JP2000258541A - Radiation-detecting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a compact radiation-detecting device that is capable of detecting a large visual field and whose size is entirely reduced by using a material with the high transmittance of radiation and sufficient mechanical strength and conductivity for a radiation detection surface to reduce the amount of exposure and detection noise, by providing a heat radiation path inside a case for accommodating an X-ray detection part for efficiently radiating heat, furthermore, and by leading the wiring of a TFT array on a substrate to the back-surface side of the substrate through a tab. SOLUTION: An X-ray-detecting device is equipped with an X-ray detection part 1 that detects X rays, a case 2 that accommodates the X-ray detection part 1 or the like, and a detection surface cover part 3 that forms an X-ray detection surface and is joined to the case 2. At the junction between the case and the detection surface cover part 3, mechanical fixing is made by a screw 15, a conductive seal material 16 is applied for electrical connecting, and a sealing property is achieved by an O ring 17. CFRP(carbon fiber reinforced plastic) is used as a material for composing the detection surface cover part 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiation detecting apparatus for detecting radiation such as X-rays and gamma rays used for X-ray photography.

[0002]

2. Description of the Related Art There are several types of X-rays employing a direct conversion method as a radiation detector for detecting radiation such as X-rays and gamma (γ) rays, for example, a flat X-ray detector used in an X-ray diagnostic apparatus. Detection devices have been proposed.

FIG. 1 is a diagram showing a schematic structure of a conventional direct conversion type flat X-ray detecting apparatus. Flat type X shown in FIG.
In the line detecting device, a voltage applying electrode 51 is
X-rays enter the selenium (Se) layer 52 functioning as a photoconductor under a high electric field in a state where a high voltage is applied to the substrate, and the incident X-rays contribute to the generation of electric charges. Electric charges are accumulated in a capacitor 54 provided for each pixel. Therefore, the flat X-ray detector shown in FIG. 1 has an X-ray-to-charge conversion function.

The above-mentioned conventional flat X-ray detector is
Further, it has a function of converting the amount of charge into a voltage, and the charge stored in the capacitor 54 of each pixel is selected by, for example, a thin film transistor (TFT) 55 having a switching function, and the selected charge is configured as a readout circuit. The voltage output is obtained from the charge amplifier by leading to a charge amplifier (readout amplifier). Furthermore, the conventional planar X-ray detector has a function of converting an analog voltage output from a charge amplifier into a digital voltage value (for example, an analog / digital (A / D) converter).

FIG. 2 is a diagram showing a configuration of a conventional flat X-ray detecting apparatus integrally provided with such a conventional X-ray detecting section and readout circuit section. In the conventional flat X-ray detection device shown in FIG. 2, a plurality of pixel electrodes 70 (corresponding to, for example, the charge storage electrodes 53) arranged in a two-dimensional matrix form photoelectrically in accordance with the intensity of incident X-rays. The charge generated in the conversion film (for example, corresponding to the selenium layer 52) is collected. In order to accumulate the charge (pixel charge) collected by the pixel electrode 70, a capacitor 71 (corresponding to, for example, the capacitor 54) used as a charge storage element is connected to the pixel electrode 70. Also,
For example, a plurality of TFTs 72 used as switching elements for reading information corresponding to pixel charges stored in each capacitor are provided as a TFT array.

A gate driver 74, which is a driving circuit for the TFT 72, controls the on / off operation of the TFT 72 on a row basis by supplying a control signal to a gate driving line 73 electrically connected to the gate of the TFT 72 in the same row. I do.
Thus, the output signal of the TFT 72 in the same row is read out to the charge amplifier 76 via the signal line 75 and amplified. Thereafter, the amplified signal is supplied to the multiplexer 77.
Are sequentially selected, converted into digital signals by the A / D converter 78, and output.

[0007]

By the way, the X-ray detecting surface (X-ray incident surface) of the above-mentioned conventional flat type X-ray detecting device.
The device must be electrically conductive because the entire device must function as an electromagnetic wave shield, and must have a certain mechanical strength in consideration of its handling. But that X
When a metal such as aluminum (Al) is used as a material for forming the line detection surface, X
Absorb lines. Therefore, in order to ensure a predetermined contrast in an X-ray image obtained by detecting a predetermined amount of X-rays, it is necessary to make a large amount of X-rays incident, thereby increasing the amount of exposure to the patient. There was a problem that would.

In the above-described flat X-ray detector, an integrated circuit (IC) provided inside the housing is provided.
Although heat is generated from electrical components such as the above, photoconductors and amplifiers are easily affected by such heat. In particular, the characteristics of the photoconductor deteriorate at high temperatures. However, in the conventional planar X-ray detection device, since measures for heat dissipation are not sufficient, there is a problem of heat transfer and heat accumulation to a photoconductor or an amplifier which is easily affected by heat.

Further, in the above-described flat X-ray detector, the TFT array is formed on a glass substrate.
Effective field of view of TFT array with respect to glass substrate (region where voltage application electrode is formed in photoconductor)
In order to make the area as large as possible, it is necessary to make the area of the edge (portion not contributing to the field of view) of the effective field of the TFT array as small as possible. However, usually, at the edge of the effective field of view of the TFT array, a gate driver for driving each TFT and a readout circuit for reading out information on electric charges converted by the photoconductor are provided along with complicated wiring. There is a problem that it is difficult to fix the TFT array formed on the glass substrate to the housing by minimizing the area of the TFT array.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a radiation detection surface having high radiation transmittance and sufficient mechanical strength and conductivity. It is an object of the present invention to provide a radiation detection device capable of detecting radiation with a low radiation dose and reducing detection noise by using a material.

[0011] It is another object of the present invention to provide a heat radiating path provided inside a housing for accommodating an X-ray detecting section, the heat radiating path being provided on the opposite side of the X-ray detecting surface with respect to the X-ray detecting section. An object of the present invention is to provide a radiation detection device that can efficiently radiate heat to the outside by guiding the radiation detection device to a plate.

Further, an object of the present invention is to reduce the size of the entire device by detecting a large field of view by guiding the wiring of the TFT array formed on the glass substrate to the back surface of the glass substrate through a tab. It is to provide a radiation detection device.

[0013]

According to a first aspect of the present invention, there is provided a radiation detecting apparatus, comprising: a radiation detecting section having a photoelectric conversion element for converting incident radiation into electric charges; A detection surface cover portion forming a detection surface on which the light enters, and a housing that houses the radiation detection portion and is joined to the detection surface cover portion, wherein the detection surface cover portion has the same radiation transmittance as aluminum. It is characterized by being made of a material having a higher radiation transmittance.

According to another aspect of the present invention, there is provided a radiation detecting apparatus comprising: a radiation detecting section having a photoelectric conversion element for converting incident radiation into electric charges; and a detecting surface on which the radiation enters. A detection surface cover portion to be formed, a housing for accommodating the radiation detection portion and joining to the detection surface cover portion are provided, and the detection surface cover portion is made of CFRP.

In the radiation detecting apparatus according to the first or second aspect of the present invention, the invention according to the third aspect is characterized in that the detection surface cover and the housing are made of different materials. .

In the radiation detecting apparatus according to the first or second aspect of the present invention, according to the fourth aspect of the present invention, the casing is made of a metal, and the detecting surface cover has conductivity. It is characterized by being electrically connected to the housing.

According to a fifth aspect of the present invention, there is provided a radiation detecting apparatus, comprising: a radiation detecting section having a photoelectric conversion element for converting radiation incident from a radiation detecting surface into electric charges; And a heat radiating means for radiating heat from a part of the housing opposite to the radiation detecting surface with the radiation detecting unit interposed therebetween.

In the radiation detecting apparatus according to the fifth aspect of the present invention, in the sixth aspect of the present invention, a heat radiation path is provided inside the housing, and heat generated inside the housing is dissipated by the heat radiation path. Through the heat radiation means.

According to a fifth aspect of the present invention, in the radiation detecting apparatus according to the fifth aspect, the heat radiating means includes a heat radiating plate provided on a part of the housing, A heat radiating member for guiding heat generated inside to the heat radiating plate.

According to another aspect of the present invention, there is provided a radiation detecting apparatus comprising: an insulating substrate; and a photoelectric conversion element formed on the insulating substrate and configured to convert incident radiation into electric charge. A switching element array for collecting charges converted by the photoelectric conversion element,
A distance between an end of the effective field of view of the switching element array and an end surface of the insulating substrate is 10 mm or less.

In the radiation detecting apparatus according to the eighth aspect, the invention according to the ninth aspect includes a flexible substrate having a U-shape, and one end of the flexible substrate is provided with one end of the switching element array. The flexible substrate is provided between an end of an effective field of view and an end surface of the insulating substrate, and the other end of the flexible substrate extends to a back surface side of the insulating substrate.

In the radiation detecting apparatus according to the ninth aspect of the present invention, the invention according to the tenth aspect provides the radiation detecting apparatus through a wiring provided on a back side of the insulating substrate and formed on the flexible substrate. A driving circuit for driving the switching element array is provided.

In the radiation detecting apparatus according to the ninth aspect of the present invention, the radiation detecting apparatus according to the eleventh aspect is provided on the back side of the insulating substrate and through the wiring formed on the flexible substrate. A readout circuit for reading out the charge converted by the photoelectric conversion element by a switching element array;

[0024] In the radiation detecting apparatus according to the first to eleventh aspects of the present invention, the invention according to the twelfth aspect is characterized in that:
The radiation is one of X-rays and gamma rays.

In the radiation detecting apparatus according to any one of the first to eleventh aspects, the invention according to the thirteenth aspect is characterized in that:
The photoelectric conversion element is constituted by a photoconductor.

In the radiation detecting apparatus according to the eighth to eleventh aspects, the invention according to the fourteenth aspect is characterized in that:
The switching element array is constituted by a plurality of thin film transistors.

[0027]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 3 is an assembly diagram showing a configuration of a planar X-ray detection apparatus which is an example of a radiation detection apparatus according to a first embodiment of the present invention, and FIG. It is sectional drawing which shows a part of structure of the flat type X-ray detection apparatus which is an example of the radiation detection apparatus of 1st Embodiment. The planar X-ray detector according to the first embodiment of the present invention shown in FIGS.
An X-ray detection unit 1 that detects X-rays and converts the X-rays into electric charges, and a circuit such as a gate driver (which constitutes a driving circuit of a thin film transistor (TFT)) and a charge amplifier (which constitutes a charge readout circuit) are formed. PC (Pr
integrated Circuit) Plates 18a, 18b, 18
c, 18d, the X-ray detector 1, the PC boards 18a, 18b,
Tabs (TAB, Tape Automatic) formed of a flexible substrate on which wiring for electrically connecting circuits formed on 18c and 18d are formed.
Bonding (TCP, Tape Carrier
Package)) 19a, 19b, 19c, 19d
A PC board 41 on which a metal rear member 14, a support body 40 supporting the X-ray detection unit 1, and a signal processing circuit for processing a signal read by a charge amplifier are formed.
And a heat conduction shield 42 made of metal for transmitting heat generated from electric components constituting circuits on the PC boards 18a, 18b, 18c, 18d to the back surface of the support 40.
And a concave housing 2 made of a metal such as aluminum (Al) and housing the X-ray detection unit 1 and the like.
And a detection surface cover 3 that forms an X-ray detection surface (incident surface) and is joined to the housing 2.

The X-ray detection unit 1 includes a glass substrate 10 which is an insulating substrate, a read electrode 11 formed on the glass substrate 10 for reading electric charges stored in a capacitor (not shown), and a read electrode 11 on the read electrode 11. Formed on the photoconductor 12, which is a photoelectric conversion element for converting incident X-rays into electric charges, and formed on the photoconductor 12.
Voltage application electrode 1 for applying a voltage to photoconductor 12
3 is provided.

The joint between the housing 2 and the detection surface cover 3 is mechanically fixed by screws 15, and a conductive sealing material 16 is provided.
Is applied to make an electrical connection, and the O-ring 1
7 provides hermeticity. Therefore, the X-ray detector 1
Are completely completely electrically shielded by the housing 2 and the detection surface cover 3, and have an electromagnetic wave shielding box structure.

The material forming the detection surface cover 3 is, for example, CFRP (Carbon Fiber Recover).
Intensified Plastic) or a metal-plated material is used. In addition, CFRP has
For example, it is characterized by having the same mechanical strength as an Al material having the same thickness, having an X-ray transmittance about 10 times that of an Al material, and having conductivity. Therefore, the material constituting the detection surface cover 3 is (1)
It is desirable that the material has a high X-ray transmittance, (2) a material having sufficient mechanical strength, and (3) a material having conductivity.

The material forming the detection surface cover 3 can be selected according to the use of the flat X-ray detector. That is, when importance is placed on reducing the amount of X-ray exposure, a material having a high X-ray transmittance is selected. When emphasis is placed on strengthening the X-ray detection surface, a material having sufficient mechanical strength is selected. Further, when emphasis is placed on shielding the entire X-ray detector from electromagnetic waves, a conductive material is selected.

(Embodiment 2) FIG. 5 is a cross-sectional view showing a part of the configuration of a planar X-ray detector which is an example of a radiation detector according to a second embodiment of the present invention. The planar X-ray detection apparatus according to the second embodiment of the present invention shown in FIG. 5 includes an X-ray detection unit 1 and a readout circuit that reads out a signal related to a charge obtained by converting an X-ray detected by the X-ray detection unit 1. And a heat radiating portion 5 for releasing heat generated in electric components such as a readout circuit provided on the PC board 4 (that is, heat generated inside the housing). It has.

In FIG. 5, arrows indicate heat transfer. Also, here, for convenience of explanation, an integrated circuit (I) constituting a readout circuit provided on the PC board 4 is described.
The electric component 4a such as C) is a heat source.

The heat radiating portion 5 is provided with a heat insulating material 21 provided for preventing the influence of heat on the X-ray detecting portion 1 of the electric component 4 a on the PC board 4, and between the heat insulating material 21 and the PC board 4. A copper (Cu) plate 22 provided, a metal shield plate 23 provided partially in contact with the Cu plate 22 and covering the PC plate 4 and functioning as an electromagnetic wave shield and a heat radiating member, and a metal shield plate 23 Screw 26 for fixing to plate 22
And a radiator plate 24 provided in contact with the metal shield plate 23 and made of, for example, Al for releasing heat into the air; A part of the heat radiation rubber 25 is provided in close contact with the metal shield plate 23 and the hole 4b formed in the PC board 4 so that the electrical component 4a and the Cu plate 22 are indirectly contacted with each other. And a heat conductor 27 made of, for example, a silver paste for efficiently conducting heat.

The metal shield plate 23 is made of, for example, C
Although it is constituted by u and iron (Fe), it may be constituted by internal nickel (Ni) plating.

The heat generated in the electric component 4a on the PC board 4 is transmitted to the Cu board 22 via the heat conductor 27 provided in the hole 4b. Further, the heat transmitted to the Cu plate 22 is guided to the heat radiating plate 24 via the metal shield plate 23 and is radiated into the air. Therefore, the heat inside the housing is moved along such a heat radiation path to be released to the outside. The metal shield plate 23 is in close contact with the heat radiating plate 24 via the silicon grease 29, and the heat radiating effect can be enhanced by the fins 24a provided on the heat radiating plate 24.

Further, a part of the heat radiation rubber 25 is replaced with the electric component 4a.
, And another part of the heat radiation rubber 25 is adhered to the metal shield plate 23, so that the efficiency of heat conduction from the electric component 4a to the metal shield plate 23 can be further improved, and the heat radiation effect can be enhanced. . Instead of using the heat radiation rubber 25, for example, a heat pipe can be used.

(Embodiment 3) FIG. 6 is an external view showing a part of a configuration of a flat type X-ray detector which is an example of a radiation detector according to a third embodiment of the present invention, and FIG. FIG. 8 is a plan view showing a part of the configuration of a flat X-ray detection apparatus which is an example of the radiation detection apparatus according to the third embodiment. FIG.
It is sectional drawing which shows a part of structure of the flat type X-ray detection apparatus which is an example of the radiation detection apparatus of 1st Embodiment. In particular, FIG.
FIG. 8 is a plan view showing an electrical connection state of signal lines (or gate drive lines) of the TFT array, and FIG. 8 is a cross-sectional view showing a positional relationship between an edge of an effective field of view of the TFT array and a pad. 6, 7, and 8, electrodes and the like provided in the photoconductor are not shown.

The flat X-ray detecting apparatus according to the third embodiment of the present invention shown in FIGS. 6, 7 and 8 comprises a detecting surface cover 30 forming an X-ray detecting surface, a support 31 and A glass substrate 32 which is an insulating substrate disposed on a support 31
A gate driver provided on the back side of the support 31;
PC on which readout circuit, signal processing circuit, etc. are formed
A plate 33, a photoconductor 34 for directly converting X-rays transmitted through the detection surface cover 30 and entering into electric charge, and a switching element formed on the glass substrate 32 for reading out the electric charge converted by the photoconductor 34 A plurality of TFTs used as are configured in a matrix,
Further, the TFT array 35 on which the signal lines 43 and the gate drive lines 44 are provided, and the circuit on the PC board 33 provided on the back side of the support 31 by extracting the signal lines 43 and the gate drive lines 44, are electrically connected. Tabs (TAB) 60, 61, 62, 63, 64, which are provided with wires for connection to the U-shaped member, and are formed of, for example, square rubber, and the tabs 60, 61, 62 , 6
Pads 60a, 6 provided on 3, 64
Tab holders 36a, 36b for holding the base members 1a, 62a, 63a, 64a, the support 31, and the glass substrate 3
2, house PC board 33, photoconductor 34, etc.
A metal case 37 is provided for connecting and sealing with the detection surface cover 30.

When the glass substrate 32 on which the TFT array 35 is formed is fixed to the support 31, the glass holder 39 used as a fixing plate and the support 3 are fixed.
The glass substrate 32 is sandwiched between the substrates 1 and the glass substrate 32 is screwed to the support 31 using screws 38. As shown in FIG. 6, a corner portion of the glass substrate 32 may be cut to provide a hole for a fixing plate.

The detection surface cover portion 30 is pressed from above the pads 60a, 61a, 62a, 63a, and 64a arranged at the ends of the glass substrate 32 with tab retainers 36a and 36b.
Is screwed to the housing 37 using a screw (not shown).
The internal member of the housing 37 is fixed more strongly. Therefore, in this case, there is no displacement of the tabs 60, 61, 62, 63, 64.

As shown in FIG. 8, the photoconductor 34
Has a tapered portion 34a at its end,
Further, a voltage application electrode and a reading electrode (not shown) are formed. Note that the voltage application electrode and the readout electrode are not formed on the tapered portion 34a.

The wiring provided on each of the tabs 60, 61, 62, 63 and 64 includes pads 60a, 61a and 6
It is electrically connected to the signal line 43 and the gate drive line 44 provided in the TFT array 35 through 2a, 63a and 64a, and is guided to the back side of the support 31. Note that T
The signal line 43 and the gate drive line 44 of the FT array 35 and the pads 60a, 61a, 62a, 63a, and 64a are AC
F (Anisotropic Conductive)
(Film) is electrically connected to and electrically connected by thermocompression bonding. The wiring led to the back side of the support 31 is the PC board 3
3 is soldered to a terminal portion of a circuit provided on.

Here, for example, as shown in FIGS. 7 and 8, the length of the tapered portion 34a of the photoconductor 34 is Lt, and the length of the portion of the glass substrate 32 where only the mold 57 is formed is Lm. , The pad margin is Mp,
When the width of the pad 60a is Wp, the TFT array 35
(The length of the edge of the effective field of view) D from the end 35a of the effective field of view (the area where a voltage application electrode (not shown in the photoconductor 34 is formed)) to the end face 32a of the glass substrate 32 is D = Lt + Lm + Mp + Wp = 5 (mm) + 2 (mm) + 1 (mm) + 2 (mm) = 10 (mm). Thus, the length of the edge of the effective field of view of the TFT array 35 can be set to 10 mm or less. In FIG. 7, Pn indicates the length of the spring portion of the wiring having a reduced pitch.

FIG. 9, FIG. 10 and FIG. 11 show a plane type X as an example of the radiation detecting apparatus according to the third embodiment of the present invention.
It is a figure for explaining arrangement of a chip on a tab (TAB (TCP)) in a line detection device, and has shown the case where a chip which consists of circuits, such as a charge amplifier and a gate driver, is built in a tab. For example, as shown in FIG. 9, the chip 45 can be arranged on the tab portion 48 of the U-shaped tab 66 that is folded back on the back surface side of the glass substrate 32.

The position where the chip 45 is arranged is shown in FIG.
However, the present invention is not limited to this case. For example, as shown in FIG.
The chip 45 can be arranged on the tab portion 46 close to a. Further, as shown in FIG.
The chip 45 can also be arranged on the tab portion 47 of the tab 66 which is bent substantially at a right angle to the tab 66.

[0048]

As described above, according to the present invention, by using a material having a high X-ray transmittance, sufficient mechanical strength and conductivity as a material for forming the detection surface cover, the conventional detection method can be used. X-ray detection with a lower exposure dose than the detector can be realized, and the detection noise can be reduced by the electromagnetic shield box structure. Therefore,
The amount of X-ray exposure to the patient can be reduced, and the quality of the obtained X-ray image can be prevented from deteriorating.

Further, according to the present invention, since the heat generated in the electric components provided inside the housing is efficiently transmitted along the heat radiation path and released to the outside of the housing, the photoconductor is provided. The effect of heat on the amplifier and the amplifier can be reduced, and the reliability of the flat X-ray detector can be improved.

Further, according to the present invention, the wiring of the TFT array formed on the glass substrate is led to the back side of the glass substrate through the tab, so that the entire device can be downsized by detecting a large field of view. Becomes

[Brief description of the drawings]

FIG. 1 is a diagram showing a schematic configuration of a conventional direct conversion type flat X-ray detection apparatus.

FIG. 2 is a diagram illustrating a configuration of an X-ray detection unit and a read-out circuit unit in a conventional planar X-ray detection device.

FIG. 3 is an assembly diagram showing a configuration of a planar X-ray detection device which is an example of the radiation detection device according to the first embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a part of a configuration of a flat X-ray detection device which is an example of the radiation detection device according to the first exemplary embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating a part of a configuration of a planar X-ray detection device which is an example of a radiation detection device according to a second embodiment of the present invention.

FIG. 6 is an external view showing a part of the configuration of a planar X-ray detection device which is an example of a radiation detection device according to a third embodiment of the present invention.

FIG. 7 is a plan view illustrating a part of a configuration of a flat X-ray detection device which is an example of a radiation detection device according to a third embodiment of the present invention.

FIG. 8 is a cross-sectional view illustrating a part of a configuration of a planar X-ray detection device which is an example of a radiation detection device according to a third embodiment of the present invention.

FIG. 9 is a diagram for explaining an arrangement of chips on a tab in a flat X-ray detection device which is an example of a radiation detection device according to a third embodiment of the present invention.

FIG. 10 is a diagram for explaining an arrangement of chips on a tab in a planar X-ray detection device which is an example of a radiation detection device according to a third embodiment of the present invention.

FIG. 11 is a diagram for explaining an arrangement of chips on a tab in a flat X-ray detector which is an example of a radiation detector according to a third embodiment of the present invention.

[Explanation of symbols]

Reference Signs List 1 X-ray detection unit 2, 37 Case 3, 30 Detection surface cover unit 4, 18a, 18b, 18c, 18d, 33, 41P
C plate 4a Electric component 4b Hole 5 Heat radiating part 10, 32 Glass substrate 11 Readout electrode 12, 34 Photoconductor 13 Voltage applying electrode 14 Back member 15, 26, 38 Screw 16 Conductive seal material 17 O-ring 19a, 19b, 19c , 19d, 60, 61, 62,
63, 64, 66 Tab 21 Heat insulator 22 Cu plate 23 Metal shield plate 24 Heat sink 24a Fin 25 Heat dissipation rubber 27 Heat conductor 29 Silicon grease 31, 40 Supporter 34a Tapered portion 35 TFT array 36a, 36b Tab holder 42 Heat conduction Shield 43 Signal line 44 Gate drive line 45 Chip 57 Mold 60a, 61b, 62c, 63d, 64e, 66a Pad

Continuing on the front page (72) Inventor Takeshi Miyagi 33, Shinisogo-cho, Isogo-ku, Yokohama-shi, Kanagawa Prefecture Inside Toshiba Production Technology Laboratory (72) Inventor Kohei Suzuki 33, Shinisogo-cho, Isogo-ku, Yokohama-shi, Kanagawa Prefecture EE01 EE27 FF02 FF04 FF14 GG21 JJ05 JJ08 JJ09 JJ33 JJ37 4C093 CA06 CA31 CA32 CA34 CA38 CA41 EA05 EB13 EB16 EB17

Claims (14)

[Claims] A radiation detection unit having a photoelectric conversion element for converting incident radiation into electric charge; a detection surface cover forming a detection surface on which the radiation is incident; and a detection surface for housing the radiation detection unit. A radiation detection apparatus comprising: a housing joined to a cover; and the detection surface cover is made of a material having a radiation transmittance equal to or higher than that of aluminum. 2. A radiation detection unit having a photoelectric conversion element for converting incident radiation into electric charges, a detection surface cover unit forming a detection surface on which the radiation enters, and a detection surface that accommodates the radiation detection unit. A radiation detection apparatus comprising: a housing joined to a cover; and the detection surface cover is made of CFRP. 3. The apparatus according to claim 1, wherein the detection surface cover and the housing are made of different materials.
Or the radiation detection device according to 2. 4. The housing according to claim 1, wherein the housing is made of metal, and the detection surface cover has conductivity and is electrically connected to the housing. Radiation detection device. 5. A radiation detection unit having a photoelectric conversion element for converting radiation incident from a radiation detection surface into electric charges, a housing for housing the radiation detection unit, and the radiation detection surface sandwiching the radiation detection unit. A radiation detecting device comprising: a heat radiating means for radiating heat from a part of the housing on the opposite side. 6. The radiation detection apparatus according to claim 5, wherein a heat radiation path is provided inside the housing, and heat generated inside the housing is guided to the heat radiation means through the heat radiation path. 7. The heat radiating means includes a heat radiating plate provided in a part of the housing, and a heat radiating member for guiding heat generated inside the housing to the heat radiating plate. The radiation detection apparatus according to claim 5, wherein 8. An insulating substrate, a photoelectric conversion element formed on the insulating substrate and converting incident radiation into electric charge, and a switching element array for collecting the electric charge converted by the photoelectric conversion element. A radiation detection apparatus, wherein a distance between an end of an effective field of view of the switching element array and an end surface of the insulating substrate is 10 mm or less. 9. A flexible substrate comprising a U-shaped flexible substrate, one end of the flexible substrate being provided between an end of an effective field of view of the switching element array and an end surface of the insulating substrate, The radiation detection device according to claim 8, wherein the other end of the radiation detection device extends to the back surface side of the insulating substrate. 10. A device provided on a back side of the insulating substrate,
The radiation detection apparatus according to claim 9, further comprising a drive circuit that drives the switching element array via a wiring formed on the flexible substrate. 11. A device provided on the back side of the insulating substrate,
The radiation detection apparatus according to claim 9, further comprising: a readout circuit that reads out the electric charge converted by the photoelectric conversion element by the switching element array via a wiring formed on the flexible substrate. 12. The radiation detecting apparatus according to claim 1, wherein the radiation is one of X-rays and gamma rays. 13. The radiation detecting apparatus according to claim 1, wherein the photoelectric conversion element is constituted by a photoconductor. 14. The radiation detecting apparatus according to claim 8, wherein the switching element array is configured by a plurality of thin film transistors.