JP6127216B1 - 電子機器の冷却システム - Google Patents
電子機器の冷却システム Download PDFInfo
- Publication number
- JP6127216B1 JP6127216B1 JP2016546554A JP2016546554A JP6127216B1 JP 6127216 B1 JP6127216 B1 JP 6127216B1 JP 2016546554 A JP2016546554 A JP 2016546554A JP 2016546554 A JP2016546554 A JP 2016546554A JP 6127216 B1 JP6127216 B1 JP 6127216B1
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- JP
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- Prior art keywords
- cooling
- coolant
- cooling system
- cooling tank
- receiving part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 217
- 239000002826 coolant Substances 0.000 claims abstract description 101
- 239000000110 cooling liquid Substances 0.000 claims abstract description 36
- 239000006185 dispersion Substances 0.000 claims description 22
- 238000009434 installation Methods 0.000 claims description 19
- 238000002955 isolation Methods 0.000 claims description 13
- 239000007788 liquid Substances 0.000 abstract description 11
- 238000007654 immersion Methods 0.000 description 7
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000009835 boiling Methods 0.000 description 5
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- QDOIZVITZUBGOQ-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,4-nonafluoro-n,n-bis(1,1,2,2,3,3,4,4,4-nonafluorobutyl)butan-1-amine;1,1,2,2,3,3,4,4,4-nonafluoro-n-(1,1,2,2,3,3,4,4,4-nonafluorobutyl)-n-(trifluoromethyl)butan-1-amine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F.FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F QDOIZVITZUBGOQ-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- -1 perfluorocarbon compound Chemical class 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D90/00—Component parts, details or accessories for large containers
- B65D90/22—Safety features
- B65D90/24—Spillage-retaining means, e.g. recovery ponds
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/16—Safety or protection arrangements; Arrangements for preventing malfunction for preventing leakage
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/30—Safety or protection arrangements; Arrangements for preventing malfunction for preventing vibrations
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
11、50、60 冷却槽
12 天板
13 熱交換器
15、17 流通路
19 ポンプ
21、41 漏出受け部
23、33 別の漏出受け部
22、24、34、42 蓋材
25、35 通路
31 設置面
32 床面
36 支柱
40 分散板
51、61 上部構造
52 流入管
53、63 下部構造
54 流出管
55 免震装置
56、67 フレキシブルな管
57 フレキシブルな流通路
66 分配器
Claims (11)
- 電子機器を冷却液中に浸漬して直接冷却する冷却システムであって、
冷却液が入れられた冷却槽と、
前記冷却槽から冷却液が漏出したときに該漏出した冷却液を受けるよう、前記冷却槽と床面との間に配置される漏出受け部と、
前記漏出受け部に貯められた前記漏出した冷却液の体積が、所定量を超えたときに、前記所定量を超えた分の前記漏出した冷却液を受けるよう配置される、別の漏出受け部と、
前記漏出受け部と前記別の漏出受け部とを連結し、前記所定量を超えた分の前記漏出した冷却液を通す通路と、
を含む冷却システム。 - 前記別の漏出受け部には前記冷却槽とは別の冷却槽が配置されている、請求項1に記載の冷却システム。
- 前記冷却槽で暖められた冷却液を前記冷却槽の外部で冷やすための熱交換器をさらに備え、前記別の漏出受け部が、前記熱交換器とその設置面との間に配置されている、請求項1に記載の冷却システム。
- 前記床面と前記別の漏出受け部の設置面とが上下2段の上げ床構造を成しており、前記通路が前記床面を貫通するよう構成されている、請求項1又は3に記載の冷却システム。
- 前記漏出受け部が、前記冷却槽から受ける荷重を分散させる分散板と、該分散板上で前記冷却槽を囲むように設けられた、閉じられた側壁とから構成されている、請求項1に記載の冷却システム。
- 前記漏出受け部及び前記別の漏出受け部が、その上部開口を覆う蓋材をさらに備えている、請求項1に記載の冷却システム。
- 前記冷却槽が、前記床面に固定される下部構造と、電子機器が前記冷却液中に浸漬される上部構造と、前記下部構造と前記上部構造との間に配置される免震装置とを含んでいる、請求項1に記載の冷却システム。
- 前記下部構造が、冷えた冷却液を分配する分配器を含み、前記上部構造が、前記分配された冷えた冷却液を前記冷却槽内に流入させる、複数の流入管を含み、前記複数の流入管の各々と前記分配器とが、フレキシブルな管により連結されている、請求項7に記載の冷却システム。
- 前記上部構造が、前記冷却槽内で暖められた冷却液を前記冷却槽外に流出させる、複数の流出管を含み、前記下部構造が、前記暖められた冷却液を集める集合器を含み、前記複数の流出管の各々と前記集合器とが、フレキシブルな管により連結されている、請求項7又は8に記載の冷却システム。
- 前記下部構造が、冷えた冷却液を通す入口通路を備え、前記上部構造が、前記冷えた冷却液を分配する分配器と、前記分配された冷えた冷却液を前記冷却槽内に流入させる、複数の流入管とを含み、前記入口通路と前記分配器とが、フレキシブルな管により連結されている、請求項7に記載の冷却システム。
- 前記上部構造が、前記冷却槽内で暖められた冷却液を前記冷却槽外に流出させる、複数の流出管と、前記暖められた冷却液を集める集合器とを含み、前記下部構造が、前記暖められた冷却液を通す出口通路を備え、前記集合器と前記出口通路とが、フレキシブルな管により連結されている、請求項7又は8に記載の冷却システム。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/081790 WO2017081778A1 (ja) | 2015-11-11 | 2015-11-11 | 電子機器の冷却システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6127216B1 true JP6127216B1 (ja) | 2017-05-10 |
JPWO2017081778A1 JPWO2017081778A1 (ja) | 2017-11-16 |
Family
ID=58694859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016546554A Expired - Fee Related JP6127216B1 (ja) | 2015-11-11 | 2015-11-11 | 電子機器の冷却システム |
Country Status (5)
Country | Link |
---|---|
US (2) | US20180363993A1 (ja) |
EP (1) | EP3376337B1 (ja) |
JP (1) | JP6127216B1 (ja) |
CN (1) | CN108369443B (ja) |
WO (1) | WO2017081778A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3376339A4 (en) * | 2015-11-11 | 2018-12-05 | Exascaler Inc. | Electronic device cooling system |
CN111836506A (zh) * | 2019-04-17 | 2020-10-27 | 鸿富锦精密电子(天津)有限公司 | 散热装置及应用所述散热装置的散热系统 |
US12004321B2 (en) | 2019-06-18 | 2024-06-04 | 3M Innovative Properties Company | Rack-mountable immersion cooling system |
JP7288834B2 (ja) * | 2019-10-07 | 2023-06-08 | キヤノントッキ株式会社 | 成膜装置、成膜方法および電子デバイスの製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517335U (ja) * | 1978-07-19 | 1980-02-04 | ||
JPS596849U (ja) * | 1982-07-05 | 1984-01-17 | 富士電機株式会社 | 水冷式半導体変換装置 |
JPH02124415U (ja) * | 1989-03-20 | 1990-10-12 | ||
US20130105120A1 (en) * | 2011-10-26 | 2013-05-02 | International Business Machines Corporation | Multi-fluid, two-phase immersion-cooling of electronic component(s) |
JP2015078745A (ja) * | 2013-10-17 | 2015-04-23 | 株式会社ケイズベルテック | 免震機能を備えた受け台 |
Family Cites Families (12)
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US3165460A (en) * | 1962-04-11 | 1965-01-12 | American Mach & Foundry | Electrolytic acid generator |
US3406244A (en) * | 1966-06-07 | 1968-10-15 | Ibm | Multi-liquid heat transfer |
US20090178727A1 (en) * | 2008-01-14 | 2009-07-16 | Murphy Stephen A | Combination water conservation apparatus and watering bucket with method of use |
DK2321849T3 (da) * | 2008-08-11 | 2022-01-31 | Green Revolution Cooling Inc | Horisontalt computerserverstativ nedsænket i væske og systemer og fremgangsmåder til afkøling af et sådant serverstativ |
CN201726300U (zh) * | 2010-07-12 | 2011-01-26 | 四川英杰电气有限公司 | 一种用于igbt逆变电源中防止冷却漏水的装置 |
US9042098B2 (en) * | 2012-11-12 | 2015-05-26 | International Business Machines Corporation | Air-cooling and vapor-condensing door assembly |
US10018425B2 (en) * | 2013-02-01 | 2018-07-10 | Dell Products, L.P. | Heat exchanger and technique for cooling a target space and/or device via stepped sequencing of multiple working fluids of dissimilar saturation temperatures to provide condensation-by-vaporization cycles |
WO2014165824A1 (en) * | 2013-04-04 | 2014-10-09 | Green Revolution Cooling, Inc. | Liquid coolant-submersible node |
WO2014169230A1 (en) * | 2013-04-11 | 2014-10-16 | Green Revolution Cooling, Inc. | Computing module with power and liquid cooling |
JP2014228353A (ja) * | 2013-05-21 | 2014-12-08 | 株式会社東芝 | 水冷ユニット保護部品、及び電子機器ユニット |
CN103593018A (zh) * | 2013-11-13 | 2014-02-19 | 曙光信息产业(北京)有限公司 | 用于服务器系统的电气转接装置和服务器 |
CN104284536B (zh) * | 2014-10-28 | 2017-06-06 | 深圳绿色云图科技有限公司 | 服务器机柜及具有其的机柜组和液体浸没冷却服务器系统 |
-
2015
- 2015-11-11 CN CN201580084497.2A patent/CN108369443B/zh not_active Expired - Fee Related
- 2015-11-11 EP EP15908298.1A patent/EP3376337B1/en active Active
- 2015-11-11 JP JP2016546554A patent/JP6127216B1/ja not_active Expired - Fee Related
- 2015-11-11 WO PCT/JP2015/081790 patent/WO2017081778A1/ja active Application Filing
- 2015-11-11 US US15/773,130 patent/US20180363993A1/en not_active Abandoned
-
2020
- 2020-08-07 US US16/987,784 patent/US20200370845A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517335U (ja) * | 1978-07-19 | 1980-02-04 | ||
JPS596849U (ja) * | 1982-07-05 | 1984-01-17 | 富士電機株式会社 | 水冷式半導体変換装置 |
JPH02124415U (ja) * | 1989-03-20 | 1990-10-12 | ||
US20130105120A1 (en) * | 2011-10-26 | 2013-05-02 | International Business Machines Corporation | Multi-fluid, two-phase immersion-cooling of electronic component(s) |
JP2015078745A (ja) * | 2013-10-17 | 2015-04-23 | 株式会社ケイズベルテック | 免震機能を備えた受け台 |
Also Published As
Publication number | Publication date |
---|---|
EP3376337B1 (en) | 2021-09-08 |
EP3376337A4 (en) | 2019-07-10 |
WO2017081778A1 (ja) | 2017-05-18 |
CN108369443B (zh) | 2021-10-22 |
JPWO2017081778A1 (ja) | 2017-11-16 |
US20180363993A1 (en) | 2018-12-20 |
EP3376337A1 (en) | 2018-09-19 |
CN108369443A (zh) | 2018-08-03 |
US20200370845A1 (en) | 2020-11-26 |
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