JP6107229B2 - 発光装置 - Google Patents

発光装置 Download PDF

Info

Publication number
JP6107229B2
JP6107229B2 JP2013037948A JP2013037948A JP6107229B2 JP 6107229 B2 JP6107229 B2 JP 6107229B2 JP 2013037948 A JP2013037948 A JP 2013037948A JP 2013037948 A JP2013037948 A JP 2013037948A JP 6107229 B2 JP6107229 B2 JP 6107229B2
Authority
JP
Japan
Prior art keywords
light emitting
emitting device
light
resin
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013037948A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014165468A (ja
JP2014165468A5 (https=
Inventor
良男 市原
良男 市原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2013037948A priority Critical patent/JP6107229B2/ja
Publication of JP2014165468A publication Critical patent/JP2014165468A/ja
Publication of JP2014165468A5 publication Critical patent/JP2014165468A5/ja
Application granted granted Critical
Publication of JP6107229B2 publication Critical patent/JP6107229B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
JP2013037948A 2013-02-27 2013-02-27 発光装置 Active JP6107229B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013037948A JP6107229B2 (ja) 2013-02-27 2013-02-27 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013037948A JP6107229B2 (ja) 2013-02-27 2013-02-27 発光装置

Publications (3)

Publication Number Publication Date
JP2014165468A JP2014165468A (ja) 2014-09-08
JP2014165468A5 JP2014165468A5 (https=) 2016-03-10
JP6107229B2 true JP6107229B2 (ja) 2017-04-05

Family

ID=51615778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013037948A Active JP6107229B2 (ja) 2013-02-27 2013-02-27 発光装置

Country Status (1)

Country Link
JP (1) JP6107229B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6793436B2 (ja) * 2017-08-04 2020-12-02 株式会社大一商会 遊技機
JP6799359B2 (ja) * 2017-08-04 2020-12-16 株式会社大一商会 遊技機
JP6799357B2 (ja) * 2017-08-04 2020-12-16 株式会社大一商会 遊技機
JP6799356B2 (ja) * 2017-08-04 2020-12-16 株式会社大一商会 遊技機
JP6799360B2 (ja) * 2017-08-04 2020-12-16 株式会社大一商会 遊技機

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8975646B2 (en) * 2004-05-31 2015-03-10 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and housing base for such a component
JP5205724B2 (ja) * 2006-08-04 2013-06-05 日亜化学工業株式会社 発光装置
JP4961978B2 (ja) * 2006-11-30 2012-06-27 日亜化学工業株式会社 発光装置およびその製造方法
US7652297B2 (en) * 2007-09-11 2010-01-26 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emitting device
TWI552374B (zh) * 2011-02-28 2016-10-01 日亞化學工業股份有限公司 發光裝置

Also Published As

Publication number Publication date
JP2014165468A (ja) 2014-09-08

Similar Documents

Publication Publication Date Title
JP6323217B2 (ja) 発光装置
JP5119621B2 (ja) 発光装置
EP3190635B1 (en) Light emitting device mount and light emitting apparatus including the same
US7964892B2 (en) Light emitting device
KR101360732B1 (ko) 발광 다이오드 패키지
JP5326229B2 (ja) 発光装置
JP5691681B2 (ja) 発光装置
JP6090680B2 (ja) 発光モジュール
CN102479910A (zh) Led模块
CN103579466A (zh) 发光装置
JP5365252B2 (ja) 光半導体装置及びその製造方法
JP5458910B2 (ja) 発光装置
JP4826470B2 (ja) 発光装置
JP6064606B2 (ja) 発光装置
JP6107229B2 (ja) 発光装置
JP6064396B2 (ja) 発光装置
JP5071069B2 (ja) 発光装置
JP5701843B2 (ja) 発光装置
JP6191214B2 (ja) 発光装置
JP2007280983A (ja) 発光装置
JP6171295B2 (ja) 発光装置
JP2011249433A (ja) 発光装置及びその製造方法
JP6544410B2 (ja) 発光素子実装用基体及びそれを備える発光装置
JP2016119464A (ja) 発光装置
CN103227264B (zh) 发光装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160121

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160121

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160907

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160913

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161111

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170207

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170220

R150 Certificate of patent or registration of utility model

Ref document number: 6107229

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250