JP6128327B2 - Terminal cutting device and terminal cutting method - Google Patents

Description

  The present invention relates to a terminal cutting device for cutting a plurality of lead terminals of an electronic component.

  Electronic components such as semiconductor devices and circuit elements have a plurality of lead terminals such as input and output, and the plurality of lead terminals extend from the component main body so as to be arranged outside. The lead terminal is cut by a terminal cutting device at a final stage of the manufacturing process so as to have a certain length according to specifications and standards. Thereafter, the electronic component is housed in, for example, a carrier tape and shipped.

  Patent Document 1 discloses a lead cutting device that provides a lead cutting device having a structure in which an end face is not rubbed with a cut punch when a lead terminal of a semiconductor device is sheared. In the cited document 1, peeling of the exterior plating extended from the lower surface of the lead terminal to the end face of shearing can be prevented, and the lead terminal can be sheared so that the solder can be satisfactorily connected to the circuit board. .

  Patent Document 2 discloses a lead cut device that stably forms a shear surface of a lead cutting portion of a semiconductor device and increases a formation ratio of a plating film on the shear surface. In Cited Document 2, the cutting clearance at the time of lead cutting, the lead supporting method, the state of the punch side surface, etc. are set as processing conditions, and without changing the lead tip part shape, the formation of a stable shear surface, the shear surface formation ratio By improving and forming a stable plating film on the sheared surface, it is possible to improve and stabilize the solder fillet forming state of the lead tip at the semiconductor device manufacturing stage.

JP 2008-16571 A Patent No. 4912016

  At present, it is desired to reduce the size of electronic components, and there is a demand for shorter lead terminals for electronic components. Therefore, in the terminal cutting device, a lead die extending in the horizontal direction from the electronic component is cut to be shorter by using a cut die having a thinner plate thickness. However, since the cut die is thinned, when the lead terminal is cut, the cut die is deformed or distorted by shear stress, and it is difficult to stably cut the lead terminal.

  Fig.11 (a) is the schematic which shows the front of the conventional terminal cutting device, FIG.11 (b) is the schematic side view. The electronic component 500 is placed on a support base 512 inside the cut die 510, and a plurality of lead terminals 502 extending from the component main body are held so that the bottom surfaces thereof are in contact with the upper portion of the cut die 510. A cutting blade 522 is formed on the upper cut punch 520 so as to be parallel to the cut die 510. Then, when the cut punch 520 moves downward, the cutting blade 522 can contact and cut the plurality of lead terminals 502.

  At this time, in the plate-shaped cut die 510, due to the shear stress (stress) applied at the time of cutting, the shape is deformed or distorted, the tip moves in the H direction, and the optimum clearance between the cut punch 520 changes. End up. As a result, the cut lead terminals 502 are disturbed in their respective cut sections, and cut burrs, coplanarity (flatness), etc. may be out of regulation, and the lead terminals 502 can be stably cut. could not.

  The present invention solves the conventional problems as described above, and disperses the shear stress applied to the cut die by making the cutting blade of the cut punch for cutting the lead terminals non-parallel to the arrangement direction of the lead terminals. An object is to provide a possible terminal cutting device.

  A terminal cutting device according to the present invention is capable of cutting a lead terminal of an electronic component comprising a main body portion and a plurality of lead terminals extending to the outside from at least one side surface of the main body portion. A support base on which the portion is placed, a cut die that is positioned outside the support base and supports the bottom surfaces of the plurality of lead terminals extending from the main body, and a pressing member that can press the top surface of the lead terminal; A plurality of cut punches that can be moved up and down at a position outside the cut die and cut a plurality of lead terminals from the upper surface of the plurality of lead terminals when moved downward; A cutting blade that is non-parallel to the arrangement direction of the lead terminals is formed.

  Preferably, the cutting blade is inclined linearly with respect to the surface in the arrangement direction of the plurality of lead terminals. Preferably, the cutting blade is inclined symmetrically so that the inclination angle changes from the center position in the longitudinal direction. Preferably, the plurality of lead terminals have a flat top surface and a flat bottom surface, and the top surfaces of the plurality of lead terminals are flat with the bottom surfaces of the plurality of lead terminals supported by the flat surface of the upper end portion of the cut die. Pressed by a pressing member having a surface, the cut die is composed of a plate-shaped metal member, the cut die is positioned on a side surface of the support base, and the plate thickness of the cut die is a cutting position of the plurality of lead terminals To decide. Preferably, the cut punch moves along the outer side surface of the cut die, and the plate thickness of the cut die is smaller than the thickness of the cut punch. Preferably, the cut die has a plate thickness of 0.24 mm or less, and an inclination angle of the cutting blade is in a range of 0.5 to 30 degrees. Preferably, the cutting blade has an inclination in the longitudinal direction in contact with the plurality of lead terminals, sequentially contacts the plurality of arranged lead terminals from one side, and cuts the lead terminal with which the cutting blade first contacts. The angle of inclination of the cutting blade is selected so that the cutting blade contacts the last lead terminal during this time.

  A terminal cutting method according to the present invention cuts a lead terminal of an electronic component comprising a main body portion and a plurality of lead terminals extending to the outside from at least one side surface of the main body portion, and the main body portion And a step of supporting the bottom surfaces of the plurality of lead terminals extending from the main body portion from the cut die, a step of pressing the top surfaces of the plurality of lead terminals, and a position facing the cut die. A step of moving the cut punch toward the cut die, and a cutting blade having an oblique angle that is not parallel to the arrangement direction of the plurality of lead terminals is formed on the cut punch, and the plurality of leads are formed by the cutting blade. Cutting the lead terminals sequentially from one end of the terminal to the other end.

  Preferably, the plurality of lead terminals have a flat top surface and a flat bottom surface, and the top surfaces of the plurality of lead terminals are flat with the bottom surfaces of the plurality of lead terminals supported by the flat surface of the upper end portion of the cut die. Pressed by a pressing member having a surface, the plate thickness of the cut die is selected so as to determine the cutting positions of a plurality of lead terminals extending from the main body.

  According to the present invention, since the cutting blade of the cut punch is inclined, the stress (stress) applied to the cut die is dispersed when the plurality of lead terminals are cut. Thereby, even if it is a thin cut die, the cutting position of a some lead terminal can be determined correctly, and it can cut stably, without generating distortion in the shape.

It is a schematic front view which shows the front of the terminal cutting device which concerns on the Example of this invention. It is a figure which shows the side surface sectional drawing showing the A-A 'cross section of the terminal cutting device in FIG. It is a schematic perspective view of the electronic component which concerns on the Example of this invention. It is a figure which compares a present Example and the conventional cut punch. It is a schematic sectional drawing explaining operation | movement of the terminal cutting device which concerns on the Example of this invention. FIG. 6A is a schematic front view showing a cutting process of a plurality of lead terminals, FIG. 6A shows an overall image, and FIG. 6B is an enlarged view of a region R in FIG. . It is a figure which shows the cut surface of a lead terminal. It is a photograph of the cut surface of a lead terminal, and is a photograph taken along the cut punch 150 (oblique angle θ) according to the present embodiment. It is the photograph figure cut | disconnected by the cut punch 520 (without a bevel) which concerns on a prior art example. It is a figure which shows the evaluation result which evaluates the cutting | disconnection result of a lead terminal, Fig.8 (a) shows the evaluation value of cut burr | flash, and FIG.8 (b) has shown the evaluation value of coplanarity. It is a graph showing the evaluation result shown to FIG. 9A. It is a figure which shows the shape of the cut punch which concerns on another Example. It is the schematic which shows the front and side surface of the conventional terminal cutting device.

  Next, a preferred embodiment of the present invention will be described with reference to the drawings. In the drawings, it should be noted that each part is emphasized for easy understanding, and is different from an actual scale.

  FIG. 1 is a schematic front view of a terminal cutting device according to an embodiment of the present invention, and FIG. 2 is a side cross-sectional view showing a cross section AA ′ of the terminal cutting device in FIG. Show. The terminal cutting device 100 includes a support base 120 on which the main body portion 112 of the electronic component 110 is placed, and a cut die 130 that is located outside the support base 120 and contacts the bottom sides of the plurality of lead terminals 114 extending from the main body portion 112. And a pressing member 140 that abuts and presses against the upper surface of the main body 112, and is arranged to be movable up and down at a position outside the cut die 130, and when moved downward, the plurality of lead terminals 114 are cut from the upper surface side. And a cut punch 150 to be configured. A cutting blade 152 is formed on the cut punch 150 so as to be non-parallel to the arrangement direction of the plurality of lead terminals 114 and to be inclined in the longitudinal direction.

  FIG. 3 is a perspective view illustrating an example of an electronic component having a lead terminal. The electronic component 100 includes a rectangular main body 112 and a plurality of lead terminals 114 arranged so as to extend outward from the upper surface of the main body 112. The electronic component 110 is not limited to an IC chip in which an IC chip is sealed and packaged, such as a semiconductor device, and may be a ceramic package. Furthermore, the electronic component may be one in which the lead terminal extends only from one side of the main body 112 or from four directions (all side surfaces) of the main body 112. Further, the electronic component may be a socket for a semiconductor device to which a semiconductor device can be attached and detached, a connector for connecting wiring such as a harness, and the like.

  As shown in FIG. 3, the plurality of lead terminals 114 are processed into a substantially rectangular shape having a substantially flat top surface, a substantially flat bottom surface, and a substantially flat side surface. The lead terminal 114 illustrated here extends from the upper surface portion of the main body portion 112 toward the side surface outside. When these lead terminals 114 are cut by the cut punch 150, the cutting blade 152 is brought into contact with the vertical line L slightly outside the lateral width W of the main body 112. In the present embodiment, the lead terminal 114 extends outward from the upper surface portion of the main body portion 112, but the present invention is not limited to this. For example, a plurality of lead terminals extend outward from the opposite side surfaces of the main body portion 112. It may also extend from the bottom surface. Further, the lead terminal 114 is not limited to a linear one, but may be a so-called gull wing type lead terminal bent so as to be at a position similar to the bottom surface of the main body 112 or the like. Furthermore, the lead terminal 114 may have a surface plated with nickel or the like.

  As shown in FIG. 2, the height of the support stand 120 is determined in advance according to the type of the electronic component 100, and the support stand 120 is formed in the enclosed space formed with the cut dies 130 arranged on both sides. The main body 112 of the electronic component 110 can be placed. The main body 112 has a vertical height determined by the support 120, and the movement in the side direction such as the front-rear direction or the left-right direction is restricted by the cut die 130. Thus, when the lead terminal 114 is cut, the electronic component 110 is held by the support base 120 on the bottom surface and the cut dies 130 on both side surfaces so as not to be misaligned.

  The cut die 130 is composed of a plate-like metal member, and its position is fixed so that the upper end of the cut die 130 comes into contact with the bottom surfaces of the plurality of lead terminals 114 extending outward from the main body 112, and the main body 112. The movement in the side direction is regulated. Preferably, the upper end portion of the cut die 130 provides a flat surface, and the lead terminal 114 abuts on the flat surface. Further, the cut die 130 can define the length of the lead terminal 114 to be cut based on the plate thickness. That is, the inner surface of the cut die 130 substantially coincides with the side surface of the main body 112, and the outer surface substantially coincides with the cut surface of the lead terminal 114. By reducing the plate thickness of the cut die 130, the lead terminal 114 can be cut short. In this example, for example, the plate thickness was 0.24 mm, and it was confirmed that the lead terminals could be cut well. Furthermore, in a preferable aspect, even when a thin cut die having a plate thickness of 0.18 mm was used, good cutting of the lead terminal could be confirmed.

  The pressing member 140 is located at a position facing the support base 120 and can press the lead terminal 114 of the electronic component 110 in the vertical direction from above in the step before cutting the lead terminal 114. In a preferred embodiment, the pressing member 140 has a flat pressing surface 140A substantially parallel to the flat upper surface of the lead terminal 114, and the outer surface 140B adjacent to the pressing surface 140A is flush with the outer surface 130B of the cut die 130. The inner surface 140C adjacent to the pressing surface 140A is located somewhat closer to the main body than the inner surface 130C of the cut die 130. That is, the width of the pressing surface 140 </ b> A presses the lead terminal with a surface that is somewhat larger than the plate thickness (width) of the support surface 130 </ b> A of the cut die 130.

  The pressing member 140 can be lowered together with the cut die 150, and the pressing member 140 leads with a certain pressurizing force so that the lead terminal 114 is not damaged by a pressurizing mechanism (not shown in the drawing) by an elastic member or the like on the upper part. The terminal 114 is pressed. The pressing member 140 abuts on the upper surface of the lead terminal 114 facing the cut die 130 and does not press the upper surface of the main body 112, but the pressing member 140 applies a certain pressure to the upper surface of the main body 112. You may press with.

  The cut punch 150 is arranged to be movable up and down at a position outside the cut die 130 and is lowered together with the pressing member 140 by a driving mechanism (not shown). After the pressing member 140 contacts the lead terminal 114, only the cut punch 150 is lowered, and the plurality of lead terminals 114 can be cut from the upper surface side. The cut punch 150 is designed and attached so that an optimum clearance exists between the cut punch 150 and the outer surface of the cut die 130 when moved downward. As shown in FIG. 2, a cutting blade 152 having an acute angle is formed at the lower end in contact with the lead terminal 114, and the cutting blade 152 is formed at the upper end of the cut die 130 in the longitudinal direction as shown in FIG. 1. A small oblique angle θ is formed so as to be non-parallel to the plane of the part (or the upper surface of the support stand 120). In a preferred embodiment, the cut punch 150 has a thickness of about 3 mm, for example, and is sufficiently thick as compared with the thin cut die 130.

  FIG. 4 is a diagram showing a comparison between this embodiment and a conventional cut punch shape. FIG. 4A shows a cut punch 150 according to this embodiment, and FIG. 4B shows a conventional cut punch 520. In the conventional cut punch 520, the cutting blade 522 is formed horizontally so as to be parallel to the surface in the arrangement direction of the lead terminals and the surface of the upper end portion of the cut die. In 150, the cutting blade 152 is not parallel to the surface in the arrangement direction of the lead terminals and the surface of the upper end portion of the cut die, and an oblique angle θ is formed between the surfaces. In a preferred embodiment, the oblique angle θ is in the range of 0.5-30 °. More preferably, the inclination angle θ of the cutting blade is selected so that the cutting blade 152 contacts the last lead terminal while the cutting blade 152 is cutting the lead terminal that first contacts. Thereby, all the shear stress to a lead terminal is disperse | distributed uniformly.

  In the conventional cut punch 520, since the cutting blade 522 contacts all the lead terminals 114 almost simultaneously at the time of cutting, the shear stress is applied to the cut die 130 at a stretch, causing distortion and deformation of the cut die 130. On the other hand, in the cut punch 150 according to the present embodiment, since the cutting blade 152 has the oblique angle θ, at the time of cutting, the cutting blade 152 sequentially contacts from the lead terminal 114 on the right end side, and shear stress applied to the cut die 130 is temporally affected. Can be dispersed. Thereby, the cut die 130 is not distorted at the time of cutting, and a good clearance with the cut punch 150 is maintained, and the state in which the plane of the upper end portion of the cut die 130 is positioned on the lead terminal 130 is maintained.

  Next, the lead terminal cutting operation of the terminal cutting apparatus of this embodiment will be described with reference to FIG. 5A to 5D are diagrams showing the lead terminal cutting process in time series. FIG. 5A is a diagram illustrating a state in which the electronic component 110 is placed on the support base 120. At this time, the pressing member 140 and the cut punch 150 that can move up and down are at positions sufficiently separated from the support stand 120 and the like, and the electronic component 110 is placed on the support stand 120 from the space. Thereby, the bottom surface of the lead terminal 114 is held in contact with the flat surface of the upper end portion of the cut die 130.

  Next, as shown in FIG. 5B, the pressing member 140 and the cut punch 150 are simultaneously lowered in the vertical direction toward the electronic component 110 by a mechanism (not shown). The pressing member 140 moves downward until it abuts on the lead terminal 114, and then the lead terminal 114 is lowered downward with an appropriate pressure by a pressurizing mechanism (not shown) using an elastic member such as a spring or rubber. Press. Thereby, the electronic component 110 is firmly fixed by the support stand 120, the cut die 130, and the pressing member 140 so as not to be misaligned when the lead terminal 114 is cut.

  Next, the cutting process will be described with reference to FIG. In a state where the lead terminal 114 is fixed by the pressing member 140, the cut punch 150 further moves downward in the vertical direction to cut the lead terminal 114. Then, the cutting blade 152 comes into contact with the upper surface of the lead terminal 114, and the lead terminal 114 is sandwiched between the cut punch 150 and the cut die 130. When the cut punch 150 is further moved downward, the lead terminal 114 is completely cut as shown in FIG.

  FIG. 6 is a schematic front view showing a cutting process of a plurality of lead terminals, FIG. 6 (a) shows an overall view, and FIG. 6 (b) is an enlarged view of a region R in FIG. 6 (a). FIG. Since the cutting blade 152 is formed in the cut punch 150 so as to have an oblique angle θ with respect to the arrangement of the plurality of lead terminals 114, when the lead terminal 114 is cut, the cutting blade 152 is shown in FIG. As shown, cutting is performed sequentially from the lead terminal 114 at the right end. For this reason, since the shear stress applied at the time of cutting the lead terminal 114 is dispersed on the time axis, the instantaneous shear stress applied to the cut die 130 is reduced. As a result, even when a thin one is used, the cut die 130 is not distorted at the time of cutting, and the positional relationship between the cut punch 150 and the cut die 130 is maintained at an appropriate distance set in advance. . Since the upper end portion of the cut die 130 is not shaken, the terminal cutting device 100 can accurately and stably cut the plurality of lead terminals 114.

  FIG. 7 is a diagram illustrating a cut surface of the lead terminal. In the cross section of the lead terminal 114, a sag surface 180, a cut surface 182, a fracture surface 184, and a cut burr 186 are formed from the upper surface direction to the cutting direction. When the clearance between the cut punch 150 and the cut die 130 is appropriate, ideally, the cut surface 182 and the fracture surface 184 are formed at a ratio of “6: 4” to “7: 3”.

  FIG. 8 is a photograph of the cut surface of the lead terminal, FIG. 8A is a photograph taken by the cut punch 150 (oblique angle θ) according to the present embodiment, and FIG. 8B is a conventional cut punch 520 (oblique). The photograph cut | disconnected by (without a corner) is shown. When the cut punch 150 (oblique angle θ) of the present embodiment is used, the cut die 130 is not deformed and the clearance is appropriately maintained, so that the cut surface and the fracture surface are formed at a good rate. On the other hand, when the conventional cut punch 520 (with no bevel) was used, it was predicted that the clearance was narrower than the appropriate value due to the deformation of the cut die 130, and only the cut surface was formed, and no fracture surface was formed. Thus, when a fracture surface is not formed, the cut burr becomes large.

  9A is a diagram showing an evaluation result for evaluating the cutting result of the lead terminal when the cut die has a thickness of 0.24 mm. FIG. 9A (a) shows an evaluation value of the cut burr, and FIG. 9A (b) Indicates the evaluation value of coplanarity. FIG. 9B is a graph showing the evaluation results shown in FIG. 9A. As for the cut burr, when the cut punch 150 (oblique angle θ) is used, all the samples sufficiently satisfy the target value, and are limited to “0.018 mm” of “Sample 4” at the maximum. Further, it can be seen that the cut burrs are reduced in all the samples as compared with the case of using the cut punch 520 (without the bevel).

  In addition, regarding the coplanarity (flatness) related to the arrangement of the plurality of lead terminals 114, it can be seen that the coplanarity is within “0.060 mm” in all the samples when the cut punch 150 (oblique angle θ) is used. Further, as compared with the case where the cut punch 520 (without the bevel) is used, the cut punch 150 (the bevel angle θ) can suppress variations in the lead terminals 114, and the cutting accuracy is stable and improved. I understand.

  As described above, the terminal cutting device 100 according to the embodiment can disperse the shear stress applied to the cut die 130 by using the cut punch 150 (slant angle θ), and the shape of the cut surface of the lead terminal 114 and the cut variability. Various cutting accuracy such as coplanarity can be improved.

  In the above embodiment, the cut punch having a cutting blade that is inclined in a straight line is used. For example, the cutting blade 154 that is inclined so that the center portion protrudes downward as shown in FIG. The cutting blade 156 may be inclined so that the central portion is recessed upward as shown in FIG. Preferably, the cutting blades 154 and 156 are formed symmetrically so that the angle of inclination at the center in the longitudinal direction is changed, so that the left and right balance of the shear stress to the lead terminals is made uniform, and the cut punch 150 Stabilizes the cutting force. Alternatively, the cutting blade is not limited to a linear shape, and may be a saw blade. In addition, the cutting blade may be a non-linear one having a curved surface shape as long as it is not parallel to the arrangement of the cut dies and the lead terminals.

  In the above embodiment, in order to fix the electronic component to be placed, the positions of the support base and the cut die are set in advance, but in order to be compatible with various electronic components, An adjustment mechanism capable of relatively adjusting the position may be provided to adjust the height difference between the support base and the cut die, the gap between the support base and the cut die, and the like.

  In the above embodiment, the cut punch moves in the vertical direction in order to cut a plurality of lead terminals, but the moving method may be manual or automatic. When the movement of the cut punch is automatic, the cutting speed may be appropriately adjusted according to the oblique angle θ of the cut punch, the thickness of the cut die, the material of the lead terminal, and the like.

  The preferred embodiment of the present invention has been described in detail above, but the present invention is not limited to the specific embodiment, and various modifications can be made within the scope of the present invention described in the claims. Deformation / change is possible.

DESCRIPTION OF SYMBOLS 100: Terminal cutting device 110: Electronic component 112: Main part 114: Lead terminal 120: Support stand 130: Cut die 140: Pressing member 150: Cut punch 152: Cutting blade 154: Cutting blade 156: Cutting blade 180: Sag 182: Cutting Surface 184: Fracture surface 186: Burr 500: Electronic equipment 502: Lead terminal 510: Cut die 512: Support base 520: Cut punch 522: Cutting blade

Claims (5)

A terminal cutting device capable of cutting a lead terminal of an electronic component comprising a main body part and a plurality of lead terminals extending to the outside from at least one side surface of the main body part,
A support base on which the main body is placed;
A plate-shaped metal cut die located on both sides of the support base and positioned so that upper ends thereof are in contact with the bottom surfaces of a plurality of lead terminals extending from the main body, the cut dies on both sides of the support base A cut die on which the main body is placed in a space formed with;
A pressing member including a pressing surface capable of pressing the upper surface of the lead terminal at a position facing the cut die, an outer surface adjacent to the pressing surface, and an inner surface adjacent to the pressing surface, The surface coincides with the outer surface of the cut die, and the inner surface is located closer to the main body than the inner surface of the cut die, and the pressing member,
It can be moved up and down at a position outside the cut die, and has a cut punch for cutting a plurality of lead terminals from the upper surface of the plurality of lead terminals when moved downward.
The cut punch is formed with a cutting blade that is not parallel to the arrangement direction of the plurality of lead terminals, and the cutting blade is inclined linearly with respect to the surface in the arrangement direction of the plurality of lead terminals. The cutting blade has an inclination in the longitudinal direction in contact with the plurality of lead terminals, sequentially contacts the plurality of arranged lead terminals from one side, and cuts the lead terminal with which the cutting blade first contacts. A terminal cutting device in which an inclination angle of the cutting blade is selected so that the cutting blade comes into contact with the last lead terminal. The plurality of lead terminals have a flat top surface and a flat bottom surface, and the top surfaces of the plurality of lead terminals are flat with the bottom surfaces of the plurality of lead terminals supported by the flat surface of the upper end portion of the cut die. The cut die is composed of a plate-shaped metal member, the cut die is positioned on the side surface of the support base, and the plate thickness of the cut die determines the cutting position of the plurality of lead terminals. The terminal cutting device according to claim 1. The terminal cutting device according to claim 1 or 2, wherein the cut die has a plate thickness of 0.24 mm or less, and an inclination angle of the cutting blade is in a range of 0.5 to 30 degrees. A terminal cutting method for cutting a lead terminal of an electronic component comprising a main body part and a plurality of lead terminals extending to the outside from at least one side surface of the main body part,
In a space formed by a support base and a plate-shaped metal cut die positioned on both sides of the support base and positioned so that the upper end portions are in contact with the bottom surfaces of a plurality of lead terminals extending from the main body portion In which the main body is placed on the support base;
A pressing member including a pressing surface capable of pressing the upper surface of the lead terminal at a position facing the cut die, an outer surface adjacent to the pressing surface, and an inner surface adjacent to the pressing surface, Pressing the upper surfaces of the plurality of lead terminals by the pressing member, the surface is coincident with the outer surface of the cut die, and the inner surface is located closer to the main body part side than the inner surface of the cut die;
Moving the cut punch at a position facing the cut die toward the cut die;
The cutting punch is formed with a cutting blade having an oblique angle that is not parallel to the arrangement direction of the plurality of lead terminals, and is directed from one end of the plurality of lead terminals to the other end by the cutting blade. Sequentially cutting the lead terminals,
In the cutting step, the cutting blade is inclined linearly with respect to the surface in the arrangement direction of the plurality of lead terminals, and the cutting blade has an inclination in a longitudinal direction in contact with the plurality of lead terminals. The plurality of arranged lead terminals are sequentially contacted from one side, and the cutting blade is inclined so that the cutting blade comes into contact with the last lead terminal while cutting the lead terminal with which the cutting blade first contacts. angle is selected, pin cutting method. The terminal cutting method according to claim 4, wherein the plate thickness of the cutting die is selected so as to determine cutting positions of a plurality of lead terminals extending from the main body.