JP6113106B2 - Induction heating cooker - Google Patents

Description

  The present invention relates to an induction heating cooker, and particularly to an induction heating cooker having a highly efficient cooling configuration.

  2. Description of the Related Art An induction heating cooker is known in which an eddy current is induced by a high-frequency magnetic flux generated by flowing a high-frequency current through an induction heating coil, and an object to be heated is heated by Joule heat generated thereby.

  As such, a driving circuit component such as an IGBT for supplying power to a grille portion disposed on one side of the main body housing and a heating coil disposed between the grill portion and the opposite side of the main body housing is mounted. An induction heating cooker having a configuration including a plurality of printed circuit boards and a cooling fan that cools drive circuit components has been proposed (see, for example, Patent Document 1).

  In the induction heating cooker described in Patent Document 1, a plurality of printed circuit boards are supported by a substrate holder so that their main surfaces extend in the horizontal direction and overlap (stack) vertically apart from each other. Furthermore, in the induction heating cooker described in Patent Document 1, a heat shield partition is arranged between the heating coil and the uppermost printed circuit board, and the ventilation path of the air blown by the cooling fan is formed by the heat shield partition and the substrate holder. Is formed.

Japanese Patent No. 3613109 (see, for example, Example 1)

  In the induction heating cooker described in Patent Document 1, the air passage formed efficiently below the printed circuit board supported in an overlapping manner (for example, between the uppermost layer and the second layer printed circuit board) is efficiently used. In order to send the cooling air, it is necessary to provide an outlet for the cooling air on an upper (for example, uppermost) printed circuit board. Therefore, with such a configuration, the area of the uppermost printed circuit board cannot be sufficiently ensured, and it is difficult to mount required circuit components.

  Further, when the cooling air passes through a plurality of printed circuit boards, it only passes through the air passage formed by the substrate holding table, and the cooling air after cooling the printed circuit boards is blown to the heating coil. Only. Then, the generation of pressure loss due to the merging of the cooling air after cooling the printed circuit board and the air flow configuration in which the heated cooling air after cooling the printed circuit board blows to the heating coil at a low wind speed, so the air volume is high and the static pressure is high. It is necessary to provide a cooling fan with a high performance. Therefore, there existed a subject that the cooling fan enlarged and the operation sound became loud.

  The present invention has been made against the background of the above problems, and has a cooling structure capable of cooling a plurality of induction heating coils and a printed circuit board (drive circuit board) with high efficiency with a low air volume and a low pressure loss. It aims at providing the induction heating cooking appliance provided with.

Induction heating cooker according to the present invention includes a plurality of heating coils, and multiple driving circuit board for driving the heating coil, it is partitioned into upper and lower multiple stages, for accommodating the drive circuit board to each stage A board case, and a cooling fan for cooling the heating coil and the drive circuit board, wherein the cooling fan is provided with a blowout opening divided into upper and lower portions, and the lower blowout air volume of the cooling fan is on the upper side The plurality of drive circuit boards are configured to drive and control more heating coils than the drive circuit board disposed on the upper stage side, and the drive circuit board disposed on the lower stage side is set to be larger than the blowing air volume. The cooling air that has passed through the drive circuit board arranged on the upper stage side is controlled by the cooling air that has passed through the driving circuit board arranged on the upper stage side without being merged in the substrate case Is supplied to the serial heating coil has a separate air passage cooling air having passed through the driving circuit board disposed on the lower side driving circuit board disposed on the lower side is supplied to the heating coil is controlled Is.

Induction heating cooker according to the present invention includes a plurality of heating coils, and multiple driving circuit board for driving the heating coil, it is divided into three vertical stages, the board case for accommodating the drive circuit board, respectively provided, and a cooling fan for cooling the heating coil and the driving circuit board, the cooling fan is provided outlet is divided into upper and lower, balloon upper lower blowoff air volume of the cooling fan air volume The cooling air blown out from the lower outlet is used to cool the lower two-stage driving circuit board among the plurality of driving circuit boards, and the cooling air that has passed through the plurality of driving circuit boards. The cooling air that has passed through the drive circuit board disposed on the upper stage side is supplied to the heating coil controlled by the drive circuit board disposed on the upper stage side without being merged in the substrate case. And it has a wind path of the cooling air passing through the driving circuit board of the lower two-stage are independent driving circuit board disposed on the lower side is supplied to the heating coil is controlled.

  According to the induction heating cooker of the present invention, the overall cooling efficiency can be improved by adjusting the blown air amount from the plurality of blower outlets of the cooling fan in accordance with the heat generation balance of each air passage. In addition, since each drive circuit board can be effectively cooled with a small amount of air, the number of rotations of the cooling fan can be reduced, and the operating noise can be reduced.

It is a disassembled perspective view which shows the state which removed the top plate of the induction heating cooking appliance which concerns on Embodiment 1 of this invention. It is the fragmentary sectional view which showed the cross-sectional structure of the drive circuit part of the induction heating cooking appliance which concerns on Embodiment 1 of this invention. It is a perspective view which shows an example of the cooling structure which cools the heating coil unit of the induction heating cooking appliance which concerns on Embodiment 1 of this invention. It is a fragmentary sectional view which shows the cross-sectional structural example of the induction heating cooking appliance which concerns on Embodiment 2 of this invention. It is a fragmentary sectional view which shows the cross-sectional structural example of the induction heating cooking appliance which concerns on Embodiment 3 of this invention.

  Hereinafter, embodiments of an induction heating cooker according to the present invention will be described with reference to the drawings. The present invention is not limited to the embodiments described below. Moreover, in the following drawings including FIG. 1, the relationship of the size of each component may be different from the actual one. Also, in the following explanation, terms (for example, “up”, “middle”, “down”, “right”, “left”, “front”, “back”, etc.) are used to facilitate understanding. Although used where appropriate, this is for the purpose of explanation and these terms do not limit the invention.

Embodiment 1 FIG.
FIG. 1 is an exploded perspective view showing a state where a top plate (top plate) 2 of the induction heating cooker 100A according to Embodiment 1 of the present invention is removed. FIG. 2 is a partial cross-sectional view showing a cross-sectional configuration of a drive circuit unit of induction heating cooker 100A. Based on FIG.1 and FIG.2, 100 A of induction heating cooking appliances are demonstrated. The induction heating cooker 100A heats an object to be heated 200 such as a pan. In FIG. 1, an object to be heated 200 such as a pan is also illustrated. Moreover, in FIG.1 and FIG.2, the flow of air is illustrated with the arrow.

  The induction heating cooker 100 </ b> A is provided with a top plate 2 on the top surface of a box-shaped housing 1 whose top surface is open, and a heated object 200 such as a pan can be placed on the top plate 2. The top plate 2 is provided with heating ports 3 displayed by printing or the like as reference positions for placing the article to be heated 200 (three in FIG. 1).

  On the front side (front side) of the top plate 2, an operation unit 4 that receives operation inputs such as heating conditions in each of the three heating ports 3 is provided. In the present embodiment, three operation units 4 are provided corresponding to the respective heating ports 3. The operation at the operation unit 4 is transmitted to the upper front side of the housing 1 and input to the drive circuit unit 8 described later. It is assumed that the operation unit 4 includes a part to which an operation on the upper front side of the housing 1 is transmitted in addition to the operation unit 4 provided on the top plate 2 that actually receives an operation input. In addition, a display unit 5 constituted by a display device such as a liquid crystal screen or a lamp is provided in the center of the front side of the housing 1. The contents displayed on the display unit 5 are visible from the display window 5a of the top plate 2.

  Inside the housing 1 and below the top plate 2, there is a grill portion 6 having heating means such as an electric heater inside and the front surface covered with a drawer-type door, and a ceiling portion installed above the grill portion 6. And a heating coil unit 20 for heating an object to be heated 200 placed on the plate 2. The heating coil unit 20 is provided so as to correspond to the left and right heating ports 3 on the front side and the heating port 3 on the center rear side, respectively. In FIG. 1, the one corresponding to the heating port 3 on the left side of the front side of the paper is illustrated as a heating coil unit 20a, the one corresponding to the heating port 3 on the right side of the front side of the paper is illustrated as a heating coil unit 20b, What corresponds to the heating port 3 at the center rear is illustrated as a heating coil unit 20c.

  In addition, in this Embodiment, although the state in which the heating coil unit 20 is provided in all the heating ports 3 among the three heating ports 3 is shown as an example, it is not limited to this. For example, instead of the heating coil unit 20 corresponding to the heating port 3 or the like at the center rear, a radiant heater is provided that heats the article to be heated 200 by radiant heat when AC power of commercial frequency is supplied and the heater itself generates heat. Also good. In the present embodiment, the left heating coil unit 20a is configured with a larger diameter than the right heating coil unit 20b, but the size of the heating coil unit 20 is limited to that illustrated. is not.

  A drive circuit portion 8 is provided on the side of the grill portion 6 in the housing 1 (the right side of the drawing), and a cooling fan 9 is provided on the rear of the housing 1. Based on the operation signal output from the operation unit 4, the drive circuit unit 8 performs heating control in the grill unit 6 and the heating coil unit 20 and performs operation control of the display unit 5 and the cooling fan 9. The drive circuit unit 8 can be configured by hardware such as a circuit device that realizes the function, or can be configured by an arithmetic device such as a microcomputer or a CPU and software executed thereon. .

  An intake port 10 serving as an air inflow port into the housing 1 is provided on the back surface of the housing 1, and an exhaust port serving as an air outflow port from the housing 1 to the outside is provided behind the top plate 2. 11 is formed as an opening. Therefore, when the cooling fan 9 operates, air is sucked into the housing 1 from the space around the housing 1 (for example, the kitchen table space) through the air inlet 10 and is sent out from the cooling fan 9. Then, the air sent from the cooling fan 9 flows into the substrate case 80 that houses the drive circuit unit 8 to cool the drive circuit unit 8 and cool the surroundings of the heating coil unit 20 and the grill unit 6. Thereafter, the cooling air flows out of the housing 1 from the exhaust port 11.

  The arrangement of the operation unit 4, the display unit 5, the grill unit 6, the drive circuit unit 8, the cooling fan 9, the intake port 10, the exhaust port 11, and the heating coil unit 20 illustrated in FIG. 1 is an example, and is illustrated. It is not limited to things.

  At least an inverter circuit, various control circuits, electrical components, and the like are mounted on the drive circuit unit 8 on the board. The drive circuit unit 8 has a plurality of drive circuit boards (two in this embodiment). The plurality of drive circuit boards each extend in the horizontal direction and are arranged so as to be stacked one above the other while being separated from each other. In the following description, the drive circuit board disposed on the upper stage side is referred to as an upper stage drive circuit board 81, and the drive circuit board disposed on the lower stage side is referred to as a lower stage drive circuit board 82, respectively.

The upper drive circuit board 81 includes drive parts such as an insulated gate bipolar transistor (IGBT) that performs switching operation as an inverter circuit and a free wheel diode (FWD) connected in reverse thereto, and a heat sink for improving the heat dissipation performance of the IGBT. Have.
The lower drive circuit board 82 also includes drive parts such as an insulated gate bipolar transistor (IGBT) that performs switching operation as an inverter circuit, and a free wheel diode (FWD) connected in reverse parallel thereto, and a heat sink for enhancing the heat dissipation performance of the IGBT. Have.

In the following description, the driving equipment arranged on the upper side is referred to as an upper driving part 83, and the driving equipment arranged on the lower side is referred to as a lower driving part 84.
Similarly, in the following description, the heat sink disposed on the upper stage side is referred to as an upper heat sink 85, and the heat sink disposed on the lower stage side is referred to as a lower heat sink 86, respectively.

  Specifically, in the substrate case 80, the upper drive circuit board 81 is mounted with an upper drive component 83 and an upper heat sink 85 for controlling the heating of the heating coil unit 20a, and the lower drive circuit board 82 is heated. A lower drive component 84 and a lower heat sink 86 are mounted to control the heating of the coil unit 20b and the heating coil unit 20c.

  Therefore, for example, the upper drive circuit board 81 is mounted with the upper drive component 83 for controlling the heating of the heating coil unit 20a capable of inputting a maximum of 3 kW, whereas the lower drive circuit board 82 is capable of inputting a maximum of 3 kW. A lower-stage drive component 84 that controls heating of the heating coil unit 20b and the heating coil unit 20c capable of inputting up to 1.5 kW is mounted. For this reason, the lower drive circuit board 82 has a larger total heat generation amount during driving. Further, the lower drive circuit board 82 is configured to have a larger area in the horizontal direction than the upper drive circuit board 81.

The cooling fan 9 is configured such that the rotation axis is arranged vertically and the discharge port (outlet port) is divided into upper and lower parts so as to be blown out at two locations. The discharge port provided on the upper side is referred to as an upper discharge port 95, and the discharge port provided on the lower side is referred to as a lower discharge port 94. That is, the cooling air sucked from the upper suction port 93 where the motor 91 is installed is discharged from the upper discharge port 95 and sent toward the upper drive circuit board 81, and the cooling air sucked from the lower suction port 92. The wind is discharged from the lower discharge port 94 and sent to the lower drive circuit board 82.
In this embodiment, the configuration of the sirocco fan in which the rotation shaft is vertically arranged is shown, but the configuration in which the rotation shaft is horizontally arranged or the blade shape may be a turbo fan. It is not limited.

  In addition, the motor 91 is disposed on the upper suction port 93 side so that the air volume discharged from the lower discharge port 94 is larger than the air volume discharged from the upper discharge port 95. At this time, the blade widths of the cooling fan 9 are substantially the same.

The cooling air sent to the upper drive circuit board 81 passes through a ventilation path formed by the board case 80 and the like so as to intensively cool the upper drive component 83 and the upper heat sink 85.
The cooling air sent to the lower drive circuit board 82 passes through the ventilation path formed by the substrate case 80 and the like so as to cool the lower drive component 84 and the lower heat sink 86 in a concentrated manner.

  The cooling air that has cooled the upper drive circuit board 81 and the lower drive circuit board 82 is then discharged outside the substrate case 80 without joining together in the substrate case 80. That is, the substrate case 80 is configured to have an independent air path structure in the vertical direction. The cooling air that has cooled the upper drive circuit board 81 is supplied to the heating coil unit 20a, and the cooling air that has cooled the lower drive circuit board 82 is supplied to the heating coil unit 20b and the heating coil unit 20c. ing.

  FIG. 3 is a perspective view showing an example of a cooling structure for cooling the heating coil unit 20a of the induction heating cooker 100A. A cooling structure for cooling the heating coil unit 20a of the induction heating cooker 100A will be described with reference to FIG. In FIG. 3, the air flow is indicated by arrows.

  As shown in FIGS. 1 and 2, the heating coil unit 20a includes an induction heating coil 21, a coil base 22, and ferrite (not shown). The induction heating coil 21 generates a high frequency magnetic field when a high frequency current flows. An eddy current is generated in the object to be heated 200 placed on the top plate 2 by the magnetic lines of force, and the object to be heated 200 is heated by generating heat.

  The heating coil unit 20a is configured to have a larger diameter than the other heating coil units 20b and 20c. The heating coil unit 20c is configured to have a smaller diameter than the other heating coil units 20a and 20b. That is, the diameter increases in the order of the heating coil unit 20a → the heating coil unit 20b → the heating coil unit 20c. In addition, in this Embodiment, although the heating coil unit 20 has shown the state which has arrange | positioned the coil from which a diameter differs, the number, shape, and arrangement | positioning of a coil are not specifically limited.

  As shown in FIG. 3, in the induction heating cooker 100A, a substantially annular coil cooling duct 23 is formed so as to face the lower surface of the heating coil unit 20a on the left side of the drawing. A plurality of coil cooling discharge holes 24 for ejecting the supplied air are formed on the wall surface above the coil cooling duct 23. Therefore, the cooling air supplied to the coil cooling duct 23 is ejected from the coil cooling discharge hole 24 and then supplied to the lower surface of the heating coil unit 20a to cool the lower surface of the induction heating coil 21. .

On the other hand, as shown in FIG. 3, the heating coil unit 20 b on the right side of the drawing is cooled by being supplied with cooling air discharged from the substrate case discharge port 87 provided in front of the substrate case 80.
Moreover, the heating coil unit 20c is cooled mainly by supplying cooling air after cooling of the heating coil unit 20a.

  That is, the air sucked from the air inlet 10 provided on the back surface of the housing 1 and sucked from the upper air inlet 93 of the cooling fan 9 is supplied from the upper air outlet 95 to the upper drive circuit board 81, and then the coil It flows into the cooling duct 23 and is supplied to the heating coil unit 20a.

  On the other hand, the air sucked from the air inlet 10 provided on the back surface of the housing 1 and sucked from the lower air inlet 92 of the cooling fan 9 is supplied from the lower air outlet 94 to the lower drive circuit board 82, and thereafter Then, it is supplied to the heating coil unit 20b through the substrate case discharge port 87. At this time, as shown in FIG. 3, a part of the cooling air is supplied from below so as to cool the operation unit 4 and the display unit 5, and then the cooling air is heated together with the cooling air that has cooled the heating coil unit 20b. It is supplied to the unit 20c.

  As described above, in the induction heating cooker 100A, the cooling air that has passed through the upper drive circuit board 81 is supplied only to the heating coil unit 20a, and the cooling air that has passed through the lower drive circuit board 82 is supplied to the heating coil unit 20b. Independent flow paths are formed to flow. In addition, the induction heating cooker 100 </ b> A sets the amount of air discharged from the upper outlet 95 of the cooling fan 9 to be larger than the amount of air discharged from the lower outlet 94. Therefore, the discharge air volume balance of the cooling fan 9 can be set in correspondence with the total heat generation amount of the heating coil unit 20, the upper drive circuit board 81, and the lower drive circuit board 82 in each air passage, and the minimum The number of rotations and the size of the cooling fan 9 can be suppressed, and the noise can be reduced or the size can be reduced.

  In addition, the induction heating cooker 100A employs a configuration in which the total heat generation amount of the lower drive circuit board 82 is larger than the total heat generation amount of the upper drive circuit board 81. As a result, as compared with a case where the total heat generation amount of the upper drive circuit board 81 is increased, an upward air flow is easily generated in the substrate case 80, and the upper drive circuit board 81 and the lower drive circuit board 82 Cooling efficiency can be improved.

  Further, in the induction heating cooker 100A, the area of the lower drive circuit board 82 in the horizontal direction is larger than that of the upper drive circuit board 81. This makes it easier for the cooling air that has passed through the lower drive circuit board 82 to escape upward to the substrate case 80, further promoting the upward air flow, and improving the ventilation performance in the cooling air passage, thereby reducing the low pressure loss. Can be achieved.

  Furthermore, the induction heating cooker 100A allows the cooling air that has passed through the upper drive circuit board 81 and the lower drive circuit board 82 to flow from the board case discharge port 87 to the outside of the case (each heating coil) without joining in the board case 80. ). Therefore, it is possible to prevent an increase in pressure loss caused by the combined flow of the flows at a place where the wind speed is large (the air volume is large) in the substrate case 80, and low pressure loss in the cooling air passage can be realized. At the same time, it is possible to reduce the noise associated with reducing the rotational speed of the cooling fan 9.

  In addition, in the induction heating cooker 100A, the cooling air that has passed through the lower drive circuit board 82 is configured to partially cool the operation unit 4 and the display unit 5. Therefore, it is a part of a large amount of cooling air passing through the lower drive circuit board 82 and can be cooled by colliding with the operation unit 4 and the display unit 5 by an upward flow, and the operation unit 4 and the display unit can be efficiently cooled. 5 can be cooled.

  Further, in the induction heating cooker 100A, an upper drive component 83 and an upper heat sink 85 for controlling the heating of the heating coil unit 20a are mounted on the upper drive circuit board 81, and the heating coil unit 20b is mounted on the lower drive circuit board 82. And the lower stage drive component 84 and the lower stage heat sink 86 for carrying out heating control of the heating coil unit 20c are mounted. Therefore, the distance from each drive circuit board to the heating coil unit 20 is shortened, and the length of the high-frequency power supply and detection signal (not shown) wiring from the drive circuit board to the heating coil unit 20 can be shortened. .

Embodiment 2. FIG.
FIG. 4 is a partial cross-sectional view showing a cross-sectional configuration example of induction heating cooker 100B according to Embodiment 2 of the present invention. Based on FIG. 4, the induction heating cooking appliance 100B is demonstrated. In the second embodiment, differences from the first embodiment will be mainly described, and the same parts as those in the first embodiment will be denoted by the same reference numerals and description thereof will be omitted. Moreover, in FIG. 4, the flow of the cooling air on the drive circuit boards (the upper drive circuit board 81 and the lower drive circuit board 82) of the induction heating cooker 100B is indicated by arrows.

  In the induction heating cooker 100B, in the substrate case 80, the upper drive circuit board 81 is mounted with an upper drive component 83 and an upper heat sink 85 for controlling the heating of the heating coil unit 20a, and the lower drive circuit board 82 is mounted on the lower drive circuit board 82. A lower drive part 84 and a lower heat sink 86 are mounted for controlling the heating of the heating coil unit 20b and the heating coil unit 20c. In the induction heating cooker 100 </ b> B, the lower drive circuit board 82 and the upper drive circuit board 81 are configured to have the same horizontal area, and the lower drive circuit board 82 is more than the upper drive circuit board 81 in the casing 1. So that the lower drive circuit board 82 and the upper drive circuit board 81 are shifted in the horizontal direction so that the lower drive circuit board 82 is positioned on the front side of the housing 1 relative to the upper drive circuit board 81. It is arranged.

  As described above, in the induction heating cooker 100B, the horizontal areas of the lower drive circuit board 82 and the upper drive circuit board 81 are made the same while being shifted in the horizontal direction. In this way, a vertical air path in the substrate case 80 can be secured, and the cooling air that has passed through the lower drive circuit board 82 can easily escape upward from the substrate case 80, thereby further promoting the updraft. . Note that the fact that the horizontal areas are the same includes not only that the areas are exactly the same, but also cases where the areas are slightly shifted.

  In addition, in the induction heating cooker 100B, the cooling air that has passed through the upper drive circuit board 81 and the lower drive circuit board 82 is not merged in the substrate case 80, and the outside of the case (each heating coil) ). Therefore, it is possible to prevent an increase in pressure loss caused by the combined flow of the flows at a place where the wind speed is large (the air volume is large) in the substrate case 80, and low pressure loss in the cooling air passage can be realized. At the same time, it is possible to reduce the noise associated with reducing the rotational speed of the cooling fan 9.

Embodiment 3 FIG.
FIG. 5 is a partial cross-sectional view showing a cross-sectional configuration example of induction heating cooker 100C according to Embodiment 3 of the present invention. The induction heating cooker 100C will be described based on FIG. In the third embodiment, differences from the first and second embodiments will be mainly described, and the same parts as those in the first and second embodiments will be denoted by the same reference numerals and the description thereof will be omitted. Further, in FIG. 5, the flow of cooling air on the drive circuit board (the upper drive circuit board 81, the drive circuit board disposed in the middle stage, and the lower drive circuit board 82) of the induction heating cooker 100C is indicated by arrows. .

  In the induction heating cooker 100C, the drive circuit unit 8 includes three upper drive circuit boards 81, a lower drive circuit board 82, and a drive circuit board (hereinafter referred to as a middle drive circuit board 88) arranged in the middle stage. , Each of which extends in the horizontal direction and is arranged so as to be stacked one above the other. In the following description, the upper drive circuit board 81 may be referred to as the uppermost drive circuit board 81, and the lower drive circuit board 82 may be referred to as the lowermost drive circuit board 82.

The upper drive circuit board 81 has the upper drive component 83 and the upper heat sink 85 as described in the first embodiment.
The lower drive circuit board 82 includes the lower drive component 84 and the lower heat sink 86 as described in the first embodiment.
The middle-stage drive circuit board 88 includes a drive component such as an insulated gate bipolar transistor (IGBT) that performs switching operation as an inverter circuit and a free wheel diode (FWD) connected in reverse thereto, and a heat sink for improving the heat dissipation performance of the IGBT. Have.
In the following description, the driving equipment arranged in the middle stage is referred to as a middle stage driving component 89, and the heat sink arranged in the middle stage is referred to as a middle stage heat sink 90, respectively.

  Specifically, in the substrate case 80, an upper drive circuit 83 and an upper heat sink 85 for controlling heating of the heating coil unit 20a are mounted on the uppermost drive circuit board 81, and the lowermost drive circuit board 82 is mounted on the lowermost drive circuit board 82. The lower drive component 84 and the lower heat sink 86 for controlling the heating of the heating coil unit 20b are mounted, and the middle drive circuit 89 and the middle heat sink 90 for controlling the heating of the heating coil unit 20c are mounted on the intermediate drive circuit board 88. Has been implemented.

  In the induction heating cooker 100C, the upper drive circuit board 81, the middle drive circuit board 88, and the lower drive circuit board 82 are arranged so as to be shifted in the horizontal direction so as to come out in front of the housing 1 from the upper stage to the lower stage. is there. That is, the lowermost drive circuit board 82 is disposed at the forefront of the housing 1, the uppermost drive circuit board 81 is disposed at the rearmost side of the housing 1, and the middle drive circuit board 88 is disposed at an intermediate position thereof.

  The cooling fan 9 is configured such that the rotation axis is arranged vertically and the blowout port is divided into upper and lower parts and can be blown out at two locations. The cooling air sucked from the upper suction port 93 where the motor 91 is installed is discharged from the upper discharge port 95 and sent toward the upper drive circuit board 81, and the cooling air sucked from the lower suction port 92 is The air is discharged from the lower discharge port 94 and sent out toward the lower drive circuit board 82 and the middle drive circuit board 88. Further, the motor 91 is installed on the upper suction port 93 side so that the air volume discharged from the lower discharge port 94 is larger than the air volume discharged from the upper discharge port 95. At this time, the blade widths of the cooling fan 9 are substantially the same.

The cooling air sent to the upper drive circuit board 81 passes through a ventilation path formed by the board case 80 and the like so as to intensively cool the upper drive component 83 and the upper heat sink 85.
The cooling air sent to the lower drive circuit board 82 passes through the ventilation path formed by the board case 80 or the like so as to cool the lower drive component 84 and the lower heat sink 86 in a concentrated manner.
The cooling air sent to the middle drive circuit board 88 passes through a ventilation path formed by the board case 80 and the like so as to cool the middle drive component 89 and the middle heat sink 90 in a concentrated manner.

  The cooling air that has cooled the upper drive circuit board 81, the lower drive circuit board 82, and the middle drive circuit board 88 is then discharged outside the substrate case 80 without joining together in the substrate case 80. That is, the substrate case 80 is configured to have independent air passage structures in the upper, middle, and lower stages. The cooling air that has cooled the upper drive circuit board 81 is supplied to the heating coil unit 20a, and the cooling air that has cooled the lower drive circuit board 82 and the middle drive circuit board 88 is supplied to the heating coil unit 20b and the heating coil unit 20c. It comes to be supplied.

  As described above, in the induction heating cooker 100C, the upper drive circuit board 81, the lower drive circuit board 82, and the middle drive circuit board 88 are arranged with their positions shifted in the horizontal direction. In this way, a vertical air path in the substrate case 80 can be secured, and the cooling air that has passed through each drive circuit board can easily escape upward from the substrate case 80, and the upward airflow can be promoted.

  In addition, in the induction heating cooker 100 </ b> C, the cooling air that has passed through the upper drive circuit board 81, the lower drive circuit board 82, and the middle drive circuit board 88 does not merge in the board case 80, and is discharged from the board case discharge port 87. It is discharged out of the case (each heating coil). Therefore, it is possible to prevent an increase in pressure loss caused by the combined flow of the flows at a place where the wind speed is large (the air volume is large) in the substrate case 80, and low pressure loss in the cooling air passage can be realized. At the same time, it is possible to reduce the noise associated with reducing the rotational speed of the cooling fan 9.

  As described above, the induction heating cooker according to the present invention can be applied to the use of a stationary induction heating cooker as well as a built-in type.

  DESCRIPTION OF SYMBOLS 1 Housing | casing, 2 Top plate, 3 Heating port, 4 Operation part, 5 Display part, 5a Display window, 6 Grill part, 8 Drive circuit part, 9 Cooling fan, 10 Air inlet, 11 Air outlet, 20 Heating coil unit, 20a Heating coil unit, 20b Heating coil unit, 20c Heating coil unit, 21 Induction heating coil, 22 Coil base, 23 Coil cooling duct, 24 Coil cooling discharge hole, 80 Board case, 81 Upper stage driving circuit board (uppermost stage driving circuit board ), 82 Lower drive circuit board (lowermost drive circuit board), 83 Upper drive part, 84 Lower drive part, 85 Upper heat sink, 86 Lower heat sink, 87 Substrate case outlet, 88 Middle drive circuit board, 89 Middle drive part, 90 middle heat sink, 91 motor, 92 lower suction port, 93 upper suction port, 4 lower outlet, 95 the upper outlet, 100A induction heating cooker, 100B induction heating cooker, 100C induction heating cooker 200 object to be heated.

Claims (6)

A plurality of heating coils;
A plurality of drive circuit boards for driving the heating coil;
A substrate case that is partitioned into a plurality of upper and lower stages, and stores the drive circuit board in each stage;
A cooling fan for cooling the heating coil and the drive circuit board,
The cooling fan is
The outlet is divided into upper and lower parts, and the lower outlet air volume of the cooling fan is set larger than the upper outlet air volume.
The drive circuit board disposed on the lower side is configured to drive and control more heating coils than the drive circuit board disposed on the upper side.
Without the cooling air that has passed through the plurality of drive circuit boards merge in the board case,
Cooling air that has passed through the drive circuit board disposed on the upper stage side is supplied to the heating coil controlled by the drive circuit board disposed on the upper stage side,
An induction heating cooker having an independent air path through which cooling air that has passed through a driving circuit board disposed on the lower side is supplied to the heating coil controlled by the driving circuit board disposed on the lower side. The induction heating cooker according to claim 1, wherein a total heat generation amount of the drive circuit board disposed on the lower stage side is made larger than a total heat generation amount of the drive circuit board disposed on the upper stage side. The induction heating cooker according to claim 1 or 2, wherein a horizontal area of the drive circuit board disposed on the lower stage side is larger than a horizontal area of the drive circuit board disposed on the upper stage side. The horizontal direction area of the drive circuit board arranged on the upper stage side and the horizontal area of the drive circuit board arranged on the lower stage side are made the same, and the positions are shifted in the front-rear direction. The induction heating cooker described. A plurality of heating coils;
A plurality of drive circuit boards for driving the heating coil;
A board case that is partitioned into three upper and lower stages and stores the drive circuit boards, respectively,
A cooling fan for cooling the heating coil and the drive circuit board,
The cooling fan is
The blower outlet is divided into upper and lower portions, the lower blowout air volume of the cooling fan is set to be larger than the upper blowout airflow, and the cooling air discharged from the lower blowout port, Cool the lower two-stage drive circuit board,
Without the cooling air that has passed through the plurality of drive circuit boards merge in the board case,
Cooling air that has passed through the drive circuit board disposed on the upper stage side is supplied to the heating coil controlled by the drive circuit board disposed on the upper stage side,
An induction heating cooker having an independent air passage through which the cooling air that has passed through the lower two-stage drive circuit boards is supplied to the heating coil that is controlled by the drive circuit boards that are arranged in the lower two stages . The induction heating cooking as described in any one of Claims 1-5 which supplies a part of cooling air which passed the drive circuit board arrange | positioned in the lowest step among these drive circuit boards to an operation part and a display part. vessel.

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