JP2012020317A - Lead processing apparatus, method of processing lead, and lead processing die set - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the accuracy of processing the lead of a semiconductor device.SOLUTION: A lead processing apparatus 100 includes a first die unit (lower die unit 10) and a second die unit (upper die unit 20) which is movable relative to the first die unit. The apparatus further includes a load transmitting portion 30 for transmitting load to the second die unit and a stopper mechanism 40 for stopping the movement of the second die unit in a direction in which the second die unit approaches the first die unit. The stopper mechanism 40 includes a plurality of stroke stopper pairs 43 each having a first stroke stopper 41 which is fixed to the first die unit and the second stroke stopper 42 which is fixed to the second die unit and comes in contact with the stopper 41 to stop the movement of the second die unit. The load transmitting portion 30 distributes a load to the plurality of load transmitting portions and transmits press load to the second die unit. Each load transmitting portion is arranged coaxially with the stroke stopper pair 43.

Description

  The present invention relates to a lead processing apparatus, a lead processing method, and a lead processing mold.

  A press device having an upper die and a lower die is used for processing a lead (bending, cutting, etc.) of a semiconductor device.

  Such a press apparatus is described in Patent Document 1, for example.

  The press device of Patent Document 1 is fixed to a bending die (lower mold) on which a semiconductor device is placed, a cam having a tapered side surface, a cam spring for lowering the cam, and a lower surface of the cam. It has a pad stopper, a stopper block disposed around the bending die, and a bending punch (upper die) having a roller at the upper end.

  The cam is provided with a clamp pin that presses and clamps the semiconductor device from above. The cam is lowered by the cam spring to a position where the movement of the pad stopper is restricted by the stopper block, and stops at this position. At this stage, the semiconductor device is pressed against the bending die by the clamp pin.

  Further, when the bending punch is lowered to a predetermined height in this state, the roller moves along the taper surface of the cam. With this movement, the lower end of the bending punch rotates inward to the predetermined position. Press on. Thereby, the lead is pressed.

  The pad stopper has a protruding portion protruding downward at the peripheral edge of the pad stopper. On the other hand, the stopper block is disposed at a position facing the protruding portion of the pad stopper. And the downward movement of a pad stopper is controlled because the protrusion part of a pad stopper abuts against a stopper block.

  Here, the cam is positioned on the upper surface of the inner portion of the pad stopper (hereinafter referred to as the central portion) in the pad stopper. For this reason, the pressing force by the cam spring is applied to the upper surface of the central portion of the pad stopper.

JP 07-32273 A

  In the technique of Patent Document 1, a pressing force by a cam spring is applied to the upper surface of the central portion of the pad stopper. For this reason, the pad stopper is deformed (bent) so that the central portion thereof is convex downward. Accordingly, the height at which the cam stops is shifted downward from the desired height by the amount of the deformation, so that the stop position of the lower end of the bending punch is also shifted from the desired position. As a result, the processing dimension of the lead by press processing also deviates from a desired dimension.

  In short, in the technique of Patent Document 1, the processing accuracy of the lead is lowered due to the deflection of the pad stopper due to the pressing of the cam spring.

  Thus, it has been difficult to increase the processing accuracy of the leads of the semiconductor device.

The present invention provides a first mold unit including an arrangement part in which a semiconductor device having a main body part and a lead protruding from the main body part is arranged;
A second mold unit provided so as to be movable in a direction approaching the first mold unit and in a direction moving away from the first mold unit, and presses the lead in cooperation with the first mold unit. When,
A load transmitting portion for transmitting a press load to the second mold unit;
A stopper mechanism for stopping the movement of the second mold unit in a direction approaching the first mold unit;
Have
The stopper mechanism is
A first stroke stopper fixed to the first mold unit;
A second stroke stopper fixed to the second mold unit in an arrangement facing the first stroke stopper and stopping the movement of the second mold unit by striking the first stroke stopper;
There are multiple pairs of stroke stoppers including
The load transmitting portion distributes a load to a plurality of load transmitting portions spaced apart from each other and transmits a press load to the second mold unit, and each of the load transmitting portions is coaxial with the stroke stopper pair. A lead processing apparatus is provided.

  According to this lead processing apparatus, the press load is transmitted to the second mold unit via the load transmitting unit. The load transmitting portion is configured to distribute the load to a plurality of load transmitting locations spaced apart from each other and transmit the press load to the second mold unit, and each of the load transmitting locations is a stroke stopper, respectively. Arranged coaxially with the pair. With these configurations, deformation of the second mold unit due to the press load can be suppressed. Therefore, since the relative position of the second mold unit with respect to the first mold unit can be prevented from shifting from a desired position during the press working, it is possible to improve the processing accuracy of the lead of the semiconductor device.

In addition, the present invention provides a first mold unit including an arrangement portion in which a semiconductor device having a main body portion and a lead protruding from the main body portion is arranged,
A second mold unit provided so as to be movable in a direction approaching the first mold unit and in a direction moving away from the first mold unit, and presses the lead in cooperation with the first mold unit. When,
A load transmitting portion for transmitting a press load to the second mold unit;
A stopper mechanism for stopping the movement of the second mold unit in a direction approaching the first mold unit;
Have
The stopper mechanism is
A first stroke stopper fixed to the first mold unit;
A second stroke stopper fixed to the second mold unit in an arrangement facing the first stroke stopper and stopping the movement of the second mold unit by striking the first stroke stopper;
There are multiple pairs of stroke stoppers including
The load transmitting portion distributes a load to a plurality of load transmitting portions spaced apart from each other and transmits a press load to the second mold unit, and each of the load transmitting portions is coaxial with the stroke stopper pair. A step of processing the leads of the semiconductor device using a lead processing device disposed in
In the step of processing the lead, a lead processing method is provided, in which a load is distributed from the load transmitting portion to the plurality of load transmitting portions and a press load is transmitted to the second mold unit. .

In addition, the present invention provides a first mold unit including an arrangement portion in which a semiconductor device having a main body portion and a lead protruding from the main body portion is arranged,
A second mold unit provided so as to be movable in a direction approaching the first mold unit and in a direction moving away from the first mold unit, and presses the lead in cooperation with the first mold unit. When,
A load transmitting portion for transmitting a press load to the second mold unit;
A stopper mechanism for stopping the movement of the second mold unit in a direction approaching the first mold unit;
Have
The stopper mechanism is
A first stroke stopper fixed to the first mold unit;
A second stroke stopper fixed to the second mold unit in an arrangement facing the first stroke stopper and stopping the movement of the second mold unit by striking the first stroke stopper;
There are multiple pairs of stroke stoppers including
The load transmitting portion distributes a load to a plurality of load transmitting portions spaced apart from each other and transmits a press load to the second mold unit, and each of the load transmitting portions is coaxial with the stroke stopper pair. Provided is a lead processing die characterized by being arranged in the above.

  According to the present invention, the processing accuracy of leads of a semiconductor device can be increased.

It is a figure which shows the lead processing apparatus which concerns on embodiment. It is a figure which shows the lead processing apparatus which concerns on embodiment. It is a figure which shows the lead processing apparatus which concerns on embodiment. It is a figure which shows the lead processing apparatus which concerns on embodiment. It is a top view of an upper mold holder. It is a top view of a load transmission part. It is front sectional drawing which shows a bending die. It is a figure for demonstrating operation | movement of a bending punch and a control member. It is a bottom view of a regulating member, a punch holder, and a bending punch. It is a figure which shows the example of a semiconductor device. It is a figure which shows an example of the procedure of the lead processing method using the lead processing apparatus which concerns on embodiment. It is a figure which shows another example of the procedure of the lead processing method which concerns on embodiment. It is a top view of the load transmission part which concerns on a modification. It is a figure which shows the lead processing apparatus which concerns on a comparative example.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same components are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  1 to 4 are views showing a lead processing apparatus (lead processing mold) 100 according to the embodiment. FIG. 5 is a plan view of the upper die holder 21, FIG. 6 is a plan view of the load transmitting portion 30, and FIG. 7 is a front sectional view showing the bending die 13. In each figure, in order to make the drawings easier to understand, illustration of some components is omitted (details will be described later).

  A lead processing apparatus (lead processing mold) 100 according to the present embodiment has a main body 51 and a placement portion (for example, a lead receiving portion) in which a semiconductor device 50 having a main body 51 and a lead 52 protruding from the main body 51 is disposed. 15 and the concave portion 16), the first mold unit (lower mold unit 10), and a first mold unit movably provided in a direction approaching the first mold unit and in a direction away from the first mold unit. A second mold unit (upper mold unit 20) for pressing the lead 52 in cooperation with the mold unit, a load transmitting unit 30 for transmitting a press load to the second mold unit, and a first mold unit. And a stopper mechanism 40 for stopping the movement of the second mold unit in a direction approaching the second mold unit. The stopper mechanism 40 includes a first stroke stopper 41 fixed to the first mold unit, a second stroke unit 41 fixed to the second mold unit in an arrangement opposite to the first stroke stopper 41, and abutting against the first stroke stopper 41. There are a plurality of pairs of stroke stoppers 43 including a second stroke stopper 42 for stopping the movement of the two mold units. The load transmission unit 30 distributes the load to a plurality of load transmission locations (for example, load transmission projections 32) spaced apart from each other, and transmits the press load to the second mold unit. It is arranged coaxially with the stopper pair 43. Details will be described below.

  The lead processing apparatus 100 according to the present embodiment presses a lead 52 (FIG. 10) of a semiconductor device 50 as a processing target.

  10A and 10B are diagrams illustrating an example of the semiconductor device 50, in which FIG. 10A is a plan view and FIG. 10B is a cross-sectional view taken along line AA in FIG. As shown in FIG. 10, the semiconductor device 50 includes a main body 51 having a rectangular shape in plan view sealed with a sealing resin 54, and leads 52 that protrude outward from the side surfaces of the main body 51. Yes. The lead 52 has a thickness of, for example, 0.125 to 0.150 mm and a width of about 0.2 mm. A plating film is applied to the upper surface, lower surface and side surfaces (excluding the lead cutting surface) of the lead 52. Including the thickness of the plating film, the thickness of the lead 52 is about 0.125 to 0.180 mm.

  In FIG. 1 to FIG. 3, the left half with the center line 1 indicating the left and right center position as a boundary is a front view, and the right half is a front sectional view. 1 to 3, FIG. 2 shows a state where the upper mold unit 20 is located at the top dead center, FIG. 3 shows a state where the upper mold unit 20 is located at the bottom dead center, and FIG. The state which the mold unit 20 is located in the intermediate position of FIG. 2 and FIG. 3 is shown.

  As shown in FIGS. 1 to 3, the lower mold unit 10 includes, for example, a lower mold holder 11 serving as a base, and a die plate 12 and a bending die 13 constituting the lower mold.

  The lower mold holder 11 is formed in a flat plate shape, for example, and is disposed horizontally. The die plate 12 is formed in a flat plate shape, for example, and is fixed horizontally on the lower mold holder 11. A bending die 13 is fixed on the die plate 12.

  7A shows a state in which the semiconductor device 50 is not disposed on the bending die 13, and FIG. 7B shows a state in which the semiconductor device 50 is placed on the bending die 13. FIG. 7C is an enlarged view of a portion B in FIG.

  As shown in FIGS. 7A and 7B, the bending die 13 is a flat plate-like main body portion 14 that is horizontally fixed on the die plate 12, and stands upward from the upper surface of the main body portion 14. (That is, projecting toward the upper mold unit 20 side).

  The lead receiving portion 15 is formed, for example, in a wall shape extending along a rectangular outline in plan view. A portion surrounded by the lead receiving portion 15 and the upper surface of the main body portion 14 constitutes a concave portion 16 so that a lower portion of the main body portion 51 of the semiconductor device 50 than the lead 52 is accommodated in the concave portion 16. It has become.

  As shown in FIG. 7B, the lead 52 is formed by placing the semiconductor device 50 on the bending die 13 so that the lower portion of the main body 51 is inserted into the recess 16 into the recess 16. The lead receiving unit 15 can receive (support) the state. The lead receiving portion 15 receives a portion closer to the proximal end than the distal end portion of the lead 52. More specifically, the lead receiving portion 15 receives a portion of the lead 52 adjacent to the main body portion 51, and a portion on the distal end side of the lead 52 protrudes outward in the horizontal direction from the lead receiving portion 15. ing. Further, the height of the lead receiving portion 15 (the depth of the concave portion 16) is the lower surface of the main body portion 51 of the semiconductor device 50 in a state where the semiconductor device 50 is disposed on the bending die 13 as shown in FIG. It is preferable that there is a slight clearance between the upper surface of the main body portion 14 of the bending die 13 and the bending die 13. For this reason, for example, the main body 51 is suspended in the recess 16.

  As shown in FIG. 7C, the outer edge of the upper end portion of the lead receiving portion 15 is rounded (R-processed) 18. As a result, the lead 52 can be prevented from being damaged when the lead 52 is bent.

  The lower mold unit 10 is configured as described above and is fixed in place.

  As shown in FIGS. 1 to 3, the upper mold unit 20 includes, for example, an upper mold holder 21 and an upper mold fixed to the upper mold holder 21. The upper mold includes, for example, a punch plate 22, a punch holder 23, and a plurality of (for example, four) bending punches 24.

  The upper mold holder 21 is formed in a flat plate shape, for example, and is disposed horizontally. Note that the planar shape of the upper holder 21 is, for example, a rectangular shape (more specifically, for example, a square shape).

  The punch plate 22 is formed in a flat plate shape, for example, and is fixed to the lower surface of the upper mold holder 21.

  For example, the punch holder 23 is fixed to the lower surface of the punch plate 22 so as to hang downward from the punch plate 22. The punch holder 23 holds a plurality of bending punches 24 and a regulating member 70 described later.

  The bending punch 24 is, for example, a substantially flat member fixed to the punch holder 23 so as to hang downward from the punch holder 23.

  FIG. 8 is a front sectional view for explaining a series of operations of the bending punch 24 and the regulating member 70.

  As shown in FIG. 8, the bending punch 24 presses the lead 52 (specifically, bending) by the processing portion 25 formed at the lower end thereof. The processing portion 25 presses a portion of the lead 52 of the semiconductor device 50 placed on the bending die 13 on the tip side of the lead receiving portion 15. The processing unit 25 has, for example, a tip formed at an acute angle and rounded.

  Here, if the L-shaped surface formed by the outer peripheral surface of the lead receiving portion 15 and the upper surface of the main body portion 14 of the bending die 13 is referred to as a pressing surface 17, the bending punch 24 descends to the bottom dead center. As a result, the lead 52 is pressed against the pressing surface 17 by the processing portion 25. In addition, when the lead 52 is pressed by the processing unit 25 in this way, the lifting of the semiconductor device 50 is restricted by the restriction member 70 described later. That is, at this time, as shown in FIG. 8, the regulating member 70 is positioned so that the lower end surface of the regulating member 70 is close to or in contact with the upper surface of the main body 51 of the semiconductor device 50. (FIG. 8 (a)). The restricting member 70 restricts the floating of the semiconductor device 50 (lifting by the lever principle using the lead 52 as a power point and the upper end of the lead receiving portion 15 as a fulcrum) (FIG. 8B). Therefore, the lead 52 is bent into a shape along the pressing surface 17 and the upper end surface of the lead receiving portion 15 (FIG. 8C). FIG. 8C shows a state where the upper mold unit 20 (including the bending punch 24) is located at the bottom dead center.

  In this manner, the bending punch 24 moves from the top dead center position (position shown in FIG. 2) to the bottom dead center position (positions shown in FIGS. 3 and 8C) and the bending die 13 and the regulating member 70. As a result, the lead 52 of the semiconductor device 50 is pressed (bent).

  FIG. 9 is a bottom view of the regulating member 70, the punch holder 23, and the bending punch 24.

  As can be seen from FIGS. 9, 8, and 1 to 3, the four bending punches 24 are disposed at positions corresponding to the four side surfaces of the main body 51 of the semiconductor device 50 disposed on the bending die 13. ing. Each of the bending punches 24 collectively processes a plurality of leads 52 protruding from corresponding side surfaces of the semiconductor device 50.

  As shown in FIG. 1, the lead processing apparatus 100 includes, for example, a press apparatus 60 as a drive source that moves the upper mold unit 20 and the lower mold unit 10 in a relatively approaching direction and a moving away direction. Yes. Specifically, the press device 60 moves the upper mold unit 20 up and down, for example.

  As the pressing device 60, for example, a motor pressing device driven by a motor, a hydraulic pressure (hydraulic pressure) pressing device driven by hydraulic pressure (hydraulic pressure), a pneumatic pressing device driven by pneumatic pressure, or the like can be applied.

  The press device 60 includes, for example, a main body 61 and a press shaft 62 that moves relative to the main body 61 so that the press device 60 expands and contracts. The main body 61 is fixed in place with an arrangement in which the press shaft 62 is positioned below the main body 61. For this reason, the press shaft 62 moves up and down below the main body 61.

  The press device 60 performs power transmission (including transmission of a press load) to the upper mold holder 21 via the load transmission unit 30.

  A connecting portion 35 for connecting the load transmitting portion 30 and the tip end portion of the press shaft 62 is fixed to the upper surface of the load transmitting portion 30, and the load transmitting portion 30 and the press shaft 62 are connected to each other by the connecting portion 35. Has been.

  As shown in FIGS. 1 to 3, the load transmitting portion 30 is fixed to the upper surface of the upper mold holder 21.

  The load transmission unit 30 includes, for example, a flat plate-like main body 31 and a plurality of load transmission protrusions 32 that protrude downward from the lower surface of the main body 31. The lower ends of these load transmission protrusions 32 are fixed to the upper surface of the upper mold holder 21. The load transmission unit 30 transmits the power (including the press load) applied from the press shaft 62 to the upper mold holder 21 through these load transmission protrusions 32. For example, the load transmitting unit 30 also has a rectangular planar shape, similar to the upper mold holder 21.

  With the above configuration, the load transmitting unit 30 and the upper mold unit 20 also move up and down as the press shaft 62 moves up and down.

  The lowering of the upper mold unit 20 is stopped at a predetermined bottom dead center position by a stopper mechanism 40 described in detail below.

  The stopper mechanism 40 includes a first stroke stopper 41 fixed to the lower mold unit 10, and a second stroke stopper 42 fixed to the upper mold unit 20 in an arrangement facing the first stroke stopper 41. A plurality of pairs (for example, four pairs) of stopper pairs 43 are provided.

  The first stroke stopper 41 is provided on the lower mold holder 11 so as to stand upward from the upper surface of the lower mold holder 11. The second stroke stopper 42 is provided on the upper mold holder 21 so as to hang downward from the lower surface of the upper mold holder 21. That is, the first and second stroke stoppers 41 and 42 are arranged coaxially with each other.

  The first and second stroke stoppers 41 and 42 are each configured, for example, in a columnar shape (specifically, for example, a cylindrical shape), and the upper end surface of the first stroke stopper 41 and the lower end surface of the second stroke stopper 42 are respectively flat surfaces. It has become.

  As shown in FIG. 2, when the upper mold unit 20 is located at the top dead center, the lower end surface of the second stroke stopper 42 and the upper end surface of the first stroke stopper 41 are vertically separated.

  As the upper mold unit 20 descends, the lower end surface of the second stroke stopper 42 abuts against the upper end surface of the first stroke stopper 41. As a result, the upper mold unit 20 stops at the bottom dead center position (FIG. 3).

  Here, as will be described below with reference to FIG. 4, the upper mold holder 21 and the load transmission unit 30 are guided so as to be linearly movable up and down, and are kept horizontal during the vertical movement. It has become.

  Also in FIG. 4, the left half with the center line 1 indicating the left and right center position as a boundary is a front view, and the right half is a front sectional view. 4A shows a state where the upper die holder 21 is located at the top dead center, and FIG. 4B shows a state where the upper die holder 21 is located at the bottom dead center.

As shown in FIG. 4, the lead processing apparatus 100 has a plurality of guide posts 81 erected on the lower mold holder 11. The guide post 81 is formed in a cylindrical shape, for example.
The lead processing apparatus 100 has, for example, four guide posts 81. That is, FIG. 4 shows two guide posts 81 on the near side, and the guide posts 81 are also arranged behind these guide posts 81.

  On the other hand, as shown in FIGS. 4 and 5, a plurality of (for example, four) guide bushes 21 b through which the guide posts 81 are inserted are embedded in the upper mold holder 21. Each guide bush 21b is formed with a guide hole 21a. Each guide post 81 is inserted through the corresponding guide hole 21a so as to penetrate the upper mold holder 21 vertically. The upper mold holder 21 is guided by the guide post 81 in the longitudinal direction (that is, the vertical direction) of the guide post 81 while the inner peripheral surface of the guide hole 21 a slides along the outer peripheral surface of the guide post 81. It has become.

  Similarly, as shown in FIGS. 4 and 6, the load transmitting portion 30 has a plurality of (for example, four) guide holes 30 a through which the guide posts 81 are inserted. The planar arrangement of these guide holes 30a is the same as that of the guide holes 21a. That is, one corresponding guide hole 30a is located above each guide hole 21a. Each guide post 81 is inserted into the corresponding guide hole 30a so as to penetrate the load transmitting portion 30 up and down. The load transmitting portion 30 is guided by the guide post 81 in the longitudinal direction (that is, the vertical direction) of the guide post 81 while the inner peripheral surface of the guide hole 30 a slides along the outer peripheral surface of the guide post 81. It has become.

  As shown in FIGS. 4 to 6, the guide post 81, the guide hole 21 a, and the guide hole 30 a are disposed at, for example, the four corners of the upper mold holder 21 and the load transmission unit 30 in plan view. For this reason, the load transmission unit 30 and the upper mold holder 21, and thus the entire upper mold unit 20, are guided up and down by the guide posts 81 while being stably kept horizontal.

  On the other hand, as shown in FIG. 5, the planar arrangement of the stroke stopper pair 43 is, for example, an intermediate position between the adjacent guide posts 81.

  As shown in FIGS. 5 and 6, each load transmission protrusion 32 of the load transmission unit 30 is disposed at a position overlapping above each stroke stopper pair 43. That is, each of the load transmission protrusions 32 is arranged coaxially with any one corresponding stroke stopper pair 43.

  For this reason, it is suppressed that the upper mold | type holder 21 deform | transforms with the load added to the upper mold | type holder 21 via the load transmission protrusion 32 from the load transmission part 30. FIG.

  Here, the definition of “the load transmission projection 32 is coaxial with the stroke stopper pair 43” will be described. At least a part of the load transmission projection 32 is the stroke stopper pair 43 (particularly, the second stroke stopper 42) in plan view. As long as it overlaps with.

  Further, as shown in FIG. 3, even if the load transmitting portion 30 is bent by a press load, the portion between the load transmitting portion 30 and the upper mold holder 21 is not provided in a portion other than the load transmitting portion (the location where the load transmitting protrusion 32 is formed). An initial clearance C0 (FIGS. 1 and 2) between the load transmitting unit 30 and the upper mold holder 21 is set so that the clearance C exists. The appropriate value of the initial clearance C0 varies depending on the shape and material of the main body 31 of the load transmitting portion 30 and the shape and material of the load transmitting protrusion 32. For example, about several millimeters (specifically, for example, 1 mm or more).

  Further, the center of gravity of the press load transmitted from the load transmitting unit 30 to the upper mold holder 21 is within the plane orthogonal to the moving direction of the upper mold unit 20 (that is, in the horizontal plane), the clearance C0, It is located in the area where C exists. Specifically, the center of gravity of the power point is located, for example, in a region closer to the center of the load transmitting portion 30 than the plurality of load transmitting protrusions 32 and the plurality of guide holes 30a (corresponding to the region R shown in FIG. 6). Preferably, it is located at the center of this region R (that is, for example, at the center of the four load transmission protrusions 32).

  The lead processing apparatus 100 is further held by the upper mold unit 20 in an arrangement facing the arrangement part (the lead receiving part 15 and the concave part 16), and a restriction that regulates the lifting of the main body 51 of the semiconductor device 50 from the arrangement part. A member 70 is provided.

  The restricting member 70 includes, for example, a columnar portion 71 extending in the vertical direction and a flange-shaped portion 72 provided at the upper end of the columnar portion 71.

  The lower surface of the columnar portion 71 is formed flat, and the upper surface of the main body 51 of the semiconductor device 50 abuts on the lower surface, thereby restricting the lifting of the main body 51. The dimensions of the columnar portion 71 are preferably set so that the lower surface of the columnar portion 71 is in surface contact with the entire upper surface of the main body portion 51.

  The flange-like portion 72 has a larger planar dimension than the columnar portion 71 and protrudes outward in the horizontal direction from the columnar portion 71.

  The flange-shaped portion 72 is held in a hollow portion 26 that is continuously formed from the punch plate 22 to the upper portion of the punch holder 23.

  Further, the columnar portion 71 is inserted through an insertion hole 27 formed in the punch holder 23 so as to allow the hollow portion 26 and the space below the punch holder 23 to communicate with each other.

The inner cross-sectional area (plane area) of the hollow portion 26 is set slightly larger than the plane area of the flange-shaped portion 72, and the inner cross-sectional area (plane area) of the insertion hole 27 is larger than the plane area of the flange-shaped portion 72. Is set too small.
For this reason, the regulating member 70 is held so as not to drop downward from the punch holder 23, and can be moved up and down relatively with respect to the punch holder 23 and the punch plate 22.
A step surface 28 is formed at the boundary between the hollow portion 26 and the insertion hole 27.

  The lead processing apparatus 100 further includes a spring (biasing portion) 73 that biases the regulating member 70 relative to the upper mold unit 20 toward the lower mold unit 10 (that is, downward), and the regulating member 70. And a restricting member stopper member 74 including a stopper portion 76 that stops the movement toward the upper mold unit 20 (that is, downward).

  The restriction member stopper member 74 includes, for example, a beam-like support body 75 and a columnar stopper portion 76. One end of the support body 75 is fixed to the lower side surface of the regulating member 70 and extends horizontally so as to project outward from the regulating member 70.

  The upper end portion of the stopper portion 76 is fixed to the other end of the support body 75, and the stopper portion 76 projects downward from the support body 75 and the regulating member 70. That is, the stopper portion 76 is provided integrally with the restricting member 70 so as to protrude toward the lower mold unit 10 with respect to the restricting member 70. The lower end of the stopper portion 76 abuts against the upper surface of the die plate 12 of the lower mold unit 10 outside the arrangement portion (the lead receiving portion 15 and the recessed portion 16) in the horizontal direction. When the lower end of the stopper portion 76 abuts against the upper surface of the die plate 12 of the lower mold unit 10, the lowering of the restricting member 70 is stopped.

  The spring 73 is a compression type coil spring. For example, the upper end of the spring 73 is fixed to the lower surface of the punch holder 23, and the lower end of the spring 73 is fixed to, for example, the upper surface of the regulating member stopper member 74 (the upper surface of the stopper portion 76 or the upper surface of the support body 75). . The spring 73 extends in the vertical direction. Therefore, for example, the spring 73 urges the punch holder 23 and the regulating member stopper member 74 away from each other, and as a result, urges the regulating member 70 downward relative to the upper mold unit 20. is doing.

  However, the spring 73 is preferably arranged coaxially with the stopper portion 76. The definition of “the spring 73 is coaxial with the stopper portion 76” will be described. The lower end of the spring 73 (the connection end to the restricting member stopper member 74) overlaps a part of the stopper portion 76 in plan view. It will be good.

  For example, four regulating member stopper members 74 are provided on the regulating member 70. That is, for example, as shown in FIG. 9, four regulating member stopper members 74 are arranged around the regulating member 70 at equal intervals. In addition, each regulating member stopper member 74 is disposed between the adjacent bending punches 24 so that the regulating member stopper member 74 and the bending punch 24 do not interfere with each other. The spring 73 is provided between the regulating member stopper member 74 and the punch holder 23 for each regulating member stopper member 74.

  As described below, the regulating member 70 moves up and down as the upper mold unit 20 moves up and down. However, the downward movement of the restricting member 70 stops when the stopper portion 76 hits the lower mold unit 10.

  As shown in FIG. 2, at the stage where the upper mold unit 20 is located at the top dead center, the restricting member 70 is caused by the weight of the restricting member 70 and the restricting member stopper member 74 and the urging force by the spring 73. In this state, the lower end of the butt is in contact with the step surface 28. At this stage, the lower end of the regulating member stopper member 74 is separated from the upper surface of the die plate 12 of the lower mold unit 10.

  In the process in which the upper mold unit 20 is lowered from the top dead center position, the regulating member 70 and the regulating member stopper member 74 are in a stage until the lower end of the stopper portion 76 of the regulating member stopper member 74 hits the upper surface of the die plate 12. It descends with the upper mold unit 20.

  In the process in which the upper mold unit 20 is lowered from the top dead center position, the restricting member stopper member 74 and the restricting member 70 are not lowered after the lower end of the stopper portion 76 hits the upper surface of the die plate 12. By urging, the lower end of the stopper portion 76 is kept pressed against the upper surface of the die plate 12 (see FIG. 1).

  The positional relationship between the regulating member 70 and the semiconductor device 50 on the arrangement portion in this state is the relationship shown in FIG. At this stage, the arrangement and dimensions of each component are set so that the clearance between the lower end surface of the columnar portion 71 of the regulating member 70 and the upper surface of the main body portion 51 of the semiconductor device 50 is 100 μm or less or 0. Yes.

  The upper mold unit 20 moves down even after the lower end of the stopper portion 76 hits the upper surface of the die plate 12, and the restricting member 70 moves relative to the upper mold unit 20. That is, the lower end of the flange-like portion 72 is separated from the step surface 28, and the restricting member 70 moves upward relative to the punch plate 22 and the punch holder 23 (FIG. 1).

  Thereafter, the state where the upper mold unit 20 is lowered until the processed portion 25 of the bending punch 24 comes into contact with the lead 52 is a state shown in FIG.

  Further, the state shown in FIG. 8B is a state where the upper mold unit 20 is lowered from the state of FIG. 8A and the bending punch 24 starts to push down the lead 52. At this stage, the main body 51 of the semiconductor device 50 tends to float upward based on the principle of the leverage with the lead 52 as a force point and the upper end of the lead receiving portion 15 as a fulcrum. For this reason, as shown in FIG. 8B, the upper surface of the main body 51 comes into contact with the lower surface of the regulating member 70, and the lifting of the main body 51 is regulated by the regulating member 70.

  Thereafter, when the bending punch 24 is lowered to the bottom dead center, the lead 52 is processed into a predetermined bent shape by the processing portion 25 (FIG. 8C).

  Note that the force by which the main body 51 attempts to float according to the above-described lever principle continuously acts from the stage of FIG. 8B to the stage of FIG. 8C. During the period in which this force is applied, the urging force that pushes down the regulating member 70 downward by the spring 73 is set so that the lifting of the main body 51 can be regulated by the regulating member 70 continuously. That is, the resultant force of the force by which the spring 73 pushes down the restricting member 70 by the bias and the gravity acting on the restricting member 70 and the four restricting member stopper members 74 is greater than the above force that causes the main body 51 to float up. The strength of the spring 73 is set so as to increase.

  As described above, the restricting member 70 restricts the lifting of the main body 51 of the semiconductor device 50 at the position (height) at which the stopper portion 76 abuts against the lower mold unit 10. The position (height) at which the stopper portion 76 abuts against the lower mold unit 10 is such that the surface (the lower end surface of the columnar portion 71) that faces the arrangement portion and restricts lifting in the restricting member 70 is before the press work is started. In this stage, the main body 51 of the semiconductor device 50 is not pressed by the biasing force of the spring 73.

  In addition, in each figure of FIG. 1 thru | or FIG. 4, in order to make drawing easy to understand, illustration of one part component is abbreviate | omitted suitably.

  First, in FIG. 2 thru | or FIG. 4, illustration of the press apparatus 60 and the connection part 35 (all are FIG. 1) is abbreviate | omitted.

  On the other hand, in FIG. 1 thru | or FIG. 4, illustration of the guide post 81 (FIG. 4) is abbreviate | omitted.

  The lead processing apparatus 100 is configured symmetrically when viewed in the direction shown in FIGS. 1 to 4. However, the bending punch 24 is not shown in the left half of FIGS. Also, in the right half of FIGS. 1 to 3, the stroke stopper pair 43 (first and second stroke stoppers 41 and 42), the spring 73 and the regulating member stopper member 74 are not shown.

  In FIG. 4, only the guide post 81, the load transmission unit 30, the upper mold holder 21 and the lower mold holder 11 are illustrated, and the other configurations are not illustrated.

  In the above, an example in which the lead processing apparatus 100 is for bending has been described. However, by using a cutting punch and die instead of the bending punch 24 and the bending die 13, it is possible to cope with the cutting process. it can.

  Next, a method for manufacturing the semiconductor device according to the present embodiment will be described. FIG. 11 is a diagram showing an example of the procedure of the manufacturing method, and FIG. 12 is a diagram showing another example of the procedure of the manufacturing method. This manufacturing method includes the lead processing method according to the present embodiment.

  The lead processing method according to the present embodiment includes an arrangement portion (for example, the lead receiving portion 15 and the concave portion 16) in which the semiconductor device 50 having the main body portion 51 and the lead 52 protruding from the main body portion 51 is disposed. The first mold unit (lower mold unit 10) is provided so as to be movable in a direction approaching the first mold unit and a direction away from the first mold unit, and in cooperation with the first mold unit. A second mold unit (upper mold unit 20) for pressing the lead 52, a load transmitting unit 30 for transmitting a press load to the second mold unit, and a second in a direction approaching the first mold unit. And a stopper mechanism 40 for stopping the movement of the mold unit. The stopper mechanism 40 includes a first stroke stopper 41 fixed to the first mold unit, a second stroke unit 41 fixed to the second mold unit in an arrangement opposite to the first stroke stopper 41, and abutting against the first stroke stopper 41. There are a plurality of pairs of stroke stoppers 43 including a second stroke stopper 42 for stopping the movement of the two mold units. The load transmission unit 30 distributes the load to a plurality of load transmission locations (for example, load transmission projections 32) spaced apart from each other, and transmits the press load to the second mold unit. The lead processing device 100 disposed coaxially with the stopper pair 43 is used to process the lead 52 of the semiconductor device 50. In the processing of the lead 52, a plurality of loads are received from the load transmitting unit 30. The load is distributed to the transmission location, and the press load is transmitted to the second mold unit. Details will be described below.

  First, a semiconductor chip (not shown) is mounted and bonded on a die pad (not shown) of a lead frame (not shown), and the semiconductor chip and the lead 52 are wire-bonded with a bonding wire (not shown). Next, the semiconductor chip and the lead frame are sealed with the sealing resin 54 so that a part of the lead 52 protrudes from the sealing resin 54 (FIG. 10). Next, the burr of the sealing resin 54 is removed. In the case of using a lead frame that has not been previously subjected to an exterior treatment, an exterior plating treatment is also performed on the lead frame.

  Next, the semiconductor device 50 is separated from the lead frame 53 (see FIG. 11A; not shown), and the lead 52 is formed.

  Specifically, for example, first, as shown in FIG. 11A, the lead frame 53 is cut at the cutting position 5 so that the lead 52 becomes longer than the final specified dimension, whereby the semiconductor device 50 is formed. Disconnect from the lead frame 53. Next, as shown in FIG. 11B, the lead 52 is bent downward to form a predetermined gull wing shape. Next, the lead 52 is cut at the cutting position 6 as shown in FIG.

  Alternatively, first, as shown in FIG. 12A, the semiconductor device 50 is separated from the lead frame 53 by cutting the lead frame 53 at the cutting position 7 so that the lead 52 has a specified dimension (FIG. 12B). )). Next, as shown in FIG. 12C, the lead 52 is bent downward to form a predetermined gull wing shape.

  Here, the processing of the lead 52 is performed using the lead processing apparatus 100 according to the present embodiment. The lead processing apparatus 100 includes a step of separating the semiconductor device 50 from the lead frame (FIGS. 10A and 11B), and a step of bending the lead 52 into a gull wing shape (FIGS. 10B and 11B). c)), and the step of cutting the gull-wing shaped lead 52 (FIG. 10B).

  As described above, the lead processing apparatus 100 performs cutting and bending of the lead 52. As processing conditions, the cutting position and bending position of the lead 52 are set within an error range of, for example, several microns. For this reason, it is important to position the bending punch 24 and the bending die 13 with high accuracy. That is, it is important to accurately position the relative position of the upper mold unit 20 with respect to the lower mold unit 10 at the bottom dead center position.

  FIG. 14 is a view showing a lead processing apparatus 1000 according to a comparative example. The left half of FIG. 14 is a front view, and the right half is a front sectional view. Similarly to FIG. 1 to FIG. 3, illustration of components is appropriately omitted in the left half part and the right half part.

  The lead processing apparatus 1000 of FIG. 14 is different from the above-described lead processing apparatus 100 only in the points described below, and is configured similarly to the lead processing apparatus 100 in other points.

  First, the lead processing apparatus 1000 does not have the load transmission unit 30, and the press processing apparatus 60 (not shown in FIG. 14, similar to FIG. 1) directly to the central portion of the upper surface of the upper mold holder 21. Power from the press shaft 62 is applied.

  The spring 73 is provided not between the regulating member stopper member 74 and the punch holder 23 but between the upper end surface of the columnar portion 71 of the regulating member 70 and the lower surface of the upper mold holder 21.

  FIG. 14 shows the deformation (deflection) of the upper mold holder 21 when the upper mold unit 20 is located at the bottom dead center.

  In the configuration of the lead processing apparatus 1000 shown in FIG. 14, the upper mold holder 21 is more likely to be deformed by a press load than the above-described lead processing apparatus 100. That is, as shown in FIG. 14, the upper mold holder 21 tends to bend downward and convex. This is because a press load is applied from the press device 60 to the central portion of the upper surface of the upper mold holder 21. When the upper mold holder 21 is convexly curved downward, the height of the upper mold at the bottom dead center (particularly, the height of the processing portion 25 of the bending punch 24) is lower than that of the lead processing apparatus 100 described above. End up. As a result, there is a possibility that the processing accuracy of the lead 52 is lowered as compared with the case of using the lead processing apparatus 100 described above. In particular, when the press device 60 is a hydraulic press device, a large press load exceeding 10000 N (Newton) is applied to the stroke stoppers 41 and 42 from the time when the bottom dead center is reached. Is assumed.

On the other hand, in this embodiment, in addition to distributing the press load to the upper mold holder 21 by the load transmitting portion 30 having the plurality of load transmitting projections 32 spaced apart from each other, the load transmitting projections 32 are stroked. It is arranged coaxially with the stopper pair 43. Thereby, the deformation of the upper mold holder 21 due to the press load can be suppressed, and the press load can be reliably transmitted to the upper mold holder 21. In addition, it can be said that the deformation | transformation by a press load can be absorbed by the deformation | transformation of the load transmission part 30 (refer FIG. 3).
Therefore, it is possible to suppress the upper mold unit 20 from being displaced from a desired relative position (height) with respect to the lower mold unit 10 at the bottom dead center position, so that the processing accuracy of the lead 52 of the semiconductor device 50 can be improved. it can.

  Further, in the configuration of the lead processing apparatus 1000 shown in FIG. 14, the height of the regulating member 70 at the bottom dead center (particularly, the height of the lower end surface of the columnar portion 71) is lower than that of the lead processing apparatus 100. End up. This is because the height of the lower end surface of the columnar portion 71 is further increased by the spring 73 biasing the columnar portion 71 downward in addition to the height of the lower end surface of the columnar portion 71 being lowered by the curvature of the upper mold holder 21. This is because the height is lowered. That is, when the columnar portion 71 is biased downward by the spring 73, the beam-like support body 75 of the restricting member stopper member 74 is bent, and the lower end surface of the columnar portion 71 is lowered. As a result, there is a possibility that the processing accuracy of the lead 52 may be further reduced as compared with the case where the lead processing apparatus 100 is used. Further, the lower end surface of the columnar portion 71 may press the main body 51 of the semiconductor device 50 downward, which may adversely affect the quality of the semiconductor device 50.

  On the other hand, in the present embodiment, the spring 73 is disposed coaxially with the stopper portion 76. Thereby, since the bending of the support body 75 etc. by the spring 73 can be suppressed, compared with the structure of FIG. 14, the fall of the height of the lower end surface of the columnar part 71 in a bottom dead center can be suppressed. Therefore, the processing accuracy of the lead 52 of the semiconductor device 50 can also be improved by this.

Here, another problem in the technique of Patent Document 1 will be described.
As described above, in the press device of Patent Document 1, the semiconductor device is pressed from above and clamped by the clamp pin provided on the cam. For this reason, in the technique of Patent Document 1, since stress is locally applied to the semiconductor device, the quality of the semiconductor device 50 may be adversely affected.
In addition, since the semiconductor device is clamped by the clamp pin provided on the cam, the position of the lower end of the clamp pin also fluctuates (fluctuates downward) due to deformation of the pad stopper. Stress may be applied and the processing accuracy of the lead 52 may be adversely affected.
Moreover, in the press apparatus of patent document 1, many springs (a spring for cams, a spring for clamp pins, and a spring for bending punches) are provided in the apparatus. There is a possibility that stress deformation generated in the apparatus by these springs may lead to a decrease in lead processing accuracy.
In an experiment by the present inventor, when a lead is processed using a press device having a structure as in Patent Document 1, a processing error of several tens of μm may occur from a design value.

On the other hand, in the present embodiment, the arrangement portion where the semiconductor device 50 is arranged protrudes toward the upper mold unit 20 and includes a lead receiving portion 15 that receives a portion closer to the base end side than the distal end portion of the lead 52. The upper mold unit 20 has a processing portion 25 that presses a portion of the lead 52 that is closer to the tip than the lead receiving portion 15. The lead processing apparatus 100 further includes a regulating member 70 that is held by the upper mold unit 20 in an arrangement facing the arrangement part and regulates the lifting of the main body 51 of the semiconductor device 50 from the arrangement part. . The lead processing apparatus 100 is further provided integrally with the regulating member 70 so as to protrude toward the lower mold unit 10 side than the regulating member 70 and a spring 73 that biases the regulating member 70 toward the lower mold unit 10 side. In addition, a stopper portion 76 that abuts against the lower mold unit 10 is provided outside the arrangement portion, and the restricting member 70 restricts the lifting of the main body 51 at a position where the stopper portion 76 abuts against the lower mold unit 10. The position where the stopper portion 76 abuts against the lower mold unit 10 is such that the surface (the lower end surface of the columnar portion 71) that faces the arrangement portion of the restriction member 70 and restricts the floating is the spring 73 at the stage before the start of press working. This is a position where the main body 51 of the semiconductor device 50 is not pressed by urging.
That is, in the present embodiment, the lower surface of the regulating member 70 is configured to suppress the floating of the semiconductor device 50, and the lower surface of the regulating member 70 (the lower end surface of the columnar portion 71) is the spring 73 at a stage before the start of press working. The semiconductor device 50 is not pressed by the urging force. For this reason, compared with the method (patent document 1 etc.) which clamps a semiconductor device, the stress added to the main-body part 51 of the semiconductor device 50 can be reduced, and the possibility of having a bad influence on the quality of the semiconductor device 50 can be reduced. . In particular, when the lower end surface of the columnar portion 71 of the regulating member 70 is in surface contact over the entire upper surface of the main body 51 of the semiconductor device 50, the stress applied to the main body 51 can be further reduced. .

In addition, in the present embodiment, the spring 73 and the stopper portion 76 that urge the regulating member 70 are arranged on the same axis, so that bending of the support body 75 and the like due to the urging of the spring 73 can be suppressed. For this reason, since the fluctuation | variation (decrease) of the height of the lower end surface of the columnar part 71 in a bottom dead center can be suppressed, the processing precision of the lead | read | reed 52 of the semiconductor device 50 can be raised.
In addition, since it is not necessary to use a spring component other than the spring 73, it is possible to suppress the internal configuration of the lead processing apparatus 100 using the spring from being deformed by stress. Therefore, the lead 52 of the semiconductor device 50 can be suppressed as much as possible. Processing accuracy can be increased. In particular, by arranging the spring 73 and the stopper portion 76 on the same axis, it is possible to synergistically suppress the stress deformation of the internal configuration of the lead machining apparatus 100 and further improve the machining accuracy of the lead 52.

According to the embodiment as described above, the press load is transmitted to the upper mold unit 20 via the load transmitting unit 30. The load transmitting unit 30 is configured to distribute the load to the plurality of load transmitting protrusions 32 that are separated from each other and transmit the press load to the upper mold holder 21 of the upper mold unit 20, and the load transmitting protrusions Each of 32 is arranged coaxially with any one corresponding stroke stopper pair 43. With these configurations, in the upper mold holder 21, a press load can be selectively applied to a portion corresponding to the arrangement position of the stroke stopper pair 43, so that deformation of the upper mold holder 21 due to the press load can be suppressed. Can do. Therefore, since the relative position of the upper mold unit 20 with respect to the lower mold unit 10 can be prevented from being shifted from a desired position during press working, the processing accuracy of the lead 52 of the semiconductor device 50 can be increased. it can.
For example, in-vehicle semiconductor devices are required to have high and stable quality on the order of several μm (microns) in the finished outer dimensions of the lead 52 that is a mounting portion. According to the present embodiment, such highly accurate processing can be easily performed.

  Further, even if the load transmitting portion 30 is bent by the press load, the clearance C between the load transmitting portion 30 and the upper mold holder 21 in the upper mold unit 20 at a portion other than the portion where the load transmitting protrusion 32 is formed (FIG. 3). The initial clearance C0 (FIGS. 2 and 1) between the load transmitting unit 30 and the upper mold holder 21 of the upper mold unit 20 is set. Therefore, since it can suppress that a press load is directly transmitted from the load transmission part 30 with respect to parts other than the formation location of the load transmission protrusion 32, a deformation | transformation of the upper mold | type holder 21 of the upper mold unit 20 more reliably. Can be suppressed.

  Note that the center of gravity of the force point of the press load transmitted from the load transmitting unit 30 to the upper mold holder 21 of the upper mold unit 20 is in a plane perpendicular to the moving direction of the upper mold unit 20 (that is, for example, a horizontal plane) (Inside), it is located in the region where the clearance C (FIG. 3) exists.

  In the above embodiment, as illustrated in FIG. 6, the example in which the load transmission protrusion 32 (and the stroke stopper pair 43) is positioned between the guide posts 81 adjacent in plan view is described. . For example, as shown in FIG. 13, the load transmission protrusion 32 (and the stroke stopper pair 43) may be positioned outside the guide post 81 in a plan view.

The present application also discloses the following invention.
(1)
A first mold unit including an arrangement part in which a semiconductor device having a main body part and a lead protruding from the main body part is arranged;
A second mold unit provided so as to be movable in a direction approaching the first mold unit and in a direction moving away from the first mold unit, and presses the lead in cooperation with the first mold unit. When,
Have
The arrangement portion has a lead receiving portion that protrudes toward the second mold unit side and receives a portion closer to the base end side than the tip end portion of the lead;
The second mold unit has a processing portion that presses a portion of the lead on the tip side of the lead receiving portion,
The lead processing apparatus further includes:
A regulating member that is held by the second mold unit in an arrangement facing the arrangement part and restricts the lifting of the main body part of the semiconductor device from the arrangement part;
A biasing portion that biases the restricting member toward the first mold unit;
A stopper part that is provided integrally with the restriction member so as to protrude to the first mold unit side relative to the restriction member, and abuts against the first mold unit outside the arrangement part;
Have
The restricting member restricts the lifting at a position where the stopper portion abuts on the first mold unit,
The position where the stopper portion abuts against the first mold unit is such that the surface of the restricting member that faces the arrangement portion and restricts the lifting is biased by the biasing portion at the stage before the start of the press working. The lead processing apparatus is a position that does not press the semiconductor device.
(2)
The lead processing apparatus according to (1), wherein the urging portion and the stopper portion are arranged coaxially.

DESCRIPTION OF SYMBOLS 1 Center line 5, 6, 7 Cutting position 10 Lower mold unit 11 Lower mold holder 12 Die plate 13 Bending die 14 Main body part 15 Lead receiving part 16 Recess 16 Cutting position 17 Pressing surface 18 Rounding process 20 Upper mold unit 21 Upper Die holder 21a Guide hole 21b Guide bush 22 Punch plate 23 Punch holder 24 Bending punch 25 Processing part 26 Hollow part 27 Insertion hole 28 Step surface 30 Load transmission part 30a Guide hole 31 Main body part 32 Load transmission protrusion 35 Connection part 40 Stopper mechanism 41 First Stroke Stopper 42 Second Stroke Stopper 43 Stroke Stopper Pair 50 Semiconductor Device 51 Main Body 52 Lead 53 Lead Frame 54 Sealing Resin 60 Press Device 61 Main Body 62 Press Shaft 70 Restricting Member 71 Columnar 72 Flange 73 Spring 74 Control member stopper member 5 support 76 stopper portion 81 guide post 100 lead processing device 1000 lead processing apparatus C clearance C0 initial clearance R region

Claims (7)

A first mold unit including an arrangement part in which a semiconductor device having a main body part and a lead protruding from the main body part is arranged;
A second mold unit provided so as to be movable in a direction approaching the first mold unit and in a direction moving away from the first mold unit, and presses the lead in cooperation with the first mold unit. When,
A load transmitting portion for transmitting a press load to the second mold unit;
A stopper mechanism for stopping the movement of the second mold unit in a direction approaching the first mold unit;
Have
The stopper mechanism is
A first stroke stopper fixed to the first mold unit;
A second stroke stopper fixed to the second mold unit in an arrangement facing the first stroke stopper and stopping the movement of the second mold unit by striking the first stroke stopper;
There are multiple pairs of stroke stoppers including
The load transmitting portion distributes a load to a plurality of load transmitting portions spaced apart from each other and transmits a press load to the second mold unit, and each of the load transmitting portions is coaxial with the stroke stopper pair. A lead processing apparatus, wherein   Even if the load transmitting portion is bent by the press load, the load transmitting portion and the second mold unit are arranged so that there is a clearance between the load transmitting portion and the second mold unit in a portion other than the load transmitting portion. The lead processing apparatus according to claim 1, wherein an initial clearance between the two mold units is set.   The force point gravity center of the press load transmitted from the load transmitting portion to the second mold unit is within a region where the clearance exists in a plane orthogonal to the moving direction of the second mold unit. The lead processing apparatus according to claim 2, wherein the lead processing apparatus is positioned. The arrangement portion has a lead receiving portion that protrudes toward the second mold unit side and receives a portion closer to the base end side than the tip end portion of the lead;
The second mold unit has a processing portion that presses a portion of the lead on the tip side of the lead receiving portion,
The lead processing apparatus further includes:
A regulating member that is held by the second mold unit in an arrangement facing the arrangement part and restricts the lifting of the main body part of the semiconductor device from the arrangement part;
A biasing portion that biases the restricting member toward the first mold unit;
A stopper part that is provided integrally with the restriction member so as to protrude to the first mold unit side relative to the restriction member, and abuts against the first mold unit outside the arrangement part;
Have
The restricting member restricts the lifting at a position where the stopper portion abuts on the first mold unit,
The position where the stopper portion abuts against the first mold unit is such that the surface of the restricting member that faces the arrangement portion and restricts the lifting is biased by the biasing portion at the stage before the start of the press working. The lead processing apparatus according to claim 1, wherein the lead processing apparatus is a position that does not press the semiconductor device.   The lead processing apparatus according to claim 4, wherein the biasing portion and the stopper portion are arranged coaxially. A first mold unit including an arrangement part in which a semiconductor device having a main body part and a lead protruding from the main body part is arranged;
A second mold unit provided so as to be movable in a direction approaching the first mold unit and in a direction moving away from the first mold unit, and presses the lead in cooperation with the first mold unit. When,
A load transmitting portion for transmitting a press load to the second mold unit;
A stopper mechanism for stopping the movement of the second mold unit in a direction approaching the first mold unit;
Have
The stopper mechanism is
A first stroke stopper fixed to the first mold unit;
A second stroke stopper fixed to the second mold unit in an arrangement facing the first stroke stopper and stopping the movement of the second mold unit by striking the first stroke stopper;
There are multiple pairs of stroke stoppers including
The load transmitting portion distributes a load to a plurality of load transmitting portions spaced apart from each other and transmits a press load to the second mold unit, and each of the load transmitting portions is coaxial with the stroke stopper pair. A step of processing the leads of the semiconductor device using a lead processing device disposed in
In the lead processing step, a load is distributed from the load transmission portion to the plurality of load transmission locations, and a press load is transmitted to the second mold unit. A first mold unit including an arrangement part in which a semiconductor device having a main body part and a lead protruding from the main body part is arranged;
A second mold unit provided so as to be movable in a direction approaching the first mold unit and in a direction moving away from the first mold unit, and presses the lead in cooperation with the first mold unit. When,
A load transmitting portion for transmitting a press load to the second mold unit;
A stopper mechanism for stopping the movement of the second mold unit in a direction approaching the first mold unit;
Have
The stopper mechanism is
A first stroke stopper fixed to the first mold unit;
A second stroke stopper fixed to the second mold unit in an arrangement facing the first stroke stopper and stopping the movement of the second mold unit by striking the first stroke stopper;
There are multiple pairs of stroke stoppers including
The load transmitting portion distributes a load to a plurality of load transmitting portions spaced apart from each other and transmits a press load to the second mold unit, and each of the load transmitting portions is coaxial with the stroke stopper pair. Lead processing mold characterized by being arranged in.

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