JP6112996B2 - Tray carrier - Google Patents

Description

The present invention, a tray is placed a semiconductor wafer is loaded into the apparatus, to a belt lay-carrier used in the process apparatus for forming.

  In the conventional tray carrier, one side surface of the resin container is opened, and a plurality of slots are provided at equal intervals in the vertical direction in the resin container. When the tray is stored in the tray carrier, the tray is manually loaded in the horizontal direction and then placed in the slot (see, for example, Patent Document 1).

  In addition, there is a type in which a semiconductor wafer is placed on a drawer-type tray (wafer carrier A), and then the tray is horizontally inserted into a shelf-type tray carrier (wafer carrier B) (see, for example, Patent Document 2). ).

  Furthermore, when carrying the tray in the horizontal direction, a means for automatically carrying (for example, see Patent Document 3) or a tray carrying-in / out device provided with such a means for automatically carrying the tray is used (for example, (See Patent Document 4).

JP 2012-33619 A JP 2004-79738 A JP-A-60-91652 JP 2006-19544 A

  In the tray carrier described in Patent Document 1, when the tray on which the semiconductor wafer before film formation is placed is stored in the tray carrier, the slot on which the outer peripheral portion of the upper surface of the tray is placed is placed in the tray carrier. It is easy to rub against the lower surface of the upper slot. For this reason, the deposit deposited on the outer periphery of the upper surface of the tray at the time of the previous film formation is peeled off and scattered by rubbing against the lower surface of the upper slot, and the semiconductor wafer before film deposition placed on the tray The film adheres to the surface as dust, and the film is deposited on the dust adhered during the subsequent film formation. As a result, the quality of the semiconductor wafer is degraded.

  In addition, when the tray on which the semiconductor wafer after film formation is placed is taken out from the tray carrier, the outer surface of the upper surface of the tray and the outer periphery of the upper surface of the tray are rubbed and the deposit on the outer periphery of the upper surface of the tray Is peeled off and scattered and adheres to the tray carrier by static electricity, and then adheres as dust to the surface of the semiconductor wafer before film deposition placed on the tray housed in the tray carrier.

  In order to solve such a problem of the tray carrier, as in the technique described in Patent Document 2, a thin drawer-type tray for storing one semiconductor wafer and a shelf-type tray carrier are mounted on the semiconductor wafer. In this case, not only a tray carrier having a complicated shape is required, but also an automatic machine having a transfer arm or a transfer arm is required for the transfer operation of the tray.

  In order to suppress rubbing between the tray and the slot of the tray carrier, a transfer arm used when taking out the semiconductor wafer from the tray as in the technique described in Patent Document 3 is attached to the tray on which the semiconductor wafer is placed. There is a method to employ, or a method using a suction stage or the like when placing the tray, but a transfer arm, a suction stage or an automatic machine is required.

  Further, as in the technique described in Patent Document 4, a substrate transfer apparatus and a substrate that are equipped with alignment means and can be reliably aligned so that the tray matches the mounting position in the slot of the tray carrier. There is a method using a transport system or a substrate transport robot, but a large apparatus is required when the tray is stored and taken out from the tray carrier.

  Furthermore, in the above technique, it is necessary to prepare a tray carrier. However, a tray carrier containing a plurality of trays has a problem that workability is not good due to its heavy weight.

  Therefore, the present invention provides a technique capable of preventing the rubbing of the tray at the time of placing the tray on the tray carrier or taking out the tray from the tray carrier and improving the workability. For the purpose.

A tray carrier according to the present invention is a tray carrier comprising a tray holder for holding a tray on which a semiconductor wafer is placed and a base plate for stacking and placing the tray holder, the tray holder being vertically And an opening in which the front direction is opened, and a step for placing the tray on the left and right sides of the inner peripheral edge of the opening and lower than the upper surface of the tray holder. length from the bottom surface of the stepped portion to the upper surface of the tray holder, the formed to be larger than the tray thickness, the tray holder is formed in a U-shape in plan view, the plurality and Ri stackable der through respective spacers in the vertical direction, the spacer is both tip and the curved portion of the U-shape of the tray holder, the bets A counterbore, which is arranged so as to protrude downward from the lower surface of the holder, is formed on both the U-shaped tip ends of the tray holder and the upper surface of the curved portion, into which the lower end of the spacer of another tray holder can be inserted. Two protrusions projecting forward from the side surface of the rear portion of the stepped portion at a predetermined interval in the left-right direction are formed, and a positioning counterbore for positioning by inserting the lower end portion of the spacer on the upper surface of the base plate Is formed .

According to the present invention, there is provided a tray carrier including a tray holder for holding a tray on which a semiconductor wafer is placed and a base plate for stacking and placing the tray holders , and the tray holder has a vertical direction and a forward direction. The tray holder includes an opened opening, and a step portion that is formed to be lower than the upper surface of the tray holder at least on the left and right sides of the inner peripheral edge of the opening portion, and on which the tray is placed. stacking up the upper surface length of, are formed to be larger than the tray thickness, tray holder is formed in a U-shape in plan view, the plurality via a respective spacer in a vertical direction Is possible.

Therefore, when placing the tray on the tray holder or taking out the tray from the tray holder, it is only necessary to move the tray up and down. Moreover, peeling and scattering of the thin film formed can be prevented. In addition, since a large apparatus is not required when storing and taking out the tray, it is possible to prevent the tray from being rubbed at a low cost. Since the tray holder is formed in a U shape in plan view, it is possible to reduce the weight of the tray holder and improve the shape stability. Further, by using the base plate as a conventional base plate, the tray carrier can be used without any modification to the carrier station for loading the tray carrier of the process apparatus for forming a film on the semiconductor wafer.

Since the spacers are arranged at both the U-shaped tip and the bent portion of the tray holder so as to protrude downward from the lower surface of the tray holder, a plurality of tray holders can be obtained without significantly increasing the weight of the tray holder. It becomes possible to enlarge the space | interval of an upper tray holder and a lower tray holder in the state which accumulated. A counterbore into which the lower end of the spacer of another tray holder can be inserted is formed on both top ends of the U-shape and the curved portion of the tray holder, so that a plurality of tray holders can be easily stacked in the vertical direction. The tray carrier can be easily configured. Since two protrusions projecting forward from the side surface of the rear part of the step part with a predetermined interval in the left-right direction are formed, the tray is placed on the step part with the outer peripheral part of the tray in contact with the two protrusion parts. By placing, the positional deviation of the tray placed on the step portion can be suppressed. Since the positioning counterbore for positioning by inserting the lower end portion of the spacer is formed on the upper surface of the base plate, it is possible to suppress the displacement of the tray holder with respect to the tray carrier.

(A) It is a top view of the tray holder which concerns on Embodiment 1. FIG. (B) It is a front view of the tray holder which concerns on Embodiment 1. FIG. (A) It is a top view of the tray holder which concerns on the modification of Embodiment 1. FIG. (B) It is a front view of the tray holder which concerns on the modification of Embodiment 1. FIG. 10 is a front view of a tray holder according to Embodiment 2. FIG. 10 is a front view of a tray holder according to a modification of the second embodiment. FIG. (A) It is a top view of the tray holder which concerns on Embodiment 3. FIG. (B) It is a front view of the tray holder which concerns on Embodiment 3. FIG. (C) It is a rear view of the tray holder which concerns on Embodiment 3. FIG. (D) It is a side view of the tray holder which concerns on Embodiment 3. FIG. 6 is a plan view of a tray holder according to Embodiment 4. FIG. 10 is a plan view of a tray holder according to Modification 1 of Embodiment 4. FIG. 10 is a plan view of a tray holder according to a second modification of the fourth embodiment. FIG. FIG. 10 is a plan view showing a state in which a tray is placed on a tray holder according to Modification 2 of Embodiment 4. 10 is a front view of a tray carrier according to Embodiment 5. FIG. 10 is a front view of a tray holder according to Embodiment 6. FIG. 10 is a front view of a tray holder according to Embodiment 7. FIG. FIG. 10 is a side view of a tray carrier according to an eighth embodiment. FIG. 10 is a plan view of a base plate of a tray carrier according to an eighth embodiment. FIG. 29 is a plan view of a base plate of a tray carrier according to a modification of the eighth embodiment. 10 is a front view of a tray carrier according to Embodiment 9. FIG. FIG. 10 is a plan view of a base plate of a tray carrier according to a ninth embodiment. FIG. 10 is a side view of a tray carrier according to Embodiment 10. FIG. 38 is a plan view of a tray carrier according to Modification 1 of Embodiment 10. FIG. 38 is a plan view of a tray carrier according to a second modification of the tenth embodiment. FIG. 38 is a side view of a tray carrier according to Modification 3 of Embodiment 10.

<Embodiment 1>
Embodiment 1 of the present invention will be described below with reference to the drawings. FIG. 1A is a plan view of the tray holder 1 according to the first embodiment, and FIG. 1B is a front view of the tray holder 1 according to the first embodiment.

  The tray holder 1 is a member that is formed in a U shape in plan view and holds the tray 10 on which a semiconductor wafer (not shown) is placed. The tray holder 1 includes an opening 2 and a step 3, and the opening 2 is formed so that the vertical direction and the front direction are opened in the tray holder 1. The opening 2 is opened as an operation area of a tray transfer arm of a film forming process apparatus for storing and taking out the tray 10.

  The opening 2 is formed in a rectangular shape in plan view, and the step 3 is formed to be lower than the upper surface of the tray holder 1 on the left and right sides of the inner peripheral edge of the opening 2. In the opening 2, the front and rear lengths and the left and right lengths of the portion above the step 3 are slightly larger than the diameter of the tray 10 formed in a disk shape, and the step 3 is the front end of the opening 2. To the rear end and has a width that can hold the end of the tray 10. For this reason, the tray 10 can be placed on the bottom surface of the step portion 3.

  The left and right outer peripheral portions of the tray holder 1 function as handles, and the operator can move the tray holder 1 by grasping the left and right outer peripheral portions of the tray holder 1 with both hands. The upper and lower surfaces of the tray holder 1 are each formed in a plane, and the tray holder 1 is formed so that a plurality of the tray holders 1 can be stacked in the vertical direction via spacers 5a and 5b (see FIG. 5B). ing. The spacers 5a and 5b may be formed integrally with the tray holder 1 or may be separate.

  The length from the bottom surface of the step portion 3 to the upper surface of the tray holder 1 is formed so as to be larger than the thickness of the tray 10, and even when a plurality of tray holders 1 are stacked vertically, the upper tray The lower surface of the holder 1 and the upper surface of the tray 10 held by the lower tray holder 1 are not in contact with each other. The lower surface of the upper tray holder 1 and the semiconductor wafer placed on the tray 10 held by the lower tray holder 1 do not come into contact with each other. The stacking of the tray holder 1 will be described in detail in the fifth embodiment.

  As described above, in the tray holder 1 according to the first embodiment, the opening 2 is opened in the vertical direction and the front direction, and is lower than the upper surface of the tray holder 1 at least on the left and right sides of the inner peripheral edge of the opening 2. And the step portion 3 for placing the tray 10 is formed, and the length from the bottom surface of the step portion 3 to the surface of the tray holder 1 is formed to be larger than the thickness of the tray 10, A plurality of tray holders 1 can be stacked in the vertical direction via spacers 5a and 5b.

  Therefore, when the tray 10 is placed on the tray holder 1 or when the tray 10 is taken out from the tray holder 1, it is only necessary to move the tray 10 in the vertical direction. Occasionally, the thin film formed on the outer peripheral portion of the upper surface of the tray 10 can be prevented from peeling and scattering. In addition, since a large apparatus is not required when the tray 10 is stored and taken out, the tray 10 can be prevented from being rubbed at a low cost. As a result, the yield of the semiconductor wafer can be improved.

  Further, since the plurality of tray holders 1 can be stacked in the vertical direction via the spacers 5a and 5b, there is no need to use a conventional tray carrier, and the tray holder 1 for holding the tray 10 is a conventional tray carrier. Workability is improved because of its light weight.

  Further, in the tray holder 1, since the upper surface of the tray 10 is exposed, there is a high possibility that environmental foreign matter floating in the clean room adheres to the semiconductor wafer placed on the tray 10, but a dummy tray is placed thereon. By attaching the tray holder 1 to the upper side of the tray holder 1 on which the tray 10 on which the semiconductor wafer is placed is placed, the adhesion of environmental foreign matters floating in the clean room to the semiconductor wafer can be suppressed.

  Further, since the tray holder 1 is formed in a U shape in plan view, the operator can easily grasp the left and right outer peripheral portions of the tray holder 1 and can easily move the tray holder 1.

  Next, a modification of the first embodiment will be described. FIG. 2A is a plan view of the tray holder 31 according to the modification of the first embodiment, and FIG. 2B is a front view of the tray holder 31 according to the modification of the first embodiment. As shown in FIGS. 2A and 2B, the stepped portion 3 does not have to be formed from the front end to the rear end of the inner peripheral edge of the opening 2. What is necessary is just to form from the rear side part to the rear end rather than the front end. Since the tray 10 is placed at the central portion on the left and right of the inner peripheral edge of the opening 2, the step portion 3 is formed from this portion to the rear end, so that the tray 10 can be held.

  Further, since the front and rear length of the step portion 3 is made smaller than the diameter of the tray 10, when the tray holder 1 is tilted left and right, the tray 10 comes into contact with the front wall 3 a rising upward from the front end of the step portion 3. The tray 10 can be prevented from falling.

<Embodiment 2>
Next, the tray holder 41 according to Embodiment 2 will be described. FIG. 3 is a front view of the tray holder 41 according to the second embodiment. In the second embodiment, the same components as those described in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  In the second embodiment, the recess 4 is formed on the lower surface of the left and right outer peripheral portions of the tray holder 41, that is, the outer lower surface of the step portion 3 in the tray holder 41.

  As described above, according to the tray holder 41 according to the second embodiment, the provision of the recess 4 improves the retainability of the tray holder 41 when the operator handles it by hand. Further, when the tray holders 41 are stacked, the contact of the operator's hand with the tray 10 or the semiconductor wafer stored in the tray holder 41 placed under the tray holder 41 can be suppressed.

  Next, a modification of the second embodiment will be described. FIG. 4 is a front view of a tray holder 51 according to a modification of the second embodiment.

  As shown in FIG. 4, the recess 4 is formed on the outer lower surface of the step portion 3 in the tray holder 51 and on the rear side of the step portion 3. The recess 4 is an outer lower surface of the step portion 3 in the tray holder 51 and is formed only on the rear side of the step portion 3, so that the upper tray holder 51 is stacked in a state where a plurality of tray holders 51 are stacked. The contact area between the lower surface of the tray holder 51 and the upper surface of the lower tray holder 51 is larger than that of the tray holder 41. For this reason, when the tray holder 51 is inclined rearward, the tray holder 51 can be prevented from dropping.

<Embodiment 3>
Next, the tray holder 61 according to Embodiment 3 will be described. 5A is a plan view of the tray holder 61 according to the third embodiment, FIG. 5B is a front view of the tray holder 61 according to the third embodiment, and FIG. FIG. 5D is a rear view of the tray holder 61 according to the third embodiment, and FIG. 5D is a side view of the tray holder 61 according to the third embodiment. In the third embodiment, the same components as those described in the first and second embodiments are denoted by the same reference numerals, and the description thereof is omitted.

  In the first and second embodiments, the entire tray holder has a thin configuration with the same thickness, but in the third embodiment, spacers 5a and 5b are arranged on the lower surface of the tray holder 61. The spacer 5 a is disposed so as to protrude from the lower surface of the front end portion on the left and right of the tray holder 61, and the spacer 5 b is disposed so as to protrude from the lower surface of the rear end portion at the center portion of the tray holder 61. Note that spacers having various heights can be used.

  As described above, in the tray holder 61 according to the third embodiment, the spacers 5a and 5b that protrude downward from the lower surface of the tray holder 61 are arranged. In the state where the tray holders 61 are stacked, the interval between the upper tray holder 61 and the lower tray holder 61 can be increased.

  Furthermore, by using spacers having different heights, it becomes easy to cope with process apparatuses having different intervals between the upper and lower tray holders.

<Embodiment 4>
Next, a tray holder 71 according to Embodiment 4 will be described. FIG. 6 is a plan view of the tray holder 71 according to the fourth embodiment. Note that in the fourth embodiment, the same components as those described in the first to third embodiments are denoted by the same reference numerals and description thereof is omitted.

In the first to third embodiments, the tray holder is formed in a U shape in plan view, but in the fourth embodiment, the tray holder 71 is formed in a U shape in plan view. The step 3 is formed over the entire inner peripheral edge of the opening 2. Spacers 5 a are arranged so as to protrude from the lower surface of the front end portion on the left and right sides of the tray holder 71 , and spacers 5 b are arranged so as to protrude from the lower surface of the rear end portion at the center portion of the tray holder 71 .

  As described above, in the tray holder 71 according to the fourth embodiment, since the tray holder 71 is formed in a U shape in plan view, the weight of the tray holder 71 can be reduced and the shape stability can be improved. Can be improved.

  Next, a modification of the fourth embodiment will be described. 7 is a plan view of a tray holder 81 according to Modification 1 of Embodiment 4, FIG. 8 is a plan view of a tray holder 72 according to Modification 2 of Embodiment 4, and FIG. 10 is a plan view showing a state in which the tray 10 is placed on the tray holder 82 according to Modification 2 of Embodiment 4. FIG.

  As shown in FIG. 7, in the first modification of the fourth embodiment, the stepped portion 3 is formed only in a region corresponding to the outer peripheral portion of the tray 10 in the inner peripheral edge portion of the opening 2. Although not shown, spacers 5 a and 5 b are also arranged in the tray holder 81. In this case, since the step portion 3 is formed in accordance with the contour shape of the tray 10, the positional deviation of the tray 10 placed on the step portion 3 can be suppressed.

  As shown in FIG. 8, in the second modification of the fourth embodiment, two projecting portions 6 projecting from the side surface of the step portion 3 toward the step portion 3 side are formed. The two protrusions 6 are formed so as to protrude from the side surface of the rear part of the step part 3 to the front side with a predetermined interval in the left-right direction. In this case, since the tray 10 is placed on the stepped portion 3 in a state where the outer peripheral portion of the tray 10 is in contact with the two protruding portions 6, the positional deviation of the tray 10 placed on the stepped portion 3 can be suppressed.

  As shown in FIG. 9, in the third modification of the fourth embodiment, the step portion 3 is formed only in a region corresponding to the outer peripheral portion of the tray 10 in the inner peripheral edge portion of the opening 2, and from the side surface of the step portion 3. Two protrusions 6 projecting to the step 3 side are formed. The two protrusions 6 are formed so as to protrude from the side surface of the rear part of the step part 3 to the front side with a predetermined interval in the left-right direction. In this case, the step portion 3 is formed in accordance with the shape of the outer peripheral portion of the tray 10, and the tray 10 is placed on the step portion 3 in a state where the outer peripheral portion of the tray 10 is in contact with the two protrusions 6. Therefore, the positional deviation of the tray 10 placed on the step portion 3 can be further suppressed.

<Embodiment 5>
Next, the tray carrier 100 according to Embodiment 5 will be described. FIG. 10 is a front view of the tray carrier 100 according to the fifth embodiment. Note that in the fifth embodiment, the same components as those described in the first to fourth embodiments are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIG. 10, in the fifth embodiment, the tray carrier 100 includes a plurality of tray holders 72, and the plurality of tray holders 72 are stacked in the vertical direction via spacers 5a and 5b, respectively. Yes.

  As described above, in the tray carrier 100 according to the fifth embodiment, the tray holder 72 is stacked in the vertical direction via the spacers 5a and 5b, so that the semiconductor wafer on the tray 10 can be formed without using the conventional tray carrier. Process equipment for film formation can be used. In addition, since a large apparatus is not required when the tray 10 is stored and taken out, the tray 10 can be prevented from being rubbed at a low cost.

  Furthermore, since the tray holder 72 constituting the tray carrier 100 holds the tray 10 and is lighter than a conventional tray carrier, the work of loading and unloading the tray carrier 100 to and from the process apparatus is facilitated.

  Furthermore, since it is not necessary to produce a mold when producing the tray carrier, it is possible to carry out trial production of the tray carrier or evaluation of the material for the tray carrier at a low cost. In addition, it is possible to prototype or manufacture a tray carrier with a material that cannot be molded.

  In the fifth embodiment, the tray carrier 72 is configured by stacking the tray holders 72 in the vertical direction. However, instead of the tray holder 72, other tray holders such as the tray holders 61, 71, 81, 82 are arranged in the vertical direction. It is also possible to configure a tray carrier by stacking. It is also possible to form a tray carrier by stacking the tray holders 1, 31, 41, 51 in the vertical direction after arranging the spacers on the lower surfaces of the tray holders 1, 31, 41, 51.

<Embodiment 6>
Next, the tray holder 62 according to Embodiment 6 will be described. FIG. 11 is a front view of the tray holder 62 according to the sixth embodiment. Note that in the sixth embodiment, the same components as those described in the first to fifth embodiments are denoted by the same reference numerals, and description thereof is omitted.

  In the first to fourth embodiments, the upper surface of the tray holder is formed flat. However, in the sixth embodiment, counterbore 7a and 7b are formed on the upper surface of the tray holder 62 as shown in FIG. The counterbore 7a is formed on the upper surface of the front end portion on the left and right sides of the tray holder 62, in the same shape as the lower end portion of the spacer 5a, and at a position corresponding to the spacer 5a. The counterbore 7b is formed on the upper surface of the rear end portion in the central portion of the tray holder 62, and is formed in the same shape as the lower end portion of the spacer 5b and at a position corresponding to the spacer 5b. For this reason, the lower end portions of the spacers 5 a and 5 b of the upper tray holder 62 are inserted into the counterbores 7 a and 7 b of the lower tray holder 62 in a state where the tray holders 62 are stacked in the vertical direction. Here, the height of the spacers 5a and 5b is set in consideration of the depth of the counterbore 7a and 7b.

  As described above, in the tray holder 62 according to Embodiment 6, the counterbore 7a and 7b into which the lower ends of the spacers 5a and 5b can be inserted are formed on the upper surface of the tray holder 62. The tray carrier can be easily stacked in the direction, and the tray carrier can be easily configured.

<Embodiment 7>
Next, the tray holder 63 according to Embodiment 7 will be described. FIG. 12 is a front view of the tray holder 63 according to the seventh embodiment. Note that in the seventh embodiment, the same components as those described in the first to sixth embodiments are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIG. 12, in the seventh embodiment, counterbore 8 a and 8 b are arranged on the lower surface of the tray holder 63. The counterbore 8a is formed on the lower surface of the front end portion on the left and right of the tray holder 63, and is formed in the same shape as the upper end portion of the spacer 5a and at a position corresponding to the spacer 5a. The counterbore 8b is formed on the lower surface of the rear end portion in the central portion of the tray holder 63, and is formed in the same shape as the upper end portion of the spacer 5b and at a position corresponding to the spacer 5b. For this reason, when stacking a plurality of tray holders 63, the upper ends of the spacers 5 a and 5 b are inserted into the counterbores 8 a and 8 b of the tray holder 63. Here, the height of the spacers 5a and 5b is set in consideration of the depth of the counterbore 8a and 8b.

  As described above, in the tray holder 63 according to the seventh embodiment, the counterbores 8a and 8b into which the upper ends of the spacers 5a and 5b can be inserted are formed on the lower surface of the tray holder 63. The positional deviation of the spacers 5a and 5b is suppressed, and the positional deviation of the tray holder 63 can be suppressed when a plurality of tray holders 63 are stacked to form a tray carrier.

<Eighth embodiment>
Next, the tray carrier 101 according to the eighth embodiment will be described. FIG. 13 is a side view of the tray carrier 101 according to the eighth embodiment. FIG. 14 is a plan view of the base plate 11. Note that in the eighth embodiment, the same components as those described in the first to seventh embodiments are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 13, the tray carrier 101 according to the eighth embodiment includes one or a plurality of tray holders 72 and a base plate 11. As shown in FIG. 14, the base plate 11 is a base plate having the same shape as the bottom plate of a conventional tray carrier. More specifically, the base plate 11 is formed in a flat plate shape, and the base plate 11 includes a semicircular portion and a linear portion. The shape of the semicircular portion of the base plate 11 in plan view is formed to be substantially the same as the shape in plan view when the tray 10 is placed on the tray holder 72, and the tray holder 72 is formed in this semicircular portion. Is placed. A carrier mounting block 12 that restricts horizontal movement of the base plate 11 is disposed on the outer periphery of the semicircular portion of the base plate 11, and a carrier fixing mechanism 13 that fixes the base plate 11 to the center of the semicircular portion of the base plate 11. Is arranged.

  As described above, in the tray carrier 101 according to the eighth embodiment, one or a plurality of tray holders 72 are provided, and one or a plurality of tray holders 72 are stacked in the vertical direction via the spacers 5a and 5b, respectively. Since the base plate 11 for further mounting is further provided, by using the base plate 11 as a conventional base plate, the tray carrier 101 can be used without any modification to the carrier station for loading the tray carrier of the process apparatus for forming a film on the semiconductor wafer. Can be used.

  Next, a modification of the eighth embodiment will be described. FIG. 15 is a plan view of the base plate 11 of the tray carrier 101 according to the modification of the sixth embodiment. As shown in FIG. 15, an L-shaped positioning member 14 in a plan view is disposed at one corner of the base plate 11 on the process apparatus side. The positioning member 14 has one or a plurality of tray holders 72 placed on the base plate 11, and the right front end of the tray holder 72 and its peripheral part are in contact with each other, so that A plurality of tray holders 72 are positioned.

  A plate-shaped positioning member 15 is disposed at another corner of the base plate 11 on the process apparatus side. The positioning member 15 has one or more tray holders 72 placed on the base plate 11, and the left front end of the tray holder 72 is in contact with the base plate 11. The holder 72 is positioned.

  Since the base plate 11 includes the positioning members 14 and 15 for positioning the tray holder 72 with respect to the base plate 11, the tray holder 72 can be placed at an accurate position, and is the same position as when a conventional tray carrier is used. The tray 10 can be placed on the tray.

<Embodiment 9>
Next, the tray carrier 102 according to Embodiment 9 will be described. FIG. 16 is a front view of the tray carrier 102 according to the ninth embodiment, and FIG. 17 is a plan view of the base plate 21. Note that in the ninth embodiment, the same components as those described in the first to eighth embodiments are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 16, the tray carrier 102 according to the ninth embodiment includes one or a plurality of tray holders 62 or tray holders 63 and a base plate 21. As shown in FIG. 17, the base plate 21 is a base plate having the same shape as the bottom plate of a conventional tray carrier. More specifically, the base plate 21 is formed in a flat plate shape, and the base plate 21 is formed in a semicircular shape in plan view. The shape of the base plate 21 in plan view is formed to be substantially the same shape as in plan view when the tray 10 is placed on the tray holder 62 or tray holder 63, and the tray holder 62 or tray holder 63 is formed on the base plate 21. Is placed. A carrier fixing mechanism 13 that fixes the base plate 21 is disposed at the center of the base plate 21.

  Positioning counterbores 22 a and 22 b are formed on the upper surface of the base plate 21. The counterbores 22a and 22b for positioning are formed on the upper surface of the front end portion at the left and right end portions of the base plate 21, and are formed in the same shape as the lower end portion of the spacer 5a and at a position corresponding to the spacer 5a. . The counterbore 22b for positioning is formed on the upper surface of the rear end portion at the center portion of the base plate 21, and is formed in the same shape as the lower end portion of the spacer 5b and at a position corresponding to the spacer 5b. For this reason, the lower ends of the spacers 5 a and 5 b of the tray holder 62 or the tray holder 63 are inserted into the positioning counterbores 22 a and 22 b of the base plate 21. Here, the height of the spacers 5a and 5b is set in consideration of the depth of the counterbores 22a and 22b for positioning.

  As described above, in the tray carrier 102 according to the ninth embodiment, since the positioning counterbores 22a and 22b for inserting and positioning the lower ends of the spacers 5a and 5b are formed on the upper surface of the base plate 21, The positional deviation of the tray holder 62 or the tray holder 63 can be suppressed.

  Further, a base plate for providing one or a plurality of tray holders 62 or 63 for stacking and mounting one or a plurality of tray holders 62 or tray holders 63 in the vertical direction via spacers 5a and 5b, respectively. Since the base plate 21 is used as a conventional base plate, the tray carrier 102 can be used without any modification to a carrier station for loading a tray carrier of a process apparatus for forming a film on a semiconductor wafer.

<Embodiment 10>
Next, the tray carrier 103 according to the tenth embodiment will be described. FIG. 18 is a side view of the tray carrier 102 according to the tenth embodiment. Note that in the tenth embodiment, the same components as those described in the first to ninth embodiments are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 18, the tray carrier 103 according to the tenth embodiment is a pressing member 17 that presses the tray holder 72 against the positioning members 14 and 15 against the tray carrier 101 according to the eighth embodiment shown in FIG. It has. The positioning member 15 is not shown in the drawing because it is hidden behind the positioning member 14. The pressing member 17 includes a horizontal plate portion 17a and a vertical plate portion 17b that rises up and down from one end of the horizontal plate portion 17a, and is formed in an L shape in a side view. The horizontal plate portion 17 a of the pressing member 17 is fixed to the straight portion of the base plate 11 with a fixing screw 18. The vertical plate portion 17 b of the pressing member 17 is in contact with the rear end portion of the one or more tray holders 72 and presses the one or more tray holders 72 against the positioning members 14 and 15.

  As described above, in the tray carrier 103 according to the tenth embodiment, since the base plate 11 further includes the pressing member 17 that presses the tray holder 72 against the positioning members 14 and 15, the tray holder 72 is placed at a more accurate position. This can further suppress displacement of the tray holder 72.

  Next, a modification of the tenth embodiment will be described. 19 is a plan view of the tray carrier 104 according to the first modification of the tenth embodiment, and FIG. 20 is a plan view of the tray carrier 105 according to the second modification of the tenth embodiment. FIG. 21 is a side view of the tray carrier 106 according to the third modification of the tenth embodiment.

  In FIG. 18, the pressing member 17 is disposed so as to press the tray holder 72 in the direction of the process apparatus, but may be disposed so as to be pressed in an oblique direction as shown in FIG. 19.

  Further, as shown in FIG. 20, a plurality of pressing members 17 may be used. For example, the pressing member 17 may be disposed so as to contact the rear end portion and the left end portion of one or a plurality of tray holders 72.

  As shown in FIG. 21, the pressing member 17 may include a spring member 19. A spring member 19 is disposed between the mounting portion 20 disposed on the horizontal plate portion 17 a of the pressing member 17 and the vertical plate portion 17 b of the pressing member 17. The pressing member 17 presses one or a plurality of tray holders 72 against the positioning portions 14 and 15 using the elastic force of the spring member 19. For example, the elastic force of the spring member 19 can be adjusted by changing the position of the attachment portion 20.

  Since the pressing member 17 includes the spring member 19, not only can the positional deviation of the tray 10 placed on the tray holder 72 be suppressed, but the tray holder 72 can be placed on the base plate 11 by changing the position of the mounting portion 20. The operation of placing and taking out can be easily performed.

  In the eighth and tenth embodiments, the tray holder 72 is stacked in the vertical direction, but other tray holders such as the tray holders 61, 62, 63, 71, 81, and 82 are stacked in the vertical direction instead of the tray holder 72. Also good. It is also possible to form a tray carrier by stacking the tray holders 1, 31, 41, 51 in the vertical direction after arranging the spacers on the lower surfaces of the tray holders 1, 31, 41, 51. In these cases, the base plate is prepared in accordance with the shape of the tray holder to be stacked and the shape of the tray 10 placed on the tray holder in plan view.

  In the ninth embodiment, the tray holders 62 and 63 are stacked in the vertical direction. However, instead of the tray holders 62 and 63, other tray holders such as the tray holders 61, 71, 81, and 82 may be stacked in the vertical direction. . It is also possible to form a tray carrier by stacking the tray holders 1, 31, 41, 51 in the vertical direction after arranging the spacers on the lower surfaces of the tray holders 1, 31, 41, 51. In these cases, the base plate is prepared in accordance with the shape of the tray holder to be stacked and the shape of the tray 10 placed on the tray holder in plan view.

  It should be noted that the present invention can be freely combined with each other within the scope of the invention, and each embodiment can be appropriately modified or omitted.

  DESCRIPTION OF SYMBOLS 1 Tray holder, 2 opening part, 3 step part, 4 dent, 5a spacer, 5b spacer, 6 protrusion part, 7a counterbore, 7b counterbore, 8a counterbore, 8b counterbore, 10 tray, 11 base plate, 14 positioning member, 15 positioning member , 17 Pressing member, 19 Spring member, 21 Base plate, 22a Positioning counterbore, 22b Positioning counterbore, 31 Tray holder, 41 Tray holder, 51 Tray holder, 61 Tray holder, 62 Tray holder, 63 Tray holder, 71 Tray holder, 72 tray holder, 81 tray holder, 82 tray holder, 100 tray carrier, 101 tray carrier, 102 tray carrier, 103 tray carrier, 104 tray carrier, 105 tray carrier, 106 to Lee career.

Claims (7)

A tray carrier comprising a tray holder for holding a tray on which a semiconductor wafer is placed and a base plate for stacking and placing the tray holder ,
The tray holder is formed so as to be lower than the upper surface of the tray holder at least on the left and right sides of the opening in which the vertical direction and the front direction are opened and the inner peripheral edge of the opening, and for placing the tray With
The length from the bottom surface of the stepped portion to the top surface of the tray holder is formed to be larger than the thickness of the tray,
The tray holder is formed in a U-shape in plan view, the plurality, Ri stackable der through respective spacers in the vertical direction,
The spacer is disposed at both the U-shaped tip portion and the curved portion of the tray holder so as to protrude downward from the lower surface of the tray holder,
A counterbore into which the lower end of the spacer of another tray holder can be inserted is formed on the upper ends of both U-shaped tip portions and the curved portion of the tray holder,
Two protrusions projecting forward from the side surface of the rear portion of the stepped portion with a predetermined interval in the left-right direction are formed,
A tray carrier in which a counterbore for positioning for positioning by inserting a lower end portion of the spacer is formed on an upper surface of the base plate . The tray carrier according to claim 1, wherein dents are formed on the lower surfaces of the left and right outer peripheral portions of the tray holder. The tray carrier according to claim 1, wherein the stepped portion is formed from a rear portion to a rear end rather than a front end of an inner peripheral edge portion of the opening. The tray carrier according to claim 3 , wherein the step portion is formed in accordance with a contour shape of the tray . The base plate is provided with a positioning member for positioning the tray holder with respect to the base plate, according to claim 1, wherein the tray carrier. The tray carrier according to claim 5 , wherein the base plate further includes a pressing member that presses the tray holder against the positioning member. The tray carrier according to claim 6 , wherein the pressing member includes a spring member.

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