JP6116641B2

JP6116641B2 - Cassette

Info

Publication number: JP6116641B2
Application number: JP2015206576A
Authority: JP
Inventors: 慎介野口; 丈恭小林; 誠杉▲崎▼
Original assignee: Fujifilm Corp
Current assignee: Fujifilm Corp
Priority date: 2015-10-20
Filing date: 2015-10-20
Publication date: 2017-04-19
Anticipated expiration: 2031-09-28
Also published as: JP2016033516A

Description

本発明は、Ｘ線等の放射線を検出してデジタル画像データに変換するカセッテに関する。 The present invention relates to a cassette that detects radiation such as X-rays and converts it into digital image data.

Ｘ線を用いた撮影は、医療診断や非破壊検査等の分野において広く普及している。一般的なＸ線撮影においては、被写体にＸ線を照射し、被写体の各部において減衰を受けて被写体を透過したＸ線を検出し、その強度分布に基づいて被写体のＸ線画像を得ている。 X-ray imaging is widely used in fields such as medical diagnosis and non-destructive inspection. In general X-ray photography, an X-ray image of a subject is obtained based on the intensity distribution by irradiating the subject with X-rays, detecting X-rays that are attenuated at each part of the subject and transmitted through the subject. .

Ｘ線を検出する検出媒体としては、例えば、Ｘ線に露光されることにより蛍光を発する増感紙とこの蛍光に感光するフイルムとを組み合わせたものや、Ｘ線に露光されることによってＸ線の強度分布を潜像として蓄積し、後にレーザー光等の励起光を照射されることによって潜像に応じた蛍光を発する輝尽性蛍光体（蓄積性蛍光体）パネルが用いられている。 As a detection medium for detecting X-rays, for example, a combination of an intensifying screen that emits fluorescence when exposed to X-rays and a film sensitive to the fluorescence, or X-rays when exposed to X-rays is used. A stimulable phosphor (accumulative phosphor) panel is used that accumulates the intensity distribution as a latent image and emits fluorescence corresponding to the latent image when irradiated with excitation light such as laser light.

また、検出媒体として、近年では、Ｘ線を検出して電気信号に変換する半導体素子を用いてデジタル画像データを生成するフラットパネル検出器（ＦＰＤ：Flat Panel Detector）も用いられている。 In recent years, a flat panel detector (FPD) that generates digital image data using a semiconductor element that detects X-rays and converts them into electrical signals is also used as a detection medium.

そして、Ｘ線撮影には、上記の検出媒体が可搬型の筐体に収納されて構成された、いわゆるカセッテが広く用いられている。この種のカセッテは、その使用形態から荷重や衝撃に晒されることが多い。 For X-ray imaging, so-called cassettes are widely used in which the above detection medium is housed in a portable housing. This type of cassette is often exposed to loads and impacts due to its usage.

例えば、特許文献１に記載されたカセッテでは、荷重や衝撃から検出媒体を保護すべく、筐体と検出媒体との隙間に気嚢等の緩衝材が万遍なく設けられている。 For example, in the cassette described in Patent Document 1, buffer materials such as air sac are uniformly provided in the gap between the housing and the detection medium in order to protect the detection medium from a load and an impact.

特開２００６‐３１１５７５号公報JP 2006-31575 A

特許文献１の記載のカセッテでは、筐体と検出媒体の間に気嚢等の緩衝材が設けられることによって、運搬などの衝撃から検出媒体を保護している。しかし、カセッテが衝撃を受けた際に、検出媒体が必要以上に動き、筺体と検出媒体が接触してしまうことあった。特に、カセッテは薄板状に構成されており、その厚さは数センチ程度しかない。このため、筺体に検出媒体が接触すると、検出媒体が損傷を受けやすい。 In the cassette described in Patent Literature 1, a buffer material such as an air sac is provided between the housing and the detection medium, thereby protecting the detection medium from impacts such as transportation. However, when the cassette is impacted, the detection medium moves more than necessary, and the casing and the detection medium may come into contact with each other. In particular, the cassette is configured in a thin plate shape, and its thickness is only a few centimeters. For this reason, when the detection medium comes into contact with the housing, the detection medium is easily damaged.

また、医療現場等においてカセッテを持ち運ぶ際に、誤ってカセッテを落としてしまうことがある。この場合、カセッテが薄板状に構成されているため、カセッテの筺体の側壁部から床に衝突することが多い。このため、筺体の側壁部を通じて検出媒体に与える衝撃対策を行うことが好ましい。 Moreover, when carrying a cassette in a medical field etc., a cassette may be accidentally dropped. In this case, since the cassette is configured in a thin plate shape, the cassette often collides with the floor from the side wall of the cassette housing. For this reason, it is preferable to take measures against an impact applied to the detection medium through the side wall of the housing.

本発明は、上述した事情に鑑みなされたものであり、カセッテの形状に起因した衝撃脆弱性に対して対策を施し、耐衝撃性を強化したカセッテを提供することを目的とする。 The present invention has been made in view of the above-described circumstances, and an object thereof is to provide a cassette with improved impact resistance by taking measures against impact vulnerability due to the shape of the cassette.

放射線を電荷に変換して蓄積する複数の画素が基板に配された平板状の受像部と、上記受像部が固着される支持体とを有する撮像部と、上記撮像部を収納する筐体と、上記受像部の画素の制御を行う回路基板が取り付けられる熱分散部材と、を備え、上記受像部、上記支持体、上記熱分散部材は、この順で積層配置されており、上記撮像部は、上記筐体に固着されていない状態で収納されており、上記支持体は、上記受像部を支持する基材と、脚部と、を有し、上記基材の外縁は、上記受像部の受像面と平行な方向において、上記受像部の基板の外縁よりも外側に位置しており、上記基材の外縁が上記筐体の側壁部に緩衝材を介さずに当接して上記筐体に嵌ることにより、上記受像部の受像面と平行な方向において上記撮像部は位置決めされており、上記脚部が上記筐体の底部に当接することにより、上記受像部の受像面と直交する方向において上記撮像部は位置決めされており、上記熱分散部材は、上記基材と上記脚部の間に設けられ、上記脚部に固着されているカセッテ。 An imaging unit having a flat image receiving unit in which a plurality of pixels that convert radiation into electric charges and stored are arranged on a substrate, a support to which the image receiving unit is fixed, and a housing that houses the imaging unit A heat distribution member to which a circuit board for controlling the pixels of the image receiving unit is attached, and the image receiving unit, the support, and the heat distribution member are stacked in this order. The support body has a base material that supports the image receiving portion and a leg portion, and an outer edge of the base material is a portion of the image receiving portion. In the direction parallel to the image receiving surface, it is located outside the outer edge of the substrate of the image receiving unit, and the outer edge of the base material abuts on the side wall of the housing without a cushioning material to the housing. By fitting, the imaging unit is positioned in a direction parallel to the image receiving surface of the image receiving unit. Cage, by the leg abuts against the bottom portion of the housing, the imaging section in the direction orthogonal to the image receiving surface of the image receiving unit is positioned, the heat dispersion member, said base member and said leg portion A cassette provided between and fixed to the legs .

上記カセッテによれば、カセッテが衝撃を受けた際に、受像部よりもこれを支持する支持体が大きく形成されているため、受像部に直接衝撃が伝わることがなく、受像部の基板が損傷しにくい。すなわち、カセッテの形状に起因した衝撃脆弱性に対して対策を施し、耐衝撃性を強化したカセッテを得ることができる。 According to the above cassette, when the cassette receives an impact, the support for supporting the cassette is larger than the image receiving portion. Hard to do. In other words, it is possible to obtain a cassette with improved impact resistance by taking measures against impact vulnerability due to the shape of the cassette.

本発明の実施形態を説明するための、カセッテの一例の概略構成を示す分解図である。It is an exploded view showing a schematic structure of an example of a cassette for explaining an embodiment of the present invention. 図１のカセッテのＡ−Ａ線断面図である。FIG. 2 is a cross-sectional view of the cassette of FIG. 1 taken along the line AA. 図１のカセッテの放射線検出媒体を説明する模式図である。It is a schematic diagram explaining the radiation detection medium of the cassette of FIG. 図１のカセッテの他の一例の構成を模式的に示す断面図である。It is sectional drawing which shows typically the structure of another example of the cassette of FIG. 図１のカセッテのさらに他の一例の構成を示す模式図である。It is a schematic diagram which shows the structure of another example of the cassette of FIG. 図１のカセッテのさらに他の一例の構成を示す模式図である。It is a schematic diagram which shows the structure of another example of the cassette of FIG. 図１のカセッテのさらに他の一例の構成を示す模式図である。It is a schematic diagram which shows the structure of another example of the cassette of FIG. 図１のカセッテのさらに他の一例の構成を模式的に示す拡大断面図である。It is an expanded sectional view which shows typically the structure of another example of the cassette of FIG.

図１は、本発明の実施形態を説明するための、カセッテの一例の概略構成を模式的に示す分解図であり、図２は、図１のカセッテのＡ−Ａ線断面図である。 FIG. 1 is an exploded view schematically showing a schematic configuration of an example of a cassette for explaining an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the cassette of FIG.

カセッテ１は、Ｘ線検出媒体としてのＦＰＤ４及びＦＰＤ４を支持する支持体５を有する撮像部２と、撮像部２を非固定状態で収納する筺体３を含んで構成される。また、カセッテ１は、撮像部２のＦＰＤ２に動作電力を供給するバッテリーパック（図示せず）等を含んで構成される（ＦＩＧ．１Ａ）。 The cassette 1 includes an FPD 4 as an X-ray detection medium and an imaging unit 2 having a support 5 that supports the FPD 4 and a housing 3 that stores the imaging unit 2 in an unfixed state. The cassette 1 includes a battery pack (not shown) that supplies operating power to the FPD 2 of the imaging unit 2 (FIG. 1A).

なお、非固定状態とは、撮像部２が筐体３に対して固着されてはいない状態をいう。例えば、撮像部２を筐体３に接着して固定したり、ねじ止めなどの締結手段により固定したりしていない状態をいう。 The non-fixed state refers to a state where the imaging unit 2 is not fixed to the housing 3. For example, it means a state where the imaging unit 2 is not fixed to the housing 3 by being bonded or fixed by fastening means such as screwing.

筐体３は、略矩形状の天板部３１ａ及び天板部３１ａの四辺の縁部に立設された枠状の側壁部３１ｂを有するフロント部材３１と、フロント部材３１の底部開口を塞ぐ平板状のバック部材３２とで構成されている。バック部材３２がフロント部材３１に嵌め込まれることで、遮光された箱型の閉空間が形成され、撮像部２は、閉空間に収納されている。 The housing 3 includes a front member 31 having a substantially rectangular top plate portion 31a and a frame-like side wall portion 31b erected on the edges of the four sides of the top plate portion 31a, and a flat plate covering the bottom opening of the front member 31. And a back member 32 having a shape. By fitting the back member 32 into the front member 31, a box-shaped closed space that is shielded from light is formed, and the imaging unit 2 is housed in the closed space.

被写体を透過したＸ線は、フロント部材３１の天板部３１ａを透過して、筐体３の内部に収納された撮像部２に入射する。天板部３１ａは、Ｘ線透過性に優れる材料によって形成され、強度重量比なども考慮して、典型的にはアルミニウムやマグネシウムなどの軽金属材料や、炭素繊維強化樹脂（ＣＦＲＰ：carbon fiber reinforced plastics）などの樹脂材料が用いられる。 The X-ray that has passed through the subject passes through the top plate portion 31 a of the front member 31 and enters the imaging unit 2 housed in the housing 3. The top plate portion 31a is formed of a material having excellent X-ray permeability, and is typically made of a light metal material such as aluminum or magnesium, carbon fiber reinforced plastics (CFRP: carbon fiber reinforced plastics) in consideration of the strength / weight ratio. ) Or the like is used.

このように、カセッテ１においては、フロント部材３１の側壁部３１ｂは、天板部３１ａと同一の材料によって一体に形成されている。天板部及３１ａ及び側壁部３１ｂが一体に形成されることによって、フロント部材３１の強度が向上し、特に天板部３１ａのねじれに対する耐性が向上する。 Thus, in the cassette 1, the side wall part 31b of the front member 31 is integrally formed with the same material as the top plate part 31a. By integrally forming the top plate portion 31a and the side wall portion 31b, the strength of the front member 31 is improved, and in particular, resistance to twisting of the top plate portion 31a is improved.

天板部３１ａ及び側壁部３１ｂを形成する材料として、上記のアルミニウムやマグネシウムを用いる場合には、例えばダイカスト成形により天板部３１ａ及び側壁部３１ｂを一体に形成することができる。また、炭素繊維強化樹脂を用いる場合には、例えば圧縮成形により、天板部３１ａ及び側壁部３１ｂを一体に形成することができる。 When the above-described aluminum or magnesium is used as a material for forming the top plate portion 31a and the side wall portion 31b, the top plate portion 31a and the side wall portion 31b can be integrally formed by die casting, for example. Moreover, when using carbon fiber reinforced resin, the top-plate part 31a and the side wall part 31b can be integrally formed, for example by compression molding.

図１に示されるように、天板部３１ａ及び側壁部３１ｂが一体に形成されることにより、フロント部材３１の四隅の角部に面取りが施されている。 As shown in FIG. 1, the top plate portion 31 a and the side wall portion 31 b are integrally formed so that the corner portions of the four corners of the front member 31 are chamfered.

バック部材３２も、強度重量比などを考慮して、典型的にはアルミニウムやマグネシウムなどの軽金属材料や、ＣＦＲＰなどの樹脂材料が用いて形成されている。 The back member 32 is also typically formed using a light metal material such as aluminum or magnesium, or a resin material such as CFRP in consideration of the strength-weight ratio.

なお、筐体３は図１に示される構造に限られない。例えば、フロント部材３１ではなく、バック部材３２が側壁部を有していてもよい。また、フロント部材３１とバック部材３２のいずれも側壁部を有し、互いの側壁部が組み合わさって、撮像部２の閉空間が形成されるようにしてもよい。 The housing 3 is not limited to the structure shown in FIG. For example, not the front member 31 but the back member 32 may have a side wall portion. Further, both the front member 31 and the back member 32 may have side walls, and the side walls may be combined to form the closed space of the imaging unit 2.

図２に示すように、撮像部２は、Ｘ線検出媒体としてのＦＰＤ４及びＦＰＤ４が固着される支持体５を含んで構成される。撮像部２は、主にＸ線の入射方向と平行な方向の衝撃を吸収する緩衝材２４及び緩衝材２５とをさらに含んで構成される。 As shown in FIG. 2, the imaging unit 2 includes an FPD 4 as an X-ray detection medium and a support 5 to which the FPD 4 is fixed. The imaging unit 2 further includes a buffer material 24 and a buffer material 25 that mainly absorb an impact in a direction parallel to the X-ray incident direction.

ＦＰＤ４は、Ｘ線を電荷に変換して蓄積する複数の画素４０が平板状の基板４１に配された受像部２１と、後述する走査回路４２や信号処理回路４３等が実装された回路基板２６と、受像部２１と回路基板２６を接続するフレキシブル回路基板２７を有する。 The FPD 4 includes an image receiving unit 21 in which a plurality of pixels 40 that convert X-rays into electric charges and are stored on a flat substrate 41, and a circuit board 26 on which a scanning circuit 42, a signal processing circuit 43, and the like, which will be described later, are mounted. And a flexible circuit board 27 for connecting the image receiving unit 21 and the circuit board 26.

支持体５は、平板状の基材２２と、受像部２１の受像面と直交する方向に延びる複数の脚部２３と、回路基板２６をＸ線から遮蔽するＸ線遮蔽材２８とを含んで構成される。 The support 5 includes a flat substrate 22, a plurality of legs 23 extending in a direction orthogonal to the image receiving surface of the image receiving unit 21, and an X-ray shielding material 28 that shields the circuit board 26 from X-rays. Composed.

撮像部２は、Ｘ線遮蔽材２８、緩衝材２５、受像部２１及び緩衝材２４が、基材２２の上にこの順に積層されて構成されている。これにより、ＦＰＤ４の受像部２１が、支持体５に支持されている。 The imaging unit 2 is configured by laminating an X-ray shielding material 28, a buffer material 25, an image receiving unit 21, and a buffer material 24 on a base material 22 in this order. Thereby, the image receiving portion 21 of the FPD 4 is supported by the support 5.

緩衝材２４は、天板部３１ａとこれに対向する受像部２１の間に設けられている。このため、カセッテ１が受けた衝撃のうち、主に天板部３１ａが受けた衝撃を緩衝材２４が吸収し、筐体３から受像部２１に直接衝撃が伝わらずに済む。なお、緩衝材２４は、天板部３１ａには接着されていない。単に、天板部３１ａと僅かな隙間を空けて配置されてもよく、天板部３１ａに圧接されてもよい。一方、緩衝材２４は、受像部２１に接着等により固着されている。 The buffer material 24 is provided between the top plate portion 31a and the image receiving portion 21 facing the top plate portion 31a. For this reason, out of the impact received by the cassette 1, the shock received mainly by the top plate portion 31 a is absorbed by the buffer material 24, so that the impact is not transmitted directly from the housing 3 to the image receiving portion 21. The buffer material 24 is not bonded to the top plate portion 31a. It may simply be arranged with a slight gap from the top plate portion 31a, or may be pressed against the top plate portion 31a. On the other hand, the buffer material 24 is fixed to the image receiving portion 21 by adhesion or the like.

受像部２１は、緩衝材２４と緩衝材２５の間に設けられている。図２に示すように、受像部２１の基板４１の外縁４１ａは、受像部２１の受像面と平行な方向において、基材２２の外縁２２ａよりも内側に位置している。なお、受像部２１は、緩衝材２５に接着等により固着されている。 The image receiving unit 21 is provided between the buffer material 24 and the buffer material 25. As shown in FIG. 2, the outer edge 41 a of the substrate 41 of the image receiving unit 21 is located on the inner side of the outer edge 22 a of the base member 22 in a direction parallel to the image receiving surface of the image receiving unit 21. The image receiving portion 21 is fixed to the buffer material 25 by adhesion or the like.

緩衝材２５は、受像部２１と支持体５の間に設けられている。図２に示すように、受像部２１とＸ線遮蔽材２８の間に設けられている。このため、カセッテ１が受けた衝撃が、受像部２１により伝わりにくくすることができる。なお、図２では、受像部２１と同様、受像部２１の受像面と平行な方向において、緩衝材２５は基材２２よりも小さく形成されているが、これよりも大きく形成されてもよい。例えば、基材２２と同じ大きさで形成されてもよい。 The buffer material 25 is provided between the image receiving unit 21 and the support 5. As shown in FIG. 2, it is provided between the image receiving portion 21 and the X-ray shielding material 28. For this reason, the impact received by the cassette 1 can be made difficult to be transmitted by the image receiving unit 21. In FIG. 2, like the image receiving unit 21, the buffer material 25 is formed smaller than the base material 22 in the direction parallel to the image receiving surface of the image receiving unit 21, but may be formed larger than this. For example, it may be formed in the same size as the base material 22.

Ｘ線遮蔽材２８は、緩衝材２５と基材２２の間に設けられている。Ｘ線遮蔽材２８としては、例えば、銅、鉛、タングステンやモリブデンなどのＸ線吸収能に優れる重金属材料を用いることができる。なお、図２では、受像部２１と同様、受像部２１の受像面と平行な方向において、基材２２よりも小さく形成されているが、これより大きく形成されてもよい。例えば、基材２２と同じ大きさで形成されてもよい。 The X-ray shielding material 28 is provided between the buffer material 25 and the base material 22. As the X-ray shielding material 28, for example, a heavy metal material having excellent X-ray absorption ability such as copper, lead, tungsten, and molybdenum can be used. In FIG. 2, the image receiving unit 21 is formed smaller than the base material 22 in the direction parallel to the image receiving surface of the image receiving unit 21, but may be formed larger than this. For example, it may be formed in the same size as the base material 22.

基材２２は、比較的剛性に優れる基材で構成される。例えば、強度重量比を考慮して、例えば、アルミニウムやマグネシウムなどの軽金属材料や、ＣＦＲＰなどの樹脂材料を用いることができる。 The base material 22 is composed of a base material that is relatively excellent in rigidity. For example, considering the strength-weight ratio, for example, a light metal material such as aluminum or magnesium or a resin material such as CFRP can be used.

そして、図２に示すように、基材２２の外縁２２ａは、受像部２１の受像面と平行な方向において、受像部２１の基板４１の外縁４１ａよりも外側に位置している。すなわち、受像部２１の受像面と平行な方向において、基材２２は受像部２１の基板４１よりも突出する。基材２２の外縁２２ａが基板４１の外縁４１ａよりも、筐体３の側壁部３１ｂに対して近傍に位置する。また、Ｘ線の入射方向から見たときには、受像部２１の基板４１の面積よりも基材２２の面積が大きい。 As shown in FIG. 2, the outer edge 22 a of the base material 22 is located outside the outer edge 41 a of the substrate 41 of the image receiving unit 21 in a direction parallel to the image receiving surface of the image receiving unit 21. That is, the base material 22 protrudes from the substrate 41 of the image receiving unit 21 in a direction parallel to the image receiving surface of the image receiving unit 21. The outer edge 22 a of the base material 22 is located closer to the side wall portion 31 b of the housing 3 than the outer edge 41 a of the substrate 41. Further, when viewed from the X-ray incident direction, the area of the base material 22 is larger than the area of the substrate 41 of the image receiving unit 21.

このように、カセッテ１が衝撃を受けても、ＦＰＤ４の受像部２１の基板４１よりもこれを支持する支持体５の基材２２が大きく形成されているため、受像部２１に直接衝撃が伝わることがなく、受像部２１の基板４１が損傷しにくい。 Thus, even when the cassette 1 is subjected to an impact, the base material 22 of the support 5 that supports the substrate 41 of the image receiving unit 21 of the FPD 4 is formed larger than the substrate 41, so that the impact is directly transmitted to the image receiving unit 21. The substrate 41 of the image receiving unit 21 is not easily damaged.

また、基材２２は、筐体３の底部開口に嵌るようになっている。図２では、基材２２の外縁２２ａが、筐体３の側壁部３１ｂと当接する。すなわち、基材２２の外縁２２ａによって、受像部２１の受像面と平行な方向において、撮像部２が位置決めされるようになっている。 Further, the base material 22 is adapted to fit into the bottom opening of the housing 3. In FIG. 2, the outer edge 22 a of the base material 22 contacts the side wall portion 31 b of the housing 3. That is, the imaging unit 2 is positioned in the direction parallel to the image receiving surface of the image receiving unit 21 by the outer edge 22 a of the base material 22.

このように、支持体５を構成する基材２２が、撮像部２を筐体３の内部で固定する役割を果たすため、カセッテ１が衝撃を受けても、受像部２１を含むＦＰＤ４が筐体３の内部で過剰にぐらつくことがない。また、カセッテ１に用いる部材を減らすことができ、カセッテ１の簡素化することができる。 Thus, since the base material 22 constituting the support 5 plays a role of fixing the imaging unit 2 inside the housing 3, even when the cassette 1 receives an impact, the FPD 4 including the image receiving unit 21 is the housing. There is no excessive wobble in the inside of 3. Moreover, the member used for the cassette 1 can be reduced and the cassette 1 can be simplified.

脚部２３は、基材２２上に積層される受像部２１等、撮像部２全体を支持することができるように２次元状に配列しており、各脚部２３は所定の高さを有する円柱形状で構成される（ＦＩＧ．１Ａ）。さらに、脚部２３は、筐体３のバック部材３２に当接し、受像部２１の受像面と直交する方向において、撮像部２を位置決めする。 The leg portions 23 are two-dimensionally arranged so as to support the entire imaging unit 2 such as the image receiving unit 21 stacked on the base material 22, and each leg portion 23 has a predetermined height. It is configured in a cylindrical shape (FIG. 1A). Further, the leg portion 23 abuts on the back member 32 of the housing 3 and positions the imaging unit 2 in a direction orthogonal to the image receiving surface of the image receiving unit 21.

以上のように、支持体５を構成する脚部２３が撮像部２を筐体３の内部で固定する役割を果たすため、カセッテ１が衝撃を受けても、受像部２１を含むＦＰＤ４が筐体３の内部で過剰にぐらつくことがない。また、カセッテ１に用いる部材を減らすことができ、カセッテ１の簡素化を図ることができる。 As described above, since the leg portion 23 constituting the support 5 plays a role of fixing the imaging unit 2 inside the housing 3, even if the cassette 1 receives an impact, the FPD 4 including the image receiving unit 21 is the housing. There is no excessive wobble in the inside of 3. Moreover, the member used for the cassette 1 can be reduced and the cassette 1 can be simplified.

なお、脚部２３も、基材２２と同じように比較的剛性に優れる基材で構成されてもよい。そして、圧縮成形により、基材２２と脚部２３を一体的に形成してもよい。 In addition, the leg part 23 may also be comprised with the base material which is comparatively excellent in rigidity like the base material 22. FIG. And you may form the base material 22 and the leg part 23 integrally by compression molding.

また、２次元状に配列した円柱形状の脚部２３を示したが、これに限られない。パーティションのようなリブ構造を採用し、凹部に回路基板２６を分割して実装してもよい。例えば、１次元状にリブ２３ａを配列してもよい（ＦＩＧ．１Ｂ）。回路基板２６がリブ構造の凹部に実装できる限り、２次元状にリブ２３ａを配列してもよい。リブ構造であれば、面荷重に対して荷重の集中が分散されるため、カセッテ１が破壊されにくい。 Moreover, although the cylindrical leg portions 23 arranged two-dimensionally are shown, the present invention is not limited to this. A rib structure such as a partition may be employed, and the circuit board 26 may be divided and mounted in the recess. For example, the ribs 23a may be arranged one-dimensionally (FIG. 1B). As long as the circuit board 26 can be mounted in the concave portion of the rib structure, the ribs 23a may be arranged two-dimensionally. With the rib structure, the load concentration is dispersed with respect to the surface load, so that the cassette 1 is not easily broken.

なお、撮像部２は筐体３に対して非固定状態であり、支持体５の基材２２の外縁２２ａと筐体３の側壁部３１ｂは接着されておらず、支持体５の脚部２３と筐体３のバック部材３２は接着されていない。このため、ＦＰＤ４を含む撮像部２に損傷が発生した場合のリワーク性が向上している。 The imaging unit 2 is not fixed to the housing 3, and the outer edge 22 a of the base material 22 of the support 5 and the side wall 31 b of the housing 3 are not bonded, and the leg 23 of the support 5. The back member 32 of the housing 3 is not bonded. For this reason, the reworkability when the imaging unit 2 including the FPD 4 is damaged is improved.

回路基板２６は、脚部２３の高さで形成される空間に設けられる。そして、締結等により、支持体５の基材２２に取り付けられている。つまり、天板部３１ａに対向する支持体５の表面側に受像部２１が、また、支持体５の裏面側に走査回路４２や信号処理回路４３などが実装された回路基板２６が、それぞれ取り付けられて支持体５に支持されている。 The circuit board 26 is provided in a space formed at the height of the leg portion 23. And it is attached to the base material 22 of the support body 5 by fastening or the like. That is, the image receiving portion 21 is attached to the front surface side of the support 5 facing the top plate portion 31a, and the circuit board 26 on which the scanning circuit 42 and the signal processing circuit 43 are mounted on the back surface side of the support 5 is attached. And is supported by the support 5.

図３は、図１のカセッテの放射線検出媒体を説明する模式図である。ＦＩＧ．３Ａは、各構成要素の接続関係を示し、ＦＩＧ．３Ｂは、各画素の断面を示す。 FIG. 3 is a schematic diagram for explaining the radiation detection medium of the cassette of FIG. FIG. 3A shows the connection relationship of each component, and FIG. 3B shows a cross section of each pixel.

ＦＰＤ４は、Ｘ線を電荷に変換して蓄積する複数の画素４０が２次元状に配列されてなる受像部２１と、受像部２１からの電荷の読み出しタイミングを制御する走査回路４２と、各画素４０に蓄積された電荷を読み出し、読み出された電荷を画像データに変換して記憶する信号処理回路４３と、画像データを外部機器に送信するデータ送信回路４４とから構成されている。走査回路４２と各画素４０とは、行毎に走査線４５によって接続されており、信号処理回路４３と各画素４０とは、列毎に信号線４６によって接続されている（ＦＩＧ．３Ａ）。 The FPD 4 includes an image receiving unit 21 in which a plurality of pixels 40 that convert X-rays into electric charges and store them in a two-dimensional array, a scanning circuit 42 that controls the timing of reading charges from the image receiving unit 21, and each pixel. The signal processing circuit 43 reads out the charges accumulated in the memory 40, converts the read charges into image data and stores them, and the data transmission circuit 44 that transmits the image data to an external device. The scanning circuit 42 and each pixel 40 are connected to each other by a scanning line 45, and the signal processing circuit 43 and each pixel 40 are connected to each column by a signal line 46 (FIG. 3A).

各画素４０は、Ｘ線の露光によって蛍光を発するシンチレータ４９でＸ線を一旦蛍光に変換し、変換された蛍光をフォトダイオード４７で電荷に変換して蓄積する間接変換型のＸ線検出素子として構成されている（ＦＩＧ．３Ｂ）。シンチレータ４９は、蛍光物質として、例えば、酸化ガドリニウム（Ｇｄ_２Ｏ_３）、硫酸化ガドリウム(Ｇｄ_２Ｏ_３Ｓ)やヨウ化セシウム（ＣｓＩ）を含有する。 Each pixel 40 is an indirect conversion type X-ray detection element that once converts X-rays into fluorescence by a scintillator 49 that emits fluorescence by X-ray exposure, and converts the converted fluorescence into charges by a photodiode 47 and accumulates the charges. (FIG. 3B). The scintillator 49 contains, for example, gadolinium oxide (Gd ₂ O ₃ ), gadolin sulfate (Gd ₂ O ₃ S) or cesium iodide (CsI) as a fluorescent substance.

また、受像部２１は、Ｘ線の入射側から順に、シンチレータ４９、フォトダイオード４７、ＴＦＴスイッチ素子４８、基板４１の順に並ぶように構成されている。 The image receiving unit 21 is configured so that the scintillator 49, the photodiode 47, the TFT switch element 48, and the substrate 41 are arranged in this order from the X-ray incident side.

このため、フォトダイオード４７は、アクティブマトリクス型の薄膜トランジスタ（ＴＦＴ：Thin Film Transistor）アレイが形成された基板４１上に形成される。具体的には、受像部２１は、基板４１上に、薄膜トランジスタアレイを形成し、その上方にフォトダイオード４７を積層した積層構造を有する（ＦＩＧ．３Ｂ）。 Therefore, the photodiode 47 is formed on the substrate 41 on which an active matrix type thin film transistor (TFT) array is formed. Specifically, the image receiving unit 21 has a laminated structure in which a thin film transistor array is formed on a substrate 41 and a photodiode 47 is laminated thereon (FIG. 3B).

ＴＦＴアレイを構成する各ＴＦＴスイッチ素子４８において、ＴＦＴスイッチ素子４８のゲート電極４８ｂが走査線４５に、ソース電極４８ａがフォトダイオード４７に、ドレイン電極４８ｃが信号線４６にそれぞれ接続される。ＴＦＴスイッチ素子４８が走査回路４２からの駆動パルスによってＯＮ状態になると、フォトダイオード４７に蓄積された電荷が信号線４６に読み出される。 In each TFT switch element 48 constituting the TFT array, the gate electrode 48 b of the TFT switch element 48 is connected to the scanning line 45, the source electrode 48 a is connected to the photodiode 47, and the drain electrode 48 c is connected to the signal line 46. When the TFT switch element 48 is turned on by the drive pulse from the scanning circuit 42, the charge accumulated in the photodiode 47 is read out to the signal line 46.

信号処理回路４３は、積分アンプ回路、Ａ／Ｄ変換器、補正回路、及び画像メモリ（いずれも図示せず）により構成されている。積分アンプ回路は、各画素４０から信号線４６を介して出力された電荷を積分して電圧信号（画像信号）に変換して、Ａ／Ｄ変換器に入力する。Ａ／Ｄ変換器は、入力された画像信号をデジタルの画像データに変換して補正回路に入力する。補正回路は、画像データに対して、オフセット補正やゲイン補正などの補正処理を行い、補正後の画像データを画像メモリに記憶させる。 The signal processing circuit 43 includes an integrating amplifier circuit, an A / D converter, a correction circuit, and an image memory (all not shown). The integrating amplifier circuit integrates the charges output from each pixel 40 via the signal line 46, converts them into a voltage signal (image signal), and inputs it to the A / D converter. The A / D converter converts the input image signal into digital image data and inputs the digital image data to the correction circuit. The correction circuit performs correction processing such as offset correction and gain correction on the image data, and stores the corrected image data in the image memory.

なお、各画素４０は、アモルファスセレン等の変換層でＸ線を電荷に直接変換し、変換された電荷を変換層の下部の電極に接続されたキャパシタに蓄積する直接変換型の素子として構成してもよい。 Each pixel 40 is configured as a direct conversion type element that directly converts X-rays into electric charges in a conversion layer such as amorphous selenium and accumulates the converted electric charges in a capacitor connected to an electrode below the conversion layer. May be.

また、ＦＰＤ４は、１画素の受光率を高めるために、フォトダイオード４７の面積を大きくする観点から、スイッチ素子４８等とフォトダイオード４７を別の層に設ける、いわゆる２階建ての構造を採用しているが、これに限られず、これらを同じ層に設ける構造を採用してもよい。 The FPD 4 employs a so-called two-story structure in which the switch element 48 and the photodiode 47 are provided in separate layers from the viewpoint of increasing the area of the photodiode 47 in order to increase the light receiving rate of one pixel. However, the present invention is not limited to this, and a structure in which these are provided in the same layer may be adopted.

また、以上の各画素４０、走査回路４２、信号処理回路４３及びデータ送信回路４４には、バッテリーパックを含む電源部（図示せず）から動作電力が供給される。なお、電源部と各画素４０、走査回路４２、信号処理回路４３及びデータ送信回路４４を接続する配線は図示を省略する。 In addition, operating power is supplied to each pixel 40, the scanning circuit 42, the signal processing circuit 43, and the data transmission circuit 44 from a power supply unit (not shown) including a battery pack. Note that the wiring connecting the power supply unit to each pixel 40, the scanning circuit 42, the signal processing circuit 43, and the data transmission circuit 44 is not shown.

以上、カセッテ１によれば、カセッテ１が衝撃を受けた際に、ＦＰＤ４の受像部２１の基板４１よりもこれを支持する支持体５の基材２２が大きく形成されているため、受像部２１に直接衝撃が伝わることがなく、受像部２１の基板４１が損傷しにくい。すなわち、カセッテ１の形状に起因した衝撃脆弱性に対して対策を施し、耐衝撃性を強化したカセッテを得ることができる。 As described above, according to the cassette 1, when the cassette 1 receives an impact, the base material 22 of the support 5 that supports the substrate 41 of the image receiving unit 21 of the FPD 4 is formed larger than the image receiving unit 21. The substrate 41 of the image receiving unit 21 is not easily damaged. That is, it is possible to obtain a cassette with improved impact resistance by taking measures against the impact vulnerability due to the shape of the cassette 1.

また、受像部２１は、フォトダイオード４７をスイッチング素子４８の上方に積層した積層構造を有するため、筐体３１の側壁部３１ｂから伝わる衝撃に弱くなりやすい。このため、本構成を採用することによる効果が大きい。 In addition, since the image receiving unit 21 has a stacked structure in which the photodiode 47 is stacked above the switching element 48, the image receiving unit 21 tends to be weak against an impact transmitted from the side wall 31 b of the housing 31. For this reason, the effect by employ | adopting this structure is large.

また、受像部２１のシンチレータ４９の蛍光物質としてヨウ化セシウム（ＣｓＩ）を採用すると、他の蛍光物質を用いたときよりもシンチレータ４９はもろくなるため、本構成を採用することによる効果が大きい。 Further, when cesium iodide (CsI) is employed as the fluorescent material of the scintillator 49 of the image receiving unit 21, the scintillator 49 becomes fragile as compared with the case where other fluorescent materials are used.

次に図４〜図８を用いて、カセッテ１の変形例を示す。以下、カセッテ１と同様の機能を有する構成要素については、同一の符号を付し、その記載を適宜省略する。 Next, modification examples of the cassette 1 will be described with reference to FIGS. Hereinafter, components having the same functions as those of the cassette 1 are denoted by the same reference numerals, and description thereof is omitted as appropriate.

図４は、図１のカセッテの他の一例の構成を模式的に示す断面図である。 FIG. 4 is a cross-sectional view schematically showing the configuration of another example of the cassette of FIG.

カセッテ４は、支持体５がさらに熱分散部材２９を有する点で、カセッテ１と異なる。 The cassette 4 is different from the cassette 1 in that the support 5 further includes a heat dispersion member 29.

熱分散部材２９は、基材２２と脚部２３の間に設けられる。このため、脚部２３が熱分散部材２９に固着されるとともに、回路基板２６が、締結等により熱分散部材２９に取り付けられる。熱分散部材２９は、例えば、薄板金属板で構成される。 The heat dispersion member 29 is provided between the base material 22 and the legs 23. For this reason, the leg portion 23 is fixed to the heat dispersion member 29 and the circuit board 26 is attached to the heat dispersion member 29 by fastening or the like. The heat dispersion member 29 is made of, for example, a thin metal plate.

このように、熱分散部材２９を設けることによって、回路基板２６等で生じる熱がＦＰＤ４を含む撮像部２の全体に拡散されるため、カセッテ１を長時間安定的に動作させることができる。 Thus, by providing the heat dispersion member 29, heat generated in the circuit board 26 and the like is diffused throughout the imaging unit 2 including the FPD 4, so that the cassette 1 can be stably operated for a long time.

図５は、図１のカセッテのさらに他の一例の構成を示す模式図である。ＦＩＧ．５Ａは、カセッテの断面を示し、ＦＩＧ．５Ｂは、カセッテのＣ−Ｃ線の位置での断面を示す。 FIG. 5 is a schematic diagram showing the configuration of still another example of the cassette of FIG. FIG. 5A shows a cross section of the cassette, FIG. 5B shows a cross section at the position of the CC line of the cassette.

カセッテ５Ａは、支持体５の基材２２と筐体３の側壁部２２間に挟まれる緩衝材５１が設けられている点で、カセッテ１と異なる。 The cassette 5 </ b> A is different from the cassette 1 in that a cushioning material 51 is provided between the base material 22 of the support 5 and the side wall portion 22 of the housing 3.

緩衝材５１は、支持体５の基材２２と筐体３の側壁部３１ｂの間に設けられ（ＦＩＧ．５Ａ）、基材２２の外縁２２ａの全周を囲むようにして設けられている（ＦＩＧ．５Ｂ）。基材２２は、緩衝材５１に接していてもよく、外側に向かって緩衝材５１にめり込まれていてもよい。 The buffer material 51 is provided between the base material 22 of the support 5 and the side wall 31b of the housing 3 (FIG. 5A), and is provided so as to surround the entire circumference of the outer edge 22a of the base material 22 (FIG. 5). 5B). The base material 22 may be in contact with the buffer material 51 or may be recessed into the buffer material 51 toward the outside.

このように、緩衝材５１を設けることによって、カセッテ１が受ける衝撃が、支持体５にも伝わりにくくなるため、受像部２１の基板４１の損傷の可能性を低くすることができる。 In this way, by providing the buffer material 51, the impact received by the cassette 1 is not easily transmitted to the support 5, and therefore the possibility of damage to the substrate 41 of the image receiving unit 21 can be reduced.

図６は、図１のカセッテのさらに他の一例の構成を示す模式図である。ＦＩＧ．６Ａは、カセッテの断面を示し、ＦＩＧ．６Ｂは、カセッテのＣ−Ｃ線の位置での断面を示す。 FIG. 6 is a schematic diagram showing the configuration of still another example of the cassette of FIG. FIG. 6A shows a cross section of the cassette, FIG. 6B shows a cross section at the position of the CC line of the cassette.

カセッテ６は、支持体５の基材２２と筐体３の側壁部２２の間に挟まれる複数の位置決め部材６１が設けられている点で、カセッテ１と異なる。 The cassette 6 is different from the cassette 1 in that a plurality of positioning members 61 sandwiched between the base material 22 of the support 5 and the side wall portion 22 of the housing 3 are provided.

各位置決め部材６１は、基材２２の四隅の角部２２ｂに各々に対応して設けられる。そして、各位置決め部材６１は、対応する角部２２ｂの形状に合わせて形成され、対応する角部２２ｂを支持する。例えば、図６に示すように、各位置決め部材６１は、Ｌ字断面形状を有し、このＬ字断面形状の下部は、脚部２３の高さと略同一の高さを有する。位置決め部材６１は、例えば、樹脂や弾性体で構成される。 Each positioning member 61 is provided corresponding to each of the corners 22 b at the four corners of the base material 22. Each positioning member 61 is formed in accordance with the shape of the corresponding corner 22b and supports the corresponding corner 22b. For example, as shown in FIG. 6, each positioning member 61 has an L-shaped cross-sectional shape, and a lower portion of the L-shaped cross-sectional shape has a height substantially equal to the height of the leg portion 23. The positioning member 61 is made of, for example, a resin or an elastic body.

また、各位置決め部材６１は、筐体３の側壁部３１ｂとバック部材３２に当接する。撮像部２を筐体３内に収納した際、位置決め部材６１を撮像部２や筐体３に接着してもよいが、リワーク性の観点から、位置決め部材６１を、撮像部２にも筐体３にも接着しない方が好ましい。 Each positioning member 61 abuts against the side wall portion 31 b of the housing 3 and the back member 32. When the imaging unit 2 is housed in the housing 3, the positioning member 61 may be adhered to the imaging unit 2 or the housing 3, but the positioning member 61 is also mounted on the imaging unit 2 from the viewpoint of reworkability. 3 is preferably not adhered.

このように、位置決め部材６１を設けることによって、少なくとも、受像部２１の受像面と直交する方向において、撮像部２の位置決めをすることができる。特に、撮像部２の位置を微調整したい場合でも位置決め部材６１を調整するだけで済み、撮像部２の位置調整が容易になる。 Thus, by providing the positioning member 61, the imaging unit 2 can be positioned at least in a direction orthogonal to the image receiving surface of the image receiving unit 21. In particular, even when it is desired to finely adjust the position of the imaging unit 2, it is only necessary to adjust the positioning member 61, and the position adjustment of the imaging unit 2 is facilitated.

図７は、図１のカセッテのさらに他の一例の構成を示す模式図である。 FIG. 7 is a schematic diagram showing the configuration of still another example of the cassette of FIG.

カセッテ７は、基板４１の四隅の角部が面取りされている点で、カセッテ１と異なる。 The cassette 7 is different from the cassette 1 in that the four corners of the substrate 41 are chamfered.

カセッテ１においては、基板４１は、Ｘ線の入射方向から見たときに矩形形状を有している。このため、基板４１の角部が鋭角になっており、この角部が損傷しやすい。 In the cassette 1, the substrate 41 has a rectangular shape when viewed from the X-ray incident direction. For this reason, the corner | angular part of the board | substrate 41 is an acute angle, and this corner | angular part is easy to damage.

このため、カセッテ７では、基板４１の四隅の角部を、例えば、受像部２１の受像面と直交する方向に所定の大きさで切断することによって、面取りされた面取り角部４１ｂが形成されている。Ｘ線の入射方向から見れば、各面取り角部４１ｂは、少なくとも２つの鈍角を有する形状になっている。 For this reason, in the cassette 7, the chamfered chamfered corners 41 b are formed by cutting the corners of the four corners of the substrate 41 with a predetermined size in a direction orthogonal to the image receiving surface of the image receiving unit 21, for example. Yes. When viewed from the incident direction of X-rays, each chamfered corner portion 41b has a shape having at least two obtuse angles.

このように、面取り角部４１ｂを形成することによって、カセッテ１の耐衝撃性を向上することができる。 Thus, by forming the chamfered corner portion 41b, the impact resistance of the cassette 1 can be improved.

図８は、図１のカセッテのさらに他の一例の構成を模式的に示す拡大断面図である。 FIG. 8 is an enlarged cross-sectional view schematically showing the configuration of still another example of the cassette of FIG.

カセッテ８は、基板４１の外縁４１ａが面取りされている点で、カセッテ１と異なる。 The cassette 8 differs from the cassette 1 in that the outer edge 41a of the substrate 41 is chamfered.

カセッテ１では、基板４１は、Ｘ線の入射方向から見たときに矩形形状を有している。このため、基板４１の外縁４１ａのうち、筐体３の天板部３１ａに対向する面を構成する上辺を含む部分が鋭角になっている（ＦＩＧ．８の点線部分を参照）。このため、この部分が損傷しやすい。 In the cassette 1, the substrate 41 has a rectangular shape when viewed from the X-ray incident direction. For this reason, the part including the upper side which comprises the surface which opposes the top-plate part 31a of the housing | casing 3 among the outer edges 41a of the board | substrate 41 is an acute angle (refer the dotted-line part of FIG.8). For this reason, this part is easily damaged.

このため、カセッテ８では、基板４１の外縁４１ａのうち、筐体３の天板部３１ａに対向する面を構成する上辺を含む部分を面取りした面取り上辺部４１ｃが形成されている。基板４１の断面では、面取り上辺部４１ｃは、少なくとも２つの鈍角を有する形状になっている。 For this reason, in the cassette 8, a chamfered upper side portion 41 c is formed by chamfering a portion including the upper side constituting the surface facing the top plate portion 31 a of the housing 3 in the outer edge 41 a of the substrate 41. In the cross section of the substrate 41, the chamfered upper side portion 41c has a shape having at least two obtuse angles.

このように、面取り上辺部４１ｃを形成することによって、カセッテ１の耐衝撃性を向上することができる。 Thus, the impact resistance of the cassette 1 can be improved by forming the chamfered upper side portion 41c.

以上の説明においては、図４〜図８を用いて、カセッテ１の変形例を説明したが、カセッテ１に対する変更部分を適宜組み合わせて用いても構わない。 In the above description, the modification example of the cassette 1 has been described with reference to FIGS. 4 to 8, but the changed portions of the cassette 1 may be used in appropriate combination.

また、放射線として一般的なＸ線を用いる場合について説明したが、本発明はＸ線に限られるものではなく、α線、γ線等のＸ線以外の放射線を用いることも可能である。 Moreover, although the case where general X-ray was used as a radiation was demonstrated, this invention is not restricted to X-ray, It is also possible to use radiation other than X-rays, such as an alpha ray and a gamma ray.

以上、説明したように、本明細書には、下記（１）〜（１６）の放射線画像検出装置が開示されている。 As described above, the following (1) to (16) radiological image detection apparatuses are disclosed in the present specification.

（１）放射線を電荷に変換して蓄積する複数の画素が基板に配された平板状の受像部と、上記受像部が固着される支持体とを有する撮像部と、上記撮像部を非固定状態で収納する筐体と、を備え、上記支持体は、上記受像部を支持し、上記支持体の外縁は、上記受像部の受像面と平行な方向において、上記受像部の基板の外縁よりも外側に位置しているカセッテ。
（２）（１）に記載のカセッテであって、上記支持体は、上記筐体の底部に当接し、上記受像部の受像面と直交する方向における撮像部の位置決めを行う脚部を有するカセッテ。
（３）（２）に記載のカセッテであって、上記脚部は、上記筐体の底部に非接着かつ密接したカセッテ。
（４）（２）又は（３）に記載のカセッテであって、上記支持体は、上記受像部の画素の制御を行う回路基板が取り付けられる熱分散部材を有し、熱分散部材に上記脚部が固着されるカセッテ。
（５）（１）から（４）のいずれか一つに記載のカセッテであって、上記支持体の外縁によって、上記受像部の受像面と平行な方向において、上記撮像部は位置決めされるカセッテ。
（６）（１）から（４）のいずれか一つに記載のカセッテであって、上記支持体の各角部に対応付けて設けられるとともに、上記支持体と上記筐体の側壁部との間に設けられる位置決め部材が設けられ、位置決め部材によって、上記受像部の受像面と平行な方向において、上記撮像部は位置決めされるカセッテ。
（７）（１）から（６）のいずれか一つに記載のカセッテであって、上記撮像部は、上記筐体の天板部とこれに対向する上記受像部との間に第１の緩衝材を有するカセッテ。
（８）（１）から（７）のいずれか一つに記載のカセッテであって、上記撮像部は、上記受像部と上記支持体との間に第２の緩衝材を有するカセッテ。
（９）（１）から（８）のいずれか一つに記載のカセッテであって、上記支持体の外縁と上記筐体の側壁部との間に設けられ、外縁の全周を囲むようにして設けられた第３の緩衝材をさらに備えるカセッテ。
（１０）（１）から（９）のいずれか一つに記載のカセッテであって、上記受像部の基板の外縁が面取りされたカセッテ。
（１１）（１）から（１０）のいずれか一つに記載のカセッテであって、上記受像部の基板の複数の角部が面取りされたカセッテ。
（１２）（１）から（１１）のいずれか一つに記載のカセッテであって、上記受像部の基板はガラスで形成されたカセッテ。
（１３）（１）から（１２）のいずれか一つに記載のカセッテであって、上記受像部の各画素は光電変換部とスイッチ素子を有し、スイッチ素子の上方に光電変換部が積層されるカセッテ。
（１４）（１）から（１３）のいずれか一つに記載のカセッテであって、各画素は、上記放射線の露光によって蛍光を発し、蛍光物質を含有するシンチレータからの蛍光を電荷に変換して蓄積するように構成されたカセッテ。
（１５）（１４）に記載のカセッテであって、上記受像部は、上記放射線の入射側から順に上記シンチレータ、上記基板の順に並んでいるカセッテ。
（１６）（１４）又は（１５）に記載のカセッテであって、上記シンチレータは上記蛍光物質として、ヨウ化セシウム（ＣｓＩ）を含有するカセッテ。 (1) An imaging unit having a flat image receiving unit in which a plurality of pixels for converting and storing radiation into electric charges are arranged on a substrate, a support to which the image receiving unit is fixed, and the imaging unit are not fixed And the support supports the image receiving portion, and the outer edge of the support is in a direction parallel to the image receiving surface of the image receiving portion from the outer edge of the substrate of the image receiving portion. The cassette is also located outside.
(2) The cassette according to (1), wherein the support is in contact with a bottom portion of the housing and has a leg portion for positioning the imaging unit in a direction orthogonal to the image receiving surface of the image receiving unit. .
(3) The cassette according to (2), wherein the leg portion is non-adhered and in close contact with the bottom portion of the casing.
(4) The cassette according to (2) or (3), wherein the support includes a heat dispersion member to which a circuit board for controlling pixels of the image receiving unit is attached, and the legs are attached to the heat dispersion member. A cassette to which the part is fixed.
(5) The cassette according to any one of (1) to (4), wherein the imaging unit is positioned in a direction parallel to an image receiving surface of the image receiving unit by an outer edge of the support. .
(6) The cassette according to any one of (1) to (4), wherein the cassette is provided in association with each corner of the support, and the support and the side wall of the housing. A cassette provided with a positioning member provided therebetween, wherein the imaging unit is positioned by the positioning member in a direction parallel to the image receiving surface of the image receiving unit.
(7) The cassette according to any one of (1) to (6), wherein the imaging unit includes a first unit between a top plate part of the housing and the image receiving part facing the first plate part. A cassette with cushioning material.
(8) The cassette according to any one of (1) to (7), wherein the imaging unit includes a second cushioning material between the image receiving unit and the support.
(9) The cassette according to any one of (1) to (8), provided between the outer edge of the support and the side wall of the housing, and provided to surround the entire periphery of the outer edge. A cassette further comprising the third cushioning material formed.
(10) The cassette according to any one of (1) to (9), wherein the outer edge of the substrate of the image receiving unit is chamfered.
(11) The cassette according to any one of (1) to (10), wherein a plurality of corners of the substrate of the image receiving unit are chamfered.
(12) The cassette according to any one of (1) to (11), wherein the substrate of the image receiving unit is formed of glass.
(13) The cassette according to any one of (1) to (12), wherein each pixel of the image receiving unit includes a photoelectric conversion unit and a switch element, and the photoelectric conversion unit is stacked above the switch element. Cassette.
(14) The cassette according to any one of (1) to (13), wherein each pixel emits fluorescence by exposure to the radiation, and converts fluorescence from the scintillator containing the fluorescent material into electric charge. Cassette configured to accumulate.
(15) The cassette according to (14), wherein the image receiving unit is arranged in the order of the scintillator and the substrate in order from the radiation incident side.
(16) The cassette according to (14) or (15), wherein the scintillator contains cesium iodide (CsI) as the fluorescent material.

１カセッテ
２撮像部
３筐体
４ＦＰＤ
５支持体
２１受像部
２２基材
２３脚部
２４緩衝材
２５緩衝材
２６回路基板
２７フレキシブル回路基板
２８Ｘ線遮蔽材 1 Cassette 2 Imaging unit 3 Housing 4 FPD
DESCRIPTION OF SYMBOLS 5 Support body 21 Image receiving part 22 Base material 23 Leg part 24 Buffer material 25 Buffer material 26 Circuit board 27 Flexible circuit board 28 X-ray shielding material

Claims

An imaging unit having a flat image receiving unit in which a plurality of pixels for converting radiation into electric charges and storing the same are arranged on a substrate; and a support to which the image receiving unit is fixed;
A housing that houses the imaging unit;
A heat dispersion member to which a circuit board for controlling the pixels of the image receiving unit is attached;
With
The image receiving portion, the support, and the heat dispersion member are stacked in this order,
The imaging unit is stored in a state not fixed to the housing,
The support includes a base material that supports the image receiving portion, and a leg portion ,
The outer edge of the base material is located outside the outer edge of the substrate of the image receiving unit in a direction parallel to the image receiving surface of the image receiving unit,
The imaging unit is positioned in a direction parallel to the image receiving surface of the image receiving unit by the outer edge of the base material abutting on the side wall of the housing without a cushioning material and fitting into the housing .
The imaging unit is positioned in a direction orthogonal to the image receiving surface of the image receiving unit, by the leg part contacting the bottom of the housing,
The heat dissipating member is a cassette provided between the base and the leg and fixed to the leg .

The cassette according to claim 1,
The heat dispersion member is a cassette that supports the image receiving unit integrally with the support.

The cassette according to claim 1 or 2,
An outer edge of the heat dispersion member is a cassette positioned outside the outer edge of the substrate of the image receiving unit in a direction parallel to the image receiving surface of the image receiving unit.

The cassette according to any one of claims 1 to 3 ,
The legs are cassettes that are non-adhered and intimately contact the bottom of the housing.

The cassette according to any one of claims 1 to 4 ,
The heat dispersion member is a cassette constituted by a metal plate.

The cassette according to any one of claims 1 to 5 ,
The imaging unit is a cassette having a first cushioning material between a top plate portion of the housing and the image receiving portion facing the top plate portion.

The cassette according to any one of claims 1 to 6 ,
The imaging unit is a cassette having a second cushioning material between the image receiving unit and the support.

The cassette according to any one of claims 1 to 7 ,
A cassette in which an outer edge of a substrate of the image receiving unit is chamfered.

The cassette according to any one of claims 1 to 8 ,
A cassette in which a plurality of corners of the substrate of the image receiving unit are chamfered.

The cassette according to any one of claims 1 to 9 ,
The image receiving unit substrate is a cassette made of glass.

The cassette according to any one of claims 1 to 10 ,
Each of the pixels of the image receiving unit has a photoelectric conversion unit and a switch element, and the photoelectric conversion unit is stacked above the switch element.

The cassette according to any one of claims 1 to 11 ,
Each cassette emits fluorescence by exposure to the radiation, and is configured to convert the fluorescence from the scintillator containing the fluorescent material into electric charges and accumulate them.

The cassette according to claim 12 , wherein
The image receiving section is a cassette in which the scintillator and the substrate are arranged in this order from the radiation incident side.

The cassette according to claim 12 or claim 13 ,
The scintillator is a cassette containing at least one selected from the group of cesium iodide, gadolinium oxide, and gadolinium sulfate as the fluorescent material.