JP6108756B2 - Light emitting device - Google Patents

Description

  The present invention relates to a COB (Chip On Board) type light emitting device.

  In recent years, various light-emitting devices using LEDs (Light Emitting Diodes) as light sources have been developed. Also, a COB (Chip On Board) type in which a plurality of LED chips are directly mounted on a substrate, each LED chip is connected to a circuit through wiring on the substrate, and each LED chip is resin-sealed is widely known. ing.

  For example, in Patent Documents 1 to 4, a rectangular or circular frame-shaped reflecting member is formed on a substrate, a plurality of light emitting elements are arranged inside the frame-shaped reflecting member, and a sealing resin is placed inside the frame-shaped reflecting member. Each light emitting element is covered with a sealing resin.

  In Patent Document 5, a plurality of element rows of light emitting elements are arranged on a substrate, and each element row is covered with a ladder-shaped sealing member.

JP 2011-228369 A JP 2011-238902 A JP 2012-15176 A JP 2012-142429 A Japanese Patent No. 4932164

  However, in the configuration in which sealing resin is filled inside the frame-shaped reflecting member as in Patent Documents 1 to 4 and each light emitting element disposed inside is sealed with resin, only each light emitting element is sealed with the sealing resin. Instead, a wide range of substrates is covered. For this reason, sealing resin became a heat insulating material with respect to the board | substrate, and the thermal radiation efficiency of the board | substrate fell.

  In addition, since the entire substrate is covered with the sealing resin, the size of the sealing resin increases both vertically and horizontally, and the distortion of the sealing resin caused by thermal expansion or the like increases, causing cracks in the sealing resin. And cracks are likely to occur.

  Further, in Patent Document 5, since the sealing member is formed in a ladder shape, an empty space of the substrate that is not covered by the sealing member is generated, and heat dissipation is considered to be efficiently performed in this empty space. However, this space has not been expanded to improve the heat dissipation efficiency.

  The present invention has been made in view of the above problems, and can suppress a decrease in the heat dissipation efficiency of the substrate while resin-sealing the light-emitting elements and wirings on the substrate. An object of the present invention is to provide a light-emitting device that does not easily generate light.

In order to solve the above problems, a light-emitting device of the present invention is a light-emitting device that includes a substrate, a plurality of light-emitting elements mounted on the substrate, and wiring that connects the light-emitting elements on the substrate. A strip-shaped sealing resin is formed on the substrate along the row of the light emitting elements and covers the row of the light emitting elements, and the wiring surrounds the plurality of light emitting elements. A first wiring portion provided; and a second wiring portion that connects the light emitting elements to form a row of the light emitting elements, wherein the first wiring portion is covered with a sealing resin, A space that is electrically connected to a land portion provided at an end of the substrate and where the strip-shaped sealing resin is parallel on the substrate is exposed between the parallel strip-shaped sealing resins. A space is provided, and the width of the empty space is changed according to the position on the substrate. , Rows of the respective light emitting elements is the same number of light emitting elements respectively connected, distant strip sealing resin from the center of the region surrounded by the first wiring portion, at least one portion is bent.

  In such a light emitting device of the present invention, the columns and wirings of the respective light emitting elements are covered and protected by the strip-shaped sealing resin. Moreover, in the location where strip | belt-shaped sealing resin parallels, the empty space which a board | substrate exposes is provided between the parallel strip | belt-shaped sealing resin. Since this empty space is not covered with the sealing resin, the heat radiation of the substrate is favorably performed in this empty space. Moreover, since the width of this empty space is changed according to the position on the substrate, the width of the empty space can be expanded to improve the heat radiation efficiency. Furthermore, since the size of the strip-shaped sealing resin is only increased in the longitudinal direction of the strip-shaped sealing resin, the strip-shaped sealing resin is less distorted due to thermal expansion, and cracks and cracks are generated in the strip-shaped sealing resin. It is hard to do.

  In the light emitting device of the present invention, a hole is formed in the substrate in the empty space, and a screw for fixing the substrate is inserted into the hole.

Thus, if the screw is inserted into the hole in the empty space of the substrate, the heat of the substrate is conducted to the outside through the screw, so that the heat dissipation efficiency of the substrate is increased. Moreover, when a hole is provided, it is preferable to bend the belt-shaped sealing resin along the hole.

  In the light-emitting device of the present invention, a plurality of the strip-shaped sealing resins are provided, and two adjacent strip-shaped sealing resins among the respective strip-shaped sealing resins contain phosphors having different fluorescent colors. Alternatively, the strip-shaped sealing resin is divided into a plurality of portions in the longitudinal direction of the strip-shaped sealing resin, and two portions adjacent to each other among the portions contain phosphors having different fluorescent colors.

  In this case, light in which fluorescent colors different from the light emitted from the light emitting element are mixed is emitted.

  In the light emitting device of the present invention, the hole is formed in the center of the substrate.

  Thus, when a hole is formed in the center of the substrate and a screw is inserted into the hole, the heat of the substrate is conducted from the center to the outside through the screw, so that the heat dissipation efficiency of the substrate is further increased.

  In the light-emitting device of the present invention, one strip-shaped sealing resin is continuously formed along the row of the light-emitting elements and the wiring.

  In this case, the area of the strip-shaped sealing resin is suppressed, the empty space where the substrate is exposed is widened, and the reduction in the heat dissipation efficiency of the substrate can be more effectively suppressed.

  In the light emitting device of the present invention, the width of the band-shaped sealing resin is wide at the site of each light emitting element and narrowed at the site of wiring between the light emitting elements.

  In this case, the light-emitting element is reliably resin-sealed with a strip-shaped sealing resin, and a vacant space is made wider at the portion of the wiring between the light-emitting elements, thereby more effectively suppressing a decrease in the heat dissipation efficiency of the substrate. Can do.

  In the present invention, the rows and wirings of the light emitting elements are covered and protected by the strip-shaped sealing resin. Moreover, in the location where strip | belt-shaped sealing resin parallels, the empty space which a board | substrate exposes is provided between the parallel strip | belt-shaped sealing resin. Since this empty space is not covered with the sealing resin, the heat radiation of the substrate is favorably performed in this empty space. In addition, since the width of the empty space is changed, the width of the empty space can be expanded according to the position on the substrate, and the heat dissipation efficiency can be improved. Furthermore, since the size of the strip-shaped sealing resin is only increased in the longitudinal direction of the strip-shaped sealing resin, the strip-shaped sealing resin is less distorted due to thermal expansion, and cracks and cracks are generated in the strip-shaped sealing resin. It is hard to do.

It is a top view which shows 1st Embodiment of the light-emitting device of this invention. It is a top view which shows the 1st modification of the light-emitting device of FIG. It is a top view which shows the 2nd modification of the light-emitting device of FIG. It is a top view which shows the 3rd modification of the light-emitting device of FIG. It is a top view which shows 2nd Embodiment of the light-emitting device of this invention. It is a top view which shows 3rd Embodiment of the light-emitting device of this invention. It is a top view which shows 4th Embodiment of the light-emitting device of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a plan view showing a first embodiment of a light emitting device of the present invention. The light emitting device 1 of the first embodiment is a COB type light emitting device, and includes a substrate 11, a plurality of light emitting elements 12 mounted on the substrate 11, and wirings 13 that connect the light emitting elements 12 on the substrate 11, Two land portions 14 connected to the wiring 13, and a strip-shaped sealing resin formed on the substrate 11 along the rows of the light emitting elements 12 and the wirings 13 to cover the rows of the light emitting elements 12 and the wirings 13. 15.

  The board | substrate 11 consists of ceramics, a phenol resin, an epoxy resin etc., for example. Each light emitting element 12 is, for example, a light emitting diode (LED) that emits visible light, and is arranged on the substrate 11 in the first row J1 to the seventh row J7, and the first row J1 to the seventh row J7. Each of the four light emitting elements 12 is arranged. Each light emitting element 12 may emit light in, for example, a single color (for example, blue), or may emit light in any of a plurality of colors (blue, green, red, etc.). The first column J1 to the seventh column J7 are arranged in parallel to each other.

Wiring 13, a plurality of wires (e.g., a bonding wire that connects the two wiring patterns 13a previously formed on the substrate 11 (first wiring part), and the light emitting element 12 to each other connected to the wiring patterns 13a: Second wiring portion ) 13b. Each wiring pattern 13a is arranged substantially symmetrically on the substrate 11 to draw an arc, and a circular region is formed inside each wiring pattern 13a, and each light emitting element 12 is arranged in this circular region.

  The two land portions 14 are formed in advance on the substrate 11 like each wiring pattern 13a, are connected to each wiring pattern 13a, and are connected to each light emitting element 12 through each wiring pattern 13a and each wire 13b. It is connected. When a predetermined voltage is applied between the land portions 14, the predetermined voltage is applied to each light emitting element 12 through each wiring pattern 13a and each wire 13b, and each light emitting element 12 emits light.

  The band-shaped sealing resin 15 is formed by forming a translucent silicone resin, fluorine resin, urea resin, or the like into a band shape, covering the first row J1 to the seventh row J7 and each wiring pattern 13a with resin sealing. doing. Since each light emitting element 12 and each wire 13b are included in the first column J1 to the seventh column J7, each light emitting element 12 and each wire are separated by the belt-shaped sealing resin 15 for each of the first column J1 to the seventh column J7. 13b is resin-sealed.

  For example, the band-shaped sealing resin 15 is filled with a silicone resin, a fluorine resin, a urea resin, or the like before curing into the syringe, and the syringe is discharged to the first row J1 to the seventh row J7 and each wiring pattern 13a while discharging the resin. The resin is formed in a belt shape by covering the first row J1 to the seventh row J7 and each wiring pattern 13a with the belt-like resin, and then the belt-like resin is cured.

  Further, the band-shaped sealing resin 15 contains a YAG phosphor, a silicate phosphor, a nitride phosphor, an oxynitride phosphor, etc., and converts the color of the emitted light of each light emitting element 12 to another color. May be. For example, if each of the light emitting elements 12 that emits blue light is applied and a part of the emitted blue light is converted into yellow light by a phosphor, white light can be obtained by mixing blue and yellow.

  Here, since the separation distance of the first row J1 to the seventh row J7 and the width of the strip-like sealing resin 15 are appropriately set, the strip-like sealing for sealing the first row J1 to the seventh row J7, respectively. The respective row portions of the resin 15 are separated from each other, and respective empty spaces S are formed between the respective row portions. That is, an empty space S is formed between the parallel strip-shaped sealing resins 15 where the strip-shaped sealing resins 15 are parallel.

  Further, the first row J1 and the second row J2 are curved outward, the third row J3 to the fifth row J5 are linearly formed, the sixth row J6 and the seventh row J7 are curved outward, The width of the empty space S between the second row J2 and the third row J3 is enlarged at the central portion, and the width of the empty space S between the fifth row J5 and the sixth row J6 is enlarged at the central portion. ing.

  In the light emitting device 1 according to the first embodiment, the light emitting elements 12, the wires 13b, and the wiring patterns 13a are covered and protected by the belt-shaped sealing resin 15. Moreover, in the place where the strip | belt-shaped sealing resin 15 parallels, the empty space S is formed between the parallel strip | belt-shaped sealing resin 15. Since the empty space S is not covered with the sealing resin, the heat dissipation of the substrate 11 is favorably performed in the empty space S. Further, the width of the empty space S between the second column J2 and the third column J3 is enlarged at the central portion, and the width of the empty space S between the fifth column J5 and the sixth column J6 is increased at the central portion. Therefore, the heat radiation efficiency of the central portion of the substrate 11 where heat is easily trapped is improved. For example, when compared with a configuration in which substantially the entire surface of the substrate is sealed with resin, the surface area of the substrate 11 that directly contacts the outside air is increased, and the heat dissipation efficiency of the entire substrate 11 is improved.

  Further, if the substrate 11 is almost entirely covered with the sealing resin, the size of the sealing resin increases both vertically and horizontally, and the distortion of the sealing resin caused by thermal expansion or the like increases, and the sealing resin Cracks and cracks are likely to occur.

  On the other hand, since the strip-shaped sealing resin 15 is only long in the longitudinal direction of the strip-shaped sealing resin 15, distortion of the strip-shaped sealing resin 15 caused by thermal expansion or the like is small, and the strip-shaped sealing resin 15 is cracked. And cracks are less likely to occur.

  FIG. 2 is a plan view showing a first modification of the light emitting device of FIG. Note that, in FIG. 2, the same reference numerals are given to portions that perform the same function as the light emitting device of FIG. 1.

In the light emitting device 1A of the first modification, the first belt-shaped sealing resin 21 and the second belt-shaped sealing resin 22 are applied in addition to the belt-shaped sealing resin 15 of FIG. The strip-shaped sealing resin 15 is resin-sealing only each wiring pattern 13a. The first strip-shaped sealing resin 21 is resin-sealed in the first row J1, the third row J3, the fifth row J5, and the seventh row J7 (odd row), and the second strip-like sealing resin 22 is The second row J2, the fourth row J4 , and the sixth row J6 (even number rows) are sealed with resin, and an empty space S is formed between the first strip-shaped sealing resin 21 and the second strip-shaped sealing resin 22. Has been. Further, the width of the empty space S between the second column J2 and the third column J3 is enlarged at the central portion, and the width of the empty space S between the fifth column J5 and the sixth column J6 is increased at the central portion. Is expanding.

  Here, the band-shaped sealing resin 15 for resin-sealing each wiring pattern 13a does not contain a phosphor. The first belt-shaped sealing resin 21 and the second belt-shaped sealing resin 22 contain different types of phosphors. For example, each light emitting element 12 that emits blue light is applied, and a phosphor that converts part of the blue emitted light into red light is contained in the first band-shaped sealing resin 21, so that A phosphor that converts the portion into green light is contained in the second strip-shaped sealing resin 22. In this case, white light can be obtained by mixing blue, red, and green. In addition, since the odd-numbered first strip-shaped sealing resins 21 and the even-numbered second strip-shaped sealing resins 22 are alternately arranged, blue, red, and green are mixed well.

  FIG. 3 is a plan view showing a second modification of the light emitting device of FIG. Note that, in FIG. 3, the same reference numerals are given to portions that perform the same function as the light emitting device of FIG.

  In the light emitting device 1B of the second modification, the first belt-shaped sealing resin 23 and the second belt-shaped sealing resin 24 are applied in addition to the belt-shaped sealing resin 15 of FIG. The strip-shaped sealing resin 15 is resin-sealing only each wiring pattern 13a. Moreover, the 1st strip | belt-shaped sealing resin 23 carries out resin sealing of the half one side of 1st row | line J1-7th row | line J7, respectively, and 2nd strip | belt-shaped sealing resin 24 is 1st row | line J1-7th row | line J7 other One half of each is resin-sealed, and the first belt-like sealing resin 23 and the second belt-like sealing resin 24 are continuously formed in any of the first row J1 to the seventh row J7. Furthermore, an empty space S is formed between the first strip-shaped sealing resins 23 adjacent to each other, and an empty space S is also formed between the second strip-shaped sealing resins 22 adjacent to each other. Further, the width of the empty space S between the second column J2 and the third column J3 is enlarged at the central portion, and the width of the empty space S between the fifth column J5 and the sixth column J6 is increased at the central portion. Is expanding.

  In the light emitting device 1B, the band-shaped sealing resin 15 for resin-sealing each wiring pattern 13a does not contain a phosphor. In addition, each light emitting element 12 that emits blue light is applied, and a phosphor that converts part of the blue emitted light into red light is included in the first band-shaped sealing resin 23, so that A phosphor that converts the portion into green light is contained in the second band-shaped sealing resin 24, and white light is obtained by mixing blue, red, and green. Furthermore, in each of the first column J1 to the seventh column J7, the first strip-shaped sealing resin 23 and the second strip-shaped sealing resin 24 are formed in half, so that the mixed colors of blue, red, and green are Good done.

  FIG. 4 is a plan view showing a third modification of the light emitting device of FIG. Note that, in FIG. 4, the same reference numerals are given to portions that perform the same function as the light emitting device of FIG. 3.

  In the light emitting device 1C of the third modified example, the arrangement positions of the first belt-shaped sealing resin 23 and the second belt-shaped sealing resin 24 are different from those of the light emitting device 1B of the second modified example of FIG. The first strip-shaped sealing resin 23 includes the right half of the first row J1, the third row J3, the fifth row J5, and the seventh row J7 and the left half of the second row J2, the fourth row J4, and the sixth row J6. Are sealed with resin. Further, the second strip-shaped sealing resin 24 includes the left half of the first row J1, the third row J3, the fifth row J5, and the seventh row J7 and the right side of the second row J2, the fourth row J4, and the sixth row J6. Half are each sealed with resin.

  In such a light emitting device 1C, the first strip-shaped sealing resin 23 and the second strip-shaped sealing resin 24 are formed in half in any of the first column J1 to the seventh column J7, and the columns are adjacent to each other vertically. Since the first belt-like sealing resin 23 and the second belt-like sealing resin 24 are arranged next to each other, and the first belt-like sealing resin 23 and the second belt-like sealing resin 24 are alternately arranged, The light color of the phosphor contained in the first belt-like sealing resin 23 and the color of the light of the phosphor contained in the second belt-like sealing resin 24 are better mixed. Of course, since the empty space S is formed between the first strip-shaped sealing resin 23 and the second strip-shaped sealing resin 24 that are adjacent to each other in the vertical direction, the surface area of the substrate 11 that directly contacts the outside air increases, and the substrate 11 Overall heat dissipation efficiency is improved.

  FIG. 5 is a plan view showing a second embodiment of the light-emitting device of the present invention. Note that, in FIG. 5, the same reference numerals are given to portions that perform the same function as the light emitting device of FIG. 1.

  In the light emitting device 1D of the second embodiment, on the substrate 11, the light emitting elements 12 are arranged in the first column J1 to the sixth column J6, and there are four for each of the first column J1 to the sixth column J6. The light emitting elements 12 are arranged. Then, the central portion of the third row J3 and the central portion of the fourth row J4 are curved so as to be spaced apart from each other, and an empty space S is formed between the central portion of the third row J3 and the central portion of the fourth row J4. Is expanded in a circular shape (the width of the empty space S is increased), and a hole 11a is formed in the substrate 11 in the circular empty space S. Further, a screw 31 is inserted into the hole 11a, and the screw 31 is screwed into a base (not shown) such as a frame or a chassis of the light emitting device 1D to fix the substrate 11.

  The wiring 13 includes a set of first wiring patterns 13d, a set of second wiring patterns 13e, wires 13b, and a third row J3 and a fourth row formed in an arc shape along the periphery of the hole 11a. J4 relay wiring pattern 13c. In both the third row J3 and the fourth row J4, the two light emitting elements 12 arranged on both sides of the hole 11a are connected through the arc-shaped relay wiring pattern 13c. This is because it is difficult to make the wire 13b extending linearly along the periphery of the hole 11a.

  Further, a set of first land portions 32a and a set of second land portions 32b are provided. The first land portions 32a are connected to the wires 13b in the first row J1 to the third row J3 through the first wiring patterns 13d, and further through the wires 13b and the relay wiring pattern 13c in the first row J1 to the third row J3. Each light emitting element 12 is connected. When a predetermined voltage is applied between the first land portions 32a, a predetermined voltage is applied to each light emitting element 12 in the first column J1 to the third column J3, and each of the first column J1 to the third column J3. The light emitting element 12 emits light. The second land portions 32b are connected to the wires 13b of the fourth row J4 to the sixth row J6 through the second wiring patterns 13e, and further the wires 13b of the fourth row J4 to the sixth row J6 and the relay wiring patterns. It is connected to each light emitting element 12 through 13c. When a predetermined voltage is applied between the second land portions 32b, a predetermined voltage is applied to each light emitting element 12 in the fourth column J4 to the sixth column J6, and each of the fourth column J4 to the sixth column J6. The light emitting element 12 emits light. Therefore, the light emitting elements 12 in the first column J1 to the third column J3 are caused to emit light by applying a voltage between the first land portions 32a or applying a voltage between the second land portions 32b. Or the light emitting elements 12 in the fourth column J4 to the sixth column J6 can emit light.

  The strip-shaped sealing resin 15 seals each first wiring pattern 13d and each second wiring pattern 13e. The first belt-like sealing resin 33 is resin-sealed in the first row J1, the second row J2, and the third row J3, respectively, and the second belt-like sealing resin 34 is in the fourth row J4, the fifth row. J5 and the sixth row J6 are respectively sealed with resin.

  The band-shaped sealing resin 15 for resin-sealing each first wiring pattern 13d and each second wiring pattern 13e does not contain a phosphor. In addition, each light emitting element 12 that emits blue light is applied, and a phosphor that converts part of the blue emitted light into red light is included in the first band-shaped sealing resin 33, and one of the blue emitted light is included. A phosphor that converts the portion into green light is contained in the second band-shaped sealing resin 34. For this reason, if all the light emitting elements 12 in the first row J1 to the sixth row J6 sealed by the first and second strip-shaped sealing resins 33 are caused to emit light, a white color is mixed by blue, red, and green. Light can be obtained. Further, by applying a voltage between the first land portions 32a or applying a voltage between the second land portions 32b, only the light emitting elements 12 in the first column J1 to the third column J3 emit light. The color of the light can be changed by causing each of the light emitting elements 12 in the fourth column J4 to the sixth column J6 to emit light.

  In such a light emitting device 1D of the second embodiment, each wiring pattern 13a is covered and protected by the belt-shaped sealing resin 15. Further, the first row J1, the second row J2, and the third row J3 (rows of the respective light emitting elements 12, the wires 13b, and the relay wiring pattern 13c) are covered and protected by the first strip-shaped sealing resin 33, The second row sealing resin 34 covers and protects the fourth row J4, the fifth row J5, and the sixth row J6 (the rows of the light emitting elements 12, the wires 13b, and the relay wiring pattern 13c). Further, an empty space S is formed between the first strip-shaped sealing resin 33 and the second strip-shaped sealing resin 34 that are parallel to each other. Since the empty space S is not covered with the sealing resin, the heat dissipation of the substrate 11 is favorably performed in the empty space S.

  Further, a hole 11a is formed in the substrate 11 in a circular empty space S between the center portion of the third row J3 and the center portion of the fourth row J4, and a screw 31 is inserted into the hole 11a. Are screwed into a base (not shown) such as a frame or a chassis of the light emitting device 1D to fix the substrate 11. For this reason, the heat of the board | substrate 11 is conducted outside from the center through the screw | thread 31, and the thermal radiation efficiency of the board | substrate 11 becomes high. In particular, if a metal base having good thermal conductivity is selected as the base of the frame, chassis, etc., the heat dissipation efficiency of the substrate 11 becomes higher. Although the hole 11a may not be formed at the center of the substrate 11, the hole 11a is preferably formed at the center of the substrate 11 in order to efficiently dissipate the heat of the entire substrate 11.

  In addition, since all of the strip-shaped sealing resin 15, the first strip-shaped sealing resin 33, and the second strip-shaped sealing resin 34 are only long in the longitudinal direction, distortion caused by thermal expansion or the like is small. Cracks and cracks are less likely to occur.

  FIG. 6 is a plan view showing a third embodiment of the light-emitting device of the present invention. In FIG. 6, the same reference numerals are given to portions that perform the same functions as those of the light emitting device of FIG. 1.

  In the light emitting device 1E of the third embodiment, on the substrate 11, the light emitting elements 12 are arranged in the first column J1 to the sixth column J6, and there are four for each of the first column J1 to the sixth column J6. The light emitting elements 12 are arranged. Then, the empty space S is expanded in a circular shape between the central portion of the third row J3 and the central portion of the fourth row J4 (the width of the empty space S is increased), and the substrate 11 is formed in the circular empty space S. A hole 11a is formed, and a screw 31 is screwed into a base (not shown) such as a frame or a chassis of the light emitting device 1E through the hole 11a to fix the substrate 11.

  The wiring 13 includes each wire 13b and a relay wiring pattern 13c in the third row J3 and the fourth row J4 formed in an arc shape along the periphery of the hole 11a. In both the third row J3 and the fourth row J4, the two light emitting elements 12 arranged on both sides of the hole 11a are connected through the arc-shaped relay wiring pattern 13c.

  The first light emitting element 12 in the first row J1 is connected to the land portion 41 through the wire 13b, and the last light emitting element 12 in the first row J1 is connected to the last light emitting element 12 in the second row J2 through the wire 13b. The first light emitting element 12 in the second column J1 is connected to the first light emitting element 12 in the third column J3 through the wire 13b, and thereafter, similarly, the last light emitting element 12 in the third column J3 and the fourth column The last light emitting element 12 in J4, the first light emitting element 12 in the fourth column J4 and the first light emitting element 12 in the fifth column J5, and the last light emitting element 12 in the fifth column J5 and the sixth column. The last light emitting element 12 of J6 is connected through each wire 13b, and the first light emitting element 12 in the sixth row is connected to the land 42 through the wire 13b. All the light emitting elements 1 in the column J1 to the sixth column J6 It is connected to.

  When a predetermined voltage is applied between the land portions 41 and 42, the predetermined voltage is applied to each light emitting element 12 through each wire 13b and each relay wiring pattern 13c, and each light emitting element 12 emits light.

  The strip-shaped sealing resin 43 is one continuous piece, extends from the front end to the rear end of the first row J1, and connects the rear end of the first row J1 and the rear end of the second row J2. , Extending from the rear end to the front end of the second row J2, connecting the front end of the second row J2 and the front end of the third row J3, and thereafter, similarly, the third row J3, the fourth row J4, the fifth row It is formed by being drawn along J5 and the sixth row J6, and the first row J1 to the sixth row J6 are sealed with resin.

  The belt-shaped sealing resin 43 may contain various phosphors to convert the color of the emitted light of each light emitting element 12 into another color.

  In such a light emitting device 1E of the third embodiment, each light emitting element 12 and each wire 13b are covered and protected by the belt-shaped sealing resin 43. In addition, an empty space S is formed between the parallel strip-shaped sealing resins 43 at locations between the first row J1 to the sixth row J6, that is, locations where the strip-shaped sealing resins 43 are parallel. Further, since the first row J1 to the sixth row J6 are resin-sealed by one continuous strip-shaped sealing resin 43, the occupied area of the strip-shaped sealing resin 43 with respect to the surface area of the substrate 11 is suppressed, and the space is free. The space S is widened. For this reason, the heat dissipation efficiency of the substrate 11 is further improved.

  Further, a hole 11a is formed in the substrate 11 in a circular empty space S between the center portion of the third row J3 and the center portion of the fourth row J4, and a screw 31 is inserted into the hole 11a. Is screwed into a base (not shown) such as a frame or chassis of the light emitting device 1E to fix the substrate 11, so that the heat of the substrate 11 is conducted from the center to the outside through the screw 31 and the heat of the substrate 11 is dissipated. Increases efficiency.

  Moreover, since the strip | belt-shaped sealing resin 43 is only long in the longitudinal direction, the distortion produced by thermal expansion etc. is small, and it is hard to generate | occur | produce a crack and a crack.

  FIG. 7 is a plan view showing a fourth embodiment of the light-emitting device of the present invention. Note that, in FIG. 7, the same reference numerals are given to portions that perform the same function as the light emitting device of FIG. 6.

  In the light emitting device 1F of the third embodiment, on the substrate 11, the light emitting elements 12 are arranged and arranged in the first column J1 to the fourth column J4, and there are four for each of the first column J1 to the fourth column J4. The light emitting elements 12 are arranged.

  The first light emitting element 12 in the first row J1 is connected to the land portion 41 through the wire 13b, and the last light emitting element 12 in the first row J1 and the last light emitting element 12 in the second row J2 are connected to the second light emitting element 12. The first light emitting element 12 in the column J2 and the first light emitting element 12 in the third column J3 are connected to the last light emitting element 12 in the third column J3 and the last light emitting element 12 in the fourth column J4. 13b, and the leading light-emitting elements 12 in the fourth row are connected to the lands 42 through the wires 13b. All the light-emitting elements 12 in the first row J1 to the fourth row J4 are connected between the land portions 41 and 42. Is connected.

  When a predetermined voltage is applied between the land portions 41 and 42, the predetermined voltage is applied to each light emitting element 12 through each wire 13b, and each light emitting element 12 emits light.

  The belt-shaped sealing resin 43 is a continuous one, and is formed continuously along the first row J1 to the fourth row J4, and the first row J1 to the fourth row J4 are resin-sealed. Yes. The width of the band-shaped sealing resin 43 is widened at each light emitting element 12 and the width is narrowed at each wire 13b.

  The belt-shaped sealing resin 43 may contain various phosphors to convert the color of the emitted light of each light emitting element 12 into another color.

  In such a light emitting device 1F of the fourth embodiment, each light emitting element 12 and each wire 13b are covered and protected by the belt-shaped sealing resin 43. In addition, an empty space S is formed between the parallel strip-shaped sealing resins 43 at a location between the first row J1 to the fourth row J4, that is, a location where the strip-shaped sealing resin 43 is parallel. Furthermore, since the width of the belt-shaped sealing resin 43 is widened at the site of each light-emitting element 12, each light-emitting element 12 can be reliably resin-sealed, and the width of the belt-shaped sealing resin 43 is the width of each wire 13b. Therefore, the empty space S is widened at each wire 13b, and the heat dissipation efficiency of the substrate 11 is improved.

  As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the claims, and these are naturally within the technical scope of the present invention. It is understood.

1, 1A, 1B, 1C, 1D Light emitting device 11 Substrate 11a Hole 12 Light emitting element 13 Wiring 13a Wiring pattern 13b Wire 13c Relay wiring patterns 14, 32, 41, 42 Land portions 15, 43 Band-shaped sealing resins 21, 23, 33 First strip-shaped sealing resin 22, 24, 34 Second strip-shaped sealing resin 31 Screw S Empty space

Claims (7)

A light-emitting device comprising a substrate, a plurality of light-emitting elements mounted on the substrate, and wiring for connecting the light-emitting elements on the substrate,
A strip-shaped sealing resin is formed on the substrate along the rows of the light emitting elements, and covers the rows of the light emitting elements.
The wiring includes a first wiring portion provided so as to surround the plurality of light emitting elements, and a second wiring portion that connects the light emitting elements to form a row of the light emitting elements,
The first wiring portion is covered with a sealing resin and electrically connected to a land portion provided at an end portion of the substrate,
In the part where the strip-shaped sealing resin is parallel on the substrate, an empty space where the substrate is exposed is provided between the parallel strip-shaped sealing resins, and the width of the empty space is changed according to the position on the substrate. then,
In each row of light emitting elements, the same number of light emitting elements are connected,
The light emitting device according to claim 1, wherein at least one portion of the band-shaped sealing resin far from the center of the region surrounded by the first wiring portion is bent . The light-emitting device according to claim 1,
Forming a hole in the substrate in the empty space;
The band-shaped sealing resin is bent along the hole . The light-emitting device according to claim 1 or 2,
A plurality of the band-shaped sealing resins are provided,
Two adjacent strip-shaped sealing resins among the respective strip-shaped sealing resins contain phosphors having different fluorescent colors. The light-emitting device according to claim 1 or 2,
The strip-shaped sealing resin is divided into a plurality of portions in the longitudinal direction of the strip-shaped sealing resin, and two portions adjacent to each other of the portions contain phosphors having different fluorescent colors. Light-emitting device. The light-emitting device according to claim 2,
A light emitting device characterized in that the hole is formed in the center of the substrate. The light-emitting device according to claim 1,
A light-emitting device, wherein the one strip-shaped sealing resin is continuously formed along the row of the light-emitting elements and the wiring. The light-emitting device according to claim 1,
The width of the band-shaped sealing resin is wide at the portion of each light emitting element and narrowed at the portion of the wiring between the light emitting elements.

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