit 2a to be formed.

When machining conditions are determined for each of the four machining directions thus obtained, the machining condition registration unit 12 is further set with a range of linear machining directions to which these machining conditions should be applied. .
In the present embodiment, the four machining directions actually measured are set so as to apply the machining conditions common to the 45 ° range with each direction as the center. Specifically, as shown in FIG. 3, when the right side in the X direction is 0 °, the machining table 4 moves the die board 2 from the start point of the slit 2 a to 22.5 ° to 337.5 ° or 157.5 ° to 202. When moving in the direction of 5 °, the machining conditions set in the X direction are applied.
If the slits 2a are formed in more directions than the above four directions and the error between the actual machining width and the design machining width is measured more, machining conditions can be set more finely. The processing conditions do not need to be set within a range of 45 °, and can be set as appropriate according to the direction of the grain.

Next, the machining code providing means 13 is provided in the machining program creating means 11. When a machining program is created by the machining program creating means 11, the machining program is added before the machining program is read by the control means 6. Is read and the required machining code is given.
The machining code is set in each of the machining direction of the slit 2a for each material of the die board 2, the plate thickness, and the machining width of the slit 2a to be formed. A machining code is associated.
Then, when the machining code adding means 13 reads the machining program created by the machining program creating means 11, the machining code adding means 13 recognizes the material and thickness of the die board 2 from the machining program, and from the first slit 2a described in the machining program. In order, the processing direction of the slit 2a is recognized based on the coordinate values of the start point and the end point.
When the machining code providing means 13 recognizes the machining direction of the slit 2a, the machining code associated with the machining conditions suitable for forming the slit 2a is stored in the machining program for the description of each slit 2a in the machining program. Appends to be added.
The control means 6 reads the machining program to which the machining code is assigned. When the machining code is read together with the description about each slit 2a, the machining conditions associated with the machining code are registered in the machining condition. Select from means 12 and read.
The control means linearly forms the slit 2a in the machining direction described in the machining program, and controls the moving speed of the machining table 4 and the position of the machining head 5 based on the machining conditions selected at that time. Thus, the slit 2a can be formed with the designed processing width described in the processing program.

Hereinafter, the operation of the laser processing apparatus 1 having the above configuration will be described.
First, the die board 2 is placed on the processing table 4. At this time, the wood grain constituting the die board 2 is placed so as to face the same direction as the grain of the test piece 14 used when setting the processing conditions.
On the other hand, the machining program creation means 11 creates a machining program in which the starting point and end point coordinate values of the slit 2a formed in the die board 2 and the design machining width, as well as the material and thickness of the die board 2 are registered. Yes. Specifically, for each of the slits 2a constituting the die board 2, an appropriate design processing width for setting the punching blade is set.
When the machining program is created by the machining program creation means 11, the machining code assigning means 13 reads the machining program, recognizes the material and thickness of the die board 2, and the slit described at the top of the machining program. In order from 2a, the machining direction is recognized from the coordinate values of the start and end points, and the design machining width of the slit 2a is read.
Next, the machining code assigning means 13 selects a machining code corresponding to the machining direction of the linear slit 2a and assigns it to the description relating to the slit 2a in the machining program.
The machining code assigning means 13 assigns the machining code to information on all the slits 2 a described in the machining program, and the machining program to which the machining code is assigned is transmitted to the control means 6.

When the control means 6 reads the machining program from the machining program creation means 11, the control means 6 reads the data of the material and thickness of the die board 2 and starts from the information of the slit 2a described at the head of the machining program. Then, the machining direction is calculated from the coordinate value of the end point, and the designed machining width is read together.
Next, the control means 6 operates the machining table 4 to move the position to be the starting point of the slit 2a described at the top of the machining program to the position irradiated with the laser beam by the machining head 5.
When the position to be the starting point of the slit 2a moves to the irradiation position of the laser beam, the control means 6 reads the machining code given to the machining program and selects the machining condition associated with the machining code from the machining condition registration means 12 To do.
The control means 6 controls the moving speed of the processing table 4 and the height of the processing head 5 based on the processing conditions, and forms the slits 2a in the die board 2.

Since the slit 2a formed in this way is formed based on the machining conditions registered in the machining condition registration means 12, the actual machining width is machined at the designed machining width described in the machining program. Will be.
When one slit 2a is formed, the control means 6 reads the start point and end point of the next slit 2a and the designed machining width in accordance with the machining program, and sets the machining conditions corresponding to the machining code as machining conditions. Read from the registration means 12 and process the slits 2a sequentially.
At this time, for example, when the machining conditions are due to the raising and lowering of the machining head 5, the machining table 4 moves the die board 2 from the end point of the slit 2a after the machining to the start point of the next slit 2a. The machining conditions can be set by moving the head 5 up and down.

According to the above embodiment, the machining head 5 and the machining table 4 are controlled on the basis of the machining conditions of the machining condition registering means 12, so that the design machining width is linear regardless of the machining direction of the slit 2a. The slit 2a can be formed, and problems such as wobbling or difficulty in mounting due to the narrow slit 2a can be prevented when mounting the punching blade on the slit 2a thus formed.
Here, the same control as the above-described processing conditions, that is, a command for changing the moving speed of the processing table 4 or the height of the processing head 5 may be added to the processing program generated by the processing program generating means 11 in advance. As in the embodiment, the slit 2a can be formed with a designed processing width.
However, if an instruction to change the machining condition is added to the machining program, the machining program itself becomes redundant, and the control means 6 processes the machining program in order from the first line, so that the processing becomes slow. There's a problem.

In the above embodiment, the processing code applying means 13 can be omitted. In that case, the control means 6 may read the machining program created by the machining program creation means 11 directly.
In addition, the control means 6 directly selects the machining conditions corresponding to these from the machining condition registration means 12 based on the machining direction of the slit 2a and the designed machining width described in the machining program, and uses them. That's fine.

In addition to the case where the slit 2a is formed in the die board 2 made of wood having a grain as in the above embodiment, the focus of the laser light irradiated to the workpiece from the processing head 5 is corrected in the light guiding process. Even in the case of an elliptical shape instead of a circle, a phenomenon occurs in which the actual processing width varies depending on the processing direction.
In such a case, even if the workpiece is not wood, the processing width differs between when the laser beam is moved to the long axis side of the focal point and when the laser beam is moved to the short axis side. Become.
Therefore, as in the above embodiment, for each machining direction of the slit 2a, an error between the designed machining width of the slit 2a and the actual machining width formed on the workpiece is measured, and the machining condition registration means 12 stores the error. If a machining condition is registered such that the actual machining width matches the designed machining width, the slit 2a can be formed on the workpiece with the designed machining width regardless of the machining direction.

Furthermore, although the laser processing apparatus 1 in the said Example forms the slit 2a in the die board 2 as a workpiece, it can be used also for the use which cuts a workpiece with a laser beam.
For example, when cutting wood as a workpiece, if cutting is performed by applying the processing conditions registered in the processing condition registration means 12 along the grain of the wood, the cutting allowance by the laser light is constant regardless of the processing direction. Therefore, a product after cutting can be obtained with high accuracy.
Further, the workpiece is not limited to wood, but may be a resin having directionality, for example.

1 Laser processing equipment 2 Die board (workpiece)
2a slit 3 laser oscillator 4 machining table 5 machining head 6 control means 11 machining program creation means 12 machining condition registration means 13 machining code provision means

Claims (4)

A laser oscillator that generates laser light, a processing table that supports a workpiece, a processing head that includes a condenser lens that irradiates the processing object with laser light, and the processing table and the processing head are moved relative to each other. In a laser processing apparatus comprising a moving means and a control means for reading a machining program and controlling the operation of the laser oscillator and the moving means, and forming a slit having a predetermined width in the workpiece,
In the machining program, information on the design width of the slit and the relative two-dimensional movement direction of the machining table and the machining head by the moving means for forming a linear slit is described. ,
The control means registers a plurality of different machining conditions set for each linear slit machining direction corresponding to the relative two-dimensional movement direction of the machining table and machining head described in the machining program. Machining condition registration means,
Further, when the control means recognizes the processing direction of the linear slit from the relative two-dimensional movement direction of the processing table and the processing head described in the processing program , the control condition registration means determines the linear direction. A laser machining apparatus, wherein a machining condition corresponding to a machining direction of a slit is selected, and a linear slit is formed in a workpiece so that an actual machining width matches the designed machining width. Provided with machining code assigning means for assigning each required machining code set for each linear slit machining direction corresponding to the relative two-dimensional movement direction of the machining table and machining head described in the machining program. ,
Said machining condition registration means stores the machining conditions in association with the processing code, the control means Nde write read a machining program that is granted the processing code, to recognize the machining direction of the linear slits the laser processing apparatus according to claim 1, wherein the selecting processing conditions corresponding to the machining code from the processing condition registration unit.   As processing conditions registered in the processing condition registration means, at least one of a relative two-dimensional moving speed between the processing table and the processing head by the moving means, a distance between the workpiece and the condenser lens, or an output of the laser oscillator Either is registered, The laser processing apparatus in any one of Claim 1 or Claim 2 characterized by the above-mentioned.   4. The laser processing apparatus according to claim 1, wherein the workpiece is wood.

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