JP6133218B2 - 化学機械平坦化パッドコンディショナー - Google Patents
化学機械平坦化パッドコンディショナー Download PDFInfo
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- JP6133218B2 JP6133218B2 JP2013557810A JP2013557810A JP6133218B2 JP 6133218 B2 JP6133218 B2 JP 6133218B2 JP 2013557810 A JP2013557810 A JP 2013557810A JP 2013557810 A JP2013557810 A JP 2013557810A JP 6133218 B2 JP6133218 B2 JP 6133218B2
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- pad conditioner
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- pad
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- 239000000126 substance Substances 0.000 title claims description 23
- 239000000758 substrate Substances 0.000 claims description 165
- 238000005498 polishing Methods 0.000 claims description 72
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 54
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 52
- 239000010432 diamond Substances 0.000 claims description 44
- 229910003460 diamond Inorganic materials 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 26
- 239000011248 coating agent Substances 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 22
- 239000011148 porous material Substances 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 14
- 230000005484 gravity Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 description 46
- 238000005520 cutting process Methods 0.000 description 36
- 230000003750 conditioning effect Effects 0.000 description 33
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 29
- 238000009826 distribution Methods 0.000 description 26
- 230000008569 process Effects 0.000 description 26
- 229910002804 graphite Inorganic materials 0.000 description 25
- 239000010439 graphite Substances 0.000 description 25
- 239000000919 ceramic Substances 0.000 description 21
- 239000010410 layer Substances 0.000 description 19
- 230000001788 irregular Effects 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000000203 mixture Substances 0.000 description 10
- 238000012545 processing Methods 0.000 description 10
- 239000002002 slurry Substances 0.000 description 9
- 239000011159 matrix material Substances 0.000 description 8
- 238000001000 micrograph Methods 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- 229910010293 ceramic material Inorganic materials 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 230000000712 assembly Effects 0.000 description 4
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- 230000008901 benefit Effects 0.000 description 4
- 230000002902 bimodal effect Effects 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000004050 hot filament vapor deposition Methods 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 229910021426 porous silicon Inorganic materials 0.000 description 3
- 238000005070 sampling Methods 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
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- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
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- 230000033001 locomotion Effects 0.000 description 2
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- 230000009467 reduction Effects 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 235000012087 Psidium araca Nutrition 0.000 description 1
- 244000233562 Psidium araca Species 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910021431 alpha silicon carbide Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009760 electrical discharge machining Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009763 wire-cut EDM Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161449851P | 2011-03-07 | 2011-03-07 | |
| US61/449,851 | 2011-03-07 | ||
| US201161506483P | 2011-07-11 | 2011-07-11 | |
| US61/506,483 | 2011-07-11 | ||
| US201161513294P | 2011-07-29 | 2011-07-29 | |
| US61/513,294 | 2011-07-29 | ||
| PCT/US2012/027916 WO2012122186A2 (en) | 2011-03-07 | 2012-03-06 | Chemical mechanical planarization pad conditioner |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014510645A JP2014510645A (ja) | 2014-05-01 |
| JP2014510645A5 JP2014510645A5 (OSRAM) | 2015-04-23 |
| JP6133218B2 true JP6133218B2 (ja) | 2017-05-24 |
Family
ID=46798753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013557810A Active JP6133218B2 (ja) | 2011-03-07 | 2012-03-06 | 化学機械平坦化パッドコンディショナー |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US9132526B2 (OSRAM) |
| EP (1) | EP2684211B1 (OSRAM) |
| JP (1) | JP6133218B2 (OSRAM) |
| KR (1) | KR101916492B1 (OSRAM) |
| CN (1) | CN103688343B (OSRAM) |
| SG (1) | SG193340A1 (OSRAM) |
| TW (1) | TWI592258B (OSRAM) |
| WO (1) | WO2012122186A2 (OSRAM) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140120724A1 (en) * | 2005-05-16 | 2014-05-01 | Chien-Min Sung | Composite conditioner and associated methods |
| SG193340A1 (en) | 2011-03-07 | 2013-10-30 | Entegris Inc | Chemical mechanical planarization pad conditioner |
| KR101144981B1 (ko) * | 2011-05-17 | 2012-05-11 | 삼성전자주식회사 | Ｃｍｐ 패드 컨디셔너 및 상기 ｃｍｐ 패드 컨디셔너 제조방법 |
| KR101339722B1 (ko) * | 2011-07-18 | 2013-12-10 | 이화다이아몬드공업 주식회사 | Ｃｍｐ 패드 컨디셔너 |
| WO2014022465A1 (en) * | 2012-08-02 | 2014-02-06 | 3M Innovative Properties Company | Abrasive articles with precisely shaped features and method of making thereof |
| USD743456S1 (en) | 2012-09-26 | 2015-11-17 | Ebara Corporation | Dresser disk |
| USD737873S1 (en) | 2012-09-26 | 2015-09-01 | Ebara Corporation | Dresser disk |
| TWD160526S (zh) | 2012-09-26 | 2014-05-11 | 荏原製作所股份有限公司 | 修整器碟片用修整塊 |
| KR101392401B1 (ko) * | 2012-11-30 | 2014-05-07 | 이화다이아몬드공업 주식회사 | 컨디셔너 겸용 웨이퍼 리테이너링 및 상기 리테이너링 제조방법 |
| US20140295740A1 (en) * | 2013-03-26 | 2014-10-02 | HGST Netherlands B.V. | Ultra fine lapping substrate through use of hard coated material on lapping kinematics |
| USD743455S1 (en) | 2013-03-26 | 2015-11-17 | Ebara Corporation | Dresser disk |
| TW201512445A (zh) * | 2013-07-11 | 2015-04-01 | Entegris Inc | 經塗覆之化學機械硏磨之固定環 |
| TWI580524B (zh) * | 2014-02-18 | 2017-05-01 | 中國砂輪企業股份有限公司 | 高性能化學機械研磨修整器及其製作方法 |
| WO2015143278A1 (en) | 2014-03-21 | 2015-09-24 | Entegris, Inc. | Chemical mechanical planarization pad conditioner with elongated cutting edges |
| TW201538276A (zh) * | 2014-04-08 | 2015-10-16 | Kinik Co | 非等高度之化學機械研磨修整器 |
| TW201538275A (zh) * | 2014-04-08 | 2015-10-16 | Kinik Co | 平坦化之化學機械研磨修整器 |
| TWI546159B (zh) * | 2014-04-11 | 2016-08-21 | 中國砂輪企業股份有限公司 | 可控制研磨深度之化學機械研磨修整器 |
| CN105364715A (zh) * | 2014-08-11 | 2016-03-02 | 兆远科技股份有限公司 | 抛光修整器 |
| DE102015220090B4 (de) * | 2015-01-14 | 2021-02-18 | Siltronic Ag | Verfahren zum Abrichten von Poliertüchern |
| JP6453666B2 (ja) * | 2015-02-20 | 2019-01-16 | 東芝メモリ株式会社 | 研磨パッドドレッサの作製方法 |
| GB201504759D0 (en) * | 2015-03-20 | 2015-05-06 | Rolls Royce Plc | Abrading tool for a rotary dresser |
| TWI595973B (zh) * | 2015-06-01 | 2017-08-21 | China Grinding Wheel Corp | Chemical mechanical polishing dresser and its manufacturing method |
| TWI623382B (zh) * | 2015-10-27 | 2018-05-11 | 中國砂輪企業股份有限公司 | Hybrid chemical mechanical polishing dresser |
| WO2017146678A1 (en) * | 2016-02-23 | 2017-08-31 | Intel Corporation | Conditioning disks for chemical mechanical polishing |
| WO2017146677A1 (en) * | 2016-02-23 | 2017-08-31 | Intel Corporation | Conditioning disks for chemical mechanical polishing |
| JP2018032745A (ja) * | 2016-08-24 | 2018-03-01 | 東芝メモリ株式会社 | ドレッサー、ドレッサーの製造方法、及び半導体装置の製造方法 |
| CN107801366B (zh) * | 2016-09-06 | 2020-07-17 | 拓自达电线株式会社 | 电磁波屏蔽膜 |
| US10471567B2 (en) | 2016-09-15 | 2019-11-12 | Entegris, Inc. | CMP pad conditioning assembly |
| US20180085891A1 (en) * | 2016-09-29 | 2018-03-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Apparatus for shaping the surface of chemical mechanical polishing pads |
| AU201712278S (en) | 2016-10-21 | 2017-06-06 | 3M Innovative Properties Co | Trapezoidal structured abrasive article |
| US20190337119A1 (en) * | 2016-12-21 | 2019-11-07 | 3M Innovative Properties Company | Pad conditioner with spacer and wafer planarization system |
| TWI621503B (zh) * | 2017-05-12 | 2018-04-21 | Kinik Company Ltd. | 化學機械研磨拋光墊修整器及其製造方法 |
| CN111032284B (zh) * | 2017-08-04 | 2022-11-04 | 3M创新有限公司 | 具有增强的共平面性的微复制型抛光表面 |
| US10269574B1 (en) | 2017-10-03 | 2019-04-23 | Mattson Technology, Inc. | Surface treatment of carbon containing films using organic radicals |
| US10857651B2 (en) * | 2017-11-20 | 2020-12-08 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus of chemical mechanical polishing and operating method thereof |
| US10654150B2 (en) * | 2017-12-26 | 2020-05-19 | Industrial Technology Research Institute | Grinding disk and method of manufacturing the same |
| CN111699439A (zh) * | 2018-02-06 | 2020-09-22 | Asml荷兰有限公司 | 用于修复衬底支撑件的系统、装置和方法 |
| US20190351527A1 (en) * | 2018-05-17 | 2019-11-21 | Entegris, Inc. | Conditioner for chemical-mechanical-planarization pad and related methods |
| US11806833B2 (en) * | 2018-08-31 | 2023-11-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical planarization system and a method of using the same |
| WO2020044011A1 (en) * | 2018-08-31 | 2020-03-05 | Morgan Advanced Ceramics, Inc. | Hybrid cmp conditioning head |
| WO2020081226A1 (en) | 2018-10-15 | 2020-04-23 | Mattson Technology, Inc. | Ozone for selective hydrophilic surface treatment |
| US10950416B2 (en) | 2018-11-16 | 2021-03-16 | Mattson Technology, Inc. | Chamber seasoning to improve etch uniformity by reducing chemistry |
| US10403492B1 (en) | 2018-12-11 | 2019-09-03 | Mattson Technology, Inc. | Integration of materials removal and surface treatment in semiconductor device fabrication |
| EP3924146A4 (en) * | 2019-02-13 | 2022-11-09 | 3M Innovative Properties Company | ABRASIVES WITH PRECISELY SHAPED FEATURES, ABRASIVES MADE THEREOF AND PROCESSES FOR THEIR MANUFACTURE |
| KR102156997B1 (ko) * | 2019-03-11 | 2020-09-16 | 한양대학교 에리카산학협력단 | Cmp 패드 컨디셔너 및 그 동작 방법 |
| SG11202111151XA (en) * | 2019-04-09 | 2021-11-29 | Entegris Inc | Segment designs for discs |
| CN110722456A (zh) * | 2019-10-14 | 2020-01-24 | 西安奕斯伟硅片技术有限公司 | 一种抛光垫修整设备和方法 |
| TWI859404B (zh) * | 2020-01-30 | 2024-10-21 | 台灣積體電路製造股份有限公司 | 可攜式清潔裝置 |
| CN113050384B (zh) * | 2020-04-23 | 2025-02-18 | 台湾积体电路制造股份有限公司 | 半导体晶圆加工方法及清洁刷头 |
| TWI738304B (zh) | 2020-04-23 | 2021-09-01 | 台灣積體電路製造股份有限公司 | 半導體晶圓加工方法及清潔刷頭 |
| US20210402563A1 (en) * | 2020-06-26 | 2021-12-30 | Applied Materials, Inc. | Conditioner disk for use on soft or 3d printed pads during cmp |
| TWI768692B (zh) * | 2021-02-01 | 2022-06-21 | 中國砂輪企業股份有限公司 | 化學機械研磨拋光墊修整器及其製造方法 |
| CN113199400A (zh) * | 2021-05-25 | 2021-08-03 | 宁波江丰电子材料股份有限公司 | 一种化学机械研磨抛光垫整修器及其制备方法 |
| JP2024535447A (ja) * | 2021-09-29 | 2024-09-30 | インテグリス・インコーポレーテッド | 両面パッドコンディショナー |
| WO2023129567A1 (en) * | 2021-12-31 | 2023-07-06 | 3M Innovative Properties Company | Pad conditioning brush |
| TWI845078B (zh) * | 2022-12-20 | 2024-06-11 | 宋健民 | 一種單晶金字塔鑽石碟 |
| KR102876400B1 (ko) * | 2023-04-24 | 2025-10-24 | 새솔다이아몬드공업 주식회사 | 패드 컨디셔너 |
| CN116652825B (zh) * | 2023-07-24 | 2023-11-10 | 北京寰宇晶科科技有限公司 | 一种金刚石cmp抛光垫修整器及其制备方法 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4706416A (en) * | 1987-01-12 | 1987-11-17 | Kottas Robert P | Tool for removing residues |
| US5186973A (en) | 1990-09-13 | 1993-02-16 | Diamonex, Incorporated | HFCVD method for producing thick, adherent and coherent polycrystalline diamonds films |
| CA2081631A1 (en) | 1991-10-30 | 1993-05-01 | Cornelius Phaal | Tool insert |
| JP2914166B2 (ja) * | 1994-03-16 | 1999-06-28 | 日本電気株式会社 | 研磨布の表面処理方法および研磨装置 |
| US9199357B2 (en) * | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US6054183A (en) | 1997-07-10 | 2000-04-25 | Zimmer; Jerry W. | Method for making CVD diamond coated substrate for polishing pad conditioning head |
| JPH1158232A (ja) * | 1997-08-26 | 1999-03-02 | Toshiba Ceramics Co Ltd | ドレッシング工具及びその製造方法 |
| US6027659A (en) * | 1997-12-03 | 2000-02-22 | Intel Corporation | Polishing pad conditioning surface having integral conditioning points |
| KR19990081117A (ko) * | 1998-04-25 | 1999-11-15 | 윤종용 | 씨엠피 패드 컨디셔닝 디스크 및 컨디셔너, 그 디스크의 제조방법, 재생방법 및 세정방법 |
| US6439986B1 (en) | 1999-10-12 | 2002-08-27 | Hunatech Co., Ltd. | Conditioner for polishing pad and method for manufacturing the same |
| KR100387954B1 (ko) * | 1999-10-12 | 2003-06-19 | (주) 휴네텍 | 연마패드용 컨디셔너와 이의 제조방법 |
| US7201645B2 (en) * | 1999-11-22 | 2007-04-10 | Chien-Min Sung | Contoured CMP pad dresser and associated methods |
| US6419553B2 (en) * | 2000-01-04 | 2002-07-16 | Rodel Holdings, Inc. | Methods for break-in and conditioning a fixed abrasive polishing pad |
| US6821189B1 (en) * | 2000-10-13 | 2004-11-23 | 3M Innovative Properties Company | Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate |
| US6632127B1 (en) | 2001-03-07 | 2003-10-14 | Jerry W. Zimmer | Fixed abrasive planarization pad conditioner incorporating chemical vapor deposited polycrystalline diamond and method for making same |
| US20020182401A1 (en) | 2001-06-01 | 2002-12-05 | Lawing Andrew Scott | Pad conditioner with uniform particle height |
| JP2003053665A (ja) * | 2001-08-10 | 2003-02-26 | Mitsubishi Materials Corp | ドレッサー |
| JP3744877B2 (ja) * | 2002-04-15 | 2006-02-15 | 株式会社ノリタケスーパーアブレーシブ | Ｃｍｐ加工用ドレッサ |
| US6872127B2 (en) * | 2002-07-11 | 2005-03-29 | Taiwan Semiconductor Manufacturing Co., Ltd | Polishing pad conditioning disks for chemical mechanical polisher |
| KR20050075280A (ko) | 2002-11-19 | 2005-07-20 | 가부시키가이샤 이시카와 세이사쿠쇼 | 화소제어 소자의 선택 전사 방법, 화소제어 소자의 선택전사 방법에 사용되는 화소제어 소자의 실장 장치,화소제어 소자 전사후의 배선 형성 방법, 및, 평면디스플레이 기판 |
| JP4277553B2 (ja) * | 2003-01-15 | 2009-06-10 | 三菱マテリアル株式会社 | 軟質材加工用工具 |
| US20050025973A1 (en) | 2003-07-25 | 2005-02-03 | Slutz David E. | CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same |
| US7799375B2 (en) | 2004-06-30 | 2010-09-21 | Poco Graphite, Inc. | Process for the manufacturing of dense silicon carbide |
| KR100636793B1 (ko) | 2004-12-13 | 2006-10-23 | 이화다이아몬드공업 주식회사 | Ｃｍｐ 패드용 컨디셔너 |
| US8678878B2 (en) * | 2009-09-29 | 2014-03-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
| US9138862B2 (en) * | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
| KR100723436B1 (ko) * | 2005-12-29 | 2007-05-30 | 삼성전자주식회사 | 연마패드의 컨디셔너 및 이를 구비하는 화학기계적연마장치 |
| US20080153398A1 (en) | 2006-11-16 | 2008-06-26 | Chien-Min Sung | Cmp pad conditioners and associated methods |
| US8393938B2 (en) * | 2007-11-13 | 2013-03-12 | Chien-Min Sung | CMP pad dressers |
| EP2411181A1 (en) * | 2009-03-24 | 2012-02-01 | Saint-Gobain Abrasives, Inc. | Abrasive tool for use as a chemical mechanical planarization pad conditioner |
| MY155563A (en) * | 2009-06-02 | 2015-10-30 | Saint Gobain Abrasives Inc | Corrosion-resistant cmp conditioning tools and methods for making and using same |
| KR101091030B1 (ko) | 2010-04-08 | 2011-12-09 | 이화다이아몬드공업 주식회사 | 감소된 마찰력을 갖는 패드 컨디셔너 제조방법 |
| JP5871904B2 (ja) | 2010-04-12 | 2016-03-01 | イコニクス コーポレーションＩｋｏｎｉｃｓ Ｃｏｒｐｏｒａｔｉｏｎ | アブレシブエッチングおよびカッティングのためのフォトレジスト膜および方法 |
| TW201246342A (en) * | 2010-12-13 | 2012-11-16 | Saint Gobain Abrasives Inc | Chemical mechanical planarization (CMP) pad conditioner and method of making |
| US20120171935A1 (en) * | 2010-12-20 | 2012-07-05 | Diamond Innovations, Inc. | CMP PAD Conditioning Tool |
| SG193340A1 (en) * | 2011-03-07 | 2013-10-30 | Entegris Inc | Chemical mechanical planarization pad conditioner |
| WO2012162430A2 (en) * | 2011-05-23 | 2012-11-29 | Chien-Min Sung | Cmp pad dresser having leveled tips and associated methods |
| TWI655057B (zh) | 2012-05-04 | 2019-04-01 | 美商恩特葛瑞斯股份有限公司 | 化學機械拋光墊修整器 |
-
2012
- 2012-03-06 SG SG2013067152A patent/SG193340A1/en unknown
- 2012-03-06 EP EP12754519.2A patent/EP2684211B1/en active Active
- 2012-03-06 CN CN201280022237.9A patent/CN103688343B/zh active Active
- 2012-03-06 US US14/004,152 patent/US9132526B2/en active Active
- 2012-03-06 WO PCT/US2012/027916 patent/WO2012122186A2/en not_active Ceased
- 2012-03-06 KR KR1020137025682A patent/KR101916492B1/ko active Active
- 2012-03-06 JP JP2013557810A patent/JP6133218B2/ja active Active
- 2012-03-07 TW TW101107639A patent/TWI592258B/zh active
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2015
- 2015-08-20 US US14/831,280 patent/US9616547B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| SG193340A1 (en) | 2013-10-30 |
| KR101916492B1 (ko) | 2018-11-07 |
| JP2014510645A (ja) | 2014-05-01 |
| EP2684211A2 (en) | 2014-01-15 |
| US9616547B2 (en) | 2017-04-11 |
| EP2684211A4 (en) | 2014-08-20 |
| EP2684211B1 (en) | 2017-01-18 |
| WO2012122186A2 (en) | 2012-09-13 |
| US20140113532A1 (en) | 2014-04-24 |
| KR20140036160A (ko) | 2014-03-25 |
| US20160074993A1 (en) | 2016-03-17 |
| US9132526B2 (en) | 2015-09-15 |
| TW201249595A (en) | 2012-12-16 |
| CN103688343B (zh) | 2016-09-07 |
| CN103688343A (zh) | 2014-03-26 |
| WO2012122186A3 (en) | 2012-11-08 |
| WO2012122186A4 (en) | 2013-01-10 |
| TWI592258B (zh) | 2017-07-21 |
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