JP6110370B2 - 基材上に流体を衝突させるための装置及び方法 - Google Patents
基材上に流体を衝突させるための装置及び方法 Download PDFInfo
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- JP6110370B2 JP6110370B2 JP2014515860A JP2014515860A JP6110370B2 JP 6110370 B2 JP6110370 B2 JP 6110370B2 JP 2014515860 A JP2014515860 A JP 2014515860A JP 2014515860 A JP2014515860 A JP 2014515860A JP 6110370 B2 JP6110370 B2 JP 6110370B2
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/04—Treatment by energy or chemical effects using liquids, gas or steam
- B32B2310/0409—Treatment by energy or chemical effects using liquids, gas or steam using liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
- B32B37/203—One or more of the layers being plastic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Textile Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Treatment Of Fiber Materials (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Drying Of Solid Materials (AREA)
Description
実施形態1.第1の移動基材の第1の表面上に、加熱された第1の流体を衝突させ、前記衝突させた加熱された第1の流体の少なくとも一部分を局所的に除去し、前記第1の移動基材の前記第1の表面を第2の移動基材の第1の表面に結合させる方法であって、少なくとも1つの第1の流体送達出口と、前記第1の流体送達出口に対して局所的に位置付けられる少なくとも1つの第1の流体捕捉入口とを提供することと、前記第1の流体送達出口の近くに第1の移動基材を通し、前記第1の基材の前記第1の表面が加熱表面となるように、前記第1の移動基材の前記第1の表面上に前記第1の流体送達出口からの加熱された第1の流体を衝突させることと、前記少なくとも1つの第1の流体捕捉入口によって前記衝突させた第1の流体の体積流量の少なくとも60%を局所的に捕捉し、前記第1の流体捕捉入口に流体接続される少なくとも1つの第1の流体除去チャネルを通して、前記局所的に捕捉した第1の流体を除去することと、
第2の移動基材の第1の表面を、前記加熱された第1の流体の温度よりも少なくとも摂氏100度低い温度である第2の流体に接触させることと、前記第1の基材の前記第1の表面及び前記第2の基材の前記第1の表面が互いに融解結合するように、前記第1の基材の前記加熱された第1の表面を前記第2の基材の前記第1の表面に接触させることと、を含む、方法。
Claims (2)
- 第1の移動基材の第1の表面上に加熱された第1の流体を衝突させ、前記衝突させた加熱された第1の流体の少なくとも一部分を局所的に除去し、前記第1の移動基材の前記第1の表面を第2の移動基材の第1の表面に結合させる方法であって、
少なくとも1つの第1の流体送達出口と、前記第1の流体送達出口に対して局所的に位置付けられる少なくとも1つの第1の流体捕捉入口とを提供することと、
前記第1の流体送達出口の近くに前記第1の移動基材を通し、前記第1の基材の前記第1の表面が加熱表面となるように、前記第1の移動基材の前記第1の表面上に前記第1の流体送達出口からの加熱された第1の流体を衝突させることと、
前記少なくとも1つの第1の流体捕捉入口によって前記衝突させた第1の流体の体積流量の少なくとも60%を局所的に捕捉し、前記第1の流体捕捉入口に流体接続される少なくとも1つの第1の流体除去チャネルを通して、前記局所的に捕捉した第1の流体を除去することと、
第2の移動基材の第1の表面を、前記加熱された第1の流体の温度よりも少なくとも摂氏100度低い温度である第2の流体に接触させることと、
前記第1の基材の前記第1の表面及び前記第2の基材の前記第1の表面が互いに融解結合するように、前記第1の基材の前記加熱された第1の表面を前記第2の基材の前記第1の表面に接触させることと、を含む、方法。 - 第1の移動基材の第1の表面上に加熱された第1の流体を衝突させ、前記衝突させた加熱された第1の流体の少なくとも一部分を局所的に除去し、前記第1の移動基材の前記第1の表面を第2の移動基材の第1の表面に結合させるための装置であって、
少なくとも1つの第1の流体送達出口、及び前記第1の流体送達出口に対して局所的に位置付けられる少なくとも1つの第1の流体捕捉入口と、
前記第1の移動基材を支持し、前記第1の流体送達出口から送達される加熱された第1の流体が、前記第1の移動基材の第1の表面上に、それが加熱された第1の表面となるように衝突させられるように、前記第1の流体送達出口の近くに前記第1の移動基材を担持するように構成される第1のバッキング面と、
前記第2の移動基材を支持し、前記第2の移動基材の前記第1の表面を、前記第1の移動基材の前記加熱された第1の表面と接触させる合流経路に沿って、前記第2の移動基材を担持するように構成される第2のバッキング面と、を備え、ここで第2の移動基材の第1の表面は、前記加熱された第1の流体の温度よりも少なくとも摂氏100度低い温度である第2の流体と接触されている、装置。
Applications Claiming Priority (3)
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US13/160,036 US8956496B2 (en) | 2011-06-14 | 2011-06-14 | Apparatus and methods for impinging a fluid on a substrate |
US13/160,036 | 2011-06-14 | ||
PCT/US2012/040682 WO2012173804A2 (en) | 2011-06-14 | 2012-06-04 | Apparatus and methods for impinging a fluid on a substrate |
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JP2014518295A JP2014518295A (ja) | 2014-07-28 |
JP2014518295A5 JP2014518295A5 (ja) | 2015-07-23 |
JP6110370B2 true JP6110370B2 (ja) | 2017-04-05 |
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EP (1) | EP2720868B1 (ja) |
JP (1) | JP6110370B2 (ja) |
KR (1) | KR20140037914A (ja) |
CN (1) | CN103596760B (ja) |
BR (1) | BR112013032077A2 (ja) |
MX (1) | MX360297B (ja) |
TW (1) | TWI569886B (ja) |
WO (1) | WO2012173804A2 (ja) |
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- 2012-06-04 KR KR1020147000477A patent/KR20140037914A/ko not_active Application Discontinuation
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US10226897B2 (en) | 2019-03-12 |
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MX2013014737A (es) | 2014-02-17 |
CN103596760A (zh) | 2014-02-19 |
JP2014518295A (ja) | 2014-07-28 |
EP2720868B1 (en) | 2018-10-24 |
US20150158279A1 (en) | 2015-06-11 |
WO2012173804A2 (en) | 2012-12-20 |
KR20140037914A (ko) | 2014-03-27 |
CN103596760B (zh) | 2015-08-26 |
TWI569886B (zh) | 2017-02-11 |
US20120318454A1 (en) | 2012-12-20 |
MX360297B (es) | 2018-10-29 |
BR112013032077A2 (pt) | 2016-12-13 |
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EP2720868A4 (en) | 2015-04-01 |
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